TWI642752B - 攜帶電子機器用兩面黏著帶 - Google Patents
攜帶電子機器用兩面黏著帶 Download PDFInfo
- Publication number
- TWI642752B TWI642752B TW103132547A TW103132547A TWI642752B TW I642752 B TWI642752 B TW I642752B TW 103132547 A TW103132547 A TW 103132547A TW 103132547 A TW103132547 A TW 103132547A TW I642752 B TWI642752 B TW I642752B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- parts
- adhesive layer
- sided adhesive
- double
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/625—Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
- C08G18/6254—Polymers of alpha-beta ethylenically unsaturated carboxylic acids and of esters of these acids containing hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2013-195572 | 2013-09-20 | ||
JP2013195572 | 2013-09-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201520301A TW201520301A (zh) | 2015-06-01 |
TWI642752B true TWI642752B (zh) | 2018-12-01 |
Family
ID=52688960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103132547A TWI642752B (zh) | 2013-09-20 | 2014-09-19 | 攜帶電子機器用兩面黏著帶 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6557470B2 (fr) |
KR (1) | KR20160060005A (fr) |
CN (1) | CN105378016B (fr) |
TW (1) | TWI642752B (fr) |
WO (1) | WO2015041313A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104650757A (zh) * | 2013-11-22 | 2015-05-27 | 日东电工株式会社 | 双面粘合片 |
JP6367598B2 (ja) * | 2013-11-22 | 2018-08-01 | 日東電工株式会社 | 両面粘着シート |
CN106957615B (zh) * | 2017-04-01 | 2020-07-14 | 江苏澳盛复合材料科技有限公司 | 一种发泡板及其制备方法和用途 |
JP7193229B2 (ja) * | 2017-09-29 | 2022-12-20 | 積水化学工業株式会社 | 両面粘着テープ |
CN107779117A (zh) * | 2017-12-15 | 2018-03-09 | 常熟市长江胶带有限公司 | 一种变压器用高强高粘结力胶带 |
WO2020179464A1 (fr) * | 2019-03-04 | 2020-09-10 | Dic株式会社 | Ruban adhésif et objet devant être collé |
JP6966650B2 (ja) * | 2019-04-24 | 2021-11-17 | 積水化学工業株式会社 | 粘着テープ |
JP2022052802A (ja) * | 2020-09-24 | 2022-04-05 | 日東電工株式会社 | 粘着シート |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011168727A (ja) * | 2010-02-19 | 2011-09-01 | Sekisui Chem Co Ltd | 電子機器用粘着シート |
TW201333151A (zh) * | 2011-12-26 | 2013-08-16 | Dainippon Ink & Chemicals | 黏著帶 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08143847A (ja) * | 1994-11-17 | 1996-06-04 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物 |
JP4707816B2 (ja) * | 2000-10-23 | 2011-06-22 | 日本合成化学工業株式会社 | 粘着剤組成物及びリサイクル部品用粘着テープ |
JP2008260825A (ja) * | 2007-04-11 | 2008-10-30 | Dic Corp | 両面粘着テープおよびアクリル系粘着剤組成物 |
-
2014
- 2014-09-19 JP JP2014549249A patent/JP6557470B2/ja active Active
- 2014-09-19 KR KR1020157032204A patent/KR20160060005A/ko not_active Application Discontinuation
- 2014-09-19 CN CN201480039470.7A patent/CN105378016B/zh not_active Expired - Fee Related
- 2014-09-19 TW TW103132547A patent/TWI642752B/zh not_active IP Right Cessation
- 2014-09-19 WO PCT/JP2014/074823 patent/WO2015041313A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011168727A (ja) * | 2010-02-19 | 2011-09-01 | Sekisui Chem Co Ltd | 電子機器用粘着シート |
TW201333151A (zh) * | 2011-12-26 | 2013-08-16 | Dainippon Ink & Chemicals | 黏著帶 |
Also Published As
Publication number | Publication date |
---|---|
CN105378016B (zh) | 2019-07-19 |
KR20160060005A (ko) | 2016-05-27 |
TW201520301A (zh) | 2015-06-01 |
JP6557470B2 (ja) | 2019-08-07 |
CN105378016A (zh) | 2016-03-02 |
WO2015041313A1 (fr) | 2015-03-26 |
JPWO2015041313A1 (ja) | 2017-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |