TW201351575A - Bonding method and bonding device for substrate - Google Patents

Abstract

An object of the present invention is to suppress the condition of introducing bubble when applying adhesive, through applying adhesive 3 electrically connected to ground on a bonding surface 1a of a ionized substrate 1, for generating the coulomb force between the adhesive 3 and the substrate 1 (to form a status of the adhesive 3 and the substrate 1 mutually attracted by potential difference), so as to continuously diffuse and apply the adhesive 3.

Description

Substrate bonding method and bonding device

The present invention relates to a bonding method and a bonding apparatus for a substrate used when a plurality of substrates are bonded together.

The mounting structure of the see-through touch sensing key panel described in the following Patent Document 1 is to provide a transparent adhesive layer on one surface of the touch panel, and the touch panel is followed by the transparent adhesive layer to the liquid crystal display element. In this way, the light reflection and the interference color on the surface of the display are eliminated, thereby improving the quality of the display (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 61-131314

In the manufacture of the touch-sensitive sensing key panel of the above prior art, a photo-curable adhesive is used instead of the transparent adhesive layer to apply an adhesive to the joint surface of the touch panel or the liquid crystal display element. When the adhesive is applied to the adhesive, if bubbles are formed in the adhesive on the bonding surface, a state in which bubbles are mixed after the touch panel or the liquid crystal display element is bonded is formed. Therefore, there is a problem that the quality of the touch panel and the liquid crystal display element that have been bonded is impaired. As a factor which generate|occur|produces a bubble at the time of application of an adhesive agent, the thing which apply|coated the adhesive agent on the joint surface, and a spherical shape are mentioned.

The present invention is an example of a problem in response to such a problem. That is, the object of the present invention It is to suppress the case where air bubbles are mixed during application of the adhesive agent.

In order to achieve such an object, the present invention has at least the following constitution.

A method for bonding a substrate, comprising: bonding a plurality of substrates, and comprising the steps of: applying an adhesive to one of the plurality of substrates; and applying an adhesive; And an overlapping step of overlapping the plurality of substrates via the adhesive; and the applying step of the adhesive includes applying the adhesive directly or electrically connected to another member to the one bonded by ionization Steps on the surface.

A bonding device characterized in that a plurality of substrates are bonded together, and includes: an ionization device that ionizes one of the plurality of substrates; and an adhesive coating device, wherein the one is An adhesive is applied to the bonding surface of the substrate; and the substrate overlapping device includes a first holding portion that holds the one substrate at a specific position and a second holding portion that holds the other substrate at a specific position; The above-mentioned adhesive is electrically grounded directly or via other members.

1‧‧‧substrate (one substrate)

1a‧‧‧ joint surface

2‧‧‧Substrate (another substrate)

2A, 2B‧‧‧Installation parts

2C‧‧‧ gap

2a‧‧‧ joint surface of another substrate

2b‧‧‧ corner

2c‧‧‧Intermediate

3‧‧‧Binder

3a‧‧‧1st adhesive

3b‧‧‧2nd adhesive

3c‧‧‧ outside side

3s‧‧‧ gap

10‧‧‧Binder coating device

11‧‧‧Ionization unit

11a‧‧‧Blowing out

12‧‧‧ Frame Department

13‧‧‧Support table

14‧‧‧Battery spray device

15‧‧‧ Storage Department

20‧‧‧Substrate overlap device

21‧‧‧1st Maintenance Department

21a‧‧‧ Keep face

22‧‧‧2nd Maintenance Department

23‧‧‧ Drive Department

24‧‧‧ Drive Department

25‧‧‧Mobile agencies

26‧‧‧ Positioning agency

27‧‧‧Support

28‧‧‧Base

30‧‧‧Binder hardening device

30a‧‧‧shell

30b‧‧‧ side

31‧‧‧ spray holes

31a‧‧‧Pipe

31b‧‧‧Flow adjustment valve

32, 32a‧‧‧ suction holes

32b‧‧‧Pipe

32c‧‧‧Flow adjustment valve

33‧‧‧Outlet

33a‧‧‧Fiber

40‧‧‧ Keeping institutions

A‧‧‧Fitting device

G‧‧‧Inert gas

L‧‧‧Light

T‧‧‧Transporting device

U1‧‧‧Unit 1

U1a‧‧‧ moving in

U2‧‧‧Unit 2

U2a‧‧‧ moving in

U3‧‧‧Unit 3

U4‧‧‧Unit 4

U5‧‧‧Unit 5

X, Y, Z‧‧ Direction

Fig. 1 is an explanatory view (plan view) showing an overall structure of a bonding method of a substrate and a bonding apparatus according to an embodiment of the present invention.

Figure 2 is a partial front elevational view showing the overlapping step.

Fig. 3 is an explanatory view showing a step of applying an adhesive, (a) is a partial front view at the time of ionization, and (b) is a partial front view when the adhesive is applied.

Fig. 4 is an explanatory view showing a step of aging the adhesive, wherein (a) is a partially enlarged cross-sectional plan view of the whole, and (b) is a front view thereof.

Fig. 5 is an explanatory view showing a step of curing an adhesive agent, wherein (a) is a partial cross-sectional plan view at the time of inert gas injection and air suction, and (b) is a perspective view of the adhesive curing device.

Fig. 6 is an explanatory view showing the intensity of light.

Fig. 7 is an explanatory view showing a modification of the mounting member.

Fig. 8 is an explanatory view showing a specific example of a bonding apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Embodiments of the present invention include the contents of the drawings, but are not limited thereto. Fig. 1 is an explanatory view showing a method of bonding a substrate according to an embodiment of the present invention and a bonding apparatus A used in the practice of the method, and Fig. 1 is a plan view showing the whole. Figure 2 shows a partial front view of the overlapping step. In the method of bonding a substrate according to the embodiment of the present invention, the main configuration includes applying an adhesive of the adhesive 3 in a specific shape on one of the plurality of substrates 1 and 2 facing each other. The coating step and the overlapping step of overlapping the plurality of substrates 1 and 2 via the adhesive 3 .

For example, a deformable substrate including a resin film or the like, a glass substrate used in a liquid crystal panel or a liquid crystal panel module, or the like used in a touch panel or the like can be used as the substrate 1 and 2 which are opposed to each other. The plurality of substrates 1 and 2 have a shape in which one of them is larger than the other, and each of the planar shapes is formed in, for example, a rectangular shape. In the case of the example shown in FIG. 1(a), the larger rectangular touch panel is used as a substrate 1 and is sequentially coated from the supply source (not shown) to the adhesive of the bonding device A. The device 10 supplies a small rectangular liquid crystal panel as the other substrate 2, and is supplied from the supply source (not shown) to the substrate stacking device 20 of the bonding apparatus A in order.

As the adhesive 3, a photocurable adhesive or the like can be used. The photocurable adhesive is cured by exposure to light such as ultraviolet rays or infrared rays. In the adhesive application step, the adhesive 3 is ejected to the bonding surface 1a of the substrate 1 by the adhesive application device 10, and is applied in a specific shape.

[Binder Coating Step] FIG. 3 is an explanatory view showing an adhesive application step in the method of bonding a substrate according to the embodiment of the present invention. In this example, FIG. 3(a) is a partial front view of the bonding surface 1a of a substrate 1 before the application of the adhesive 3, and FIG. 3(b) is attached to FIG. A partial front view of the adhesive 3 after ionization. That is, in the adhesive application step, the adhesive 3 which is electrically or directly grounded via another member is applied onto the bonding surface 1a of one of the ionized substrates 1.

As a method of forming the ionized bonding surface of the bonding surface 1 a of the substrate 1 (ionization step), as shown in FIG. 3( a ), as the adhesive application device 10 , an ionizable device capable of blowing ions can be used. 11. The ionization apparatus 11 is, for example, an ionizer or the like, and has an air outlet 11a that is positively ionized or negatively ionized. The air outlet 11a is formed, for example, longer than one side of the substrate 1. First, the air outlet 11a is opposed to the joint surface 1a of one substrate 1 (the joint surface on which the adhesive 3 is applied). Next, the air outlet 11a is relatively moved with respect to the substrate 1, whereby the positively ionized or negatively ionized air is blown over the entire joint surface 1a of the substrate 1. At this time, the frame portion 12 surrounding the outer peripheral portion of the substrate 1 is provided. The frame portion 12 retains ions inside the frame portion A1. The frame portion 12 is provided on the upper surface of the support table 13 such as the platen on which the substrate 1 is placed so as to surround the outer peripheral portion of the substrate 1, so that the positive ions or negative ions are blown off with respect to the bonding surface 1a of the substrate 1. On the joint surface 1a.

Further, in the example shown in FIG. 3(a), the air outlet 11a of the ionization device 11 is formed to be longer than one side of the substrate 1. Further, by moving the air outlet 11a in the direction along the other side of the substrate 1 fixed at a specific position, the positive ionized air is blown over the entire joint surface 1a of the substrate 1. A substrate 1 can also be fixed without being movably. Further, as another example, although not shown, the joint surface 1a of one substrate 1 is moved relative to the air outlet 11a of the ionization device 11 fixed at a specific position, and the relative position is made. Or changing the relative position of the air outlet 11a of the ionization device 11 and the substrate 1 together; or blowing the negative ionized air from the air outlet 11a of the ionization device 11; or to the other substrate 2 The joint surface 1a of the joint surface 2a and the substrate 1 is blown through the different ionized air, and a potential difference or the like occurs between the other substrate 2 and the substrate 1. Further, in the example of FIG. 3(a), the ionized air is blown onto the joint surface 1a of the substrate 1, but the invention is not limited thereto. For example, a hole portion may be formed in the frame portion 3, The hole portion as the air outlet is sprayed with ionized air toward the inside of the frame portion 3, whereby the joint surface 1a of the substrate 1 is ionized.

As a method of applying the third agent 3, as shown in Fig. 3(b), an adhesive discharge device 14 such as a dispenser can be used. The subsequent drug ejection device 14 includes a storage portion 15 in which the adhesive 3 is stored, and the storage portion 15 is electrically grounded. As shown in FIG. 1(a), the coating shape of the adhesive 3 is provided in a plurality of lines with respect to the bonding surface 1a of the substrate 1. Between the plurality of adhesives 3, for example, a substrate 1 is provided. The inner side extends to the outside with a gap of 3 s. Further, the gap 3s is continuously formed between the plurality of adhesives 3 from one end to the other end of the adhesive 3. Among the plurality of adhesives 3, the first adhesive 3a is disposed along the axis of the substrate 1 (the axis in the longitudinal direction in the illustrated example), and the second adhesive 3b is from the first adhesive 3a. It is radially arranged on the outer side of one substrate 1. Further, one substrate 1 which completes the application of the adhesive 3 by the adhesive application device 10 is sequentially supplied to the substrate stacking device 20.

In the example shown in FIG. 1( a ), the first adhesive 3 a is disposed in the vicinity of the center along the axis of the longitudinal direction of the substrate 1 , and the second adhesive 3 b is divided into a plurality of units. The adhesive 3a is radially disposed outside the substrate 1. Further, as another example, although not shown, the size, number, and arrangement of the first adhesive 3a and the second adhesive 3b may be changed according to the size or shape of one substrate 1 and the other substrate 2.

The bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention apply an electrically grounded adhesive 3 to the bonding surface 1a of the substrate 1 to be ionized, whereby the adhesive 3 and the bonding agent 3 A Coulomb force is generated between the substrates 1 (a state in which the adhesive 3 and the substrate 1 are pulled to each other, or a state in which the adhesive 3 and the substrate 1 are pulled from each other by a potential difference), and the adhesive 3 is continuously applied continuously. By continuous application of the adhesive 3, it is possible to suppress the incorporation of air bubbles during the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be improved.

Further, when the frame portion 12 surrounding the substrate 1 is provided and the ionized air is ejected toward the inside of the frame portion 12 in the ionization step, the ions are retained on the substrate 1 by the frame portion 12. Therefore, the adhesive 3 can be continuously applied to a substrate. Thus, further It is suppressed in the case where bubbles are mixed in the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be further improved.

Further, when the frame portion 12 covering the outer peripheral portion of the substrate 1 is provided and the ions are blown (sprayed) toward the inside of the frame portion 12, the ions are retained on the substrate 1 by the frame portion 12, so that the ions are retained on the substrate 1 by the frame portion 12, The adhesive 3 can be continuously applied to a substrate. Therefore, it is possible to further suppress the incorporation of air bubbles during the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be further improved.

Further, the adhesive 3 applied to the bonding surface 1a of the substrate 1 is designed in a plurality of lines, and a gap 3s extending from the inner side of the substrate 1 to the outside is provided between the plurality of adhesives 3b. When one substrate 1 is overlapped with the other substrate 2, the adhesives 3a and 3b are diffused. The gap 3s between the plurality of adhesives 3b is blocked by the diffusion of the adhesive 3. However, while the gap 3s is blocked, air escapes to the outside of a substrate 1 through the gap 3s. Therefore, it is possible to suppress the incorporation of air bubbles when the adhesive 3 is overlapped. As a result, the quality of the bonded substrates 1 and 2 can be further improved.

As shown in FIG. 2, the substrate overlapping device 20 used in the overlapping step includes a first holding portion 21 that detachably holds one of the plurality of substrates 1 and 2 at a specific position. The holding portion 22 detachably holds the other substrate 2 at a specific position; the susceptor 28; and the support portion 27 movably support the first holding portion 21 and the second holding portion 22. The support portion 27 extends in a direction from one substrate 1 to the other substrate 2. The first holding portion 21 and the second holding portion 22 are movably provided at least in a direction in which they are relatively close to each other and in a direction in which they are separated. Here, one of the first holding portion 21 or the second holding portion 22 may be fixed, and the other one may be moved relative to one. Further, both the first holding portion 21 and the second holding portion 22 can be moved. In the overlapping step, one substrate 1 is held by the first holding portion 21, and the other substrate 2 is held by the second holding portion 22. On the substrate 1, the adhesive 3 is applied by an adhesive coating step. The bonding surface 2a of the other substrate 2 is relatively close to the substrate 1 and overlaps the bonding surface 1a of the substrate 1. At the time of the overlap, for example, The entire surfaces 1a and 2a are substantially parallel and uniformly pressurized on the entire joint surface. By this pressurization, the adhesive 3 is diffused from the center to the outer peripheral portion of the joint surface 1a of the substrate 1. Further, when overlapping, the joint surface 2a may be obliquely overlapped with respect to the joint surface 1a. Further, the pressure of the specific range can be set to be relatively large, and the adhesive 3 can be further diffused and overlapped. Specifically, when the bonding surface 1a of one substrate 1 overlaps with the bonding surface 2a of the other substrate 2, the first adhesive 3a and the second adhesive 3b are crushed and brought close to each other. When the first adhesive 3a and the second adhesive 3b are close to each other, the air located in the gap 3s is pushed out to the outside of the other substrate 2. The air is pushed out to the outside, and the first adhesive 3a and the second adhesive 3b are connected to each other and diffused to the outer peripheral portion of the smaller substrate 2 to form a layer of the adhesive 3 which is continuously formed.

In the example shown in FIG. 2, the position of the first holding portion 21 is fixed. First, the other substrate 2 held by the second holding portion 22 is brought closer to the substrate 1 held by the first holding portion 21 by the operation of the elevation driving portion 23 provided in the second holding portion 22. Next, the bonding surface 2a of the other substrate 2 is superposed on the bonding surface 1a on which the substrate 1 of one of the adhesives 3 is applied. Next, the entire joint surfaces 1a and 2a are uniformly parallelized while maintaining the entire joint surfaces 1a and 2a. Further, as another example, the substrate 1 held by the first holding portion 21 may be held by the second holding portion 22 by the operation of the elevation driving portion 23 provided in the first holding portion 21. The other substrate 2 on the top is close.

Moreover, the bonding method of the substrate according to the embodiment of the present invention may include an adhesive hardening step of curing the adhesive 3 located between the plurality of substrates 1 and 2 after the overlapping step. Further, between the overlapping step and the adhesive hardening step, a curing step of enlarging the contact areas of the plurality of substrates 1, 2 and the adhesive 3 may be included.

[Curing Step] FIG. 4 is an explanatory view showing a step of curing the adhesive 3 in the bonding method of the substrate according to the embodiment of the present invention, and FIG. 4(a) is a partially enlarged cross-sectional plan view of the whole, and FIG. 4(b) Represents its front view. The aging step of the subsequent agent 3 includes a substrate shifting step of displacing the relative positions of one substrate 1 and the other substrate 2. In the substrate shifting step, the substrate The direction of displacement of the relative positions of 1 and 2 may be, for example, a specific direction of rotation (theta direction) passing through the center of one substrate 1 or the other substrate 2 as a rotation axis, or along a substrate 1 and The linear direction (X direction or Y direction) of one side of the other substrate 2. Further, the relative positions of the substrates 1 and 2 may be displaced in the thickness direction of the substrates 1 and 2 as needed. Further, the center of the rotation direction is not limited to the center of the substrates 1 and 2, and any position may be the center as long as it is on the substrate. Further, the linear direction is included in the radial direction. The radial direction is, for example, a direction that is linearly or curved from a first position on the substrate toward a second position that is different from the first position. Therefore, in the rotation direction, a specific rotation direction including the position other than the center of the substrates 1 and 2 is included as the rotation axis. The radial direction includes a direction intersecting with respect to one side in addition to the linear direction. In the substrate stacking device 20, the first holding portion 21 and the second holding portion 22 are provided to be relatively movable in a direction such as the rotation direction or the linear direction. Further, the position of one of the first holding portion and the second holding portion may be fixed, and the other may be moved freely. One or both of the substrate 1 held by the first holding portion 21 and the other substrate 2 held by the second holding portion 22 may be rotationally moved in the θ direction or in the X direction or the Y direction. mobile. Further, while maintaining the state of the adhesive 3 after aging, the relative position of one of the substrates 1 and the other substrate 2 after the aging step can be restored to the relative position before the aging step (recovery step). Further, the substrate overlapping device 20 includes a driving portion 24 that shifts the relative positions of the substrates 1 and 2.

In the example shown in FIG. 4( a ), the position of the second holding portion 22 is fixed, and the moving mechanism 25 such as a guide rail or an XY stage and the driving unit 24 for horizontal movement are provided on the first holding portion 21 . In the operation, the first holding portion 21 holding the one substrate 1 is rotated in the θ direction or linearly moved in the X direction or the Y direction with respect to the other substrate 2 . Further, as another example, as shown in FIG. 4(b), the moving mechanism 25 and the driving unit 24 for horizontal movement may be provided in the second holding portion 22, and the operation portion 24 may be held by the operation. 2 The other substrate 2 on the holding portion 22 is rotated in the θ direction with respect to one of the substrates 1 held by the first holding portion 21, or linearly moved in the X direction or the Y direction; or in the first holding portion 21 And the second holding portion 22 The driving unit for horizontal movement is provided in each of the two, and the first holding unit 21 and the second holding unit 22 are rotationally moved in the θ direction or linearly moved in the X direction or the Y direction by the operation thereof. .

Further, the aging step of the adhesive 3 may include a placing step performed after the substrate shifting step of vertically supporting the other substrate 2 disposed above the plurality of substrates 1 and 2. The placing step holds the overlapped substrates 1 and 2 between the upper and lower (Z) directions and the specific positions in the XYθ direction intersecting with the vertical direction. The specific period of time is, for example, a period before the above-mentioned adhesive 3 is stabilized (for example, a state in which the shape of the adhesive 3 is stable). In order to perform the placing step, the substrate overlapping device 20 includes a positioning mechanism 26 that positions the overlapped substrates 1 and 2 at a specific position in the XYθ direction, and a control unit that releases the second holding portion 22 to the other substrate 2 Keep it. The control unit, for example, removes the other substrate 2 from the second holding portion 22 after the placing step, and releases the other substrate 2. Further, in the placing step, the first holding portion 21 can hold the substrate 1 and the second holding portion 22 can hold the other substrate 2, and the weight of the first holding portion 21 or the second holding portion 22 can be continued. The adhesive 3 is pressurized. Further, in the placing step, the second holding portion may be released from the other substrate 2, and the adhesive 3 may be pressurized by the weight of one substrate 1 or the other substrate 2.

In the example shown in FIGS. 4(a) and 4(b), as the positioning mechanism 26, a positioning guide that can adjust the position corresponding to each side of the other substrate 2 is shown. The positioning guide can be provided integrally or separately from the second holding portion 22. Further, the second holding portion 22 can support the other substrate 2 so as to be movable in the up-down (Z) direction along the inner surface of the positioning guide. Further, as another example, although not shown, the positioning guide 26 may be provided integrally with the second holding portion 22 as the positioning mechanism 26. Further, as the positioning mechanism 26, an alignment mark formed on the other substrate 2 can be recognized by a CCD (Charge Coupled Device) camera and positioned.

The bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention can be passed through The subsequent agent 3 superimposes the plurality of substrates 1 and 2, and then rotates or linearly moves one substrate 1 and the other substrate 2, thereby uniformizing the thickness of the adhesive 3 after the overlap, and making the adhesive 3 The degree of proliferation has expanded. Therefore, in the joint surface of the bonded substrates 1 and 2, the gradient (thickness unevenness) in the thickness of the adhesive 3 can be eliminated. Moreover, the film thickness of the adhesive 3 can be controlled, and the gap between the substrates 1 and 2 can be made uniform.

Particularly in the ripening step, there is a case where the adhesive 3 is to be restored to the shape before the ripening step by the surface tension or internal stress by the recovery step. However, the diffusion area of the adhesive 3 after the recovery step becomes larger than the diffusion area of the adhesive 3 before the ripening step. Therefore, the thickness of the adhesive 3 can be simply uniformized. As a result, the thickness unevenness of the bonded substrates 1 and 2 can be eliminated. Moreover, the film thickness of the adhesive 3 can be controlled, and the gap between the substrates 1 and 2 can be made uniform.

[Binder curing step] Fig. 5 is an explanatory view showing an adhesive curing step in the bonding method of the substrate according to the embodiment of the present invention, and Fig. 5 (a) is a partial cross-cutting at the time of inert gas injection and air suction. In plan view, FIG. 5(b) is a perspective view of the adhesive curing device 30. The subsequent hardening step includes a pressurizing step of expanding the adhesive 3 to the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2 via a substrate 1 or another substrate 2. Further, the adhesive curing step includes a light irradiation step of irradiating light L such as ultraviolet rays to the outer side surface 3c of the adhesive 3 located between the plurality of substrates 1 and 2. The direction in which the light L is emitted is arranged in a direction inclined with respect to the joint surface 1a of the substrate 1 facing the other substrate 2. In other words, the direction in which the light L is emitted is a direction in which the holding surface 21a of the first holding portion 21 of the substrate 1 is inclined with respect to the second holding portion 22 and held. Further, the adhesive hardening step includes a gas injection step of injecting the inert gas G to the outer side surface 3c of the adhesive 3, and an air suction step of sucking the air outside the adhesive 3.

In the pressurizing step in the adhesive hardening step, the same or different device as the substrate overlapping device 20 used in the above overlapping step can be used. Hereinafter, the case where the substrate overlapping device 20 is used in the pressurizing step will be described using FIG. 2 described above. Substrate pressing device and substrate weight Similarly, the stacking device 20 includes a first holding portion 21 that detachably holds one of the plurality of substrates 1 and 2 at a specific position, and a second holding portion 22 that detachably attaches the other substrate 2 The ground is kept at a specific location. The first holding portion 21 and the second holding portion 22 are provided to be movable at least in a direction in which they are relatively close to each other and in a direction in which they are separated. Here, one of the first holding portion 21 or the second holding portion 22 may be fixed, and the other one may move relative to one. Further, both the first holding portion 21 and the second holding portion 22 can be moved. In the pressurizing step, one substrate 1 is held by the first holding portion 21, and the other substrate 2 is held by the second holding portion 22. The bonding surface 1a of one substrate 1 is relatively close to the bonding surface 2a of the other substrate 2, and the adhesive 3 is pressurized to be expanded to the outer peripheral portion of one substrate 1 or the other substrate 2. In this pressurizing step, for example, the entire joint surfaces 1a and 2a are substantially parallel and uniformly pressurized on the entire joint surface. By this pressurization, the adhesive 3 is further diffused to the outer peripheral portion. At this time, the adhesive 3 reaches the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2.

The adhesive hardening device 30 of the bonding apparatus A used in the subsequent hardening step includes an ejection mechanism of the inert gas G and a suction mechanism. The inert gas G is ejected from the plurality of injection holes 31 in the ejection mechanism to the outer peripheral portion of the other substrate 2. The air on the outside of the subsequent agent 3 is sucked from the suction hole 32 in the suction mechanism. The plurality of injection holes 31 and the plurality of suction holes 32 are arranged side by side along the outer peripheral portion of the other substrate 2. The injection hole 31 may also be disposed between the plurality of suction holes 32. Specifically, the plurality of injection holes 31 are arranged in a relatively large manner so as to face the intermediate portion 2c between the two corner portions 2b of the other substrate 2. The plurality of suction holes 32 are disposed on the side of the corner portion 2b in a relatively large portion with respect to the central portion between the two corner portions 2b of the other substrate 2. Further, it is preferable that the suction mechanism 32 has the suction hole 32a disposed at a position facing the vicinity of the corner portion 2b of the other substrate 2.

The injection hole 31 is constituted by a pipe 31a connected to the injection mechanism. The flow rate adjustment valve 31b is connected to each of the pipes 31a on the upstream side of the plurality of injection holes 31, and the flow rate adjustment valve 31b is operated and controlled by a controller (not shown). The amount of injection of the inert gas G is adjusted. Suction holes 32, 32a are connected to the suction mechanism The connecting pipe 32b is constructed. The flow rate adjustment valve 32c is connected to each of the pipes 32b on the upstream side of the plurality of suction holes 32 and 32a, and the flow rate adjustment valve 32c is operated and controlled by a controller (not shown). The amount of injection of the inert gas G and the amount of suction of the suction holes 32, 32a can be individually adjusted.

Further, the adhesive agent curing device 30 includes a casing 30a and an exit port 33 for emitting light L of a light source (not shown) from the inside of the casing 30a. In the light irradiation step, the light L is irradiated from the exit port 33 to The outer side surface 3c of the adhesive 3 reaches the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2. The adhesive agent 3 irradiated with the light L hardens from the outer side surface 3c and becomes a temporarily hardened state, whereby the adhesive 3 becomes difficult to flow. The light L may be diffused light or light collected using a lens or the like. The timing at which the light L is irradiated can be arbitrarily set to be before or after the adhesive 3 reaches the outer peripheral portion of the other substrate 2. Further, the angle formed by the substrate (one substrate 1 or the other substrate 2) and the direction in which the light L is emitted can be arbitrarily determined.

When the adhesive 3 reaches the outer peripheral portion of the other substrate 2 at a time when the positions of the outer peripheral portions of the other substrate 2 are substantially the same, the angle is set to 0° or 90°, and the adhesive 3 reaches the other substrate. The light L is irradiated at the time point of the outer peripheral portion, whereby the adhesive 3 becomes more difficult to flow. When the time when the adhesive 3 reaches the outer peripheral portion of the other substrate 2 is different at each position of the outer peripheral portion of the other substrate 2, the light L may be irradiated before the adhesive 3 reaches the outer peripheral portion of the other substrate 2. In this case, when the adhesive 3 reaches the outer peripheral portion of the other substrate 2, the light L is irradiated onto the adhesive 3, so that the adhesive 3 becomes more difficult to flow. Further, when the angle L is set to 0° and the light L is irradiated at the time point when the adhesive 3 reaches the outer peripheral portion of the other substrate 2, the adhesive 3 that has not reached the outer peripheral portion of the other substrate 2 receives the light L. Since the irradiation 3 does not reach the outer peripheral portion of the other substrate 2, there is a case where the adhesive 3 cannot reach the outer peripheral portion of the other substrate 2. Further, when the angle is set to 90°, the adhesive 3 arrives at a faster position or a slower reach of the other substrate 2 at each position of the outer peripheral portion of the other substrate 2 in the circumferential direction. In the outer peripheral portion, there is a case where it is difficult to obtain the timing of the irradiation of the light L. Further, in the case where the thickness of the adhesive 3 is relatively large, the light on the adhesive 3 on the side of the substrate 1 in terms of the intensity of the light L The strength of L is relatively small with respect to the intensity of the light L on the adhesive on the other substrate 2 side, and there is a case where the fluidity of the adhesive cannot be sufficiently lowered.

Fig. 6 shows the relationship between the irradiation angle of the light L and the intensity of the light L when the adhesive 3 is different in each of the outer peripheral portions of the other in the circumferential direction. Light L is diffused light. As shown in FIG. 6, the light L has a specific strength in a region from the outer side surface 3c of the adhesive 3 toward the inner side by a specific distance X. In the case where the irradiation angle of the light L is set to about 30 to about 40 (an acute angle), the distance X becomes, for example, about 1 mm. By setting this angle, the intensity of the light L inside the adhesive 3 can be made relatively large, and the adhesive 3 becomes more difficult to flow. Moreover, the adhesive 3 can be temporarily hardened in the vicinity of the outer peripheral portion of the other substrate 2. Further, the irradiation angle of the light L can be appropriately changed depending on the thickness of the adhesive 3. The exit port 33 of the casing 30a is different from the position of the injection hole 31 of the injection mechanism or the suction hole 32 of the suction mechanism in the thickness direction of the adhesive 3, and is disposed above or below it. Specifically, the position of the injection hole 31 in the thickness direction of the adhesive 3 and the position of the suction hole 32 are disposed on the substrate 1 side with respect to the exit port 33. The position of the injection hole 31 and the position of the suction hole 32 are located between the position of the ejection opening 33 and the position of a substrate 1. The housing 30a includes a side surface 30b having an injection hole 31, a suction hole 32, and an exit port 33. The side surface 30b of the casing 30a is formed into a specific shape by a short axis and a long axis. Further, in the longitudinal direction of the side surface 30b, a relatively large number of injection holes 31 are disposed on the central portion side of the side surface 30b, and a relatively large number of suction holes 32 are disposed on the end side of the side surface 30b with respect to the injection hole 31. The exit port 33 is constituted by an optical fiber 33a connected to a light source.

In the example shown in FIG. 5(b), the exit opening 33 extends along the direction in which the plurality of injection holes 31 or the plurality of suction holes 32 are arranged. Further, the direction in which the plurality of injection holes 31 or the plurality of suction holes 32 are arranged is in a direction intersecting the direction from the ejection opening 33 toward the injection hole 31 or the suction hole 32. Further, as another example, although not shown, a plurality of the ejection openings 33 may be arranged side by side along the arrangement direction of the plurality of ejection holes 31 or the plurality of suction holes 32.

The bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention are mainly The photocurable adhesive 3 located between the plurality of substrates 1 and 2 is diffused from the center of the bonding surface 1a of one of the plurality of substrates 1 and 2 to the outer periphery, and is passed through a substrate in the adhesive hardening step. 1 or another substrate 2 pressurizes the adhesive 3 so that the adhesive 3 reaches the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2. By irradiating the light L to the outer side surface 3c of the adhesive 3 by the light irradiation step, the amount of overflow of the adhesive 3 overflowing from the outer peripheral portion of the substrate 1 or the outer peripheral portion of the substrate 2 can be minimized. Therefore, the overflow of the adhesive 3 from the outer peripheral portion of the substrate 1 or the outer peripheral portion of the substrate 2 can be made to have a specific width. As a result, the overflow of the adhesive from the outer peripheral portion of the touch panel or the liquid crystal display element can be suppressed, so that the problem of the positional deviation of other mounting components other than the liquid crystal display element disposed on the touch panel can be suppressed.

Fig. 7 is an explanatory view showing a modification of the mounting member. There is a case where the liquid crystal display element as the mounting component 2A is disposed adjacent to the mounting component 2B other than the liquid crystal display element. A gap 2C that is small with respect to the size of the mounting part 2A or the size of the other mounting part 2B is provided between the adjacent mounting part 2A and the other mounting part 2B. This gap 2C can also be set as needed. When the adhesive agent overflows from the substrate 2 or the substrate 1 on which the component is mounted, when the other mounting component 2B is disposed adjacent to the mounting component 2A, it is necessary to move the other mounting component 2B along the surface of the substrate 2 to overflow the adhesive. The amount. However, there is a case where the wiring of other mounting parts is brought into contact with the wiring formed on the substrate 2. If the amount of overflow of the adhesive is moved by other mounting parts, there is a case where the electrical contact becomes difficult. In addition, when the mounting component 2A and the other mounting component 2B are placed in the surface of the substrate 2, the other mounting component 2B is exposed from the substrate 2 by moving the adhesive amount of the other mounting component 2B. However, by suppressing the overflow of the adhesive as described above, for example, electrical contact can be performed, and the overflow of the adhesive from the mounted component can be suppressed. When the mounting part 2A has wiring, it can also make electrical contact similarly to other mounting parts 2B.

Moreover, in the above example, the bonding agent can use the wiring and mounting parts on the substrate 2. An electrically conductive adhesive that is electrically connected to the wiring of 2A and B. For example, by suppressing the overflow of the conductive adhesive from the mounting parts 2A and 2B, it is possible to suppress the electrical connection between the conductive adhesive overflowing from the wiring-attached mounting member 2A and the wiring of the other mounting component 2B.

In particular, when the outgoing direction of the light L is in a direction inclined with respect to the bonding surface 1a of the substrate 1 which is opposed to the other substrate 2 having a relatively large shape and has a relatively small shape, the light L may not be transmitted. The other substrate 2 is irradiated onto the adhesive 3 to temporarily cure the adhesive 3. As a result, the strength of the light L that reaches the adhesive 3 without passing through the glass substrate which causes scattering of the light L or the like can be maintained relatively large, and the adhesive 3 can be cured.

Further, in the case where the adhesive hardening step includes the air suction step of sucking the air on the outer side of the adhesive 3, the ambient gas on the outer side of the adhesive 3 is self-primed by the suction of the air on the outer side of the adhesive 3. The air is replaced by an inert gas G. Therefore, the hardening of the outer side surface 3c of the adhesive 3 can be more actively promoted.

Further, the adhesive 3 applied in the vicinity of the center of the joint surface 1a spreads from the center of the substrates 1 and 2 to the outer periphery as the substrates 1 and 2 overlap. However, even if the coating shape or viscosity of the adhesive 3 is carefully designed, there is a tendency that the outer side surface 3c of the adhesive 3 diffused from the center of the substrates 1 and 2 to the outer periphery reaches the substrates 1 and 2 relatively quickly. The outer peripheral portion faces the center portion of the side, but it takes a relatively long time until it reaches the vicinity of the corner portion 2b of the substrates 1 and 2. Therefore, for example, the thickness of the adhesive 3 in the vicinity of the central portion in the joint surface of the substrates 1 and 2 and the vicinity of the central portion of one of the substrates 1 and 2 is relatively large, and is near the corner portion 2b of the substrates 1 and 2. The thickness of the subsequent agent 3 is relatively small. In this case, there is a difference in the thickness of the adhesive 3 between the substrates 1 and 2, so that there is a problem that uneven coating occurs as a whole.

Therefore, in the adhesive hardening step, the adhesive 3 is hardened by the adhesive curing device 30. The adhesive hardening device 30 includes an injection mechanism of the inert gas G. The inert gas G is ejected from the plurality of injection holes 31 of the injection mechanism to the other substrate 2. Again, in plural When the above-described injection holes 31 are arranged side by side along the outer peripheral portion of the other substrate 2, the distribution of the diffusion state or thickness of the adhesive 3 is applied, and the diffusion of the adhesive 3 is relatively fast and the adhesive 3 is relatively thick. Further, the inert gas G is sprayed more, and the outer side surface 3c of the adhesive 3 in the thicker region is hardened relatively quickly, so that the outer side surface 3c of the adhesive 3 can be prevented from overflowing from the outer peripheral portion of the other substrate 2. That is, the hardening of the adhesive 3 can be more actively promoted to suppress the overflow of the adhesive 3.

Further, in the adhesive hardening step, the adhesive hardening device 30 includes a suction mechanism. The air on the outside of the subsequent agent 3 is sucked from a plurality of suction holes 32 of the suction mechanism. Further, when a plurality of suction holes 32 are arranged side by side along the outer peripheral portion of the other substrate 2, the diffusion of the adhesive 3 is relatively slow and the area of the adhesive 3 is relatively thin, so that the self-suction hole 32 is The suction is stronger, whereby the outer side surface 3c of the adhesive 3 in the thinner region is pulled toward the outer periphery of the other substrate 2. Therefore, the thickness of the adhesive 3 can be made uniform, and coating unevenness of the adhesive 3 can be suppressed.

Further, the other of the plurality of substrates 1 and 2 has a rectangular planar shape, and when the suction hole 32a of the suction mechanism is disposed at the corner portion 2b of the other substrate 2, the outer side of the adhesive 3 is provided. 3c is pulled toward the suction hole 32. Therefore, the adhesive 3 can be made to reach the corner portion 2b of the substrate 2. As a result, coating unevenness of the adhesive 3 can be suppressed.

Further, in the example shown in FIG. 1, after the hardening (temporary hardening) of the adhesive 3 is completed by the adhesive curing device 30, the bonded substrates 1, 2 are supplied to harden the entire adhesive 3 The formal hardening step (not shown). In the main hardening step, the entire surface of the adhesive 3 is irradiated with light through one of the substrates 1 and 2, and heated as necessary, whereby the adhesive 3 is cured.

[Specific Example of Bonding Apparatus] Fig. 8 is an explanatory view showing a specific example of the bonding apparatus A according to the embodiment of the present invention. The bonding apparatus A includes a first unit U1, a second unit U2, and a third unit U3. The conveying unit T for conveying the substrates 1 and 2 is provided between the first unit U1, the second unit U2, and the third unit U3. The first unit U1 has a supply for feeding from a supply source of a substrate 1. The inlet U1a into which the substrate 1 is carried. In the first unit U1, the adhesive application device 10 is provided to carry one of the substrates 1 toward the inlet U1a. The second unit U2 includes a carry-in port U2a for carrying in another substrate 2 loaded from a supply source of the other substrate 2, and includes a substrate stacking device 20. In other words, the second unit U2 includes the first holding unit 21 that holds one of the substrates 1 transported from the first unit U1 by the transport device T, and the second holding unit 22 that holds the other substrate carried in from the carry-in U2a. 2. The third unit U3 may include a holding mechanism 40 that holds the overlapped substrates 1, 2 at a specific position in the XYθ direction. Further, the fourth unit U4 may be included, and the fourth unit U4 includes an adhesive curing device 30 having a light irradiation device for curing (temporarily curing) the adhesive 3. Further, the fifth unit U5 may be included, and the fifth unit U5 includes an adhesive curing device (not shown) that irradiates light to the entire surface of the adhesive 3 to be completely cured. The holding mechanism 40 is constituted by a positioning guide that is the same as the positioning mechanism 26 and that can adjust the position corresponding to each side of the substrates 1 and 2, and is oriented from the second unit U2 toward the third unit U3. The conveying device T is configured to interlock with the movement of the third unit U3 toward the conveying device T of the fourth unit U4.

The embodiments of the present invention have been described in detail above with reference to the drawings. However, the specific configuration is not limited to the embodiments, and the design changes and the like within the scope of the gist of the present invention are also included in the present invention. The embodiments shown in the above figures can be combined with each other as long as the purpose, configuration, and the like are not particularly contradictory or problematic. Further, the description of each drawing may be an independent embodiment, and the embodiment of the present invention is not limited to the embodiment in which each drawing is combined.

1‧‧‧substrate (one substrate)

1a‧‧‧ joint surface

3‧‧‧Binder

10‧‧‧Binder coating device

11‧‧‧Ionization unit

11a‧‧‧Blowing out

12‧‧‧ Frame Department

13‧‧‧Support table

14‧‧‧Battery spray device

15‧‧‧ Storage Department

Claims (11)

A method for bonding a substrate, comprising: bonding a plurality of substrates, and comprising the steps of: applying an adhesive to one of the plurality of substrates; and applying an adhesive; And an overlapping step of overlapping the plurality of substrates via the adhesive; and the applying step of the adhesive includes applying the adhesive directly or electrically connected to another member to the ionized one of the bonding faces The steps above. The bonding method of the substrate of claim 1, wherein the adhesive coating step comprises an ionization step of ejecting the ionized air on the one bonding surface. The method of bonding a substrate according to claim 2, wherein a frame portion surrounding the substrate is provided, and the ionization step ejects the ionized air to the inside of the frame portion. The method of bonding a substrate according to claim 3, wherein the adhesive is provided in a plurality of lines on the bonding surface of the substrate, and between the plurality of adhesives, there is one end from the adhesive A continuous gap to the other end. The method of bonding a substrate according to claim 4, wherein among the plurality of adhesives, the first adhesive is disposed along an axis of the substrate, and the second adhesive is applied from the first adhesive The outer side of one of the substrates is radially arranged. The method of bonding a substrate according to claim 1, wherein the one substrate is a resin film, and the other substrate is made of a glass substrate. A bonding device characterized in that it is a plurality of substrates and is packaged An ionization device that ionizes one of the plurality of substrates; an adhesive coating device that applies an adhesive to the bonding surface of the substrate; and a substrate overlapping device that includes the one The first holding portion that holds the substrate at a specific position and the second holding portion that holds the other substrate at a specific position; the adhesive is electrically grounded directly or via another member. The bonding device of claim 7, comprising a storage portion for storing the above-mentioned adhesive, and the storage portion is electrically grounded. The bonding apparatus of claim 8, comprising a frame portion surrounding the one of the substrates, and blowing the ions toward the inside of the frame portion. The bonding apparatus of claim 9, wherein the plurality of the above-mentioned adhesives are linearly disposed on the bonding surface of the substrate, and between the plurality of adhesives, there is one end from the adhesive to another A continuous gap at one end. The bonding apparatus of claim 7, wherein the one substrate is a resin film, and the other substrate is made of a glass substrate.