WO2022257204A1 - 一种电路板及背钻加工方法 - Google Patents
一种电路板及背钻加工方法 Download PDFInfo
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- WO2022257204A1 WO2022257204A1 PCT/CN2021/103814 CN2021103814W WO2022257204A1 WO 2022257204 A1 WO2022257204 A1 WO 2022257204A1 CN 2021103814 W CN2021103814 W CN 2021103814W WO 2022257204 A1 WO2022257204 A1 WO 2022257204A1
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- drilling
- layer
- drilled
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- 238000005553 drilling Methods 0.000 title claims abstract description 450
- 238000003672 processing method Methods 0.000 title claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 580
- 238000000034 method Methods 0.000 claims description 40
- 238000001514 detection method Methods 0.000 claims description 27
- 239000011229 interlayer Substances 0.000 claims description 15
- 238000001465 metallisation Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
Definitions
- the present application relates to the technical field of circuit boards, in particular to a circuit board and a back-drilling processing method.
- the speed of digital signal transmission is getting faster and higher, and the frequency is getting higher and higher, and it is more and more critical to ensure the integrity of the signal.
- a useless portion of hole copper that is not used for signal transmission in a metallized hole in a circuit board will increase the loss of signal transmission in the circuit board.
- the redundant copper plating of the useless hole copper part is equivalent to the antenna, which generates signal radiation and interferes with other surrounding signals, and will destroy the integrity of signal transmission in severe cases. Therefore, the back-drilling method is usually used to drill away the excess copper plating as much as possible, so as to reduce its impact on the signal transmission of the metallized orifice plate.
- a preset back-drilling depth is usually used in advance, and then the metallized hole is back-drilled according to the preset back-drilled depth, so as to remove excess copper plating in the metallized hole.
- the accuracy of back drilling to remove residual piles according to the preset back drilling depth will be insufficient, resulting in a large signal loss in the signal hole, which is difficult Meet the high-frequency and high-speed performance requirements of the product.
- the present application provides a circuit board and a back-drilling processing method to solve the problem of low precision of back-drilling for removing residual piles.
- a technical solution adopted by the present application is to provide a method for back-drilling a circuit board, including: obtaining a board to be back-drilled; wherein, the board to be back-drilled includes a target signal layer and at least two a conductive reference layer; the target signal layer is the signal layer corresponding to the current back-drilling task; a through hole is drilled at the set position of the board to be back-drilled, and two of the board to be back-drilled are obtained based on the through-hole.
- the actual measured spacing of the conductive reference layer in response to the first type of back-drilled hole to be back-drilled, based on the measured spacing, determine the target back-drilling depth; control the back-drilling bit to drill the target to the target signal layer The back-drilling depth of the back-drilling hole, and the back-drilling does not drill through the target signal layer; in response to the second type of back-drilling hole to be back-drilled, based on the measured distance, determine the target of the back-drilling end point relative to the machine table relative height: controlling the back-drilling bit to drill the target signal layer to the back-drilled hole at the target relative height, and the back-drilling does not drill through the target signal layer.
- the back-drilling method further includes: acquiring a preset back-drilling depth of the back-drilled hole on the board to be back-drilled; in response to the preset back-drilling depth being greater than or equal to a signal detection safety value, determining that the back-drilled hole is of the first type; in response to the preset back-drilled depth being less than a signal detection safety value, determining that the back-drilled hole is of the second type.
- the board to be back-drilled includes a first conductive reference layer, a second conductive reference layer, and a third conductive reference layer, wherein the first conductive reference layer is a back-drilled drill of the board to be back-drilled.
- the first surface conductive layer on the side, the second conductive reference layer is between the first surface conductive layer and the target signal layer, and the third conductive reference layer is the second surface of the back-drilling board Conductive layer;
- the step of drilling a through hole at the set position of the back-drilling board, and obtaining the measured spacing of the two conductive reference layers of the back-drilling board based on the through hole comprising:
- the set position of the board to be back-drilled is drilled through the second surface conductive layer to obtain the measured distance between the second surface conductive layer and the second conductive reference layer;
- the back-drilling hole to be back-drilled is of the second type, and based on the measured distance, determine the target relative height of the back-drilling end
- the target relative height of the machine table includes: in response to the second type of back-drilled hole to be back-drilled, based on the measured distance between the second surface conductive layer and the second conductive reference layer and by the The preset step-by-step depth control from the second conductive reference layer to the target signal layer determines the target relative height of the end point of back-drilling relative to the machine table.
- a backing plate is provided on one side of the second surface conductive layer of the board to be back-drilled; the back-drilled hole in response to the back-drilled hole is the second type, based on the second surface conductive layer and Determining the target relative height of the end point of the back-drilling relative to the machine based on the measured distance between the second conductive reference layers includes: based on the distance between the second surface conductive layer and the second conductive reference layer The measured distance, the preset step-by-step control depth from the second conductive reference layer to the target signal layer, and the height of the backing plate relative to the machine platform determine the target relative height of the back drilling end point relative to the machine platform.
- the end point of the back-drilling is determined based on the measured distance between the second surface conductive layer and the second conductive reference layer
- the target relative height relative to the machine platform includes: the sum of the height of the backing plate relative to the machine platform, the measured distance between the second surface conductive layer and the second conductive reference layer, and the compensation value , subtracting the preset step-by-step control depth from the second conductive reference layer to the target signal layer to obtain the target relative height of the back-drilling end point relative to the machine platform.
- the board to be back-drilled includes a first conductive reference layer and a second conductive reference layer, wherein the first conductive reference layer conducts electricity to the first surface on one side of the back-drilled board to be back-drilled.
- Layer, the second conductive reference layer is between the first surface conductive layer and the target signal layer;
- the through hole is drilled at the set position of the back-drilled board, and based on the through hole, the
- the step of measuring the distance between the two conductive reference layers of the board to be back-drilled includes: drilling a through hole at a set position of the board to be back-drilled, and obtaining the board to be back-drilled based on the through-hole
- the measured distance between the first surface conductive layer and the second conductive reference layer; the response to the back-drilled hole to be back-drilled is the first type, based on the measured distance, determine the target back-drilled depth; control the back-drilled
- the drill bit drills a back-drilling hole at the target back-drilling depth to the target
- the step of the target back-drilling depth includes: in response to the back-drilling hole to be back-drilled is the first type, based on the measured distance between the first surface conductive layer and the second conductive reference layer, by the second The preset step-by-step depth control from the conductive reference layer to the target signal layer determines the target back-drilling depth.
- the board to be back-drilled also includes a second surface conductive layer; said drilling a through hole at the set position of the board to be back-drilled, and obtaining two parts of the board to be back-drilled based on the through-hole.
- the step of measuring the pitch of the conductive reference layer comprising: drilling a through hole at a set position of the board to be back-drilled, and obtaining the first surface conductive layer of the board to be back-drilled based on the through hole The measured distance from the second conductive reference layer, and the measured distance from the first surface conductive layer to the second surface conductive layer; the back-drilled hole in response to the back-drilling is the first type, based on the
- the step of determining the target back-drilling depth of the measured distance between the first surface conductive layer of the board to be back-drilled and the second conductive reference layer includes: based on the first surface conductive layer and the second The actual measured spacing of the surface conductive layer and the theoretical thickness of the board to be back-drilled to obtain the thickness ratio value
- the back-drilling board further includes a third conductive reference layer and a second surface conductive layer; wherein, the third conductive reference layer is between the second surface conductive layer and the target signal layer;
- the step of drilling a through-hole at the set position of the board to be back-drilled, and obtaining the measured distance between the two conductive reference layers of the board to be back-drilled based on the through-hole includes: Drill a through hole at the set position of the back-drilling board, and based on the through hole, obtain the measured distance between the first surface conductive layer and the second conductive reference layer, the distance between the second conductive reference layer and the third conductive reference layer.
- the step of determining the target back-drilling depth of the measured distance from the second conductive reference layer and the preset step-by-step control depth from the second conductive reference layer to the target signal layer includes: responding to The back-drilling of the back-drilling is the first type, based on the measured distance and the theoretical distance between the second conductive reference layer and the third conductive reference layer, the inter-layer ratio value is obtained; from the second conductive reference layer to the The product of the preset step-by-step control depth of the target signal layer and the inter-layer ratio value, and the sum of the measured distance between the first surface conductive layer and the second conductive reference layer are used to determine the first target background Drilling depth; the step of controlling the back-drilling bit to drill the back-d
- the response to the back-drilling hole to be back-drilled is the first type, based on the measured distance between the first surface conductive layer and the second conductive reference layer, the second conductive reference layer
- the step of determining the target back-drilling depth to the preset step-by-step control depth of the target signal layer further includes: the preset step-by-step control depth from the third conductive reference layer to the target signal layer and the set The product of the inter-layer ratio value and the sum of the measured distance between the second surface conductive layer and the third conductive reference layer determine the second target back-drilling depth; the control back-drilling bit to the target signal layer
- the step of drilling the back-drilling hole at the target back-drilling depth, and the back-drilling does not drill through the target signal layer includes: the control back-drilling drill bit is drilled from the second surface conductive layer to the target signal layer The second target back-drilling depth is back-drilled, and the back-drill
- the measured distance between the second conductive reference layer and the third conductive reference layer is greater than or equal to a signal detection safety value.
- the board to be back-drilled includes a plurality of holes to be back-drilled; the acquired board to be back-drilled; wherein, the board to be back-drilled includes a target signal layer and at least two conductive reference layers;
- the target signal layer is the signal layer corresponding to the current back-drilling task, including: obtaining the board to be back-drilled; wherein, the board to be back-drilled includes the target signal layer corresponding to each of the holes to be back-drilled and at least two The conductive reference layer; the target signal layer is the signal layer corresponding to the current backdrilling task.
- the drilling a through-hole at the set position of the board to be back-drilled, and obtaining the measured distance between the two conductive reference layers of the board to be back-drilled based on the through-hole includes: Drill through holes at the set positions corresponding to each of the back-drilled holes on the board to be back-drilled, and obtain the measured distance between the two conductive reference layers of the board to be back-drilled based on the through holes.
- the method includes: performing a metallization operation on the through hole to obtain a metallized hole.
- controlling the back-drilling bit to drill the back-drilling hole of the target back-drilling depth to the target signal layer, and the back-drilling does not drill through the target signal layer includes: at the position of the metallized hole , controlling the back-drilling bit to drill a back-drill hole at the target back-drilling depth to the target signal layer, and the back-drilling does not drill through the target signal layer.
- controlling the back-drilling bit to drill the target signal layer to the back-drilled hole at the target relative height, and the back-drilling does not drill through the target signal layer, including: at the position of the metallized hole , controlling the back-drilling bit to drill the target signal layer to a back-drill hole at the target relative height, and the back-drilling does not drill through the target signal layer.
- the target relative height of the back-drilling end point relative to the machine table is the ordinate in the coordinate system of the back-drilling end point relative to the machine table.
- the signal detection safety value is greater than or equal to 0.5 mm.
- another technical solution adopted by the present application is to provide a circuit board manufactured by any one of the above-mentioned back-drilling processing methods.
- the present application provides a back-drilling processing method of a circuit board, the processing method obtains the board to be back-drilled; wherein, the board to be back-drilled includes the target signal layer and At least two conductive reference layers; the target signal layer is the signal layer corresponding to the current back-drilling task; drill through holes at the set position of the board to be back-drilled, and obtain the actual measurement of the two conductive reference layers of the board to be back-drilled based on the through holes Spacing; in response to the back-drilling hole to be back-drilled is the first type, based on the measured distance, determine the target back-drilling depth; control the back-drilling bit to drill the back-drilling hole of the target back-drilling depth to the target signal layer, and the back-drilling does not drill through The target signal layer; in response to the second type of back-drilling hole to be back-drilled, based
- the target back-drilling is improved.
- the accuracy of the depth or relative height of the target, back drilling based on the target back drilling depth or target relative height reduces the drilling error caused by uneven board thickness at different positions of the circuit board, improves the back drilling accuracy of the circuit board,
- the corresponding back-drilling methods are carried out for different types of back-drilled holes, which improves the back-drilling accuracy of different types of holes to be drilled, and realizes high-precision control of the length of the back-drilled residual pile Stub.
- Fig. 1 is the schematic flow chart of the first embodiment of the back drilling processing method of the circuit board provided by the present application
- Fig. 2 is the schematic flow chart of the second embodiment of the back-drilling processing method of the circuit board provided by the present application;
- FIG. 3 is a schematic structural view of the first embodiment of the circuit board provided by the present application.
- FIG. 4 is a schematic flow diagram of a second embodiment of the method for back-drilling a circuit board provided by the present application.
- Fig. 5 is a schematic structural diagram of the second embodiment of the circuit board provided by the present application.
- FIG. 6 is a schematic flow chart of a third embodiment of the method for back-drilling a circuit board provided by the present application.
- FIG. 7 is a schematic structural diagram of a third embodiment of a circuit board provided by the present application.
- Embodiments of the present application provide a battery protection board, a processing method, and an electronic device, so as to solve the heat dissipation requirement of the battery protection board, thereby improving the service life and reliability of the battery protection board.
- first”, “second”, and “third” in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as “first”, “second”, and “third” may explicitly or implicitly include at least one of these features.
- “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back%) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly.
- the circuit boards in this application include printed circuit boards, PCB boards, FPC circuit boards, etc., and may be multilayer boards.
- the circuit board is a multi-layer board, since the thickness of each layer of the multi-layer board may be uneven, and in the process of making the multi-layer board, the design and processing of the inner layer graphics and the lamination of the multi-layer board will all be As a result, the thickness of the circuit board is uneven, and the distance between the surface conductive layer used for back-drilling and the target signal layer corresponding to the current back-drilling task is also uneven.
- a back-drilling operation is routinely performed at a preset depth, which may make the stub length Stub of the back-drilled hole too long, or too short, and even the target signal layer may be drilled through, resulting in back-drilling accuracy. Poor, the signal hole has a large signal loss and may even fail to function as a signal hole.
- the present application provides a circuit board and back-drilling processing method.
- Fig. 1 is a schematic flow chart of the first embodiment of the back-drilling processing method of the circuit board provided by the present application, specifically including:
- S101 Obtain the board to be back-drilled; wherein, the board to be back-drilled includes a target signal layer and at least two conductive reference layers; the target signal layer is a signal layer corresponding to the current back-drilling task.
- the conductive reference layer in this embodiment may be additionally provided, or an existing metal conductive layer in the circuit board may be used, such as a surface conductive layer of the circuit board, a ground layer in the circuit board, a power layer or other signal layers.
- the circuit board may have multiple signal layers, and the target signal layer is the signal layer corresponding to the current back-drilling task.
- at least two conductive reference layers are also corresponding to the current back-drilling task, not to the circuit board to be back-drilled.
- the conductive reference layer in this step is not uniquely fixed, and the conductive reference layer in this step is relative to the back-drilled holes in the current back-drilling task.
- the at least two conductive reference layers may be different conductive layers, and of course may also be the same conductive layer.
- back-drilled holes can be different types of back-drilled holes, such as single-sided back-drilled holes or double-sided back-drilled holes. Or it can be divided into shallow back drilling or deep back drilling based on the preset back drilling depth.
- S102 Drill a through hole at a set position of the board to be back-drilled, and obtain a measured distance between two conductive reference layers of the board to be back-drilled based on the through hole.
- a through hole is drilled at a set position corresponding to the back-drilled hole on the board to be back-drilled, and the measured distance between two conductive reference layers of the board to be back-drilled is obtained based on the through-hole.
- the measured distance may be the measured distance obtained when the through-hole is drilled, or the measured distance obtained based on relevant signals or data obtained during the through-hole drilled.
- a board to be back-drilled may include a plurality of back-drilled holes, and it is necessary to drill through holes at the set positions of each to-be-back-drilled hole, and obtain two conductive The measured spacing of the reference layer.
- the at least two conductive reference layers corresponding to each to-be-back-drilled hole may be the same or different. Due to the different positions of the holes to be back-drilled on the board to be back-drilled and the thickness of the plate due to operations such as conductive patterns during processing, even if at least two conductive reference layers corresponding to different back-drilled holes are the same, the obtained two conductive reference layers are the same.
- the measured spacing of the reference layer may still vary. For each hole to be back-drilled, the measured distance between two conductive reference layers can be obtained, which can reduce or even eliminate the influence of board thickness and thickness.
- S103 In response to the fact that the back-drilling hole to be back-drilled is the first type, determine the target back-drilling depth based on the measured distance; control the back-drilling bit to drill the back-drilling hole at the target back-drilling depth to the target signal layer, and the back-drilling does not drill through The target signal layer; in response to the second type of back-drilling hole to be back-drilled, based on the measured distance, determine the target relative height of the back-drilling end point relative to the machine table; control the back-drilling bit to drill to the target signal layer to the back of the target relative height Drilling, and back drilling does not drill through the target signal layer.
- the target back-drilling depth or target relative height for different types of back-drilled holes based on the measured distance, improve the accuracy of the target back-drilling depth or target relative height, back-drilling based on the target back-drilling depth or target relative height, reducing the drilling error caused by uneven board thickness at different positions of the circuit board, and improving the accuracy of the circuit board
- the accuracy of the back drilling is high, and the corresponding back drilling method is carried out for different types of holes to be back drilled, which improves the back drilling accuracy of different types of holes to be drilled, and realizes the high precision control of the length of the back drilled stub pile.
- determining whether the back-drilled hole to be back-drilled is the first type or the second type can be determined according to the preset back-drilled depth of the back-drilled hole, or can be determined according to the target signal layer and the surface of the circuit board to be back-drilled. to determine the distance.
- the theoretical distance between the target signal layer and the surface of the side to be back-drilled is known, and can be calculated according to the thickness of each sub-board and the dielectric layer in the board to be back-drilled.
- the preset back-drilling depth needs to be smaller than the theoretical distance between the target signal layer and the surface on the side to be back-drilled, and the difference between the two corresponds to the theoretical back-drilling stub length Stub.
- the back-drilling method further includes acquiring a preset back-drilling depth of the back-drilled hole on the board to be back-drilled. In response to the preset back-drilling depth being greater than or equal to the signal detection safety value, it is determined that the back-drilling is the first type. In response to the preset backdrilling depth being less than the signal detection safety value, it is determined that the backdrilled hole is of the second type.
- the signal detection safety value is related to the drilling equipment.
- the drilling equipment can only obtain the signal corresponding to the layer that the drill bit or the drill needle touches first, and the signal of the layer that is contacted later.
- the signal is prone to abnormality, or is affected or interfered by the signal of the previous layer, which makes it impossible to obtain the measured distance between the two layers.
- the signal detection safety value is greater than or equal to 0.5 mm.
- the safe value of signal detection can be 0.8mm, 1.0mm, 1.2mm, 1.4mm and so on.
- the back-drilling is the first type, which may also be referred to as a deep back-drilling.
- the back-drilled hole is of the second type, which may be referred to as a shallow back-drilled hole.
- the back-drilling processing method can refer to Fig. 2 and Fig. 3 specifically, and Fig. 2 is the back-drilling processing of the circuit board provided by the present application A schematic flowchart of the second embodiment of the method, FIG. 3 is a schematic structural diagram of the first embodiment of the circuit board provided by the present application.
- the board to be back-drilled includes the target signal layer 31 and the first conductive reference layer, the second conductive reference layer, and the third conductive reference layer;
- the target signal layer 31 is the target signal layer corresponding to the current back-drilling task.
- the first conductive reference layer is the first surface conductive layer 32 on the back drill side of the back-drilled board to be drilled
- the second conductive reference layer 33 is between the first surface conductive layer 32 and the target signal layer 31, and the third
- the conductive reference layer is the second surface conductive layer 34 of the board to be back-drilled.
- the back-drilling end point is determined.
- the back-drilling board can also be rested on the backing board for drilling operations.
- the backing plate is disposed on the side of the second surface conductive layer 34 of the back drill board.
- the height of the backing plate relative to the machine table can be obtained by the drilling equipment. Based on the measured distance Z1 between the second surface conductive layer 34 and the second conductive reference layer 33, the preset step-by-step control depth h1 from the second conductive reference layer 33 to the target signal layer 31, and the relative machine height of the backing plate, determine The relative height of the end point of back drilling relative to the target of the machine table.
- the height of the pad relative to the machine the sum of the measured distance Z1 between the second surface conductive layer 34 and the second conductive reference layer 33 and the compensation value, minus the distance from the second conductive reference layer 33 to the target signal layer 31
- the preset step-by-step depth control h1 obtains the target relative height of the back drilling end point relative to the machine table.
- the compensation value includes the thickness of electroplated copper, the relative height difference of the through-hole and the back-drilling drill point, etc.
- the relative height relative to the machine platform may be the ordinate relative to the machine platform coordinate system.
- S204 Control the back-drilling bit to drill from the first surface conductive layer 32 side of the board to be back-drilled, perform back-drilling to the target signal layer 31, drill to the target relative height, and obtain the back-drilled hole 36, and the back-drilling does not drill through The target signal layer.
- a hole metallization operation is also performed on the through hole 35 to obtain a metallized through hole.
- control the back-drilling bit to drill from the first surface conductive layer 32 side of the board to be back-drilled, perform back-drilling, and drill to the target relative height, which is the end point of back-drilling .
- the second conductive reference layer 33 is disposed between the first surface conductive layer 32 on the back-drilling side and the target signal layer 31, and the second conductive reference layer 33 is connected to the first surface conductive layer 32 on the back-drilling side.
- the distance between the surface conductive layers 32 and the distance between the second conductive reference layer 33 and the target signal layer 31 can be set according to specific conditions.
- the second conductive reference layer 33 can be arranged at a position closer to the target signal layer 31, that is, the distance between the second conductive reference layer 33 and the first surface conductive layer 32 used for back-drilling side greater than the distance between the first surface conductive layer 32 and the target signal layer 31 .
- the through hole since the through hole is actually drilled, the measured distance Z1 between the second surface conductive layer 34 and the second conductive reference layer 33 is obtained through the through hole, which is more accurate.
- the back-drilled hole is of the second type, that is, the preset back-drilled depth is smaller than a safe value for signal detection.
- the sum of the preset back-drilling depth and the preset step-by-step control depth h1 from the second conductive reference layer 33 to the target signal layer 31 is the first surface conductive layer 32 and the target signal layer 31 used for the back-drilling side. spacing between.
- the preset step-by-step control depth h1 is generally very small, so the distance between the first surface conductive layer 32 and the second conductive reference layer 33 on the back-drilling side is also smaller than the safe value for signal detection.
- the through hole is drilled from one side of the second surface conductive layer 34 to obtain the measured distance between the second surface conductive layer 34 and the second conductive reference layer 33, and then based on the back-drilling end point relative to the machine Controlled depth back drilling based on the target relative height of the platform to achieve more accurate back drilling control depth, making the back drilling stub length stub smaller without drilling through the target signal layer.
- holes to be back-drilled in this embodiment there are not only holes to be back-drilled in this embodiment, but also holes to be back-drilled in opposite directions to the back-drilled holes in this embodiment.
- the holes to be back-drilled in the opposite direction can also follow the relevant steps of the back-drilling processing method in this embodiment, by drilling through-holes in the opposite direction from the back-drilling to the drilling direction, to obtain the surface conductive layer and the The actual measured distance between the middle conductive reference layer, wherein the middle conductive reference layer is between the surface conductive layer on one side of the back-in-drill and the target signal layer.
- the target relative height of the end point of the back drilling relative to the machine table is obtained, and the depth-controlled back-drilling is performed according to the target relative height, which also achieves more accurate depth-controlled back-drilling.
- FIG. 4 is the back drilling of the circuit board provided by the present application.
- the board to be back-drilled includes a target signal layer 51, a first conductive reference layer, and a second conductive reference layer 53;
- the target signal layer 51 is a signal layer corresponding to the current back-drilling task, and the first The conductive reference layer is the first surface conductive layer 52 on the back drilling side of the back-drilled board, and the second conductive reference layer 53 is between the first surface conductive layer 52 and the target signal layer 51 .
- S402 Drill a through hole at a set position of the board to be back-drilled, and obtain a measured distance Z2 between the first surface conductive layer 52 and the second conductive reference layer 53 of the board to be back-drilled based on the through hole.
- the board to be back-drilled further includes a second surface conductive layer 54, and in S402, the measured distance between the first surface conductive layer 52 and the second surface conductive layer 54 is obtained based on the through hole. And based on the measured distance between the first surface conductive layer 52 and the second surface conductive layer 54 and the theoretical thickness of the board to be back-drilled, the board thickness ratio value x is obtained. Specifically, the board thickness ratio x is the ratio of the measured distance between the first surface conductive layer 52 and the second surface conductive layer 54 and the theoretical board thickness of the board to be back-drilled.
- the preset step-by-step control depth h2 from the second conductive reference layer 53 to the target signal layer 51, and The plate thickness ratio value x determines the target back drilling depth H.
- the target back-drilling depth H is the preset step-by-step control depth h2 from the second conductive reference layer 53 to the target signal layer 51 and the board thickness ratio value x, and the first surface conductive layer 52 and the second conductive reference layer 53 The sum of the measured distance Z2.
- the error between the medium thickness and the plate thickness of the preset step-by-step depth control h2 is reduced or even eliminated, so that the target back drilling depth H is more accurate and a more accurate depth is achieved Control deep back drill.
- S404 Control the back-drilling bit to drill a back-drilling hole at a target back-drilling depth from the first surface conductive layer 52 to the target signal layer 51, and the back-drilling does not drill through the target signal layer.
- the back-drilling is of the first type, that is, the preset back-drilling depth is greater than or equal to the signal detection safety value.
- the theoretical distance between the first surface conductive layer 52 and the second conductive reference layer 53 needs to be greater than the signal detection safety value, otherwise, according to the back-drilling method of the previous embodiment, the back-drilled hole can also be classified as the second type.
- the measured distance Z2 between the first surface conductive layer 52 and the second conductive reference layer 53 is obtained based on the through hole, together with the preset step-by-step control depth h2 from the second conductive reference layer 53 to the target signal layer 51 , determine the target back-drilling depth H, improve the accuracy and precision of the target back-drilling depth H, reduce the drilling error caused by plate thickness, improve the accuracy of back-drilling, and achieve the back-drilling accuracy of this back-drilling task , so that the length of the back-drilling stump can be better controlled within an appropriate range without drilling through the target signal layer.
- the target back drilling depth H is more accurate and more accurate depth control depth backing is realized. drill.
- FIG. 6 is a schematic flow chart of a third embodiment of a circuit board back-drilling method provided by the present application
- FIG. 7 is a schematic structural diagram of a third embodiment of a circuit board provided by the present application.
- the back drilling processing method of the present embodiment comprises:
- the board to be back-drilled includes the target signal layer 71, the first conductive reference layer 72, the second conductive reference layer 73, the second surface conductive layer 74, and the third conductive reference layer 75;
- the target The signal layer 71 is the signal layer corresponding to the current back-drilling task
- the first conductive reference layer 72 is the first surface conductive layer 72 on the side of the back-drilled board to be back-drilled
- the second conductive reference layer 73 is on the first surface conductive layer 72 and the target signal layer 71
- the third conductive reference layer 75 is between the second surface conductive layer 74 and the target signal layer 71 .
- S602 Drill a through hole at the set position of the board to be back-drilled, and based on the through hole, obtain the measured distance Z3 between the first surface conductive layer 72 and the second conductive reference layer 73, the second conductive reference layer 73 and the third conductive reference layer The measured distance Z4 of the layer 75 , and the measured distance Z5 of the second surface conductive layer 74 and the third conductive reference layer 75 .
- the ratio of the measured distance Z4 between the second conductive reference layer 73 and the third conductive reference layer 75 and the theoretical distance between the second conductive reference layer 73 and the third conductive reference layer 75 is used to obtain the interlayer ratio value y.
- the theoretical distance between the second conductive reference layer 73 and the third conductive reference layer 75 can be determined according to the theoretical plate thickness and the thickness of the dielectric layer.
- S604 The sum of the product of the preset step-by-step control depth h3 from the second conductive reference layer 73 to the target signal layer 71 and the interlayer ratio value, and the measured distance Z3 between the first surface conductive layer 72 and the second conductive reference layer 73 , to determine the first target backdrilling depth H1.
- the product of the preset step-by-step control depth h3 from the second conductive reference layer 73 to the target signal layer 71 and the interlayer ratio value, and the actual measured distance between the first surface conductive layer 72 and the second conductive reference layer 73 The sum of Z3 and the compensation value determines the first target backdrilling depth H1.
- the compensation value may include the thickness of electroplated copper, the relative height difference of the through hole and the back drilling drill point, and the like.
- S605 Control the back-drilling bit to drill a back-drilling hole with a first target back-drilling depth H1 from the first surface conductive layer 72 to the target signal layer 71, and the back-drilling does not drill through the target signal layer.
- the back-drilling method of this embodiment further includes: the product of the preset step-by-step control depth h4 from the third conductive reference layer 75 to the target signal layer 71 and the interlayer ratio value y, and the second surface conductive layer 74
- the sum of the measured distance Z5 and the third conductive reference layer 75 determines the second target backdrilling depth H2.
- the back-drilling bit is controlled to drill a back-drilling hole of a second target back-drilling depth H2 from the second surface conductive layer 74 to the target signal layer 71 , and the back-drilling does not drill through the target signal layer.
- the inter-layer ratio value y here is the inter-layer ratio value y acquired in S603.
- Double-sided back-drilling is obtained by back-drilling from the first surface conductive layer 72 and the second surface conductive layer 74 to the target signal layer 71 respectively.
- the back-drilled holes on both sides are of the first type, that is, the preset back-drilled depth of the back-drilled holes on both sides is greater than or equal to the signal detection safety value, and the first surface conductive layer 72 and the second conductive reference layer 73 are theoretically The spacing needs to be larger than the signal detection safety value, and the theoretical distance between the second surface conductive layer 74 and the third conductive reference layer 75 needs to be larger than the signal detection safety value. If the back-drilling on any side is not satisfactory, the back-drilling on the corresponding side will be back-drilled according to the second type of related back-drilling method.
- the second surface conductive layer 72 and the target signal layer 71 of the board to be back-drilled are respectively provided with the second surface conductive Layer 74 and the third conductive reference layer 75, by drilling through holes, the measured distance Z3 between the first surface conductive layer 72 and the second conductive reference layer 73, the second conductive reference layer 73 and the third conductive reference layer are obtained based on the through holes.
- the inter-layer ratio value y and obtain the first target back-drilling depth H1 and the second target back-drilling depth H2 more accurately based on the above data respectively.
- start back-drilling from the first surface conductive layer 72 and the second surface conductive layer 74 to the target signal layer 71 respectively respectively carry out controlled depth back-drilling according to the first target back-drilling depth H1 and the second target back-drilling depth H2, and obtain double Drill holes on the front and back.
- the actual measured spacing Z3 and the measured spacing Z5 obtained through actual measurement, and based on the interlayer ratio value y reduce or even eliminate the thickness and plate thickness of the preset step-by-step control depth h3 and preset step-by-step control depth h4
- the error makes the target back-drilling depth H more accurate and achieves more accurate depth-controlled back-drilling.
- the distance between the target signal layer and the conductive reference layer of the inner layer can be called the back-drilling safety distance W, and its value needs to be greater than or equal to the sum of the back-drilling stub length Stub and the voltage safety design value, such as Greater than or equal to 0.45mm.
- the voltage design safety value also known as the voltage safety distance, is related to the voltage, temperature, humidity and other conditions when the circuit board product is used.
- the setting of the voltage safety design value is to prevent the distance between the target signal layer and the conductive reference layer of the inner layer from being too short under specific voltage, temperature, and humidity conditions of the circuit board product, or the back-drilled stump of the target signal layer If the distance from the conductive reference layer of the inner layer is too short, a voltage breakdown is likely to occur, and electrons migrate between the target signal layer and the conductive reference layer of the inner layer to form a channel and cause a short circuit.
- the voltage design safety value can be 0.1mm, 0.3mm, 0.5mm, etc., which can be set according to the actual circuit board product, and is not limited here.
- the distance between the target signal layer and the inner conductive reference layers on both sides is the safe back-drilling distance W2 and the safe back-drilling distance W3 respectively, and both need to meet the back-drilling safety distance.
- the distance between the conductive reference layers of the two inner layers needs to be greater than or equal to the signal detection safety value K, or it can be That is to say, the double-sided back drilling needs to satisfy the back drilling safety distance W2 ⁇ K/2 and the back drilling safety distance W3 ⁇ K/2, where K is the signal detection safety value, and the sum of the back drilling safety distance W2 and the back drilling safety distance W3 is about
- K is the signal detection safety value
- the sum of the back drilling safety distance W2 and the back drilling safety distance W3 is about The spacing between the conductive reference planes of the two inner layers.
- the distance between the target signal layer and the conductive reference layer of the inner layer and the safety distance W satisfy the limited conditions, and the smaller the value, the more the control accuracy of the back-drilling can be increased.
- the corresponding back-drilling operation can be performed according to the corresponding back-drilled processing method, so that according to each to-be-back-drilled hole and different types After back drilling, calculate the control depth or relative height to realize precise back drilling.
- the present application also provides a circuit board, which is manufactured by the back-drilling method provided in the present application.
- the back-drilling processing method provided by the present application the measured distance between the two conductive reference layers corresponding to the back-drilled hole is obtained when drilling the through-hole, and the target back-drilled depth or The relative height of the target improves the accuracy of the target back-drilling depth or the target relative height.
- Back-drilling based on the target back-drilling depth or the target relative height reduces the drilling error caused by uneven board thickness at different positions on the circuit board.
- the back-drilling accuracy of the circuit board is improved, and the corresponding back-drilling methods are carried out for different types of back-drilled holes, which improves the back-drilling accuracy of different types of holes to be drilled, and realizes high-precision control of the length of the back-drilled stub stub, and at the same time obtains Circuit board including high precision backdrilled stub length stub. .
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Abstract
一种电路板的背钻加工方法，该加工方法通过获取到待背钻板；其中，待背钻板包括目标信号层以及至少两个导电参考层；目标信号层为对应当前背钻任务的信号层；在待背钻板的设定位置钻通孔，并基于通孔获取待背钻板的两个导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于实测间距，确定目标背钻深度；控制背钻钻头向目标信号层钻目标背钻深度的背钻孔，且背钻不钻穿目标信号层；响应于待背钻的背钻孔为第二类型，基于实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向目标信号层钻至目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。通过在钻通孔时获取到对应待背钻孔的两个导电参考层的实测间距，基于实测间距对不同类型的待背钻孔的确定目标背钻深度或者目标相对高度，提高了目标背钻深度或目标相对高度的准确度，基于目标背钻深度或目标相对高度进行背钻，减小了因电路板不同位置处板厚不均匀导致的钻孔误差，提高了电路板的背钻精度。
Description
本申请涉及电路板技术领域，特别涉及一种电路板及背钻加工方法。
随着信息化产业的不断推动，数字信号传输的速度越来越快，频率越来越高，保证信号的完整性也越来越关键。电路板中的金属化孔中一段不用于信号传输的、无用的孔铜部分会增加电路板中信号传输的损耗。且当电路信号的频率增加到一定高度后，无用的孔铜部分多余的镀铜就相当于天线一样，产生信号辐射对周围的其他信号造成干扰，严重时将破坏信号传输的完整性。因此通常使用背钻的加工方式尽可能将多余的镀铜用背钻的方式钻掉，从而减轻其对金属化孔板信号传输的影响。
而目前通常采用的是预先设置一个预设背钻深度，然后根据预设背钻深度对金属化孔进行背钻加工，以将金属化孔中多于的镀铜去除。但实际生产中由于板厚介厚不均匀、内层图形设计等多种因素，会导致根据预设背钻深度进行背钻去残桩的背钻精度不足，导致信号孔的信号损失较大，难以满足产品高频、高速的性能需求。
因此，如何提高背钻精度是电路板加工的一大难题。
【发明内容】
本申请提供一种电路板及背钻加工方法，以解决背钻去残桩的背钻精度不高的问题。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种电路板的背钻加工方法，包括：获取到待背钻板；其中，所述待背钻板包括目标信号层以及至少两个导电参考层；所述目标信号层为对应当前背钻任务的信号层；在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于所述实测间距，确定目标背钻深度；控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层；响应于待背钻的背钻孔为第二类型，基于所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述背钻加工方法还包括：获取到所述待背钻板上所述背钻孔的预设背钻深度；响应于所述预设背钻深度大于等于信号探测安全值，确定所述背钻孔为第一类型；响应于所述预设背钻深度小于信号探测安全值，确定所述背钻孔为第二类型。
可选地，所述待背钻板包括第一导电参层、第二导电参考层和第三导电参考层，其中，所述第一导电参层为所述待背钻板背钻入钻一侧的第一表面导电层，所述第二导电参考层于所述第一表面导电层与所述目标信号层之间，所述第三导电参考层为所述待背钻板的第二表面导电层；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置，由所述第二表面导电层进行入钻钻通孔，获取所述第二表面导电层与所述第二导电参考层之间的所述实测间距；所述响应于待背钻的背钻孔为第二类型，基于所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头由所述待背钻板的所述第一表面导电层一侧入钻，向所述目标信号层进行背钻，钻至所述目标相对高度，得到所述背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定背钻终点相对于机台的目标相对高度，包括：响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距以及由所述第二导电参考层向所述目标信号层的预设分阶控深，确定背钻终点相对于机台的目标相对高度。
可选地，所述待背钻板的所述第二表面导电层一侧设有垫板；所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定背钻终点相对于机台的目标相对高度，包括：基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深、所述垫板相对机台高度，确定背钻终点相对于机台的目标相对高度。
可选地，所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定所述背钻终点相对于机台的所述目标相对高度，包括：由所述垫板相对机台高度、所述第二表面导电层与所述第二导电参考层之间的所述实测间距与补偿值之和，减去由所述第二导 电参考层向目标信号层的所述预设分阶控深，得到所述背钻终点相对于所述机台的所述目标相对高度。
可选地，所述待背钻板包括第一导电参层、第二导电参考层，其中，所述第一导电参层为所述待背钻板背钻入钻一侧的第一表面导电层，所述第二导电参考层于所述第一表面导电层与所述目标信号层之间；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的所述第一表面导电层与所述第二导电参考层的实测间距；所述响应于待背钻的背钻孔为第一类型，基于所述实测间距，确定目标背钻深度；控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度；控制所述背钻钻头由所述第一表面导电层，向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度。
可选地，所述待背钻板还包括第二表面导电层；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的所述第一表面导电层与所述第二导电参考层的实测间距，以及所述第一表面导电层与所述第二表面导电层的实测间距；所述响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度的步骤，包括：基于所述第一表面导电层与所述第二表面导电层的实测间距与所述待背钻板的理论板厚，获取板厚比例值；响应于待背钻的背钻孔为第一类型，由所述第二导电参考层向所述目标信号层的预设分阶控深与板厚比例值的乘积，与所述第一表面导电层与所述第二导电参考层的所述实测间距之和，确定所述目标背钻深度。
可选地，所述待背钻板还包括第三导电参考层和第二表面导电层；其中，所述第三导电参考层于所述第二表面导电层与所述目标信号层之间；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述 导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔，获取所述第一表面导电层与所述第二导电参考层的实测间距、所述第二导电参考层与所述第三导电参考层的实测间距，以及所述第二表面导电层与所述第三导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述第二导电参考层与所述第三导电参考层的实测间距与理论间距，获取层间比例值；由所述第二导电参考层向所述目标信号层的预设分阶控深与所述层间比例值的乘积，与所述第一表面导电层与所述第二导电参考层的所述实测间距之和，确定第一目标背钻深度；所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：所述控制背钻钻头由所述第一表面导电层向所述目标信号层钻所述第一目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度的步骤，还包括：由所述第三导电参考层向所述目标信号层的预设分阶控深与所述层间比例值的乘积，与所述第二表面导电层与所述第三导电参考层的实测间距之和，确定第二目标背钻深度；所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：所述控制背钻钻头由所述第二表面导电层向所述目标信号层钻所述第二目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述第二导电参考层与所述第三导电参考层的所述实测间距大于等于信号探测安全值。
可选地，所述待背钻板包括多个所述待背钻孔；所述获取到待背钻板；其中，所述待背钻板包括目标信号层以及至少两个导电参考层；所述目标信号层为对应当前背钻任务的信号层，包括：获取到待背钻板；其中，所述待背钻板包括每个所述待背钻孔对应的所述目标信号层以及至少两个所述导电参考层；所述目标信号层为对应当前背钻任务的信号层。
可选地，所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距，包括：在所述待背钻板上每个所述待背钻孔对应的所述设定位置钻通孔，并基于所述通孔获取所述待背钻板 的两个所述导电参考层的实测间距。
可选地，所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤之后，还包括：对所述通孔进行金属化操作得到金属化孔。
可选地，所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层，包括：在所述金属化孔的位置处，控制所述背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层，包括：在所述金属化孔的位置处，控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。
可选地，所述背钻终点相对于机台的目标相对高度为所述背钻终点相对于所述机台的坐标系中的纵坐标。
可选地，所述信号探测安全值大于等于0.5毫米。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种电路板，通过上述任一项所述的背钻加工方法制造而成。
本申请的有益效果是：区别于现有技术的情况，本申请提供一种电路板的背钻加工方法，该加工方法通过获取到待背钻板；其中，待背钻板包括目标信号层以及至少两个导电参考层；目标信号层为对应当前背钻任务的信号层；在待背钻板的设定位置钻通孔，并基于通孔获取待背钻板的两个导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于实测间距，确定目标背钻深度；控制背钻钻头向目标信号层钻目标背钻深度的背钻孔，且背钻不钻穿目标信号层；响应于待背钻的背钻孔为第二类型，基于实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向目标信号层钻至目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。通过在钻通孔时获取到对应待背钻孔的两个导电参考层的实测间距，基于实测间距对不同类型的待背钻孔的确定目标背钻深度或者目标相对高度，提高了目标背钻深度或目标相对高度的准确度，基于目标背钻深度或目标相对高度进行背钻，减小了因电路板不同位置处板厚不均匀导致的钻孔误差，提高了电路板的背钻精度，且对不同类型的待背钻孔进行对应背钻方式，提高了不同类型待钻孔的背钻精度，实现背钻残桩长度Stub的高精度控制。
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1是本申请提供的电路板的背钻加工方法的第一实施例的流程示意图；
图2是本申请提供的电路板的背钻加工方法的第二实施例的流程示意图；
图3是本申请提供的电路板第一实施例的结构示意图；
图4是本申请提供的电路板的背钻加工方法的第二实施例的流程示意图；
图5是本申请提供的电路板第二实施例的结构示意图；
图6是本申请提供的电路板的背钻加工方法的第三实施例的流程示意图；
图7是本申请提供的电路板第三实施例的结构示意图。
本申请实施例提供一种电池保护板、加工方法及电子设备，以解决电池保护板散热需求，从而提升电池保护板的寿命及可靠性。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可 以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，在不冲突的情况下，本文所描述的实施例可以与其它实施例相结合。下面通过具体实施例，分别进行详细的说明。
本申请中的电路板包括印刷线路板、PCB板、FPC线路板等，可以为多层板。在电路板为多层板时，由于多层板中每一层板的厚度可能存在不均匀的情况，且在多层板制作过程中，内层图形设计与加工以及多层板压合等都会导致电路板的厚度不均匀，也会导致用于背钻一侧的表面导电层与对应当前背钻任务的目标信号层与之间的距离不均匀。在这种情况下，常规按照一个预设深度进行一次背钻操作，可能会使得背钻孔的背钻残桩长度Stub过长、或者过短甚至可能目标信号层被钻穿，导致背钻精度不佳，信号孔的信号损失大甚至可能无法正常作为信号孔。基于此，本申请提供了一种电路板及背钻加工方法，针对电路板上不同的背钻孔，以及其背钻深度等，确定相应的目标背钻深度或目标相对高度，并基于目标背钻深度或目标相对高度进行背钻，以提高背钻去残桩的背钻精度。
参阅图1，图1是本申请提供的电路板的背钻加工方法的第一实施例的流程示意图，具体包括：
S101：获取到待背钻板；其中，待背钻板包括目标信号层以及至少两个导电参考层；目标信号层为对应当前背钻任务的信号层。
本实施例中的导电参考层可以是额外设置的，也可以使用电路板中现有的金属导电层，比如电路板的表面导电层、电路板中的地层、电源层或者其他信号层。
可以理解的，电路板可能有多个信号层，而此目标信号层为对应当前背钻任务的信号层。同样的，至少两个导电参考层也是对应当前背钻任务而言，并不是对应待背钻的电路板而言。或者可以说，对于一个待背钻板，本步骤中的导电参考层并不是唯一固定的，本步骤中的导电参考层是相对于当前背钻任务的背钻孔而言。对于不同的背钻任务的背钻孔来说，至少两个导电参考层可以是不同的导电层，当然也可以相同导电层。
另外，电路板上可以有多个信号层，也对应有多个不同的背钻孔，不同的背钻孔可以是不同类型的背钻孔，比如单面背钻孔或双面背钻孔，或者基于预设背钻深度可以分为的浅背钻孔或深背钻孔等。
S102：在待背钻板的设定位置钻通孔，并基于通孔获取待背钻板的两个导电参考层的实测间距。
在此步骤中，在待背钻板上待背钻孔对应的设定位置钻通孔，并基于通孔获取待背钻板的两个导电参考层的实测间距。而实测间距可以是在钻通孔时获取到的实测间距，也可以是基于钻通孔时获取到相关的信号或数据，从而获取到的实测间距。
进一步地，一块待背钻板上可能包括多个待背钻孔，需要对每个待背钻孔的设定位置钻通孔，且基于通孔获取每个待背钻孔对应的两个导电参考层的实测间距。由于每个待背钻孔对应的至少两个导电参考层可以相同，也可以不相同。由于待背钻孔在待背钻板上的位置不同以及加工中导电图形等操作导致的板厚介厚不同，即使不同待背钻孔对应的至少两个导电参考层相同，获取到的两个导电参考层的实测间距仍然可能不同。对每个待背钻孔，均获取两个导电参考层的实测间距，可以减小甚至消除板厚介厚的影响。
一般而言，在电路板上需要进行背钻的位置处，需要先进行钻通孔，然后对通孔进行金属化操作得到金属化孔，并在金属化孔的位置处进行背钻操作，得到背钻孔。在对待背钻板上所有待背钻孔的设定位置进行相应的钻通孔，并基于通孔获取待背钻孔对应的两个导电参考层的实测间距之后，对通孔进行金属化操作得到金属化孔，并在金属化孔的位置处进行S103的操作。
S103：响应于待背钻的背钻孔为第一类型，基于实测间距，确定目标背钻深度；控制背钻钻头向目标信号层钻目标背钻深度的背钻孔，且背钻不钻穿目标信号层；响应于待背钻的背钻孔为第二类型，基于实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向目标信号层钻至目标相对高度的背钻孔，且背钻不钻穿目标信号层。
本步骤中，需要根据不同类型的背钻孔，分别进行深度控深或相对高度控深，以进行控深背钻得到背钻孔，且使背钻孔的金属背钻残桩长度Stub控制在较小的范围但又不至于钻穿目标信号层导致无法实现信号层功能。
本实施例中，通过在钻通孔时获取到对应待背钻孔的两个导电参考层的实测间距，基于实测间距对不同类型的待背钻孔的确定目标背钻深度或者目标相对高度，提高了目标背钻深度或目标相对高度的准确度，基于目标背钻深度或目标相对高度进行背钻，减小了因电路板不同位置处板厚不均匀导致的钻孔误差，提高了电路板的背钻精度，且对不同类型的待背钻孔进行对应背钻方式，提高了不同类型待钻孔的背钻精度，实现背钻残桩长度Stub的高精度控制。
具体地，确定待背钻的背钻孔为第一类型还是第二类型，可以根据背钻孔的预设背钻深度来进行确定，也可以根据目标信号层与电路板待背钻一侧表面的距离来确定。在待背钻板中，目标信号层与待背钻一侧表面的理论间距是已 知的，可以根据待背钻板中各层子板以及介质层厚度计算出。为了使背钻不钻穿目标信号层，预设背钻深度需要小于目标信号层与待背钻一侧表面的理论间距，且两者之差对应于理论背钻残桩长度Stub。
在一个具体实施例中，背钻加工方法还包括获取到待背钻板上背钻孔的预设背钻深度。响应于预设背钻深度大于等于信号探测安全值，确定背钻孔为第一类型。响应于预设背钻深度小于信号探测安全值，确定背钻孔为第二类型。
其中，信号探测安全值与钻孔设备相关。在使用钻孔设备钻孔时，若待获取信号的两层间距小于信号探测安全值，那么钻孔设备只能获取先钻头或钻针先接触的一层对应的信号，后接触的一层的信号易产生异常，或者被前一层的信号影响或干扰，导致无法获取到两层的实测间距。在本实施例中，信号探测安全值大于等于0.5毫米。具体地，根据不同的电路板钻孔设备，信号探测安全值可以为0.8mm、1.0mm、1.2mm、1.4mm等。
响应于预设背钻深度大于等于信号探测安全值，确定背钻孔为第一类型，也可以称为深背钻孔。而响应于预设背钻深度小于信号探测安全值，确定背钻孔为第二类型，则可以称为浅背钻孔。
在响应于预设背钻深度小于信号探测安全值，确定背钻孔为第二类型时，背钻加工方法具体可以参阅图2和图3，图2是本申请提供的电路板的背钻加工方法的第二实施例的流程示意图，图3是本申请提供的电路板第一实施例的结构示意图。
S201：获取到待背钻板；其中，待背钻板包括目标信号层31以及第一导电参层、第二导电参考层和第三导电参考层；目标信号层31为对应当前背钻任务的信号层，第一导电参层为待背钻板背钻入钻一侧的第一表面导电层32，第二导电参考层33于第一表面导电层32与目标信号层31之间，第三导电参考层为待背钻板的第二表面导电层34。
此步骤可以参阅S101的相关描述，此处不进行赘述。
S202：在待背钻板的设定位置，由第二表面导电层34进行入钻钻通孔35，获取第二表面导电层34与第二导电参考层33之间的实测间距Z1。
此步骤可以参考S102的相关描述，此处不进行赘述。
S203：响应于待背钻的背钻孔为第二类型，基于第二表面导电层34与第二导电参考层33之间的实测间距Z1，确定背钻终点相对于机台的目标相对高度。
具体地，基于第二表面导电层34与第二导电参考层33之间的实测间距Z1，以及由第二导电参考层33向目标信号层31的预设分阶控深h1，确定背钻终点相对于机台的目标相对高度。
进一步地，待背钻板还可以搁置在垫板上进行钻孔操作。此时，垫板设于背钻板的第二表面导电层34一侧。而垫板相对机台高度可以由钻孔设备获取得到。基于第二表面导电层34与第二导电参考层33之间的实测间距Z1、由第二导电参考层33向目标信号层31的预设分阶控深h1和垫板相对机台高度，确定背钻终点相对于机台的目标相对高度。
具体地，垫板相对机台高度、第二表面导电层34与第二导电参考层33之间的实测间距Z1与补偿值之和，减去由第二导电参考层33向目标信号层31的预设分阶控深h1得到背钻终点相对于机台的目标相对高度。其中，补偿值包含电镀铜厚、通孔及背钻钻尖机台相对高度差值等。
本实施例中，相对于机台的相对高度可以为相对于机台坐标系而言的纵坐标。
S204：控制背钻钻头由待背钻板的第一表面导电层32一侧入钻，向目标信号层31进行背钻，钻至目标相对高度，得到背钻孔36，且背钻不钻穿所述目标信号层。
在此步骤之前，还包括对通孔35进行孔金属化操作，得到金属化通孔。本步骤中，基于金属化通孔的的开口处，控制背钻钻头由待背钻板的第一表面导电层32一侧入钻，进行背钻，钻至目标相对高度，即为背钻终点。
本实施例中，第二导电参考层33设置于用于背钻一侧的第一表面导电层32与目标信号层31之间，第二导电参考层33与用于背钻一侧的第一表面导电层32之间的距离以及第二导电参考层33与目标信号层31之间的距离，可以根据具体情况进行相应的设置。比如，可以将第二导电参考层33设置在更加靠近目标信号层31的位置处，也就是说，第二导电参考层33与用于背钻一侧的第一表面导电层32之间的距离大于第一表面导电层32与目标信号层31之间的距离。而在这种情况下，由于实际在钻通孔，通过通孔获取到了第二表面导电层34与第二导电参考层33之间的实测间距Z1，更加准确。而由第二导电参考层33向目标信号层31的预设分阶控深h1越小，背钻受板厚误差的影响也越小，背钻的控深也就更加精确。
本实施例中，背钻孔为第二类型，即预设背钻深度小于信号探测安全值。而预设背钻深度与由第二导电参考层33向目标信号层31的预设分阶控深h1之和为所述用于背钻一侧的第一表面导电层32与目标信号层31之间的间距。其中，预设分阶控深h1一般会很小，那么用于背钻一侧的第一表面导电层32与第二导电参考层33之间的间距也是小于信号探测安全值的，因此，无论从第一表面导电层32一侧入钻还是从第二表面导电层34一侧入钻进行钻通孔，均无 法获取到第一表面导电层32与第二导电参考层33之间的实测间距。进而也就无法通过第一表面导电层32与第二导电参考层33之间的实测间距与由由第二导电参考层33向目标信号层31的预设分阶控深h1作为深度控深进行背钻。而是在本实施例由第二表面导电层34一侧表面入钻钻通孔，获取第二表面导电层34与第二导电参考层33之间的实测间距，然后基于背钻终点相对于机台的目标相对高度进行控深背钻，实现更加精准的背钻控深，使得背钻残桩长度Stub更小却又不钻穿目标信号层。
在其他实施例中，待背钻板上不仅存在本实施待背钻孔，还存在与本实施例中背钻孔方向相反的待背钻孔。而方向相反的待背钻孔同样可以按照本实施例中背钻加工方法的相关步骤，通过由背钻入钻方向相反的方向进行钻通孔，获取钻通孔入钻一侧表面导电层与中间导电参考层之间的实测间距，其中，中间导电参考层介于背钻入钻一侧表面导电层与目标信号层之间。并基于实测间距获取背钻终点相对于机台的目标相对高度，并根据目标相对高度进行控深背钻，同样实现更加精准的控深背钻。
在响应于预设背钻深度大于等于信号探测安全值，确定背钻孔为第一类型时，背钻加工方法具体可以参阅图4和图5，图4是本申请提供的电路板的背钻加工方法的第二实施例的流程示意图，图5是本申请提供的电路板第二实施例的结构示意图。
S401：获取到待背钻板；其中，待背钻板包括目标信号层51以及第一导电参层和第二导电参考层53；目标信号层51为对应当前背钻任务的信号层，第一导电参层为待背钻板背钻入钻一侧的第一表面导电层52，第二导电参考层53于第一表面导电层52与目标信号层51之间。
此步骤可以参阅S101的相关描述，此处不进行赘述。
S402：在待背钻板的设定位置钻通孔，并基于通孔获取待背钻板的第一表面导电层52与第二导电参考层53的实测间距Z2。
S403：响应于待背钻的背钻孔为第一类型，基于待背钻板的第一表面导电层52与第二导电参考层53的实测间距Z2，确定目标背钻深度H。
具体地，响应于待背钻的背钻孔为第一类型，基于待背钻板的第一表面导电层52与第二导电参考层53的实测间距Z2、由第二导电参考层53向目标信号层51的预设分阶控深h2，确定目标背钻深度H。进一步地，目标背钻深度H为实测间距Z2与预设分阶控深h2之和，即满足公式：目标背钻深度H＝实测间距Z2+预设分阶控深h2。
在一个具体实施例中，待背钻板还包括第二表面导电层54，在S402中，还 基于通孔获取到第一表面导电层52与第二表面导电层54的实测间距。并基于第一表面导电层52与第二表面导电层54的实测间距与待背钻板的理论板厚，获取板厚比例值x。具体地，板厚比例值x为第一表面导电层52与第二表面导电层54的实测间距与待背钻板的理论板厚之比。在此S403中，基于待背钻板的第一表面导电层52与第二导电参考层53的实测间距Z2、由第二导电参考层53向目标信号层51的预设分阶控深h2以及板厚比例值x，确定目标背钻深度H。具体地，目标背钻深度H为由第二导电参考层53向目标信号层51的预设分阶控深h2与板厚比例值x，与第一表面导电层52与第二导电参考层53的实测间距Z2之和。
本具体实施例中，通过板厚比例值x，减小甚至消除了预设分阶控深h2部分的介厚与板厚的误差，从而使目标背钻深度H更加准确，实现更加精准的深度控深背钻。
S404：控制背钻钻头由第一表面导电层52，向目标信号层51钻目标背钻深度的背钻孔，且背钻不钻穿目标信号层。
本实施例中，背钻孔为第一类型，即预设背钻深度大于等于信号探测安全值。且第一表面导电层52与第二导电参考层53的理论间距需要大于信号探测安全值，否则按照上一实施例的背钻方法，背钻孔也可归于第二类型。
本实施例，基于通孔获取到第一表面导电层52与第二导电参考层53的实测间距Z2，并与由第二导电参考层53向目标信号层51的预设分阶控深h2一起，确定目标背钻深度H，提高了目标背钻深度H的准确度和精确度，减少了因板厚导致的钻孔误差，使得背钻的精度提高，达到本次背钻任务的背钻精度，使得背钻残桩长度能够更好的控制在合适的范围，同时又不钻穿目标信号层。且进一步通过获取板厚比例值x，减小甚至消除了预设分阶控深h2部分的介厚与板厚的误差，从而使目标背钻深度H更加准确，实现更加精准的深度控深背钻。
参阅图6和图7，图6是本申请提供的电路板的背钻加工方法的第三实施例的流程示意图，图7是本申请提供的电路板第三实施例的结构示意图。本实施例的背钻加工方法包括：
S601：获取到待背钻板；其中，待背钻板包括目标信号层71、第一导电参层72、第二导电参考层73以及第二表面导电层74、第三导电参考层75；目标信号层71为对应当前背钻任务的信号层，第一导电参层72为待背钻板背钻入钻一侧的第一表面导电层72，第二导电参考层73于第一表面导电层72与目标信号层71之间，第三导电参考层75于第二表面导电层74与目标信号层71之间。
S602：在待背钻板的设定位置钻通孔，并基于通孔，获取第一表面导电层72与第二导电参考层73的实测间距Z3、第二导电参考层73与第三导电参考层75的实测间距Z4，以及第二表面导电层74与第三导电参考层75的实测间距Z5。
S603：响应于待背钻的背钻孔为第一类型，基于第二导电参考层73与第三导电参考层75的实测间距Z4与理论间距，获取层间比例值y。
具体地，第二导电参考层73与第三导电参考层75的实测间距Z4与第二导电参考层73与第三导电参考层75的理论间距之比，获取层间比例值y。其中，第二导电参考层73与第三导电参考层75的理论间距可以根据理论板厚和介质层厚度确定。
S604：由第二导电参考层73向目标信号层71的预设分阶控深h3与层间比例值的乘积，与第一表面导电层72与第二导电参考层73的实测间距Z3之和，确定第一目标背钻深度H1。
进一步地，还可以由第二导电参考层73向目标信号层71的预设分阶控深h3与层间比例值的乘积，与第一表面导电层72与第二导电参考层73的实测间距Z3、以及补偿值之和，确定第一目标背钻深度H1。具体的，补偿值可以包含电镀铜厚、通孔及背钻钻尖机台相对高度差值等。
S605：控制背钻钻头由第一表面导电层72向目标信号层71钻第一目标背钻深度H1的背钻孔，且背钻不钻穿目标信号层。
进一步地，本实施例的背钻加工方法还包括：由第三导电参考层75向目标信号层71的预设分阶控深h4与层间比例值y的乘积，与第二表面导电层74与第三导电参考层75的实测间距Z5之和，确定第二目标背钻深度H2。控制背钻钻头由第二表面导电层74向目标信号层71钻第二目标背钻深度H2的背钻孔，且背钻不钻穿所述目标信号层。此处的层间比例值y为S603中获取的层间比例值y。
通过分别由第一表面导电层72和第二表面导电层74向目标信号层71进行背钻，得到双面背钻孔。
本实施例中，两面的背钻孔均为第一类型，即两面进行背钻的预设背钻深度大于等于信号探测安全值，且第一表面导电层72与第二导电参考层73的理论间距需要大于信号探测安全值，第二表面导电层74与第三导电参考层75的理论间距需要大于信号探测安全值。若任意一面进行背钻不满足，则对应一面的背钻按照第二类型的相关背钻方法进行背钻。
本实施例的背钻加工方法，通过在待背钻板第一表面导电层72与目标信号 层71之间，以及第二表面导电层74与目标信号层71之间，分别设置第二表面导电层74和第三导电参考层75，通过钻通孔，基于通孔获取到第一表面导电层72与第二导电参考层73的实测间距Z3、第二导电参考层73与第三导电参考层75的实测间距Z4，以及第二表面导电层74与第三导电参考层75的实测间距Z5，并由第二导电参考层73与第三导电参考层75的实测间距Z4与理论间距之比获取层间比例值y，并分别基于上述数据更加精确的获取到第一目标背钻深度H1和第二目标背钻深度H2。并分别由第一表面导电层72和第二表面导电层74向目标信号层71开始背钻，分别按照第一目标背钻深度H1和第二目标背钻深度H2进行控深背钻，得到双面背钻孔。且通过实际测量获取的实测间距Z3和的实测间距Z5，以及基于层间比例值y，减小甚至消除了预设分阶控深h3和预设分阶控深h4部分的介厚与板厚的误差，从而使目标背钻深度H更加准确，实现更加精准的深度控深背钻。
在上述实施例中，目标信号层与其内层的导电参考层之间的间距，可以称为背钻安全距离W，其值需要大于等于背钻残桩长度Stub与电压安全设计值之和，比如大于等于0.45mm。其中，电压设计安全值，也可称为电压安全距离，与电路板产品使用时的电压和温度湿度等条件相关。电压安全设计值的设定，是为了防止电路板产品在特定电压、温度、湿度条件下，目标信号层与内层的导电参考层间隔距离过短，或者说目标信号层的背钻孔残桩与内层的导电参考层的距离过短，易产生电压击穿，电子在目标信号层与内层的导电参考层之间迁移，形成通道，而造成短路。电压设计安全值可以为0.1mm，0.3mm，0.5mm等，可以根据实际电路板产品进行设定，此处不进行限定。
而对于双面背钻孔，目标信号层与两侧的内层导电参考层的间距，分别为安全背钻距离W2和安全背钻距离W3，均需要满足背钻安全距离。且对于双面背钻孔，为了能获取到两个内层的导电参考层之间的实测间距，两个内层的导电参考层之间的间距需要大于等于信号探测安全值K，或者也可以说，双面背钻需要满足背钻安全距离W2≥K/2且背钻安全距离W3≥K/2，其中K为信号探测安全值，背钻安全距离W2与背钻安全距离W3之和约为两个内层的导电参考层之间的间距。目标信号层与内层的导电参考层之间的间距以及安全距离W在满足限定条件下，值越小，越能增加背钻的控制精度。
可以理解的是，在待背钻的电路板包括上述多种待背钻孔时，可以分别按照对应的背钻加工方法，进行相应的背钻操作，以根据每个待背钻孔以及不同类型待背钻孔，计算控深深度或者相对高度，实现精准背钻。
本申请还提供一种电路板，此电路板通过本申请提供的背钻加工方法制造 而成。通过本申请提供的背钻加工方法通过在钻通孔时获取到对应待背钻孔的两个导电参考层的实测间距，基于实测间距对不同类型的待背钻孔的确定目标背钻深度或者目标相对高度，提高了目标背钻深度或目标相对高度的准确度，基于目标背钻深度或目标相对高度进行背钻，减小了因电路板不同位置处板厚不均匀导致的钻孔误差，提高了电路板的背钻精度，且对不同类型的待背钻孔进行对应背钻方式，提高了不同类型待钻孔的背钻精度，实现背钻残桩长度Stub的高精度控制，同时得到包括高精度背钻残桩长度Stub的电路板。。
以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。
Claims (20)
- 一种电路板的背钻加工方法，其特征在于，所述背钻加工方法包括：获取到待背钻板；其中，所述待背钻板包括目标信号层以及至少两个导电参考层；所述目标信号层为对应当前背钻任务的信号层；在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于所述实测间距，确定目标背钻深度；控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层；响应于待背钻的背钻孔为第二类型，基于所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求1所述的背钻加工方法，其特征在于，所述背钻加工方法还包括：获取到所述待背钻板上所述背钻孔的预设背钻深度；响应于所述预设背钻深度大于等于信号探测安全值，确定所述背钻孔为第一类型；响应于所述预设背钻深度小于信号探测安全值，确定所述背钻孔为第二类型。
- 根据权利要求2所述的背钻加工方法，其特征在于，所述待背钻板包括第一导电参层、第二导电参考层和第三导电参考层，其中，所述第一导电参层为所述待背钻板背钻入钻一侧的第一表面导电层，所述第二导电参考层于所述第一表面导电层与所述目标信号层之间，所述第三导电参考层为所述待背钻板的第二表面导电层；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置，由所述第二表面导电层进行入钻钻通孔，获取所述第二表面导电层与所述第二导电参考层之间的所述实测间距；所述响应于待背钻的背钻孔为第二类型，基于所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定背钻终点相对于机台的目标相对高度；控制背钻钻头由所述待背钻板的所述第一表面导电层一侧入钻，向所述目标信号层进行背钻，钻至所述目标相对高度，得到所述背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求3所述的背钻加工方法，其特征在于，所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定背钻终点相对于机台的目标相对高度，包括：响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距以及由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述背钻终点相对于机台的所述目标相对高度。
- 根据权利要求4所述的背钻加工方法，其特征在于，所述待背钻板的所述第二表面导电层一侧设有垫板；所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定所述背钻终点相对于机台的所述目标相对高度，包括：基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距、由所述第二导电参考层向所述目标信号层的所述预设分阶控深、所述垫板相对机台高度，确定所述背钻终点相对于所述机台的所述目标相对高度。
- 根据权利要求5所述的背钻加工方法，其特征在于，所述响应于待背钻的背钻孔为第二类型，基于所述第二表面导电层与所述第二导电参考层之间的所述实测间距，确定所述背钻终点相对于机台的所述目标相对高度，包括：由所述垫板相对机台高度、所述第二表面导电层与所述第二导电参考层之间的所述实测间距与补偿值之和，减去由所述第二导电参考层向目标信号层的所述预设分阶控深，得到所述背钻终点相对于所述机台的所述目标相对高度。
- 根据权利要求2所述的背钻加工方法，其特征在于，所述待背钻板包括第一导电参层、第二导电参考层，其中，所述第一导电参层为所述待背钻板背钻入钻一侧的第一表面导电层，所述第二导电参考层于所述第一表面导电层与所述目标信号层之间；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的所述第一表面导电层与所述第二导电参考层的实测间距；所述响应于待背钻的背钻孔为第一类型，基于所述实测间距，确定目标背钻深度；控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背 钻不钻穿所述目标信号层的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度；控制所述背钻钻头由所述第一表面导电层，向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求7所述的背钻加工方法，其特征在于，所述响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度。
- 根据权利要求8所述的背钻加工方法，其特征在于，所述待背钻板还包括第二表面导电层；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的所述第一表面导电层与所述第二导电参考层的实测间距，以及所述第一表面导电层与所述第二表面导电层的实测间距；所述响应于待背钻的背钻孔为第一类型，基于所述待背钻板的所述第一表面导电层与所述第二导电参考层的所述实测间距，确定目标背钻深度的步骤，包括：基于所述第一表面导电层与所述第二表面导电层的实测间距与所述待背钻板的理论板厚，获取板厚比例值；响应于待背钻的背钻孔为第一类型，由所述第二导电参考层向所述目标信号层的预设分阶控深与板厚比例值的乘积，与所述第一表面导电层与所述第二导电参考层的所述实测间距之和，确定所述目标背钻深度。
- 根据权利要求7所述的背钻加工方法，其特征在于，所述待背钻板还包括第三导电参考层和第二表面导电层；其中，所述第三导电参考层于所述第二表面导电层与所述目标信号层之间；所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤，包括：在所述待背钻板的设定位置钻通孔，并基于所述通孔，获取所述第一表面导电层与所述第二导电参考层的实测间距、所述第二导电参考层与所述第三导 电参考层的实测间距，以及所述第二表面导电层与所述第三导电参考层的实测间距；响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度的步骤，包括：响应于待背钻的背钻孔为第一类型，基于所述第二导电参考层与所述第三导电参考层的实测间距与理论间距，获取层间比例值；由所述第二导电参考层向所述目标信号层的预设分阶控深与所述层间比例值的乘积，与所述第一表面导电层与所述第二导电参考层的所述实测间距之和，确定第一目标背钻深度；所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：所述控制背钻钻头由所述第一表面导电层向所述目标信号层钻所述第一目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求10所述的背钻加工方法，其特征在于，所述响应于待背钻的背钻孔为第一类型，基于所述第一表面导电层与所述第二导电参考层的所述实测间距、由所述第二导电参考层向所述目标信号层的预设分阶控深，确定所述目标背钻深度的步骤，还包括：由所述第三导电参考层向所述目标信号层的预设分阶控深与所述层间比例值的乘积，与所述第二表面导电层与所述第三导电参考层的实测间距之和，确定第二目标背钻深度；所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层的步骤，包括：所述控制背钻钻头由所述第二表面导电层向所述目标信号层钻所述第二目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求10所述的背钻加工方法，其特征在于，所述第二导电参考层与所述第三导电参考层的所述实测间距大于等于信号探测安全值。
- 根据权利要求1所述的背钻加工方法，其特征在于，所述待背钻板包括多个所述待背钻孔；所述获取到待背钻板；其中，所述待背钻板包括目标信号层以及至少两个导电参考层；所述目标信号层为对应当前背钻任务的信号层，包括：获取到待背钻板；其中，所述待背钻板包括每个所述待背钻孔对应的所述目标信号层以及至少两个所述导电参考层；所述目标信号层为对应当前背钻任 务的信号层。
- 根据权利要求13所述的背钻加工方法，其特征在于，所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距，包括：在所述待背钻板上每个所述待背钻孔对应的所述设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距。
- 根据权利要求1所述的背钻加工方法，其特征在于，所述在所述待背钻板的设定位置钻通孔，并基于所述通孔获取所述待背钻板的两个所述导电参考层的实测间距的步骤之后，还包括：对所述通孔进行金属化操作得到金属化孔。
- 根据权利要求15所述的背钻加工方法，其特征在于，所述控制背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层，包括：在所述金属化孔的位置处，控制所述背钻钻头向所述目标信号层钻所述目标背钻深度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求16所述的背钻加工方法，其特征在于，所述控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层，包括：在所述金属化孔的位置处，控制背钻钻头向所述目标信号层钻至所述目标相对高度的背钻孔，且背钻不钻穿所述目标信号层。
- 根据权利要求1所述的背钻加工方法，其特征在于，所述背钻终点相对于机台的目标相对高度为所述背钻终点相对于所述机台的坐标系中的纵坐标。
- 根据权利要求2-18任一项所述的背钻加工方法，其特征在于，所述信号探测安全值大于等于0.5毫米。
- 一种电路板，其特征在于，通过权利要求1-19中任一项所述的背钻加工方法制造而成。
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433969A (zh) * | 2013-08-28 | 2013-12-11 | 华为技术有限公司 | 印刷电路板的钻孔方法和装置 |
| US20140093321A1 (en) * | 2012-09-28 | 2014-04-03 | Huawei Technologies Co., Ltd. | Printed circuit board, and method and apparatus for drilling printed circuit board |
| JP2017092259A (ja) * | 2015-11-11 | 2017-05-25 | 大船企業日本株式会社 | 多層プリント配線基板におけるバックドリル加工方法及び基板加工装置 |
| CN107920423A (zh) * | 2017-11-21 | 2018-04-17 | 大族激光科技产业集团股份有限公司 | 钻孔机及钻孔制作方法 |
| CN109121305A (zh) * | 2018-09-29 | 2019-01-01 | 生益电子股份有限公司 | 一种pcb背钻控制方法及pcb |
| CN110022648A (zh) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | 一种pcb的背钻方法及系统 |
| CN110022647A (zh) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | 一种pcb的钻孔方法及装置 |
| CN110893629A (zh) * | 2018-09-13 | 2020-03-20 | 健鼎（无锡）电子有限公司 | 电路板的制造方法及钻孔机 |
| CN112492759A (zh) * | 2020-12-01 | 2021-03-12 | 维嘉数控科技（苏州）有限公司 | 一种电路板的背钻加工方法及钻孔系统 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM541179U (zh) * | 2017-01-06 | 2017-05-01 | 金像電子股份有限公司 | 鑽孔系統 |
| CN208623982U (zh) * | 2017-06-30 | 2019-03-19 | 苏州思诺林电子有限公司 | 一种用于线路板钻孔深度控制的高精度钻孔盖板 |
| TWI674826B (zh) * | 2018-10-01 | 2019-10-11 | 健鼎科技股份有限公司 | 電路板的背鑽孔方法 |
| CN112804825B (zh) * | 2021-04-09 | 2021-09-14 | 苏州维嘉科技股份有限公司 | 控深钻孔的补偿方法和钻孔设备 |
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140093321A1 (en) * | 2012-09-28 | 2014-04-03 | Huawei Technologies Co., Ltd. | Printed circuit board, and method and apparatus for drilling printed circuit board |
| CN103433969A (zh) * | 2013-08-28 | 2013-12-11 | 华为技术有限公司 | 印刷电路板的钻孔方法和装置 |
| JP2017092259A (ja) * | 2015-11-11 | 2017-05-25 | 大船企業日本株式会社 | 多層プリント配線基板におけるバックドリル加工方法及び基板加工装置 |
| CN107920423A (zh) * | 2017-11-21 | 2018-04-17 | 大族激光科技产业集团股份有限公司 | 钻孔机及钻孔制作方法 |
| CN110022648A (zh) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | 一种pcb的背钻方法及系统 |
| CN110022647A (zh) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | 一种pcb的钻孔方法及装置 |
| CN110893629A (zh) * | 2018-09-13 | 2020-03-20 | 健鼎（无锡）电子有限公司 | 电路板的制造方法及钻孔机 |
| CN109121305A (zh) * | 2018-09-29 | 2019-01-01 | 生益电子股份有限公司 | 一种pcb背钻控制方法及pcb |
| CN112492759A (zh) * | 2020-12-01 | 2021-03-12 | 维嘉数控科技（苏州）有限公司 | 一种电路板的背钻加工方法及钻孔系统 |
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| US20240114625A1 (en) | 2024-04-04 |
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