JP4981190B1 - Manufacturing method of bonding device - Google Patents

Abstract

Substrates are bonded together while maintaining the outer shape of an adhesive in a cured shape.
An adhesive 3 is applied to the inner surface of either a first substrate 1 or a second substrate 2 in the same shape as when cured, and the viscosity of only the peripheral portion 3a of the adhesive 3 is kept adhesive. The first substrate 1 and the second substrate 2 are bonded so that the adhesive 3 including the peripheral edge portion 3a is sandwiched between the first substrate 1 and the second substrate 2 so as to be partially semi-cured so as to be higher than the viscosity of other portions. Thus, even if the central portion 3b surrounded by the peripheral edge portion 3a of the adhesive 3 is in an uncured state, it is blocked by the semi-cured peripheral edge portion 3a and does not extend outward.
[Selection] Figure 1

Description

The present invention includes, for example, a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flat panel display (FPD) such as a flexible display, a touch panel, a 3D (three-dimensional) display, an electronic book, etc. It is related with the manufacturing method of the bonding device which adhere | attaches another board | substrates, such as a cover glass and FPD, with respect to such board | substrates, such as FPD.
In detail, it is related with the manufacturing method of the bonding device which bonds the 1st board | substrate and 2nd board | substrate which oppose so that the adhesive agent apply | coated between them may be pinched | interposed.

Conventionally, as a method of manufacturing a bonding device for a substrate, when adhering dust-proof glass on a liquid crystal panel, first, the adhesive is partially supplied only near the center on the surface of the substrate arranged on the bonding side of the liquid crystal panel. Next, the dust-proof glass adsorbed by the suction pressure member is moved, placed on the substrate to which the adhesive has already been supplied, and pressurized as it is along the interface between the dust-proof glass and the substrate. It is uniformly spread toward the outer edge of the substrate, and then fixed by curing the adhesive (for example, see Patent Document 1).
In addition, a groove for storing the adhesive resin protruding from the substrate is provided in the peripheral portion of the surface to be the bonding surface of one or both of the two substrates, and first, at least the bonding surface of the two substrates The adhesive resin is dropped only near the center on one surface, and then the two substrates are joined so that the adhesive resin is sandwiched between them, and the adhesive resin is uniformly distributed by a pressing means. There is also a method in which the adhesive resin is cured by ultraviolet irradiation or heat treatment by a heating device after unfolding and the excess adhesive resin flows into the resin reservoir groove (see, for example, Patent Document 2).

JP 2007-240914 A JP-A-8-36151

However, in such a conventional method of manufacturing a bonding device, since the adhesive is applied only to the vicinity of the center of the substrate and then pressed and extended, the adhesive partially protrudes from the peripheral edge of the substrate or adheres. There is a problem that it is difficult to shape the adhesive in accordance with the outer shape of the substrate, for example, the agent does not reach the peripheral edge of the substrate and is insufficient. Since the size of the extended adhesive changes slightly depending on the pressure between the substrates, it is inferior in accuracy, and it is necessary to finely adjust the pressure between the substrates according to changes in the temperature and humidity of the manufacturing environment. There was also a problem that productivity was inferior.
Furthermore, depending on the kind of the bonding device, there is a demand for the film thickness (thickness dimension) of the adhesive to be about 0.1 to 0.5 mm. Since this size is several tens of times larger than the film thickness (about 1 to 10 μm) of an adhesive in a general LCD, the fluidity of the adhesive is large, and the method of pressing and extending the adhesive requires a substrate. There was a problem that it was difficult to deal with, such as the adhesive flowing out from the periphery of.
In addition, there is a possibility that bubbles may be generated in the process of extending the adhesive, and in particular, when the adhesive includes a curing control material having gas generating properties, the curing control material is gasified in a vacuum atmosphere. Due to the bubbles, there was a problem that the substrates could not be bonded together completely without bubbles.

  An object of the present invention is to cope with such a problem, and it is an object of the present invention to bond substrates together while maintaining the outer shape of an adhesive in a cured shape.

  In order to achieve such an object, the present invention is a method for manufacturing a bonding device in which a first substrate and a second substrate facing each other are bonded so that a liquid adhesive applied therebetween is sandwiched therebetween. The step of applying the adhesive to the inner surface of either the first substrate or the second substrate from the beginning in the same shape as the outer shape at the time of curing, and the viscosity of the peripheral portion of the adhesive is adhesive The first substrate and the second substrate are bonded together so that the entire adhesive including the peripheral portion is sandwiched between the step of partially curing so as to be higher than the viscosity of other parts while being held. And a step of causing the step to occur.

In the present invention having the above-described features, after the adhesive is applied to the inner surface of one of the first substrate and the second substrate in the same shape as when cured, the viscosity of the peripheral edge of the adhesive is kept adhesive. Adhering by bonding the first substrate and the second substrate so that the entire adhesive including the peripheral part is sandwiched between the first substrate and the semi-cured partially so as to be higher than the viscosity of the other part as it is Even if the central part surrounded by the peripheral part of the agent is in an uncured state, it is blocked by the semi-cured peripheral part and does not extend outside, so the substrate is maintained while maintaining the outer shape of the adhesive in the shape at the time of curing. They can be joined together.
As a result, compared to the conventional method in which the adhesive is applied only near the center of the substrate and pressed and stretched, the fluidity of the adhesive protrudes from the periphery of the substrate and the adhesive does not reach the periphery of the substrate. It can be prevented and has excellent adhesive formability.
Furthermore, even if the adhesive is pressed along with the bonding between the substrates, the size of the adhesive does not change, so it is excellent in accuracy, and the adhesive is applied in the same shape as at the time of curing from the application, Since it is not necessary to finely adjust the degree of pressing between the substrates according to changes in the temperature and humidity of the manufacturing environment, the productivity is excellent.
Furthermore, when manufacturing a bonding device in which the film thickness (thickness dimension) of the adhesive is much thicker than the film thickness of the adhesive in a general LCD, the adhesive does not flow out from the peripheral edge of the substrate. Easy to handle.

It is explanatory drawing which shows the whole structure of the manufacturing method of the bonding device which concerns on embodiment of this invention, (a) is a partially notched longitudinal front view of a coating process, (b) is a partially notched longitudinal front of a periphery hardening process. FIG. 4C is a partially cut longitudinal front view of the center curing process, and FIG. 4D is a partially cut longitudinal front view of the attaching process. (A) is a reduction | restoration top view of the application | coating process shown by Fig.1 (a), (b) is a reduction | restoration top view of the periphery hardening process shown by FIG.1 (b).

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1-2, the manufacturing method of the bonding device A which concerns on embodiment of this invention is a liquid adhesive apply | coated between the pair of 1st board | substrate 1 and 2nd board | substrate 2 which oppose between them. This is a method used for joining so that 3 is sandwiched.
As the manufacturing method of the bonding device A, the application | coating process which apply | coats the adhesive agent 3 to the inner surface of either one of the 1st board | substrate 1 or the 2nd board | substrate 2 from the beginning in the same shape as the outer shape at the time of hardening, and the apply | coated adhesion | attachment A peripheral curing step in which the peripheral edge 3a of the agent 3 is partially semi-cured so that the viscosity thereof is higher than the viscosity of other parts while maintaining adhesiveness, and the adhesive 3 including the semi-cured peripheral edge 3a A bonding step of bonding the first substrate 1 and the second substrate 2 so as to be sandwiched between them.

As the first substrate 1 and the second substrate 2, for example, a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flat panel display (FPD) such as a flexible display, for example, a touch panel or 3D (3 Dimension) FPD used for displays and electronic books, and transparent glass substrates, transparent plastic films such as PES (Poly-Ether-Sulphone), synthetic resin substrates, cover glass, barrier glass, and the like are used.
In addition, the first substrate 1 and the second substrate 2 may be one before separation in which a plurality of the first substrate 1 and the second substrate 2 are juxtaposed in the manufacturing stage.
Furthermore, it is preferable that the outer shapes of the first substrate 1 and the second substrate 2 are formed to have the same size, for example, a rectangle, and are bonded so that the outer edges overlap each other in the bonding step.

As the adhesive 3, for example, a photo-curing adhesive having a photo-curing property which is cured by absorbing light energy and developing due to the progress of polymerization is used. Further, instead of the photo-curing adhesive, it is also possible to use a thermosetting adhesive or a two-component mixed curing adhesive that is cured by polymerization by absorption of thermal energy.
Furthermore, when the adhesive 3 is applied to either the first substrate 1 or the second substrate 2, the viscosity, specifically, the degree of polymerization (degree of curing) is low and has fluidity, Although the fluidity decreases as the viscosity (degree of polymerization, degree of cure) increases by absorbing heat energy, etc., it is deformable and the surface of the adhesive 3 does not solidify and maintains the adhesive property This is called a semi-cured state. The semi-cured adhesive 3 is further hard to be deformed by absorbing light energy, heat energy, and the like, and is in a fully cured state.
As a specific example of the adhesive 3, for example, an ultraviolet curable adhesive made of, for example, an acrylic UV curable resin or a silicon UV curable resin is used, and the curing control has an oxygen inhibition property that the surface does not harden particularly in the air. It is preferable to use a material containing a material. In many cases, this type of curing control material has the property of being gasified in a vacuum atmosphere.

Moreover, the adhesive agent 3 is made into the same desired shape as the outer shape at the time of hardening from the beginning with respect to the inner surface of either one of the first substrate 1 or the second substrate 2 using, for example, a quantitative discharge nozzle composed of a dispenser or the like. It is preferable to apply.
In addition, before apply | coating the adhesive agent 3, the bubble mixed in the adhesive agent 3 is deaerated, and care must be taken so that an air bubble may not be involved at the time of application | coating.

In the specific example of the coating process shown in FIG. 1A and FIG. 2A, the adhesive 3 is applied to the inner surface 1a of the first substrate 1 in the atmosphere, and the outer surfaces of the first substrate 1 and the second substrate 2 are removed. It is applied in a rectangular shape along the shape.
Although not shown in the drawings as other examples, the adhesive 3 is applied by printing or the like instead of the fixed discharge nozzle, the adhesive 3 is applied to the inner surface 2a of the second substrate 2, or the first substrate 1 or the second substrate 2 is used. It is also possible to apply the adhesive 3 to a shape other than a rectangle on the inner surface of one of the substrates 2.

In the specific example of the peripheral curing step in which the peripheral edge 3a of the applied adhesive 3 is semi-cured, a case where a light curable adhesive is used as the adhesive 3 and a light shielding mask 4 is used is shown.
Specifically, as shown in FIGS. 1B and 2B, a flat light-shielding mask 4 is disposed so as to cover the central portion 3b of the adhesive 3 surrounded by the peripheral edge portion 3a. Light L such as ultraviolet rays is irradiated from a light source (not shown) so as to sandwich the mask 4.
Moreover, when using point light sources, such as LED, it is also possible to irradiate a point light source along the peripheral part 3a.
As a result, only the peripheral edge 3a of the adhesive 3 absorbs light energy in a frame shape and gels, and the frame-shaped peripheral edge 3a also gels on its surface but is in a semi-cured state that retains adhesion. .
In particular, when the adhesive 3 includes a curing control material having oxygen inhibition properties, the surface layer of the peripheral edge portion 3a is not completely solidified in the air because of the oxygen inhibition properties, and the adhesiveness remains.
Although not shown in the drawings as another example, instead of the light beam L such as ultraviolet rays, the heat source is irradiated toward only the peripheral portion 3a, so that the heat energy is absorbed and gelled to form the peripheral portion 3a. Semi-curing is also possible.

Further, if necessary, it is preferable to include a leveling step for leaving the state for a predetermined time after the peripheral edge curing step.
By this leveling step, the surfaces of the peripheral edge portion 3a and the central portion 3b of the adhesive 3 in a semi-cured state are naturally smoothed, and bubbles that are entrained during application can be naturally defoamed.

Then, after the peripheral curing step, as shown in FIG. 1 (c), a central curing step of semi-curing the central portion 3b of the adhesive 3 surrounded by the peripheral portion 3a so as to increase its viscosity, It is preferable to include a bonding step of bonding the first substrate 1 and the second substrate 2 so that the entire adhesive 3 including the semi-cured peripheral edge portion 3a and the center portion 3b is sandwiched.
In the specific example shown in FIG. 1C, after the light shielding mask 4 covering the central portion 3b of the adhesive 3 is removed, the light source L is selectively irradiated on the entire surface or the central portion 3b from the light source. By doing so, the central portion 3b becomes a semi-cured state that retains the adhesiveness although it is gelled by absorbing light energy.
In particular, when the adhesive 3 includes a curing control material having oxygen inhibition properties, the surface layer of the central portion 3b is not completely solidified in the air due to oxygen inhibition properties, and the surface layer remains adhesive. ing.
Therefore, the adhesive 3 may be formed on the first substrate 1 or the second substrate 2 regardless of the vertical relationship between the two substrates during the bonding process. In addition, by forming the adhesive 3 on both the first substrate 1 and the second substrate 2, it is easy to form a thick film of the much thicker adhesive 3.
Although not shown as another example, a frame-shaped shading mask that covers the peripheral edge 3 a is provided so that the viscosity of the already semi-cured peripheral edge 3 a does not increase, and light is applied only to the central part 3 b of the adhesive 3. Irradiated with L and semi-cured, or irradiated with heat rays or the like from the heat source instead of the light beam L such as ultraviolet rays toward the central portion 3b, or the semi-cured peripheral after the peripheral curing step without including the central curing step It is also possible to execute a bonding step of bonding the first substrate 1 and the second substrate 2 so that the entire adhesive 3 including the portion 3a and the uncured center portion 3b is sandwiched.

In the specific example of the bonding process shown in FIG. 1D, the inner surface 2a of the second substrate 2 is made of the adhesive 3 with respect to the first substrate 1 coated with the adhesive 3 in a vacuum or in the atmosphere. The first substrate 1 and the second substrate 2 are bonded so as to be parallel to each other with the adhesive 3 interposed therebetween so as to be in contact with the surface 3c.
Specifically, an elevating drive unit (not shown) that moves either one or both of the first substrate 1 and the second substrate 2 toward each other is provided. This lifting drive unit is controlled by a controller (not shown) and approaches the first substrate 1 and the second substrate 2 until the distance between the inner surfaces 1a and 2a is substantially the same as the coating height of the adhesive 3. It is configured to move.

In addition, as a post-process of the coalescence process, light L such as ultraviolet rays or heat rays are semi-cured in a state where the process is carried to a place where the coalescence process is performed or a place different from the place where the coalescence process is performed. It is preferable to irradiate the peripheral portion 3a in the state and the central portion 3b in the semi-cured state or the uncured state to perform the main curing.
Thereby, the viscosity of the adhesive 3 as a whole is further increased to be in a completely bonded state that cannot be deformed, and the first substrate 1 and the second substrate 2 have an even filling film thickness ( A bonding device A bonded so as to be sandwiched by a gap) is produced.

According to the manufacturing method of the bonding device A according to such an embodiment of the present invention, either the first substrate 1 or the second substrate 2 is applied in the coating step shown in FIG. 1 (a) and FIG. 2 (a). After the adhesive 3 is applied to one inner surface 1a in the same shape as when it is cured (semi-cured and fully cured), the peripheral edge of the adhesive 3 is subjected to the peripheral curing step shown in FIGS. 1 (b) and 2 (b). Only the part 3a is partially semi-cured so that the viscosity thereof is higher than the viscosity of other parts while maintaining the adhesiveness, and then the peripheral part 3a is formed in the attaching step shown in FIG. In order to bond the first substrate 1 and the second substrate 2 so that the entire adhesive 3 is sandwiched, even if the central portion 3b surrounded by the peripheral portion 3a of the adhesive 3 is in an uncured state, It is blocked by the semi-cured peripheral edge 3a and does not extend outward.
Thereby, the substrates 1 and 2 can be bonded together while maintaining the outer shape of the adhesive 3 in the shape at the time of curing. Therefore, the adhesive 3 can be prevented from protruding due to the fluidity, and the adhesive 3 has excellent formability.

In particular, after the peripheral curing step, the central portion 3b of the adhesive 3 is semi-cured so as to increase its viscosity in the central curing step shown in FIG. 1 (c), and then shown in FIG. 1 (d). When the first substrate 1 and the second substrate 2 are bonded so that the entire adhesive 3 including the semi-cured peripheral portion 3a and the center portion 3b is sandwiched in the bonding step, the first substrate 1 And before bonding of the 2nd board | substrate 2, the whole adhesive agent 3 of the peripheral part 3 and the center part 3b is a semi-hardened state.
Thereby, the flow of the adhesive 3 after the bonding of the substrates 1 and 2 can be completely prevented. Therefore, even if the bonded substrates 1 and 2 are transported or moved upside down in order to fully cure the adhesive 3, it is possible to avoid the problem of quality degradation and to increase the degree of freedom in production. improves.
Next, an embodiment of the present invention will be described with reference to the drawings.

In this embodiment, the adhesive 3 includes a curing control material that gasifies in a vacuum atmosphere, and the entire adhesive 3 including the peripheral portion 3a and the center portion 3b in which the bonding process is semi-cured in the vacuum atmosphere is sandwiched. The first substrate 1 and the second substrate 2 are bonded together.
In the example shown in FIG. 1D, the first substrate 1 and the second substrate 2 are bonded together inside the chamber 5 maintained at a predetermined degree of vacuum.

Furthermore, it is preferable to pressurize so that the inner surface of the other one of the 1st board | substrate 1 or the 2nd board | substrate 2 may contact | adhere with respect to the surface 3c of the adhesive agent 3 in a bonding process.
In the example shown by the two-dot chain line in FIG. 1 (d), the second substrate 2 is applied to the adhesive 3 applied to the first substrate 1 by the elevating drive unit, and the inner surface 2 a is the surface 3 c of the adhesive 3. It is moved and pressed so as to come into pressure contact.

According to the manufacturing method of the bonding device A according to the embodiment of the present invention, air is not left between the first substrate 1 and the second substrate 2 and the surface 3c of the adhesive 3 in a vacuum atmosphere. At the same time, the peripheral edge portion 3a and the central portion 3b are semi-cured (gelled), and the internal curing control material does not come into contact with the vacuum atmosphere, so that it is not gasified and bubbles are not generated.
Thereby, the substrates 1 and 2 can be bonded together without bubbles. Therefore, there is an advantage that the bubble-free quality can be ensured.

Furthermore, in the bonding step, when the other inner surface of the first substrate 1 or the second substrate 2 is pressed against the surface 3c of the adhesive 3, the surface 3a of the adhesive 3 is used. Concavities and convexities generated in the film are smoothly deformed and adhered.
Thereby, the bubble remaining at the time of joining the substrates 1 and 2 can be further reduced. Therefore, there is also an advantage that the bubble-free quality can be further improved.

  In the previous embodiment, the adhesive 3 includes a curing control material that is gasified in a vacuum atmosphere, and the entire adhesive 3 including the peripheral edge portion 3a and the center portion 3b in which the bonding process is semi-cured in the vacuum atmosphere. Although the 1st board | substrate 1 and the 2nd board | substrate 2 were joined so that it might be pinched | interposed, it is not limited to this, The adhesive agent 3 which does not contain a hardening control material is used, or the 1st board | substrate 1 is used in the atmosphere in the joining process And the second substrate 2 may be bonded together.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 1a Inner surface 2 2nd board | substrate 2a Inner surface 3 Adhesive 3a Peripheral part 3b Center part 3c Surface

Claims (4)

A method of manufacturing a bonding device, wherein a first substrate and a second substrate facing each other are bonded so that a liquid adhesive applied therebetween is sandwiched,
Applying the adhesive on the inner surface of either the first substrate or the second substrate from the beginning in the same shape as the outer shape at the time of curing;
A step of partially semi-curing the peripheral edge of the adhesive such that the viscosity is higher than the viscosity of other parts while maintaining the adhesiveness;
And a step of bonding the first substrate and the second substrate so that the entire adhesive including the peripheral portion is sandwiched.   After the step of partially semi-curing the peripheral portion of the adhesive, the step of semi-curing the central portion of the adhesive surrounded by the peripheral portion so that the viscosity is increased while maintaining adhesiveness; The bonding device according to claim 1, further comprising a step of bonding the first substrate and the second substrate so that the entire adhesive including the peripheral portion and the center portion is sandwiched. Production method. The adhesive includes a curing control material that gasifies in a vacuum atmosphere,
3. The step of bonding the first substrate and the second substrate so that the whole of the adhesive including the peripheral portion and the center portion in a semi-cured state is sandwiched in a vacuum atmosphere. The manufacturing method of the bonding device of description.   In the step of bonding the first substrate and the second substrate, pressurizing the inner surface of either the first substrate or the second substrate so as to be in close contact with the surface of the adhesive. The manufacturing method of the bonding device of Claim 3 characterized by the above-mentioned.

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