TWI507300B - Substrate adhesion method - Google Patents
Substrate adhesion method Download PDFInfo
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- TWI507300B TWI507300B TW102112000A TW102112000A TWI507300B TW I507300 B TWI507300 B TW I507300B TW 102112000 A TW102112000 A TW 102112000A TW 102112000 A TW102112000 A TW 102112000A TW I507300 B TWI507300 B TW I507300B
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Description
本發明係關於一種基板間的黏合方法。The present invention relates to a method of bonding between substrates.
習知黏合方法是將兩個欲接合基板之間的接觸面塗佈一黏合劑後實施對應於該黏合劑的固化程序，從而完成前述兩基板之黏合。然而，由於習知黏合方法僅是利用一種型態之膠材來黏合兩基板，亦即該黏合劑於塗佈後所形成之黏合層的型態為液態、固態及凝態的其中之一，因此該等型態之黏合層分別具有如下的缺點：當該黏合層的型態為液態時，在接合過程中，於兩基板壓合時，該黏合層中的液態黏合劑會從其側邊流溢出；當該黏合層的型態為固態時，因該黏合層的表面乾硬而具有壓縮彈性缺乏的問題；以及當該黏合層的型態為固態或凝態時，在應用於硬式基板與硬式基板的接合時，較容易因為空氣不易排除而於兩硬式基板之間形成氣泡，另外，若發生對位不準確，又難以調整其對位誤差。The conventional bonding method is to apply a curing agent to the contact surface between the two substrates to be bonded, and then perform a curing process corresponding to the adhesive to complete the bonding of the two substrates. However, since the conventional bonding method uses only one type of adhesive to bond the two substrates, that is, the adhesive layer formed by the adhesive is one of a liquid state, a solid state, and a condensed state. Therefore, the adhesive layers of the types have the following disadvantages: when the type of the adhesive layer is liquid, the liquid adhesive in the adhesive layer will be from the side when the two substrates are pressed during the bonding process. Flow overflow; when the type of the adhesive layer is solid, the surface of the adhesive layer is dry and has a problem of lack of compressive elasticity; and when the type of the adhesive layer is solid or condensed, it is applied to a hard substrate When bonding to a hard substrate, it is easier to form bubbles between the two rigid substrates because the air is not easily removed, and if the alignment is inaccurate, it is difficult to adjust the alignment error.
因此，有必要提供一種黏合方法，來解決習知技術所存在的問題。Therefore, it is necessary to provide a bonding method to solve the problems of the prior art.
有鑑於此，本發明提供一種基板黏合方法，以改進習知技術中所存在之問題。In view of this, the present invention provides a substrate bonding method to improve the problems in the prior art.
本發明的主要目的在於提供一種基板黏合方法，其係藉由在一基板上形成黏合層，並對該黏合層實施預固化程序，以使該黏合層之部份呈液態，而部份呈凝態，而後將另一基板設置於此態樣之黏合層上。本發明的基板黏合方法除了可以調整前述兩基板之間的對位誤差，更可以解 決黏合劑流溢的問題。The main object of the present invention is to provide a substrate bonding method by forming an adhesive layer on a substrate and pre-curing the adhesive layer so that a part of the adhesive layer is in a liquid state and a part is condensed. Then, another substrate is placed on the adhesive layer of this aspect. In addition to adjusting the alignment error between the two substrates, the substrate bonding method of the present invention can be solved. The problem of adhesive sticking out.
為達成上述目的，本發明提供一種基板黏合方法，其包括下列步驟：提供一第一基板；塗佈一黏合劑於該第一基板上，以形成一黏合層；對該黏合層實施預固化程序，以使該黏合層之部份呈液態，而部份呈凝態，該呈液態之黏合層部分所佔的體積比例是小於該呈凝態之黏合層部分所佔的體積比例；以及提供一第二基板，且將該第二基板設置於該黏合層上。In order to achieve the above object, the present invention provides a substrate bonding method, comprising the steps of: providing a first substrate; applying an adhesive on the first substrate to form an adhesive layer; and performing a pre-curing process on the adhesive layer So that a portion of the adhesive layer is in a liquid state, and a portion is in a condensed state, and the proportion of the volume of the adhesive layer in the liquid state is smaller than the volume ratio of the portion of the adhesive layer in the condensed state; a second substrate, and the second substrate is disposed on the adhesive layer.
在本發明的一實施例中，該黏合劑包括紫外線固化型黏合劑或熱固化型黏合劑。In an embodiment of the invention, the adhesive comprises an ultraviolet curing adhesive or a thermosetting adhesive.
在本發明的一實施例中，該黏合劑為紫外線固化型黏合劑，且於該預固化程序中是以紫外線照射該黏合層進行預固化。In an embodiment of the invention, the adhesive is an ultraviolet curing adhesive, and the adhesive layer is pre-cured by ultraviolet irradiation in the pre-curing process.
在本發明的一實施例中，該黏合劑為熱固化型黏合劑，且於該預固化程序中是加熱該黏合層進行預固化。In an embodiment of the invention, the adhesive is a thermosetting adhesive, and in the pre-curing process, the adhesive layer is heated for pre-curing.
在本發明的一實施例中，在該第二基板設置於該黏合層上之後更包括下列步驟：對該黏合層實施完全固化程序。In an embodiment of the invention, after the second substrate is disposed on the adhesive layer, the method further includes the step of: performing a complete curing process on the adhesive layer.
本發明基板黏合方法係藉由在一基板上形成黏合層，並對該黏合層實施預固化程序，以使該黏合層之部份呈液態，而部份呈凝態，而後將另一基板設置於此態樣之黏合層上。相較於先前技術而言，本發明除了可以調整前述兩基板之間的對位誤差，更可以解決黏合劑流溢的問題。The substrate bonding method of the present invention comprises forming an adhesive layer on a substrate, and pre-curing the adhesive layer so that a part of the adhesive layer is in a liquid state, and a part is in a condensed state, and then the other substrate is set. On the adhesive layer of this aspect. Compared with the prior art, the present invention can solve the problem of adhesive overflow even if the alignment error between the two substrates can be adjusted.
10‧‧‧第一玻璃基板10‧‧‧First glass substrate
20a‧‧‧液態黏合層20a‧‧‧Liquid adhesive layer
20b‧‧‧具液態及凝態之黏合層20b‧‧‧liquid and condensed adhesive layer
20c‧‧‧凝態黏合層20c‧‧‧Condensed adhesive layer
201‧‧‧呈液態之黏合層部分201‧‧‧liquid adhesive layer
202‧‧‧呈凝態之黏合層部分202‧‧‧Condensed adhesive layer
30‧‧‧第二玻璃基板30‧‧‧Second glass substrate
S11~S15‧‧‧步驟S11~S15‧‧‧Steps
第1圖為本發明實施例中基板黏合方法的步驟流程圖。FIG. 1 is a flow chart showing the steps of a substrate bonding method according to an embodiment of the present invention.
第2a圖為本發明實施例中基板黏合方法的一具體實施方式之第一流程示意圖。FIG. 2a is a first schematic flowchart of a specific embodiment of a substrate bonding method according to an embodiment of the present invention.
第2b圖為本發明實施例中基板黏合方法的一具體實施方式之第二流程示意圖。FIG. 2b is a second schematic flowchart of a specific embodiment of a substrate bonding method according to an embodiment of the present invention.
第2c圖為本發明實施例中基板黏合方法的一具體實施方式之第三流程示意圖。FIG. 2c is a third schematic flowchart of a specific embodiment of a substrate bonding method according to an embodiment of the present invention.
第2d圖為本發明實施例中基板黏合方法的一具體實施方式之第四流程示 意圖。FIG. 2d is a fourth flowchart showing a specific implementation manner of a substrate bonding method according to an embodiment of the present invention; intention.
第2e圖為本發明實施例中基板黏合方法的一具體實施方式之第五流程示意圖。FIG. 2e is a fifth schematic flowchart of a specific embodiment of a substrate bonding method according to an embodiment of the present invention.
第2f圖為本發明實施例中基板黏合方法的一具體實施方式之第六流程示意圖。FIG. 2f is a sixth schematic flowchart of a specific embodiment of a substrate bonding method according to an embodiment of the present invention.
為詳細說明本發明之技術內容、構造特徵、所達成目的及功效，以下茲舉例並配合圖式詳予說明。In order to explain the technical content, structural features, objectives and effects of the present invention in detail, the following detailed description is given by way of example.
請參閱第1圖，其係為本發明實施例中基板黏合方法的步驟流程圖，該方法包括下列步驟：在步驟S11中，提供一第一基板。在本實施例中，該第一基板包含可撓性基板、玻璃基板或塑膠基板等，但本發明不受限於此。Referring to FIG. 1 , which is a flow chart of steps of a substrate bonding method according to an embodiment of the present invention, the method includes the following steps: In step S11 , a first substrate is provided. In the embodiment, the first substrate includes a flexible substrate, a glass substrate, a plastic substrate, or the like, but the invention is not limited thereto.
在步驟S12中，塗佈一黏合劑於該第一基板上，以形成一黏合層。該黏合劑包含紫外線固化型黏合劑或熱固化型黏合劑。In step S12, an adhesive is applied on the first substrate to form an adhesive layer. The adhesive comprises an ultraviolet curable adhesive or a thermosetting adhesive.
在步驟S13中，對該黏合層實施預固化程序，以使該黏合層之部份呈液態，而部份呈凝態。在前述預固化程序中，如果該黏合劑為紫外線固化型黏合劑時，於該預固化程序中是藉由控制紫外線的功率及/或照射時間來照射該黏合層，以實現由該紫外線固化型黏合劑所構成之黏合層的預固化。如果該黏合劑為熱固化型黏合劑時，於該預固化程序中則是藉由控制加熱的溫度及/或加熱時間來加熱該黏合層，以實現由該熱固化型黏合劑所構成之黏合層的預固化。經過預固化的黏合層中，該呈液態之黏合層部分所佔的體積比例是小於該呈凝態之黏合層部分所佔的體積比例，在本發明一實施例中，該呈凝態之黏合層部分所佔的體積比例可以是介於80~99%之間，其餘為該呈液態之黏合層部分。In step S13, the adhesive layer is subjected to a pre-curing process such that a portion of the adhesive layer is in a liquid state and a portion is in a condensed state. In the pre-curing process, if the adhesive is an ultraviolet curing adhesive, the adhesive layer is irradiated by controlling the power and/or the irradiation time of the ultraviolet light in the pre-curing process to realize the ultraviolet curing type. Pre-curing of the adhesive layer formed by the adhesive. If the adhesive is a heat curing adhesive, in the pre-curing process, the adhesive layer is heated by controlling the heating temperature and/or the heating time to achieve the bonding formed by the heat curing adhesive. Pre-curing of the layer. In the pre-cured adhesive layer, the proportion of the volume of the adhesive layer in the liquid state is smaller than the proportion of the volume of the adhesive layer in the condensed state. In an embodiment of the invention, the condensed state is bonded. The proportion of the volume occupied by the layer portion may be between 80 and 99%, and the rest is the portion of the adhesive layer which is in a liquid state.
在步驟S14中，提供一第二基板，且將該第二基板設置於該黏合層上。該第二基板包含可撓性基板、玻璃基板或塑膠基板等，但本發明不受限於此。In step S14, a second substrate is provided, and the second substrate is disposed on the adhesive layer. The second substrate includes a flexible substrate, a glass substrate, a plastic substrate, or the like, but the present invention is not limited thereto.
在步驟S15中，對該黏合層實施完全固化程序。在所述完全固化程序中，如果該黏合劑為紫外線固化型黏合劑時，於該完全固化程 序中是以紫外線照射該黏合層進行完全固化。如果該黏合劑為熱固化型黏合劑時，於該完全固化程序中則是加熱該黏合層進行完全固化。該完全固化程序之目的是將該預固化程序後呈液態之黏合層部分完全地固化成凝態。In step S15, a complete curing process is performed on the adhesive layer. In the complete curing process, if the adhesive is an ultraviolet curing adhesive, in the complete curing process In the sequence, the adhesive layer is irradiated with ultraviolet rays for complete curing. If the adhesive is a heat curing adhesive, the adhesive layer is heated to complete curing in the complete curing process. The purpose of the full cure procedure is to completely cure the portion of the adhesive layer that is in a liquid state after the pre-cure procedure to a condensed state.
由於不同的黏合劑之組成、特性殊異而有不同的固化程序及其操作條件，且本發明所屬技術領域中具有通常知識者可以瞭解該等黏合劑所對應的固化程序及其操作條件，故本發明未明確地指出黏合劑之組成及其所對應之固化程序的操作條件。以下依上述實施例舉出一具體實作範例來進一步詳細說明本發明的基板黏合方法。Different curing procedures and operating conditions are different due to different composition and characteristics of different adhesives, and those having ordinary knowledge in the technical field of the present invention can understand the curing procedures and operating conditions corresponding to the adhesives. The present invention does not explicitly indicate the composition of the binder and the operating conditions of the corresponding curing procedure. The substrate bonding method of the present invention will be further described in detail below by way of a specific example of the above embodiments.
本發明基板黏合方法的一種具體實施方式，請參閱第2a至2f圖，其中第2c圖的空心箭頭是代表一基於預固化的紫外光源，而第2e圖的實心箭頭則是代表一基於完全固化的紫外光源，前述預固化及完全固化是透過控制紫外光的照射時間及/或功率而實現的。首先提供一第一玻璃基板10。再將一紫外線固化型黏合劑藉由狹縫式塗佈設備(圖中未示)塗佈於該第一玻璃基板10上，形成一液態黏合層20a，於此流程中，該液態黏合層20a為全部呈液態(即第2b圖中呈液態之黏合層部分201)。而後以基於預固化的紫外光照射該液態黏合層20a，進而反應成為一具液態及凝態之黏合層20b，該具液態及凝態之黏合層20b意指其部份呈液態(如第2c圖中呈液態之黏合層部分201)，且部份呈凝態(如第2c圖中呈凝態之黏合層部分202)。接續提供一第二玻璃基板30，且將該第二玻璃基板30設置於該具液態及凝態之黏合層20b上。最後以基於完全固化的紫外光照射該具液態及凝態之黏合層20b，進而反應成為一凝態黏合層20c，因而實現了本發明的基板黏合方法。For a specific embodiment of the substrate bonding method of the present invention, please refer to Figures 2a to 2f, wherein the hollow arrow of Figure 2c represents a pre-cured ultraviolet light source, and the solid arrow of Figure 2e represents a complete curing. The ultraviolet light source, the pre-curing and the complete curing are realized by controlling the irradiation time and/or power of the ultraviolet light. First, a first glass substrate 10 is provided. A UV-curable adhesive is applied to the first glass substrate 10 by a slit coating apparatus (not shown) to form a liquid adhesive layer 20a. In the process, the liquid adhesive layer 20a is formed. It is all in a liquid state (i.e., the adhesive layer portion 201 which is liquid in Figure 2b). Then, the liquid adhesive layer 20a is irradiated with pre-cured ultraviolet light, and then reacted into a liquid and condensed adhesive layer 20b. The liquid and condensed adhesive layer 20b means that the portion thereof is in a liquid state (eg, 2c). The figure is in the form of a liquid adhesive layer portion 201), and the portion is in a condensed state (as in the condensed layer portion 202 in Figure 2c). A second glass substrate 30 is successively provided, and the second glass substrate 30 is disposed on the adhesive layer 20b having a liquid state and a condensed state. Finally, the adhesive layer 20b having a liquid state and a condensed state is irradiated based on the completely cured ultraviolet light, and further reacted to form a cohesive adhesive layer 20c, thereby realizing the substrate bonding method of the present invention.
如上所述，本發明的基板黏合方法係藉由對該第一玻璃基板10上之該液態黏合層20a實施預固化程序，以使該液態黏合層20a之部份呈液態(標號201)，而部份呈凝態(標號202)，而後以此態樣之黏合層(亦即具液態及凝態之黏合層20b)連結該第二玻璃基板30。於此，由於該具液態及凝態之黏合層20b的表面呈現少許液態(標號201)，故於該第二玻璃基板30設置於該具液態及凝態之黏合層20b上後可以調整其對位誤差；再 者，由於該具液態及凝態之黏合層20b中的大部分為呈現凝態(標號202)，因此於該第二玻璃基板30壓合於該具液態及凝態之黏合層20b上後較不會有黏合劑流溢的問題產生。As described above, the substrate bonding method of the present invention is performed by pre-curing the liquid bonding layer 20a on the first glass substrate 10 such that a portion of the liquid bonding layer 20a is in a liquid state (reference numeral 201). The portion is in a condensed state (reference numeral 202), and then the second glass substrate 30 is joined by the adhesive layer (that is, the adhesive layer 20b having a liquid state and a condensed state) in this state. Here, since the surface of the adhesive layer 20b having a liquid state and a condensed state exhibits a slight liquid state (reference numeral 201), the second glass substrate 30 can be adjusted after being disposed on the adhesive layer 20b having a liquid state and a condensed state. Bit error; Since most of the adhesive layer 20b having a liquid state and a condensed state exhibits a condensed state (reference numeral 202), after the second glass substrate 30 is pressed against the adhesive layer 20b having a liquid state and a condensed state, There will be no problems with adhesive spillage.
雖然本發明已用較佳實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
S11~S15‧‧‧步驟S11~S15‧‧‧Steps
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