WO2015041313A1 - Ruban adhésif double face pour dispositif électronique portable - Google Patents
Ruban adhésif double face pour dispositif électronique portable Download PDFInfo
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- WO2015041313A1 WO2015041313A1 PCT/JP2014/074823 JP2014074823W WO2015041313A1 WO 2015041313 A1 WO2015041313 A1 WO 2015041313A1 JP 2014074823 W JP2014074823 W JP 2014074823W WO 2015041313 A1 WO2015041313 A1 WO 2015041313A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/625—Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
- C08G18/6254—Polymers of alpha-beta ethylenically unsaturated carboxylic acids and of esters of these acids containing hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Definitions
- the present invention is for portable electronic devices that can adhere and fix components constituting a portable electronic device to the device main body, and the base material is not destroyed even when a strong impact is applied, and peeling of the component from the device main body can be suppressed. It relates to a double-sided adhesive tape.
- Mobile electronic devices such as mobile phones and personal information terminals (Personal Digital Assistants, PDAs) are designed so that they do not come off or break even if an impact is applied in consideration of falling from the user's hand to the foot.
- PDAs Personal Digital Assistants
- Fixed arrangements or device body designs are being considered. Therefore, a double-sided pressure-sensitive adhesive tape that is used for fixing the component to the main body of the device is desired to prevent the component from coming off even when an impact is applied, and not to apply a strong shock to the component. ing.
- an acrylic pressure-sensitive adhesive layer is laminated and integrated on at least one surface of a base material layer as a shock absorbing tape that fixes a component constituting a portable electronic device to the device body.
- An impact absorbing tape is described in which the layer is a cross-linked polyolefin resin foam sheet having a specific degree of cross-linking and an aspect ratio of cells.
- the present invention is for portable electronic devices that can adhere and fix components constituting a portable electronic device to the device main body, and the base material is not destroyed even when a strong impact is applied, and peeling of the component from the device main body can be suppressed. It aims at providing a double-sided adhesive tape.
- the present invention relates to a double-sided pressure-sensitive adhesive tape for portable electronic devices having adhesive layers on both sides of a base material, wherein the base material has a breaking elongation at 23 ° C. in the MD direction of 480 to 580%, and an apparent density is 0.4 to 0.6 g / cm 3 and made of a polyolefin foam having a 25% compressive strength in the thickness direction of 200 to 600 kPa, and at least one pressure-sensitive adhesive layer contains butyl acrylate and 2-ethylhexyl acrylate
- a double-sided pressure-sensitive adhesive tape for portable electronic devices comprising 100 parts by weight of an acrylic copolymer having a weight average molecular weight of 400,000 to 1,000,000 obtained by copolymerization of a monomer mixture and 30 to 50 parts by weight of a tackifier resin .
- the present invention is described in detail below.
- the present inventor has found that the cause of the peeling of the component from the device body when a strong impact is applied to the portable electronic device is the destruction of the substrate of the double-sided adhesive tape for portable electronic device, and the strength of the substrate was considered to raise.
- the strength of the base material is increased too much, the flexibility of the base material is remarkably impaired, causing a problem of peeling at the interface with the pressure-sensitive adhesive layer.
- the present inventor has obtained a 25 ° C. compressive elongation at 23 ° C. in the MD direction, an apparent density, and a 25% compression in the thickness direction of a polyolefin foam that is a base material for a double-sided pressure-sensitive adhesive tape for portable electronic devices.
- the present inventor has a pressure-sensitive adhesive layer having a high adhesive strength containing a specific acrylic copolymer and a tackifying resin on at least one surface of a substrate excellent in both strength and flexibility. It has been found that a double-sided pressure-sensitive adhesive tape for portable electronic devices has a base material that is not destroyed even when a strong impact is applied, and can suppress the peeling of components from the device body (that is, has excellent impact resistance). The present invention has been completed.
- the present invention is a double-sided pressure-sensitive adhesive tape for portable electronic devices having pressure-sensitive adhesive layers on both sides of a substrate.
- the base material has a breaking elongation at 23 ° C. in the MD direction of 480 to 580%, an apparent density of 0.4 to 0.6 g / cm 3 , and a 25% compressive strength in the thickness direction of 200 to 600 kPa. It consists of a certain polyolefin foam.
- the polyolefin foam has a breaking elongation at 23 ° C. in the MD direction of 480 to 580%.
- the breaking elongation at 23 ° C. in the MD direction is less than 480%, the polyolefin foam is less flexible and easily peels off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied.
- the breaking elongation at 23 ° C. in the MD direction exceeds 580%, the polyolefin foam has a reduced strength and is easily broken when subjected to a strong impact.
- MD direction means the extrusion direction at the time of extruding a polyolefin foam in a sheet form.
- the elongation at break is obtained by measuring the elongation at break a (%) in accordance with JISK-6767 and correcting the measured elongation at break a (%) based on the following formula (1).
- Elongation at break (%) Measured elongation at break a ⁇ (1 / (18 ⁇ b)) (1)
- b represents the apparent density (g / cm ⁇ 3 >) of polyolefin foam.
- the polyolefin foam has an apparent density of 0.4 to 0.6 g / cm 3 .
- the apparent density is less than 0.4 g / cm 3 , the polyolefin foam has a reduced strength and is easily broken when subjected to a strong impact.
- the apparent density exceeds 0.6 g / cm 3 , the polyolefin foam is less flexible and easily peels off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied.
- the apparent lower limit of the density is 0.42 g / cm 3, a preferred upper limit is 0.57 g / cm 3, more preferable lower limit is 0.45 g / cm 3, and a more preferred upper limit is 0.55 g / cm 3.
- the apparent density can be measured and calculated using an electronic hydrometer (trade name “ED120T”) manufactured by Mirage in accordance with JISK-6767.
- the polyolefin foam has a 25% compressive strength in the thickness direction of 200 to 600 kPa.
- the 25% compressive strength in the thickness direction is less than 200 kPa, the polyolefin foam is reduced in strength and easily broken when subjected to a strong impact.
- the 25% compressive strength in the thickness direction exceeds 600 kPa, the polyolefin foam is less flexible and easily peels off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied.
- the preferable lower limit of the 25% compressive strength in the thickness direction is 250 kPa, the preferable upper limit is 500 kPa, the more preferable lower limit is 300 kPa, and the more preferable upper limit is 400 kPa.
- the 25% compressive strength in the thickness direction can be measured in accordance with JISK-6767.
- a 25 cm-thick laminate is produced by superimposing polyolefin foams cut into 5 cm ⁇ 5 cm and left at room temperature, and then the 25% compressive strength in the thickness direction of the laminate is measured at room temperature. .
- the polyolefin foam is not particularly limited as long as it is a foam containing a polyolefin resin, and examples thereof include a polyethylene foam, a polypropylene foam, an ethylene-propylene foam, and the like.
- a polyolefin-based resin obtained using a metallocene compound containing a tetravalent transition metal as a polymerization catalyst is included.
- a foam also referred to herein as a “metallocene polyolefin foam” is preferred.
- a foam containing a polyethylene resin obtained by using a metallocene compound (also referred to as “metallocene polyethylene foam” in the present specification) is more preferable.
- the metallocene compounds include Kaminsky catalysts.
- ethylene and other ⁇ -olefin blended as necessary may be used as a polyethylene resin obtained by using the metallocene compound contained in the metallocene polyethylene foam.
- ethylene and other ⁇ -olefin blended as necessary may be used.
- examples thereof include polyethylene-based resins obtained by polymerization.
- examples of the other ⁇ -olefins include propene, 1-butene, 1-pentene, 1-hexene and the like.
- the metallocene polyethylene foam may further contain another olefin resin in addition to the polyethylene resin obtained using the metallocene compound.
- the other olefin resins include polyethylene, polypropylene, ethylene-propylene copolymer, and the like.
- the content of the polyethylene resin obtained by using the metallocene compound in the metallocene polyethylene foam is preferably 40% by weight or more. When the content of the polyethylene resin obtained by using the metallocene compound is 40% by weight or more, high compressive strength can be obtained even if the metallocene polyethylene foam is thin.
- the polyolefin foam is preferably cross-linked.
- the method for crosslinking the polyolefin foam is not particularly limited.
- a method of irradiating the polyolefin foam with ionizing radiation such as electron beam, ⁇ ray, ⁇ ray, ⁇ ray, Examples include a method of decomposing the organic peroxide by heating.
- the method for producing the polyolefin foam is not particularly limited, but a foamable resin composition containing a polyolefin resin and a foaming agent is prepared, and the foamable resin composition is extruded into a sheet using an extruder. In this case, it is preferable to foam the foaming agent and crosslink the obtained polyolefin foam as necessary.
- the thickness of the polyolefin foam is not particularly limited, but is preferably 120 to 300 ⁇ m. When the thickness is less than 120 ⁇ m, the polyolefin foam has a reduced strength and may be destroyed when a strong impact is applied. When the thickness exceeds 300 ⁇ m, the polyolefin foam is reduced in flexibility, and may be peeled off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied. Also, along the shape of the adherend It may be difficult to stick them together.
- At least one pressure-sensitive adhesive layer has a weight average molecular weight of 400,000 to 1,000,000 obtained by copolymerization of a monomer mixture containing butyl acrylate and 2-ethylhexyl acrylate. 100 parts by weight of an acrylic copolymer and 30 to 50 parts by weight of a tackifier resin are contained. By setting it as such a composition, the adhesive force of an adhesive layer can be raised.
- the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention as long as at least one pressure-sensitive adhesive layer has such a composition, the double-sided pressure-sensitive adhesive layers may have the same composition or different compositions. May be.
- the acrylic copolymer is obtained by copolymerizing a monomer mixture containing butyl acrylate and 2-ethylhexyl acrylate.
- the preferred content of butyl acrylate in the total monomer mixture is 40 to 80% by weight.
- the content of butyl acrylate is less than 40% by weight, the pressure-sensitive adhesive layer becomes too soft and the cohesive force is lowered, and may be peeled off when a strong impact is applied.
- the content of butyl acrylate exceeds 80% by weight, the pressure-sensitive adhesive layer becomes hard and the adhesive strength or tack is lowered, and may be peeled off when a strong impact is applied.
- the preferred content of 2-ethylhexyl acrylate in the total monomer mixture is 10 to 40% by weight. If the content of 2-ethylhexyl acrylate is less than 10% by weight, the pressure-sensitive adhesive layer may be peeled off when the adhesive force is reduced and a strong impact is applied. When the content of 2-ethylhexyl acrylate exceeds 40% by weight, the pressure-sensitive adhesive layer becomes too soft and the cohesive force is lowered, and may be peeled off when a strong impact is applied.
- the monomer mixture may contain other copolymerizable monomers other than butyl acrylate and 2-ethylhexyl acrylate as necessary.
- examples of other polymerizable monomers that can be copolymerized include, for example, carbon number of alkyl groups such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and isopropyl (meth) acrylate.
- (Meth) acrylic acid alkyl ester having 1 to 3 carbon atoms such as (meth) acrylic acid alkyl ester, tridecyl methacrylate, stearyl (meth) acrylate, and the like, and (meth) acrylic acid hydroxyalkyl And functional monomers such as glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid and fumaric acid.
- the monomer mixture may be radically reacted in the presence of a polymerization initiator.
- a method of radical reaction of the monomer mixture that is, a polymerization method
- examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
- the said polymerization initiator is not specifically limited, For example, an organic peroxide, an azo compound, etc. are mentioned.
- organic peroxide examples include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5 -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Examples include isobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-butylperoxylaurate.
- the azo compound examples include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.
- the acrylic copolymer has a weight average molecular weight (Mw) of 400,000 to 1,000,000.
- Mw weight average molecular weight
- the pressure-sensitive adhesive layer has a reduced cohesive force and an adhesive force at the adherend interface.
- the weight average molecular weight exceeds 1,000,000, the pressure-sensitive adhesive layer has a low adhesive force and is easily peeled off when a strong impact is applied.
- the preferable lower limit of the weight average molecular weight is 500,000, and the preferable upper limit is 700,000.
- polymerization conditions such as a polymerization initiator and a polymerization temperature may be adjusted.
- a weight average molecular weight (Mw) is a weight average molecular weight of standard polystyrene conversion by GPC (Gel Permeation Chromatography: gel permeation chromatography).
- the pressure-sensitive adhesive layer contains 30 to 50 parts by weight of a tackifier resin with respect to 100 parts by weight of the acrylic copolymer.
- a tackifier resin with respect to 100 parts by weight of the acrylic copolymer.
- the content of the tackifying resin is less than 30 parts by weight, the pressure-sensitive adhesive layer is easily peeled off from the adherend due to peeling stress caused by deformation of the adherend when a strong impact is applied.
- the content of the tackifying resin exceeds 50 parts by weight, the pressure-sensitive adhesive layer becomes hard and the adhesive force or tack is lowered, and may be peeled off when a strong impact is applied.
- tackifier resins examples include rosin ester resins, hydrogenated rosin resins, terpene resins, terpene phenol resins, coumarone indene resins, alicyclic saturated hydrocarbon resins, C5 petroleum resins, and C9 resins. Examples include petroleum resins and C5-C9 copolymer petroleum resins. These tackifying resins may be used alone or in combination of two or more.
- a crosslinking structure may be formed between main chains of the resin (the acrylic copolymer and / or the tackifying resin) constituting the pressure-sensitive adhesive layer by adding a crosslinking agent.
- a crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an aziridine type crosslinking agent, an epoxy-type crosslinking agent, a metal chelate type crosslinking agent etc. are mentioned. Of these, isocyanate-based crosslinking agents are preferred.
- the isocyanate group of the isocyanate-based crosslinking agent reacts with the alcoholic hydroxyl group in the resin constituting the pressure-sensitive adhesive layer, thereby cross-linking the pressure-sensitive adhesive layer. It becomes loose. Therefore, the pressure-sensitive adhesive layer can disperse the peeling stress applied intermittently, and has a resistance to peeling from the adherend against the peeling stress caused by the deformation of the adherend when a strong impact is applied. More improved.
- the addition amount of the crosslinking agent is preferably 0.01 to 10 parts by weight and more preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
- the degree of cross-linking of the pressure-sensitive adhesive layer is too high or too low, the pressure-sensitive adhesive layer may be easily peeled off from the adherend due to peeling stress caused by deformation of the adherend. It is preferably 40% by weight, more preferably 10 to 40% by weight, and particularly preferably 15 to 35% by weight.
- the thickness of the pressure-sensitive adhesive layer is not particularly limited, but the thickness of the pressure-sensitive adhesive layer (thickness of the pressure-sensitive adhesive layer on one side) is preferably 10 to 150 ⁇ m. When the thickness is less than 10 ⁇ m, the pressure-sensitive adhesive layer may have reduced impact resistance. When the thickness exceeds 150 ⁇ m, the pressure-sensitive adhesive layer may have impaired reworkability or removability.
- the total thickness of the double-sided pressure-sensitive adhesive tape is preferably 150 to 400 ⁇ m. When the total thickness is less than 150 ⁇ m, the impact resistance of the double-sided pressure-sensitive adhesive tape may be lowered. When the total thickness exceeds 400 ⁇ m, the double-sided pressure-sensitive adhesive tape may not be suitable for use in bonding and fixing components constituting the portable electronic device to the device body.
- a solution of an adhesive A is prepared by adding a solvent to an acrylic copolymer, a tackifier resin, and a cross-linking agent as necessary, and the solution of the adhesive A is applied to the surface of the substrate.
- the solvent is completely removed by drying to form the pressure-sensitive adhesive layer A.
- the release film is superimposed on the pressure-sensitive adhesive layer A so that the release treatment surface faces the pressure-sensitive adhesive layer A.
- a release film different from the above release film is prepared, the adhesive B solution is applied to the release treatment surface of the release film, and the solvent in the solution is completely removed by drying, thereby releasing the release film.
- a laminated film in which the pressure-sensitive adhesive layer B is formed on the surface of the mold film is produced.
- the obtained laminated film is laminated on the back surface of the base material on which the pressure-sensitive adhesive layer A is formed, with the pressure-sensitive adhesive layer B facing the back surface of the base material to produce a laminate.
- the double-sided adhesive tape which has an adhesive layer on both surfaces of a base material, and the surface of the adhesive layer was covered with the release film can be obtained.
- two sets of laminated films are produced in the same manner, and a laminated body is produced by superposing these laminated films on both sides of the base material with the adhesive layer of the laminated film facing the base material.
- a double-sided pressure-sensitive adhesive tape having an adhesive layer on both surfaces of the base material and having the surface of the adhesive layer covered with a release film may be obtained.
- the use of the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention is not particularly limited, but the use of bonding and fixing components constituting the portable electronic device to the device body is preferable.
- the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention can be used, for example, as a double-sided pressure-sensitive adhesive tape for bonding and fixing a liquid crystal display panel of a portable electronic device to a device body.
- the shape of the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention in these uses is not particularly limited, and examples thereof include a rectangle, a frame shape, a circle, an ellipse, and a donut shape.
- a portable electronic device that can adhere and fix components constituting a portable electronic device to the device main body, and even if a strong impact is applied, the base material is not destroyed and the separation of the component from the device main body can be suppressed.
- a double-sided adhesive tape for equipment can be provided.
- Acrylic copolymer (a) except that 50 parts by weight of butyl acrylate, 32 parts by weight of 2-ethylhexyl acrylate, 15 parts by weight of ethyl acrylate, 3 parts by weight of acrylic acid, and 0.2 parts by weight of 2-hydroxyethyl acrylate were used. Similarly, a solution of an acrylic copolymer (d) having a weight average molecular weight of 1.26 million was obtained.
- Example 1 A release paper having a thickness of 150 ⁇ m was prepared, the pressure-sensitive adhesive (1) was applied to the release-treated surface of the release paper, and dried at 100 ° C. for 5 minutes, thereby forming a pressure-sensitive adhesive layer having a thickness of 30 ⁇ m.
- This pressure-sensitive adhesive layer was made of a crosslinked metallocene polyethylene foam having a thickness of 140 ⁇ m (breaking elongation at 23 ° C. in MD direction: 552%, apparent density: 0.44 g / cm 3 , 25% compression strength in the thickness direction: 208 kPa). Bonded to the surface.
- the same pressure-sensitive adhesive layer as above was bonded to the opposite surface of the crosslinked metallocene polyethylene foam. This obtained the double-sided adhesive tape covered with the 150-micrometer-thick release paper.
- Examples 2 to 10 Comparative Examples 1 to 13
- a double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the types and thicknesses of the base material and the pressure-sensitive adhesive were changed as described in Tables 2 and 3.
- FIG. 1 the schematic diagram of the drop impact test of the double-sided adhesive tape obtained by the Example and the comparative example is shown.
- the obtained double-sided adhesive tape was punched into an outer diameter of 46 mm, a length of 61 mm, an inner diameter of 44 mm, and a length of 59 mm to produce a frame-shaped test piece having a width of 1 mm.
- the square hole is approximately in the center of the test piece 1 from which the release paper has been peeled off from the polycarbonate plate 3 having a thickness of 38 mm and a square hole having a width of 50 mm and a thickness of 2 mm.
- a polycarbonate plate 2 having a width of 55 mm, a length of 65 mm, and a thickness of 1 mm is pasted from the upper surface of the test piece 1 so that the test piece 1 is located substantially in the center, and the test apparatus was assembled. . Thereafter, a pressure of 5 kgf was applied for 10 seconds from the side of the polycarbonate plate positioned on the upper surface of the test apparatus, and the polycarbonate plate positioned on the upper and lower sides and the test piece were pressed and left at room temperature for 24 hours.
- the frame-shaped test piece of width 2mm was produced, and the result of the "drop impact test [cm] at 2 mm width" was obtained by the same method using the obtained test piece. Furthermore, when the result of the “drop impact test at 1 mm width [cm]” is 60 cm or more and the result of the “drop impact test at 2 mm width [cm]” is 120 cm or more, the drop impact resistance was determined as ⁇ , and in the cases other than the above, the drop impact resistance was determined as ⁇ .
- a portable electronic device that can adhere and fix components constituting a portable electronic device to the device main body, and even if a strong impact is applied, the base material is not destroyed and the separation of the component from the device main body can be suppressed.
- a double-sided adhesive tape for equipment can be provided.
- Test piece (frame shape) 2 Polycarbonate plate (thickness 1mm) 3 Polycarbonate plate (thickness 2mm) 4 Iron balls (300 g)
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Priority Applications (3)
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KR1020157032204A KR20160060005A (ko) | 2013-09-20 | 2014-09-19 | 휴대 전자 기기용 양면 점착 테이프 |
JP2014549249A JP6557470B2 (ja) | 2013-09-20 | 2014-09-19 | 携帯電子機器用両面粘着テープ |
CN201480039470.7A CN105378016B (zh) | 2013-09-20 | 2014-09-19 | 便携电子设备用双面粘合带 |
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PCT/JP2014/074823 WO2015041313A1 (fr) | 2013-09-20 | 2014-09-19 | Ruban adhésif double face pour dispositif électronique portable |
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JP (1) | JP6557470B2 (fr) |
KR (1) | KR20160060005A (fr) |
CN (1) | CN105378016B (fr) |
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WO (1) | WO2015041313A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015120876A (ja) * | 2013-11-22 | 2015-07-02 | 日東電工株式会社 | 両面粘着シート |
WO2019066077A1 (fr) * | 2017-09-29 | 2019-04-04 | 積水化学工業株式会社 | Bande adhésive double face |
CN113508034A (zh) * | 2019-03-04 | 2021-10-15 | Dic株式会社 | 粘合带和粘接体 |
WO2022064897A1 (fr) * | 2020-09-24 | 2022-03-31 | 日東電工株式会社 | Feuille adhésive |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104650757A (zh) * | 2013-11-22 | 2015-05-27 | 日东电工株式会社 | 双面粘合片 |
CN106957615B (zh) * | 2017-04-01 | 2020-07-14 | 江苏澳盛复合材料科技有限公司 | 一种发泡板及其制备方法和用途 |
CN107779117A (zh) * | 2017-12-15 | 2018-03-09 | 常熟市长江胶带有限公司 | 一种变压器用高强高粘结力胶带 |
WO2020218430A1 (fr) * | 2019-04-24 | 2020-10-29 | 積水化学工業株式会社 | Ruban adhésif sensible à la pression |
Citations (2)
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JP2011168727A (ja) * | 2010-02-19 | 2011-09-01 | Sekisui Chem Co Ltd | 電子機器用粘着シート |
WO2013099755A1 (fr) * | 2011-12-26 | 2013-07-04 | Dic株式会社 | Bande adhésive sensible à la pression |
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JPH08143847A (ja) * | 1994-11-17 | 1996-06-04 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物 |
JP4707816B2 (ja) * | 2000-10-23 | 2011-06-22 | 日本合成化学工業株式会社 | 粘着剤組成物及びリサイクル部品用粘着テープ |
JP2008260825A (ja) * | 2007-04-11 | 2008-10-30 | Dic Corp | 両面粘着テープおよびアクリル系粘着剤組成物 |
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2014
- 2014-09-19 KR KR1020157032204A patent/KR20160060005A/ko not_active Application Discontinuation
- 2014-09-19 TW TW103132547A patent/TWI642752B/zh not_active IP Right Cessation
- 2014-09-19 WO PCT/JP2014/074823 patent/WO2015041313A1/fr active Application Filing
- 2014-09-19 CN CN201480039470.7A patent/CN105378016B/zh not_active Expired - Fee Related
- 2014-09-19 JP JP2014549249A patent/JP6557470B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011168727A (ja) * | 2010-02-19 | 2011-09-01 | Sekisui Chem Co Ltd | 電子機器用粘着シート |
WO2013099755A1 (fr) * | 2011-12-26 | 2013-07-04 | Dic株式会社 | Bande adhésive sensible à la pression |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015120876A (ja) * | 2013-11-22 | 2015-07-02 | 日東電工株式会社 | 両面粘着シート |
JP2018193557A (ja) * | 2013-11-22 | 2018-12-06 | 日東電工株式会社 | 両面粘着シート |
WO2019066077A1 (fr) * | 2017-09-29 | 2019-04-04 | 積水化学工業株式会社 | Bande adhésive double face |
JP2019065153A (ja) * | 2017-09-29 | 2019-04-25 | 積水化学工業株式会社 | 両面粘着テープ |
JP7193229B2 (ja) | 2017-09-29 | 2022-12-20 | 積水化学工業株式会社 | 両面粘着テープ |
CN113508034A (zh) * | 2019-03-04 | 2021-10-15 | Dic株式会社 | 粘合带和粘接体 |
CN113508034B (zh) * | 2019-03-04 | 2023-12-05 | Dic株式会社 | 粘合带和粘接体 |
WO2022064897A1 (fr) * | 2020-09-24 | 2022-03-31 | 日東電工株式会社 | Feuille adhésive |
Also Published As
Publication number | Publication date |
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JP6557470B2 (ja) | 2019-08-07 |
CN105378016A (zh) | 2016-03-02 |
JPWO2015041313A1 (ja) | 2017-03-02 |
TW201520301A (zh) | 2015-06-01 |
CN105378016B (zh) | 2019-07-19 |
TWI642752B (zh) | 2018-12-01 |
KR20160060005A (ko) | 2016-05-27 |
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