WO2015046294A1 - ダイヤモンド基板及びダイヤモンド基板の製造方法 - Google Patents

ダイヤモンド基板及びダイヤモンド基板の製造方法 Download PDF

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WO2015046294A1
WO2015046294A1 PCT/JP2014/075365 JP2014075365W WO2015046294A1 WO 2015046294 A1 WO2015046294 A1 WO 2015046294A1 JP 2014075365 W JP2014075365 W JP 2014075365W WO 2015046294 A1 WO2015046294 A1 WO 2015046294A1
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Prior art keywords
diamond
substrate
diamond substrate
columnar
diameter
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PCT/JP2014/075365
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English (en)
French (fr)
Japanese (ja)
Inventor
英雄 会田
浩司 小山
憲次朗 池尻
聖祐 金
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並木精密宝石株式会社
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Application filed by 並木精密宝石株式会社 filed Critical 並木精密宝石株式会社
Priority to CN201480053428.0A priority Critical patent/CN105579624B/zh
Priority to KR1020167007448A priority patent/KR102106424B1/ko
Priority to JP2015539292A priority patent/JP6142145B2/ja
Priority to EP14848179.9A priority patent/EP3054036B1/en
Priority to US15/026,063 priority patent/US10132000B2/en
Publication of WO2015046294A1 publication Critical patent/WO2015046294A1/ja
Priority to US16/026,342 priority patent/US10480096B2/en

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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C23C16/27—Diamond only
    • C23C16/274—Diamond only using microwave discharges
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
    • C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/04—Diamond
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02—Heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02376—Carbon, e.g. diamond-like carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8206—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using diamond technology

Definitions

  • the present invention relates to a diamond substrate and a method for manufacturing the diamond substrate.
  • Diamond is expected as the ultimate semiconductor substrate.
  • the reason for this is that diamond has many excellent properties that are unparalleled as a semiconductor material, such as high thermal conductivity, high electron / hole mobility, high breakdown field strength, low dielectric loss, and wide band gap. This is because.
  • the band gap is about 5.5 eV, which is extremely high among existing semiconductor materials.
  • ultraviolet light emitting elements utilizing a wide band gap and field effect transistors having excellent high frequency characteristics are being developed.
  • Patent Document 1 a diamond single crystal growth method (so-called mosaic growth method) in which a plurality of small diamond single crystal substrates are arranged.
  • Patent Document 2 a manufacturing method in which a single crystal magnesium oxide (MgO) substrate is used as a base substrate and a diamond film is formed on the base substrate by heteroepitaxial growth.
  • MgO single crystal magnesium oxide
  • the mosaic growth method is a technique for growing and forming a large-sized diamond single crystal substrate by arranging a plurality of diamond single crystal substrates in a tile shape and newly homoepitaxially growing a diamond single crystal on the diamond single crystal substrate. .
  • a bonding boundary is generated as a region where the crystal quality is deteriorated. Therefore, a bond boundary always occurs in the diamond single crystal obtained by the mosaic growth method.
  • the reason why the bond boundary occurs is that growth occurs randomly in the bond boundary region, coalescence occurs from various directions, and a large amount of dislocation occurs at the bond boundary. This bond boundary is also confirmed visually. The boundary is as clear as possible.
  • the area that can actually be used is limited with respect to the area of the diamond single crystal substrate obtained by the mosaic growth method.
  • the area of the diamond single crystal substrate where the semiconductor device can be fabricated does not necessarily match the size of the semiconductor device chip. Therefore, in the process of manufacturing a semiconductor device on such a diamond single crystal substrate, it is necessary to proceed so as to avoid the bonding boundary. Therefore, the semiconductor device manufacturing process becomes complicated.
  • the heteroepitaxial growth method is a method of epitaxially growing a diamond film to be a diamond substrate on a base substrate made of a material having different physical properties. Since one diamond film is epitaxially grown on one base substrate, there is no possibility that a bonding boundary between a plurality of diamond single crystal substrates is generated unlike the mosaic growth method.
  • the heteroepitaxial growth method is particularly promising in that it is not easily restricted by the substrate area on which the semiconductor device can be manufactured.
  • Patent Document 3 proposes several prior arts for reducing the stress generated in diamond by the hetero-epitaxial growth method.
  • the diamond substrate by the hetero-epitaxial growth method achieved to date is 1.5 inches, which is the largest for semiconductor applications.
  • the required 2 inch or larger substrate has not been achieved.
  • the prior art has not been able to fundamentally solve the stress relaxation inside the diamond crystal in the heteroepitaxy growth method. That is, the reduction of warpage and cracks in a diamond substrate of 2 inches or more has not been actually realized, and the upper limit diameter value of the diamond substrate for which warpage and cracks are still reduced is still 1.5 inches.
  • Equation 1 indicates that the deflection ⁇ of the diamond substrate increases with the amount of change of the square of the diameter I as the diameter I of the diamond substrate increases. Therefore, as the diameter I of the diamond substrate increases, the stress ⁇ generated in the diamond crystal increases. For this reason, there is a limit to restraining the stress inside the diamond crystal by the prior art, and this is the reason why there are no actual examples of realization up to about 1.5 inches.
  • E Young's modulus
  • ⁇ Poisson's ratio
  • b is the thickness of the base substrate
  • d is the thickness of the diamond substrate.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a large diamond substrate having a diameter of 2 inches or more.
  • Another object of the present invention is to provide a method for producing a diamond substrate that enables the production of a large diamond substrate having a diameter of 2 inches or more.
  • the diamond substrate of the present invention comprises a diamond single crystal
  • the shape of the diamond substrate in the planar direction is a circular shape or a circular shape provided with an orientation flat surface, and the diameter is 2 inches or more.
  • the manufacturing method of the diamond substrate of the present invention prepares a base substrate, A plurality of columnar diamonds made of diamond single crystal are formed on one side of the base substrate, A diamond single crystal is grown from the tip of each columnar diamond, each diamond single crystal grown from the tip of each columnar diamond is coalesced to form a diamond substrate layer, Separate the diamond substrate layer from the underlying substrate, Producing a diamond substrate from the diamond substrate layer,
  • the planar shape of the diamond substrate is a circular shape or a circular shape provided with an orientation flat surface, and the diameter is 2 inches or more.
  • the diamond substrate according to the present invention it is possible to realize a large diamond substrate formed from a diamond single crystal and having a diameter of 2 inches or more.
  • a diamond substrate layer is manufactured by coalescing diamond single crystals grown from each columnar diamond. Therefore, a diamond substrate layer having a large diameter of 2 inches or more can be easily manufactured only by increasing the number of columnar diamonds.
  • stress is generated in each columnar diamond due to a lattice multiplier difference and / or a thermal expansion coefficient difference between the base substrate and the diamond substrate layer during the growth of the diamond substrate layer.
  • the columnar diamond is destroyed by the stress, and the diamond substrate layer is separated from the base substrate.
  • a diamond substrate having a diameter of 2 inches or more By manufacturing a diamond substrate from such a diamond substrate layer, a diamond substrate having a diameter of 2 inches or more can be manufactured.
  • FIG. 1 It is a perspective view which shows an example of the diamond substrate which concerns on this embodiment. It is a schematic explanatory drawing which shows the base substrate which concerns on this embodiment. It is a schematic explanatory drawing which shows the state of the base substrate with a diamond layer of this embodiment. It is a schematic diagram which shows the base substrate in which the some columnar diamond was formed. It is a perspective view which shows the base substrate in which the some columnar diamond was formed. It is a schematic diagram which shows the base substrate with a columnar diamond in which the diamond substrate layer was formed. It is a perspective view which shows the base substrate with a columnar diamond in which the diamond substrate layer was formed. FIG.
  • FIG. 3 is a schematic explanatory view showing a diamond substrate layer, a base substrate, and each columnar diamond that have been warped in a convex shape due to a tensile stress. It is a schematic diagram showing a state in which columnar diamond is destroyed and a diamond substrate layer and a base substrate are separated. It is a schematic diagram which shows another form of the base substrate in which the some columnar diamond was formed.
  • the shape of the diamond substrate according to the present invention in the planar direction is not particularly limited, and may be, for example, a square.
  • the circular shape is preferable from the viewpoint of easy use in the manufacturing process for applications such as surface acoustic wave elements, thermistors, and semiconductor devices.
  • a circular shape provided with an orientation flat surface (orientation flat surface) as shown in FIG. 1 is preferable.
  • the diameter is 2 inches (about 50.8 mm) or more from the viewpoint of increasing the size of a practical substrate. Preferably, it is 3 inches (about 76.2 mm) or more, more preferably 6 inches (about 152.4 mm) or more.
  • the range of 49.8 mm to 50.8 mm, which is obtained by subtracting 1.0 mm, which is 2% of 50.8 mm, is defined as 2 inches.
  • the upper limit of the diameter is not particularly limited, but is preferably 8 inches (about 203.2 mm) or less from a practical viewpoint. Moreover, in order to manufacture many elements and devices at once, a square diamond substrate having an area equal to or larger than 2 inches in diameter may be used.
  • the surface 2 of the diamond substrate 1 has a surface area of at least 20 cm 2 . Furthermore, it is more preferable to have a surface area of up to 1297 cm 2 from the viewpoint of enlargement.
  • the thickness t of the diamond substrate 1 can be arbitrarily set, but it is preferably 3.0 mm or less as a self-supporting substrate, and more preferably 1.5 mm or less for use in an element or device production line. 1.0 mm or less is more preferable.
  • the lower limit of the thickness t is not particularly limited, but is preferably 0.05 mm or more and 0.3 mm or more from the viewpoint of ensuring the rigidity of the diamond substrate 1 and preventing the occurrence of cracks, tears or cracks. It is more preferable.
  • the “self-supporting substrate” or “self-supporting substrate” in the present invention refers to a substrate not only capable of holding its own shape but also having a strength that does not cause inconvenience in handling.
  • the thickness t is preferably 0.3 mm or more. Since diamond is an extremely hard material, the upper limit of the thickness t as a self-standing substrate is preferably 3.0 mm or less in consideration of easiness of cleavage after formation of elements and devices.
  • the thickness t is most preferably 0.5 mm or more and 0.7 mm or less (500 ⁇ m or more and 700 ⁇ m or less) as the thickness of the substrate that is most frequently used as an element or device and is free-standing.
  • the diamond crystal forming the diamond substrate 1 is preferably a diamond single crystal.
  • the diamond single crystal may be any of the Ia type, IIa type, or IIb type. However, when the diamond substrate 1 is used as a substrate of a semiconductor device, the amount of crystal defects or distortion or the full width at half maximum of the X-ray rocking curve is large. From this point, type Ia is more preferable. Further, the diamond substrate 1 is formed from a single diamond single crystal, and there is no bonding boundary on the surface 2 where a plurality of diamond single crystals are bonded.
  • the surface 2 of the diamond substrate 1 is subjected to lapping, polishing, or CMP (Chemical Mechanical Polishing) processing.
  • the back surface of the diamond substrate 1 is lapped and / or polished.
  • the surface 2 is processed mainly to achieve a flat substrate shape, and the back surface is processed mainly to achieve a desired thickness t.
  • the surface roughness Ra of the surface 2 is preferably such that an element or device can be formed, it is preferably formed to be less than 1 nm, and more preferably to be 0.1 nm or less that is flat at the atomic level. . Ra may be measured with a surface roughness measuring machine.
  • the plane orientation of the crystal plane of the surface 2 may be any of (111), (110), and (100), and is not limited to these plane orientations. However, (100) is preferable from the viewpoint that it is most used in applications such as element and device formation or diamond single crystal growth.
  • the diamond substrate 1 When the diamond substrate 1 is formed of a single diamond single crystal, there is no bonding boundary obtained by bonding a plurality of diamond single crystals on the surface 2, so that deterioration of crystal quality at the boundary portion is prevented. Therefore, when the diamond substrate 1 is formed of a single diamond single crystal, the full width at half maximum (FWHM: full width at half Maximum) of the rocking curve by the X-ray on the surface 2 (particularly (100)) Can be realized for 300 seconds or less over the entire surface 2.
  • FWHM full width at half Maximum
  • the diamond substrate 1 formed from a single diamond single crystal, it is possible to realize a full width at half maximum of 300 seconds or less of the rocking curve by X-rays, and to provide a high-quality diamond substrate 1. Is possible. Furthermore, by using such a diamond substrate 1, high-quality and highly efficient elements and devices can be produced.
  • a base substrate 4 is prepared as shown in FIG.
  • Examples of the material of the base substrate 4 include magnesium oxide (MgO), aluminum oxide ( ⁇ -Al 2 O 3 : sapphire), Si, quartz, platinum, iridium, and strontium titanate (SrTiO 3 ).
  • the MgO single crystal substrate and the aluminum oxide (sapphire) single crystal substrate are extremely stable thermally, and the substrate with a diameter of up to 8 inches (about 203.2 mm) comes out, so it can be easily obtained. For this reason, it is preferable as a base substrate for diamond single crystal growth.
  • the base substrate 4 is a mirror whose at least one side 4a is mirror-polished.
  • the diamond layer is grown on the mirror-polished surface side (on the surface of the one surface 4a).
  • a base substrate whose one side 4a and back side 4b are mirror-polished may be used, and in this case, either one can be arbitrarily used as a growth surface of the diamond layer.
  • the mirror polishing may be performed so as to be smooth to the extent that a diamond layer can grow on at least one side 4a.
  • As a guideline it is preferable to polish the surface to a surface roughness Ra of 10 nm or less. If the Ra of the single side 4a exceeds 10 nm, the quality of the diamond layer grown on the single side 4a is deteriorated. Furthermore, it is assumed that there is no crack on one side 4a. Ra may be measured with a surface roughness measuring machine.
  • the growth surface of the diamond layer is preferably (001).
  • planes other than (001) can also be used.
  • the shape of the base substrate 4 in the planar direction is not particularly limited, and may be, for example, a circular shape or a square shape.
  • the diameter of the base substrate 4 is preferably 2 inches (about 50.8 mm) or more, and more preferably 3 inches (about 76.2 mm) or more from the viewpoint of increasing the size. Preferably, it is 6 inches (about 152.4 mm) or more.
  • the upper limit of the diameter is not particularly limited, but is preferably 8 inches or less from a practical viewpoint. In consideration of the dimensional tolerance of the base substrate 4, in the present application, the range of 49.8 mm to 50.8 mm, which is obtained by subtracting 1.0 mm corresponding to 2% of 50.8 mm, is defined as 2 inches.
  • the base substrate 4 is square, it is preferably 50 mm ⁇ 50 mm or more and more preferably 75 mm ⁇ 75 mm or more from the viewpoint of enlargement.
  • the upper limit of the dimension is preferably 200 mm ⁇ 200 mm or less from a practical viewpoint.
  • the surface of the base substrate 4 has a surface area of at least 20 cm 2 . Furthermore, it is more preferable to have a surface area of up to 1297 cm 2 from the viewpoint of enlargement.
  • the thickness d4 of the base substrate 4 is preferably 3.0 mm or less, more preferably 1.5 mm or less, and further preferably 1.0 mm or less.
  • the lower limit of the thickness d4 is not particularly limited, but is preferably 0.05 mm or more and more preferably 0.4 mm or more from the viewpoint of ensuring the rigidity of the base substrate 4.
  • the thickness d4 is preferably 0.3 mm or more, and when the diameter exceeds 150 mm, the thickness d4 is 0.6 mm or more. Is preferred.
  • a diamond layer 9 made of a diamond single crystal is grown and formed on one side 4a as shown in FIG.
  • the growth method of the diamond layer 9 is not particularly limited, and a known method can be used.
  • a vapor phase growth method such as a pulsed laser deposition (PLD: Pulsed Laser Deposition) method or a chemical vapor deposition method (CVD: Chemical Vapor Deposition) method.
  • the base substrate 4 Prior to the growth of the diamond layer 9, the base substrate 4 is thermally cleaned, and then the diamond layer 9 is grown.
  • the PLD method laser sputtering is performed on a target containing graphite, amorphous carbon, or diamond in a gas atmosphere substantially consisting of oxygen, and the carbon is scattered from the target to be formed on one side 4a of the base substrate 4.
  • a diamond layer 9 is grown.
  • the furnace pressure is preferably 1.33 ⁇ 10 ⁇ 4 Pa to 133.32 Pa
  • the temperature of the base substrate 4 is 300 ° C. to 1000 ° C.
  • the distance between the target and the base substrate 4 is preferably in the range of 10 mm to 100 mm.
  • a base substrate 4 is placed in a CVD growth furnace, and a CVD diamond single crystal is grown on one side 4a of the base substrate 4.
  • a growth method a direct current plasma method, a hot filament method, a combustion flame method, an arc jet method, or the like can be used, but a microwave plasma method is preferable in order to obtain high-quality diamond with little contamination.
  • a gas containing hydrogen and carbon is used as a source gas.
  • Methane is introduced into the growth reactor as a gas containing hydrogen and carbon at a methane / hydrogen gas flow rate ratio of 0.001% to 30%.
  • the pressure in the furnace is kept at about 1.3 ⁇ 10 3 Pa to 1.3 ⁇ 10 5 Pa, and plasma is generated by applying a microwave of frequency 2.45 GHz ( ⁇ 50 MHz) or 915 MHz ( ⁇ 50 MHz) with a power of 100 W to 60 kW.
  • CVD diamond is grown by depositing active species on one side 4a of the underlying substrate 4 maintained at a temperature of 700 ° C. to 1300 ° C. by heating with the plasma.
  • an iridium (Ir) single crystal film may be formed on the surface of the base substrate 4 as a pretreatment, and the diamond layer 9 may be grown on the Ir single crystal film.
  • the thickness d9 of the diamond layer 9 shown in FIG. 6 is set so as to be equal to the height of the columnar diamond to be formed, and is preferably grown to a thickness of 30 ⁇ m or more and 500 ⁇ m or less.
  • the columnar diamond 11 may be formed by etching, photolithography, laser processing, or the like.
  • the diamond layer 9 is formed by heteroepitaxial growth with respect to the base substrate 4, many crystal defects are formed in the diamond layer 9, but by using a plurality of columnar diamonds 11, defects can be thinned out.
  • a diamond substrate layer 12 is grown and formed on the tip of the columnar diamond 11.
  • the growth of the diamond single crystal can be promoted uniformly from any columnar diamond 11.
  • the diamond substrate layer 12 is manufactured by coalescence of diamond single crystals grown from each columnar diamond 11.
  • the number of columnar diamonds 11 that can be formed varies depending on the diameter of the base substrate 4, and the number of columnar diamonds 11 can be increased as the diameter of the base substrate 4 increases. Accordingly, a 2-inch diamond substrate layer can be produced from a 2-inch base substrate, and an 8-inch diamond substrate layer can be produced from an 8-inch base substrate.
  • the surface quality of the diamond substrate layer 12 is grown by growing the diamond single crystal from each columnar diamond. Is improved, and a full width at half maximum of 300 seconds or less can be realized over the entire surface.
  • the pitch value between the columnar diamonds 11 can be selected as appropriate. However, the pitch value may be appropriately selected from the viewpoint of whether coalescence of the diamond single crystal grown from each columnar diamond 11 starts at the same timing.
  • the diamond substrate layer 12 is separated from the base substrate 4 at the columnar diamond 11 portion.
  • stress is generated in the columnar diamond 11 due to warpage generated in the base substrate 4 and the diamond substrate layer 12, and the columnar diamond 11 is destroyed by the stress, and the diamond substrate 12 is converted into the base substrate 4.
  • the base substrate 4 made of MgO single crystal has a thermal expansion coefficient and a lattice multiplier larger than that of the diamond substrate layer 12 made of diamond single crystal. Accordingly, during the cooling after the growth of the diamond substrate layer 12, a tensile stress is generated on the diamond substrate layer 12 side from the center portion toward the end portion as shown by the arrows. The tensile stress is generated by a stress generated by a difference in lattice constant between the base substrate 4 and the diamond substrate layer 12 and / or a difference in thermal expansion coefficient between the base substrate 4 and the diamond substrate layer 12. As a result, as shown in FIG. 8, the diamond substrate layer 12, the base substrate 4, and each columnar diamond 11 as a whole warp greatly so that the diamond substrate layer 12 side has a convex shape.
  • each columnar diamond 11 is broken as shown in FIG. 9 and the diamond substrate layer 12 is separated from the base substrate 4.
  • the stress generated by the difference in lattice constant between the base substrate 4 and the diamond substrate layer 12 and / or the stress generated by the difference in thermal expansion coefficient between the base substrate 4 and the diamond substrate layer 12 can be used for separation. Separately after the growth of the substrate layer 12, an apparatus, a tool or a process for separation is unnecessary. Therefore, the manufacturing process of the diamond substrate 1 can be simplified and the separation process can be facilitated.
  • the height of the columnar diamond 11 is set to a direction perpendicular to the (001) plane of the diamond single crystal forming the diamond layer 9 and each columnar diamond 11, so that the columnar diamond 11 by stress application is set. This is preferable because the destruction proceeds smoothly.
  • the thickness d9 of the diamond layer 9 shown in FIG. 6 is set so as to be equal to the height of the columnar diamond to be formed, and is preferably grown to a thickness of 30 ⁇ m or more and 500 ⁇ m or less. As shown in FIG. 10, columnar diamond 11 may be formed leaving a diamond layer 9 corresponding to a partial thickness of the bottom of thickness d9.
  • the aspect ratio of each columnar diamond 11 is set to a value that does not completely fill each columnar diamond 11 during the growth of the diamond substrate layer 12, and specifically, 5 or more is desirable.
  • the cross-sectional shape of the columnar diamond 11 may be square or circular. However, the columnar diamond 11 needs to be quickly destroyed when a stress is applied. Considering the above points, since the cross-sectional shape of the columnar diamond 11 is more circular (that is, the columnar diamond 11 is cylindrical), the stress is applied evenly in the circumferential direction. Can be uniform. Therefore, since the crack, tear, or generation of cracks in the diamond substrate layer 12 due to non-uniform fracture can be prevented, a circular shape is more preferable.
  • each columnar diamond 11 is set to about submicron to 5 ⁇ m, and the diameter of the central portion of the columnar diamond is formed to be smaller than the diameter of the tip portion in the height direction. It is possible to proceed more easily and smoothly, which is preferable.
  • the diamond substrate layer 12 is polished to remove the remaining columnar diamond 11 and sliced and circled to cut out a disk. Furthermore, the diamond substrate 1 is manufactured from the diamond substrate layer 12 by subjecting the disk to various processes such as lapping, polishing, CMP, and mirror polishing as necessary. Accordingly, the thickness d12 of the diamond substrate layer 12 is set to be slightly thicker than the above-mentioned t in consideration of the polishing allowance and the like.
  • the polishing allowance since diamond is a material having the highest hardness, it is preferable to set it as thin as possible in view of the difficulty of the polishing process. As an example, it may be set to 50 ⁇ m.
  • the diamond substrate 1 By manufacturing the diamond substrate 1 from such a diamond substrate layer 12, a diamond substrate having a large diameter of 2 inches or more can be manufactured. Furthermore, since the full width at half maximum of the rocking curve by X-rays on the surface 2 of the diamond substrate 1 can be realized for 300 seconds or less over the entire surface 2, the high-quality diamond substrate 1 can be provided.

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KR1020167007448A KR102106424B1 (ko) 2013-09-30 2014-09-25 다이아몬드 기판 및 다이아몬드 기판의 제조 방법
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EP14848179.9A EP3054036B1 (en) 2013-09-30 2014-09-25 Diamond substrate manufacturing method
US15/026,063 US10132000B2 (en) 2013-09-30 2014-09-25 Diamond substrate and diamond substrate manufacturing method
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EP4112786A1 (en) 2021-07-02 2023-01-04 Shin-Etsu Polymer Co., Ltd. Method of manufacturing diamond substrate
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CN112992675A (zh) * 2021-02-05 2021-06-18 中国电子科技集团公司第十三研究所 用于太赫兹肖特基二极管的多孔金刚石衬底的制备方法
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EP4112787A1 (en) 2021-07-02 2023-01-04 Shin-Etsu Polymer Co., Ltd. Method of manufacturing diamond substrate

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