201237824 六、發明說明： 【發明所屬之技術領域】 於一係相關於一種軟性顯示器的製造方法，尤相關 '種軟性顯不器的之軟板製作方法。 【先前技術】 =十年來’由於影像顯示技術的突破性進步與蓬勃發 展，傳統的陰極射線顯示器（CRT，〜tube)已絕大 部分被所謂的面板顯示器（panel display)所取代，其係歸因 於面板顯示ϋ具有體積小、厚度薄、重量輕、低能耗等優 :，故成為現今顯示器之主流。目前一般常見的面板顯示 ，有薄膜電晶體液晶顯不器或是電漿原理發光之面板顯示 器。基於對科技發展的需求，目前有商品需求具有軟性基 板的顯示器。 而上述軟性基板的顯示器的製作過程需要軟板剝離 (debonding)製程。圖i繪示一種習知的軟性顯示器（1〇)的 軟板剝離製程之一種雷射軟板剝離（EPLaR，Electr〇nics⑽ Plastic by Laser Release)方法。主要是先在玻璃基板（12) 上塗上一層聚醯亞胺（PI，P〇lyimide)薄膜，以形成一軟板 (16)。而後在該軟板（16)上形成一薄膜電晶體層（18)。在全 部製程完畢後，利用雷射射入玻璃基板（12)與軟板（16)的介 面（14) ’利用物理特性高溫產生氣泡使其玻璃基板（12)與軟 板（16)剝離。 然而，上述利用雷射射入玻璃基板（12)與軟板（16)的介 面（14)之方法需要購置額外的雷射設備，因而增加了生產 201237824 的成本。 ； 1 2繪示另一種習知的軟性顯示器⑽的軟板剝離方 -法。先在玻璃基板（22)上塗上—剝離層（祖，如如 後在該_層上塗上—層聚醯亞胺薄膜，以 形成-軟板（26)。之後在軟板⑽之上形成一薄膜電晶體層 (28)。在形成薄膜電晶體層（28)之後，再利用機械切割沿切 割線㈣切割軟板（26)。此時，在軟板（26)和玻璃基板⑼ 之間僅隔者剝離層(24)，因為剝離層(24)具有黏著力，所以 需要施加大於剝離層（24)的黏著力之外力，將軟板（26)連同 薄膜電晶體層（28)從玻璃基板（22)上撕下。 然而，因為要施加外力’使得在玻璃基板（22)上形成 的薄膜電晶體層（28)容易受到損害。 以上兩種軟板製作方法皆是利用塗佈溶液式（c〇ating Solution Type)的聚醯亞胺來製作軟板，較不適用於薄膜式 (Film Type)的聚醯亞胺軟板。因此，需要上述兩種聚醯亞 胺軟板都適用，且生產成本較低，而不會損害在玻璃基板 上形成的薄膜電晶體層的軟板製作方法。 【發明内容】 因此，本發明之目的即在於提供對塗佈溶液式和薄膜 式聚醯亞胺皆能適用的軟板製作方法。 一種用於軟性顯示器之軟板製作方法，包括下列步 驟.於一基板上塗佈一或多光阻；在該光阻實施一微影製 程形成一或多光阻圖案；在該一或多光阻圖案外圍形成一 或多黏膠框，將一或多軟板貼附於該基板上的該一或多黏 201237824 膠樞上·太— ，在戎一或多軟板上形成一或多薄膜電晶體層；製 乍或夕7^件陣列背板、配向 '框膠印刷、液晶滴: 衣，>σ遠一或多黏膠框内側對該一或多軟板進行機械 刀。】，以除去具有該一或多黏膠框之部分；將該一或 阻圖案浸泡至一剝膜液中，以去除該一或多光阻圖案 透過外力將該一或多軟板自該基板剝離。 β本發明尚有下列優點：本發明所使用的材料均為目前 已有的材料，不需要另外開發。而本發明使玻璃美 反可以回收繼續使用，符合目前市場上資源回收的要求t 卜本發明在製程中所需施加的外力極小，故能防止在 人板上形成的元件受到外力破壞。 【實施方式】 提供: = = 同的實施方式進行說明。下列描述係 ..一-特疋的鈀仃細節，俾使閱者徹底瞭解此些實施 =之貫行方式。然該領域之熟習技藝者須瞭解本發明亦可 = 具備這些細節之條件下實行。此外，文中不會對二 結構或功能或是作細節描述，以避免各種實施； 曰1不必要相關描述之混 廣義的人搜, 以下鈾述中使用之術語將以最 釋，即使其與本發明某特定實施例之細 即指述一起使用。 之淀U，係本發明軟板製作方法之—實施例的流程（300) 軟:之於Γ YA_4D為應用圖3之流程_於具有四片 权板之軟板矩陣（4〇)的示意圖。 如圖3所示，首头 '隹> 進仃光阻塗佈製程（步驟3 02)，例 201237824 如’先於圖4A之-玻璃基板（42)上的—或多光阻區㈣貼 附上一或多乾膜光阻。例如，型號為三斜日立&州 負f光阻且厚度為15·25#，較佳為心的乾膜光阻。上 述參數僅用於說明，非用以限定本發明。 接著進行曝光製程（步驟304)，例如，在該一或多光阻 區（44)上用-光罩（未圖示）進行曝光，常用的曝光量為 50-706—W，較佳為6Qmj/em2。如了解此技術者可知， 曝光量可基於光阻型式以及光阻厚度而改變調整。 閒置-段時間（例如，15分鐘）後，進行顯影製則步驟 306)，例如’可以使用濃度〇 5-2%，較佳為ι%的碳酸鈉 或有機驗進行顯影。其中，顯影溫度可以是攝氏2〇_35度， 較佳為27度，顯影速度可以是3-4 M/min，較佳為 3.6Μ/Πΐίη，而沖水水壓可以是M.5kg，較佳為ug。如 了解此技術者可知’上述之顯影劑、溫度、顯影速度係基 於上述光阻型式而舉例，非用以限定本發明，熟悉此技藝 者，當得隨光阻型式與厚度調整顯影劑與作業參數。 再來進行黏膠塗佈製程（步驟3〇8)。如圖4B所示，在 該玻璃基板上’在該一或多光阻區（44)顯影後留下的一或 多光阻圖案外圍塗上石夕膠黏著劑以形成一或多黏膠框 (47)。、其中，較佳的矽膠黏著劑要可以耐高溫至攝式3㈧ 度’並且要可以抗酸驗。其中，在石夕膠黏著劑内可加入間 隔物’以使光阻與黏膠框（47)的高度一致，從而使後續步 驟中貼附的-或多軟板（46)能夠平坦地貼附在玻璃基板 (42)上。 201237824 之後進行軟板貼附製程（步驟31〇)。如圖4C所示，將 一或多軟板（46)貼附於該玻璃基板（42)上的該黏膠框（47) 上，其中利用該黏膠框（47)的黏性使該一或多軟板（46)黏附 於該玻璃基板（42)上，並利用該黏膠框（4乃使該一或多軟板 (46)下方的一或多光阻圖案不受到後續製程（例如，薄臈電 晶體製程）中的酸驗液影響。軟板（46)的材料可用各類薄臈 材料的軟板，例如，聚乙烯萘（pEN，p〇lyethylene Naphthalate)軟板，它可耐熱至攝氏18〇度。 之後進行薄膜電晶體形成製程（步驟3 12)，以在該一或 多軟板（46)上形成一或多薄膜電晶體層。圖4E是圖4D之 一軟板（46)上形成一薄膜電晶體層（49)的一剖面圖。這個製 程不需要另外添加製程設備。由剖面觀之，一或多光阻區 (44)配置於玻璃基板（42)上，黏膠框（47)鄰近一或多光阻 區（44)兩侧且位於玻璃基板（42)上。一或多軟板（46)披附於 一或多光阻區（44)及黏膠框（47)之上，薄膜電晶體層（49)形 成於一或多軟板（46)上。 而後，進行後段製程（步驟314)，例如，製作元件陣列 彦板、配向、框膠印刷、液晶滴入（例如，使用〇DF (〇ne Dap Filling)技術）、及組立封裝等程序。 再來進行液晶面板切割，也就是機械切割製程（步驟 316)。例如，沿著該一或多黏膠框（47)内側之一或多切割 線（48)對6亥一或多軟板（46)進行機械切割，但不切斷下方 玻璃基板（42)，亦不損及薄膜電晶體層（49)，至上述玻璃基 板（42)止，以除去具有該一或多黏膠框（47)之部分，切割的 201237824 1大】、視°又a十所需尺寸決定。圖4F即是圖4£之一軟板（46) ,f機械切割製程之後的剖面圖，其中具有黏膠框（47)的部 刀已被割除。此時’雖然已經切開該軟板（46)，但因為該 光阻區（44)的光阻圖案具有黏性，該軟板仍黏附於該玻 璃基板（42)上。 所以接下來要浸泡剝膜液（步驟3丨8)，藉由浸泡剝膜液 了去除孩或多軟板（46)底下的該一或多光阻區（44)的一 或多光阻圖案’以消除軟板（46)和玻璃基板（42)間的黏性。 其中，剝膜液可以是是氫氧化鈉（NaOH)。 最後透過外力，將該一或多軟板（46)從該玻璃基板 取下（步驟320)。圖4G即是圖4F之軟板（46)從玻璃基板（42) 剝離之後的剖面圖。此時因為軟板（46)底下具有黏性的光 阻圖案已被去除，所以可以用最小的外力將軟板(46)取 因此不會傷害到軟板（46)和它上面形成的薄膜電晶體 層（49)。 邊玻璃基板（42)可重複使用，只要利用刷布去除玻璃 基板（42)上的黏膠即可。 本發明並未侷限於此處所描述之特定細節特徵。在本 發明之精神與範嘴下，其與先前描述與圖式相關之許多不 同的發明變更是可被允許的。因此，本發明將由下述之專 利申請範圍來定義涵括其所可能之修改與變更，而非由上 方之描述來界定本發明之範疇。 【圖式簡單說明】 圖1繪不一種習知的軟性顯示器的軟板剝離製程之一 201237824 種雷射軟板剝離方法。 圖2繪示另一種習知的軟性顯示器的軟板剝離方法。 圖3係本發明軟板製作方法之—實施例的流程之流程 圖。 圖4A-4D為應用圖2夕、、ώ ^ _ 3之机程於具有四片軟板之軟板矩 陣的示意圖。 圖4Ε疋圖4D之軟板上形成—薄膜電晶體層的一剖面 圖。 圖4F是圖4Ε之軟板在機械切割製程之後的剖面圖。 圖4G是圖4F之軟板從玻璃基板剝離之後的剖面圖。 【主要元件符號說明】 10軟性顯示器 12玻璃基板 14介面 16軟板 18薄膜電晶體層 20軟性顯示器 2 2玻璃基板 24剝離層 26軟板 28薄膜電晶體層 29切割線 40軟板矩陣 42玻璃基板 10 201237824 44 光阻區 46軟板 47黏膠框 48 切割線 49薄膜電晶體層 300流程圖 302光阻塗佈 304曝光製程 306顯影製程 308黏膠塗佈 3 10軟板貼附 312薄膜電晶體形成 314後段製程 316機械切割 3 18浸泡剝膜液 320取下軟板201237824 VI. Description of the Invention: [Technical Fields According to the Invention] A related method relates to a method for manufacturing a flexible display, and more particularly to a method for manufacturing a soft board of a soft display device. [Prior Art] = Ten years ago, due to the breakthrough progress and flourishing of image display technology, most of the traditional cathode ray displays (CRT, ~tube) have been replaced by so-called panel displays. Because the panel display has the advantages of small size, thin thickness, light weight, low energy consumption, etc., it has become the mainstream of today's displays. At present, the common panel display has a thin film transistor liquid crystal display or a plasma panel light emitting panel display. Based on the demand for technological development, there is currently a display with a soft substrate for merchandise. The manufacturing process of the above flexible substrate display requires a soft-bond debonding process. FIG. 1 illustrates a method of EPLaR, Electron(10) Plastic by Laser Release, which is a soft stripping process of a conventional flexible display (1〇). The film is mainly coated with a film of polyimide (PI, P〇lyimide) on the glass substrate (12) to form a soft board (16). A thin film transistor layer (18) is then formed on the flexible board (16). After the entire process is completed, the glass substrate (12) and the soft plate (16) interface (14)' are irradiated with laser light to generate bubbles at a high temperature to peel the glass substrate (12) from the soft plate (16). However, the above method of using lasers to inject the glass substrate (12) with the interface (14) of the flexible board (16) requires the purchase of additional laser equipment, thereby increasing the cost of producing 201237824. ; 1 2 shows another conventional soft display (10) soft board stripping method. First, a peeling layer is applied on the glass substrate (22), and a layer of polyimide film is coated on the layer to form a soft board (26). Then a film is formed on the soft board (10). a thin film transistor layer (28). After forming the thin film transistor layer (28), the soft board (26) is cut along the cutting line (4) by mechanical cutting. At this time, only between the soft board (26) and the glass substrate (9) The release layer (24), because the release layer (24) has an adhesive force, it is necessary to apply a force greater than the adhesion of the release layer (24), and the soft plate (26) together with the thin film transistor layer (28) from the glass substrate (22) The upper layer is torn off. However, the thin film transistor layer (28) formed on the glass substrate (22) is easily damaged because of the application of an external force. Both of the above soft board manufacturing methods utilize a coating solution type ( The polyethylenimine of c〇ating Solution Type) is used to make a soft board, and is not suitable for a film type of polyimide type soft board. Therefore, both types of polyimine soft sheets are required, and Low production cost without damaging the soft board of the thin film transistor layer formed on the glass substrate SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for producing a flexible board which is applicable to both a coating solution type and a film type polyimide. A method for producing a soft board for a flexible display includes the following Step of applying one or more photoresists on a substrate; performing a lithography process on the photoresist to form one or more photoresist patterns; forming one or more adhesive frames on the periphery of the one or more photoresist patterns, Or a plurality of flexible sheets attached to the substrate on the one or more adhesive 201237824, and one or more thin film transistor layers are formed on the one or more flexible boards; the back of the array or the back of the array a plate, a matching 'frame glue printing, a liquid crystal drop: a garment,> a mechanical knife for the one or more soft boards on the inner side of the one or more adhesive frames.] to remove the portion having the one or more adhesive frames; Soaking the one or more resist pattern into a stripping solution to remove the one or more photoresist patterns and peeling the one or more soft boards from the substrate by an external force. β The present invention has the following advantages: the present invention uses The materials are all existing materials and do not need to be developed separately. The glass can be recycled and reused, which meets the requirements of resource recovery on the market. The external force required to be applied in the process of the present invention is extremely small, so that the components formed on the human board can be prevented from being damaged by external force. Provided: = = Description of the same embodiment. The following description is a detailed description of the palladium details of the first-order, so that the reader thoroughly understands the implementation of these implementations. However, those skilled in the art must understand this The invention may also be implemented under these conditions. In addition, the two structures or functions are not described in detail to avoid various implementations; 曰1 unnecessary related descriptions of the broad sense of the search, the following uranium The terminology used is to be accorded its meaning, even if it is used in conjunction with a particular embodiment of the invention. The process of the soft board manufacturing method of the present invention is the flow of the embodiment (300). Soft: Γ YA_4D is a schematic diagram of applying the flow chart of Fig. 3 to a soft board matrix (4 〇) having four weight plates. As shown in FIG. 3, the first '隹> is introduced into the photoresist coating process (step 3 02), and the example 201237824 is as follows: 'before the glass substrate (42) of FIG. 4A or the multi-photo resistive area (four) Attach one or more dry film photoresists. For example, the model is a three-slope Hitachi & state negative f-resistance and has a thickness of 15·25#, preferably a dry film photoresist of the heart. The above parameters are for illustrative purposes only and are not intended to limit the invention. Then, an exposure process is performed (step 304). For example, exposure is performed on the one or more photoresist regions (44) with a mask (not shown). The usual exposure amount is 50-706-W, preferably 6Qmj. /em2. As will be appreciated by those skilled in the art, the amount of exposure can be adjusted based on the photoresist type and the thickness of the photoresist. After the idle period (e.g., 15 minutes), development step 306) is performed, for example, development can be carried out using sodium carbonate or organic test having a concentration of -2 5-2%, preferably ι%. Wherein, the developing temperature may be 2 〇 _ 35 degrees Celsius, preferably 27 degrees, the developing speed may be 3-4 M/min, preferably 3.6 Μ / Πΐ ίη, and the flushing water pressure may be M. 5 kg, Good for ug. As is known to those skilled in the art, the above-mentioned developer, temperature, and development speed are exemplified based on the above-mentioned resist pattern, and are not intended to limit the present invention. Those skilled in the art will be able to adjust the developer and work with the pattern and thickness of the photoresist. parameter. The adhesive coating process is then carried out (steps 3〇8). As shown in FIG. 4B, on the glass substrate, one or more photoresist patterns left after the development of the one or more photoresist regions (44) are coated with a stone adhesive to form one or more adhesive frames. (47). Among them, the preferred silicone adhesive should be able to withstand high temperatures up to 3 (eight) degrees and be resistant to acid. Wherein, a spacer can be added in the Shishi adhesive to make the photoresist conform to the height of the adhesive frame (47), so that the attached or multi-soft board (46) can be attached flatly in the subsequent step. On the glass substrate (42). After the 201237824, the soft board attach process (step 31〇). As shown in FIG. 4C, one or more flexible boards (46) are attached to the adhesive frame (47) on the glass substrate (42), wherein the adhesiveness of the adhesive frame (47) is used to make the one Or a plurality of flexible boards (46) are adhered to the glass substrate (42), and the adhesive frame (4 is used to prevent one or more photoresist patterns under the one or more flexible boards (46) from being subjected to subsequent processes (for example, The influence of the acid test solution in the thin-twist transistor process. The material of the soft board (46) can be made of soft sheets of various thin materials, for example, pEN, p〇lyethylene Naphthalate soft board, which is heat resistant. Up to 18 degrees Celsius. A thin film transistor formation process is then performed (step 3 12) to form one or more thin film transistor layers on the one or more flexible plates (46). Figure 4E is a soft plate of Figure 4D ( 46) forming a cross-sectional view of a thin film transistor layer (49). This process does not require additional processing equipment. From the cross-sectional view, one or more photoresist regions (44) are disposed on the glass substrate (42), adhered The plastic frame (47) is adjacent to both sides of the one or more photoresist regions (44) and is located on the glass substrate (42). One or more soft plates (46) are attached to the one or more photoresist regions. 44) and the adhesive frame (47), the thin film transistor layer (49) is formed on the one or more flexible plates (46). Then, the back end process (step 314) is performed, for example, to fabricate the component array and the alignment. , glue printing, liquid crystal dropping (for example, using 〇DF (〇ne Dap Filling) technology), and assembly of the package, etc. The liquid crystal panel cutting, that is, the mechanical cutting process (step 316). One or more of the one or more viscous frames (47) are mechanically cut to one or more of the soft boards (46), but the lower glass substrate (42) is not cut, and the second glass substrate (42) is not damaged. The thin film transistor layer (49) is terminated to the glass substrate (42) to remove the portion having the one or more adhesive frames (47), and the size of the cut is determined by the size of the cut. Figure 4F is a cross-sectional view of the soft board (46) of Figure 4 after f mechanical cutting process, in which the knife with the adhesive frame (47) has been cut. At this time 'although the soft board has been cut (46) ), but because the photoresist pattern of the photoresist region (44) is viscous, the soft plate still adheres to the glass substrate (42) Therefore, the next step is to soak the stripping solution (step 3丨8), and remove one or more photoresists of the one or more photoresist regions (44) under the child or soft board (46) by soaking the stripping solution. The pattern 'to eliminate the stickiness between the soft board (46) and the glass substrate (42). The stripping liquid may be sodium hydroxide (NaOH). Finally, the one or more soft boards (46) are removed from the external force. The glass substrate is removed (step 320). Fig. 4G is a cross-sectional view of the soft board (46) of Fig. 4F after being peeled off from the glass substrate (42). At this time, because of the viscous photoresist pattern under the soft board (46) It has been removed, so the soft plate (46) can be taken with minimal external force so that it does not damage the soft plate (46) and the thin film transistor layer (49) formed thereon. The edge glass substrate (42) can be reused as long as the glue on the glass substrate (42) is removed by a brush. The invention is not limited to the specific details described herein. Many different inventive variations of the foregoing description and drawings are permitted under the spirit and scope of the present invention. Therefore, the invention is intended to be limited by the scope of the appended claims BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 depicts one of the soft stripping processes of a conventional flexible display. FIG. 2 illustrates another conventional soft panel peeling method for a flexible display. Fig. 3 is a flow chart showing the flow of the embodiment of the soft board manufacturing method of the present invention. 4A-4D are schematic diagrams showing the application of the machine of Fig. 2, ώ ^ _ 3 to a soft matrix having four soft boards. Fig. 4 is a cross-sectional view showing the formation of a thin film transistor layer on the soft board of Fig. 4D. Figure 4F is a cross-sectional view of the soft board of Figure 4 after a mechanical cutting process. 4G is a cross-sectional view of the soft board of FIG. 4F after being peeled off from the glass substrate. [Main component symbol description] 10 flexible display 12 glass substrate 14 interface 16 soft board 18 thin film transistor layer 20 flexible display 2 2 glass substrate 24 peeling layer 26 soft board 28 thin film transistor layer 29 cutting line 40 soft board matrix 42 glass substrate 10 201237824 44 photoresist zone 46 soft board 47 adhesive frame 48 cutting line 49 thin film transistor layer 300 flow chart 302 photoresist coating 304 exposure process 306 development process 308 adhesive coating 3 10 soft board attached 312 thin film transistor Form 314 rear stage process 316 mechanical cutting 3 18 soaking stripping solution 320 remove the soft board