WO2015018190A1 - 液晶面板母版及制造和切割方法以及由此得到的液晶面板 - Google Patents

液晶面板母版及制造和切割方法以及由此得到的液晶面板 Download PDF

Info

Publication number
WO2015018190A1
WO2015018190A1 PCT/CN2014/071053 CN2014071053W WO2015018190A1 WO 2015018190 A1 WO2015018190 A1 WO 2015018190A1 CN 2014071053 W CN2014071053 W CN 2014071053W WO 2015018190 A1 WO2015018190 A1 WO 2015018190A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
crystal panel
substrates
substrate
edge
Prior art date
Application number
PCT/CN2014/071053
Other languages
English (en)
French (fr)
Inventor
马涛
宋涛
刘明
赵国栋
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/240,350 priority Critical patent/US9703131B2/en
Publication of WO2015018190A1 publication Critical patent/WO2015018190A1/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening

Definitions

  • Liquid crystal panel master and method of piercing and cutting and liquid crystal panel obtained thereby
  • the present invention relates to the field of liquid crystal panel production, and in particular to a liquid crystal panel master, a method of manufacturing and cutting the same, and a liquid crystal panel obtained thereby. Background technique
  • HVA HVA
  • TFT- LCD, OLED, etc.
  • This technology is mainly used to polymerize the polymer in the liquid crystal under the action of ultraviolet light and voltage, and realize the liquid crystal. Automatic alignment. Therefore, while the ultraviolet light is irradiated onto the liquid crystal panel, a certain voltage needs to be applied to the liquid crystal panel, and both ends of the liquid crystal, and both sides of the TFT and the CF.
  • the current liquid crystal panel is composed of two upper and lower substrates, such as: On the CF and TFT substrates, the glass substrate on the CF side blocks the metal circuit on the TFT side, and the external voltage cannot be added. Therefore, it is necessary to cut off this portion of the CF.
  • the single-sided cutting machine cuts off the edges of both sides of the LCD panel master (designed to ⁇ to the 4 sides), exposing the metal wires that the TFT receives external voltage, so that the external voltage is added.
  • the cutting process is currently generally divided into cutting, lobing, and removal of the end material.
  • the cutting is performed by cutting the surface of the glass to a certain depth.
  • the lobes are based on the cracks to force the cracks to expand the sheet in order to smoothly break the glass ends.
  • the end material is sucked by vacuum suction, the end material is removed from the TFT substrate, and the metal circuit on the TFT side is exposed to apply the external voltage.
  • the reason may be as follows. Firstly, the separation end material is one side of the glass, and the opposite side is not separated. Generally, the surface of the end material and the opposite glass are very flat. After the force is applied, the two pieces of glass are tight. When they are put together, the air between the two pieces of glass is driven away to form a vacuum environment.
  • An object of the present invention is to provide a liquid crystal panel master, a liquid crystal panel, a method of manufacturing the same, and a cutting method in view of the problems in the prior art described above. Solved the HVA-sub-cutting process, the TFT and CF edges form a seamless fit due to the smooth Glass surface, resulting in a vacuum environment, so that the current prior art and process technology can not separate the cut TFT (or CF) residue. 13 ⁇ 4] question.
  • a liquid crystal panel master comprising two substrates bonded to each other, wherein protrusions are distributed on edge residue regions other than a display area on one or two of the substrates, so that the two substrates are bonded together The two pieces of substrate edge residue area cannot be seamlessly bonded.
  • the protrusions are a plurality of sets of convex strips juxtaposed and spaced apart from each other.
  • the raised strips are continuous raised strips or discontinuous raised strips.
  • the height of the protrusion is 0.1 1.3 ⁇ m.
  • the height of the protrusion is 0.13 ⁇ .
  • liquid crystal panel mother rice according to any one of the items 1 to 5, wherein the projections are distributed on both substrates;
  • the pattern shapes and positions distributed on the sheet substrate are correspondingly the same positions.
  • a polyimide can be applied to an edge residue region on at least one of the two substrates using a roll coater (Coater) or by an ink jet machine (in the case of polyimide)
  • An inkjet method is applied to the edge residue region on at least one of the two substrates to form a raised strip in the region.
  • a liquid crystal panel wherein the display area of at least one of the substrates of the panel is distributed with the protrusion according to any one of items I) to (5).
  • the main core principle may be as follows, but the following reasons do not constitute a limitation of the present invention - the polyimide film (film, also referred to as an alignment film) is inverted, and the PL film is pre-coated on the TFT and CF substrate to perform liquid crystal on the substrate. After the pre-aligned alignment liquid is solidified, in the prior art, the Pi film is formed only in the substrate display region, and is not formed in the edge residue region of the substrate.
  • the present invention changes the formulation and process of the PI coating.
  • PI line coating is added to the edge region outside the substrate display region, and the alignment liquid in the display region is simultaneously cured. . This can be achieved by coating the edge residue areas of both substrates or by coating one of the substrates.
  • the height of the PI film is set at 0, lim ⁇ i.3um, and the spacing between the two substrates in the liquid crystal panel display is about .5i to ⁇ 4.0 ⁇ , if only one of the substrates is coated with PI lines. , then it can effectively prevent the smooth contact of the two substrates outside the display area, so that the vacuum seamless bonding can not be formed, and the residual material separation requirement in the manufacturing process can be satisfied; if both sides of the two substrates outside the display area are on both sides
  • the PI line group can also play a supporting role at the same time, making the cutting process more convenient and convenient.
  • the bumps of the present invention may also be constructed of other materials such as spacers or photoresists.
  • spacer When the spacer is used, the gap can be directly spread on the edge residue region, and when the photoresist is used, the photoresist is first coated, and then the residual energy is obtained after the exposure process. Start.
  • the method of the invention is simple and easy to solve, and solves the problem of difficulty in cutting due to seamless bonding between the substrates after the substrate is butted.
  • FIG. 1 is a schematic cross-sectional structural view of a liquid crystal panel master formed by the prior art before cutting the edge of the village.
  • FIG. 2 is a schematic cross-sectional view of a liquid crystal panel master formed by the method of the present invention before cutting edge residues.
  • Figures 3a and 3b are schematic illustrations of one of the substrates in the liquid crystal master formed by the prior art and the method of the present invention, respectively.
  • FIG. 4 is a schematic illustration of one of the substrates in a liquid crystal master formed in accordance with a preferred embodiment of the method of the present invention. Pay the map mark:
  • First substrate 2-second substrate, 3-first edge residue region, 4-first seal, 6-first edge cut line, 7-display area;
  • the liquid crystal panel master formed by the method of this embodiment is shown in Figs. 2, 3b and 4.
  • the liquid crystal panel master of the present invention comprises two substrates, which are a third substrate ⁇ and a fourth substrate 2 ′, respectively, the second substrate ⁇ is a thin film transistor (TFT) substrate, and a driving circuit is mainly disposed thereon.
  • the fourth substrate 2' is generally a color film (CF) substrate, and the liquid crystal panel further includes a second edge residue region: it is in the fourth substrate 2', that is, an edge region of the CF substrate, and an edge of the TFT substrate a region fit, wherein the four edge residue regions and the edge region of the TFT substrate are provided with: three raised strips 5', so that the two substrate edge residue regions cannot be seamlessly attached As shown in FIG.
  • the raised strips 5' may be arranged in a plurality of sets in the color film substrate row, and each set may be composed of three or more raised strips which are parallel to each other. Further, as shown in FIG. 4, for the entire liquid crystal panel master, the raised strips may be disposed at the edges of the periphery of the liquid crystal panel master or at several edges thereof, so that the The edges of the raised strips do not fit snugly, which facilitates the next cut removal.
  • the strip may be disposed by applying a polyimide to at least one of the two substrates in a margin region of the third substrate and the fourth substrate 2' using a roller printer (Coater).
  • An edge residue region on the substrate or an inkjet coating (Inkjet) is applied to the edge residue region on at least one of the two substrates by inkjet to form a bump in the region
  • the strip 5' after the PI film is cured, in the process of the liquid crystal panel master Ceil into a box (two substrates butt joints), the edges of the two substrate edges cannot be seamlessly bonded.
  • a CF substrate is cracked on a substrate on which the liquid crystal panel master is not provided with a circuit, that is, a CF substrate, and then a force is applied to the crack.
  • the crack is enlarged, and finally the edge residue region of the CF substrate is cracked with the display region of the CF substrate, and finally the cracked residue is broken.
  • the material area is removed, and the liquid crystal panel master from which the circuit is exposed is obtained and transported to the next step.
  • the PI film raised strip 5' remains on the edge residue on the substrate of the liquid crystal panel obtained by cutting the above liquid crystal panel master.
  • the liquid crystal panel master formed by the method of this embodiment is shown in Figs. 2, 3b and 4.
  • the liquid crystal panel master of the present invention comprises two substrates, respectively: a third substrate ⁇ and a fourth substrate 2 ′, wherein the second substrate ⁇ is generally a thin film transistor (TFT) substrate, and a driving circuit is mainly disposed thereon.
  • the fourth substrate 2 ′ is generally a color film (CF) substrate.
  • the liquid crystal panel further includes a second edge residue region 3 ′, which is located on the fourth substrate 2 ′, that is, an edge region of the CF substrate, and the TFT substrate.
  • the edge regions are adhered to each other, wherein a gap is formed between the four edge residue regions and the edge regions of the TFT substrate as protrusions, so that the two substrate edge residual regions cannot be seamlessly adhered.
  • the position of its setting is the same as that of the embodiment i.
  • a CF substrate is cracked on a substrate on which the liquid crystal panel master is not provided with a circuit, that is, a CF substrate, and then a force is applied to the crack.
  • the crack is enlarged, and finally the edge residue region of the CF substrate is cracked with the display region of the CF substrate, and finally the residue region of the crack is removed to obtain a liquid crystal panel master in which the circuit is exposed, and is transported to the next step.
  • the edge residue on the substrate of the liquid crystal panel obtained by cutting the liquid crystal panel master described above still has the spacer protrusion remaining.
  • the method for spreading the spacer of the embodiment is different from the method of applying the PI film in the first embodiment, because the spreading point is not well controlled, so the quality of the panel display effect is unstable relative to the dry embodiment, and the cost is also The method relative to Example 1 is higher.
  • the liquid crystal panel master formed by the method of this embodiment is shown in Figs. 2, 3b and 4.
  • the liquid crystal panel master of the present invention comprises two ⁇ substrates, which are respectively a second substrate ⁇ and a fourth substrate 2 ′, wherein the third substrate ⁇ is generally a thin film transistor (TFT) substrate, and a driving circuit is mainly disposed thereon.
  • the fourth substrate 2' is generally a color film (CF) substrate, and the liquid crystal panel further includes a second edge residue region 3', which is located on the fourth substrate, that is, the edge region of the CF substrate, and the edge region of the TFT substrate.
  • the bonding is performed, wherein a photoresist protrusion is disposed between the four edge residue regions and the edge region of the TFT substrate.
  • the location is set to be the same as the implementation ⁇ 1.
  • the strip is disposed in an edge residual region on at least one of the two substrates by using a photoresist in the edge region of the TFT substrate and the CF substrate, and then using an exposure technique.
  • the substrate coated with the photoresist is subjected to an exposure treatment to form a convex strip shape 5%, and then in the process of forming a liquid crystal panel master Cdl into a box (two substrates butt joints), the edges of the two substrates are disabled The material area cannot be seamlessly fitted.
  • a CF substrate is cracked on a substrate on which the liquid crystal panel master is not provided with a circuit, that is, a CF substrate, and then a force is applied to the crack.
  • the crack is enlarged, and finally the edge residue region of the CF substrate is cleaved from the display region of the CF substrate, and finally the cracked residue region is removed to obtain a liquid crystal panel master in which the circuit is exposed, and is transported to the next step.
  • the edge residue on the substrate of the liquid crystal panel obtained by cutting the liquid crystal panel master described above remains with the photoresist bump strip.
  • the photoresist is provided as a bump, exposure processing is required, and the procedure is more complicated than the P] coating method in the first embodiment, and the cost is higher.

Abstract

一种液晶面板母版的制造方法，包括将能形成凸起的材料设置于两片基板（1'，2'）的至少一个基板上的边缘残材区域（3'），然后将两片基板（1'，2'）贴合，使得两片基板（1'，2'）边缘残材区域不能无缝贴合。还提供了一种液晶面板的切割方法以及一种由液晶母版得到的液晶面板。

Description

液晶面板母版及刺造和切割方法以及由此得到的液晶面板 技术领域
本发明涉及液晶面板生产领域， 具体涉及一种液晶面板母版及制造和切割方法以及 由此得到的液晶面板。 背景技术
HVA (PSVA) 是显示面板行业（主要有 TFT- :LCD、 OLED等） 目前主流的技术之一， 该技术主要是利 液晶中的高分子在紫外光和电压共同作用下聚合，并对液晶实现自动配 向。 因此在紫外光照射液晶面板的同时， 需要将一定的电压加到液晶面板上， 及液晶的两 端， 及 TFT、 CF两侧。
为了实现这一目的， 目前通常做法是在 TFT基板靠近边缘处做出一些金属电路， 通 过这些金属线路将外部电压输入到液晶面板,但是目前的液晶面板是由上下两片基板组成 的， 如： CF和 TFT基板， CF侧的玻璃基板会挡住 TFT侧的金属电路， 外部电压无法加 上， 因此需要将这部分的 CF切除。
目前业界主要使用单面切割机实现这部分的切除， 其方法如下所述：
单面切割机将液晶面板母版两侧 （设计决定， 〗到4边都有可能） 的边缘切除， 露出 TFT 接受外部电压的金属线， 以便外部电压加入。 切除过程目前一般分成切割、 裂片、 移除端材 3步骤完成，切割是将玻璃表面划出一定深度的裂痕。裂片是在裂痕的基础上利 用力的作用将裂痕扩大片过程中为了顺利将玻璃端材裂开。然后利用真空吸附将端材吸^ 住， 将端材从 TFT基板上移除， 使 TFT侧的金属电路露出， 以便施加夕卜部电压。
在移除端材的过程中存在端材难以从 TFT基板分离的情况， 且需要分离的端材的宽 度越宽， 分离越难进行， 及分离失败率上升。 经过研究， 其原因可能如下， 首先需要分离 端材是其中一面玻璃，其对面是不需分离的，一般情况下端材及其对面玻璃的表面都非常 平整， 在受力后， 两片玻璃紧紧贴合在一起， 两片玻璃之间的空气被赶走， 形成一个真空 的环境， 在外部大气压的作用下， 我们将其中一面玻璃分离就变得困难很多， 且需要分离 的端材的宽度越宽， 分离越难进行， 及分离失败率上 。 发明内容 本发明的目的在于针对上述现有技术中存在的问题，提供了一种液晶面板母版、液晶 面板及其制造方法和切割方法。 解决了 HVA—次切割过程中， TFT与 CF边缘由于光滑 Glass表面形成无缝贴合， 造成真空环境， 从而使得目前现有技术和制程工艺无法使切割 后的 TFT (或者 CF) 残材分离开的 1¾]题。
本发明提供了如下技术方案：
1 ) 一种液晶面板母版， 包括两个相互贴合的基板， 在其中一片或两片基板上的显示 区域以外的边缘残材区域上分布有凸起，使得所述两片基板贴合时，所述两片基材边缘残 材区域不能无缝贴合。
2) 在本发明的第 1 ) 项所述的液晶面板母版的一个优选实施方式中， 所述凸起为多 组并列且相互间隔的凸起条带。
3 ) 在本发明的第 2) 项所述的液晶面板母版的一个优选实施方式中， 所述凸起的条 带为连续的凸起条带或不连续的凸起条带。
4) 在本发明的第 2) 项所述的液晶面板母版的一个优选实施方式中， 所述凸起的高 度为 0.1 1.3μηι。
5 ) 在本发明的第 2) 项所述的液晶面板母饭的一个优选实施方式中， 所述凸起的高 度为 0.13μίη。
6) 在本发明的第 1 ) 项-第 5 ) 项中任一项所述的液晶面板母饭的一个优选实施方式 中， 当在两； t基板上都分布所述凸起时，在两片基板上分布的图案形状以及位置为对应的 相同位置。
7) 在本发明的第 1 ) 项-第 6) 项中任一项所述的液晶面板母版的一个优选实施方式 中， 所述凸起由聚戬亚胺薄膜构成。 在本发明中， 可使用滚筒印刷机 （Coater) 将聚酰亚 胺涂布于所述两片基板的至少一个基板上的边缘残材区域或通过喷墨机 （Μ ϋ 将聚酰 亚胺以喷墨的方式涂布于所述两 i†基板的至少一个基板上的边缘残材区域以在该区域形 成凸起条带。
8) 一种第 1 ) 项-第 7) 项中任一项所述的液晶面板母版的制造方法， 包括将能形成 凸起的材料设置于两片基板的至少一个基板上的边缘残 区域， 然后将所述两片基板贴 合， 使得所述两片基材边缘残材区域不能无缝贴合。
9) 一种第 1 ) 项-第 7) 项中任一项所述的液晶面板母版的切割方法， 包括将在所述 液晶面板母版的没有布设电路的基板上的显示区域与边缘残材区域之间进行切割从而在 被切割基板上产生裂痕，施加作用力与所述裂痕使得裂痕扩大，使得残材区域与显示区域 裂开，将所述裂开的残材区域从所述液晶面板上移除，使得液晶面板母饭上的电路露出己 进行液晶面板生产下一步工序。
10 )—种液晶面板，所述面板的至少一片基板的显示区域以夕卜的边缘残材区分布有第 I ) -第 5 ) 项中任一项所述的凸起。
使 ]¾本发明的方法， 在将两面基板对接使得液晶面板母版成盒时， 在其边缘（残材区 域）无法形成真空无缝贴合， 而容易将边缘的残材区域切割去除， 其主要核心原理可能 如下， 但以下理由并不构成对本发明的限定- 以聚酰亚胺薄膜 （ 膜， 又称配向膜） 为倒， PL膜是 预先涂布在 TFT和 CF基板 上以对液晶进行预配向的配向液固化后形成的， 在原有技术中 Pi膜只成形在基板显示区 内， 而不形成在所述基板的边缘残材区域， 本发明通过改变 PI涂布的配方和工艺， 在对 TFT基板和 CF基板进行 PI涂布过程中， 除了在显示区域内的正常 PI涂布外， 在基板显 示区外的边缘区域也追加 PI线条涂布， 再和显示区域內的配向液同时固化。 可在两片基 板的边缘残材区域皆进行涂布， 或者其中一个基板上涂布， 都能实现该功能。
由于 PI膜厚高度设置在 0, lim^i .3um左右， 而液晶面板显示器中所述两片基板贴合 后的间距在 i .5i皿〜 4.0瞧左右， 如果只有其中一片基板涂布 PI线条， 那么可以有效地防 止显示区外的两基板光面接触，从而无法形成真空无缝贴合，就可以满足制造工序中的残 材分离要求； 如果在显示区外的两片基板的边缘两边均设置 PI线组， 则 PI线组同时可以 起到一个支撑作用， 使得一次切割工艺更为筒单便捷。
本发明的凸起还可以由间隙子或光阻等其他材料构成。使用间隙子时可将所述间隙子 诈为凸起直接撒布于所述边缘残材区域， 而使用光阻时， 则需要首先涂布光阻剂， 然后经 过曝光处理后残能得到所述凸起。
本发明的有益效果：
本发明的方法简单易行， 解决了现有技术中， 由于基板对接后基板之间无缝贴合而 造成的切割困难的问题。 t图说明
图 i为现有技术形成的液晶面板母版切割边缘残村之前的剖面结构示意图。
图 2为本发明的方法形成的液晶面板母版在切割边缘残材之前的剖面结构示意图。 图 3a和图 3b分别为现有技术和本发明的方法形成的液晶母版中的其中一个基板的示 意图。
图 4 为本发明的方法的一个优选实施方式形成的液晶母版中的其中一个基板的示意 图。 付图标记：
第一基板、 2-第二基板、 3-第一边缘残材区域、 4-第一密封件、 6-第一边缘切割线、 7-显示区域；
Γ-第―三基板、 2'-第四基板、 3'-第二边缘残材区域、 4'-第二密封件、 5'-凸起条带、 6'- 第二边缘切割线、 7'-显示区域。 具体实施方式
以下结合^图和实施例对本发明进行详细所说明，但需要理解的是本发明的范围并不 限于以下实施倒，在不脱离本发明的范围和精神的情况下， 可以对其进行各种改进并且可 以 等效物替换其中的部件。尤其是， 只要不存在结构冲突， 各个实施例中所提到的各项 技术特征均可以任意方式组合起来。
实施例 1
本实施例的方法形成的液晶面板母版如图 2、 3b和 4所示。
本发明的液晶面板母版包括两片基板， 分别为第三基板 Γ以及第四基板 2' , 所述第 Ξ:基板 Γ—般为薄膜晶体管（TFT)基板， 其上主要布设有驱动电路等， 所述第四基板 2' 一般为彩膜（CF)基板， 所述液晶面板还包括第二边缘残材区域： 其处于第四基板 2' , 即 CF基板的边缘区域， 与 TFT基板的边缘区域贴合 ·，其中所述四个边缘残材区域与 TFT 基板的边缘区域之间设有:三条凸起条带 5' , 使得所述两; t基材边缘残材区域不能无缝贴 另外， 如图 3b所示， 所述凸起条带 5'可在彩膜基板行设置多组， 每组可 ώ-三条以上 的相互间隔平行的凸起条带组成。进一歩如图 4所示， 对于整个液晶面板母版而言， 可在 所述液晶面板母版的四周的边缘或在其中的几个边缘设置所述凸起条带，以使得所述设有 凸起条带的边缘不能无缝贴合， 从而有利于下一步的切割移除。
所述条带的设置方法， 可为在第三基板 Γ和第四基板 2'边缘残材区域中， 使用滚筒 印刷机 （Coater) 将聚酰亚胺涂布于所述两片基板的至少一个基板上的边缘残材区域或通 过喷墨机 （Inkjet) 将聚酰亚胺以喷墨的方式涂布于所述两片基板的至少一个基板上的边 缘残材区域以在该区域形成凸起条带 5' , 待 PI膜固化后， 在液晶面板母版 Ceil成盒 （两 片基板对接贴合） 制程中， 使得所述两片基材边缘残村区域不能无缝贴合。
在上述液晶面板母版在切割时， 首先在所述液晶面板母版的没有布设电路的基板上， 即 CF基板上使用切割方法使 CF基板产生裂痕， 然后对所述裂痕施加作用力， 使所述裂 痕扩大， 最后使得 CF基板的边缘残材区域与 CF基板的显示区域裂开， 最后将裂开的残 材区域移除， 得到露出了电路的液晶面板母版， 输送至下一步工序。
由上述的液晶面板母版切割后得到的液晶面板的基板上的边缘残材去还残留有所述 的 PI膜凸起条带 5'。
实施倒 2
本实施例的方法形成的液晶面板母版如图 2、 3b和 4所示。
本发明的液晶面板母版包括两片基板， 分别为第：三基板 Γ以及第四基板 2' , 所述第 ≡基板 Γ一般为薄膜晶体管（TFT)基板， 其上主要布设有驱动电路等， 所述第四基板 2' 一般为彩膜（CF)基板.， 所述液晶面板还包括第二边缘残材区域 3'， 其处于第四基板 2'， 即 CF基板的边缘区域，与 TFT基板的边缘区域贴合，其中所述四个边缘残材区域与 TFT 基板的边缘区域之间撒布间隙子作为凸起， 使得所述两片基材边缘残村区域不能无缝贴 合。 其设置的位置与实施例 i相同。
在上述液晶面板母版在切割时， 首先在所述液晶面板母版的没有布设电路的基板上， 即 CF基板上使用切割方法使 CF基板产生裂痕， 然后对所述裂痕施加作用力， 使所述裂 痕扩大， 最后使得 CF基板的边缘残材区域与 CF基板的显示区域裂开， 最后将裂幵的残 材区域移除， 得到露出了电路的液晶面板母版， 输送至下一歩工序。
由上述的液晶面板母版切割后得到的液晶面板的基板上的边缘残材去还残留有所述 的间隙子凸起》
本实施例的撒布间隙子的方法相对于实施倒 I中的涂布 PI膜法来说， 由于撒布落点 不好控制， 因此面板显示效果质量相对干实施例中的不稳定， 而旦成本也相对实施例 1 的方法较高。
实施倒 3
本实施例的方法形成的液晶面板母版如图 2、 3b和 4所示。
本发明的液晶面板母版包括两 i†基板， 分别为第≡基板 Γ以及第四基板 2'， 所述第 三基板 Γ一般为薄膜晶体管（TFT)基板， 其上主要布设有驱动电路等， 所述第四基板 2' 一般为彩膜 （CF) 基板， 所述液晶面板还包括第二边缘残材区域 3' , 其处于第四基板， 即 CF基板的边缘区域， 与 TFT基板的边缘区域贴合，其中所述四个边缘残材区域与 TFT 基板的边缘区域之间设置光阻凸起。 其设置的位置与实施^ 1相同。
所述条带的设置方法，可为在 TFT基板和 CF基板边缘残 区域中，使用光阻剂涂布 于所述两片基板的至少一个基板上的边缘残材区域，然后利用曝光技术在所述涂覆有光阻 剂的基板上进行曝光处理以形成凸起带状 5% 然后在液晶面板母版 Cdl成盒 （两片基板 对接贴合） 制程中， 使得所述两片基材边缘残材区域不能无缝贴合。 在上述液晶面板母版在切割时， 首先在所述液晶面板母版的没有布设电路的基板上， 即 CF基板上使用切割方法使 CF基板产生裂痕， 然后对所述裂痕施加作用力， 使所述裂 痕扩大， 最后使得 CF基板的边缘残材区域与 CF基板的显示区域裂开， 最后将裂开的残 材区域移除， 得到露出了电路的液晶面板母版， 输送至下一步工序。
由上述的液晶面板母版切割后得到的液晶面板的基板上的边缘残材去还残留有所述 的光阻凸起条带。
本实施例由于设置光阻作为凸起， 需要进行曝光处理， 相对于实施例 1中的 P】涂膜 法来说不仅程序更复杂， 而 ϋ成本更高。

Claims

权利要求书
1 . 一种液晶面板母版的制造方法， 包括将能形成凸起的材料设置于所述两片基板的 至少一个基板上的边缘残材区域，然后将所述两片基板贴合，使得所述两片基材边缘残材 区域不能无缝贴合。
2. 根据权利要求 1所述的方法， 其中， 所述凸起为多组并列旦相互间隔的凸起条带。
3. 根据权利要求 2所述的方法， 其中， 所述凸起条带为连续的凸起条带或不连续的 凸起条带。
4. 根据权利要求 2所述的方法， 其中， 所述凸起的高度为 0, 1-1.3μι ι。
5. 根据权利要求 2所述的方法， 其中， 所述凸起的高度为 0.13μηι。
6. 根据权利要求 1所述的方法， 其中， 当在所述两片基板上都分布所述凸起时， 在 两 i†基板上分布的凸起的图案形状相同，且两片基板上分布的凸起的位置为对应的相同位
7. 根据权利要求 1所述的方法， 其中， 所述凸起由聚酰亚胺薄膜构成。
8. 一种根据权利要求 1所述的方法制备得到的液晶面板母版的切割方法， 包括将在 所述液晶面板母版的没有布设电路的基板上的显示区域与边缘残材区域之间进行切割从 而在被切割基板上产生裂痕，施加作用力与所述裂痕使得裂痕扩大，使得残材区域与现实 区域裂开，将所述裂开的残材区域从所述液晶面板上移除，使得液晶面板上的电路露出已 进行液晶面板母版生产下一步工序。
9. 一种液晶面板， 所述面板包括两个相互贴合的基板， 在其中一片或两片基板上的 显示区域以外的边缘残材区域上分布有凸起，使得所述两片基板贴合时，所述两片基材边 缘残材区域不能无缝贴合。
10. 根据权利要求 9所述的液晶面板， 其中， 所述凸起为多组并列且相互间隔的凸起 条带。
1 1 . 根据权利要求 10所述的液晶面板， 其中， 所述凸起条带为连续的凸起条带或不 连续的凸起条带。
12. 根据权利要求 10所述的液晶面板， 其中， 所述凸起的高度为 0,1- 1。3μηι。
13. 根据权利要求 10所述的液晶面板， 其中， 所述凸起的高度为 0.13μπι。
14.根据权利要求 9所述的液晶面板，其中，当在所述两片基板上都分布所述凸起 在两片基板上分布的凸起的图案形状相同，且两片基板上分布的凸起的位置为对应的相同 位置。
15. 根据权利要求 9所述的液晶面板， 其中， 所述凸起由聚酰亚胺薄膜构成。
PCT/CN2014/071053 2013-08-09 2014-01-22 液晶面板母版及制造和切割方法以及由此得到的液晶面板 WO2015018190A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/240,350 US9703131B2 (en) 2013-08-09 2014-01-22 Liquid crystal motherboard, manufacturing and cutting methods thereof, and liquid crystal panel obtained thereby

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310347029.2 2013-08-09
CN2013103470292A CN103439820A (zh) 2013-08-09 2013-08-09 液晶面板母版及制造和切割方法以及由此得到的液晶面板

Publications (1)

Publication Number Publication Date
WO2015018190A1 true WO2015018190A1 (zh) 2015-02-12

Family

ID=49693522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/071053 WO2015018190A1 (zh) 2013-08-09 2014-01-22 液晶面板母版及制造和切割方法以及由此得到的液晶面板

Country Status (3)

Country Link
US (1) US9703131B2 (zh)
CN (1) CN103439820A (zh)
WO (1) WO2015018190A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9703131B2 (en) 2013-08-09 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal motherboard, manufacturing and cutting methods thereof, and liquid crystal panel obtained thereby

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104289342A (zh) * 2014-10-20 2015-01-21 深圳市华星光电技术有限公司 聚酰亚胺涂布方法及装置
CN105538521A (zh) * 2016-01-12 2016-05-04 田宇科技股份有限公司 硬脆材料基板的切割方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031806A (ja) * 2000-07-14 2002-01-31 Casio Comput Co Ltd 液晶表示素子の製造方法
CN1624548A (zh) * 2003-12-01 2005-06-08 Lg.菲利浦Lcd株式会社 薄膜晶体管上滤色器型液晶显示器件及其制造方法
JP2008015383A (ja) * 2006-07-07 2008-01-24 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
CN102749731A (zh) * 2011-04-22 2012-10-24 三菱电机株式会社 液晶显示装置及其制造方法
CN102929024A (zh) * 2012-11-05 2013-02-13 深圳市华星光电技术有限公司 液晶面板母板及其制造方法
CN103439820A (zh) * 2013-08-09 2013-12-11 深圳市华星光电技术有限公司 液晶面板母版及制造和切割方法以及由此得到的液晶面板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081643B2 (ja) * 2001-08-01 2008-04-30 株式会社日立製作所 液晶表示装置
TW565727B (en) * 2002-10-24 2003-12-11 Toppoly Optoelectronics Corp Dual-layer glass substrate structure capable of preventing internal contamination in a liquid crystal panel process and its manufacturing method
TWI345652B (en) * 2006-12-01 2011-07-21 Chimei Innolux Corp Liquid crystal panel and method of manufacturing the same
CN101641634B (zh) * 2007-03-28 2011-04-13 夏普株式会社 带微透镜阵列的液晶显示面板及其制造方法
CN101424826A (zh) * 2007-11-02 2009-05-06 上海广电Nec液晶显示器有限公司 液晶显示装置
JP5299873B2 (ja) * 2010-11-30 2013-09-25 株式会社ジャパンディスプレイ 液晶表示パネル

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031806A (ja) * 2000-07-14 2002-01-31 Casio Comput Co Ltd 液晶表示素子の製造方法
CN1624548A (zh) * 2003-12-01 2005-06-08 Lg.菲利浦Lcd株式会社 薄膜晶体管上滤色器型液晶显示器件及其制造方法
JP2008015383A (ja) * 2006-07-07 2008-01-24 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
CN102749731A (zh) * 2011-04-22 2012-10-24 三菱电机株式会社 液晶显示装置及其制造方法
CN102929024A (zh) * 2012-11-05 2013-02-13 深圳市华星光电技术有限公司 液晶面板母板及其制造方法
CN103439820A (zh) * 2013-08-09 2013-12-11 深圳市华星光电技术有限公司 液晶面板母版及制造和切割方法以及由此得到的液晶面板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9703131B2 (en) 2013-08-09 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal motherboard, manufacturing and cutting methods thereof, and liquid crystal panel obtained thereby

Also Published As

Publication number Publication date
US20150146154A1 (en) 2015-05-28
CN103439820A (zh) 2013-12-11
US9703131B2 (en) 2017-07-11

Similar Documents

Publication Publication Date Title
KR101543932B1 (ko) 모기판 배향막의 제조 방법, 및 전사 인쇄판 및 배향액
WO2015113367A1 (zh) 显示面板的制作方法及转印版
TW200618303A (en) Thin film etching method and method of fabricating liquid crystal display device using the same
WO2015018190A1 (zh) 液晶面板母版及制造和切割方法以及由此得到的液晶面板
WO2020019679A1 (zh) 阵列基板及其制备方法、显示面板
JP2013104990A5 (zh)
CN103412430A (zh) 一种待切割的液晶面板母板及其制造方法
CN108333819A (zh) 显示面板及其制造方法
JP4685256B2 (ja) プラスチック液晶パネルの製造方法
WO2016024446A1 (ja) フレキソ印刷版の製造方法、および液晶表示素子の製造方法
TWI439983B (zh) 用於軟性顯示器之軟板製作方法
JP2013022902A (ja) ガラスフィルム積層体及びその製造方法
TWI471278B (zh) Substrate break method
JP2007206690A (ja) 表示装置の製造装置及び表示装置の製造方法
TW201022773A (en) Liquid crystal display and method for forming alignment film
JP2007178809A (ja) 液晶表示装置
JP4685853B2 (ja) プラスチック液晶パネルの製造方法
JP6237623B2 (ja) ガラスフィルム積層体
CN203317849U (zh) 一种贴膜用的垫板
JP2009025596A (ja) 液晶表示パネルおよび液晶表示パネルの製造方法
JP2008003388A (ja) フラットパネルディスプレイおよびその製造方法
CN104015467A (zh) 一种贴膜用的垫板及其使用方法
JP2002358024A (ja) 表示装置の製造方法及び液晶表示装置
JP2021045854A (ja) パターン形成方法
JP2005115037A (ja) 光学部材及びそれを備える液晶表示装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14240350

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14834234

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14834234

Country of ref document: EP

Kind code of ref document: A1