JP5553722B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5553722B2 JP5553722B2 JP2010232429A JP2010232429A JP5553722B2 JP 5553722 B2 JP5553722 B2 JP 5553722B2 JP 2010232429 A JP2010232429 A JP 2010232429A JP 2010232429 A JP2010232429 A JP 2010232429A JP 5553722 B2 JP5553722 B2 JP 5553722B2
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- Prior art keywords
- light emitting
- emitting device
- glass film
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000463 material Substances 0.000 claims description 20
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000000149 argon plasma sintering Methods 0.000 claims description 3
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- 229920000647 polyepoxide Polymers 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- -1 B 2 O 3 Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
11 素子搭載基板
12 導体配線
13 LED素子
14 リフレクタ
14a 開口部
15 封止樹脂
16 裏面ガラス
17 ボンディングワイヤ
30 実装基板
32 密着材
34 配線基板
36 導体配線
38 コネクタ
Claims (10)
- アルミナセラミックスからなる基板の一方の面に搭載された複数の発光素子と、
前記発光素子の各々の周囲を囲む光反射枠を形成する複数の開口部を有する第1のガラス膜と、
前記基板の他方の面に設けられた第2のガラス膜と、を含み、
前記第2のガラス膜の前記基板に対する熱膨張率の大小関係は、前記第1のガラス膜の前記基板に対する熱膨張率の大小関係と一致していることを特徴とする発光装置。 - 前記第1のガラス膜と、前記第2のガラス膜とは、同一熱膨張率を有するガラス材からなることを特徴とする請求項1に記載の発光装置。
- 前記第1のガラス膜と、前記第2のガラス膜とは、同一のガラス材からなることを特徴とする請求項1に記載の発光装置。
- 前記第2のガラス膜が前記基板に被着する面積は、前記第1のガラス膜が前記基板に被着する面積よりも大きいことを特徴とする請求項1乃至3のいずれか一項に記載の発光装置。
- 前記第2のガラス膜は、前記基板の他方の面の全面に被着していることを特徴とする請求項1乃至4のいずれか一項に記載の発光装置。
- 前記基板の前記発光素子を搭載している側の面に給電端子を有することを特徴とする請求項1乃至5のいずれか一項に記載の発光装置。
- 前記第2のガラス膜の厚さは、前記第1のガラス膜の厚さよりも薄いことを特徴とする請求項1乃至6のいずれか一項に記載の発光装置。
- 前記第1のガラス膜は、光散乱粒子を含むことを特徴とする請求項1乃至7のいずれか一項に記載の発光装置。
- 前記開口部に、蛍光体を含む封止樹脂が充填されていることを特徴とする請求項1乃至8のいずれか一項に記載の発光装置。
- 前記第2のガラス膜に密着材を介して接合された実装基板を更に含むことを特徴とする請求項1乃至9のいずれか一項に記載の発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010232429A JP5553722B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置 |
CN201110312655.9A CN102456782B (zh) | 2010-10-15 | 2011-10-14 | 发光器件 |
US13/273,526 US8587008B2 (en) | 2010-10-15 | 2011-10-14 | Light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010232429A JP5553722B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012089553A JP2012089553A (ja) | 2012-05-10 |
JP5553722B2 true JP5553722B2 (ja) | 2014-07-16 |
Family
ID=45933375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010232429A Expired - Fee Related JP5553722B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8587008B2 (ja) |
JP (1) | JP5553722B2 (ja) |
CN (1) | CN102456782B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102777797B (zh) * | 2012-07-23 | 2014-06-18 | 贵州光浦森光电有限公司 | 互换性和通用性强的led灯泡构成方法及法兰式支架led灯泡 |
JP6072472B2 (ja) * | 2012-08-27 | 2017-02-01 | シチズン電子株式会社 | Led発光装置 |
JP6053594B2 (ja) * | 2013-03-27 | 2016-12-27 | シチズン時計株式会社 | Led発光装置の製造方法及びled発光装置 |
JP2015119096A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社タムラ製作所 | 発光装置 |
KR102297802B1 (ko) | 2014-09-22 | 2021-09-03 | 도시바 라이텍쿠 가부시키가이샤 | 광원장치 |
JP6398887B2 (ja) * | 2015-06-18 | 2018-10-03 | 豊田合成株式会社 | 発光装置の製造方法 |
JP6652025B2 (ja) * | 2016-09-29 | 2020-02-19 | 豊田合成株式会社 | 発光装置及びその製造方法 |
CN112576945A (zh) * | 2020-12-11 | 2021-03-30 | 佛山市中昊光电科技有限公司 | 全彩cob器件 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0429380A (ja) * | 1990-05-24 | 1992-01-31 | Ibiden Co Ltd | Ledプリンタヘッド用基板 |
JP2001201611A (ja) * | 2000-01-21 | 2001-07-27 | Hitachi Ltd | 光学的機能性シート及びこれを用いた面状光源並びに画像表示装置 |
JP4307094B2 (ja) * | 2003-02-04 | 2009-08-05 | パナソニック株式会社 | Led光源、led照明装置、およびled表示装置 |
JP2004356506A (ja) * | 2003-05-30 | 2004-12-16 | Stanley Electric Co Ltd | ガラス封止型発光ダイオード |
JP2006100441A (ja) * | 2004-09-28 | 2006-04-13 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
JP2006294898A (ja) * | 2005-04-12 | 2006-10-26 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
JP2006310584A (ja) * | 2005-04-28 | 2006-11-09 | Fujikura Ltd | 発光素子実装用ホーロー基板及び光源装置 |
JP2006324134A (ja) | 2005-05-19 | 2006-11-30 | Koha Co Ltd | 面状発光装置 |
JP4810913B2 (ja) * | 2005-07-26 | 2011-11-09 | パナソニック電工株式会社 | 光源装置、及びそれを用いた照明器具 |
FR2892594B1 (fr) * | 2005-10-21 | 2007-12-07 | Saint Gobain | Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications |
JP2009164311A (ja) * | 2007-12-28 | 2009-07-23 | Sumitomo Metal Electronics Devices Inc | 発光素子搭載用基板およびその製造方法およびそれを用いた発光装置 |
CN100583476C (zh) * | 2008-03-27 | 2010-01-20 | 潮州三环(集团)股份有限公司 | 一种高功率led陶瓷封装基座 |
JP5180158B2 (ja) * | 2008-10-31 | 2013-04-10 | スタンレー電気株式会社 | 液晶用バックライト |
JP2010129923A (ja) | 2008-11-28 | 2010-06-10 | Showa Denko Kk | 発光部材、発光装置、照明装置、バックライト装置および発光部材の製造方法 |
-
2010
- 2010-10-15 JP JP2010232429A patent/JP5553722B2/ja not_active Expired - Fee Related
-
2011
- 2011-10-14 CN CN201110312655.9A patent/CN102456782B/zh active Active
- 2011-10-14 US US13/273,526 patent/US8587008B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8587008B2 (en) | 2013-11-19 |
US20120091480A1 (en) | 2012-04-19 |
JP2012089553A (ja) | 2012-05-10 |
CN102456782A (zh) | 2012-05-16 |
CN102456782B (zh) | 2016-02-24 |
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