WO2015027701A1 - 一种高精度背钻Stub长度控制的实现方法 - Google Patents

一种高精度背钻Stub长度控制的实现方法 Download PDF

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Publication number
WO2015027701A1
WO2015027701A1 PCT/CN2014/073235 CN2014073235W WO2015027701A1 WO 2015027701 A1 WO2015027701 A1 WO 2015027701A1 CN 2014073235 W CN2014073235 W CN 2014073235W WO 2015027701 A1 WO2015027701 A1 WO 2015027701A1
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WO
WIPO (PCT)
Prior art keywords
conductive layer
drilling
drill
printed circuit
circuit board
Prior art date
Application number
PCT/CN2014/073235
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English (en)
French (fr)
Inventor
杨永星
张键
刘山当
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US14/553,942 priority Critical patent/US9827616B2/en
Publication of WO2015027701A1 publication Critical patent/WO2015027701A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B49/00—Measuring or gauging equipment on boring machines for positioning or guiding the drill; Devices for indicating failure of drills during boring; Centering devices for holes to be bored
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/36—Multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/41—Highly conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2260/00—Details of constructional elements
    • B23B2260/128—Sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/32—Use of electronics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/48—Measuring or detecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/16—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/17—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control infeed
    • Y10T408/173—Responsive to work

Definitions

  • the present invention claims to be submitted to the Chinese Patent Office on August 28, 2013, and the application number is 201310381665. 7.
  • the invention name is "a method for realizing high-precision back-drilling Stub length control"
  • the priority of the Chinese Patent Application the entire contents of which is incorporated herein by reference.
  • BACKGROUND OF THE INVENTION 1.
  • the present invention relates to the field of manufacturing a printed circuit board (PCB), and more particularly to a method and apparatus for drilling a printed circuit board.
  • PCB printed circuit board
  • BACKGROUND With the rapid development of wireless and network communication technologies, the working frequency of communication products is getting higher and higher, and the improvement of the working frequency of communication products puts forward higher requirements on the loss control of the transmission process.
  • the back-drilling of the printed circuit board is a process to effectively reduce the loss of the hole link. The smaller the excess length of the stub above the signal layer after the back-drilling, the smaller the loss.
  • the backdrilling of the plated through hole is generally performed according to the pre-calculated theoretical back drilling depth; and the back drill is tested by the conventional back drilling test of the PCB production board.
  • the length of the stub is analyzed and sliced to correct the backdrill depth. Due to the large amount of work involved in depth inspection, the Coupon back-drilling depth is typically measured by production lot slicing, ie the back-drilling depth is not corrected for each PCB. Due to the uneven thickness of the PCB, there is a difference in the thickness of the same batch of PCBs, even if the thickness of the same PCB is different.
  • the disadvantage of the prior art is that the back drilling depth obtained according to the conventional back-drilled Coupon position of the PCB board is deviated from the actual back drilling position depth on the PCB board.
  • the thicker the PCB board the larger the absolute value of the deviation.
  • the deviation of the back drilling depth is also larger.
  • the functions realized by the PCB are more and more complicated, and the integration level is getting higher and higher.
  • the PCB board needs more layers and a larger thickness to meet the functional design requirements of the PCB board, and the back-drilling Coupon according to the PCB board mentioned above.
  • the deviation of the back-drilling depth obtained by the test result of the position is large, so that the length of the stub is large, and the influence of the hole link loss is large when the high-frequency signal is transmitted.
  • Embodiments of the present invention provide a method and apparatus for drilling a printed circuit board, which can reduce the loss in the high-speed high-frequency signal transmission process of the hole link by reducing the length of the stub of the back-drill.
  • an embodiment of the present invention provides a method of drilling a printed circuit board, the method comprising: drilling a drill bit from an initial position, when in contact with a first conductive layer of a printed circuit board, The rig generates a first electrical signal, and determines a first conductive position according to the first electrical signal to obtain first z coordinate information corresponding to the first conductive position;
  • drilling operation is continued, and when contacting the second conductive layer of the printed circuit board, the drilling machine generates a second electrical signal, and determines the first electrical signal according to the second electrical signal a second conductive position, obtaining second Z coordinate information corresponding to the second conductive position;
  • the predetermined depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth
  • the medium thickness is calculated The absolute value of the difference between the first z coordinate information and the second Z coordinate information is obtained.
  • the second conductive layer is a conductive layer between the signal layer and the back-drilled surface conductive layer
  • the drilling operation is continued, and the printed circuit board is drilled through, and the through hole is obtained. After the drill bit is drilled through the second conductive layer, the drilling operation is continued until the printed circuit board is to be used.
  • the through hole is obtained; when the first conductive layer is a conductive layer between the signal layer and the back-drilled surface conductive layer, and the second conductive layer is a back-drilled surface conductive layer, The drilling operation is continued, and the printed circuit board is drilled through, and the through hole is drilled, including: the drill bit is drilled through: the drill bit is drilled through the second conductive layer, and the drilling motion is stopped, and the through hole is obtained. .
  • the first Z coordinate information identifies the drill bit in a vertical direction The coordinate value.
  • the drilling machine when the first conductive layer of the printed circuit board is in contact, the drilling machine generates The first electrical signal includes - when the drill bit is in contact with the first conductive layer of the printed circuit board, the driller detects the first conductive layer, the control circuit of the drill, and the A first loop is formed between the drill bits to generate the first electrical signal.
  • the contacting with the second conductive layer of the printed circuit board comprises: when the drill bit is in contact with the second conductive layer of the printed circuit board, the drilling machine detects the second conductive layer, the control of the drilling machine through an internal inductor A second loop is formed between the drill bits in the circuit domain to generate a second electrical signal.
  • an embodiment of the present invention provides a drilling device for a printed circuit board, the device comprising a host, a drill bit - the host includes a controller, the controller includes a control circuit and an inductor, and the control The circuit controls the drill bit to perform a drilling motion from an initial position, the rig generates a first electrical signal when contacting the first conductive layer of the printed circuit board, and determines a first conductive position according to the first electrical signal, a first Z coordinate information corresponding to the first conductive position; the control circuit controls the drill bit to drill through the first conductive layer, and further performs a drilling motion when the second conductive layer is opposite to the printed circuit board When contacting, the drilling machine generates a second electrical signal, and determines a second conductive position according to the second electrical signal to obtain second z coordinate information corresponding to the second conductive position; the control circuit controls the drill bit to continue Performing a drilling motion, drilling the printed circuit board to obtain a through hole; the host performs back drilling at a predetermined
  • the absolute value of the difference between the Z coordinate information and the second Z coordinate information is obtained.
  • the second conductive layer is a conductive layer between the signal layer and the back-drilled surface conductive layer
  • the drill bit is specifically used to: after the drill bit is drilled through the second conductive layer, continue drilling operation until the printed circuit board is drilled through to obtain the through hole; a conductive layer is a conductive layer between the signal layer and the back-drilled surface conductive layer, and when the second conductive layer is a back-drilled surface conductive layer, the drill bit is specifically used for: the drill bit is drilled through the second After the conductive layer, the drilling operation is stopped, and the through hole is obtained.
  • the first Z coordinate information identifies the drill bit in a vertical direction The coordinate value.
  • the drilling machine when the drill bit is in contact with the first conductive layer of the printed circuit board, the drilling machine The process of generating the second electrical signal is specifically: when the drill bit is in contact with the first conductive layer of the printed circuit board, the inductor detects the first conductive layer, the control circuit of the drilling machine, and the Forming a first loop between the drill bits; the driller generates the first electrical signal according to the first loop.
  • the contacting with the second conductive layer of the printed circuit board is specifically: when the drill bit is in contact with the second conductive layer of the printed circuit board, the inductor detects the second conductive layer, the control circuit of the drilling machine Forming a second loop between the drill bits; the drill produces a second electrical signal based on the second loop.
  • the drill bit of the drilling machine when back drilling is required on the printed circuit board, performs drilling operation from an initial position, and when contacting the first conductive layer of the printed circuit board, the drilling machine generates a first electrical signal, and Determining a first conductive position according to the first electrical signal to obtain first z coordinate information corresponding to the first conductive position; after drilling through the first conductive layer, continuing drilling operation, when contacting the second conductive layer of the printed circuit board The drilling machine generates a second electrical signal, and determines a second conductive position according to the second electrical signal to obtain a second Z coordinate information corresponding to the second conductive position; continuing the drilling motion, drilling the printed circuit board to obtain a through hole; Back drilling is performed at a predetermined depth according to a predetermined depth, wherein the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth, wherein the medium thickness is calculated by calculating the first Z coordinate information The absolute value of the difference of the second Z coordinate information is obtained
  • the embodiment of the present invention can obtain the precise back drilling depth of the through hole to be back drilled by obtaining the thickness of the medium between the second conductive layer and the first conductive layer when drilling the through hole, and reduce the back drilling.
  • the Stub length enables high-precision back-drilling of the PCB board, thereby reducing the loss during high-speed high-frequency signal transmission of the hole link and improving the integrity of the transmitted signal.
  • 1 is a schematic cross-sectional view of a printed circuit board according to an embodiment of the present invention
  • FIG. 2 is a flow chart of a method for drilling a printed circuit board according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of obtaining a dielectric thickness between a second conductive layer and a first conductive layer by a current feedback signal according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of back drilling according to the obtained back drilling depth according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a drilling device for a printed circuit board according to an embodiment of the present invention.
  • the embodiments of the present invention are described in detail with reference to the accompanying drawings in the embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
  • FIG. 1 is a detailed description of a printed circuit board according to an embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.
  • the drilling method provided by the embodiments of the present invention needs to obtain the dielectric thickness between the first conductive layer and the second conductive layer.
  • a printed circuit board provided by an embodiment of the present invention includes a first conductive layer 101 , a via hole 102 , a signal layer 103 , and a second conductive layer 104 .
  • first conductive layer 101 a first conductive layer
  • second conductive layer 104 a second conductive layer
  • the various parts of the printed circuit board are as follows:
  • the signal layer can be designed by some means (such as providing an insulating medium in the circuit between the signal layer and the rig) so that the current for feedback loop formation is not generated when the rig is drilled into the signal layer.
  • the first conductive layer 101 is located between the signal layer 103 and the second conductive layer 104.
  • the first conductive layer 101 is a power layer or a ground layer.
  • the first conductive layer 101 must be drilled through the layer during back drilling. As the through hole is drilled, the first conductive layer 104 and the drill bit of the drilled through hole and the drill control circuit may form a first test circuit loop such that the drill acquires an electrical signal and positions the first conductive layer.
  • the through hole 102 has a third conductive layer formed on the inner wall of the through hole.
  • the third conductive layer formed on the inner wall of the through hole 102 may connect the signal layer to the upper end surface of the printed circuit board (the other side opposite to the back-drilled surface).
  • the second conductive layer 104 is located on one side of the back drill (ie, the side that is first in contact with the drill bit).
  • the first conductive layer forms a first test circuit loop with the drill bit and the drill control circuit for drilling the through hole, such that the drill machine acquires an electrical signal and positions the first conductive layer;
  • the second conductive layer and The drill bit that drills the through hole and the drill control circuit form a second test circuit loop such that the drill acquires an electrical signal and positions the second conductive layer.
  • the second conductive layer 104 is a back-drilled surface conductive layer.
  • the drilled surface conductive layer that is, the second conductive layer 104 may be drilled, so that when the drill bit contacts the second conductive layer 104, The second conductive layer 104 forms a second test loop with the drill bit and the drill control circuit to generate an electrical signal, by which the position of the second conductive layer 104 can be determined.
  • the drilling operation continues, and when drilling into the first conductive layer 101, the first conductive layer 101 forms a first test loop with the drill bit and the drill control circuit to generate an electrical signal by which the position of the first conductive layer 101 can be determined.
  • the thickness of the medium between the two conductive layers can be determined, and the back drilling can be performed according to the thickness of the medium.
  • the second conductive layer 104 and the first conductive layer 101 may further include a multi-layer signal layer and an insulating layer separating the multi-layer signal layer; in order to drill the second conductive layer 104 with the drill bit
  • the first conductive layer 101 The interlayer between the second conductive layer 104 and the first conductive layer 101 may be insulated by providing isolation pads for the interlayer of the first conductive layer 101 without generating a circuit loop. .
  • drilling may also be started from the opposite side of the conductive layer of the backdrilled surface, so that the signal layer may be drilled first, then drilled into the first conductive layer 101, and then drilled to the second conductive layer 104.
  • the back conductive surface conductive layer when the drill bit contacts the first conductive layer 101, the first conductive layer 101 forms a first test loop with the drill bit and the drill control circuit to generate an electrical signal, and the first conductive layer can be determined by the electrical signal. 101 location.
  • the drilling operation continues, and as the second conductive layer 104 is drilled, the second conductive layer 104 forms a second test loop with the drill bit and the drill control circuit to generate an electrical signal by which the position of the second conductive layer 104 can be determined.
  • the dielectric thickness between the two conductive layers can be determined.
  • a compensation value (offset value) can be added to the thickness as the depth at the time of back drilling to achieve high-precision back drilling.
  • the printed circuit board provided by the embodiment of the present invention realizes the pass through the second conductive layer when the through hole is drilled by providing the first conductive layer on the drilled layer and the second conductive layer on the back drill face.
  • the position of the first conductive layer is obtained to obtain a precise depth between the two conductive layers, and thus the depth required for back drilling can be determined based on the depth and a compensation value, thereby realizing high-precision back drilling and controlling a smaller stub, thereby reducing
  • the loss of the high-frequency signal transmission of the hole link is beneficial to improve the integrity of the transmitted signal.
  • FIG. 2 is a flow chart of a method for drilling a printed circuit board according to an embodiment of the present invention.
  • the main body of this embodiment is a drilling machine in which the method of determining the depth of the back drilling while drilling the through hole is described in detail. As shown in FIG. 2, this embodiment includes the following steps:
  • Step 201 The drill bit of the drilling machine performs a drilling motion from an initial position. When contacting the first conductive layer of the printed circuit board, the drilling machine generates a first electrical signal, and determines a first conductive position according to the first electrical signal. Obtaining first Z coordinate information corresponding to the first conductive position.
  • the drilling machine can drill through holes from the conductive layer of the back-drilled surface, or can drill through holes from the other side of the printed circuit board opposite to the conductive layer of the back-drilled surface. In the embodiment of the invention, the drilling machine starts drilling through the conductive layer of the back-drilled surface.
  • the technical solution provided by the embodiment of the present invention is described in detail as an example. The technical solution provided by the embodiment of the present invention is also fully applicable to the application scenario of drilling a through hole from the other side of the printed circuit board opposite to the conductive layer of the back-drilled surface.
  • the first conductive layer is a back-drilled surface conductive layer
  • the second conductive layer is a conductive layer between the signal layer and the back-drilled surface conductive layer.
  • the initial position is the position at which the drill bit begins to drill.
  • the driller controls the drill bit to start drilling at the initial position.
  • the first conductive layer, the control circuit of the drill and the drill bit form a first loop to generate a first electrical signal.
  • the drilling machine obtains the position of the drill bit as the first conductive position, and can record the z coordinate (vertical coordinate) information corresponding to the first conductive position, and the Z coordinate information can identify the real coordinate information in the vertical direction of the drill bit.
  • the first Z coordinate information may further identify reference coordinate information (such as 0) in a vertical direction of the real position of the bit relative to the initial position, or may be a reference coordinate information (such as 1000) of any value. , -100, etc.).
  • Step 202 after drilling through the first conductive layer, continuing drilling operation, when contacting the second conductive layer of the printed circuit board, the drilling machine generates a second electrical signal, and according to the second electrical The signal determines a second conductive position to obtain second z coordinate information corresponding to the second conductive position.
  • the driller controls the drill bit to continue drilling at the same position.
  • the drill bit contacts the second conductive layer of the printed circuit board, and at this time, the second conductive layer, the control circuit of the drill,
  • the drill bit can form a second circuit through the printed circuit board to generate a second electrical signal through which the rig introduces current.
  • the drilling machine obtains the position of the drill bit as the second conductive position, and can record the coordinate information of the z corresponding to the second conductive position, and the Z coordinate information can identify the coordinate information of the real position of the drill bit in the vertical direction.
  • the second Z coordinate information is used to calculate the distance that the drill bit moves in the Z direction (vertical direction) (that is, calculate the offset distance), and therefore, its value corresponds to the first z coordinate information, for example, the first Z coordinate information is When a z coordinate value is relatively true (there is some error in the system), the second Z coordinate information is also a relatively true Z coordinate value; when the first Z coordinate information is a relative value (such as 0), the second Z The value of the coordinate information is the offset value calculated from 0.
  • Step 203 continuing the drilling motion, drilling the printed circuit board to obtain a through hole.
  • the drilling operation is continued until the printed circuit board is drilled through to obtain a through hole.
  • a copper plating treatment is performed on the inner wall of the through hole to obtain a third conductive layer for connecting the signal layer to the upper end surface of the printed circuit board (the other end surface of the printed circuit board opposite to the second conductive layer).
  • Step 204 performing back drilling according to a preset depth in the through hole position, wherein the predetermined depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth, the medium The thickness is obtained by calculating an absolute value of a difference between the first Z coordinate information and the second Z coordinate information.
  • the thickness of the medium between the second conductive layer and the first conductive layer can be automatically calculated by an internally set program, and the thickness of the medium can be the back of the back drilling Drilling depth.
  • FIG. 3 is a schematic diagram of obtaining a dielectric thickness between a second conductive layer and a first conductive layer by a current feedback signal according to an embodiment of the present invention, as shown in the figure, when the drill bit is drilled to the conductive layer of the back drill surface, Control circuit, drill
  • the test layer circuit is formed on the conductive layer of the head and back drill surface, and the rig main machine can obtain the first z coordinate information of the drill bit; when the drill bit is drilled to the conductive layer between the conductive layer and the signal layer of the back drill surface, the rig is in the main body of the drill
  • the control circuit, the drill bit and the conductive layer form a test circuit loop, at which time the drill machine host can acquire the second z coordinate information of the drill bit; through the first Z coordinate information and the second Z coordinate information, the 101 conductive layer and the 104 conductive layer can be obtained.
  • the drilling machine can compensate by the thickness of the medium, that is, add a compensation depth based on the thickness of the medium, and the value can be positive or negative. .
  • This back-drilling depth ensures that the back-drilled drill cannot penetrate the non-drillable layer, the signal layer.
  • the compensation depth is set by the rig according to the actual situation, and the purpose is to ensure that the non-drillable layer cannot be drilled during the back drilling.
  • the compensation depth may be no greater than the value of the dielectric thickness between the signal layer and the adjacent conductive layer minus the tolerance of the device, where the "adjacent conductive layer" refers to the signal in the first conductive layer and the second conductive layer.
  • the closest conductive layer of the layer for example, the conductive layer 101 of Figures 1, 3.
  • the back drilling depth that is, the preset depth
  • the through hole to be back drilled can be back drilled.
  • the back hole has an aperture D that is larger than the aperture of the through hole, so as to abrade the copper plating of the through hole wall. Since the back drilling depth is obtained by drilling the through hole, the error is small, so the length of the back drilled Stub is small, thereby The loss in the high-speed high-frequency signal transmission of the hole link can be greatly reduced, and the transmission integrity of the high-frequency signal can be improved.
  • the technical solution provided by the present invention can also drill a through hole from the other side opposite to the conductive layer on the back-drilled surface, so that the drill bit first drills into the signal layer, and does not generate a current feedback signal, and continues the drilling motion.
  • a first test circuit loop is generated to generate a first signal, whereby the rig main body can determine the position of the 101 conductive layer, the drilling machine performs the drilling motion, and the drill bit is drilled to the one shown in FIG.
  • a second test circuit loop can be generated to generate a second electrical signal, so that the drilling machine main body can determine the position of the 104 conductive layer, and after drilling through the conductive layer 104, the through hole can be obtained. Based on the positions of the 104 conductive layer and the 101 conductive layer, the dielectric thickness between the two conductive layers can be determined, whereby the predetermined depth of the through hole position can be determined.
  • the drill bit of the drilling machine when back drilling is required on the printed circuit board, performs drilling operation from the initial position, and when contacting the first conductive layer of the printed circuit board, the drilling machine generates the first electric power. And determining a first conductive position according to the first electrical signal to obtain first Z coordinate information corresponding to the first conductive position; after drilling through the first conductive layer, continuing drilling operation, when conducting second conductive with the printed circuit board When the layer is in contact, the drilling machine generates a second electrical signal, and determines a second conductive position according to the second electrical signal to obtain second Z coordinate information corresponding to the second conductive position; The drilling operation is continued, the printed circuit board is drilled through to obtain a through hole, and the back hole is drilled according to a preset depth at the position of the through hole, wherein the preset depth is the dielectric thickness between the second conductive layer and the first conductive layer plus Compensating the depth, wherein the medium thickness is obtained by calculating an absolute value of a difference between
  • the embodiment of the present invention can obtain the precise back drilling depth of the through hole to be back drilled by obtaining the thickness of the medium between the second conductive layer and the first conductive layer when drilling the through hole, and reduce the back drilling.
  • the Stub length enables high-precision back-drilling of the PCB board, thereby reducing the loss during high-speed high-frequency signal transmission of the hole link and improving the integrity of the transmitted signal.
  • the embodiment of the present invention further provides a drilling device for a printed circuit board.
  • the apparatus is for drilling a hole on a printed circuit board, wherein the printed circuit board includes a plurality of conductive layers and an insulating layer separating the conductive layers.
  • FIG. 5 is a schematic diagram of a drilling device for a printed circuit board according to an embodiment of the present invention.
  • the apparatus includes a main body 501 and a drill bit 502.
  • the host 501 includes a controller 505, and the controller 505 includes a control circuit 504 and an inductor 505.
  • the host 501 includes a controller 505 that includes a control circuit 504 and a sensor 505 that controls the drill bit to perform a drilling motion from an initial position when in contact with the first conductive layer of the printed circuit board.
  • the rig generates a first electrical signal, and determines a first conductive position according to the first electrical signal to obtain first Z coordinate information corresponding to the first conductive position;
  • the control circuit controls the drill bit to drill through the first After a conductive layer, drilling operation is continued, and when contacting the second conductive layer of the printed circuit board, the drilling machine generates a second electrical signal, and determining a second conductive position according to the second electrical signal,
  • the second conductive position corresponds to second Z coordinate information;
  • the control circuit controls the drill bit to continue the drilling motion, and the printed circuit board is drilled through to obtain a through hole.
  • the drill bit is specifically used for: the drill bit is drilled through After the second conductive layer, drilling operation is continued until the printed circuit board is drilled through to obtain the through hole; when the first conductive layer is a signal layer and the backdrill surface conductive layer.
  • the drill bit is specifically used to: after the drill bit penetrates the second conductive layer, stop drilling motion, and the through-bit can be obtained hole.
  • the first Z coordinate information and the second Z coordinate information identify coordinate values of the drill bit in the vertical direction.
  • the initial position is the position at which the drill bit begins to drill down.
  • the driller controls the drill bit to start drilling at the initial position when the drill bit contacts the first conductive layer of the printed circuit board.
  • the inductor 505 detects that the first conductive layer, the control circuit of the drill and the drill bit form a first loop, and the drill generates a first electrical signal.
  • the drilling machine may determine the first conductive position according to the first electrical signal, and may record the Z coordinate information corresponding to the first conductive position, and the Z coordinate information may identify the coordinate information of the real position of the drill bit in the vertical direction.
  • the driller controls the drill bit to continue the drilling operation at the same position.
  • the drill hole reaches a certain degree, the drill bit contacts the second conductive layer of the printed circuit board, and the inductor 505 detects the second conductive state.
  • the layer, the control circuit of the drilling machine, the drill bit can form a second loop through the printed circuit board, the drill machine generates a second electrical signal, and the drilling machine introduces a current through the second loop.
  • the drilling machine acquires the position of the drill bit as the second conductive position, and can record the Z coordinate information corresponding to the second conductive position, and the Z coordinate information can identify the coordinate information of the real position of the drill bit in the vertical direction.
  • the drilling operation is continued until the printed circuit board is drilled through to obtain the through hole.
  • the via holes may be plated to form a conductive layer inside the via holes.
  • the host 501 the host performs back drilling at a predetermined depth in the through hole position, wherein the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth,
  • the medium thickness is obtained by calculating an absolute value of a difference between the first Z coordinate information and the second Z coordinate information.
  • the thickness of the medium between the second conductive layer and the first conductive layer at the position of the through hole can be automatically calculated by an internally set program, and the thickness of the medium can be Back drilling depth when back drilling.
  • the host 502 can perform a compensation process based on the thickness of the medium, that is, add a compensation depth based on the thickness of the medium, and the value can be positive or negative. value.
  • the compensation depth is set by the drilling machine according to the actual situation, the purpose is to ensure that the non-drillable layer cannot be drilled during the back drilling.
  • the preset depth is obtained, that is, after the back drilling depth, the through hole to be back drilled can be back drilled, and the hole diameter of the back drill is larger than the hole diameter of the through hole, so that the copper plating of the through hole hole wall is ground, due to
  • the back drilling depth is obtained by drilling the through hole, and the error is small, so the length of the back drilled Stub is small, so that the loss in the high-speed high-frequency signal transmission process of the hole link can be greatly reduced, and the transmission of the high-frequency signal is improved. Sex.
  • the drilling machine can drill through holes from the conductive layer of the back-drilled surface, or can drill through holes from the other side of the printed circuit board opposite to the conductive layer of the back-drilled surface, and the drilling device provided by the embodiment of the invention simultaneously Suitable for both scenarios.
  • the embodiment of the present invention can achieve accurate back-drilling depth by obtaining the thickness of the medium between the second conductive layer and the first conductive layer (which must be drilled through) when drilling the through hole, and reduce the back-drilled stub.
  • the length enables high-precision back drilling of the PCB board, thereby reducing the loss during high-speed high-frequency signal transmission of the hole link and improving the integrity of the transmitted signal.

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Abstract

一种印刷电路板的钻孔方法和钻孔装置，钻孔方法包括：钻头从初始位置进行钻孔运动，当与印刷电路板的第一导电层（101）接触时，钻机产生第一电信号并根据第一电信号确定第一导电位置，得到第一导电位置对应的第一Z坐标信息；钻穿第一导电层（101）后，继续进行钻孔运动，当与第二导电层（104）接触时，钻机产生第二电信号，并根据第二电信号确定第二导电位置，得到第二导电位置对应的第二Z坐标信息；继续进行钻孔运动，将印刷电路板钻通，得到通孔；在通孔位置按照预设深度进行背钻，其中，预设深度为第二导电层（104）与第一导电层（101）之间介质厚度加上补偿深度。本钻孔方法在钻通孔时通过获取背钻面与必须钻穿层之间的差值来获取精确的背钻深度，减小背钻的Stub长度。

Description

一种高精度背钻 Stub长度控制的实现方法 本申请要求于 2013年 8月 28日提交中国专利局、 申请号为 201310381665. 7、发明 名称为 "一种高精度背钻 Stub长度控制的实现方法" 的中国专利申请的优先权， 其全 部内容通过引用结合在本申请中。 技术领域 本发明涉及印刷电路板 （Printed Circuit Board, PCB) 的制造技术领域， 尤其涉 及一种印刷电路板的钻孔方法和装置。 背景技术 随着无线、 网络通信技术的快速发展， 通信产品的工作频率越来越高， 通信产品工 作频率的提高对传输过程的损耗控制提出更高的要求。而印刷电路板的背钻是一种有效 降低孔链路损耗的工艺加工方式，背钻后的信号层上方的多余的孔铜（Stub)长度越小， 损耗也越小。
在现有技术下，一般按预先计算的理论背钻深度，对电镀孔（Plated Through Hole, PTH)进行背钻；并通过 PCB生产板边的常规的背钻测试科邦（Coupon)测试背钻的 Stub 长度， 并进行切片分析， 以校正背钻深度。 由于深度检测的工作量较大， 通常是按生产 批次切片检测 Coupon背钻深度， 即并非对每个 PCB板都校正背钻深度。 由于 PCB板厚 的不均匀性， 同批次的 PCB板的厚度存在一定差异， 即使是同一块 PCB板不同位置的厚 度也存在差异。 现有技术的缺点是， 按照 PCB板边常规的背钻 Coupon位置的测试结果 得到的背钻深度， 与 PCB板上实际背钻位置深度存在偏差， PCB板越厚， 该偏差的绝对 值越大， 背钻深度的偏差也越大。
PCB实现的功能越来越复杂， 集成程度越来越高， 相应的， PCB板需要更多的层数、 更大的厚度满足 PCB 板功能设计需求， 而通过上述的按照 PCB板边背钻 Coupon位置的 测试结果得到的背钻深度的偏差较大， 使得 Stub长度较大， 在高频信号传输时， 孔链 路损耗影响大。 发明内容
本发明实施例提供了一种印刷电路板的钻孔方法和装置，可以实现通过减小背钻的 Stub长度， 降低孔链路高速高频信号传输过程中的损耗。 第一方面， 本发明实施例提供了一种印刷电路板的钻孔方法， 所述方法包括： 钻机的钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 所述 钻机产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述第一导电位 置对应的第一 z坐标信息；
钻穿所述第一导电层后， 继续进行钻孔运动， 当与所述印刷电路板的第二导电层接 触时， 所述钻机产生第二电信号， 并根据所述第二电信号确定第二导电位置， 得到所述 第二导电位置对应的第二 Z坐标信息；
继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔；
在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度为所述第二导电层与 所述第一导电层之间介质厚度加上补偿深度， 所述介质厚度通过计算所述第一 z坐标信 息与所述第二 Z坐标信息的差值的绝对值得到。
根据第一方面， 在第一种可能的实现方式中， 当所述第一导电层为背钻面导电层， 所述第二导电层为信号层与所述背钻面导电层之间的导电层时， 所述继续进行钻孔运 动， 将所述印刷电路板钻通， 得到通孔包括： 所述钻头钻穿所述第二导电层后， 继续钻 孔运动， 直到将所述印刷电路板钻通， 即可得到所述通孔； 当所述第一导电层为信号层 与所述背钻面导电层之间的导电层， 所述第二导电层为背钻面导电层时， 所述继续进行 钻孔运动， 将印刷电路板钻通， 得到通孔包括所述钻头钻穿包括： 所述钻头钻穿所述第 二导电层后， 停止钻孔运动， 即可得到所述通孔。
根据第一方面或者第一方面的第一种可能的实现方式， 在第二种可能的实现方式 中， 所述第一 Z坐标信息、 所述第二 Z坐标信息标识所述钻头在垂直方向上的坐标值。
根据第一方面或者第一方面的第一种、 第二种可能的实现方式， 在第三种可能的实 现方式中， 所述当与印刷电路板的第一导电层接触时， 所述钻机产生第一电信号包括- 当所述钻头与所述印刷电路板的第一导电层接触时，所述钻机通过内部的感应器检测到 所述第一导电层、 所述钻机的控制电路与所述钻头之间形成第一回路， 产生所述第一电 信号。
根据第一方面或者第一方面的第一种、 第二种、 第三种可能的实现方式， 在第四种 可能的实现方式中， 所述当与所述印刷电路板的第二导电层接触时， 所述钻机产生第二 电信号包括： 当所述钻头与所述印刷电路板的第二导电层接触时， 所述钻机通过内部的 感应器检测到第二导电层、 所述钻机的控制电路域所述钻头之间形成第二回路， 产生第 二电信号。 第二方面， 本发明实施例提供了一种印刷电路板的钻孔装置， 所述装置包括主机、 钻头- 所述主机包括一个控制器， 所述控制器包括控制电路以及感应器， 所述控制电路控 制所述钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 所述钻机 产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述第一导电位置对 应的第一 Z坐标信息； 所述控制电路控制所述钻头钻穿所述第一导电层后， 继续进行钻 孔运动， 当与所述印刷电路板的第二导电层接触时， 所述钻机产生第二电信号， 并根据 所述第二电信号确定第二导电位置， 得到所述第二导电位置对应的第二 z坐标信息； 所 述控制电路控制所述钻头继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔； 所述主机在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度为所述第二 导电层与所述第一导电层之间介质厚度加上补偿深度，所述介质厚度通过计算所述第一
Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。
根据第二方面， 在第一种可能的实现方式中， 当所述第一导电层为背钻面导电层， 所述第二导电层为信号层与所述背钻面导电层之间的导电层时， 所述钻头具体用于： 所 述钻头钻穿所述第二导电层后， 继续钻孔运动， 直到将所述印刷电路板钻通， 即可得到 所述通孔； 当所述第一导电层为信号层与所述背钻面导电层之间的导电层， 所述第二导 电层为背钻面导电层时， 所述钻头具体用于： 所述钻头钻穿所述第二导电层后， 停止钻 孔运动， 即可得到所述通孔。
根据第二方面或者第二方面的第一种可能的实现方式， 在第二种可能的实现方式 中， 所述第一 Z坐标信息、 所述第二 Z坐标信息标识所述钻头在垂直方向上的坐标值。
根据第二方面或者第二方面的第一种、 第二种可能的实现方式， 在第三种可能的实 现方式中， 当所述钻头与印刷电路板的第一导电层接触时， 所述钻机产生第二电信号的 过程具体为： 当所述钻头与所述印刷电路板的第一导电层接触时， 所述感应器检测到所 述第一导电层、 所述钻机的控制电路与所述钻头之间形成第一回路； 所述钻机根据所述 第一回路产生所述第一电信号。
根据第二方面或者第二方面的第一种、 第二种、 第三种可能的实现方式， 在第四种 可能的实现方式中， 所述当与所述印刷电路板的第二导电层接触时， 所述钻机产生第二 电信号的过程具体为： 当所述钻头与所述印刷电路板的第二导电层接触时， 所述感应器 检测到第二导电层、 所述钻机的控制电路域所述钻头之间形成第二回路； 所述钻机根据 所述第二回路产生第二电信号。 本发明实施例中， 当需要在印刷电路板上进行背钻时， 钻机的钻头从初始位置进行 钻孔运动， 当与印刷电路板的第一导电层接触时， 钻机产生第一电信号， 并根据第一电 信号确定第一导电位置， 得到第一导电位置对应的第一 z坐标信息； 钻穿第一导电层后， 继续进行钻孔运动， 当与印刷电路板的第二导电层接触时， 钻机产生第二电信号， 并根 据第二电信号确定第二导电位置， 得到第二导电位置对应的第二 Z坐标信息； 继续进行 钻孔运动， 将印刷电路板钻通， 得到通孔； 在通孔位置按照预设深度进行背钻， 其中， 预设深度为第二导电层与第一导电层之间介质厚度加上补偿深度， 其中， 介质厚度通过 计算所述第一 Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。 由此， 本发明实施 例可以实现通过在钻通孔时获取第二导电层与第一导电层之间的介质厚度来获取要背 钻的通孔的精确的背钻深度， 减小背钻的 Stub长度， 实现对 PCB板的高精度背钻， 进而 降低孔链路高速高频信号传输过程中的损耗， 提高传输信号的完整性。 附图说明 图 1为本发明实施例提供的一种印刷电路板的剖面示意图；
图 2为本发明实施例提供的一种印刷电路板的钻孔方法流程图；
图 3为本发明实施例提供的通过电流反馈信号获取第二导电层与第一导电层之间的 介质厚度的示意图；
图 4为本发明实施例提供的按照所获取的背钻深度进行背钻的示意图；
图 5为本发明实施例提供的一种印刷电路板的钻孔装置示意图。 具体实施方式 下面结合本发明实施例中的附图，对本发明实施例中的方案进行清楚、完整的描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部实施例。 基于本发明实 施例， 本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例， 都 属于本发明保护的范围。
下面以图 1为例详细说明本发明实施例提供的印刷电路板， 图 1为本发明实施例提供 的一种印刷电路板的剖面示意图。 为了精确控制背钻深度， 本发明实施例提供的钻孔方 法需要获取第一导电层与第二导电层之间的介质厚度。为了能够在钻通孔时能在钻头接 触到第一导电层或者第二导电层时产生电信号， 需要在印刷电路板中设置能够和钻机的 控制电路以及钻头构成电路回路的第一导电层和第二导电层。 如图 1所示， 本发明实施例提供的印刷电路板包括第一导电层 101、 通孔 102、 信号 层 103、 第二导电层 104。 需要说明的是，本实施例及以下各实施例中， 第一导电层和第 二导电层之间并没有严格的位置关系， 仅表示有两个不同的导电层，因此， 针对图 1中的 示意图， 两者名称也可以互换,例如，将图 1中的 104视为 "第一导电层"， 将图 1中的 101 视为 "第二导电层" 。
印刷电路板各个部分具体如下：
信号层 103，信号层可通过一些设计 (如在信号层与钻机之间回路中设置绝缘介质）， 使得在钻机钻到信号层时不会产生用于反馈形成回路的电流。
第一导电层 101， 所述第一导电层位于所述信号层 103与第二导电层 104之间。
可选地， 所述第一导电层 101为电源层或者地层。
第一导电层 101在背钻时为必须钻穿层。 在钻通孔时， 第一导电层 104与钻通孔的钻 头以及所述钻机控制电路可以形成第一测试电路回路，使得钻机获取电信号并定位所述 第一导电层的位置。
通孔 102， 所述通孔内壁形成有第三导电层。
通孔 102内壁所形成的第三导电层可以连接信号层与印刷电路板的上端面 （与背钻 面相对的另一面） 。
第二导电层 104， 所述第二导电层位于背钻的一面（即最先与钻头接触的一面）。 其中， 第一导电层与钻所述通孔的钻头以及钻机控制电路形成第一测试电路回路， 使得所述钻机获取电信号并定位所述第一导电层的位置； 所述第二导电层与钻所述通孔 的钻头以及所述钻机控制电路形成第二测试电路回路，使得所述钻机获取电信号并定位 所述第二导电层的位置。
可选地， 第二导电层 104为背钻面导电层， 在钻通孔时， 可以从背钻面导电层， 即 第二导电层 104开始钻， 这样在钻头接触到第二导电层 104时， 第二导电层 104与钻头以 及钻机控制电路形成第二测试回路产生电信号， 通过该电信号即可确定第二导电层 104 的位置。 继续钻孔运动， 钻到第一导电层 101时， 第一导电层 101与钻头以及钻机控制电 路形成第一测试回路产生电信号， 通过该电信号可以确定第一导电层 101的位置。 通过 确定第一导电层 101、 第二导电层 104的位置， 即可确定两个导电层之间的介质厚度， 按 照该介质厚度进行背钻即可。
可选的，第二导电层 104与所述第一导电层 101之间还可以包括多层信号层以及将所 述多层信号层分开的绝缘层； 为了使得在钻头钻第二导电层 104与所述第一导电层 101之 间的各层时不产生电路回路而对第一导电层 101的位置确认产生影响， 可对第二导电层 104与所述第一导电层 101之间的各层进行设置隔离焊盘的绝缘处理。
可选地， 在钻通孔时， 也可以从背钻面导电层的相对面开始钻孔， 这样可以先钻到 信号层， 然后钻到第一导电层 101， 再钻到第二导电层 104， 即背钻面导电层， 在钻头接 触到第一导电层 101时，第一导电层 101与钻头以及钻机控制电路形成第一测试回路产生 电信号， 通过该电信号即可确定第一导电层 101的位置。 继续钻孔运动， 钻到第二导电 层 104时， 第二导电层 104与钻头以及钻机控制电路形成第二测试回路产生电信号， 通过 该电信号可以确定第二导电层 104的位置。 通过确定第一导电层 101、 第二导电层 104的 位置， 即可确定两个导电层之间的介质厚度。
确定完导电层之间的介质厚度后便可在这个厚度基础上加上一个补偿值 （偏移值） 作为背钻时的深度来实现高精度的背钻。
由此， 本发明实施例提供的印刷电路板通过在必须钻穿层上设置第一导电层， 以及 在背钻面设置第二导电层， 实现了在钻通孔时通过确认第二导电层和第一导电层的位置 以获取两个导电层之间精确的深度，进而可以基于这个深度及一个补偿值来确定需要背 钻的深度， 从而实现高精度背钻， 控制更小的 Stub, 从而减少孔链路高度高频信号传输 过程中的损耗， 有利于提高传输信号的完整性。
上述实施例介绍了本发明实施例提供的印刷电路板， 下面通过一个实施例介绍该印 刷电路板的钻孔方法。 图 2为本发明实施例提供的一种印刷电路板的钻孔方法流程图。 该实施例的执行主体是钻机， 其中详细描述了钻机在钻通孔时确定背钻深度的方法。 如 图 2所示， 本实施例包括以下步骤：
步骤 201， 钻机的钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接 触时， 所述钻机产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述 第一导电位置对应的第一 Z坐标信息。
钻机可以从背钻面导电层开始钻通孔， 也可以从与背钻面导电层相对的印刷电路板 的另一面开始钻通孔，本发明实施例以钻机从背钻面导电层开始钻通孔为例详细介绍本 发明实施例提供的技术方案， 当然本发明实施例提供的技术方案同样完全适用于从与背 钻面导电层相对的印刷电路板的另一面开始钻通孔的应用场景。
当钻机从背钻面导电层开始钻通孔时， 第一导电层即为背钻面导电层， 第二导电层 即为信号层与背钻面导电层之间的导电层。 具体地， 初始位置即为钻头开始进行钻孔运 动的位置， 在对印刷电路板进行钻孔时， 钻机控制钻头在初始位置开始进行钻孔运动， 当钻头与印刷电路板的第一导电层接触时， 第一导电层、 钻机的控制电路与钻头之间形 成第一回路而产生第一电信号。 此时， 钻机获取钻头的位置作为第一导电位置， 可以记 录第一导电位置对应的 z坐标（垂直坐标）信息， 该 Z坐标信息可以标识钻头垂直方向上 的真实坐标信息。
可选地， 该第一 Z坐标信息还可以标识钻头真实位置相对初始位置在垂直方向上的 参考坐标信息 （如 0 ) ， 或者还可以是以任何值为参考值的一个参考坐标信息 （如 1000、 -100等) 。
步骤 202， 钻穿所述第一导电层后， 继续进行钻孔运动， 当与所述印刷电路板的第 二导电层接触时，所述钻机产生第二电信号，并根据所述第二电信号确定第二导电位置， 得到所述第二导电位置对应的第二 z坐标信息。
获取第一导电位置之后， 钻机控制钻头在同一位置继续进行钻孔运动， 钻孔到一定 程度时， 钻头与印刷电路板的第二导电层接触， 此时第二导电层、 钻机的控制电路、 钻 头可以通过印刷电路板形成第二回路而产生第二电信号， 钻机通过该第二回路导入电 流。 此时， 钻机获取钻头的位置作为第二导电位置， 可以记录第二导电位置对应的 z的 坐标信息， 该 Z坐标信息可以标识钻头的真实位置在垂直方向上的坐标信息。
第二 Z坐标信息用于计算钻头在 Z方向（垂直方向）移动的距离（也即计算偏移距离）， 因此， 其值跟第一 z坐标信息的相对应， 例如， 第一 Z坐标信息是一个相对真实 （系统中 会存在一些误差） 的 z坐标值时， 第二 Z坐标信息也是一个相对真实的 Z坐标值； 第一 Z坐 标信息是一个相对的值时 （如 0 ) ， 第二 Z坐标信息的值为从 0开始计算得到的偏移值。
步骤 203， 继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔。
具体地， 钻头钻穿第一导电层后， 继续钻孔运动， 直到将印刷电路板钻通， 即可得 到通孔。 对通孔内壁进行镀铜处理可得到第三导电层， 该第三导电层用于连接信号层与 印刷电路板的上端面 （与第二导电层相对的印刷电路板的另一端面） 。
步骤 204， 在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度为所述第 二导电层与所述第一导电层之间介质厚度加上补偿深度，所述介质厚度通过计算所述第 一 Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。
钻机获取到第一 Z坐标信息和第二 Z坐标信息后， 即可通过内部设置的程序自动计算 第二导电层与第一导电层之间的介质厚度， 该介质厚度可以为背钻时的背钻深度。
图 3为本发明实施例提供的通过电流反馈信号获取第二导电层与第一导电层之间的 介质厚度的示意图， 如图所示， 钻头钻到背钻面导电层时， 钻机主机中的控制电路、 钻 头与背钻面导电层形成了一个测试电路回路， 此时钻机主机可以获取钻头的第一 z坐标 信息； 钻头钻到背钻面导电层与信号层之间的导电层时， 钻机主机中的控制电路、 钻头 与该导电层形成了一个测试电路回路， 此时钻机主机可以获取钻头的第二 z坐标信息； 通过第一 Z坐标信息与第二 Z坐标信息，可以获取 101导电层与 104导电层之间的介质厚度 h。
当然， 为了获得更加精确的背钻深度， 钻机可以通过在该介质厚度的基础上进行补 偿处理， 即在该介质厚度的基础上增加一个补偿深度，该值可以是正值，也可以是负值。 该背钻深度可保证背钻时不能钻到不可钻穿层， 即信号层。 该补偿深度由钻机根据实际 情况进行设置， 目的是保证背钻时不能钻到不可钻穿层。 一个优选的实施例中， 补偿深 度可以不大于信号层与邻近导电层之间介质厚度减去设备公差的值， 这里的 "邻近导电 层"是指第一导电层与第二导电层中与信号层最靠近的导电层， 例如， 图 1、 图 3中的导 电层 101。
图 4为本发明实施例提供的按照所获取的背钻深度进行背钻的示意图， 经过补偿处 理， 得到背钻深度， 即预设深度后， 即可对要背钻的通孔进行背钻， 背钻的孔径 D大于 通孔的孔径， 以便磨掉通孔孔壁的镀铜， 由于背钻深度是通过钻该通孔时得到的， 误差 很小， 因此背钻的 Stub长度很小， 从而可以大大降低孔链路高速高频信号传输过程中的 损耗， 提高高频信号的传输完整性。
上面的方案描述是以从背钻面导电层开始钻通孔来描述的。 优选地， 本发明提供的 技术方案也可以从与背钻面导电层相对的另一面开始钻通孔， 这样钻头首先钻到信号 层， 此时并不产生电流反馈信号， 继续进行钻孔运动， 钻到图 1所示的 101导电层时， 产 生第一测试电路回路， 产生第一信号， 由此钻机主机可以确定 101导电层的位置， 钻机 进行钻孔运动， 钻头钻到图 1所示的 104导电层时， 即可产生第二测试电路回路， 产生第 二电信号， 由此钻机主机可以确定 104导电层的位置，钻穿 104导电层后， 即可得到通孔。 根据 104导电层和 101导电层的位置， 可以确定两个导电层之间的介质厚度， 由此可以确 定该通孔位置的预设深度。
由此， 本发明实施例中， 当需要在印刷电路板上进行背钻时， 钻机的钻头从初始位 置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 钻机产生第一电信号， 并根据 第一电信号确定第一导电位置， 得到第一导电位置对应的第一 Z坐标信息； 钻穿第一导 电层后， 继续进行钻孔运动， 当与印刷电路板的第二导电层接触时， 钻机产生第二电信 号， 并根据第二电信号确定第二导电位置， 得到第二导电位置对应的第二 Z坐标信息； 继续进行钻孔运动，将印刷电路板钻通，得到通孔；在通孔位置按照预设深度进行背钻， 其中， 预设深度为第二导电层与第一导电层之间介质厚度加上补偿深度， 其中， 介质厚 度通过计算所述第一 Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。 由此， 本发 明实施例可以实现通过在钻通孔时获取第二导电层与第一导电层之间的介质厚度来获 取要背钻的通孔的精确的背钻深度， 减小背钻的 Stub长度， 实现对 PCB板的高精度背钻， 进而降低孔链路高速高频信号传输过程中的损耗， 提高传输信号的完整性。
基于上述各实施例， 相应地， 本发明实施例还提供了一种印刷电路板的钻孔装置。 该装置用于在印刷电路板上进行钻孔， 其中， 该印刷电路板包括多层导电层以及将导电 层分开的绝缘层。 图 5为本发明实施例提供的一种印刷电路板的钻孔装置示意图。 如图 5 所示， 该装置包括主机 501、 钻头 502。 其中， 主机 501包括一个控制器 505， 控制器 505 包括控制电路 504以及感应器 505。
主机 501包括一个控制器 505， 所述控制器 505包括控制电路 504以及感应器 505， 控 制电路控制所述钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 所述钻机产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述第一导 电位置对应的第一 Z坐标信息； 所述控制电路控制所述钻头钻穿所述第一导电层后， 继 续进行钻孔运动，当与所述印刷电路板的第二导电层接触时，所述钻机产生第二电信号， 并根据所述第二电信号确定第二导电位置， 得到所述第二导电位置对应的第二 Z坐标信 息；所述控制电路控制所述钻头继续进行钻孔运动，将所述印刷电路板钻通，得到通孔。
当所述第一导电层为背钻面导电层，所述第二导电层为信号层与所述背钻面导电层 之间的导电层时，所述钻头具体用于：所述钻头钻穿所述第二导电层后，继续钻孔运动， 直到将所述印刷电路板钻通， 即可得到所述通孔； 当所述第一导电层为信号层与所述背 钻面导电层之间的导电层， 所述第二导电层为背钻面导电层时， 所述钻头具体用于： 所 述钻头钻穿所述第二导电层后， 停止钻孔运动， 即可得到所述通孔。
其中， 第一 Z坐标信息、 所述第二 Z坐标信息标识钻头在垂直方向上的坐标值。 具体地，初始位置即为钻头开始进行下钻运动的位置，在对印刷电路板进行钻孔时， 钻机控制钻头在初始位置开始进行钻孔运动， 当钻头与印刷电路板的第一导电层接触 时， 感应器 505检测到第一导电层、 钻机的控制电路与钻头之间形成第一回路， 钻机产 生第一电信号。 此时， 钻机可以根据第一电信号确定第一导电位置， 可以记录第一导电 位置对应的 Z坐标信息， 该 Z坐标信息可以标识钻头的真实位置在垂直方向上的坐标信 息。 主机 501获取第一导电位置之后， 钻机控制钻头在同一位置继续进行钻孔运动， 钻 孔到一定程度时， 钻头与印刷电路板的第二导电层接触， 此时感应器 505检测到第二导 电层、钻机的控制电路、钻头可以通过印刷电路板形成第二回路，钻机产生第二电信号， 钻机通过该第二回路导入电流。 此时， 钻机获取钻头的位置作为第二导电位置， 可以记 录第二导电位置对应的 Z坐标信息， 该 Z坐标信息可以标识钻头的真实位置在垂直方向上 的坐标信息。
具体地， 钻头 502钻穿所述第一导电层后， 继续钻孔运动， 直到将所述印刷电路板 钻通， 即可得到所述通孔。 得到通孔后， 可对通孔进行电镀处理， 在通孔内部形成一层 导电层。
主机 501， 所述主机在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度 为所述第二导电层与所述第一导电层之间介质厚度加上补偿深度，所述介质厚度通过计 算所述第一 Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。
主机 501获取到第一 Z坐标信息和第二 Z坐标信息后， 即可通过内部设置的程序自动 计算通孔位置的第二导电层与第一导电层之间的介质厚度， 该介质厚度可以为背钻时的 背钻深度。
当然， 为了获得更加精确的背钻深度， 主机 502可以通过在该介质厚度的基础上进 行补偿处理， 即在该介质厚度的基础上增加一个补偿深度， 该值可以是正值， 也可以是 负值。 其中， 补偿深度由钻机根据实际情况进行设置， 目的是保证背钻时不能钻到不可 钻穿层。
经过补偿处理， 得到预设深度， 即背钻深度后， 即可对要背钻的通孔进行背钻， 背 钻的孔径大于通孔的孔径， 以便磨掉通孔孔壁的镀铜， 由于背钻深度是通过钻该通孔时 得到的， 误差很小， 因此背钻的 Stub长度很小， 从而可以大大降低孔链路高速高频信号 传输过程中的损耗， 提高高频信号的传输完整性。
需要说明的是， 钻机可以从背钻面导电层开始钻通孔， 也可以从与背钻面导电层相 对的印刷电路板的另一面开始钻通孔，本发明实施例提供的钻孔装置同时适用于这两种 场景。
由此， 本发明实施例可以实现通过在钻通孔时获取第二导电层与第一导电层（必须 钻穿层） 之间的介质厚度来获取精确的背钻深度， 减小背钻的 Stub长度， 实现对 PCB板 的高精度背钻， 进而降低孔链路高速高频信号传输过程中的损耗， 提高传输信号的完整 性。 专业人员应该还可以进一步意识到， 结合本文中所公开的实施例描述的各示例的单 元及算法步骤， 能够以电子硬件、 计算机软件或者二者的结合来实现， 为了清楚地说明 硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步 骤。 这些功能究竟以硬件还是软件方式来执行， 取决于技术方案的特定应用和设计约束 条件。 专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能， 但是 这种实现不应认为超出本发明的范围。
结合本文中所公开的实施例描述的方法或算法的步骤可以用硬件、处理器执行的软 件模块， 或者二者的结合来实施。 软件模块可以置于随机存储器 （RAM) 、 内存、 只读 存储器（ROM)、电可编程 R0M、电可擦除可编程 R0M、寄存器、硬盘、可移动磁盘、 CD-ROM, 或技术领域内所公知的任意其它形式的存储介质中。
以上所述的具体实施方式， 对本发明的目的、 技术方案和有益效果进行了进一步详 细说明， 所应理解的是， 以上所述仅为本发明的具体实施方式而已， 并不用于限定本发 明的保护范围， 凡在本发明的精神和原则之内， 所做的任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。

Claims

权利要求
1、 一种印刷电路板的钻孔方法， 其特征在于， 所述方法包括：
钻机的钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 所述 钻机产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述第一导电位 置对应的第一 Z坐标信息；
钻穿所述第一导电层后， 继续进行钻孔运动， 当与所述印刷电路板的第二导电层接 触时， 所述钻机产生第二电信号， 并根据所述第二电信号确定第二导电位置， 得到所述 第二导电位置对应的第二 Z坐标信息；
继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔；
在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度为所述第二导电层与 所述第一导电层之间介质厚度加上补偿深度， 所述介质厚度通过计算所述第一 z坐标信 息与所述第二 Z坐标信息的差值的绝对值得到。
2、 根据权利要求 1所述的印刷电路板的钻孔方法， 其特征在于， 当所述第一导电层 为背钻面导电层， 所述第二导电层为信号层与所述背钻面导电层之间的导电层时， 所述 继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔包括： 所述钻头钻穿所述第二导 电层后， 继续钻孔运动， 直到将所述印刷电路板钻通， 即可得到所述通孔；
当所述第一导电层为信号层与所述背钻面导电层之间的导电层，所述第二导电层为 背钻面导电层时， 所述继续进行钻孔运动， 将印刷电路板钻通， 得到通孔包括所述钻头 钻穿包括： 所述钻头钻穿所述第二导电层后， 停止钻孔运动， 即可得到所述通孔。
3、 根据权利要求 1或 2所述的印刷电路板的钻孔方法， 其特征在于， 所述第一 Z坐标 信息、 所述第二 Z坐标信息标识所述钻头在垂直方向上的坐标值。
4、 根据权利要求 1-3任一项所述的印刷电路板的钻孔方法， 其特征在于， 所述当与 印刷电路板的第一导电层接触时， 所述钻机产生第一电信号包括： 当所述钻头与所述印 刷电路板的第一导电层接触时， 所述钻机通过内部的感应器检测到所述第一导电层、 所 述钻机的控制电路与所述钻头之间形成第一回路， 产生所述第一电信号。
5、 根据权利要求 1-4任一项所述的印刷电路板的钻孔方法， 其特征在于， 所述当与 所述印刷电路板的第二导电层接触时， 所述钻机产生第二电信号包括： 当所述钻头与所 述印刷电路板的第二导电层接触时， 所述钻机通过内部的感应器检测到第二导电层、 所 述钻机的控制电路域所述钻头之间形成第二回路， 产生第二电信号。
6、 一种印刷电路板的钻孔装置， 用于在印刷电路板上进行钻孔， 其特征在于， 所 述装置包括主机、 钻头：
所述主机包括一个控制器， 所述控制器包括控制电路以及感应器， 所述控制电路控 制所述钻头从初始位置进行钻孔运动， 当与印刷电路板的第一导电层接触时， 所述钻机 产生第一电信号， 并根据所述第一电信号确定第一导电位置， 得到所述第一导电位置对 应的第一 Z坐标信息； 所述控制电路控制所述钻头钻穿所述第一导电层后， 继续进行钻 孔运动， 当与所述印刷电路板的第二导电层接触时， 所述钻机产生第二电信号， 并根据 所述第二电信号确定第二导电位置， 得到所述第二导电位置对应的第二 Z坐标信息； 所 述控制电路控制所述钻头继续进行钻孔运动， 将所述印刷电路板钻通， 得到通孔； 所述主机在所述通孔位置按照预设深度进行背钻， 其中， 所述预设深度为所述第二 导电层与所述第一导电层之间介质厚度加上补偿深度，所述介质厚度通过计算所述第一
Z坐标信息与所述第二 Z坐标信息的差值的绝对值得到。
7、 根据权利要求 6所述的印刷电路板的钻孔装置， 其特征在于， 当所述第一导电层 为背钻面导电层， 所述第二导电层为信号层与所述背钻面导电层之间的导电层时， 所述 钻头具体用于： 所述钻头钻穿所述第二导电层后， 继续钻孔运动， 直到将所述印刷电路 板钻通， 即可得到所述通孔；
当所述第一导电层为信号层与所述背钻面导电层之间的导电层，所述第二导电层为 背钻面导电层时，所述钻头具体用于：所述钻头钻穿所述第二导电层后，停止钻孔运动， 即可得到所述通孔。
8、 根据权利要求 6或 7所述的印刷电路板的钻孔装置， 其特征在于， 所述第一 Z坐标 信息、 所述第二 Z坐标信息标识所述钻头在垂直方向上的坐标值。
9、 根据权利要求 6-8任一项所述的印刷电路板的钻孔装置， 其特征在于， 当所述钻 头与印刷电路板的第一导电层接触时， 所述钻机产生第二电信号的过程具体为： 当所述 钻头与所述印刷电路板的第一导电层接触时， 所述感应器检测到所述第一导电层、 所述 钻机的控制电路与所述钻头之间形成第一回路； 所述钻机根据所述第一回路产生所述第 一电信号。
10、 根据权利要求 6-8任一项所述的钻孔装置， 其特征在于， 所述当与所述印刷电 路板的第二导电层接触时， 所述钻机产生第二电信号的过程具体为： 当所述钻头与所述 印刷电路板的第二导电层接触时， 所述感应器检测到第二导电层、 所述钻机的控制电路 域所述钻头之间形成第二回路； 所述钻机根据所述第二回路产生第二电信号。
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