WO2015025505A1 - 一液型硬化性樹脂組成物 - Google Patents
一液型硬化性樹脂組成物 Download PDFInfo
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- WO2015025505A1 WO2015025505A1 PCT/JP2014/004195 JP2014004195W WO2015025505A1 WO 2015025505 A1 WO2015025505 A1 WO 2015025505A1 JP 2014004195 W JP2014004195 W JP 2014004195W WO 2015025505 A1 WO2015025505 A1 WO 2015025505A1
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- Prior art keywords
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- XZKLXPPYISZJCV-UHFFFAOYSA-N C(c1ccccc1)[n]1c(-c2ccccc2)ncc1 Chemical compound C(c1ccccc1)[n]1c(-c2ccccc2)ncc1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- DNYMPDJLNNEOAP-GSLHJPOASA-N C/C=C\N(C)C(C)=N Chemical compound C/C=C\N(C)C(C)=N DNYMPDJLNNEOAP-GSLHJPOASA-N 0.000 description 1
- BFXVJZHDZKVGOS-PLNGDYQASA-N C/C=C\N=C(\C)/NC Chemical compound C/C=C\N=C(\C)/NC BFXVJZHDZKVGOS-PLNGDYQASA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
Definitions
- the present invention relates to a one-component curable resin composition not containing an isocyanate compound. Specifically, it contains an epoxy resin, a thiol compound, a specific imidazole compound, and an appropriate acidic compound, and is excellent in storage stability and fast curability.
- the present invention also relates to an epoxy-thiol one-component curable resin composition.
- Epoxy resin compositions are used in a wide range of fields such as adhesives, sealants and paints.
- Conventional epoxy resin compositions are generally two-pack type epoxy resins composed of a main agent and a curing agent (Non-patent Document 1), but the workability is poor, for example, a mixing operation of the main agent and the curing agent is required. Was pointed out. Therefore, recently, a one-component curable epoxy resin composition in which a latent curing agent is blended with an epoxy resin from the beginning, which does not require a mixing operation of the main agent and the curing agent, and has excellent workability, has been used.
- latent curing agents used in the one-part curable epoxy resin composition are solid dispersion type latent curing agents that are used in a state of being dispersed in a liquid epoxy resin in the form of particles of several ⁇ m.
- dicyandiamide, dihydrazide compounds, amine adduct compounds, microcapsules of curable compounds such as amines or imidazoles are known (Non-patent Document 1). Since these latent curing agents are separated from the epoxy resin by microcapsules at room temperature, they do not cause a curing reaction, and when heated, the curable compound melts with the epoxy resin, causing a curing reaction of the epoxy resin. It is.
- Non-patent Document 2 a composition using an amine complex of boron trifluoride as a curing agent is disclosed (Non-patent Document 2), but corrosive hydrogen fluoride is used during the curing reaction of the resin. Because it generates gas, its use has been limited.
- Non-Patent Document 1 a one-part epoxy resin composition using an onium salt such as a sulfonium salt or a pyridinium salt as a curing agent is also disclosed (Non-Patent Document 1). These curing agents are curing agents that cause cationic polymerization. In addition, there are problems such as poor adhesive strength and many restrictions on additives that can be added to the resin composition.
- Patent Document 1 a one-component epoxy resin composition using an amine imide compound as a latent curing agent is disclosed (Patent Document 1), but the curing speed is extremely slow, the curing temperature is high, and practical adhesive strength is achieved. In order to obtain it, there existed a problem that severe hardening conditions of 150 degreeC and 3 hours were required.
- composition containing a polyfunctional epoxy compound, a polyfunctional thiol, an amine, and a mercapto organic acid as a curing retarder is also disclosed (Patent Document 3), but the curability is still insufficient.
- a polythiol compound having two or more thiol groups in the molecule is used, and as the curing accelerator, a compound having one or more isocyanate groups in the molecule and at least one primary and / or in the molecule.
- a polythiol-based epoxy resin composition having storage stability and excellent curability by using a reaction product with a compound having a secondary amino group has been disclosed (Patent Document 4).
- this composition is not necessarily excellent in reproducibility, such as an uncured part may occur because the curing agent and the like are not uniformly dissolved in the resin composition, and a practical composition and I could not say.
- the isocyanate compound gives excellent curability to the epoxy resin composition, since it is extremely toxic, there is a high risk of adversely affecting the environment and the human body. It was desired.
- an epoxy resin composition with improved storage stability an epoxy resin having two or more epoxy groups in the molecule, a thiol compound having two or more thiol groups in the molecule, a solid dispersion type latent curing accelerator And an epoxy resin composition characterized by containing a borate ester compound as an essential component (Patent Document 5).
- a one-component curable resin composition that can be used is not yet known.
- JP 2003-96061 A Japanese Patent Publication No. 60-21648 JP-A 61-159417 Japanese Patent Laid-Open No. 6-21970 Japanese Patent Application Laid-Open No. 11-256013
- the first object of the present invention is a one-part curable composition that has sufficient storage stability and excellent curability, is suitable for narrow space adhesion and impregnation adhesion, and does not contain a highly toxic isocyanate compound.
- the object is to provide a resin composition.
- the second object of the present invention is to provide an epoxy resin cured product excellent in curing uniformity, which is obtained by curing the one-component curable resin composition.
- the third object of the present invention is to provide a safe functional product suitable for narrow space bonding and impregnation bonding, in which an uncured portion does not occur in the coated portion.
- the present inventors have found that when an imidazole compound is not contained and a specific imidazole compound is used together with a polythiol compound and a polyepoxy compound, the imidazole compound is a composition. It was found that the solution became liquid and dissolved uniformly and good results were obtained, and the present invention was reached.
- the present invention is represented by (A) a compound having at least two epoxy groups in the molecule, (B) a compound having two or more thiol groups in the molecule, and (C) the following general formula (I).
- the one-component curable resin composition comprising the imidazole compound uniformly mixed and containing no isocyanate compound, wherein the component (C) is present in liquid form Product, an epoxy resin cured product obtained by heating the one-component curable resin composition, and a function comprising the one-component curable resin composition as a main component It is a sex product.
- n is an integer of 1 to 6
- R 1 , R 2 and R 3 are each independently a hydrogen atom or an alkyl group having 1 to 20 carbon atoms or a carbon atom.
- the number of 6 to 20 aryl group, R 4 is an alkylene group, an arylene group having 6 to 20 carbon atoms, or a group represented by -CH 2 CH 2 COO- carbon atoms 1 to 20
- R 5 Is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms when n is 1, and a hydrocarbon group having 1 to 20 carbon atoms when n is 2 to 6 .
- the one-component curable resin composition of the present invention preferably further contains (D) an acidic compound, and the acidic compound includes phosphorous acid, phosphorous acid monoester, phosphorous acid diester, borate compound, It is preferably at least one acidic compound selected from the group consisting of titanate compounds, aluminate compounds and zirconate compounds, and in particular selected from the group consisting of phosphorous acid, phosphite monoesters and phosphite diesters. Preferably, at least one phosphorous acid compound, borate compound or titanate compound is used.
- the molar ratio of the component (D) to 1 mol of the imidazole group in the imidazole compound of the component (C) is preferably 0.05 to 3.5.
- the present invention a practical one-component curable resin composition having a balance between excellent curing characteristics and storage stability and having low toxicity is obtained by using raw materials that are easily available. Can do. Since the one-component curable resin composition of the present invention is a one-component curable resin composition that does not contain a solid curing agent component, particularly at room temperature, it is excellent in workability and is also suitable for adhesion in narrow spaces and impregnation. A suitable functional product of the present invention and an epoxy resin cured product in which an uncured part does not occur can be easily obtained.
- examples of the epoxy resin used as the component (A) include polyglycidyl ether compounds of mononuclear polyhydric phenol compounds such as hydroquinone, resorcin, pyrocatechol, and phloroglucinol; dihydroxynaphthalene, biphenol, methylene bisphenol (Bisphenol F), methylene bis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetrabromobisphenol A, 1,3-bis (4-hydroxycumylbenzene), 1 , 4-bis (4-hydroxycumylbenzene), 1,1,3-tris (4-hydroxyphenyl) butane, 1,1,2,2-tetra (4-hydroxyphenyl) ethane, thio Polyglycidyl ether compounds of polynuclear polyhydric phenol compounds such as hydroquinone, resorcin, pyrocate
- epoxy resins may be internally crosslinked by a terminal isocyanate prepolymer, but may be a polyvalent active hydrogen compound (polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphate ester, etc.) and a high molecular weight. It may be converted into one.
- a polyvalent active hydrogen compound polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphate ester, etc.
- those having an epoxy equivalent of 70 to 3000 are preferably used, and those having 90 to 2000 are more preferably used. If the epoxy equivalent is less than 70, the physical properties of the cured product may be lowered, and if it is greater than 3000, sufficient curability may not be obtained.
- polythiol compound (B) used in the present invention examples include trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, trimethylolpropane tris ( ⁇ -Thiopropionate), pentaerythritol tetrakis ( ⁇ -thiopropionate), dipentaerythritol poly ( ⁇ -thiopropionate) and other thiol compounds obtained by esterification reaction of mercapto organic acid Examples thereof include thiol compounds having two or more thiol groups in the molecule, which do not require the use of a basic substance in the production process.
- alkyl polythiol compounds such as 1,4-butanedithiol, 1,6-hexanedithiol, 1,10-decanedithiol; terminal thiol group-containing polyether; terminal thiol group-containing polythioether; reaction of epoxy compound with hydrogen sulfide
- a basic substance such as a thiol compound having a terminal thiol group obtained by a reaction between a polythiol compound and an epoxy compound
- a thiol compound having two or more thiol groups in a molecule that has been subjected to dealkalization treatment and has an alkali metal ion concentration of 50 ppm or less can be given.
- the polythiol compound to be treated is dissolved in an organic solvent such as acetone or methanol, and an acid such as dilute hydrochloric acid or dilute sulfuric acid is added.
- an organic solvent such as acetone or methanol
- an acid such as dilute hydrochloric acid or dilute sulfuric acid is added.
- Examples thereof include a method of removing the produced salt by extraction, washing, etc., a method of removing by adsorption using an ion exchange resin, a method of separating and purifying a polythiol compound by distillation, and the like.
- trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-) are obtained from the viewpoint of obtaining a one-component curable resin composition having an excellent balance between storage stability and curability.
- the mixing ratio of the component (A) and the component (B) is preferably 0.2 to 2.0 in terms of thiol equivalent number / epoxy equivalent number.
- the thiol equivalent number / epoxy equivalent number is preferably 0.5 to 1.5.
- the imidazole compound used as the component (C) is represented by the following general formula (I).
- n is an integer of 1 to 6, particularly preferably 1 or 2.
- R 1 , R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms.
- alkyl group having 1 to 20 carbon atoms examples include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tertiary butyl group, pentyl group, isopentyl group, tertiary pentyl group, and hexyl group.
- R 1 , R 2 and R 3 are preferably a hydrogen atom, a methyl group, an ethyl group or a phenyl group.
- R 4 is an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, or a group represented by —CH 2 CH 2 COO—.
- alkylene group having 1 to 20 carbon atoms include methylene group, ethylene group, propane-1,2-diyl group, propane-1,3-diyl group, butane-1,4-diyl group, and pentane-1,5. -Diyl group, hexane-1,6-diyl group, octane-1,8-diyl group, 2-methyl-hexane-1,6-diyl group, decane-1,10-diyl group, etc.
- arylene group having 6 to 20 atoms examples include a phenylene group and a naphthylene group. These groups may be substituted with a halogen, a hydroxy group or the like.
- R 4 in the present invention is preferably a methylene group or a group represented by —CH 2 CH 2 COO—.
- R 5 is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms when n is 1, and a hydrocarbon group having 1 to 20 carbon atoms when n is 2 to 6 It is.
- Examples of the imidazole compound represented by the general formula (I) include the following compounds.
- the content of the components (A) to (C) is 30 to 80 parts by mass of the component (B) with respect to 100 parts by mass of the component (A).
- the component C) is preferably 1 to 3 parts by mass.
- the one-component curable resin composition of the present invention preferably further contains (D) an acidic compound in order to improve storage stability.
- an acidic compound include compounds represented by the following general formula. M (OH) p (OR) n ⁇ p
- a phosphorous acid compound As said acidic compound, a phosphorous acid compound, a titanate compound, a borate compound, an aluminate compound, a zirconate compound etc. are mentioned, for example.
- M in the above formula is P, n is 3, and p is 1 to 3.
- M in the above formula is B or Al, n is 3, and p is 0 to 3, respectively.
- M is Ti or Zr, n is 4, and p is 0-4.
- what mixed these 1 type (s) or 2 or more types can be used.
- R in the above formula is not particularly limited, but for example, a linear or branched alkyl group having 1 to 18 carbon atoms, a linear or branched alkenyl group having 1 to 18 carbon atoms, or a carbon number of 3
- p in the formula is 1, the phosphite compound becomes a phosphite diester, and the Rs in that case may be the same or different.
- a part of carbon atoms may be substituted with an oxygen atom or a nitrogen atom.
- the alkyl group and alkenyl group may be substituted with a cycloalkyl group having 3 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, and particularly substituted with a cycloalkyl group having 4 to 7 carbon atoms. It is preferable.
- the cycloalkyl group and cycloalkenyl group may be substituted with an alkyl group or alkenyl group having 1 to 18 carbon atoms, and particularly preferably a cycloalkyl group having 4 to 7 carbon atoms.
- the aryl group may be substituted with a halogen atom, or an alkyl group or alkenyl group having 1 to 18 carbon atoms, and particularly preferably an aryl group having 6 to 10 carbon atoms.
- Examples of the phosphorous acid monoester compound include monomethyl phosphite, monoethyl phosphite, monobutyl phosphite, monolauryl phosphite, monooleyl phosphite, monophenyl phosphite, mononaphthyl phosphite and the like.
- Examples of the phosphite diester compound include dimethyl phosphite, diethyl phosphite, dibutyl phosphite, dilauryl phosphite, dioleyl phosphite, diphenyl phosphite, dinaphthyl phosphite, Di-o-tolyl phosphate, di-m-tolyl phosphite, di-p-tolyl phosphite, di-p-chlorophenyl phosphite, di-p-bromophenyl phosphite, di-phosphite p-fluorophenyl and the like. In this invention, what mixed these 1 type (s) or 2 or more types can be used.
- borate compound examples include trimethyl borate, triethyl borate, tri-n-propyl borate, triisopropyl borate, tri-n-butyl borate, tripentyl borate, triallyl borate, trihexyl borate, tricyclohexyl borate, and tricyclohexyl borate.
- Octyl borate trinonyl borate, tridecyl borate, tridodecyl borate, trihexadecyl borate, trioctadecyl borate, tris (2-ethylhexyloxy) borane, bis (1,4,7,10-tetraoxaundecyl) ( 1,4,7,10,13-pentaoxatetradecyl) (1,4,7-trioxaundecyl) borane, tribenzyl borate, triphenyl borate, tri-o-tolyl borate, tri-m-tolyl borate , Triethanolamine borate and the like.
- trimethyl borate, triethyl borate, tri-n-propyl borate, triisopropyl borate and / or tri-n-butyl borate from the viewpoints of availability, compound safety or storage stability of the resin composition It is more preferable to use triethyl borate and / or triisopropyl borate, and it is particularly preferable to use triethyl borate.
- titanate compounds include tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetrabutyl titanate, and tetraoctyl titanate.
- tetraethyl titanate, tetrapropyl titanate, and tetraisopropyl titanate are preferable, and tetraethyl titanate is preferably used.
- aluminate compound examples include triethyl aluminate, tripropyl aluminate, triisopropyl aluminate, tributyl aluminate, trioctyl aluminate and the like.
- zirconate compound examples include tetraethyl zirconate, tetrapropyl zirconate, tetraisopropyl zirconate, and tetrabutyl zirconate.
- the amount of the acidic compound (D) used in the latent curing agent composition of the present invention is usually 0.05 to 3.5 in terms of the molar ratio of the acidic compound to 1 mol of the imidazole group in the imidazole compound. It is more preferably 0.1 to 3.0, and most preferably 0.3 to 2.0. If the molar ratio is less than 0.05, sufficient storage stability may not be obtained, and if it exceeds 3.5, the curability is greatly lowered.
- the one-component curable resin composition of the present invention includes a curing catalyst; a reactive or non-reactive diluent or plasticizer such as monoglycidyl ethers, dioctyl phthalate, dibutyl phthalate, benzyl alcohol, coal tar; Fillers or pigments such as fibers, carbon fibers, cellulose, silica sand, cement, kaolin, clay, aluminum hydroxide, bentonite, talc, silica, finely divided silica, titanium dioxide, carbon black, graphite, iron oxide, bitumen substances; ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) -N′- ⁇ - (aminoethyl) - ⁇ -aminopropyltriethoxy Silane, ⁇ -anilinopropy
- the method for producing the one-component curable resin composition of the present invention is not particularly limited as long as (A) an epoxy compound, (B) a thiol compound, and (C) an imidazole compound can be mixed uniformly.
- the components (B) and (C) may be directly mixed with the component (A).
- the component (C) is solid at room temperature, the components (C) and (B) are mixed, By heating and melting, the component (C) becomes a liquid solution even at room temperature and becomes easy to mix with the component (A).
- (D) acidic compound since (D) acidic compound can dissolve solid (C) component, after (C) component is dissolved in (D) component in advance, (A) ) And / or (B) component.
- the cured product of the present invention is obtained by heating the one-component curable resin composition of the present invention.
- the curing temperature is preferably 60 to 100 ° C.
- the curing time is preferably 10 to 240 minutes.
- the one-component curable resin composition of the present invention easily penetrates into a narrow space, generation of uncured portions in the narrow space can be suppressed.
- the one-component curable resin composition of the present invention has various uses, for example, paints or adhesives for concrete, cement mortar, various metals, leather, glass, rubber, plastic, wood, cloth, paper, etc .; packaging Adhesive tape, adhesive label, frozen food label, removable label, POS label, adhesive wallpaper, adhesive for adhesive flooring; art paper, lightweight coated paper, cast coated paper, coated paperboard, carbonless copier, impregnated paper, etc. Processed paper; fiber treatment agents such as natural fibers, synthetic fibers, glass fibers, carbon fibers and metal fibers, fraying preventives, processing agents; building materials such as sealing materials, cement admixtures and waterproofing materials; -It can be used in a wide range as functional products such as sealants for electrical equipment.
- a one-part curable resin composition containing the imidazole compound IM-3, which is liquid at room temperature, as a latent curing agent was prepared by mixing at room temperature with the formulation shown in Table 1 below.
- Example 1 A one-component curable resin composition containing a modified imidazole-type latent curing agent EH-1 in powder form at room temperature as a latent curing agent was blended as shown in Table 1 below, and the same as in Example 1 Prepared by method.
- Example 1 When the one-component curable resin composition obtained in Example 1 and Comparative Example 1 was applied on a glass plate and heated at 80 ° C., it was confirmed that the resin composition was cured.
- Example 1 the penetrability of the one-component curable resin composition obtained in Example 1 and Comparative Example 1 was evaluated by the following method. The evaluation results are shown in Table 1.
- ⁇ Penetration test> A one-component curable resin composition is applied to the end surfaces of two glass plates provided with a gap of 5 ⁇ m or less, and the resin composition penetrates into the gap by capillary action. Heated for 4 hours.
- EP bisphenol A diglycidyl ether (manufactured by ADEKA Corporation EP-4300E: epoxy equivalent 185 g / eq)
- T-1 Trimethylolpropane tris (3-mercaptobutyrate)
- EH-1 Modified imidazole type latent curing agent, average particle size 5 ⁇ m (EH-4346S manufactured by ADEKA Corporation)
- the epoxy resin penetrates into the gap between the two glass plates. Since the latent curing agent did not penetrate, it could not be cured. On the other hand, it was confirmed that the one-component curable resin composition of the present invention can cure the portion that has penetrated into the gap between the two glass plates and is excellent in permeability.
- a one-part curable resin composition containing imidazole compounds IM-3 and IM-7 that are liquid at room temperature as latent curing agents was prepared by mixing at room temperature with the formulation shown in Table 2 below. . The following evaluation was performed about the obtained one-pack type curable resin composition. The results are shown in Table 2.
- ⁇ Quick curing> The curing time (unit: hour) when the curable resin composition was cured at 60 ° C. was measured up to 4 hours. ⁇ : Less than 1 hour ⁇ : 1 hour to less than 2 hours ⁇ : 2 hours to less than 4 hours ⁇ : More than 4 hours
- Example 2 A resin composition containing the compound AM-1 which is liquid at room temperature as a latent curing agent was prepared in the same manner as in Example 2 with the formulation shown in Table 2 below, and a one-part curable resin composition was prepared. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 3.
- T-2 Dipentaerythritol hexakis (3-mercaptopropionate) AM-1: 2,4,6-tris (dimethylaminomethyl) phenol
- a one-component curable resin composition was prepared according to the formulation shown in Table 4 below in the same manner as in Example 2 and evaluated in the same manner as in Example 2. The results are shown in Table 4.
- Example 3 A one-component curable resin composition was prepared according to the formulation shown in Table 5 in the same manner as in Example 2, and evaluated in the same manner as in Example 2. The results are shown in Table 5.
- A-1 Mixture of ethyl phosphite and diethyl phosphite
- A-2 Triethyl borate
- A-3 Tetraethyl titanate
- a curable resin composition cannot be obtained by using only an epoxy resin and a thiol compound.
- a known curing agent such as an amine compound
- rapid curing is possible.
- a storable resin composition could not be obtained.
- the one-component curable resin composition of the present invention using a specific imidazole compound has sufficient rapid curability and storage stability.
- acidic compounds, such as a phosphorous acid compound were used together, it was confirmed that the preservability of the one-component curable resin composition of the present invention is improved.
- the one-component resin composition of the present invention can be used in a wide range of fields such as adhesives, sealants, paints, and the like, and in particular, the curing agent component is also in a liquid state, and is used for narrow space adhesion and impregnation adhesion. In addition, since it does not contain a highly toxic isocyanate compound and is easy to handle, it is extremely useful industrially.
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Abstract
Description
本発明の第2の目的は、前記一液型硬化性樹脂組成物を硬化させてなる、硬化均一性に優れたエポキシ樹脂硬化物を提供することにある。
本発明の第3の目的は、狭所接着や含浸接着にも適した、塗布部分に未硬化部分が生じない、安全な機能性製品を提供することにある。
但し、上記式中の、mは0又は1、nは1~6の整数、R1、R2及びR3はそれぞれ独立して、水素原子又は炭素原子数1~20のアルキル基又は炭素原子数6~20のアリール基、R4は、炭素原子数1~20のアルキレン基、炭素原子数6~20のアリーレン基、又は-CH2CH2COO-で表される基であり、R5は、nが1の場合、炭素原子数1~20のアルキル基又は炭素原子数6~20のアリール基であり、nが2~6の場合、炭素原子数1~20の炭化水素基である。
本発明において、(A)成分として使用されるエポキシ樹脂としては、例えば、ハイドロキノン、レゾルシン、ピロカテコール、フロログルシノールなどの単核多価フェノール化合物のポリグリシジルエーテル化合物;ジヒドロキシナフタレン、ビフェノール、メチレンビスフェノール(ビスフェノールF)、メチレンビス(オルトクレゾール)、エチリデンビスフェノール、イソプロピリデンビスフェノール(ビスフェノールA)、イソプロピリデンビス(オルトクレゾール)、テトラブロモビスフェノールA、1,3-ビス(4-ヒドロキシクミルベンゼン)、1,4-ビス(4-ヒドロキシクミルベンゼン)、1,1,3-トリス(4-ヒドロキシフェニル)ブタン、1,1,2,2-テトラ(4-ヒドロキシフェニル)エタン、チオビスフェノール、スルホニルビスフェノール、オキシビスフェノール、フェノールノボラック、オルソクレゾールノボラック、エチルフェノールノボラック、ブチルフェノールノボラック、オクチルフェノールノボラック、レゾルシンノボラック、テルペンフェノールなどの多核多価フェノール化合物のポリグリジルエーテル化合物;エチレングリコール、プロピレングリコール、ブチレングリコール、ヘキサンジオール、ポリグリコール、チオジグリコール、グリセリン、トリメチロールプロパン、ペンタエリスリトール、ソルビトール、ビスフェノールA-エチレンオキシド付加物などの多価アルコール類のポリグリシジルエーテル;マレイン酸、フマル酸、イタコン酸、コハク酸、グルタル酸、スベリン酸、アジピン酸、アゼライン酸、セバシン酸、ダイマー酸、トリマー酸、フタル酸、イソフタル酸、テレフタル酸、トリメリット酸、トリメシン酸、ピロメリット酸、テトラヒドロフタル酸、ヘキサヒドロフタル酸、エンドメチレンテトラヒドロフタル酸等の脂肪族、芳香族又は脂環族多塩基酸のグリシジルエステル類及びグリシジルメタクリレートの単独重合体又は共重合体;N,N-ジグリシジルアニリン、ビス(4-(N-メチル-N-グリシジルアミノ)フェニル)メタン、ジグリシジルオルトトルイジン等のグリシジルアミノ基を有するエポキシ化合物;ビニルシクロヘキセンジエポキシド、ジシクロペンタンジエンジエポキサイド、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-6-メチルシクロヘキシルメチル-6-メチルシクロヘキサンカルボキシレート、ビス(3,4-エポキシ-6-メチルシクロヘキシルメチル)アジペート等の環状オレフィン化合物のエポキシ化物;エポキシ化ポリブタジエン、エポキシ化スチレン-ブタジエン共重合物等のエポキシ化共役ジエン重合体、トリグリシジルイソシアヌレート等の複素環化合物があげられる。
また、これらのエポキシ樹脂は、末端イソシアネートのプレポリマーによって内部架橋されたものであっても、多価の活性水素化合物(多価フェノール、ポリアミン、カルボニル基含有化合物、ポリリン酸エステル等)で高分子量化したものであってもよい。
本発明におけるR1、R2及びR3は、水素原子、メチル基、エチル基又はフェニル基であることが好ましい。
炭素原子数1~20のアルキレン基としては、メチレン基、エチレン基、プロパン-1,2-ジイル基、プロパン-1,3-ジイル基、ブタン-1,4-ジイル基、ペンタン-1,5-ジイル基、ヘキサン-1,6-ジイル基、オクタン-1,8-ジイル基、2-メチル-ヘキサン-1,6-ジイル基、デカン-1,10-ジイル基、等が挙げられ、炭素原子数6~20のアリーレン基としては、フェニレン基、ナフチレン基等が挙げられる。これらの基は、ハロゲン、ヒドロキシ基等により置換されていてもよい。
本発明におけるR4は、メチレン基又は-CH2CH2COO-で表される基であることが好ましい。
具体的には、メタン、エタン、プロパン、ブタン、イソブタン、ペンタン、イソペンタン、ヘキサン、イソヘキサン、オクタン、2-エチルヘキサン、ノナン、デカン、ウンデカン、ドデカン、トリデカン、テトラデカン、ペンタデカン、ヘキサデカン、ヘプタデカン、オクタデカン、イコサン、ベンゼン、ナフタレン等の炭化水素から、n個の水素原子を除いた残基が挙げられる。これらの基は、ハロゲン、ヒドロキシ基等により置換されていてもよい。
該酸性化合物としては、下記一般式により表される化合物が挙げられる。
M(OH)p(OR)n-p
例えば、亜リン酸化合物の場合、前記式中のMはP、nは3であり、pは1~3である。
また、ボレート化合物又はアルミネート化合物の場合、上記式中のMは、それぞれ、B又はAl、nは3であり、pは0~3である。また、チタネート化合物又はジルコネート化合物の場合、MはTi又はZr、nは4であり、pは0~4である。
本発明においては、これらの1種又は2種以上を混合したものを用いることができる。
また、前記Rは、一部の炭素原子が、酸素原子又は窒素原子により置換されていてもよい。
これらの中でも、入手の容易さ、化合物の安全性又は樹脂組成物の保存安定性の観点から、トリメチルボレート、トリエチルボレート、トリ-n-プロピルボレート、トリイソプロピルボレート及び/又はトリ-n-ブチルボレートが好ましく、トリエチルボレート及び/又はトリイソプロピルボレートを使用することが更に好ましく、トリエチルボレートを使用することが特に好ましい。
更に(D)酸性化合物を使用する場合、該(D)酸性化合物は固体の(C)成分を溶解することができるので、予め(C)成分を(D)成分に溶解してから、(A)及び/又は(B)成分と混合することが好ましい。
また、本発明の一液型硬化性樹脂組成物は狭所に浸透しやすいため、狭所における未硬化部分の発生を抑えることができる。
常温で粉体の変性イミダゾール型潜在性硬化剤EH-1を潜在性硬化剤として含有する一液型硬化性樹脂組成物を、下記の表1に示された配合で、実施例1と同様の方法により調製した。
<浸透性試験>
5μm以下のギャップを設けた2枚のガラス板の端面に、一液型硬化性樹脂組成物を塗布し、毛細管現象でギャップ内に浸透させた後、樹脂組成物が浸透した部分を80℃で4時間加熱した。
T-1:トリメチロールプロパントリス(3-メルカプトブチレート)
EH-1:変性イミダゾール型潜在性硬化剤、平均粒径5μm((株)ADEKA製 EH-4346S)
一方、本発明の一液型硬化性樹脂組成物は、2枚のガラス板のギャップ内に浸透した部分を硬化させることができ、浸透性に優れていることが確認された。
得られた一液型硬化性樹脂組成物について、下記の評価を行った。結果を表2に示す。
各実施例で得られた一液型硬化性樹脂組成物の、調製直後の粘度(v0)及び25℃で10時間保存した後の粘度(v1)を、TV型粘度計(東機産業株式会社製)を用いて測定し、増粘率[((v1/v0)-1)×100(%)]を算出して、以下の基準により評価した。
◎:増粘率10%未満
○:増粘率10%~50%未満
△:増粘率50%~100%未満
×:増粘率100%以上
硬化性樹脂組成物を60℃で硬化させた場合の硬化時間(単位:時間)を、4時間を限度に測定した。
◎:1時間未満
○:1時間~2時間未満
△:2時間~4時間未満
×:4時間以上
常温で液状の化合物AM-1を潜在性硬化剤として含有する樹脂組成物を、下記表2に示された配合により、実施例2と同様にして一液型硬化性樹脂組成物を調製し、実施例1と同様に評価を行った。結果を表3に示す。
下記表5に示された配合により、実施例2と同様にして一液型硬化性樹脂組成物を調製し、実施例2と同様に評価を行った。結果を表5に示す。
これに対し、特定のイミダゾール化合物を使用する本発明の一液型硬化性樹脂組成物は、十分な速硬化性及び保存性を有することが確認された。
更に、亜リン酸化合物等の酸性化合物を併用した場合には、本発明の一液型硬化性樹脂組成物の保存性が向上することが確認された。
Claims (10)
- 少なくとも(A)分子内にエポキシ基を2個以上有する化合物、(B)分子内にチオール基を2個以上有する化合物、及び、(C)下記一般式(I)で表されるイミダゾール化合物が均一に混合されてなり、イソシアネート化合物を含有しない一液型硬化性樹脂組成物であって、前記(C)成分が液状で存在することを特徴とする一液型硬化性樹脂組成物;
但し、上記式中の、mは0又は1、nは1~6の整数、R1、R2及びR3は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基又は炭素原子数6~20のアリール基、R4は、炭素原子数1~20のアルキレン基、炭素原子数6~20のアリーレン基又は-CH2CH2COO-で表される基であり、R5は、nが1の場合、炭素原子数1~20のアルキル基又は炭素原子数6~20のアリール基であり、nが2~6の場合、炭素原子数1~20の炭化水素基である。 - 更に、(D)酸性化合物を含有する、請求項1に記載された一液型硬化性樹脂組成物。
- 前記(D)成分が、亜リン酸、亜リン酸モノエステル、亜リン酸ジエステル、ボレート化合物、チタネート化合物、アルミネート化合物及びジルコネート化合物からなる群から選択される少なくとも1種の酸性化合物である、請求項2に記載された一液型硬化性樹脂組成物。
- 前記(D)成分が、亜リン酸、亜リン酸モノエステル及び亜リン酸ジエステルからなる群から選択される少なくとも1種の亜リン酸化合物である、請求項3に記載された一液型硬化性樹脂組成物。
- 前記(D)成分がボレート化合物である、請求項3に記載された一液型硬化性樹脂組成物。
- 前記(D)成分がチタネート化合物である、請求項3に記載された一液型硬化性樹脂組成物。
- 前記(C)成分のイミダゾール化合物中のイミダゾール基1モルに対する、(D)成分のモル比が0.05~3.5である、請求項2~6の何れかに記載された一液型硬化性樹脂組成物。
- 前記(B)成分が、トリメチロールプロパントリス(3-メルカプトブチレート)、ペンタエリスリトールテトラキス(3-メルカプトブチレート)、ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)、1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、1,3,5-トリス(3-メルカプトプロピル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、1,3,5-トリス(3-メルカプトプロピオニルオキシ)-エチル-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオンからなる群より選ばれる少なくとも1種の化合物である、請求項1~7の何れかに記載された一液型硬化性樹脂組成物。
- 請求項1~8の何れかに記載された一液型硬化性樹脂組成物を加熱してなることを特徴とするエポキシ樹脂硬化物。
- 請求項1~8の何れかに記載された一液型硬化性樹脂組成物を主成分としてなることを特徴とする機能性製品。
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JP2019131676A (ja) * | 2018-01-30 | 2019-08-08 | 株式会社Adeka | エポキシ樹脂組成物、およびその硬化物 |
JP2019157018A (ja) * | 2018-03-15 | 2019-09-19 | 株式会社Adeka | 硬化性樹脂組成物およびこれを用いた接着剤 |
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CN105473633B (zh) | 2018-08-24 |
TW201509978A (zh) | 2015-03-16 |
JPWO2015025505A1 (ja) | 2017-03-02 |
JP6450681B2 (ja) | 2019-01-09 |
EP3037452A4 (en) | 2017-03-15 |
CN105473633A (zh) | 2016-04-06 |
TWI646123B (zh) | 2019-01-01 |
US10144799B2 (en) | 2018-12-04 |
US20160200860A1 (en) | 2016-07-14 |
KR102257362B1 (ko) | 2021-05-26 |
EP3037452A1 (en) | 2016-06-29 |
EP3037452B1 (en) | 2019-04-10 |
KR20160048781A (ko) | 2016-05-04 |
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