WO2016041307A1 - Substrate bonding method, touch control substrate and display device - Google Patents

Substrate bonding method, touch control substrate and display device Download PDF

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Publication number
WO2016041307A1
WO2016041307A1 PCT/CN2015/070614 CN2015070614W WO2016041307A1 WO 2016041307 A1 WO2016041307 A1 WO 2016041307A1 CN 2015070614 W CN2015070614 W CN 2015070614W WO 2016041307 A1 WO2016041307 A1 WO 2016041307A1
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WIPO (PCT)
Prior art keywords
substrate
layer
bonding method
touch
curable adhesive
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PCT/CN2015/070614
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French (fr)
Chinese (zh)
Inventor
罗鸿强
许邹明
范文金
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/771,429 priority Critical patent/US20160361907A1/en
Priority to EP15753302.7A priority patent/EP3196018B1/en
Publication of WO2016041307A1 publication Critical patent/WO2016041307A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331—Cover glasses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a substrate bonding method, a touch substrate, and a display device.
  • the substrate of the layer is bonded, for example, the touch panel substrate is attached to the display panel.
  • the bonding process for the above-mentioned bonded substrate generally has the following two types:
  • One is a frame glue bonding method of bonding a substrate with a frame glue.
  • the frame glue used generally has a certain thickness, so that the touch screen after bonding
  • the gap between the touch panel and the display panel is not tight enough, so that particles such as dust easily enter the gap and affect the touch performance, and the gap also causes the entire touch module.
  • the optical performance is poor.
  • Another method is to directly bond the substrate directly using Optical Clear Adhesive or Optical Clear Resist.
  • the optical transparent adhesive bonding method requires cutting, glass release filming, and the like for the size of the touch screen and the display panel, resulting in high cost and cumbersome operation.
  • optically clear resin glue bonding method avoids the cutting operation and uses a light and heavy release film, and a single type of optically transparent resin glue can be applied to a variety of different sizes of products, the thickness of the glue can be controlled, and the process is relatively simple This method has been widely used.
  • the so-called optically clear resin glue contains a photo- or thermo-curable material, so that it can be cured and bonded after being exposed to light or heat.
  • coating methods using optical transparent resin glue for bonding include dispensing, screen printing, and slit coating (Slit Coating) fits in three ways.
  • the fine seam coating fits the thickness of the curable adhesive layer in the middle area well, but the thickness of the curable adhesive layer around the coated edge is usually thicker than the curable adhesive in the middle area, which is easy.
  • the edge of the curable adhesive itself has a significant oblique slope, which makes it difficult to control the lack of glue/overflow when the substrate is attached; Can be applied in a rectangular shape, and can not be coated with a profiled coating.
  • the curable adhesive layer 2 for bonding the first substrate 1 and the second substrate 2 bubbles are generated in the curable adhesive layer 2 due to the above-described disadvantages of the coating method, and
  • the edge portion of the curable adhesive layer 2 produces a curable rubber oblique angle, and the gel is formed at the upper portion of the bevel of the curable adhesive, and the gel is formed at the lower portion.
  • the object of the present invention is to solve the problem that the uniformity of the thickness of the adhesive layer is difficult to control when the different functional substrates are adhered in the display device existing in the prior art, and it is easy to generate bubbles, overflow glue, lack of glue, etc., resulting in a decrease in optical performance of the display device.
  • the problem is thus to provide a new substrate bonding method, touch display panel and display device.
  • the technical solution adopted to solve the technical problem of the present invention is a substrate bonding method, comprising the following steps:
  • the surface to be bonded of the second substrate is bonded to the curable adhesive on the first substrate.
  • the easy-to-remove layer has a tensile strength of 10 to 30 kgf/mm 2 .
  • the disposing the layer on the light-blocking frame comprises: cutting the easy-to-remove film prepared by using polyethylene terephthalate into a surface corresponding to the bonding surface of the first substrate a shape; and applying a cut-and-release layer of the film to the light-blocking frame to form a detachable layer.
  • the disposing the layer on the light-blocking frame comprises: forming a detachable layer on the light-blocking frame by using a peelable glue.
  • the peelable glue comprises a photocurable or thermosetting material.
  • the method further comprises: curing the easy-release layer.
  • the curable adhesive is an ultraviolet curable adhesive; and the irradiation dose of the ultraviolet light used for the pre-curing is 100-200 mj/cm 2 .
  • the method further comprises: curing the curable paste.
  • the first substrate is a glass cover
  • the second substrate is a touch film or a touch glass
  • the first substrate is a touch glass
  • the second substrate is a liquid crystal display panel.
  • Another object of the present invention is to provide a touch substrate including a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded by the substrate bonding method described above.
  • Another object of the present invention is to provide a display device including the touch substrate described above.
  • the photocurable adhesive is pre-cured and removed by providing an easy-to-remove layer on the periphery of the first substrate, and then coating the photo-curable adhesive.
  • Easy to disassemble and other steps to enable light curing The glue forms the desired shape (including the profiled shape), and the thickness of the light-cured adhesive layer is uniform, the surface is flat, and the edge slope angle is close to 90°; at the same time, the bonding bubbles can be effectively reduced, and the lack of glue in the edge region at the time of bonding can be suppressed. Overflow phenomenon; guarantees the optical performance of the display device.
  • FIG. 1 is a schematic view showing a state of bonding a substrate in the prior art
  • Embodiment 3 is a schematic structural view of a first substrate after an easy-to-remove layer is disposed in Embodiment 1 of the present invention
  • FIG. 4 is a schematic structural view of a first substrate coated with a curable adhesive in Embodiment 1 of the present invention
  • FIG. 5 is a schematic structural view of a first substrate after a removable layer is removed in Embodiment 1 of the present invention
  • FIG. 6 is a schematic structural view of the first substrate and the second substrate after being bonded in Embodiment 1 of the present invention.
  • the first substrate 2. The curable adhesive layer; 3. The second substrate; 4. The light blocking frame; 5. The easy-to-remove layer.
  • This embodiment provides a substrate bonding method, including the following steps:
  • the surface to be bonded of the second substrate is bonded to the curable adhesive on the first substrate.
  • the photocurable adhesive is pre-cured and removed by providing an easy-to-remove layer on the periphery of the first substrate, and then coating the photo-curable adhesive.
  • the easy-to-remove layer and the like can form the photocurable adhesive into a desired shape (including the profiled shape), and the thickness of the light-curable adhesive layer is uniform, the surface is flat, the edge slope angle is close to 90°, and at the same time, the bonding bubble can be effectively reduced.
  • the lack of glue and glue in the edge region during the bonding is suppressed, thereby ensuring the optical performance of the display device.
  • this embodiment takes the following steps to laminate the substrate:
  • the bonding surface of the first substrate 1 (for example, a glass cover (CG) or a touch glass (OGS)) is plasma-cleaned.
  • the method of plasma cleaning is in the prior art and will not be described herein.
  • a light blocking frame 4 is disposed on a peripheral area of the surface to be bonded of the first substrate 1, and the light blocking frame 4 can be prepared by using a light absorbing material by printing;
  • the inside of the light-blocking frame 4 is a light-transmitting area of a subsequently formed display device, and the light-blocking frame 4 is used to form a non-light-transmitting area of the display device.
  • a detachable layer 5 is disposed on the light-blocking frame 4, that is, the detachable layer is disposed in the non-light-transmitting region.
  • the stretchable layer 5 has a tensile strength of 10 to 30 kgf/mm 2 . This ensures that the easy-to-remove layer has suitable strength and that the subsequent removal of the easy-to-remove layer 5 can be ensured in the subsequent removal.
  • a film prepared using polyethylene terephthalate is applied to the light blocking frame 4 to form the easy-release layer 5.
  • the film for forming the easy-removable layer 5 can be cut according to the shape of the surface to be bonded of the first substrate 1, so that the desired shape can be cut and then It is applied to the light blocking frame 4 on the first substrate 1.
  • peelable glue may also be used to form the easy-release layer 5 on the light-blocking frame 4 by printing.
  • screen printing can be used to print peelable glue. Screen printing is in the prior art and will not be described here.
  • Strippable glues include photocurable or thermosetting materials that can be exposed to ultraviolet light or After curing by heat, in this embodiment, the peelable adhesive is cured after printing is completed, and the curing conditions can be selected according to the selected photocurable or thermosetting material.
  • the curable adhesive may be an ultraviolet curable adhesive, for example, a commercially available KAYARAD KSP-501 or a Dexerials 12F032-4 ultraviolet curable adhesive, and a UV-curable adhesive is applied by a slit coating method.
  • the entire surface to be bonded of the first substrate 1 is applied to form a curable adhesive layer 2, and the slit coating is in the prior art, and will not be described herein.
  • curable adhesive may also be a heat curable adhesive.
  • the above-mentioned curable adhesive layer 2 formed of the ultraviolet curable adhesive is pre-cured under the condition that the ultraviolet light irradiation dose is 100-200 mj/cm 2 .
  • the curable adhesive is a thermosetting adhesive
  • the substrate coated with the thermosetting adhesive is heated to be pre-cured, and the conditions of the thermal curing are determined according to the selected thermosetting adhesive.
  • the easy-removable layer 5 is removed, and at the same time, the portion of the curable adhesive layer 2 located above the easy-release layer 5 is simultaneously removed, and the remaining curable adhesive layer 2 is formed into a desired shape, and
  • the curable adhesive layer 2 has a uniform thickness, a flat surface, and an edge slope angle of approximately 90°.
  • the surface to be bonded of the second substrate 3 (for example, a liquid crystal display panel) is aligned with the surface to be bonded of the first substrate 1, and the curable adhesive is utilized.
  • Layer 2 fits the two to form a touch display panel.
  • the first basic and second substrates in this embodiment are exemplary and not limiting.
  • the second substrate 3 may be a touch film, a touch glass or a liquid crystal display panel.
  • the first substrate is a glass cover
  • the second substrate may be a touch film or a touch glass; or when the first substrate is a touch glass, the second substrate may be a liquid crystal display panel; or vice versa.
  • the curable adhesive layer 2 of the formed touch display panel is cured by irradiating ultraviolet light.
  • the ultraviolet curable gel is completely cured by ultraviolet light having an irradiation dose of 3500 mj/cm 2 to achieve a good fit of the first substrate and the second substrate.
  • the present curing of the curable adhesive is achieved under the respective heat curing conditions.
  • the touch substrate includes a first substrate and a second substrate.
  • the first substrate may be a touch substrate
  • the second substrate may be a display panel
  • the touch panel and the touch panel The display panel is bonded by the above-described substrate bonding method.
  • the touch substrate of the embodiment is prepared by the above substrate bonding method, the optical performance of the touch substrate is good.
  • the embodiment provides a display device, and the display device includes a touch substrate.
  • the display device of the embodiment includes the touch substrate described above, the optical performance of the display device is good.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention provides a substrate bonding method, a touch control substrate and a display device. In the process of manufacturing a touch display panel and a display device by using the substrate bonding method of the present invention, steps such as arranging a detachable layer on the periphery of a first substrate, coating a light curable adhesive, pre-curing the light curable adhesive, and removing the detachable layer are performed to form the light curable adhesive into a desired shape (comprising an irregular shape). The layer of the light curable adhesive has uniform thickness, a flat surface, and an edge slope angle close to 90°. The method can effectively reduce bonding bubbles, alleviate the adhesive lacking and the adhesive spilling phenomena in edge areas during bonding, and ensure the optical performance of the display device.

Description

基板贴合方法、触控基板、显示装置Substrate bonding method, touch substrate, display device 技术领域Technical field
本发明涉及显示技术领域，具体地，涉及基板贴合方法、触控基板、和显示装置。The present invention relates to the field of display technologies, and in particular, to a substrate bonding method, a touch substrate, and a display device.
背景技术Background technique
当前，诸如智能手机、电脑和电视等具有触控和显示功能的电子产品得到了日益广泛的应用，在制作这些产品的具有触控功能的显示屏的过程中，通常需要将两个各自具有功能层的基板进行贴合，例如，将触摸屏基板贴合于显示面板上。Currently, electronic products such as smart phones, computers, and televisions with touch and display functions are increasingly used. In the process of making touch-enabled displays for these products, it is usually necessary to have two functions. The substrate of the layer is bonded, for example, the touch panel substrate is attached to the display panel.
用于上述贴合基板的贴合工艺通常有以下两种：The bonding process for the above-mentioned bonded substrate generally has the following two types:
一种是利用框胶贴合基板的框胶贴合方法，例如，在利用该方法将触摸屏基板贴合于显示面板时，所使用的框胶通常要具有一定的厚度，从而贴合后的触摸屏和显示面板之间易于出现间隙，导致触摸屏和显示面板之间的贴合不够紧密，从而例如灰尘等的颗粒物易于进入该间隙而影响触控性能，而且该间隙的出现也使得整个触控模组的光学性能较差。One is a frame glue bonding method of bonding a substrate with a frame glue. For example, when the touch screen substrate is attached to the display panel by the method, the frame glue used generally has a certain thickness, so that the touch screen after bonding The gap between the touch panel and the display panel is not tight enough, so that particles such as dust easily enter the gap and affect the touch performance, and the gap also causes the entire touch module. The optical performance is poor.
另一种方法是利用光学透明胶(Optical Clear Adhesive)或光学透明树脂胶水(Optical Clear Resist)对基板直接进行全贴合。例如，在利用该方法将触摸屏基板贴合于显示面板时，采用光学透明胶贴合方式需要针对触摸屏和显示面板的尺寸进行切割、玻璃离型膜化等操作，导致成本高、操作繁琐。Another method is to directly bond the substrate directly using Optical Clear Adhesive or Optical Clear Resist. For example, when the touch panel substrate is bonded to the display panel by the method, the optical transparent adhesive bonding method requires cutting, glass release filming, and the like for the size of the touch screen and the display panel, resulting in high cost and cumbersome operation.
相比较而言，光学透明树脂胶水贴合方式避免了切割操作并且使用轻重离型膜，而且单一型号的光学透明树脂胶水可以应用于多种不同尺寸的产品，胶水厚度可以控制，因而工艺相对简单，使得该方法得到了广泛的应用。所谓的光学透明树脂胶水包含有光致或热致固化材料，因而在光照或受热后能够固化粘结。迄今为止，利用光学透明树脂胶水进行贴合的涂布方式包括点胶(Dispensing)涂布贴合、丝网印刷涂布贴合和细缝涂布(Slit  Coating)贴合三种方式。In comparison, the optically clear resin glue bonding method avoids the cutting operation and uses a light and heavy release film, and a single type of optically transparent resin glue can be applied to a variety of different sizes of products, the thickness of the glue can be controlled, and the process is relatively simple This method has been widely used. The so-called optically clear resin glue contains a photo- or thermo-curable material, so that it can be cured and bonded after being exposed to light or heat. Up to now, coating methods using optical transparent resin glue for bonding include dispensing, screen printing, and slit coating (Slit Coating) fits in three ways.
当利用点胶涂布方式对基板进行涂布贴合时，需要依靠可固化胶的流动来实现将贴合时的气泡挤出，这就需要使用较多量的可固化胶，所以很难对贴合后的缺胶/溢胶现象以及可固化胶厚度的均一性进行管控；而且该方式不能用于进行异形贴合。When the substrate is coated and applied by means of dispensing, it is necessary to rely on the flow of the curable glue to achieve the extrusion of the bubbles during the bonding, which requires the use of a larger amount of curable glue, so it is difficult to apply The lack of glue/overfill phenomenon and the uniformity of the thickness of the curable adhesive are controlled; and this method cannot be used for profile fitting.
当利用丝网印刷方式对基板进行的涂布贴合时也同样很难对可固化胶厚度的均一性进行管控，同时打胶过程麻烦，治具的清洗也很麻烦。When the substrate is applied by screen printing, it is also difficult to control the uniformity of the thickness of the curable adhesive, and the glueing process is troublesome, and the cleaning of the jig is also troublesome.
细缝涂布贴合可以很好的对中间区域的可固化胶层的厚度进行管控，但是涂布后边缘四周的可固化胶层厚度也通常比中间区域的可固化胶厚，这样就很容易造成贴合时在边缘四周产生气泡，而且涂布后由于可固化胶本身的重力作用而使得边缘具有明显斜角坡度，造成基板贴合时难以管控缺胶/溢胶现象；同时可固化胶只能被涂布成矩形，而不能进行异形涂布贴合。The fine seam coating fits the thickness of the curable adhesive layer in the middle area well, but the thickness of the curable adhesive layer around the coated edge is usually thicker than the curable adhesive in the middle area, which is easy. When the bonding is caused, bubbles are generated around the edge, and after the coating, the edge of the curable adhesive itself has a significant oblique slope, which makes it difficult to control the lack of glue/overflow when the substrate is attached; Can be applied in a rectangular shape, and can not be coated with a profiled coating.
如图1所示，在用于贴合第一基板1和第二基板2的可固化胶层2中，由于上述的涂布方式的缺点会造成在可固化胶层2中产生气泡，同时，可固化胶层2边缘部分产生可固化胶斜角，可固化胶斜角的上部处产生缺胶现象，下部处产生溢胶现象。As shown in FIG. 1, in the curable adhesive layer 2 for bonding the first substrate 1 and the second substrate 2, bubbles are generated in the curable adhesive layer 2 due to the above-described disadvantages of the coating method, and The edge portion of the curable adhesive layer 2 produces a curable rubber oblique angle, and the gel is formed at the upper portion of the bevel of the curable adhesive, and the gel is formed at the lower portion.
因此，需要提高可固化胶层2的平整度，降低气泡产生的概率、防止可固化胶层2的边缘处产生缺胶和溢胶现象。Therefore, it is necessary to increase the flatness of the curable adhesive layer 2, reduce the probability of bubble generation, and prevent the occurrence of lack of glue and glue at the edges of the curable adhesive layer 2.
发明内容Summary of the invention
本发明的目的是解决现有技术存在的显示装置中不同功能基板进行贴合时胶层厚度的均一性难以控制，容易产生气泡、溢胶、缺胶等不良，造成显示装置的光学性能降低的问题，因而提供了新的基板贴合方法、触控显示面板和显示装置。The object of the present invention is to solve the problem that the uniformity of the thickness of the adhesive layer is difficult to control when the different functional substrates are adhered in the display device existing in the prior art, and it is easy to generate bubbles, overflow glue, lack of glue, etc., resulting in a decrease in optical performance of the display device. The problem is thus to provide a new substrate bonding method, touch display panel and display device.
解决本发明技术问题所采用的技术方案是一种基板贴合方法，包括如下步骤：The technical solution adopted to solve the technical problem of the present invention is a substrate bonding method, comprising the following steps:
在第一基板的待贴合面的周边区域设置挡光框；Providing a light blocking frame in a peripheral area of the surface to be bonded of the first substrate;
在所述挡光框上设置易拆层； Providing a detachable layer on the light blocking frame;
在第一基板的待贴合面涂覆可固化胶；Applying a curable glue to the surface to be bonded of the first substrate;
对可固化胶进行预固化；Precuring the curable glue;
拆除易拆层，同时将在所述易拆层上附着的可固化胶拆除；以及Removing the easy-to-remove layer while removing the curable glue attached to the easy-to-remove layer;
将第二基板的待贴合面与所述第一基板上的可固化胶贴合。The surface to be bonded of the second substrate is bonded to the curable adhesive on the first substrate.
优选的是，所述易拆层的抗拉强度为10-30kgf/mm2。Preferably, the easy-to-remove layer has a tensile strength of 10 to 30 kgf/mm 2 .
优选的是，所述在所述挡光框上设置易拆层包括：将采用聚对苯二甲酸乙二醇酯制备的易拆层薄膜裁剪为与所述第一基板的贴合面对应的形状；和将裁剪后的易拆层薄膜贴敷于所述挡光框上以形成易拆层。Preferably, the disposing the layer on the light-blocking frame comprises: cutting the easy-to-remove film prepared by using polyethylene terephthalate into a surface corresponding to the bonding surface of the first substrate a shape; and applying a cut-and-release layer of the film to the light-blocking frame to form a detachable layer.
优选的是，所述在所述挡光框上设置易拆层包括：采用可剥胶在所述挡光框上印制形成易拆层。Preferably, the disposing the layer on the light-blocking frame comprises: forming a detachable layer on the light-blocking frame by using a peelable glue.
优选的是，所述可剥胶包括光致固化或热致固化材料。Preferably, the peelable glue comprises a photocurable or thermosetting material.
优选的是，在采用可剥胶印制易拆层之后还包括：对易拆层进行固化。Preferably, after the peelable offset printing easy-to-remove layer is used, the method further comprises: curing the easy-release layer.
优选的是，所述可固化胶为紫外光固化胶；进行所述预固化所使用紫外光的照射剂量为100-200mj/cm2。Preferably, the curable adhesive is an ultraviolet curable adhesive; and the irradiation dose of the ultraviolet light used for the pre-curing is 100-200 mj/cm 2 .
优选的是，在贴合第二基板后还包括：使可固化胶本固化。Preferably, after bonding the second substrate, the method further comprises: curing the curable paste.
优选的是，所述第一基板为玻璃盖板，所述第二基板为触控薄膜或触控玻璃；Preferably, the first substrate is a glass cover, and the second substrate is a touch film or a touch glass;
或，所述第一基板为触控玻璃，所述第二基板为液晶显示面板。Or the first substrate is a touch glass, and the second substrate is a liquid crystal display panel.
本发明的另一个目的是提供一种触控基板，其包括第一基板和第二基板，所述第一基板和所述第二基板是采用上述的基板贴合方法进行贴合的。Another object of the present invention is to provide a touch substrate including a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded by the substrate bonding method described above.
本发明的另一个目的是提供一种显示装置，所述显示装置包括上述的触控基板。Another object of the present invention is to provide a display device including the touch substrate described above.
在实施本发明的基板贴合方法来制造触控显示面板和显示装置的过程中，通过在第一基板的周边设有易拆层、然后涂覆光固化胶、使光固化胶预固化、拆除易拆层等步骤，能够使光固化 胶形成所需形状(包括异形形状)，而且光固化胶胶层的厚度均一、表面平整、边缘坡度角接近90°；同时，能够有效减少贴合气泡、抑制贴合时边缘区域的缺胶、溢胶现象；保证了显示装置的光学性能。In the process of manufacturing the touch display panel and the display device by implementing the substrate bonding method of the present invention, the photocurable adhesive is pre-cured and removed by providing an easy-to-remove layer on the periphery of the first substrate, and then coating the photo-curable adhesive. Easy to disassemble and other steps to enable light curing The glue forms the desired shape (including the profiled shape), and the thickness of the light-cured adhesive layer is uniform, the surface is flat, and the edge slope angle is close to 90°; at the same time, the bonding bubbles can be effectively reduced, and the lack of glue in the edge region at the time of bonding can be suppressed. Overflow phenomenon; guarantees the optical performance of the display device.
附图说明DRAWINGS
图1为现有技术中的基板贴合状况示意图；1 is a schematic view showing a state of bonding a substrate in the prior art;
图2为本发明的基板贴合方法的流程图；2 is a flow chart of a substrate bonding method of the present invention;
图3为本发明实施例1中设置了易拆层后的第一基板的结构示意图；3 is a schematic structural view of a first substrate after an easy-to-remove layer is disposed in Embodiment 1 of the present invention;
图4为本发明实施例1中涂覆了可固化胶后的第一基板的结构示意图；4 is a schematic structural view of a first substrate coated with a curable adhesive in Embodiment 1 of the present invention;
图5为本发明实施例1中拆除了易拆层后的第一基板的结构示意图；以及5 is a schematic structural view of a first substrate after a removable layer is removed in Embodiment 1 of the present invention;
图6为本发明实施例1中第一基板和第二基板贴合后的结构示意图。FIG. 6 is a schematic structural view of the first substrate and the second substrate after being bonded in Embodiment 1 of the present invention.
附图标记说明：Description of the reference signs:
1.第一基板；2.可固化胶层；3.第二基板；4.挡光框；5.易拆层。1. The first substrate; 2. The curable adhesive layer; 3. The second substrate; 4. The light blocking frame; 5. The easy-to-remove layer.
具体实施方式detailed description
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
实施例1：Example 1:
本实施例提供一种基板贴合方法，包括如下步骤：This embodiment provides a substrate bonding method, including the following steps:
在第一基板的待贴合面的周边区域设置挡光框；Providing a light blocking frame in a peripheral area of the surface to be bonded of the first substrate;
在所述挡光框上设置易拆层；Providing a detachable layer on the light blocking frame;
在第一基板的待贴合面涂覆可固化胶；Applying a curable glue to the surface to be bonded of the first substrate;
对可固化胶进行预固化； Precuring the curable glue;
拆除易拆层，同时将在所述易拆层上附着的可固化胶拆除；以及Removing the easy-to-remove layer while removing the curable glue attached to the easy-to-remove layer;
将第二基板的待贴合面与所述第一基板上的可固化胶贴合。The surface to be bonded of the second substrate is bonded to the curable adhesive on the first substrate.
在实施本发明的基板贴合方法来制造触控显示面板和显示装置的过程中，通过在第一基板的周边设有易拆层、然后涂覆光固化胶、使光固化胶预固化、拆除易拆层等步骤，能够使光固化胶形成所需形状(包括异形形状)，而且光固化胶胶层的厚度均一、表面平整、边缘坡度角接近90°，同时，能够有效减少贴合气泡、抑制贴合时边缘区域的缺胶、溢胶现象，从而保证了显示装置的光学性能。In the process of manufacturing the touch display panel and the display device by implementing the substrate bonding method of the present invention, the photocurable adhesive is pre-cured and removed by providing an easy-to-remove layer on the periphery of the first substrate, and then coating the photo-curable adhesive. The easy-to-remove layer and the like can form the photocurable adhesive into a desired shape (including the profiled shape), and the thickness of the light-curable adhesive layer is uniform, the surface is flat, the edge slope angle is close to 90°, and at the same time, the bonding bubble can be effectively reduced. The lack of glue and glue in the edge region during the bonding is suppressed, thereby ensuring the optical performance of the display device.
具体地，如图2所示，该实施例采取以下步骤对基板进行贴合：Specifically, as shown in FIG. 2, this embodiment takes the following steps to laminate the substrate:
S1，清洁基板；S1, cleaning the substrate;
具体地，对第一基板1(例如，玻璃盖板(CG)、触控玻璃(OGS))的贴合面进行等离子体清洁。等离子体清洁的方法为现有技术范畴，在此不再赘述。Specifically, the bonding surface of the first substrate 1 (for example, a glass cover (CG) or a touch glass (OGS)) is plasma-cleaned. The method of plasma cleaning is in the prior art and will not be described herein.
S2，设置挡光框；S2, setting a light blocking frame;
具体地，如图3所示，在第一基板1的待贴合面的周边区域设置挡光框4，该挡光框4可以采用吸光物质通过印刷方式来制备；Specifically, as shown in FIG. 3, a light blocking frame 4 is disposed on a peripheral area of the surface to be bonded of the first substrate 1, and the light blocking frame 4 can be prepared by using a light absorbing material by printing;
该挡光框4的内部即为随后形成的显示装置的透光区域，而该挡光框4则用于形成显示装置的非透光区域。The inside of the light-blocking frame 4 is a light-transmitting area of a subsequently formed display device, and the light-blocking frame 4 is used to form a non-light-transmitting area of the display device.
S3，设置易拆层；S3, setting easy to remove layer;
具体地，如图3所示，在挡光框4上设置易拆层5，即，该易拆层设置在上述非透光区域中。Specifically, as shown in FIG. 3, a detachable layer 5 is disposed on the light-blocking frame 4, that is, the detachable layer is disposed in the non-light-transmitting region.
优选的，易拆层5的抗拉强度为10-30kgf/mm2。这样保证了易拆层有合适的强度，而且在后续拆除时，也能够保证将易拆层5完整拆除。Preferably, the stretchable layer 5 has a tensile strength of 10 to 30 kgf/mm 2 . This ensures that the easy-to-remove layer has suitable strength and that the subsequent removal of the easy-to-remove layer 5 can be ensured in the subsequent removal.
优选的，将采用聚对苯二甲酸乙二醇酯制备的薄膜贴敷于挡光框4上来形成易拆层5。 Preferably, a film prepared using polyethylene terephthalate is applied to the light blocking frame 4 to form the easy-release layer 5.
在具体贴敷易拆层5的过程中，可根据第一基板1的待贴合面的形状对用于形成易拆层5的薄膜进行裁剪，因此可以裁剪出所需的形状，然后将其贴敷于第一基板1上的挡光框4上。In the process of specifically applying the easy-to-remove layer 5, the film for forming the easy-removable layer 5 can be cut according to the shape of the surface to be bonded of the first substrate 1, so that the desired shape can be cut and then It is applied to the light blocking frame 4 on the first substrate 1.
应当理解的是，也可以采用可剥胶通过印刷方式在挡光框4上形成易拆层5。例如，可采用丝网印刷的方法来印制可剥胶，丝网印刷为现有技术范畴，在此不再赘述；可剥胶包括光致固化或热致固化材料，其可在紫外线照射或受热后固化，在该实施例中，在印制完成后使可剥胶固化，固化的条件可根据选用的光致固化或热致固化材料来选择。It should be understood that the peelable glue may also be used to form the easy-release layer 5 on the light-blocking frame 4 by printing. For example, screen printing can be used to print peelable glue. Screen printing is in the prior art and will not be described here. Strippable glues include photocurable or thermosetting materials that can be exposed to ultraviolet light or After curing by heat, in this embodiment, the peelable adhesive is cured after printing is completed, and the curing conditions can be selected according to the selected photocurable or thermosetting material.
S4，涂覆可固化胶；S4, coating a curable glue;
具体地，如图4所示，可固化胶可以采用紫外光固化胶，例如，市售的KAYARAD KSP-501或Dexerials 12F032-4型紫外光固化胶，采用细缝涂布方式将紫外光固化胶涂覆于整个第一基板1的整个待贴合面以形成可固化胶层2，细缝涂布为现有技术范畴，在此不再赘述。Specifically, as shown in FIG. 4, the curable adhesive may be an ultraviolet curable adhesive, for example, a commercially available KAYARAD KSP-501 or a Dexerials 12F032-4 ultraviolet curable adhesive, and a UV-curable adhesive is applied by a slit coating method. The entire surface to be bonded of the first substrate 1 is applied to form a curable adhesive layer 2, and the slit coating is in the prior art, and will not be described herein.
应当理解的是，可固化胶也可以采用热固化胶。It should be understood that the curable adhesive may also be a heat curable adhesive.
S5，使可固化胶预固化；S5, pre-curing the curable adhesive;
具体地，在紫外光照射剂量为100-200mj/cm2的条件下对上述的由紫外光固化胶形成的可固化胶层2进行预固化。Specifically, the above-mentioned curable adhesive layer 2 formed of the ultraviolet curable adhesive is pre-cured under the condition that the ultraviolet light irradiation dose is 100-200 mj/cm 2 .
应当理解的是，若可固化胶采用热固化胶，则对上述涂覆热固化胶的基板进行加热以进行预固化，热固化的条件根据选用的热固化胶来确定。It should be understood that if the curable adhesive is a thermosetting adhesive, the substrate coated with the thermosetting adhesive is heated to be pre-cured, and the conditions of the thermal curing are determined according to the selected thermosetting adhesive.
S6，拆除易拆层；S6, removing the easy-to-remove layer;
具体地，如图5所示，将易拆层5拆除，同时可固化胶层2的位于易拆层5上方的部分也同时被拆除，保留下的可固化胶层2形成所需形状，并且可固化胶层2的厚度均一、表面平整、以及边缘坡度角接近90°。Specifically, as shown in FIG. 5, the easy-removable layer 5 is removed, and at the same time, the portion of the curable adhesive layer 2 located above the easy-release layer 5 is simultaneously removed, and the remaining curable adhesive layer 2 is formed into a desired shape, and The curable adhesive layer 2 has a uniform thickness, a flat surface, and an edge slope angle of approximately 90°.
S7，贴合第二基板；S7, bonding the second substrate;
具体地，如图6所示，将第二基板3(例如，液晶显示面板)的待贴合面与所述第一基板1的待贴合面对准，并利用可固化胶 层2将其二者进行贴合，以形成触控显示面板。应该理解的是，该实施例中的第一基本和第二基板都是示例性的，而不是限制性的，例如，第二基板3可以为触控薄膜、触控玻璃或液晶显示面板，而当第一基板为玻璃盖板时，第二基板可以为触控薄膜或触控玻璃；或者，当第一基板为触控玻璃时，第二基板可以为液晶显示面板；反之亦然。Specifically, as shown in FIG. 6, the surface to be bonded of the second substrate 3 (for example, a liquid crystal display panel) is aligned with the surface to be bonded of the first substrate 1, and the curable adhesive is utilized. Layer 2 fits the two to form a touch display panel. It should be understood that the first basic and second substrates in this embodiment are exemplary and not limiting. For example, the second substrate 3 may be a touch film, a touch glass or a liquid crystal display panel. When the first substrate is a glass cover, the second substrate may be a touch film or a touch glass; or when the first substrate is a touch glass, the second substrate may be a liquid crystal display panel; or vice versa.
S8，使可固化胶本固化；S8, curing the curable paste;
具体地，通过照射紫外光使形成的触控显示面板的可固化胶层2固化。例如，利用照射剂量为3500mj/cm2的紫外光使紫外光固化胶完全固化，从而实现第一基板和第二基板的良好贴合。Specifically, the curable adhesive layer 2 of the formed touch display panel is cured by irradiating ultraviolet light. For example, the ultraviolet curable gel is completely cured by ultraviolet light having an irradiation dose of 3500 mj/cm 2 to achieve a good fit of the first substrate and the second substrate.
应当理解的是，在采用热固化胶形成可固化胶层2的情况下，在相应的热固化条件下实现可固化胶的本固化。It should be understood that in the case where the curable adhesive layer 2 is formed using a thermosetting adhesive, the present curing of the curable adhesive is achieved under the respective heat curing conditions.
可选的，进一步在上述贴合形成的显示面板上制备其它功能层，从而完成显示装置的制备。Optionally, further functional layers are further prepared on the display panel formed by the above bonding, thereby completing preparation of the display device.
实施例2Example 2
本实施例提供一种触控基板，所述触控基板包括第一基板和第二基板，具体的，第一基板可以是触控基板，第二基板可以是显示面板，所述触控面板和显示面板是采用上述的基板贴合方法进行贴合。The touch substrate includes a first substrate and a second substrate. Specifically, the first substrate may be a touch substrate, and the second substrate may be a display panel, and the touch panel and the touch panel The display panel is bonded by the above-described substrate bonding method.
由于本实施例的触控基板是采用上述的基板贴合方法制备的，因此，该触控基板的光学性能较好。Since the touch substrate of the embodiment is prepared by the above substrate bonding method, the optical performance of the touch substrate is good.
实施例3Example 3
本实施例提供一种显示装置，所述显示装置包括触控基板。The embodiment provides a display device, and the display device includes a touch substrate.
由于本实施例的显示装置包括上述的触控基板，因此，该显示装置的光学性能较好。Since the display device of the embodiment includes the touch substrate described above, the optical performance of the display device is good.
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领 域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。 It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the invention, but the invention is not limited thereto. For skills Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the invention.

Claims (11)

  1. 一种基板贴合方法，其特征在于，包括如下步骤：A substrate bonding method, comprising the steps of:
    在第一基板的待贴合面的周边区域设置挡光框；Providing a light blocking frame in a peripheral area of the surface to be bonded of the first substrate;
    在所述挡光框上设置易拆层；Providing a detachable layer on the light blocking frame;
    在第一基板的待贴合面涂覆可固化胶；Applying a curable glue to the surface to be bonded of the first substrate;
    对可固化胶进行预固化；Precuring the curable glue;
    拆除易拆层，同时将在所述易拆层上附着的可固化胶拆除；以及Removing the easy-to-remove layer while removing the curable glue attached to the easy-to-remove layer;
    将第二基板的待贴合面与所述第一基板上的可固化胶贴合。The surface to be bonded of the second substrate is bonded to the curable adhesive on the first substrate.
  2. 如权利要求1所述的基板贴合方法，其特征在于，所述易拆层的抗拉强度为10-30kgf/mm2。The substrate bonding method according to claim 1, wherein the detachable layer has a tensile strength of 10 to 30 kgf/mm 2 .
  3. 如权利要求1所述的基板贴合方法，其特征在于，所述在所述挡光框上设置易拆层包括：将采用聚对苯二甲酸乙二醇酯制备的易拆层薄膜裁剪为与所述第一基板的贴合面对应的形状；和The substrate bonding method according to claim 1, wherein the disposing the layer on the light blocking frame comprises: cutting a easy-to-remove film prepared by using polyethylene terephthalate into a shape corresponding to a bonding surface of the first substrate; and
    将裁剪后的易拆层薄膜贴敷于所述挡光框上以形成易拆层。The cut easy-release film is applied to the light-blocking frame to form a detachable layer.
  4. 如权利要求1所述的基板贴合方法，其特征在于，所述在所述挡光框上设置易拆层包括：采用可剥胶在所述挡光框上印制形成易拆层。The substrate bonding method according to claim 1, wherein the disposing the layer on the light-blocking frame comprises: forming a detachable layer on the light-blocking frame by using a peelable glue.
  5. 如权利要求4所述的基板贴合方法，其特征在于，所述可剥胶包括光致固化或热致固化材料。The substrate bonding method according to claim 4, wherein the peelable glue comprises a photocurable or thermosetting material.
  6. 如权利要求5所述的基板贴合方法，其特征在于，在采用可剥胶印制易拆层之后还包括：对易拆层进行固化。The substrate bonding method according to claim 5, further comprising: curing the easy-to-remove layer after the peelable offset printing layer is removed.
  7. 如权利要求1所述的基板贴合方法，其特征在于，所述可 固化胶为紫外光固化胶；进行所述预固化所使用的紫外光的照射剂量为100-200mj/cm2。The substrate bonding method according to claim 1, wherein the curable adhesive is an ultraviolet curable adhesive; and the ultraviolet light used for the pre-curing is irradiated at a dose of 100 to 200 mj/cm 2 .
  8. 如权利要求1所述的基板贴合方法，其特征在于，在贴合第二基板后还包括：The substrate bonding method according to claim 1, further comprising: after bonding the second substrate:
    使可固化胶本固化。The curable gum is cured.
  9. 如权利要求1所述的基板贴合方法，其特征在于，所述第一基板为玻璃盖板，所述第二基板为触控薄膜或触控玻璃；The substrate bonding method according to claim 1, wherein the first substrate is a glass cover, and the second substrate is a touch film or a touch glass;
    或，所述第一基板为触控玻璃，所述第二基板为液晶显示面板。Or the first substrate is a touch glass, and the second substrate is a liquid crystal display panel.
  10. 一种触控基板，包括第一基板和第二基板，其特征在于，所述第一基板和所述第二基板采用如权利要求1-9中任一项所述基板贴合方法进行贴合。A touch substrate comprising a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded by the substrate bonding method according to any one of claims 1-9 .
  11. 一种显示装置，其特征在于，所述显示装置包括如权利要求10所述触控基板。 A display device, comprising the touch substrate according to claim 10.
PCT/CN2015/070614 2014-09-17 2015-01-13 Substrate bonding method, touch control substrate and display device WO2016041307A1 (en)

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