TWI541562B - The manufacturing method of the bonding element - Google Patents

The manufacturing method of the bonding element Download PDF

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Publication number
TWI541562B
TWI541562B TW101145326A TW101145326A TWI541562B TW I541562 B TWI541562 B TW I541562B TW 101145326 A TW101145326 A TW 101145326A TW 101145326 A TW101145326 A TW 101145326A TW I541562 B TWI541562 B TW I541562B
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TW
Taiwan
Prior art keywords
substrate
bonding
bonding agent
adhesive
peripheral portion
Prior art date
Application number
TW101145326A
Other languages
Chinese (zh)
Other versions
TW201335663A (en
Inventor
Michiya Yokota
Ryou Hasegawa
Original Assignee
Shinetsu Eng Co Ltd
Shinko Engineering Co Ltd
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Filing date
Publication date
Priority to JP2011269229A priority Critical patent/JP4981190B1/en
Application filed by Shinetsu Eng Co Ltd, Shinko Engineering Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW201335663A publication Critical patent/TW201335663A/en
Application granted granted Critical
Publication of TWI541562B publication Critical patent/TWI541562B/en

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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/28Adhesive materials or arrangements

Description

Manufacturing method of bonding component

The present invention relates to a method of manufacturing a bonding component, such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or the like, or a touch panel display (FPD). A panel or a substrate such as a 3D (3D) display or an FPD such as an e-book is bonded to another substrate such as a cover glass or an FPD.

More specifically, it relates to a method of manufacturing a bonding element in which a first substrate and a second substrate are bonded to each other such that a coated adhesive is interposed therebetween.

When a dust-proof glass is bonded to a liquid crystal panel as a method of manufacturing a bonding element for a substrate, first, a bonding agent is locally supplied only in the vicinity of the center of the surface of the substrate disposed on the bonding side of the liquid crystal panel. Then, the dust-proof glass adsorbed by the adsorption pressurizing member is moved, and the substrate on which the adhesive has been supplied is placed, and pressurized in this state, so that the adhesive is uniformly distributed toward the outer side of the substrate along the interface between the dust-proof glass and the substrate. The expansion is then carried out by hardening the above-mentioned binder (for example, refer to Patent Document 1).

Further, there is a method of providing a groove for accumulating the adhesive resin overflowing from the substrate on the outer peripheral surface of the surface of the bonding surface of one or both of the two substrates, firstly, The adhesive resin is dropped on only one of the faces of at least one of the bonding faces of the substrate, and then bonded by sandwiching the adhesive resin In the above-mentioned two substrates, the above-mentioned adhesive resin is uniformly spread by a pressurizing member, and the excess adhesive resin is poured into the resin storage tank, and then the adhesive resin is cured by heat treatment by ultraviolet irradiation or a heating device (for example, See Patent Document 2).

[Previous Technical Literature]

Patent Document 1: Japanese Patent Publication No. 2007-240914

Patent Document 2: Japanese Patent Publication No. Hei 8-36151

However, in the manufacturing method of the conventional bonding element, the bonding agent is applied only after the application of the bonding agent in the vicinity of the center of the substrate, so that the bonding agent partially overflows from the periphery of the substrate or the bonding agent is partially unable to be partially formed. It is difficult to match the outer shape of the substrate to the problem of the binder by reaching the periphery of the substrate without being sufficient. Since the size of the stretched adhesive is subtly changed depending on the pressing condition of the substrates, the accuracy is poor, and there is also a need to slightly adjust the pressing of the substrates to each other in response to changes in temperature or humidity of the manufacturing environment. Poor question.

Further, depending on the type of the bonding member, the film thickness (thickness dimension) of the bonding agent is required to be about 0.1 to 0.5 mm. This size is tens of times larger than the film thickness of a general LCD adhesive (about 1 to 10 μm), so that the fluidity of the adhesive is large, and the method of pressing the stretching adhesive causes the adhesive to pass from the substrate. It is difficult to respond to problems such as outflows around the periphery.

Further, bubbles may be generated during the process of stretching the binder. Especially when the binder contains a gas-generating hardening control material, the hardening control material is vaporized in a vacuum atmosphere to become a bubble, so that there is no bubble at all. The problem of bonding substrates to each other.

The present invention has been made to solve such a problem, and an object thereof is to bond a substrate to each other while maintaining the outer shape of the bonding agent while being shaped.

In order to achieve the object, the present invention provides a method for manufacturing a bonding component, wherein the bonding component sandwiches the first substrate and the second substrate with the applied liquid bonding agent. In a method of bonding, the manufacturing method includes the steps of: applying the adhesive from the initial surface to the inner surface of the first substrate or the second substrate to be the same as the outer shape at the time of initial hardening a shape in which the peripheral portion of the above-mentioned binder is partially semi-hardened in such a manner as to maintain the adhesiveness while the viscosity thereof becomes higher than that of the other portions; and in such a manner as to sandwich the entirety of the above-mentioned binder including the peripheral portion Bonding the first substrate and the second substrate.

In the invention having the above characteristics, after the adhesive is applied to the inner surface of either of the first substrate or the second substrate to have the same shape as that at the time of curing, only the peripheral portion of the adhesive is partially semi-hardened to The viscosity is made higher than that of other parts while maintaining the adhesiveness, and then the first substrate and the second substrate are bonded by sandwiching the entire adhesive including the peripheral portion, even if the periphery of the adhesive is adhered The center portion of the surrounding portion is in an uncured state, and is also blocked by the semi-hardened peripheral portion without extending outward. Therefore, the outer shape of the bonding agent can be maintained as a shape at the time of hardening while the substrates are bonded to each other.

As a result, compared with the conventional method of applying a binder only in the vicinity of the center of the substrate and pressing it to stretch, it is possible to prevent the binder from overflowing from the periphery of the substrate due to fluidity, or the adhesive cannot reach the periphery of the substrate. The adhesive is excellent in shapeability.

Further, even if the binder is pressed together with the adhesion of the substrates, the size of the binder does not change, so the accuracy is excellent, and the binder is applied from the same shape as that at the time of curing, and it is not necessary to manufacture. The substrate is slightly adjusted in the temperature and humidity of the environment, and the productivity is excellent.

Further, when the film thickness (thickness dimension) of the adhesive is much thicker than that of the film thickness of the general LCD adhesive, the adhesive does not flow out from the periphery of the substrate, and it is easy to respond.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1 to FIG. 2, the manufacturing method of the bonding element A according to the embodiment of the present invention is for sandwiching the first substrate 1 and the second substrate 2 with the liquid binder 3 to be coated. The method of bonding between them.

The manufacturing method of the bonding element A includes a coating step of applying the adhesive 3 from the initial surface to the outer surface of the first substrate 1 or the second substrate 2 a shape having the same shape; a peripheral hardening step, which is partially semi-hardened and coated with the peripheral portion 3a of the adhesive 3 so as to maintain the adhesiveness while the viscosity becomes higher than that of other portions; and the bonding step to the folder The first substrate 1 and the second substrate 2 are bonded to each other including the adhesive 3 of the semi-hardened peripheral portion 3a.

As the first substrate 1 and the second substrate 2, a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or the like, or for example, for a touch panel or 3D is used. (3D) FPDs for displays or e-books, and transparent glass substrates or A transparent plastic film such as PES (Poly-Ether-Sulphone) or a synthetic resin substrate, or a cover glass or a barrier glass.

Further, the first substrate 1 and the second substrate 2 may be formed by arranging a plurality of substrates before the separation of the plurality of first substrates 1 and 2 in the production stage.

Further, the outer shapes of the first substrate 1 and the second substrate 2 are formed to have the same size, for example, a rectangular shape, and it is preferable that the outer edges of the first substrate 1 and the second substrate 2 are bonded to each other in the bonding step.

As the binder 3, for example, a photocurable binder which is cured by absorbing light energy and which is cured to exhibit adhesive photocurability is used. Further, instead of the photocurable adhesive, a thermosetting type binder or a two-liquid type hardening type binder which is cured by superposition of heat energy may be used.

In addition, when the adhesive 3 is applied to either of the first substrate 1 or the second substrate 2, the viscosity, in detail, the degree of overlap (hardness) is low and fluid, and the light energy is absorbed. In the case of thermal energy or the like, the fluidity decreases as the viscosity (coordination degree and degree of hardening) becomes higher, but the gelatinized state in which the surface of the binder 3 is not solidified and remains adhesive is called a semi-hardened state. The semi-hardened binder 3 is hardly deformed by further absorption of light energy, thermal energy, etc., and becomes a substantially hardened state.

As a specific example of the binder 3, for example, an ultraviolet curable adhesive composed of an acrylic UV curable resin or an anthraquinone UV curable resin is used, and a hardening control including oxygen suppression having a surface which does not solidify in air is used. The binder of the material is especially good. In addition, the hardening control material usually has There is a property of gasification in a vacuum atmosphere.

Further, the adhesive 3 is applied to the inner surface of either the first substrate 1 or the second substrate 2 from the beginning to the same shape as the outer shape at the time of curing, using a quantitative discharge nozzle or the like formed of, for example, a dispenser. The desired shape is preferred.

Further, before the application of the binder 3, the bubbles mixed in the binder 3 are degassed in advance, and care must be taken to prevent the bubbles from being caught during coating.

In a specific example of the coating step shown in FIGS. 1(a) and 2(a), the adhesive 3 is applied to the inner surface 1a of the first substrate 1 in the atmosphere along the first substrate 1 and the second. A rectangular shape of the outer shape of the substrate 2.

Further, although not shown, as another example, the binder 3 may be applied by printing or the like instead of the quantitative discharge nozzle, or the adhesive 3 may be applied to the inner surface 2a of the second substrate 2, or to the first substrate 1 or The inner surface of any of the second substrates 2 is coated with a shape other than a rectangular shape.

In the specific example of the peripheral hardening step of the peripheral portion 3a of the semi-hardened coated adhesive 3, a case where a photocurable adhesive is used as the adhesive 3 and the hood 4 is used is shown.

Specifically, as shown in FIG. 1(b) and FIG. 2(b), a flat hood 4 is disposed so as to cover the center portion 3b of the bonding agent 3 surrounded by the peripheral portion 3a, so as to sandwich the hood. The method of 4 is to irradiate light L such as ultraviolet rays from a light source (not shown).

Further, when a point light source such as an LED is used, the point light source may be irradiated along the peripheral portion 3a.

Thereby, only the peripheral portion 3a of the adhesive 3 absorbs light energy in a frame-like shape and gels, and the peripheral portion 3a of the frame-like shape is a semi-hardened state in which the surface is gelatinized but retains the adhesiveness.

In particular, when the adhesive 3 contains an oxygen-suppressing hardening control material, the surface layer of the peripheral portion 3a in the air does not completely solidify due to the oxygen suppression property, and the adhesiveness remains.

In addition, although it is not shown in the figure, the light source L such as ultraviolet rays may be replaced by a heat source or the like from the heat source to the peripheral portion 3a, whereby the heat energy or the like is absorbed and gelled to semi-harden the peripheral portion 3a.

Further, depending on the need, after the peripheral hardening step, a leveling step for placing the state for a predetermined time is preferred.

By the leveling step, the surface of the peripheral portion 3a and the center portion 3b of the adhesive 3 which has been semi-hardened can be naturally smoothed, and the bubbles which are caught during coating can be naturally defoamed.

Further, as shown in Fig. 1(c), after the peripheral hardening step, the center portion 3b of the bonding agent 3 surrounded by the peripheral portion 3a is semi-hardened to have a center hardening step for making the viscosity high, and to sandwich the half portion. It is preferable that the bonding process of the first substrate 1 and the second substrate 2 is bonded to the entire periphery of the hardened peripheral portion 3a and the central portion 3b.

In the specific example shown in FIG. 1(c), after the hood 4 covering the center portion 3b of the bonding agent 3 is removed, the light ray L such as ultraviolet rays is mapped from the light source to the central portion 3b in a comprehensive or selective manner. The center portion 3b is in a semi-hardened state in which light energy is absorbed and gelled, but the adhesiveness is maintained.

In particular, when the curing agent 3 having an oxygen barrier property is contained in the binder 3, the surface layer of the central portion 3b in the air does not completely solidify due to the oxygen suppression property, and the adhesion remains in the surface layer.

Therefore, the coating formation of the bonding agent 3 is performed as the bonding step. The vertical relationship between the two substrates can be formed in any one without distinguishing between the first substrate 1 or the second substrate 2. In addition, by forming the binder 3 on each of the first substrate 1 and the second substrate 2, a thick film of the very thick adhesive 3 can be easily formed.

Further, although not shown, as another example, in order to prevent the viscosity of the semi-hardened peripheral portion 3a from rising, a hood that covers the peripheral portion 3a is provided, and only the adhesive 3 is provided. The center portion 3b irradiates the light L to be semi-hardened, or irradiates the heat line or the like from the heat source toward the center portion 3b instead of the light L such as ultraviolet rays, or does not include the center hardening step but after the peripheral hardening step, is carried out to clamp the included The bonding step of the first substrate 1 and the second substrate 2 is bonded to the entire periphery of the semi-hardened peripheral portion 3a and the adhesive portion 3 of the unhardened central portion 3b.

In a specific example of the bonding step shown in FIG. 1(d), the first substrate 1 coated with the bonding agent 3 is applied to the second substrate 2 with the inner surface 2a and the bonding agent 3 in a vacuum or in the atmosphere. The surface 3c is overlapped so that the first substrate 1 and the second substrate 2 are bonded to each other with the adhesive 3 interposed therebetween.

Specifically, an elevation drive unit (not shown) that moves either or both of the first substrate 1 or the second substrate 2 is provided. The elevation drive unit is configured to be controlled by a controller (not shown) to move the first substrate 1 and the second substrate 2 to a distance between the inner surfaces 1a and 2a of the first substrate 1 and the second substrate 2, and the coating height of the adhesive 3 is substantially the same.

Further, as a subsequent step of the bonding step, in a state of being conveyed to a position where the bonding step is performed or a position different from the position at which the bonding step is performed, the peripheral portion 3a in the semi-hardened state is in a semi-hardened state or an uncured state. It is preferable that the core portion 3b is irradiated with light L such as ultraviolet rays or a heat line to be hardened.

Thereby, the viscosity of the entire adhesive 3 is further increased to become a completely adhered state which cannot be deformed, and it is possible to produce the first substrate 1 and the second substrate 2 with a uniform filling film thickness (gap) therebetween. The state of the adhesive 3 is bonded to the component A.

According to the manufacturing method of the bonding element A of the embodiment of the present invention, in the coating step shown in FIGS. 1(a) and 2(a), the first substrate 1 or the second substrate 2 is used. The inner surface 1a of one of the coatings 3 is applied to the same shape as that of the hardening (semi-hardening and the main hardening), and is only partially localized in the peripheral hardening step shown in FIGS. 1(b) and 2(b). The peripheral portion 3a of the semi-hardened adhesive 3 is so as to maintain the adhesiveness while the viscosity thereof becomes higher than that of the other portions, and then, in the bonding step shown in Fig. 1(d), to sandwich the peripheral portion The bonding agent 3 of 3a bonds the first substrate 1 and the second substrate 2 as a whole. Therefore, even if the central portion 3b of the bonding agent 3 surrounded by the peripheral portion 3a is in an uncured state, it is blocked by the semi-hardened peripheral portion 3a. Do not stretch out.

Thereby, the outer shape of the adhesive 3 can be maintained as the shape at the time of curing, and the substrates 1 and 2 can be bonded to each other. Therefore, it is possible to prevent the adhesive 3 from overflowing due to fluidity, and the adhesive 3 is excellent in formability.

In particular, after the peripheral hardening step, in the center hardening step shown in Fig. 1(c), the central portion 3b of the semi-hardened adhesive 3 is made higher in viscosity, and then bonded as shown in Fig. 1(d). In the step of bonding the first substrate 1 and the second substrate 2 in such a manner as to sandwich the entire periphery of the semi-hardened peripheral portion 3a and the central portion 3b, before bonding the first substrate 1 and the second substrate 2, week The entire bonding agent 3 of the side portion 3a and the center portion 3b is in a semi-hardened state.

Thereby, it is possible to completely prevent the adhesives 3 from flowing after the substrates 1 and 2 are bonded to each other. Therefore, in order to formally harden the adhesive 3, even if the bonded substrates 1 and 2 are conveyed or the front and back are moved in the reverse direction, it is possible to avoid the problem of deterioration in quality and to improve the degree of freedom in production.

Next, an embodiment of the present invention will be described with reference to the drawings.

[Examples]

In this embodiment, the bonding agent 3 comprises a hardening control material which is vaporized in a vacuum atmosphere, and the bonding step is bonded in a vacuum atmosphere in such a manner as to sandwich the entire adhesive portion 3 including the peripheral portion 3a and the central portion 3b in the semi-hardened state. A substrate 1 and a second substrate 2.

In the example shown in Fig. 1(d), the bonding between the first substrate 1 and the second substrate 2 is performed inside the chamber 5 which maintains a predetermined degree of vacuum.

Further, in the bonding step, it is preferable to pressurize the inner surface of any one of the first substrate 1 or the second substrate 2 so as to be adhered to the surface 3c of the bonding agent 3.

In the example shown by the one-dot chain line of FIG. 1(d), the second substrate 2 is pressed against the bonding agent 3 with respect to the bonding agent 3 coated on the first substrate 1 with the inner surface 2a thereof by the lifting and lowering driving portion. The way of the surface 3c moves closer to and presses.

According to the manufacturing method of the bonding element A of the embodiment of the invention, the first substrate 1 and the second substrate 2 are not bonded to the surface 3c of the bonding agent 3 in the vacuum atmosphere, and the periphery is adhered thereto. The portion 3a and the center portion 3b are semi-hardened (gelled), and the internal hardening control material does not come into contact with the vacuum atmosphere, so that it does not vaporize and does not generate bubbles.

Thereby, the substrates 1 and 2 can be bonded to each other without bubbles. Therefore, there is an advantage that quality without bubbles can be ensured.

Further, in the bonding step, when the inner surface of any one of the first substrate 1 or the second substrate 2 is pressed against the surface 3c of the bonding agent 3, the surface 3a of the bonding agent 3 is generated. The unevenness is smooth and dense.

Thereby, it is possible to further reduce the residual of the bubbles when the substrates 1 and 2 are bonded to each other. Therefore, there is an advantage that the quality of no bubbles can be further improved.

Further, in the embodiment shown in the foregoing, the bonding agent 3 contains a hardening control material which is vaporized in a vacuum atmosphere, and the bonding step sandwiches the bonding agent 3 including the peripheral portion 3a and the central portion 3b in a semi-hardened state in a vacuum atmosphere. The first substrate 1 and the second substrate 2 are bonded to each other as a whole, but the bonding is not limited thereto, and the bonding agent 3 containing no curing control material may be used, or the bonding step may be used to bond the first substrate 1 and the second substrate 2 in the atmosphere. .

1‧‧‧First substrate

1a‧‧‧ inside

2‧‧‧second substrate

2a‧‧‧ inside

3‧‧‧Adhesive

3a‧‧‧ peripherals

3b‧‧‧ Central Department

3c‧‧‧ surface

4‧‧‧ hood

5‧‧‧ chamber

A‧‧‧Fitting components

L‧‧‧Light

1 is an explanatory view showing an overall configuration of a method for producing a bonding element according to an embodiment of the present invention, wherein (a) is a partial notch longitudinal sectional front view of a coating step, and (b) is a partial notch longitudinal section of a peripheral hardening step. The main view, (c) is a partial notch longitudinal section front view of the center hardening step, and (d) is a partial notch longitudinal section front view of the bonding step.

Fig. 2(a) is a reduced plan view showing the coating step of Fig. 1(a), and Fig. 2(b) is a reduced plan view showing the peripheral hardening step of Fig. 1(b).

1‧‧‧First substrate

1a‧‧‧ inside

2‧‧‧second substrate

2a‧‧‧ inside

3‧‧‧Adhesive

3a‧‧‧ peripherals

3b‧‧‧ Central Department

3c‧‧‧ surface

4‧‧‧ hood

5‧‧‧ chamber

A‧‧‧Fitting components

L‧‧‧Light

Claims (4)

  1. A manufacturing method of a bonding component, wherein the bonding component bonds a first substrate and a second substrate oppositely with a liquid binder coated therebetween, and the manufacturing is performed. The method includes the steps of: coating the adhesive on the inner surface of any one of the first substrate or the second substrate from the beginning to have the same shape as the outer shape at the time of hardening; The entire peripheral portion is partially semi-hardened in such a manner that the viscosity thereof becomes higher than the viscosity of the other portions while maintaining the adhesiveness; and the first substrate is bonded to the entirety of the above-mentioned bonding agent including the peripheral portion. The second substrate described above.
  2. The manufacturing method of the bonding member according to claim 1, wherein after the step of partially semi-hardening the entire peripheral portion of the bonding agent, the method includes the step of: maintaining a center portion of the bonding agent surrounded by the peripheral portion The first substrate and the second substrate are bonded to each other so as to sandwich the peripheral portion and the center portion of the bonding agent while maintaining the adhesiveness.
  3. The manufacturing method of the bonding member of claim 2, wherein the bonding agent comprises a hardening control material vaporized in a vacuum atmosphere, and the manufacturing method comprises the steps of: sandwiching the periphery including the semi-hardened state in a vacuum atmosphere And bonding the first substrate and the second substrate to the entirety of the bonding agent in the portion and the central portion.
  4. A method of manufacturing a bonding component of claim 3, wherein In the step of bonding the first substrate and the second substrate, the inner surface of any one of the first substrate or the second substrate is pressed against the surface of the bonding agent.
TW101145326A 2011-12-08 2012-12-03 The manufacturing method of the bonding element TWI541562B (en)

Priority Applications (1)

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