TW201505843A - Bonded device manufacturing method - Google Patents

Abstract

The purpose of a manufacturing method for a bonded device according to the present invention is to control the extension of the outer periphery of an adhesive sandwiched between a first substrate and a second substrate and fill the entirety of the inside of a display area with the adhesive. After a first substrate (1), second substrate (2), or both are supplied with an adhesive (3) such that the adhesive (3) is disposed within a display area (D), in the periphery (3a) of the adhesive (3), a filled portion (3b) excluding a specific portion (3a') is semi-cured such that the viscosity thereof is higher than the viscosity of other portions while the adhesiveness thereof is maintained. Thereafter, the first substrate (1) and second substrate (2) are caused to overlap so that the adhesive (3) is sandwiched therebetween, and the resulting capillary action, natural flow, or pressurized flow occurring between the first substrate (1) and second substrate (2) causes the specific portion (3a'), which is not semi-cured, in the periphery (3a) of the adhesive (3) to extend toward an unfilled area (D1) further to the outside than the periphery (3a) of the adhesive (3) and spread throughout the entirety of the inside of the display area (D).

Description

Manufacturing method of bonding equipment

The present invention relates to a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or the like, for example, a touch panel type FPD or 3D (3) A manufacturing method of a bonding apparatus for a substrate such as a liquid crystal module (LCM) such as a display or an electronic book or a flexible printed circuit board (FPC) to bond a cover glass or a cover film or another substrate such as an FPD.

Conventionally, as a method of manufacturing such a bonding apparatus, there is a bonding method in which a supply unit supplies an adhesive (ultraviolet curing resin) over the entire single surface of one workpiece, with respect to the entire single surface of the workpiece. A part of the adhesive (the outer edge portion of the supply region of the adhesive agent) or all of the adhesive agent covering the entire surface of the workpiece is irradiated with electromagnetic waves (ultraviolet rays) in the atmosphere before bonding, thereby making a part of the adhesive (outside) The edge portion or all of the temporary curing, bonding another workpiece with respect to the temporarily cured adhesive, thereby suppressing the flow of the adhesive before bonding, and preventing deformation of the coating shape or overflow to the outside of the workpiece (for example, Refer to Patent Document 1).

Further, in the bonding method, as a method of supplying the adhesive over the entire single surface of one workpiece, there is shown an example in which the nozzle of the dispenser is dropped onto the entire surface (the entire one surface) of the workpiece S1. Agent R, an example in which the adhesive is applied to the entire surface of the workpiece by moving the dispenser with a scanning device; an example in which the adhesive is supplied to a part of the workpiece and then diffused toward the whole; the device connected to the plurality of dispensers will continue An example in which the agent is applied in a plurality of lines; the supply portion coats the adhesive into a planar shape, thereby uniformly coating the adhesive in a short time. Examples of various devices such as a device coated by a roller or a device coated by a rubber roller or a device coated by spin coating.

[Advanced technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2012-73533

However, in a bonding apparatus such as an LCD or an LCM, the substrate constituting the apparatus is a rectangular thin plate as shown in Patent Document 1, and is formed by filling an adhesive with an adhesive between the two substrates. Formed as a rectangle within the entire display area.

Further, in recent years, the size of the display region is expanding with respect to the size of the substrate due to an increase in the application technique of the adhesive, etc., but the blank portion of the outer edge portion of the substrate which is not filled with the adhesive is as narrow as possible. the trend of. Recently, there has been a demand to expand the size of the display area to the vicinity of the outer edge of the substrate.

Even in such a case, in the rectangular display region, especially when the adhesive is not applied to the corner portion and the end portion of the adhesive is observed in the display region, the display quality is lowered, so that it becomes a defective product.

However, in the above-described manufacturing method of the bonding apparatus, it is difficult to supply the adhesive over the entire single surface of the rectangular workpiece.

The reason for this is that the liquid adhesive such as the ultraviolet curable resin is rounded in a spherical shape in the longitudinal and lateral directions (XY direction) and the thickness direction (Z direction) of the workpiece due to the surface tension. Therefore, the adhesive cannot be used on one side of the workpiece. It is distributed at right angles to the corners of the rectangular display area.

In other words, even if the adhesive is applied to the supply device described in Patent Document 1, or the supplied adhesive is diffused as a whole, or the adhesive is applied to the surface by the supply portion, the adhesive cannot be supplied as an adhesive. The desired thickness is throughout the designated area of the rectangular workpiece.

For this reason, in order to extend the adhesive to the corners of the rectangular display area, The adhesive is not supplied (coated) in a manner wider than the rectangular display region so that the end portion of the adhesive which is rounded due to the surface tension extends to the corner portion of the rectangular display region. However, in this method, if the workpieces are bonded to each other after being supplied (coated) to the one surface of the workpiece in such a manner that the adhesive is wider than the rectangular display region, the end portion of the adhesive which diffuses between the workpieces is displayed from the rectangle. The edge of the area overflows. For example, in recent years, when there is no sufficient margin in the blank portion from the rectangular display region to the outer edge of the workpiece, as the workpieces are attached to each other, the adhesive overflows to the outside of the workpiece, and needs to be wiped off in a subsequent step. Thereby, there is a problem that the productivity is lowered and the production cost is increased.

Further, depending on the type of the bonding apparatus, the film thickness (thickness dimension) of the adhesive is required to be about 0.1 to 0.5 mm. This size is up to tens of times higher than the film thickness of an adhesive in a normal LCD or LCM (about 1 to 10 μm), so that the fluidity of the adhesive becomes large, and the adhesive is applied to the entire display region. Work is becoming more difficult.

The present invention has been made to solve such a problem, and an object thereof is to control the stretching of the outer edge portion of the adhesive agent sandwiched between the first substrate and the second substrate, and to coat the entire display region with an adhesive.

In order to achieve such a object, the present invention provides a method of manufacturing a bonding apparatus in which a pair of opposed first substrates and second substrates are bonded by a liquid adhesive interposed therebetween. a display region having a predetermined shape, wherein the display unit includes a supply step of disposing the first substrate or the second substrate or both the first substrate and the second substrate in the display region Providing the above-mentioned adhesive; the semi-curing step, semi-curing the filling portion except the specific portion of the outer edge portion of the adhesive in a state in which the viscosity is maintained higher than that of the other portions; and bonding a step of superimposing the first substrate and the second substrate so that the opposing surfaces are spaced apart from each other, and in the supplying step, outside the display region The shape of the portion is such that the filling portion is formed so as to be adjacent to the outer portion of the outer edge portion of the adhesive agent, and the adhesive is supplied along the outer shape of the boundary line of the display region. In the semi-curing step, The entire filling portion except the specific portion of the outer edge portion of the adhesive is partially semi-cured, and in the bonding step, the first substrate and the second substrate are overlapped in the semi-curing step. The specific portion of the outer edge portion of the intermediate agent that is not semi-cured is stretched toward an unfilled region of the adhesive disposed outside the outer edge portion of the adhesive.

In the present invention, the first substrate or the second substrate is supplied with an adhesive agent so as to be disposed in the display region, and then the viscosity is higher than that of the other portions while maintaining the adhesion. In this manner, the filling portion other than the specific portion of the outer edge portion of the adhesive is semi-cured, and then the first substrate and the second substrate are stacked so as to sandwich the adhesive, whereby the outer edge portion of the adhesive is not half The specific portion in the cured state extends toward the unfilled region outside the outer edge portion of the adhesive due to a capillary phenomenon or a natural flow or a pressurized flow generated between the first substrate and the second substrate, and extends over the entire display region. Inside.

Thereby, the extension of the outer edge portion of the adhesive agent sandwiched between the first substrate and the second substrate can be controlled, and the entire display region can be coated with the adhesive.

As a result, compared with the conventional method of manufacturing a bonding apparatus in which the adhesive adheres from the side of the rectangular filling region as the bonding between the workpieces is made, even from the rectangular display region to the first substrate and the second substrate. When there is no sufficient margin in the blank portion of the edge, it is possible to prevent the adhesive from overflowing to the outside of the first substrate and the second substrate, and the adhesive has excellent formability and excellent productivity.

Further, even when the film thickness (thickness dimension) of the adhesive is much thicker than that of the film thickness of the adhesive in a general LCD or LCM or the like, the adhesion of the adhesive agent to the first substrate and the second substrate can be avoided. It is easier to fill with an external overflow.

A‧‧‧Fitting equipment

1‧‧‧1st substrate

1a‧‧‧ opposite surface of the first substrate

1b‧‧‧The outer edge

2‧‧‧2nd substrate

2a‧‧‧ opposite surface of the second substrate

2b‧‧‧The outer edge

3‧‧‧Binder

3a‧‧‧The outer edge

3a'‧‧‧Specific parts

3a1‧‧ corner section

3a2‧‧‧ side section

3a3‧‧‧ side parts

3a4‧‧‧ adjacent parts

3b‧‧‧filling parts

3b'‧‧‧ semi-cured parts

3c‧‧‧ surface

3L‧‧‧ side

3R‧‧‧ arc

4‧‧‧ mask

4a‧‧‧Lighting Department

4a1‧‧‧Lighting Department

4a2‧‧‧Lighting Department

4a3‧‧‧Lighting Department

4b‧‧‧Transparent board

5‧‧‧Light source

11‧‧‧protection frame

12‧‧‧Image display component

13‧‧‧Backlight unit

A‧‧‧Fitting equipment

D‧‧‧ display area

D1‧‧‧Unfilled area

D2‧‧‧ corner

D3‧‧‧Edge

D4‧‧‧Unfilled area

P‧‧‧Parts opposite specific parts

S‧‧‧ joint space

Fig. 1 is an explanatory view showing a method of manufacturing a bonding apparatus according to an embodiment of the present invention, wherein (a) is a plan view after a supply step, (b) is a plan view of a semi-curing step, and (c) is a semi-curing step. The plan view, (d) is a plan view of the bonding step, and (e) is a plan view after the bonding step.

Fig. 2 is a front view, (a) is an enlarged front view of Fig. 1(b), and (b) is an enlarged front view of Fig. 1(e).

Fig. 3 is an enlarged plan view showing a modification of the bonding step.

Fig. 4 is an explanatory view of a semi-curing step, (a) is a partially enlarged plan view of Fig. 1 (b), and (b) (c) is a partially enlarged plan view showing a modification of Fig. 4 (a).

Figure 5 is an explanatory view showing a method of manufacturing a bonding apparatus according to another embodiment of the present invention, (a) is a plan view after the supply step, (b) is a plan view of the semi-curing step, and (c) is a semi-curing step The subsequent plan view, (d) is a plan view of the bonding step, and (e) is a plan view after the bonding step.

Fig. 6 is a front view, (a) is an enlarged longitudinal sectional front view of Fig. 5(b), and (b) is an enlarged longitudinal sectional front view of Fig. 1(e).

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 6, the bonding apparatus A according to the embodiment of the present invention is bonded to the first substrate 1 and the second substrate so as to sandwich the liquid adhesive 3 filled therebetween. The substrate 2 is thereby formed with a display region D having a predetermined shape at a predetermined position.

The manufacturing method of the bonding apparatus A includes a supply step of supplying the adhesive 3 to the facing surface of the first substrate 1 or the second substrate 2 so as to be disposed in the display region D. The semi-curing step is performed. The filling portion 3b other than the specific portion 3a' of the outer edge portion 3a of the supplied adhesive 3 is semi-cured in such a manner that the viscosity of the adhesive 3 is higher than that of the other portions, and the bonding step is performed to The opposing faces 1a, 2a are separated by an adhesive The first substrate 1 and the second substrate 2 are superposed on each other.

The first substrate 1 and the second substrate 2 are, for example, a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or, for example, a touch panel type FPD or Liquid crystal module (LCM) such as 3D (3D) display or electronic book or flexible printed circuit board (FPC), transparent glass substrate or transparent heat-resistant resin (PES: Poly-Ether-Sulphone, etc.) A film or a synthetic resin substrate or a cover glass or a barrier glass.

Further, the first substrate 1 or the second substrate 2 is not limited to use a substrate which is finally separated in the production stage, and it is possible to use a plurality of first substrate 1 or second substrate 2 which are arranged in parallel in the production stage. The front one of the substrates. Any one of the first substrate 1 or the second substrate 2 may be formed by assembling a plurality of components such as LCM, and the outer periphery of the frame may be supported by a frame-shaped protective frame.

Further, the outer shape of the first substrate 1 and the second substrate 2 is formed to have the same size, for example, a rectangular shape, and is preferably bonded so that the outer edges overlap each other in the bonding step.

The adhesive 3 is cured by, for example, a photocurable adhesive having photocurability, that is, by polymerization by absorbing light energy, thereby exhibiting adhesion. Further, in place of the photocurable adhesive, a thermosetting adhesive or a two-liquid mixed curable adhesive which is cured by absorbing heat energy can be used.

In addition, when the adhesive agent 3 is supplied to either of the first substrate 1 or the second substrate 2, the viscosity of the adhesive is lower than that of the first substrate 1 or the second substrate 2, and the fluidity is low. The adhesive 3 absorbs light energy, heat energy, or the like in a semi-curing step to be described later, and the fluidity decreases as the viscosity (degree of polymerization, degree of cure) increases, but the surface of the adhesive 3 does not solidify and remains. The gelatinized state is referred to as a semi-cured state. The adhesive 3 in the semi-cured state is not easily deformed by further absorption of light energy or heat energy, and is in a state of being completely cured.

As a specific example of the adhesive 3, for example, a propylene-based UV-curable resin or An ultraviolet curable adhesive such as an anthraquinone-based UV-curable resin is preferably an adhesive containing an oxygen-inhibiting curing control material which is not cured on the surface of the air. In addition, such a curing control material generally has a property of vaporizing in a vacuum atmosphere.

In the method of supplying the adhesive 3 in the supply step, for example, a linear coating device such as a coating die having a slit-shaped discharge portion or a linear coating device such as a quantitative discharge nozzle or another mechanism is used for the first substrate. 1 or both of the opposing surfaces of the second substrate 2 or both of the first substrate 1 and the second substrate 2 are supplied in substantially the same shape as the outer shape of the display region D.

In the specific example of the supply step shown in FIG. 1( a ), in the rectangular display region D in the opposing surface 1 a of the first substrate 1 by using a planar coating device or a linear coating device in the atmosphere, The adhesive 3 is applied in a substantially rectangular shape smaller than the outer shape of the display region D.

Further, although not shown in the drawings, the adhesive 3 may be applied by printing or the like instead of the planar coating device or the linear coating device, or instead of the opposing surface 1a of the first substrate 1, only The opposing surface 2a of the second substrate 2 or the opposing surface 1a of the first substrate 1 and the opposing surface 2a of the second substrate 2 are coated with the adhesive 3, respectively.

Further, before the supply of the adhesive 3, the air bubbles mixed in the adhesive 3 are degassed in advance, and care must be taken to avoid entrapment of air bubbles during coating. It is also left for a predetermined period of time after the supply of the adhesive 3, so that the bubbles which are entrapped at the time of coating are naturally defoamed.

As the "specific portion 3a' in the outer edge portion 3a of the adhesive 3" which is semi-cured by the semi-curing step, the opposing surface of the first substrate 1 or the second substrate 2 is supplied in a rectangular shape to the adhesive 3 At the time, the end portion is rounded into a spherical corner portion 3a1 or the like due to the surface tension of the adhesive 3. Further, as another example of the specific portion 3a', the side portion 3a2 or the corner portion 3a1 of the predetermined length continuous with the corner portion 3a1 and the entire circumference of the outer edge portion 3a of the side portion 3a2 may be included.

As a semi-curing method based on the adhesive 3 of the semi-curing step, the specific portion 3a' in the outer edge portion 3a of the adhesive 3 is covered with a mask 4 or the like to expose the cover except for the cover 4 or the like. The filling portion 3b of the specific portion 3a' of the agent 3 is irradiated with light energy, heat energy, or the like, and only the filled portion 3b in the exposed state absorbs light energy or heat energy, thereby becoming viscous and maintaining the adhesion state. Local semi-curing is carried out in a manner higher than the viscosity of other parts.

In the specific example of the semi-curing step shown in FIGS. 1(b) and 2(a), a photocurable adhesive is used as the adhesive 3 to serve as a specific portion 3a in the outer edge portion 3a of the adhesive 3. The flat mask 4 is disposed so as to cover the corner portion 3a1 in the thickness direction (hereinafter referred to as the Z direction), and the light source 5 such as an ultraviolet lamp is disposed through the mask 4, and the light source 5 is irradiated with the light L such as ultraviolet rays. In the outer edge portion 3a of the adhesive agent 3, only the filling portion 3b such as the corner portion 3a1 of the specific portion 3a' absorbs light energy and gels, and the surface thereof is gelatinized but maintains the adhesion. Semi-cured state.

That is, the filling portion 3b of the adhesive 3 excluding the corner portion 3a1 of the specific portion 3a' or the like becomes the semi-cured portion 3b' which is semi-cured in the semi-curing step. Further, in the outer edge portion 3a of the adhesive 3, the corner portion 3a1 or the like of the specific portion 3a' is an uncured portion or an uncured portion which is not semi-cured in the semi-curing step.

In particular, when the adhesive 3 contains an oxygen-suppressing curing control material, the surface layer of the filling portion 3b of the outer edge portion 3a in the air is not completely cured due to the oxygen suppression property, and the adhesion remains.

In the example of the figure, as the mask 4, the transparent plate 4b in which the light shielding portion 4a is fixed at a predetermined position is used.

Further, although not shown in the drawings, a mask in which a through hole is formed in a transparent portion other than the light shielding portion 4a, or a light L such as ultraviolet rays, may be used as the mask 4 from the heat source. By irradiating a heat line or the like, it is gelled by absorbing heat energy or the like, and is semi-cured or changed.

In addition, after the semi-curing step, the semi-cured portion 3b' in the semi-cured state is left in this state (the filling of the corner portion 3a1 of the outer edge portion 3a of the adhesive 3 other than the specific portion 3a') The portion 3b) and the outer edge portion 3a except the semi-cured portion 3b' The surface 3c in the corner portion 3a1 or the like of the specific portion 3a' (the uncured portion or the semi-cured portion which is not semi-cured) is naturally smoothed, and it is preferable to further defoam the bubble which is caught during coating.

In the bonding method of the first substrate 1 and the second substrate 2 in the bonding step, the specific portion 3a including the outer edge portion 3a is sandwiched between the opposing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 The entire adhesive agent 3 of the 'half-cured portion 3b' overlaps in the Z direction, and the specific portion 3a' of the outer edge portion 3a of the adhesive 3 that is not semi-cured is disposed toward the outer edge portion 3a of the adhesive 3. The unfilled region D1 of the outer adhesive 3 is stretched.

As an example, one or both of the superposed first substrate 1 or the second substrate 2 are pressed in the Z direction, and the opposing faces 1a and 2a are brought closer to each other in the Z direction so as to be respectively aligned with each other. The vertical and horizontal oblique directions (hereinafter referred to as XYθ directions) in which the Z direction intersects are preferably diffused.

In the specific example of the bonding step shown in FIGS. 1(d) and 1(e), the first substrate 1 coated with the adhesive 3 is placed in the vacuum or in the atmosphere, and the opposing surface 2a and the adhesive 3 are used. The second substrate 2 is placed so as to be in contact with the surface 3c, and the first substrate 1 and the second substrate 2 are integrally pressed together so as to be parallel to each other with the adhesive 3 interposed therebetween.

Specifically, an elevation drive unit (not shown) that moves either or both of the first substrate 1 or the second substrate 2 close to each other is provided. The elevation drive unit is controlled by a controller (not shown), and is configured to move the first substrate 1 and the second substrate 2 to a distance between the opposing surfaces 1a and 2a and the application of the adhesive 3. The height is roughly the same.

By the full pressurization, the substantially rectangular adhesive 3 is supplied to the rectangular display region D, and the substantially arc-shaped corner portion 3a1 formed at the four corners of the outer edge portion 3a faces the corner portion D2 of the display region D, respectively. The substantially straight side portion 3a2 formed on the four sides of the outer edge portion 3a is diffused in the θ direction toward the side portion D3 of the display region D in the XY direction. Thereby, as shown in FIG. 1(e), the corner portion 3a1 of the outer edge portion 3a extends over the corner portion D2 of the display region D, and the side portion 3a2 of the outer edge portion 3a extends over the side portion D3 of the display region D.

Further, in place of the above-described overall pressurization in the bonding step or in addition to the full pressurization, the flattening step is performed, that is, the predetermined time is left in a state in which the first substrate 1 and the second substrate 2 are overlapped, and the adhesive 3 is externally disposed. It is preferable that the specific portion 3a' in the edge portion 3a is naturally stretched along the opposing faces 1a, 2a. Thereby, the corner portion 3a1 or the side portion 3a2 of the specific portion 3a' which is not semi-cured in the outer edge portion 3a of the adhesive 3 faces the corner portion D2 or the side portion which becomes the unfilled region D1 in the display region D. D3 naturally flows, thereby expanding the stretch throughout the entire display area D.

Further, as a modification of the bonding step, as shown in FIG. 3, the first substrate 1 or the second substrate 2 may be overlapped in place of the above-described overall pressurization or placement, or in addition to full pressurization or placement. In either or both of the portions, the portion P of the outer edge portion 3a of the adhesive 3 facing the specific portion 3a' is locally pressurized to be brought close to each other so that the specific portion 3a' extends toward the unfilled region D1.

In the example shown in Fig. 3, the portion P of the second substrate 2 opposed to the corner portion 3a1 of the outer edge portion 3a is partially pressed into a circular shape by a pressurizing device (not shown), and is not semi-cured. The corner portion 3a1 of the specific portion 3a' of the state is forcibly extruded toward the corner portion D2 which becomes the display region D of the unfilled region D1. Further, when the partial pressurization is performed in addition to the above-described full pressurization or placement, the corner portion 3a1 of the specific portion 3a' which is not in the semi-hardened state can be accelerated toward the corner portion D2 which becomes the display region D of the unfilled region D1. stretch.

Further, although not shown in the drawings, the vicinity of the portion P opposed to the corner portion 3a1 may be locally pressed in a shape other than the circular shape, or the partial portion 3a1 may be partially pressed against the side portion 3a2 instead of the corner portion 3a1. The portions respectively promote the stretching of the side portion 3a2 of the specific portion 3a' which is not in the semi-cured state toward the side portion D3 of the display region D.

Further, as a post-step of the bonding step, after confirming that the adhesive 3 is filled in the entire display region D, after the position where the bonding step is performed, or after being conveyed to a position different from the execution position of the bonding step, etc., the orientation includes the outer edge portion 3a. The entire adhesive portion 3 of the specific portion 3a' and the semi-cured portion 3b' is irradiated with light L such as ultraviolet rays or a heat line to form a solidified portion. It is better.

As a result, the viscosity of the entire adhesive 3 is further increased, and the adhesive state is completely deformed, so that the first substrate 1 and the second substrate 2 are sandwiched between the first substrate 1 and the second substrate 2 with a uniform filling film thickness (gap). A bonding apparatus A that adheres in the form of an adhesive 3 in a cured state.

According to the manufacturing method of the bonding apparatus A of the embodiment of the present invention, in the supply step shown in FIG. 1( a ), either or both of the first substrate 1 or the second substrate 2 are disposed. After the supply of the adhesive 3 in the display region D, in the semi-curing step shown in FIGS. 1(b) and 2(a), the viscosity is higher than that of the other portions while maintaining the adhesiveness in the adhesive state. In this manner, the filling portion 3b of the specific portion 3a' is partially semi-cured in the outer edge portion 3a of the supplied adhesive 3. Thereafter, in the bonding step shown in FIGS. 1(c) and 1(d), the first substrate is superimposed so as to sandwich the entire adhesive portion 3 including the specific portion 3a' of the outer edge portion 3a and the semi-cured portion 3b'. 1 and the second substrate 2. As a result, as shown in FIG. 1(e), the specific portion 3a' of the outer edge portion 3a of the adhesive 3 which is not semi-cured is formed by capillary phenomenon or natural between the first substrate 1 and the second substrate 2. The flow or the pressurized flow or the like spreads and spreads toward the unfilled region D1 outside the outer edge portion 3a of the adhesive 3, and spreads over the entire display region D.

Thereby, the extension of the outer edge portion 3a of the adhesive 3 sandwiched between the first substrate 1 and the second substrate 2 can be controlled, and the entire display region D can be coated with the adhesive 3.

As a result, even when there is no sufficient margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, the adhesive 3 can be prevented from being applied to the first substrate 1 and the second substrate 2 The external overflow can provide a method of manufacturing the bonding apparatus A which is excellent in the formability of the adhesive 3 and excellent in productivity.

Further, even when the film thickness (thickness dimension) of the adhesive 3 is made thicker than the bonding apparatus A of the film thickness of the adhesive in a general LCD or LCM or the like, the adhesive 3 can be prevented from being applied to the first substrate 1 and Since the external portion of the second substrate 2 overflows and is filled, the correspondence is relatively easy.

In particular, in the bonding step, either or both of the first substrate 1 and the second substrate 2 are pressed, and the opposing surface 1a of the first substrate 1 and the second substrate 2 is adhered to the surface 3c of the adhesive 3, In either case of 2a, the unevenness generated on the surface 3c of the adhesive 3 is deformed to be smooth and adhered.

Thereby, it is possible to further reduce the residual of the bubbles when the substrates 1 and 2 are bonded to each other.

Thereby, the quality of the bubble-free quality can be improved, and the warpage of the substrates 1 and 2 can be corrected, and the yield can be greatly improved.

Further, in the bonding step, the opposing faces 1a, 2a are brought close to each other such that the specific portion 3a' of the outer edge portion 3a of the adhesive 3 is diffused along the opposing faces 1a, 2a, and the outer edge of the adhesive 3 The specific portion 3a' which is not semi-cured in the portion 3a flows toward the unfilled region D1 outside the outer edge portion 3a of the adhesive 3 due to the capillary phenomenon occurring between the first substrate 1 and the second substrate 2 The extension is extended to spread over the entire display area D.

Thereby, the entire display region D can be reliably coated with the adhesive 3.

As a result, the adhesiveness of the adhesive 3 is further improved, the yield is greatly improved, and productivity can be further improved.

After the bonding step, the predetermined time is left in a state in which the first substrate 1 and the second substrate 2 are overlapped, so that the specific portion 3a' of the outer edge portion 3a of the adhesive 3 is along the opposing faces 1a, 2a. In the step of naturally stretching, the specific portion 3a' of the outer edge portion 3a of the adhesive 3 that is not semi-cured is naturally flowed toward the unfilled region D1 outside the outer edge portion 3a of the adhesive 3, thereby expanding the stretch. It extends throughout the entire display area D. At the same time, the partial vacuum or the like in the adhesive 3 disappears, and the adhesive 3 is substantially static and stable. The layer thickness of the adhesive 3 is applied to the opposing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 as a whole. The Z direction is substantially uniform, and it is in a state where no additional gap adjustment is required.

Thereby, the entire display region D can be naturally coated with the adhesive 3, and the first substrate 1 and the second substrate 2 can be attached in a completely bubble-free state with a uniform gap.

As a result, the production equipment is not complicated, and the cost is reduced, and Improve bubble-free performance.

In the bonding step, the portion P of the outer edge portion 3a of the partial pressure adhesive 3 facing the specific portion 3a' is made to be partially or both of the first substrate 1 or the second substrate 2 which are overlapped. When the specific portion 3a' is extended toward the unfilled region D1, the specific portion 3a' which is not semi-cured in the outer edge portion 3a of the adhesive 3 is oriented further outward than the outer edge portion 3a of the adhesive 3. The unfilled area D1 is forced to flow and flow, thereby expanding the stretch throughout the entire display area D.

Thereby, the entire display region D can be smoothly coated with the adhesive 3.

As a result, the adhesiveness of the adhesive 3 is further improved, the yield is greatly improved, and productivity can be further improved.

Further, when partial pressurization is performed in addition to the above-described full pressurization or placement, the stretching of the specific portion 3a' toward the unfilled state of the unfilled region D1 is promoted.

Thereby, the time in which the entire display region D is filled with the adhesive 3 can be shortened.

As a result, productivity can be improved.

Next, an embodiment of the present invention will be described based on the drawings.

[Example 1]

Next, each embodiment of the present invention will be described based on the drawings.

As shown in FIGS. 1 to 4, in the first embodiment, in the supply step, the adhesive 3 is supplied in a substantially rectangular shape along the inner side of the boundary line of the rectangular display region D, and in the semi-curing step, the pair is continued. The specific portion 3a' of the outer edge portion 3a of the agent 3 is semi-cured except for the entire filling portion 3b of the corner portion 3a1. In the bonding step, the corner portion 3a1 which becomes the specific portion 3a' is made to be unfilled in the display region D. The corner D2 of D1 is stretched.

The bonding apparatus A of the first embodiment indicates a case where there is no sufficient electronic component in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, for example, an LCD or an LCM.

In the example shown in Fig. 4(a), the corner portion 3a1 which becomes the specific portion 3a' is only supplied. The outer edge portion 3a of the substantially rectangular adhesive 3 is formed at a portion where the four corners are a quarter circle.

In the example of the drawing, the light shielding portion 4a (4a1) of the mask 4 is rectangular and covers only a portion which is a quarter circle. However, the light shielding portion 4a can be provided as long as it can cover a portion which is a quarter circle. Change to other shapes such as triangles.

In the example shown in Fig. 4(b), the corner portion 3a1 which is the specific portion 3a' is a portion which is a quarter circle of the four corners of the outer edge portion 3a of the adhesive 3 having a substantially rectangular shape, and along with One or both of the arcs 3R continuous with the predetermined length 3L are continuously formed as portions of the rectangular side portions 3a3 adjacent to the XY direction.

In the example of the drawing, the rectangular light-shielding portion 4a2 larger than the light-shielding portion shown in Fig. 4(a) covers the portion which is a quarter circle and the L-shaped side portion 3a3, but it is covered as long as it can be covered. A light-shielding portion 4a having another shape such as a triangle can be used as the round portion and the side portion 3a3 along at least one side 3L.

In the example shown in Fig. 4(c), the corner portion 3a1 which is the specific portion 3a' is a portion which is a quarter circle of the four corners of the outer edge portion 3a of the adhesive 3 having a substantially rectangular shape, and The boundary between the circular arc 3R and the side 3L is continuously formed adjacent to the filling portion 3b in the XY direction so as to be adjacent to the portion 3a4.

In the example of the drawing, the light-shielding portion 4a3 having a shape in which the rectangle and the trapezoid partially overlap each other covers the portion which is a quarter circle and the adjacent portion 3a4. However, as long as it can cover the corner portion 3a1 and the adjacent portion 3a4 which are a quarter circle, Then, it is possible to use a light-shielding portion 4a having a rectangular shape instead of a triangle or a trapezoidal shape instead of a circular shape.

According to the method of manufacturing the bonding apparatus A of the first embodiment of the present invention, the first substrate 1 and the second substrate 2 are stacked, and the specific portion 3a which is not semi-cured is supplied into the adhesive 3 having a substantially rectangular shape. The corner portion 3a1 expands and contracts toward the corner portion D2 which becomes the unfilled region D1 in the rectangular display region D due to a capillary phenomenon or a natural flow or a pressurized flow generated between the first substrate 1 and the second substrate 2, respectively. Thus extending to the corner of the unfilled area D1 D2.

Thereby, the corner portion D2 of the display region D can be reliably coated with the adhesive 3.

As a result, even when the bonding apparatus A is, for example, an LCD or an LCM, there is no sufficient margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, and the adhesive can be prevented. (3) The outer surface of the first substrate 1 and the second substrate 2 overflows, and the adhesiveness of the adhesive 3 is further improved, the yield is greatly improved, and productivity is further improved.

Further, in the case of the example shown in Fig. 4(b), the area of the specific portion 3a' which is not semi-cured is increased only in correspondence with the side portion 3a3 as compared with the example shown in Fig. 4(a). Since the amount of stretching of the adhesive 3 is increased by this amount, the corner portion D2 of the display region D can be more reliably coated by the adhesive 3. Thereby, it is possible to prevent the adhesive 3 required for stretching from being insufficient and the corner portion D2 of the display region D to be thinner than the other filling portions 3b.

Further, in the case of the example shown in Fig. 4(c), the area of the specific portion 3a' which is not semi-cured is increased only in correspondence with the adjacent portion 3a4 as compared with the example shown in Fig. 4(a). The amount of the adhesive 3 is increased by the flow rate of the adhesive 3, and since the side 3L adjacent to the quarter circle is temporarily cured as compared with the example shown in Fig. 4(b), the adhesive 3 can be prevented from the side 3L. The phenomenon of overflowing into the unfilled region D1 can simultaneously coat the corner portion D2 of the display region D more reliably with the adhesive 3. Thereby, it is possible to prevent the adhesive 3 required for stretching from being insufficient and the corner portion D2 of the display region D to be thinner than the other filling portions 3b.

[Embodiment 2]

As shown in FIGS. 5 and 6, in the second embodiment, in the supply step, the adhesive 3 is supplied along the inner side of the boundary line of the rectangular display region D, and in the semi-curing step, the outer portion 3 is used as the adhesive 3 The specific portion 3a' of the edge portion 3a at least excludes the filling portion 3b of the side portion 3a2 from being semi-cured, and in the bonding step, at least the side portion 3a2 which becomes the specific portion 3a' faces the unfilled region D4 outside the display region D. The joint space S between the outer edge portions 1b and 2b of the first substrate 1 and the second substrate 2 is stretched, and this configuration and the first embodiment shown in Figs. 1 to 4 are shown. The configuration other than this is the same as that of the first embodiment shown in Figs. 1 to 4 .

The bonding apparatus A of the second embodiment shows a case where, for example, an LCM has a marginal electronic component from the rectangular display region D to the blank portion of the outer edges of the first substrate 1 and the second substrate 2, for example.

In the examples shown in FIGS. 5 and 6, the first substrate 1 has a frame-shaped protective frame 11, and a plurality of components are stacked in the Z direction and supported by the protective frame 11, thereby being integrated. In the first substrate 1 of the example, the image display unit 12 on the front side and the backlight unit 13 on the back side are assembled and fixed by a metal protective frame 11.

In the mask 4 used in the semi-curing step, the transparent plate 4d to which the frame-shaped light shielding portion 4c smaller than the protective frame 11 is fixed is used, and the four side portions of the outer edge portion 3a of the substantially rectangular adhesive 3 are covered with the light shielding portion 4c. The portion of the 3a2 and the four corners is a quarter circle and is partially semi-cured so as to be continuous in a frame shape over the entire circumference of the outer edge portion 3a. That is, the "specific portion 3a' in the outer edge portion 3a of the adhesive 3" which is semi-cured by the semi-curing step is the entirety including the portion which becomes a quarter circle and the outer edge portion 3a of the side portion 3a2. The situation of the week.

Further, although not shown in the drawings, a protective frame 11 formed of another material may be used instead of the metal protective frame 11, or a protective frame having a through hole may be formed using a transparent portion other than the frame-shaped light shielding portion 4c, or Instead of the light L such as ultraviolet rays, the heat source or the like is irradiated with a heat source to semi-cure, or the first substrate 1 is replaced with a substrate having no frame-shaped protective frame 11.

According to the method of manufacturing the bonding apparatus A of the second embodiment of the present invention, by overlapping the first substrate 1 and the second substrate 2, a specific portion which is not semi-cured is formed in the joint space S which is supplied in a substantially rectangular shape. At least the side portion 3a2 of 3a' is caused by a capillary phenomenon or a natural flow or a pressurized flow generated between the first substrate 1 and the second substrate 2, and is directed toward the first substrate 1 which becomes the unfilled region D4 outside the rectangular display region D. The joint space S between the outer edge portions 1b and 2b of the second substrate 2 is extended and extended to extend into the joint space S.

Thereby, the first substrate 1 and the second substrate 2 can be reliably coated with the adhesive 3 to The vicinity of the outer edge portions 1b and 2b.

As a result, when the bonding apparatus A is a LCM or the like, and there is a margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, the first one can be improved. The bonding strength between the substrate 1 and the second substrate 2.

In particular, in the case of the examples shown in FIGS. 5 and 6, the adhesion strength between the protective frame 11 of the first substrate 1 and the second substrate 2 can be improved.

Further, when the first substrate 1 is an electronic component in which a plurality of components are stacked in the Z direction and supported by the protective frame 11, the liquid penetrates from the gap between the protective frame 11 and the image display unit 12 on the front side. However, the internal electronic circuit is damaged and becomes a cause of failure, and thus an adhesive such as an infiltration agent from the gap cannot be used. However, by using the adhesive 3 having a high viscosity such as an ultraviolet curable adhesive, it is possible to prevent a failure caused by penetration of the gap between the protective frame 11 and the image display unit 12 on the front side into the inside.

In the above-described embodiment, the bonding method of the first substrate 1 and the second substrate 2 in the bonding step is not described in detail. However, the first substrate of the first substrate 1 is detachably held or detachably held. One of the second stages of the second substrate 2 or the first stage and the second stage are provided with a buffer material, and the first substrate 1 and the second substrate 2 are ensured regardless of the parallelism of the first stage and the second stage. Parallelism is preferred.

Further, in the above-described embodiment, the entire filling portion 3b other than the specific portion 3a' of the outer edge portion 3a of the adhesive 3 is semi-cured, but the present invention is not limited thereto, and only the specific portion 3a of the outer edge portion 3a is excluded. ', semi-curing can be performed in a state in which a part of the center side of the filling portion 3b is partially excluded.

1‧‧‧1st substrate

1a‧‧‧ opposite surface of the first substrate

2‧‧‧2nd substrate

2a‧‧‧ opposite surface of the second substrate

3‧‧‧Binder

3a‧‧‧The outer edge

3b‧‧‧filling parts

3a'‧‧‧Specific parts

3b'‧‧‧ semi-cured parts

3a1‧‧ corner section

3a2‧‧‧ side section

4‧‧‧ mask

4a‧‧‧Lighting Department

4b‧‧‧Transparent board

5‧‧‧Light source

A‧‧‧Fitting equipment

D‧‧‧ display area

D1‧‧‧Unfilled area

D2‧‧‧ corner

D3‧‧‧Edge

Claims (6)

A method of manufacturing a bonding apparatus in which a first substrate and a second substrate are bonded to each other with a liquid adhesive interposed therebetween, and a display region having a predetermined shape is formed at a predetermined position. The present invention includes a supply step of supplying the adhesive to one of the first substrate or the second substrate or both the first substrate and the second substrate so as to be disposed in the display region; a semi-curing step of semi-curing a filling portion other than a specific portion in the excluded edge portion of the adhesive agent in such a manner that the viscosity becomes higher than the viscosity of the other portion while maintaining the adhesiveness; and a bonding step The first substrate and the second substrate are overlapped with each other between the opposing surfaces of the second substrate; and in the supplying step, the external shape of the display region is partially formed by the adhesive The filling portion other than the specific portion of the outer edge portion is supplied to the adhesive along the outer shape of the boundary line of the display region, and the half In the step of forming, the entire adhesive portion is partially semi-cured except for the specific portion formed on the outer edge portion, and the first substrate and the second substrate are overlapped in the bonding step. The specific portion of the outer edge portion of the adhesive that is not semi-cured in the semi-curing step extends toward the unfilled region of the adhesive disposed outside the outer edge portion of the adhesive. The method of manufacturing a bonding apparatus according to claim 1, wherein in the bonding step, either or both of the first substrate or the second substrate are subjected to full pressurization, thereby making the first substrate and the second substrate Any one of the aforementioned opposing faces adheres to the front The surface of the adhesive is disposed such that the opposing surfaces approach each other such that the specific portion of the outer edge portion of the adhesive is pushed along the opposing surface. The method of manufacturing a bonding apparatus according to claim 1, wherein the bonding step includes a step of placing the first substrate and the second substrate in a state of being placed for a predetermined period of time to form the outer edge portion of the adhesive The aforementioned specific portion naturally extends along the aforementioned opposing surface. The method of manufacturing a bonding apparatus according to claim 1, wherein in the bonding step, one or both of the first substrate or the second substrate that are overlapped are in the outer edge portion of the adhesive; The portion facing the specific portion is locally pressurized so that both of them approach each other such that the specific portion extends toward the unfilled region. The method of manufacturing a bonding apparatus according to any one of claims 1 to 4, wherein, in the supplying step, the adhesive is supplied along an inner side of a boundary line of the rectangular display region, and in the semi-curing step, the adhesive is applied The filling portion is semi-cured except for the corner portion of the specific portion in the outer edge portion, and in the bonding step, the corner portion that is the specific portion is oriented toward the corner portion of the unfilled region in the display region. stretch. The method of manufacturing a bonding apparatus according to any one of claims 1 to 4, wherein, in the supplying step, the adhesive is supplied along an inner side of a boundary line of the rectangular display region, and in the semi-curing step, the adhesive is applied And a filling portion other than at least a side portion of the specific portion in the outer edge portion is semi-cured, and in the bonding step, at least the side portion that is the specific portion faces the unfilled region outside the display region The joint space between the first substrate and the outer edge portion of the second substrate extends.