WO2014207867A1 - Bonded device manufacturing method - Google Patents

Bonded device manufacturing method Download PDF

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WO2014207867A1
WO2014207867A1 PCT/JP2013/067691 JP2013067691W WO2014207867A1 WO 2014207867 A1 WO2014207867 A1 WO 2014207867A1 JP 2013067691 W JP2013067691 W JP 2013067691W WO 2014207867 A1 WO2014207867 A1 WO 2014207867A1
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substrate
adhesive
outer edge
semi
bonding
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PCT/JP2013/067691
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French (fr)
Japanese (ja)
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坂下　光邦
義和 大谷
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信越エンジニアリング株式会社
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Priority to JP2014505427A priority Critical patent/JP5512061B1/en
Priority to PCT/JP2013/067691 priority patent/WO2014207867A1/en
Priority to KR1020157036781A priority patent/KR20160026908A/en
Priority to CN201380077770.XA priority patent/CN105359203B/en
Priority to TW103122414A priority patent/TWI603848B/en
Publication of WO2014207867A1 publication Critical patent/WO2014207867A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

The purpose of a manufacturing method for a bonded device according to the present invention is to control the extension of the outer periphery of an adhesive sandwiched between a first substrate and a second substrate and fill the entirety of the inside of a display area with the adhesive. After a first substrate (1), second substrate (2), or both are supplied with an adhesive (3) such that the adhesive (3) is disposed within a display area (D), in the periphery (3a) of the adhesive (3), a filled portion (3b) excluding a specific portion (3a') is semi-cured such that the viscosity thereof is higher than the viscosity of other portions while the adhesiveness thereof is maintained. Thereafter, the first substrate (1) and second substrate (2) are caused to overlap so that the adhesive (3) is sandwiched therebetween, and the resulting capillary action, natural flow, or pressurized flow occurring between the first substrate (1) and second substrate (2) causes the specific portion (3a'), which is not semi-cured, in the periphery (3a) of the adhesive (3) to extend toward an unfilled area (D1) further to the outside than the periphery (3a) of the adhesive (3) and spread throughout the entirety of the inside of the display area (D).

Description

貼合デバイスの製造方法Manufacturing method of bonding device
　本発明は、例えば液晶ディスプレイ（ＬＣＤ）、有機ＥＬディスプレイ（ＯＬＥＤ）、プラズマディスプレイ（ＰＤＰ）、フレキシブルディスプレイなどのフラットパネルディスプレイ（ＦＰＤ）か、又は例えばタッチパネル式ＦＰＤや３Ｄ（３次元）ディスプレイや電子書籍などのような、液晶モジュール（ＬＣＭ）やフレキシブルプリント配線板（ＦＰＣ）などの基板に対して、カバーガラスやカバーフィルムやＦＰＤなどのもう一枚の基板を合着する貼合デバイスの製造方法に関する。 The present invention may be a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel FPD, 3D (three-dimensional) display, electronic A method of manufacturing a bonding device, such as a book, for bonding another substrate such as a cover glass, a cover film, or an FPD to a substrate such as a liquid crystal module (LCM) or a flexible printed wiring board (FPC). About.
　従来、この種の貼合デバイスの製造方法として、一方のワークの片面の全体に行き渡るように供給部が接着剤（紫外線硬化樹脂）を供給し、ワークの片面の全体に行き渡った接着剤の一部（接着剤の供給領域の外縁部）か、若しくはワークの片面の全体に行き渡った接着剤の全部に対して、貼り合わせ前に大気中で電磁波（紫外線）を照射することにより、接着剤の一部（外縁部）又は全部を仮硬化させ、仮硬化した接着剤に対して他方のワークを貼り合わせることで、貼り合わせ前の接着剤の流動が抑制され、塗布形状のくずれやワーク外へのはみ出しを防止する貼合方法がある（例えば、特許文献１参照）。
　さらに、この貼合方法では、一方のワークの片面の全体に接着剤が行き渡るように供給する方法として、ワークＳ１の全面（片面の全体）にディスペンサのノズルから接着剤Ｒを滴下し、このディスペンサを走査装置で移動させることによってワークの全面に接着剤が行き渡るようにする例、ワークの一部に接着剤が供給された後に全体に広がるようにする例、ディスペンサが多数連ねられたもので接着剤を多数の線状に塗布する例、供給部が接着剤を面状に塗布することによって短時間で均一に塗布する例、ローラによって塗布する装置やスキージによって塗布する装置やスピン塗布する装置等、種々の装置を適用する例が示されている。 Conventionally, as a manufacturing method of this kind of bonding device, a supply unit supplies an adhesive (ultraviolet curable resin) so as to spread over one side of one workpiece, and one of the adhesives spread over the whole side of the workpiece. Part of the adhesive (outer edge of the adhesive supply area) or the entire adhesive on one side of the workpiece is irradiated with electromagnetic waves (ultraviolet rays) in the atmosphere before bonding. By pre-curing part (outer edge) or all, and bonding the other workpiece to the pre-cured adhesive, the flow of the adhesive before bonding is suppressed, and the applied shape is lost or moved out of the workpiece. There is a bonding method for preventing the protrusion of the film (for example, see Patent Document 1).
Furthermore, in this bonding method, the adhesive R is dropped from the nozzle of the dispenser onto the entire surface of the workpiece S1 (the entire one surface) as a method for supplying the adhesive so that it spreads over the entire surface of one of the workpieces. An example in which the adhesive is spread over the entire surface of the workpiece by moving it with a scanning device, an example in which the adhesive is spread over the entire part of the workpiece after it has been supplied, and an adhesive that is connected to many dispensers Examples where the agent is applied in a number of lines, examples where the supply unit applies the adhesive in a planar manner and uniformly applies in a short time, a device for applying with a roller, a device for applying with a squeegee, a device for applying spin, etc. Examples of applying various devices are shown.
特開２０１２－７３５３３号公報JP 2012-73533 A
　ところで、ＬＣＤやＬＣＭなどの貼合デバイスは、それを構成する基板が、特許文献１に記載のワークのように矩形状の薄板であり、二枚の基板の間に接着剤を充填して、矩形に形成される表示領域内の全てを接着剤で満たすように構成されている。
　また近年では、接着剤の塗布技術などの向上により、基板のサイズに対する表示領域のサイズは拡大傾向にあるものの、基板の外縁部において接着剤が充填されない余白部分は限りなく狭くなる傾向にある。最近では、基板の外縁近くまで表示領域のサイズを拡大したいと要望もある。
　このような状況下であっても、矩形の表示領域において、特に角部分まで接着剤が満たされず、表示領域内で接着剤の端部が視認される場合には、表示品質を落とすため、不良品となることに変わりがない。
　しかし乍ら、前述した従来の貼合デバイスの製造方法では、矩形のワークの片面全体に接着剤が行き渡るように供給することは困難であった。
　その理由として、紫外線硬化樹脂など液状の接着剤は、その端部が表面張力によってワークの縦横方向（ＸＹ方向）及び厚み方向（Ｚ方向）へ球形に丸くなるため、ワークの片面において矩形の表示領域の角部まで接着剤を直角状に行き渡らすことは不可能である。
　すなわち、特許文献１に記載されるような供給装置によって接着剤を塗布したり、供給された接着剤を全体に広げたり、供給部で接着剤を面状に塗布しても、矩形のワークの指定領域全体に亘って接着剤が所望の厚みで行き渡るように供給できなかった。
　このような理由から、矩形の表示領域の角部まで接着剤が行き渡るようにするには、表面張力によって丸くなった接着剤の端部が、矩形の表示領域の角部まで行き渡るように、矩形の表示領域よりも広くなるように接着剤を供給（塗布）するしかなかった。しかし、この方法では、ワークの片面に接着剤が矩形の表示領域よりも広くなるように供給（塗布）された後にワーク同士を貼り合わせると、ワークの間で押し広げられた接着剤の端部が、矩形の表示領域の辺部からはみ出してしまう。近年のように、矩形の表示領域からワークの外縁までの余白部分に十分な余裕がない場合には、ワーク同士の貼り合わせに伴ってワーク外へ接着剤がはみ出してしまい、後工程で拭き取る必要がある。それにより生産性の低下を招くとともに、生産コストが上昇するという問題があった。
　さらに、貼合デバイスの種類によっては、接着剤の膜厚（厚さ寸法）を約０．１～０．５ｍｍにする要望がある。このサイズは一般的なＬＣＤやＬＣＭなどにおける接着剤の膜厚（約１～１０μｍ程度）に比べて数十倍にもなるため、接着剤の流動性が大きくなって、表示領域内の全てを接着剤で満たすことが更に困難になる傾向にある。 By the way, as for the bonding device such as LCD and LCM, the substrate constituting it is a rectangular thin plate like the work described in Patent Document 1, and an adhesive is filled between the two substrates, The entire display area formed in a rectangular shape is filled with an adhesive.
In recent years, due to improvements in adhesive application technology and the like, the size of the display area with respect to the size of the substrate tends to expand, but the marginal portion of the outer edge of the substrate that is not filled with the adhesive tends to be as narrow as possible. Recently, there is a desire to enlarge the size of the display area to the vicinity of the outer edge of the substrate.
Even in such a situation, in the rectangular display area, particularly when the adhesive is not filled up to the corner and the edge of the adhesive is visually recognized in the display area, the display quality is deteriorated. There is no change in becoming a good product.
However, in the conventional method for manufacturing a bonding device described above, it has been difficult to supply the adhesive so that the entire surface of the rectangular workpiece is spread.
The reason for this is that liquid adhesives such as UV curable resins are rounded into a spherical shape in the longitudinal and lateral directions (XY direction) and thickness direction (Z direction) of the workpiece due to surface tension, so a rectangular display on one side of the workpiece It is impossible to spread the adhesive at right angles to the corners of the region.
That is, even if the adhesive is applied by a supply device as described in Patent Document 1, the supplied adhesive is spread over the entire surface, or the adhesive is applied to the surface in the supply portion, The adhesive could not be supplied so as to spread in the desired thickness over the entire designated area.
For this reason, in order to spread the adhesive to the corner of the rectangular display area, the end of the adhesive that has been rounded by the surface tension is rectangular so that it reaches the corner of the rectangular display area. In other words, the adhesive must be supplied (applied) so as to be wider than the display area. However, in this method, when the workpieces are pasted together after the adhesive is supplied (applied) on one side of the workpiece so as to be wider than the rectangular display area, the end portion of the adhesive spread between the workpieces. However, it protrudes from the side of the rectangular display area. If there is not enough room in the margin from the rectangular display area to the outer edge of the workpiece as in recent years, the adhesive will protrude outside the workpiece due to the bonding of the workpieces, and it will be necessary to wipe it off in the subsequent process There is. As a result, the productivity is lowered and the production cost is increased.
Furthermore, depending on the type of bonding device, there is a demand for the film thickness (thickness dimension) of the adhesive to be about 0.1 to 0.5 mm. This size is several tens of times larger than the adhesive film thickness (about 1 to 10 μm) in general LCDs and LCMs, so the fluidity of the adhesive is increased and the entire display area is covered. It tends to be more difficult to fill with adhesive.
　本発明は、このような問題に対処することを課題とするものであり、第一基板と第二基板で挟まれた接着剤の外縁部の伸展をコントロールして表示領域内の全てを接着剤で満たすこと、などを目的とするものである。 An object of the present invention is to cope with such a problem, and controls the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate so that the entire area in the display area is adhesive. The purpose is to satisfy with.
　このような目的を達成するために本発明は、対向する第一基板と第二基板が、その間に充填した液状の接着剤を挟んで合着され、表示領域を有する貼合デバイスの製造方法であって、前記第一基板又は前記第二基板のいずれか一方か若しくは前記第一基板及び前記第二基板の両方に前記接着剤を前記表示領域内に配置されるように供給する供給工程と、前記接着剤の外縁部において特定部位が除かれた充填部位を、その粘度が接着性を保持したまま他の部位の粘度よりも高くなるように半硬化させる半硬化工程と、前記第一基板と前記第二基板をそれら対向面の間に前記接着剤が挟まれるように重ね合わせる合着工程とを含み、前記合着工程では、前記半硬化工程で半硬化されていない前記接着剤の前記外縁部における前記特定部位を、前記接着剤の前記外縁部の外側に配置される前記接着剤の未充填領域に向け伸展させることを特徴とする。 In order to achieve such an object, the present invention provides a method for manufacturing a bonding device in which a first substrate and a second substrate facing each other are bonded together with a liquid adhesive filled therebetween and having a display region. A supplying step of supplying the adhesive to be arranged in the display area on either the first substrate or the second substrate or both the first substrate and the second substrate; A semi-curing step of semi-curing a filling site from which a specific site is removed at the outer edge of the adhesive so that the viscosity is higher than the viscosity of other sites while maintaining adhesion; and the first substrate; A bonding step of stacking the second substrate so that the adhesive is sandwiched between the opposing surfaces, and in the bonding step, the outer edge of the adhesive that is not semi-cured in the semi-curing step The specific part in the front Wherein it is disposed outside the outer edge of the adhesive, characterized in that to stretch toward the unfilled region of the adhesive.
　前述した特徴を有する本発明は、第一基板又は第二基板のいずれか一方か若しくは両方に接着剤を表示領域内に配置されるように供給した後に、接着剤の外縁部において特定部位が除かれた充填部位をその粘度が接着性を保持したまま他の部位の粘度よりも高くなるように半硬化させ、その後、接着剤が挟まれるように第一基板と第二基板を重ね合わせることにより、接着剤の外縁部において未半硬化状態の特定部位が、第一基板と第二基板の間に生じる毛細管現象や自然流動や加圧流動で、接着剤の外縁部よりも外側の未充填領域に向け伸展して、表示領域内の全てに行き渡る。
　したがって、第一基板と第二基板で挟まれた接着剤の外縁部の伸展をコントロールして表示領域内の全てを接着剤で満たすことができる。
　その結果、ワーク同士の貼り合わせに伴って接着剤が矩形の充填領域の辺部からはみ出る従来のものに比べ、矩形の表示領域から第一基板及び第二基板の外縁までの余白部分に十分な余裕がない場合でも、第一基板及び第二基板の外に接着剤がはみ出ることを防止できて、接着剤の整形性に優れて、生産性に優れる。
　さらに、接着剤の膜厚（厚さ寸法）が一般的なＬＣＤやＬＣＭなどにおける接着剤の膜厚よりも遥かに厚い貼合デバイスを製造する場合でも、第一基板及び第二基板の外に接着剤がはみ出ることなく充填できて対応が容易である。 In the present invention having the above-described features, after supplying the adhesive to one or both of the first substrate and the second substrate so as to be disposed in the display region, the specific portion is removed at the outer edge of the adhesive. By semi-curing the filled part so that its viscosity is higher than the viscosity of other parts while maintaining adhesiveness, and then superimposing the first and second substrates so that the adhesive is sandwiched In the outer edge of the adhesive, the unsemi-cured specific part is a capillary phenomenon generated between the first substrate and the second substrate, natural flow or pressure flow, and the unfilled area outside the outer edge of the adhesive Extends to the entire display area.
Therefore, the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate can be controlled to fill the entire display area with the adhesive.
As a result, the adhesive is sufficient for the blank area from the rectangular display area to the outer edge of the first substrate and the second substrate as compared with the conventional one in which the adhesive protrudes from the side of the rectangular filling area when the workpieces are bonded to each other. Even when there is no allowance, it is possible to prevent the adhesive from protruding outside the first substrate and the second substrate, and the adhesive has excellent formability and productivity.
Furthermore, even when manufacturing a bonding device in which the film thickness (thickness dimension) of the adhesive is much thicker than the film thickness of the adhesive in general LCDs and LCMs, The adhesive can be filled without sticking out and can be easily handled.
本発明の実施形態に係る貼合デバイスの製造方法を示す説明図であり、（ａ）が供給工程後の平面図、（ｂ）が半硬化工程の平面図、（ｃ）が半硬化工程後の平面図、（ｄ）が合着工程の平面図、（ｅ）が合着工程後の平面図である。It is explanatory drawing which shows the manufacturing method of the bonding device which concerns on embodiment of this invention, (a) is a top view after a supply process, (b) is a top view of a semi-hardening process, (c) is after a semi-hardening process. (D) is a top view of a joining process, (e) is a top view after a joining process. 同正面図であり、（ａ）が図１（ｂ）の拡大正面図、（ｂ）が図１（ｅ）の拡大正面図である。It is the same front view, (a) is an enlarged front view of FIG.1 (b), (b) is an enlarged front view of FIG.1 (e). 合着工程の変形例を示す拡大平面図である。It is an enlarged plan view which shows the modification of a joining process. 半硬化工程の説明図であり、（ａ）が図１（ｂ）の部分拡大平面図、（ｂ）（ｃ）が図４（ａ）の変形例を示す部分拡大平面図である。It is explanatory drawing of a semi-hardening process, (a) is a partial enlarged plan view of FIG.1 (b), (b) (c) is a partial enlarged plan view which shows the modification of FIG.4 (a). 本発明の他の実施例に係る貼合デバイスの製造方法を示す説明図であり、（ａ）が供給工程後の平面図、（ｂ）が半硬化工程の平面図、（ｃ）が半硬化工程後の平面図、（ｄ）が合着工程の平面図、（ｅ）が合着工程後の平面図である。It is explanatory drawing which shows the manufacturing method of the bonding device which concerns on the other Example of this invention, (a) is a top view after a supply process, (b) is a top view of a semi-hardening process, (c) is semi-hardened. The top view after a process, (d) is a top view of a joining process, (e) is a top view after a joining process. 同正面図であり、（ａ）が図５（ｂ）の拡大縦断正面図、（ｂ）が図１（ｅ）の拡大縦断正面図である。It is the same front view, (a) is an enlarged vertical front view of FIG. 5 (b), (b) is an enlarged vertical front view of FIG. 1 (e).
　以下、本発明の実施形態を図面に基づいて詳細に説明する。
　本発明の実施形態に係る貼合デバイスＡは、図１～図６に示すように、対向する一対の第一基板１と第二基板２を、その間に充填された液状の接着剤３が挟み込まれるように合着することで、その所定位置に所定形状の表示領域Ｄが形成される。
　貼合デバイスＡの製造方法としては、第一基板１又は第二基板２のいずれか一方の対向面に接着剤３を表示領域Ｄ内に配置されるように供給する供給工程と、この供給された接着剤３の外縁部３ａにおいて特定部位３ａ′が除かれた充填部位３ｂをその粘度が接着性を保持したまま他の部位の粘度よりも高くなるように半硬化させる半硬化工程と、第一基板１と第二基板２をそれら対向面１ａ，２ａの間に接着剤３が挟まれるように重ね合わせる合着工程と、を含んでいる。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 6, the bonding device A according to the embodiment of the present invention sandwiches a pair of opposing first substrate 1 and second substrate 2 with a liquid adhesive 3 filled therebetween. As a result, the display area D having a predetermined shape is formed at the predetermined position.
As a manufacturing method of the bonding device A, a supply step of supplying the adhesive 3 so as to be disposed in the display region D on the facing surface of either the first substrate 1 or the second substrate 2, and this supply A semi-curing step of semi-curing the filling site 3b from which the specific site 3a 'is removed at the outer edge 3a of the adhesive 3 so that the viscosity is higher than the viscosity of other sites while maintaining the adhesiveness; A bonding step of overlapping the one substrate 1 and the second substrate 2 so that the adhesive 3 is sandwiched between the opposing surfaces 1a and 2a.
　第一基板１及び第二基板２は、例えば液晶ディスプレイ（ＬＣＤ）、有機ＥＬディスプレイ（ＯＬＥＤ）、プラズマディスプレイ（ＰＤＰ）、フレキシブルディスプレイなどのフラットパネルディスプレイ（ＦＰＤ）か、又は例えばタッチパネル式ＦＰＤや３Ｄ（３次元）ディスプレイや電子書籍などのような、液晶モジュール（ＬＣＭ）やフレキシブルプリント配線板（ＦＰＣ）などと、透明なガラス製基板又は透明な耐熱樹脂（ＰＥＳ：Poly-Ether-Sulphoneなど）製のカバーフィルムや合成樹脂製基板若しくはカバーガラスやバリアガラスなどが用いられる。
　また、第一基板１又は第二基板２のいずれか一方は、その製作段階で最終的に分離されたものを使用することに限らず、その製作段階で複数の第一基板１や第二基板２が並設される分離前の一枚ものを使用することも可能である。第一基板１又は第二基板２のいずれか一方が、ＬＣＭなどのような複数の部品を組み付けることで構成され、その外周を額縁状の保護枠で支持したものであっても良い。
　さらに、第一基板１及び第二基板２の外形状は、例えば矩形など、同じ大きさに形成され、合着工程においてそれぞれの外縁同士が重なり合うように合着させることが好ましい。 The first substrate 1 and the second substrate 2 are flat panel displays (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a touch panel type FPD or 3D, for example. Made of liquid crystal module (LCM) and flexible printed wiring board (FPC) such as (three-dimensional) display and electronic book, and transparent glass substrate or transparent heat-resistant resin (PES: Poly-Ether-Sulphone, etc.) A cover film, a synthetic resin substrate, a cover glass, a barrier glass, or the like is used.
In addition, one of the first substrate 1 and the second substrate 2 is not limited to the one that is finally separated in the production stage, and a plurality of first substrates 1 and second substrates are produced in the production stage. It is also possible to use one before separation in which 2 are arranged side by side. Either the first substrate 1 or the second substrate 2 may be configured by assembling a plurality of components such as LCM, and the outer periphery thereof may be supported by a frame-shaped protective frame.
Furthermore, it is preferable that the outer shapes of the first substrate 1 and the second substrate 2 are formed to have the same size, for example, a rectangle, and are bonded so that the outer edges overlap each other in the bonding step.
　接着剤３は、例えば光エネルギーを吸収して重合が進行することにより硬化して接着性を発現する光硬化性を有する光硬化型接着剤などが用いられる。また光硬化型接着剤に代えて、熱エネルギーの吸収により重合が進行して硬化する熱硬化型接着剤や二液混合硬化型接着剤などを用いることも可能である。
　さらに、接着剤３は、第一基板１又は第二基板２のいずれか一方に供給される時点で、その粘度、詳しくは重合度（硬化度）が低くて流動性を有している。接着剤３は、後述する半硬化工程で光エネルギーや熱エネルギーなどを吸収することにより、粘度（重合度、硬化度）が高くなるにつれて流動性が低下するものの、変形可能で且つ接着剤３の表面は固まらずに接着性を保持しているゲル状化状態となり、このゲル状化状態を半硬化状態と呼んでいる。この半硬化状態の接着剤３は、更に光エネルギーや熱エネルギーなどを吸収することにより、変形し難くなって本硬化状態となる。
　接着剤３の具体例としては、例えばアクリル系ＵＶ硬化型樹脂やシリコン系ＵＶ硬化型樹脂などからなる紫外線硬化型接着剤を用い、特に空気中ではその表面が固まらない酸素阻害性を有する硬化制御材が含まれるものを用いることが好ましい。なお、この種の硬化制御材は、真空雰囲気においてガス化する性質を有する場合が多い。 As the adhesive 3, for example, a photo-curing adhesive having a photo-curing property, which is cured by absorbing light energy and is developed by polymerization, and the like are used. Further, instead of the photo-curing adhesive, it is also possible to use a thermosetting adhesive or a two-component mixed curing adhesive that is cured by polymerization by absorption of thermal energy.
Further, when the adhesive 3 is supplied to either the first substrate 1 or the second substrate 2, the viscosity, specifically, the degree of polymerization (curing degree) is low and has fluidity. The adhesive 3 absorbs light energy, heat energy, and the like in a semi-curing step to be described later, and its fluidity decreases as the viscosity (degree of polymerization, degree of curing) increases. The surface becomes a gelled state that does not harden and maintains adhesiveness, and this gelled state is called a semi-cured state. The semi-cured adhesive 3 is further hard to be deformed by absorbing light energy, heat energy, and the like, and is in a fully cured state.
As a specific example of the adhesive 3, for example, an ultraviolet curable adhesive made of, for example, an acrylic UV curable resin or a silicon UV curable resin is used, and the curing control has an oxygen inhibition property that the surface does not harden particularly in the air. It is preferable to use a material containing a material. In many cases, this type of curing control material has the property of being gasified in a vacuum atmosphere.
　そして、供給工程における接着剤３の供給方法は、例えばスリット形吐出部を有するコータダイなどの面状塗布装置や定量吐出ノズルなどの線状塗布装置か又はその他の手段で、第一基板１又は第二基板２のいずれか一方の対向面か、若しくは第一基板１及び第二基板２の両方に対して、表示領域Ｄの外形状と略同じ形状に供給している。
　図１（ａ）に示される供給工程の具体例では、大気中において面状塗布装置や線状塗布装置を用い、第一基板１の対向面１ａにおいて矩形の表示領域Ｄ内に、接着剤３を表示領域Ｄの外形状よりも小さな略矩形状に塗布している。
　また、その他の例として図示しないが、面状塗布装置や線状塗布装置に代えて印刷などにより接着剤３を塗布したり、第一基板１の対向面１ａに代えて第二基板２の対向面２ａのみ又は第一基板１の対向面１ａ及び第二基板２の対向面２ａの両方に接着剤３をそれぞれ塗布したりすることなども可能である。
　なお、接着剤３を供給する前に、接着剤３の中に混在している気泡は脱気しておき、塗布時においても気泡を巻き込まないように注意が必要である。接着剤３の供給後も所定時間に亘り放置して、塗布時に巻き込んだ気泡を自然に脱泡させることが好ましい。 And the supply method of the adhesive agent 3 in a supply process is, for example, a linear coating device such as a coater die having a slit-shaped discharge part, a linear coating device such as a quantitative discharge nozzle, or other means, and the first substrate 1 or the first substrate 1 Either one of the opposing surfaces of the two substrates 2 or both the first substrate 1 and the second substrate 2 are supplied in a shape substantially the same as the outer shape of the display region D.
In the specific example of the supply process shown in FIG. 1A, a surface coating device or a linear coating device is used in the atmosphere, and the adhesive 3 is placed in the rectangular display area D on the opposing surface 1a of the first substrate 1. Is applied in a substantially rectangular shape smaller than the outer shape of the display area D.
Although not shown as another example, the adhesive 3 is applied by printing or the like instead of the planar coating device or the linear coating device, or the second substrate 2 is opposed to the opposing surface 1a of the first substrate 1. It is also possible to apply the adhesive 3 to only the surface 2 a or both the facing surface 1 a of the first substrate 1 and the facing surface 2 a of the second substrate 2.
Before supplying the adhesive 3, it is necessary to degas the air bubbles mixed in the adhesive 3 so that the air bubbles are not involved even during application. It is preferable to leave the adhesive 3 for a predetermined period of time after the supply of the adhesive 3 to naturally defoam the bubbles that are involved during application.
　半硬化工程によって半硬化される「接着剤３の外縁部３ａにおける特定部位３ａ′」とは、第一基板１又は第二基板２の対向面に接着剤３を矩形状に供給した際に、接着剤３の表面張力によって端部が球形に丸くなる角部分３ａ１などが挙げられる。また、特定部位３ａ′の他の例として、角部分３ａ１と連続する所定長さの辺部分３ａ２や角部分３ａ１及び辺部分３ａ２を含む外縁部３ａの全周などであってもよい。
　半硬化工程による接着剤３の半硬化方法としては、接着剤３の外縁部３ａにおける特定部位３ａ′をマスク４などで覆い、マスク４などで覆われない接着剤３の特定部位３ａ′が除かれた充填部位３ｂを露出させ、そこに光エネルギーや熱エネルギーなどが照射されることにより、露出状態の充填部位３ｂのみに光エネルギーや熱エネルギーを吸収させて、その粘度が接着性を保持したまま他の部位の粘度よりも高くなるように部分的に半硬化させている。
　図１（ｂ）及び図２（ａ）に示される半硬化工程の具体例では、接着剤３として光硬化型接着剤を用い、接着剤３の外縁部３ａにおける特定部位３ａ′として角部分３ａ１などを厚み方向（以下Ｚ方向という）へ覆うように平板状のマスク４が配設されるとともに、マスク４を挟んで紫外線ランプなどの光源５が配設され、光源５から紫外線などの光線Ｌを照射している。それにより、接着剤３の外縁部３ａにおいて特定部位３ａ′となる角部分３ａ１などを除いた充填部位３ｂのみが、光エネルギーを吸収してゲル状化し、その表面もゲル状化するが接着性を保持する半硬化状態にしている。
　すなわち、接着剤３の特定部位３ａ′となる角部分３ａ１などを除いた充填部位３ｂが、半硬化工程で半硬化された半硬化部位３ｂ′となる。また、接着剤３の外縁部３ａにおいて特定部位３ａ′となる角部分３ａ１などは、半硬化工程で半硬化されていない、未半硬化状態の未硬化部位又は未半硬化部位となる。
　特に、接着剤３に酸素阻害性を有する硬化制御材が含まれる場合には、酸素阻害性のため、空気中において外縁部３ａが除かれた充填部位３ｂの表面層が完全に固まることはなく接着性を残している。
　図示例の場合には、マスク４として、所定位置に遮光部４ａが固着された透明板４ｂを用いている。
　また、その他の例として図示しないが、マスク４として遮光部４ａを除く透明部分に貫通孔が開穿されたものを用いたり、紫外線などの光線Ｌに代えて熱源から熱線などを照射することで、熱エネルギーなどが吸収されてゲル状化し半硬化させたり変更することも可能である。
　なお、半硬化工程の後は、その状態を所定時間に亘り放置して、半硬化状態になった半硬化部位３ｂ′（接着剤３の外縁部３ａにおいて特定部位３ａ′となる角部分３ａ１などを除いた充填部位３ｂ）と、半硬化部位３ｂ′が除かれた外縁部３ａの特定部位３ａ′となる角部分３ａ１など（未半硬化状態の未硬化部位又は未半硬化部位）における表面３ｃを自然に平滑化させるとともに、塗布時に巻き込んだ気泡を更に脱泡させることが好ましい。 The “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process means that when the adhesive 3 is supplied in a rectangular shape to the opposing surface of the first substrate 1 or the second substrate 2, Examples include a corner portion 3a1 whose end is rounded into a spherical shape by the surface tension of the adhesive 3. Further, as another example of the specific part 3a ′, it may be a side portion 3a2 having a predetermined length continuous with the corner portion 3a1 or the entire circumference of the outer edge portion 3a including the corner portion 3a1 and the side portion 3a2.
As a semi-curing method of the adhesive 3 by the semi-curing process, the specific portion 3a ′ on the outer edge 3a of the adhesive 3 is covered with the mask 4 or the like, and the specific portion 3a ′ of the adhesive 3 that is not covered with the mask 4 or the like is excluded. The exposed filling portion 3b is exposed and irradiated with light energy, heat energy, or the like, so that only the filling portion 3b in an exposed state absorbs light energy or heat energy, and the viscosity maintains adhesiveness. It is partially semi-cured so as to be higher than the viscosity of other parts.
In the specific example of the semi-curing process shown in FIGS. 1B and 2A, a photo-curing adhesive is used as the adhesive 3, and the corner portion 3a1 is used as the specific portion 3a 'in the outer edge 3a of the adhesive 3. And the like, and a light source 5 such as an ultraviolet lamp is disposed between the mask 4 and the light beam L such as ultraviolet rays from the light source 5. Is being irradiated. As a result, only the filling portion 3b excluding the corner portion 3a1 which becomes the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 gels by absorbing light energy, and the surface also gels, but the adhesiveness Is in a semi-cured state.
In other words, the filling portion 3b excluding the corner portion 3a1 and the like serving as the specific portion 3a ′ of the adhesive 3 becomes the semi-cured portion 3b ′ semi-cured in the semi-curing process. Further, the corner portion 3a1 or the like that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 becomes an uncured or uncured portion in an unsemi-cured state that is not semi-cured in the semi-curing process.
In particular, when the adhesive 3 includes a curing control material having oxygen inhibition properties, the surface layer of the filling portion 3b from which the outer edge portion 3a is removed in the air is not completely solidified due to oxygen inhibition properties. Remains adhesive.
In the case of the illustrated example, as the mask 4, a transparent plate 4b having a light shielding portion 4a fixed at a predetermined position is used.
Although not shown in the drawings as another example, a mask 4 having a through-hole formed in a transparent portion excluding the light-shielding portion 4a may be used, or a heat source may be irradiated from a heat source instead of a light beam L such as ultraviolet rays. It is also possible to change the heat energy and the like into a gel and semi-cured or changed.
After the semi-curing step, the state is left for a predetermined time, and the semi-cured portion 3b ′ that has become a semi-cured state (such as the corner portion 3a1 that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3). The surface 3c in the filling part 3b) excluding the part 3 and the corner part 3a1 or the like (unsemi-hardened part or unsemi-hardened part) which becomes the specific part 3a 'of the outer edge 3a from which the semi-hardened part 3b' is removed It is preferable that the air bubbles are naturally smoothed and the bubbles entrained at the time of application are further defoamed.
　合着工程における第一基板１と第二基板２の貼り合わせ方法は、第一基板１及び第二基板２の対向面１ａ，２ａの間に、外縁部３ａの特定部位３ａ′と半硬化部位３ｂ′を含む接着剤３の全体が挟まれるようにＺ方向へ重ね合わせて、接着剤３の外縁部３ａにおける未半硬化状態の特定部位３ａ′を、接着剤３の外縁部３ａの外側に配置される接着剤３の未充填領域Ｄ１に向け伸展させている。
　その一例として、重ね合わされた第一基板１又は第二基板２のいずれか一方か或いは両方を全面的にＺ方向へ加圧して、Ｚ方向と交差する縦横斜め方向（以下ＸＹθ方向という）へそれぞれ押し広げられるように対向面１ａ，２ａ同士を互いにＺ方向へ接近させることが好ましい。 The bonding method of the first substrate 1 and the second substrate 2 in the bonding process is as follows: between the facing surfaces 1a and 2a of the first substrate 1 and the second substrate 2, the specific portion 3a 'and the semi-cured portion of the outer edge portion 3a. The specific part 3a 'of the unsemi-cured state in the outer edge 3a of the adhesive 3 is placed outside the outer edge 3a of the adhesive 3 by overlapping in the Z direction so that the entire adhesive 3 including 3b' is sandwiched. It extends toward the unfilled area D1 of the adhesive 3 to be arranged.
As an example, either one or both of the first substrate 1 and the second substrate 2 that are overlapped are entirely pressed in the Z direction, and each is vertically and horizontally obliquely intersected with the Z direction (hereinafter referred to as XYθ direction). It is preferable that the facing surfaces 1a and 2a be close to each other in the Z direction so as to be spread.
　図１（ｄ）（ｅ）に示される合着工程の具体例では、真空中又は大気中において、接着剤３が塗布された第一基板１に対し、第二基板２をその対向面２ａが接着剤３の表面３ｃと接触するように重ね合わせ、第一基板１と第二基板２が接着剤３を挟んで互いに平行となるように全面的に加圧して合着させている。
　詳しくは、第一基板１又は第二基板２のいずれか一方若しくは両方を互いに接近移動させる昇降駆動部（図示しない）が設けられている。この昇降駆動部は、コントローラ（図示しない）で作動制御され、第一基板１と第二基板２をそれらの対向面１ａ，２ａ同士の間隔が、接着剤３の塗布高さと略同じになるまで接近移動させるように構成している。
　この全面的な加圧によって、矩形の表示領域Ｄ内に供給された略矩形状の接着剤３は、外縁部３ａの四隅に形成される略円弧状の角部分３ａ１が、表示領域Ｄの角部Ｄ２に向かってそれぞれθ方向へ押し広げられると同時に、外縁部３ａの四辺に形成される略直線状の辺部分３ａ２が表示領域Ｄの辺部Ｄ３に向かってそれぞれＸＹ方向へ押し広げられる。それにより、図１（ｅ）に示されるように、外縁部３ａの角部分３ａ１が表示領域Ｄの角部Ｄ２に行き渡り、外縁部３ａの辺部分３ａ２が表示領域Ｄの辺部Ｄ３に行き渡る。 In the specific example of the bonding step shown in FIGS. 1D and 1E, the second substrate 2 is opposed to the first substrate 1 coated with the adhesive 3 in a vacuum or in the atmosphere. The first substrate 1 and the second substrate 2 are superposed so as to be in contact with the surface 3c of the adhesive 3, and are pressed and bonded together so that the first substrate 1 and the second substrate 2 are parallel to each other with the adhesive 3 interposed therebetween.
Specifically, an elevating drive unit (not shown) that moves either one or both of the first substrate 1 and the second substrate 2 toward each other is provided. This lifting drive is controlled by a controller (not shown) until the distance between the opposing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 is substantially the same as the coating height of the adhesive 3. It is configured to move closer.
The substantially rectangular adhesive 3 supplied into the rectangular display region D by this overall pressurization has substantially arc-shaped corner portions 3a1 formed at the four corners of the outer edge 3a. At the same time, each of the substantially straight side portions 3a2 formed on the four sides of the outer edge portion 3a is expanded in the XY direction toward the side portion D3 of the display region D. Thereby, as shown in FIG. 1 (e), the corner portion 3 a 1 of the outer edge portion 3 a reaches the corner portion D 2 of the display region D, and the side portion 3 a 2 of the outer edge portion 3 a reaches the side portion D 3 of the display region D.
　さらに、合着工程における前述した全面的な加圧に代えて、又は全面的な加圧に加えて、第一基板１と第二基板２を重ね合わせた状態のままで所定時間放置し、接着剤３の外縁部３ａにおける特定部位３ａ′を対向面１ａ，２ａに沿って自然伸展させるレベリング工程を含むことが好ましい。それにより、接着剤３の外縁部３ａにおいて未半硬化状態の特定部位３ａ′となる角部分３ａ１や辺部分３ａ２などが、表示領域Ｄ内の未充填領域Ｄ１となる角部Ｄ２や辺部Ｄ３に向けて自然流動し、それにより拡張伸展して表示領域Ｄ内の全てに行き渡る。
　なお、合着工程の変形例として、図３に示されるように、前述した全面的な加圧又は放置に代えて、若しくは全面的な加圧や放置に加えて、重ね合わせが完了した第一基板１又は第二基板２のいずれか一方か若しくは両方において、接着剤３の外縁部３ａにおける特定部位３ａ′と対向する部位Ｐを部分的に加圧することで、特定部位３ａ′が未充填領域Ｄ１に向け伸展するように互いに接近させることも可能である。
　図３に示される例では、第二基板２において外縁部３ａの角部分３ａ１と対向する部位Ｐを、それぞれ加圧装置（図示しない）で円形状に局部加圧して、未半硬化状態の特定部位３ａ′となる角部分３ａ１が未充填領域Ｄ１となる表示領域Ｄの角部Ｄ２に向けて強制的に押し出される。それに加え、前述した全面的な加圧や放置に加えて局部加圧した場合には、未半硬化状態の特定部位３ａ′となる角部分３ａ１が未充填領域Ｄ１となる表示領域Ｄの角部Ｄ２に向かう伸展をそれぞれ促進させることが可能となる。
　また、その他の例として図示しないが、角部分３ａ１と対向する部位Ｐの近傍を円形状と別な形状で局部加圧したり、角部分３ａ１に代えて辺部分３ａ２と対向する部位を局部加圧して、未半硬化状態の特定部位３ａ′となる辺部分３ａ２が表示領域Ｄの辺部Ｄ３に向かう伸展をそれぞれ促進させたりすることも可能である。 Further, instead of or in addition to the above-described full pressurization in the bonding step, the first substrate 1 and the second substrate 2 are left in a state of being overlapped and bonded for a predetermined time. It is preferable to include a leveling step of naturally extending the specific portion 3a ′ in the outer edge portion 3a of the agent 3 along the opposing surfaces 1a and 2a. Accordingly, the corner portion 3a1 and the side portion 3a2 that become the specific portion 3a 'in the semi-cured state in the outer edge portion 3a of the adhesive 3 are the corner portion D2 and the side portion D3 that become the unfilled region D1 in the display region D. It naturally flows toward the screen, thereby expanding and extending all over the display area D.
As a modification of the bonding process, as shown in FIG. 3, instead of the above-described full pressurization or leaving, or in addition to full pressurization or leaving, In either one or both of the substrate 1 and the second substrate 2, the specific portion 3 a ′ is unfilled by partially pressing the portion P facing the specific portion 3 a ′ in the outer edge 3 a of the adhesive 3. It is also possible to approach each other so as to extend toward D1.
In the example shown in FIG. 3, the portion P of the second substrate 2 facing the corner portion 3a1 of the outer edge portion 3a is locally pressed into a circular shape by a pressurizing device (not shown) to identify the unsemi-cured state. The corner portion 3a1 that becomes the portion 3a 'is forcibly pushed toward the corner portion D2 of the display region D that becomes the unfilled region D1. In addition to this, when the partial pressurization is performed in addition to the above-described full pressurization and neglecting, the corner portion 3a1 which becomes the specific portion 3a 'in the unsemi-cured state becomes the corner portion of the display region D which becomes the unfilled region D1 Each extension toward D2 can be promoted.
Although not shown as another example, the vicinity of the portion P facing the corner portion 3a1 is locally pressurized with a shape different from the circular shape, or the portion facing the side portion 3a2 is locally pressed instead of the corner portion 3a1. Thus, it is also possible to promote the extension of the side portion 3a2 serving as the specific portion 3a ′ in the unsemi-cured state toward the side portion D3 of the display region D.
　さらに、合着工程の後工程としては、表示領域Ｄの全体に接着剤３が充填されたことを確認した後、合着工程が実行される場所、又は合着工程の実行場所とは異なる場所などに搬送してから、外縁部３ａの特定部位３ａ′と半硬化部位３ｂ′を含む接着剤３の全体に向け、紫外線などの光線Ｌや熱線などを照射して本硬化させることが好ましい。
　それにより、接着剤３全体の粘度が更に高くなって変形不能な完全接着状態となり、第一基板１と第二基板２がそれらの間に本硬化状態の接着剤３を均等な充填膜厚（ギャップ）で挟み込むように合着した貼合デバイスＡが生産される。 Further, as a post process of the bonding process, after confirming that the entire display area D is filled with the adhesive 3, the place where the bonding process is performed or a place different from the execution place of the bonding process It is preferable to carry out main curing by irradiating the entire adhesive 3 including the specific part 3a ′ and the semi-cured part 3b ′ of the outer edge 3a by irradiating light L such as ultraviolet rays or heat rays.
Thereby, the viscosity of the adhesive 3 as a whole is further increased to be in a completely bonded state that cannot be deformed, and the first substrate 1 and the second substrate 2 have an even filling film thickness ( A bonding device A bonded so as to be sandwiched by a gap) is produced.
　このような本発明の実施形態に係る貼合デバイスＡの製造方法によると、図１（ａ）に示される供給工程で、第一基板１又は第二基板２のいずれか一方か若しくは両方に、接着剤３を表示領域Ｄ内に配置されるように供給した後に、図１（ｂ）及び図２（ａ）に示される半硬化工程で、供給された接着剤３の外縁部３ａにおいて特定部位３ａ′が除かれた充填部位３ｂをその粘度が接着性を保持したまま他の部位の粘度よりも高くなるように部分的に半硬化させる。その後、図１（ｃ）（ｄ）に示される合着工程で、外縁部３ａの特定部位３ａ′と半硬化部位３ｂ′からなる接着剤３の全体を挟むように第一基板１と第二基板２が重ね合わされる。それにより、図１（ｅ）に示されるように、接着剤３の外縁部３ａにおいて未半硬化状態の特定部位３ａ′が、第一基板１と第二基板２の間に生じる毛細管現象や自然流動や加圧流動などによって、接着剤３の外縁部３ａよりも外側の未充填領域Ｄ１に向け拡張伸展して、表示領域Ｄ内の全てに行き渡る。
　したがって、第一基板１と第二基板２で挟まれた接着剤３の外縁部３ａの伸展をコントロールして表示領域Ｄ内の全てを接着剤３で満たすことができる。
　その結果、矩形の表示領域Ｄから第一基板１及び第二基板２の外縁までの余白部分に十分な余裕がない場合でも、第一基板１及び第二基板２の外に接着剤３がはみ出ることを防止できて、接着剤３の整形性に優れて、生産性に優れた貼合デバイスＡの製造方法を提供できる。
　さらに、接着剤３の膜厚（厚さ寸法）が一般的なＬＣＤやＬＣＭなどにおける接着剤の膜厚よりも遥かに厚い貼合デバイスＡを製造する場合でも、第一基板１及び第二基板２の外に接着剤３がはみ出ることなく充填できて対応が容易である。 According to the manufacturing method of the bonding device A according to such an embodiment of the present invention, either or both of the first substrate 1 and the second substrate 2 in the supply step shown in FIG. After supplying the adhesive 3 so as to be arranged in the display area D, in the semi-curing process shown in FIGS. 1B and 2A, a specific part in the outer edge 3a of the supplied adhesive 3 The filling part 3b from which 3a 'is removed is partially semi-cured so that its viscosity is higher than the viscosity of other parts while maintaining the adhesiveness. Thereafter, in the bonding step shown in FIGS. 1C and 1D, the first substrate 1 and the second substrate 1 are sandwiched between the adhesive 3 including the specific portion 3a ′ and the semi-cured portion 3b ′ of the outer edge 3a. The substrate 2 is overlaid. As a result, as shown in FIG. 1 (e), an unsemi-cured specific portion 3 a ′ in the outer edge 3 a of the adhesive 3 is caused by capillarity or natural phenomenon that occurs between the first substrate 1 and the second substrate 2. Due to the flow or pressure flow, it extends and extends toward the unfilled area D1 outside the outer edge 3a of the adhesive 3 and reaches all within the display area D.
Accordingly, it is possible to control the extension of the outer edge 3 a of the adhesive 3 sandwiched between the first substrate 1 and the second substrate 2 and fill the entire display area D with the adhesive 3.
As a result, the adhesive 3 protrudes outside the first substrate 1 and the second substrate 2 even when there is not enough margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2. The manufacturing method of the bonding device A excellent in the shaping property of the adhesive 3 and excellent in productivity can be provided.
Furthermore, even when manufacturing the bonding device A in which the film thickness (thickness dimension) of the adhesive 3 is much thicker than the film thickness of the adhesive in general LCDs and LCMs, the first substrate 1 and the second substrate The adhesive 3 can be filled without sticking out of 2 and can be easily handled.
　特に、合着工程では、第一基板１又は第二基板２のいずれか一方か或いは両方を全面的に加圧して、第一基板１及び第二基板２の対向面１ａ，２ａのいずれかを接着剤３の表面３ｃに対し密着させる場合には、接着剤３の表面３ｃに生ずる凹凸が平滑に変形して密着する。
　したがって、基板１，２同士の合着時における気泡の残留を更に減少させることができる。
　したがって、無気泡の品質を向上させることができるとともに、基板１，２同士の反りを矯正できて、歩留まりが大幅に良くなる。
　　それに加え、合着工程では、対向面１ａ，２ａに沿って接着剤３の外縁部３ａにおける特定部位３ａ′が押し広げられるように対向面１ａ，２ａ同士を互いに接近させる場合には、接着剤３の外縁部３ａにおいて未半硬化状態の特定部位３ａ′が、第一基板１と第二基板２の間に生じる毛細管現象で、接着剤３の外縁部３ａよりも外側の未充填領域Ｄ１に向け流動して拡張伸展し、それにより表示領域Ｄ内の全てに行き渡る。
　したがって、表示領域Ｄ内の全てを接着剤３で確実に満たすことができる。
　その結果、接着剤３の整形性により優れ、歩留まりが大幅に良くなって更なる生産性の向上が図れる。 In particular, in the bonding step, either one or both of the first substrate 1 and the second substrate 2 are fully pressurized, and any one of the facing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 is pressed. When the adhesive 3 is brought into close contact with the surface 3c, the unevenness generated on the surface 3c of the adhesive 3 is smoothly deformed and brought into close contact.
Accordingly, it is possible to further reduce the residual bubbles when the substrates 1 and 2 are bonded together.
Therefore, the bubble-free quality can be improved, and the warpage between the substrates 1 and 2 can be corrected, thereby greatly improving the yield.
In addition, in the bonding step, when the opposing surfaces 1a and 2a are brought close to each other so that the specific portion 3a 'on the outer edge 3a of the adhesive 3 is pushed and spread along the opposing surfaces 1a and 2a, In the outer edge portion 3a of the adhesive 3, the specific portion 3a 'in an unsemi-cured state is formed in the unfilled region D1 outside the outer edge portion 3a of the adhesive 3 due to a capillary phenomenon generated between the first substrate 1 and the second substrate 2. It flows and expands and extends all over the display area D.
Therefore, the entire display area D can be reliably filled with the adhesive 3.
As a result, the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.
　さらに、合着工程の後に、第一基板１と第二基板２を重ね合わせた状態のままで所定時間放置し、接着剤３の外縁部３ａにおける特定部位３ａ′を対向面１ａ，２ａに沿って自然伸展させる工程を含む場合には、接着剤３の外縁部３ａにおいて未半硬化状態の特定部位３ａ′が、接着剤３の外縁部３ａよりも外側の未充填領域Ｄ１に向けて自然流動し、それにより拡張伸展して表示領域Ｄ内の全てに行き渡る。これと同時に、接着剤３中における局部的な真空などが消失して、接着剤３は略静止安定した状態になり、接着剤３の層厚が第一基板１及び第二基板２の対向面１ａ，２ａ全体でＺ方向へ略均一になって、これ以上のギャップ調整は必要ない状態となる。
　したがって、表示領域Ｄ内の全てを接着剤３で自然に満たすことができるとともに、第一基板１及び第二基板２を完全な無気泡状態で且つ均一なギャップで接着することができる。
　その結果、生産設備が複雑化せずコストの低減化が図れるとともに、無気泡の性能を向上させることができる。 Further, after the bonding step, the first substrate 1 and the second substrate 2 are left in a state of being overlapped and left for a predetermined time, and the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 extends along the opposing surfaces 1a and 2a. In this case, the specific part 3a ′ that is not semi-cured in the outer edge 3a of the adhesive 3 is naturally flowed toward the unfilled region D1 outside the outer edge 3a of the adhesive 3. As a result, it extends and extends all over the display area D. At the same time, the local vacuum or the like in the adhesive 3 disappears, the adhesive 3 becomes substantially stationary and stable, and the layer thickness of the adhesive 3 is the opposite surface of the first substrate 1 and the second substrate 2. 1a and 2a are substantially uniform in the Z direction, and no further gap adjustment is required.
Accordingly, the entire display area D can be naturally filled with the adhesive 3, and the first substrate 1 and the second substrate 2 can be bonded in a completely bubble-free state with a uniform gap.
As a result, the production equipment is not complicated, the cost can be reduced, and the bubble-free performance can be improved.
　また、また、合着工程では、重ね合わされた第一基板１又は第二基板２のいずれか一方か若しくは両方において、接着剤３の外縁部３ａにおける特定部位３ａ′と対向する部位Ｐを部分的に加圧して、特定部位３ａ′が未充填領域Ｄ１に向け伸展するように互いに接近させる場合には、接着剤３の外縁部３ａにおいて未半硬化状態の特定部位３ａ′が、接着剤３の外縁部３ａよりも外側の未充填領域Ｄ１に向け強制的に押し出されて流動し、それにより拡張伸展して表示領域Ｄ内の全てに行き渡る。
　したがって、表示領域Ｄ内の全てを接着剤３でスムーズに満たすことができる。
　その結果、接着剤３の整形性により優れ、歩留まりが大幅に良くなって更なる生産性の向上が図れる。
　さらに、前述した全面的な加圧や放置に加えて局部加圧を行った場合には、未充填領域Ｄ１に向かう未半硬化状態の特定部位３ａ′の伸展が促進される。
　したがって、表示領域Ｄ内の全てに接着剤３に充填される時間を短縮することができる。
　その結果、生産性の向上が図れる。
　次に、本発明の一実施例を図面に基づいて説明する。 In addition, in the bonding step, the portion P facing the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 is partially applied to either one or both of the superposed first substrate 1 and second substrate 2. In the outer edge 3a of the adhesive 3 so that the specific part 3a 'is not semi-cured at the outer edge 3a of the adhesive 3. It is forced to flow toward the unfilled region D1 outside the outer edge portion 3a and flows, thereby expanding and extending all over the display region D.
Therefore, the entire display area D can be smoothly filled with the adhesive 3.
As a result, the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.
Furthermore, in the case where local pressurization is performed in addition to the above-described full pressurization and neglect, the extension of the non-hardened specific portion 3a ′ toward the unfilled region D1 is promoted.
Therefore, it is possible to shorten the time for filling the adhesive 3 in the entire display area D.
As a result, productivity can be improved.
Next, an embodiment of the present invention will be described with reference to the drawings.
　次に、本発明の各実施例を図面に基づいて説明する。
　この実施例１は、図１～図４に示すように、供給工程では、矩形の表示領域Ｄの境界線内側に沿って接着剤３を略矩形状に供給し、半硬化工程では、接着剤３の外縁部３ａにおける特定部位３ａ′として角部分３ａ１が除かれた充填部位３ｂの全てを半硬化させ、合着工程では、特定部位３ａ′となる角部分３ａ１を、表示領域Ｄ内において未充填領域Ｄ１となる角部Ｄ２に向け伸展させている。
　実施例１の貼合デバイスＡは、例えばＬＣＤやＬＣＭなどのような、矩形の表示領域Ｄから第一基板１及び第二基板２の外縁までの余白部分に十分な余裕がない電子部品の場合を示している。 Next, each embodiment of the present invention will be described with reference to the drawings.
In the first embodiment, as shown in FIGS. 1 to 4, in the supplying process, the adhesive 3 is supplied in a substantially rectangular shape along the inner side of the boundary line of the rectangular display region D. In the semi-curing process, the adhesive 3 is used. The filling portion 3b from which the corner portion 3a1 is removed as the specific portion 3a 'in the outer edge portion 3a of the outer peripheral portion 3a is semi-cured, and in the joining process, the corner portion 3a1 that becomes the specific portion 3a' It is extended toward the corner | angular part D2 used as the filling area | region D1.
In the case where the bonding device A of Example 1 is an electronic component such as an LCD or an LCM that does not have a sufficient margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2. Is shown.
　図４（ａ）に示される例では、特定部位３ａ′となる角部分３ａ１が、略矩形状に供給された接着剤３の外縁部３ａにおいて四隅に形成される四分円となる部位のみである。
　図示例では、マスク４の遮光部４ａ（４ａ１）を矩形にして、四分円となる部位のみを覆っているが、四分円となる部位を覆うことができれば、遮光部４ａを三角形など他の形状に変更することも可能である。 In the example shown in FIG. 4A, the corner portion 3a1 that becomes the specific portion 3a 'is only a portion that is a quadrant formed at the four corners of the outer edge portion 3a of the adhesive 3 supplied in a substantially rectangular shape. is there.
In the illustrated example, the light-shielding part 4a (4a1) of the mask 4 is rectangular and covers only the part that becomes a quadrant. However, if the part that becomes a quadrant can be covered, the light-shielding part 4a may be a triangle or the like. It is also possible to change the shape.
　図４（ｂ）に示される例では、特定部位３ａ′となる角部分３ａ１が、略矩形状の接着剤３の外縁部３ａにおいて四隅の四分円となる部位と、その円弧３Ｒのいずれか一方又は両方に連続する所定長さの辺３Ｌに沿ってＸＹ方向へ隣接するように連続形成される矩形の辺部位３ａ３とを含めた箇所である。
　図示例では、図４（ａ）に示されるよりも大きな矩形の遮光部４ａ２を用いて、四分円となる部位とＬ字型の辺部位３ａ３を覆っているが、四分円となる部位と少なくとも１つの辺３Ｌに沿った辺部位３ａ３を覆うことができれば、三角形などその他の形状の遮光部４ａを用いることも可能である。 In the example shown in FIG. 4B, the corner portion 3a1 that becomes the specific portion 3a 'is a portion that is a quadrant of the four corners of the outer edge portion 3a of the substantially rectangular adhesive 3, and one of the arcs 3R. This is a location including a rectangular side portion 3a3 that is continuously formed so as to be adjacent in the XY direction along a side 3L having a predetermined length continuous with one or both.
In the illustrated example, the rectangular light-shielding portion 4a2 larger than that shown in FIG. 4A is used to cover the quadrant and the L-shaped side part 3a3, but the quadrant. If the side part 3a3 along at least one side 3L can be covered, it is also possible to use a light shielding part 4a having another shape such as a triangle.
　図４（ｃ）に示される例では、特定部位３ａ′となる角部分３ａ１が、略矩形状の接着剤３の外縁部３ａにおいて四隅の四分円となる部位と、その円弧３Ｒと辺３Ｌの境目から充填部位３ｂに向けＸＹ方向へ隣り合うようにそれぞれ連続形成される隣接部位３ａ４とを含めた箇所である。
　図示例では、矩形と台形が一部で重なり合う形状の遮光部４ａ３を用いて、四分円となる部位と隣接部位３ａ４を覆っているが、四分円となる角部分３ａ１と隣接部位３ａ４を覆うことができれば、矩形を三角形に代えたり台形を円形などに代えたりするなどその他の形状の遮光部４ａを用いることも可能である。 In the example shown in FIG. 4C, the corner portion 3a1 that becomes the specific portion 3a 'is a portion where the outer edge portion 3a of the substantially rectangular adhesive 3 is a quadrant of the four corners, and the arc 3R and the side 3L. And adjacent portions 3a4 continuously formed so as to be adjacent to each other in the XY direction from the boundary to the filling portion 3b.
In the illustrated example, the light shielding part 4a3 having a shape in which a rectangle and a trapezoid partially overlap is used to cover the quadrant and the adjacent portion 3a4. However, the quadrant and the corner portion 3a1 and the adjacent portion 3a4 are covered. As long as it can be covered, it is also possible to use the light-shielding portion 4a having other shapes such as changing the rectangle into a triangle or changing the trapezoid into a circle.
　このような本発明の実施例１に係る貼合デバイスＡの製造方法によると、第一基板１と第二基板２の重ね合わせにより、略矩形状に供給される接着剤３において未半硬化状態の特定部位３ａ′となる角部分３ａ１が、第一基板１と第二基板２の間に生じる毛細管現象や自然流動や加圧流動によって、矩形の表示領域Ｄ内において未充填領域Ｄ１となる角部Ｄ２に向けそれぞれ拡張伸展し、未充填領域Ｄ１の角部Ｄ２まで行き渡る。
　したがって、表示領域Ｄの角部Ｄ２を接着剤３で確実に満たすことができる。
　その結果、貼合デバイスＡがＬＣＤやＬＣＭなどのような、矩形の表示領域Ｄから第一基板１及び第二基板２の外縁までの余白部分に十分な余裕がない場合であっても、第一基板１及び第二基板２の外に接着剤３がはみ出ることを防止できて、接着剤３の整形性により優れ、歩留まりが大幅に良くなって更なる生産性の向上が図れるという利点がある。 According to the manufacturing method of the bonding device A according to the first embodiment of the present invention, the adhesive 3 supplied in a substantially rectangular shape by superimposing the first substrate 1 and the second substrate 2 is not semi-cured. The corner portion 3a1 serving as the specific portion 3a 'is a corner that becomes the unfilled region D1 in the rectangular display region D due to capillary action, natural flow, or pressurized flow generated between the first substrate 1 and the second substrate 2. Each extends and extends toward the portion D2, and reaches the corner portion D2 of the unfilled region D1.
Therefore, the corner portion D <b> 2 of the display area D can be reliably filled with the adhesive 3.
As a result, even if the bonding device A has a sufficient margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCD or LCM, There is an advantage that the adhesive 3 can be prevented from protruding outside the first substrate 1 and the second substrate 2, the formability of the adhesive 3 is excellent, the yield is greatly improved, and the productivity can be further improved. .
　さらに、図４（ｂ）に示される例の場合には、図４（ａ）に示される例に比べ、未半硬化状態の特定部位３ａ′の面積が辺部位３ａ３の分だけ増大して接着剤３の伸展流量が増えるため、表示領域Ｄの角部Ｄ２を接着剤３でより確実に満たすことができる。それにより、伸展に要する接着剤３が不足せず、表示領域Ｄの角部Ｄ２を他の充填部位３ｂに比べて薄くなることなく満たすことができる。 Further, in the case of the example shown in FIG. 4B, the area of the specific part 3a ′ in an unsemi-cured state is increased by the side part 3a3 and bonded compared to the example shown in FIG. Since the extension flow rate of the agent 3 increases, the corner portion D2 of the display region D can be more reliably filled with the adhesive 3. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.
　また、図４（ｃ）に示される例の場合には、図４（ａ）に示される例に比べ、未半硬化状態の特定部位３ａ′の面積が隣接部位３ａ４の分だけ増大して接着剤３の伸展流量が増えるとともに、図４（ｂ）に示される例に比べ、四分円と隣り合う辺３Ｌが仮硬化するため、辺３Ｌから未充填領域Ｄ１へ接着剤３がはみ出ることを防止しながら、表示領域Ｄの角部Ｄ２を接着剤３でより確実に満たすことができる。それにより、伸展に要する接着剤３が不足せず、表示領域Ｄの角部Ｄ２を他の充填部位３ｂに比べて薄くなることなく満たすことができる。 Further, in the case of the example shown in FIG. 4C, the area of the specific part 3a ′ in an unsemi-cured state is increased by the amount of the adjacent part 3a4 compared to the example shown in FIG. As the extension flow rate of the agent 3 increases, the side 3L adjacent to the quadrant is temporarily cured as compared with the example shown in FIG. 4B, and thus the adhesive 3 protrudes from the side 3L to the unfilled region D1. While preventing, the corner | angular part D2 of the display area D can be more reliably filled with the adhesive agent 3. FIG. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.
　この実施例２は、図５及び図６に示すように、供給工程では、矩形の表示領域Ｄの境界線内側に沿って接着剤３を供給し、半硬化工程では、接着剤３の外縁部３ａにおける特定部位３ａ′として少なくとも辺部分３ａ２が除かれた充填部位３ｂを半硬化させ、合着工程では、特定部位３ａ′となる少なくとも辺部分３ａ２を、表示領域Ｄ外において未充填領域Ｄ４となる第一基板１及び第二基板２の外縁部１ｂ，２ｂ間の接合スペースＳに向け伸展させる構成が、図１～図４に示した実施例１とは異なり、それ以外の構成は図１～図４に示した実施例１と同じものである。
　実施例２の貼合デバイスＡは、例えばＬＣＭなどのような、矩形の表示領域Ｄから第一基板１及び第二基板２の外縁までの余白部分に比較的に余裕がある電子部品の場合を示している。 In the second embodiment, as shown in FIGS. 5 and 6, the adhesive 3 is supplied along the boundary line inside the rectangular display region D in the supply process, and the outer edge portion of the adhesive 3 is used in the semi-curing process. The filling part 3b from which at least the side part 3a2 is removed as the specific part 3a 'in 3a is semi-cured, and in the bonding process, at least the side part 3a2 to be the specific part 3a' is separated from the unfilled area D4 outside the display area D. The configuration in which the first substrate 1 and the second substrate 2 are extended toward the bonding space S between the outer edge portions 1b and 2b is different from the first embodiment shown in FIGS. This is the same as the first embodiment shown in FIG.
The bonding device A of Example 2 is a case of an electronic component having a relatively large margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM. Show.
　図５及び図６に示される例では、第一基板１が額縁状の保護枠１１を有し、複数の部品をＺ方向へ重ね合わせて保護枠１１により支持することで一体的に組み付けられている。図示例の第一基板１は、表面側の映像表示部品１２と裏面側のバックライトユニット１３を金属製の保護枠１１で組み付け固定している。
　半硬化工程で用いるマスク４は、保護枠１１よりも小さな額縁状の遮光部４ｃが固着された透明板４ｄを用い、略矩形状の接着剤３の外縁部３ａにおいて四つの辺部分３ａ２と、四隅の四分円となる部位を、遮光部４ｃで覆って、外縁部３ａの全周に亘り枠状に連続するように部分的に半硬化させている。つまり、半硬化工程によって半硬化される「接着剤３の外縁部３ａにおける特定部位３ａ′」が、全ての四分円となる部位及び辺部分３ａ２を含む外縁部３ａの全周である場合を示している。
　また、その他の例として図示しないが、金属製の保護枠１１に代えて他の材料で形成された保護枠１１を用いたり、額縁状の遮光部４ｃを除く透明部分に貫通孔が開穿されたものを用いたり、紫外線などの光線Ｌに代えて熱源から熱線などを照射することで半硬化させたり、第一基板１を額縁状の保護枠１１がないものに代えたりすることも可能である。 In the example shown in FIGS. 5 and 6, the first substrate 1 has a frame-shaped protective frame 11, and a plurality of components are stacked in the Z direction and supported by the protective frame 11 so as to be integrally assembled. Yes. In the illustrated first substrate 1, the front-side video display component 12 and the back-side backlight unit 13 are assembled and fixed by a metal protective frame 11.
The mask 4 used in the semi-curing process uses a transparent plate 4d to which a frame-shaped light-shielding portion 4c smaller than the protective frame 11 is fixed, and has four side portions 3a2 on the outer edge portion 3a of the substantially rectangular adhesive 3; The part which becomes a quadrant of the four corners is covered with a light-shielding part 4c, and is partially semi-cured so as to continue in a frame shape over the entire circumference of the outer edge part 3a. That is, the case where the “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process is the entire circumference of the outer edge 3a including all the quadrants and the side part 3a2. Show.
Although not shown as another example, a protective frame 11 made of another material is used in place of the metal protective frame 11, or a through hole is opened in a transparent portion excluding the frame-shaped light shielding portion 4c. It is also possible to use semi-cured materials, to be semi-cured by irradiating heat rays or the like from a heat source instead of the light rays L such as ultraviolet rays, or to replace the first substrate 1 with one without the frame-shaped protective frame 11. is there.
　このような本発明の実施例２に係る貼合デバイスＡの製造方法によると、第一基板１と第二基板２の重ね合わせにより、略矩形状に供給される接合スペースＳにおいて未半硬化状態の特定部位３ａ′となる少なくとも辺部分３ａ２が、第一基板１と第二基板２の間に生じる毛細管現象や自然流動や加圧流動によって、矩形の表示領域Ｄ外において未充填領域Ｄ４となる第一基板１及び第二基板２の外縁部１ｂ，２ｂ間の接合スペースＳに向けそれぞれ拡張伸展し、接合スペースＳまで行き渡る。
　したがって、第一基板１と第二基板２の間をそれらの外縁部１ｂ，２ｂ近くまで接着剤３で確実に満たすことができる。
　その結果、貼合デバイスＡがＬＣＭなどのような、矩形の表示領域Ｄから第一基板１及び第二基板２の外縁までの余白部分に比較的に余裕がある場合には、第一基板１と第二基板２の接着強度を向上させることができるという利点がある。 According to such a manufacturing method of the bonding device A according to Example 2 of the present invention, the first substrate 1 and the second substrate 2 are superposed to each other in the non-cured state in the bonding space S supplied in a substantially rectangular shape. At least the side portion 3a2 serving as the specific portion 3a 'becomes an unfilled region D4 outside the rectangular display region D due to capillary action, natural flow, or pressurized flow generated between the first substrate 1 and the second substrate 2. Each of the first substrate 1 and the second substrate 2 extends and extends toward the bonding space S between the outer edge portions 1b and 2b of the second substrate 2 and reaches the bonding space S.
Therefore, the space between the first substrate 1 and the second substrate 2 can be reliably filled with the adhesive 3 to the vicinity of the outer edge portions 1b and 2b.
As a result, when the bonding device A has a relatively large margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM, the first substrate 1 There is an advantage that the adhesive strength of the second substrate 2 can be improved.
　特に、図５及び図６に示される例の場合には、第一基板１の保護枠１１と第二基板２との接着強度を高めることができる。
　さらに、第一基板１が、複数の部品をＺ方向へ積み重ねて保護枠１１により支持固定するような電子部品である場合には、保護枠１１と表面側の映像表示部品１２との隙間から液体が染み込むと、内部の電子回路にダメージを与えて故障の原因となるため、隙間から染み込むような接着剤は使用できなかった。しかし、紫外線硬化型接着剤のような粘性の高い接着剤３を用いることで、保護枠１１と表面側の映像表示部品１２との隙間からの内部への染み込みによる故障も防止できる。 In particular, in the example shown in FIGS. 5 and 6, the adhesive strength between the protective frame 11 of the first substrate 1 and the second substrate 2 can be increased.
Further, when the first substrate 1 is an electronic component in which a plurality of components are stacked in the Z direction and supported and fixed by the protective frame 11, the liquid is discharged from the gap between the protective frame 11 and the video display component 12 on the front side. If soaked, it would damage the internal electronic circuit and cause failure, so an adhesive that soaked through the gap could not be used. However, by using a highly viscous adhesive 3 such as an ultraviolet curable adhesive, it is possible to prevent failure due to penetration into the interior from the gap between the protective frame 11 and the image display component 12 on the surface side.
　なお、前示実施例では、合着工程における第一基板１と第二基板２の貼り合わせ方法について詳しく説明しなかったが、第一基板１を着脱自在に保持する第一定盤、又は第二基板２を着脱自在に保持する第二定盤のいずれか一方か、若しくは第一定盤及び第二定盤の両方に緩衝材を具備して、第一定盤及び第二定盤の平行度と関係なく、第一基板１と第二基板２の平行度を確保することが好ましい。
　さらに、前示実施例では、接着剤３の外縁部３ａにおける特定部位３ａ′が除かれた充填部位３ｂの全てを半硬化させたが、これに限定されず、外縁部３ａの特定部位３ａ′が除かれていれば、それに加えて充填部位３ｂの中心側の一部を部分的に除いた状態で半硬化させてもよい。 In the previous embodiment, the method for bonding the first substrate 1 and the second substrate 2 in the bonding process has not been described in detail. However, the first fixed plate that holds the first substrate 1 detachably, Either one of the second surface plates for detachably holding the two substrates 2 or both the first surface plate and the second surface plate are provided with a buffer material, and the first surface plate and the second surface plate are parallel to each other. It is preferable to ensure the parallelism between the first substrate 1 and the second substrate 2 regardless of the degree.
Furthermore, in the previous embodiment, all of the filling portion 3b from which the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 is removed is semi-cured. However, the present invention is not limited to this. May be semi-cured in a state where a part of the center side of the filling portion 3b is partially removed.
　Ａ　貼合デバイス　　　　　　　　　　　　　１　第一基板
　１ａ　対向面　　　　　　　　　　　　　　　１ｂ　外縁部
　２　第二基板　　　　　　　　　　　　　　　２ａ　対向面
　２ｂ　外縁部　　　　　　　　　　　　　　　３　接着剤
　３ａ　外縁部　　　　　　　　　　　　　　　３ａ′　特定部位
　３ａ１　角部分　　　　　　　　　　　　　　３ａ２　辺部分
　３ｂ　充填部位　　　　　　　　　　　　　　３ｂ′　半硬化部位
　３ｃ　表面　　　　　　　　　　　　　　　　Ｄ　表示領域
　Ｄ１　未充填領域　　　　　　　　　　　　　Ｄ２　角部
　Ｄ４　未充填領域　　　　　　　　　　　　　Ｐ　特定部位と対向する部位
　Ｓ　接合スペース A bonding device 1 1st board | substrate 1a Opposing surface 1b Outer edge part 2 2nd board | substrate 2a Opposing surface 2b Outer edge part 3 Adhesive 3a Outer edge part 3a 'Specific part 3a1 Corner | angular part 3a2 Side part 3b Filling part 3b' Semi-hardening part 3c Surface D Display area D1 Unfilled area D2 Corner D4 Unfilled area P Part facing a specific part S Joining space

Claims (6)

  1. 　対向する第一基板と第二基板が、その間に充填した液状の接着剤を挟んで合着され、表示領域を有する貼合デバイスの製造方法であって、
    　前記第一基板又は前記第二基板のいずれか一方か若しくは前記第一基板及び前記第二基板の両方に前記接着剤を前記表示領域内に配置されるように供給する供給工程と、
    　前記接着剤の外縁部において特定部位が除かれた充填部位を、その粘度が接着性を保持したまま他の部位の粘度よりも高くなるように半硬化させる半硬化工程と、
    　前記第一基板と前記第二基板をそれら対向面の間に前記接着剤が挟まれるように重ね合わせる合着工程とを含み、
    　前記合着工程では、前記半硬化工程で半硬化されていない前記接着剤の前記外縁部における前記特定部位を、前記接着剤の前記外縁部の外側に配置される前記接着剤の未充填領域に向け伸展させることを特徴とする貼合デバイスの製造方法。     The first substrate and the second substrate facing each other are bonded together with a liquid adhesive filled therebetween, and a manufacturing method of a bonding device having a display region,
    A supply step of supplying the adhesive to either the first substrate or the second substrate or to both the first substrate and the second substrate so as to be disposed in the display area;
    A semi-curing step of semi-curing the filling part from which the specific part is removed at the outer edge of the adhesive so that the viscosity becomes higher than the viscosity of the other part while maintaining the adhesiveness;
    A bonding step of overlapping the first substrate and the second substrate so that the adhesive is sandwiched between the opposing surfaces;
    In the attaching step, the specific portion in the outer edge portion of the adhesive that has not been semi-cured in the semi-curing step is placed in an unfilled region of the adhesive disposed outside the outer edge portion of the adhesive. The manufacturing method of the bonding device characterized by extending toward the direction.
  2. 　前記合着工程では、前記第一基板又は前記第二基板のいずれか一方か或いは両方を全面的に加圧して、前記第一基板及び前記第二基板の前記対向面のいずれかを前記接着剤の表面に対し密着させ、且つ前記対向面に沿って前記接着剤の前記外縁部における前記特定部位が押し広げられるように前記対向面同士を互いに接近させることを特徴とする請求項１記載の貼合デバイスの製造方法。 In the bonding step, either one or both of the first substrate and the second substrate are entirely pressurized, and either the first substrate or the second substrate is opposed to the adhesive. 2. The sticking according to claim 1, wherein the facing surfaces are brought into close contact with each other, and the facing surfaces are brought close to each other so that the specific portion of the outer edge portion of the adhesive is spread along the facing surface. A method for manufacturing a composite device.
  3. 　前記合着工程の後に、前記第一基板と前記第二基板を重ね合わせた状態のままで所定時間放置し、前記接着剤の前記外縁部における前記特定部位を前記対向面に沿って自然伸展させる工程を含むことを特徴とする請求項１又は２記載の貼合デバイスの製造方法。 After the bonding step, the first substrate and the second substrate are left in a superposed state for a predetermined time, and the specific portion of the outer edge portion of the adhesive is naturally extended along the facing surface. The manufacturing method of the bonding device of Claim 1 or 2 characterized by including a process.
  4. 　前記合着工程では、重ね合わされた前記第一基板又は前記第二基板のいずれか一方か若しくは両方において、前記接着剤の前記外縁部における前記特定部位と対向する部位を部分的に加圧して、前記特定部位が前記未充填領域に向け伸展するように互いに接近させることを特徴とする１，２又は３記載の貼合デバイスの製造方法。 In the bonding step, in either one or both of the superimposed first substrate and second substrate, a part facing the specific part in the outer edge part of the adhesive is partially pressurized, The manufacturing method of the bonding device according to 1, 2 or 3, wherein the specific parts are brought close to each other so as to extend toward the unfilled region.
  5. 　前記供給工程では、矩形の前記表示領域の境界線内側に沿って前記接着剤を供給し、
    　前記半硬化工程では、前記接着剤の前記外縁部における前記特定部位として角部分が除かれた充填部位を半硬化させ、
    　前記合着工程では、前記特定部位となる前記角部分を、前記表示領域内において前記未充填領域となる角部に向け伸展させることを特徴とする請求項１～４のいずれかに記載の貼合デバイスの製造方法。     In the supplying step, the adhesive is supplied along the boundary line inside the rectangular display area,
    In the semi-curing step, semi-curing the filling part from which the corner part is removed as the specific part in the outer edge part of the adhesive,
    The pasting process according to any one of claims 1 to 4, wherein, in the attaching step, the corner portion serving as the specific portion is extended toward a corner portion serving as the unfilled region in the display region. A method for manufacturing a composite device.
  6. 　前記供給工程では、矩形の前記表示領域の境界線内側に沿って前記接着剤を供給し、
    　前記半硬化工程では、前記接着剤の前記外縁部における前記特定部位として少なくとも辺部分が除かれた充填部位を半硬化させ、
    　前記合着工程では、前記特定部位となる少なくとも前記辺部分を、前記表示領域外において前記未充填領域となる前記第一基板及び前記第二基板の外縁部間の接合スペースに向け伸展させることを特徴とする請求項１～４のいずれかに記載の貼合デバイスの製造方法。     In the supplying step, the adhesive is supplied along the boundary line inside the rectangular display area,
    In the semi-curing step, the filling part from which at least a side part is removed as the specific part in the outer edge part of the adhesive is semi-cured,
    In the bonding step, extending at least the side portion serving as the specific portion toward a bonding space between the outer edge portion of the first substrate and the second substrate serving as the unfilled region outside the display region. The method for producing a bonding device according to any one of claims 1 to 4, characterized in that:
PCT/JP2013/067691 2013-06-27 2013-06-27 Bonded device manufacturing method WO2014207867A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106125352A (en) * 2015-05-07 2016-11-16 信越工程株式会社 The manufacture method of abutted equipment and the manufacture device of abutted equipment
JPWO2020195251A1 (en) * 2019-03-26 2020-10-01
CN114425504A (en) * 2022-02-08 2022-05-03 亚世光电(集团)股份有限公司 Novel LOCA (local area array) glue overflow reducing process method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107554043A (en) * 2017-09-22 2018-01-09 东莞华贝电子科技有限公司 The assemble method of LCM joint jigs, LCM
CN111369904B (en) * 2020-04-08 2022-05-31 深圳市华星光电半导体显示技术有限公司 Display panel, manufacturing method thereof and display device
CN114241916A (en) * 2021-12-22 2022-03-25 云谷（固安）科技有限公司 Method for attaching curved cover plate and flexible screen

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10274946A (en) * 1997-03-31 1998-10-13 Matsushita Electron Corp Production of liquid crystal panel
JP2004151656A (en) * 2002-11-01 2004-05-27 Seiko Epson Corp Manufacturing method and manufacturing apparatus for electro-optic device and electrical equipment
JP2011145534A (en) * 2010-01-15 2011-07-28 Hitachi Displays Ltd Display device with front window and method for manufacturing the same
WO2012029110A1 (en) * 2010-08-30 2012-03-08 信越エンジニアリング株式会社 Display panel production method and production system therefor
JP2012071281A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Apparatus and method for supplying adhesive
JP2012073534A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Sticking device and sticking method
JP4981190B1 (en) * 2011-12-08 2012-07-18 信越エンジニアリング株式会社 Manufacturing method of bonding device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012073533A (en) 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Sticking device and sticking method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10274946A (en) * 1997-03-31 1998-10-13 Matsushita Electron Corp Production of liquid crystal panel
JP2004151656A (en) * 2002-11-01 2004-05-27 Seiko Epson Corp Manufacturing method and manufacturing apparatus for electro-optic device and electrical equipment
JP2011145534A (en) * 2010-01-15 2011-07-28 Hitachi Displays Ltd Display device with front window and method for manufacturing the same
WO2012029110A1 (en) * 2010-08-30 2012-03-08 信越エンジニアリング株式会社 Display panel production method and production system therefor
JP2012071281A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Apparatus and method for supplying adhesive
JP2012073534A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Sticking device and sticking method
JP4981190B1 (en) * 2011-12-08 2012-07-18 信越エンジニアリング株式会社 Manufacturing method of bonding device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106125352A (en) * 2015-05-07 2016-11-16 信越工程株式会社 The manufacture method of abutted equipment and the manufacture device of abutted equipment
CN106125352B (en) * 2015-05-07 2019-04-19 信越工程株式会社 The manufacturing method of abutted equipment and the manufacturing device of abutted equipment
JPWO2020195251A1 (en) * 2019-03-26 2020-10-01
WO2020195251A1 (en) * 2019-03-26 2020-10-01 日東電工株式会社 Layered film production method
US11691405B2 (en) 2019-03-26 2023-07-04 Nitto Denko Corporation Layered film production method
JP7402860B2 (en) 2019-03-26 2023-12-21 日東電工株式会社 Manufacturing method of laminated film
CN114425504A (en) * 2022-02-08 2022-05-03 亚世光电(集团)股份有限公司 Novel LOCA (local area array) glue overflow reducing process method

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