JP3516632B2 - Method and apparatus for bonding optical disk substrates - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method and device for bonding optical disk substrates to form one optical disk substrate.

[0002]

2. Description of the Related Art As a conventional example, bonding of optical disk substrates will be described. In an optical disk bonding apparatus using a liquid adhesive, the adhesive layer after bonding does not have voids (air bubbles). It is important that various methods have been considered for this purpose, but all of these methods have voids with a diameter of 0.1 mm or more, minute voids with a diameter of 0.05 mm to 0.1 mm or less, or a mixture of these. Matched voids are formed between the optical disk substrates.

As a method capable of considerably improving such a conventional method, the present applicant has filed a patent application for the following invention (Japanese Patent Application No. 10-257530). The invention of this application will be described with reference to FIG. Of the two optical disk substrates A and B, the adhesive surface of the lower optical disk substrate A faces upward,
An annular adhesive liquid film Ta is formed there. On the bonding surface of the upper optical disk substrate B, a plurality of dot-shaped adhesive liquid films Tb are formed on a virtual circle having a diameter slightly larger than the diameter of the annular adhesive liquid film Ta. After that, the adhesive surfaces of the two optical disk substrates A and B are brought close to each other in a state of being opposed to each other, and the annular adhesive liquid film Ta and the dot-shaped adhesive liquid film Tb are brought into contact with each other to make the two adhesive substrates. Stack optical disk substrates A and B. Next, the two optical disk substrates A and B are spin-processed to spread the adhesive liquid film Ta and the adhesive liquid film Tb, and the excess adhesive is shaken off to form an adhesive layer having a uniform film thickness on the optical disk substrates A and B. Form between B.

That is, the top of the dot-shaped adhesive liquid film Tb on the imaginary circle on the surface of the upper optical disk substrate B is appropriately outside the annular adhesive liquid film Ta on the surface of the lower optical disk substrate A. By contacting with the liquid film, it is possible to prevent the generation of voids, especially minute voids, which occur at the moment when these liquid films contact each other, and when the contact portion spreads over the entire liquid film,
Since the air between the liquid films can be eliminated, the occurrence of voids at this time is reduced.

[0005]

However, even with such a method, it is extremely difficult to sufficiently reduce the contact area at the moment when the adhesive liquid film Ta and the adhesive liquid film Tb contact each other. Such voids cannot be eliminated, and voids may occur when the adhesive liquid film Ta or the adhesive liquid film Tb comes into contact with the optical disk substrate B or A of the other party.

Further, it is important to supply a liquid adhesive onto the surface of the lower optical disk substrate A or the upper optical disk substrate B from an adhesive supply nozzle (not shown) to form an adhesive liquid film.
Voids may be generated when forming a or the adhesive liquid film b, and it is necessary to prevent generation of voids when supplying a liquid adhesive to the optical disc substrate.

Therefore, according to the present invention, when a liquid adhesive is supplied to an optical disk substrate or the like, or when two optical disk substrates to which the adhesive is supplied are bonded, a void is substantially generated between them. It is an object of the present invention to provide an optical disk substrate bonding method and device that does not cause or hardly generates.

[0008]

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention according to claim 1 lays two optical disk substrates on top of each other with an adhesive between them, and bonds the optical disk substrates to cure the adhesive. In the aligning method, the adhesive is supplied to the optical disc substrate in a state where an electric field is formed between the adhesive supply nozzle for supplying the adhesive to the optical disc substrate and the optical disc substrate, and then the two optical disc substrates The present invention provides a method for laminating optical disk substrates, characterized by stacking, rotating and spinning.

In order to solve the above problems, the present invention provides a method for laminating optical disk substrates according to the invention of claim 2, wherein the electric field is an AC electric field or a DC electric field. It is a thing.

In order to solve the above-mentioned problems, the present invention provides a third aspect of the present invention in which two optical disk substrates are stacked with an adhesive, and the adhesive is cured to bond the optical disk substrates. In the aligning device, an adhesive supply nozzle for supplying an adhesive to the optical disk substrate, and an electrode means arranged in contact with or in the vicinity of the surface of the optical disk substrate opposite to the side where the adhesive supply nozzle is present, An apparatus for laminating an optical disk substrate, comprising: an AC power supply or a DC power supply for forming an AC electric field or a DC electric field between the electrode means and the adhesive supply nozzle. .

In order to solve the above-mentioned problems, the present invention according to a fourth aspect provides the invention according to the third aspect, wherein the adhesive supply nozzle is provided alone or at a position shifted by about 180 degrees.
An optical disk substrate comprising a book, which is directed downwards so as to be substantially perpendicular to the optical disk substrate, and which forms an annular adhesive liquid film on the optical disk substrate which is in a relatively rotating state. To provide a laminating device.

To solve the above problems, the present invention according to claim 5 provides the adhesive supply nozzle according to claim 3, which comprises a plurality of nozzle portions arranged on a virtual circle at substantially constant intervals. An optical disk substrate characterized in that a liquid film of an adhesive is applied to the lower surface of the optical disk substrate in a dot-like shape, which is directed upward so as to be substantially perpendicular to the optical disk substrate. A laminating device is provided.

[0013]

First, the principle of the present invention will be described. According to the present invention, when a liquid adhesive is supplied from an adhesive supply nozzle to an optical disc substrate, an electric field, particularly an alternating electric field, is formed between the adhesive supply nozzle and the optical disc substrate so that the surface of the optical disc substrate is adhered to the liquid adhesive. The first finding that voids are less likely to be generated between the optical disk substrate and the adhesive or between the adhesives due to the improved wetting characteristics, and the liquid film of the adhesive supplied to the optical disk substrate is the other optical disk substrate. It is based on the second finding that the smaller the contact area is, the more difficult it is to form voids when directly contacting or directly contacting the liquid film of the adhesive on the surface.

This is because the positive and negative charges having different polarities are given to the upper and lower optical disk substrates and the liquid film by the electric field, and the positive and negative charges are coupled when the liquid films come into contact with each other. It is considered that this is because the wetting property between the liquid film and the optical disk substrate is improved and the spreading property is improved.
Further, it is considered that the electric field is considerably increased just before the first contact with the liquid film of the adhesive, so that the tip of the liquid film of the adhesive is tapered and the contact area is reduced.

As a generally known digital versatile disc (DVD), a single-sided single-layer type optical disc having a recording layer composed of a pit row and a reflective layer only on one optical disc substrate to be laminated, is laminated. Double-sided single-layer type optical disc having recording layers on both disc substrates, or one-sided two with one reflecting layer made of a semitransparent film
In addition to a layered optical disc, or a combination of a single-sided single-layered optical disc and a single-sided double-layered optical disc as described above, there is a double-sided double-layered optical disc in which two single-sided double-layered optical discs are bonded together. The invention is applicable to the manufacture of these various types of DVDs.

First, before explaining the embodiments of the present invention, taking an optical disk substrate having a hole in the center as an example, a liquid bonding which is expected to have the desired effect when the present invention is applied. The shape and combination of agents will be described. FIG. 1 (A) shows the annular liquid film Ta of the adhesive formed around the central hole H 1 of the optical disc substrate A 1. FIG. 1 (B) shows a dotted liquid film Tb of the adhesive formed in a dotted line at a narrow interval on a virtual circle centered on the central hole H 1 of the optical disc substrate A 1. FIG. 1 (C) shows a flat liquid film Tc of an adhesive formed on almost the entire surface of the optical disk substrate A with a predetermined width left around the central hole H 2. FIG. 1D shows a case where no liquid film of adhesive is formed on the optical disc substrate A.

Next, among FIGS. 1 (A) to 1 (D), a combination of bonding which is effective when the present invention is adopted will be described. The one shown in FIG. 1A is almost the same as that shown in FIG. 1A, or the voltage application method according to the present invention is adopted even when combined with any one of FIG. 1B, FIG. 1C and FIG. 1D. By
The intended effect of the present invention can be achieved. Further, the one in FIG. 1 (B) is almost the same as that, or in combination with any of FIG. 1 (A), FIG. 1 (C), and FIG. 1 (D), the voltage application method according to the present invention is adopted. By doing so, the intended effect of the present invention can be achieved. However, the combination of Figure 1 (C) and Figure 1 (D)
For the combination of 1 (C) and almost the same ones, the intended effect of the present invention cannot be achieved even if the voltage application method according to the present invention is adopted.

A first embodiment according to the present invention will be described below with reference to the drawings. FIG. 2 is a diagram for explaining an example of forming the annular liquid film Ta of the adhesive as shown in FIG. 1 (A). The adhesive supply nozzle 1 for supplying the liquid adhesive to the optical disk substrate A is a thin pipe made of a normal metal material and performs a general liquid supply operation. The adhesive supply nozzle 1 is connected to one terminal of the AC power supply 2 and is also connected to the ground potential, and the electrode means 3 serving as an electrode in the pedestal is connected to the other terminal of the AC power supply 2 through the switch 4. Therefore, the switch 4 is closed and the AC voltage from the AC power supply 2 is applied between the adhesive supply nozzle 1 and the electrode means 3 to form an AC electric field therebetween. With this AC electric field formed, the pedestal is rotated about once at a constant speed, and a predetermined amount of liquid adhesive is continuously supplied from the adhesive supply nozzle 1 to the bonding surface side of the disk substrate A. A liquid film Ta of an annular adhesive as shown in FIG. 1 (A) is formed. In this case, the action of the AC electric field improves the wettability between the optical disc substrate A and the adhesive, and voids are unlikely to be generated between the optical disc substrate A and the liquid film Ta.

The value of the applied AC voltage is the optical disk substrate
It is influenced by the rotation speed of A or the rotation speed of the adhesive supply nozzle 1, the discharge speed of the liquid adhesive, the characteristics such as the resistivity and viscosity of the liquid adhesive, etc. Peak value of sine wave is about 1kV and frequency is 5
An AC voltage of 00 Hz was used. The value of the AC voltage applied here is preferably as low as possible so as to achieve the initial purpose in order to minimize the risk of occurrence of discharge. When forming the liquid film Ta of the annular adhesive as shown in FIG. 1 (A), the frequency of the applied AC voltage is 100%.
While achieving the initial purpose of eliminating or reducing the occurrence of voids by setting the frequency in the range of Hz to 2 kHz,
It was found that the value of the applied voltage can be made small. For this reason, the frequency of the applied AC voltage is preferably in the range of 100 Hz to 2 kHz.

Next, an example of forming the dotted liquid film Tb of the adhesive as shown in FIG. 1B will be described with reference to FIG. The base portion 5 made of a metal material or a synthetic resin material, the surface of which is covered with an electric insulating coating, stores an excess amount of adhesive supplied from the adhesive supply nozzle 1. An outer peripheral annular wall portion 6 standing upright is provided. The adhesive supply nozzle 1 comprises an annular nozzle common portion 1a in the central region of the base portion 5 and a nozzle portion 1b extending from the nozzle common portion 1a at substantially regular intervals, and is made of a metal such as a stainless material. . The number of individual nozzles 1b is shown in Fig. 1 (B).
This is the same as the number of dotted lines of the dotted liquid film Tb of the adhesive shown in. Further, a liquid supply passage 7 for supplying a liquid adhesive to the adhesive supply nozzle 1 is formed in the base portion 5. At the center of the base portion 5, a center pin 8 that is inserted into the center hole H of the optical disc substrate A to position the optical disc substrate A
The support base 9 for supporting is fixed.

The supporting means 10 for supporting the optical disk substrate A and moving it in the horizontal direction in addition to the vertical direction is
Although not shown, the optical disk substrate A is selectively suction-held on the lower surface of the electrode portion 11 in addition to the positioning means 12 for receiving the electrode portion 11 and the center pin 8 whose main surface is an annular plate or disc shape. A suction passage or the like is also formed, and the support means 10 is connected to a drive mechanism for moving the support means 10 in the vertical direction. One terminal of the AC power supply 1 is connected to the electrode portion 11 through the switch 4, the adhesive supply nozzle 1 is connected to the ground potential, and the other terminal of the AC power supply 1 is connected. In addition, center pin 8 and support stand
9 is not always necessary, and a sensor (not shown) detects that the support means 10 has been moved in the horizontal direction to reach a predetermined position above the adhesive supply nozzle 1, and stops the horizontal movement. Of course, it may be lowered after that.

To explain the operation next, when the supporting means 10 sucks and holds the optical disk substrate A at another position, the supporting means 10 moves to the upper side in the drawing and then starts to descend. Switch 4 in the process
Is closed and an AC voltage from the AC power supply 1 is applied to all the adhesive supply nozzles 1 and the electrode portions 11 of the supporting means 10, and an AC electric field is formed between them. With the AC electric field formed, the optical disk substrate A is stopped approximately 0.4 mm to 2 mm above the tip of the adhesive supply nozzle 1, and the liquid adhesive from the adhesive supply nozzle 1 is applied to the bottom surface of the optical disk substrate A. Bond as shown in Fig. 1 (B). After that, the optical disk substrate A is raised and moved to the next step. As a safety measure, keep the optical disk substrate A from the support base 9 so that it is no closer than 0.4 mm from the tip of the adhesive supply nozzle 1.
An elastic body 9a is fixed to the upper surface of the elastic body 9a, and the upper surface of the elastic body 9a is at a position higher than the tip of the adhesive supply nozzle 1 by approximately 0.4 mm. That is, the elastic body 9a also functions as a stopper.

When the liquid adhesive from the adhesive supply nozzle 1 adheres to the lower surface of the optical disc substrate A in the state where the AC electric field is formed in this way, the adhesive supply nozzle 1
Since the distance between the electrode part 11 of the bearing means 10 and the electrode part 11 of the support means 10 becomes very small, the strength of the AC electric field becomes considerably large. Therefore, the adhesive at the tip of the adhesive supply nozzle 1 just before the adhesion is microscopically The contact area with the initial optical disk substrate A is sufficiently small. This is the first reason why voids are less likely to be formed, and the second reason is that the wetting property between the tip of the adhesive and the optical disk substrate A is improved. By the method and apparatus of this embodiment, an adhesive liquid film having a pattern as shown in FIG. 1 (B) in which voids are not substantially formed can be obtained.

In this embodiment, the value of the applied AC voltage is influenced by the discharge speed of the liquid adhesive, the characteristics such as the resistivity and viscosity of the liquid adhesive, the capacitance between the electrodes, etc., and cannot be determined unconditionally. However, the peak of the sine wave is about 4
A voltage value of 00V or more is required, and here, it is about 900V.
And the frequency is 4 kHz or more, 2 considering the audible frequency range
An alternating voltage of 0 kHz was used.

Next, the optical disc substrate A has the annular adhesive liquid film shown in FIG.
An example of bonding in the case where the adhesive liquid film is not formed at all as shown in FIG. 1 (D) will be described using FIG. 4 as well as FIGS. 1 to 3. The lower optical disk substrate on which the annular adhesive liquid film Ta shown in FIG. 1 (A) is formed
A is placed on the pedestal 15 of the laminating apparatus. Cradle 15
Has a center shaft 15A projecting in the center thereof. A side wall of the center shaft 15A is divided into a plurality of parts so that a chuck claw described later can pass therethrough. Further, the pedestal 15 is provided with an annular electrode part 16, and the electrode part 16 is connected to one end of an AC power supply 18 through a power supply line 17. On the other hand, the upper optical disk substrate B on which no liquid film of adhesive is formed is a support means.
Supported by 19. The support means 19 is a disk-shaped member made of a conductive material such as stainless steel and serves as one of the electrodes, and also has a general suction mechanism (not shown), and the suction mechanism causes the upper optical disk substrate B
Adsorb and hold the upper surface of. Further, the support means 19 is connected to a transfer arm that can pivot in a horizontal direction at an angle (not shown), and is grounded through the transfer arm or the like.

At the center of the support means 19, a chuck means 20 having an axial center coinciding with the central axis of the center shaft 15A of the pedestal 15 is fixed. The chuck means 20 has three chuck claws 20A which are operated by an external signal to perform expansion / contraction diameter operation. When the chuck claws 20A are transferred to another place while holding the optical disc substrates A and B in a stacked state, the chuck claws 20A perform a diameter expansion operation in the central holes of the optical disc substrates A and B so as to It supports the inner wall of B.

Next, the operation of this mechanism will be described with reference to FIG. While the lower optical disk substrate A is placed on the pedestal 15, a continuous annular liquid film Ta is formed on the upper surface thereof as in the above-described embodiment, and the optical disk substrates A and B are formed.
And face each other. In this state, the electrode part 16 of the pedestal 15
The AC voltage of the AC power supply 18 is applied between the support means 19 and the supporting means 19, and an AC electric field is formed in the space between the optical disk substrates A and B. Next, an elevating shaft 21 fixed to the lower surface of the pedestal 15 by a driving mechanism such as a cylinder device (not shown).
Is raised to narrow the space between the optical disc substrates A and B and bring the liquid film Ta into contact with the surface of the optical disc substrate B. In the process of contacting the liquid film Ta, as the space between the optical disk substrates A and B narrows, the electric field in that space increases, and when the liquid film Ta contacts the liquid film Ta, the suction force by the electric field causes the annular shape of the liquid film Ta. Since the tops of the liquid crystals Ta are tapered and the highest peaks of these tapered liquid films Ta first contact the surface of the optical disk substrate B, the area at the moment of contact of the liquid films Ta is assumed to be significantly smaller than in the past. To be done. Figure 6 is an enlarged view of this initial contact state. After the liquid film Ta has come into contact with the liquid, as shown in FIGS. 5 (B) to 5 (D), the continuous liquid film Ta in the form of a ring spreads from the top in the circumferential direction to form a circle, Optical disk substrate A and
It spreads between B toward the radial direction.

Next, the chuck means 20 is operated by an external signal, and its chuck claw 20A expands the diameter in the central hole of the optical disk substrates A and B to press and hold the inner walls of the optical disk substrates A and B. . In this state, the elevating shaft 21 lowers and the pedestal 15 is lowered, so that the optical disk substrates A and B are held by the chuck means 20 and supported by the support means 19. Actually, in this state, the liquid film of the adhesive between the optical disk substrates A and B spreads much more than the drawing, and as far as it is observed through the optical disk substrates A and B, minute voids and larger voids are not observed. . After that, the supporting means 19 makes a turning motion by a turning means (not shown) to transfer the optical disk substrates A and B to a spinner device (not shown).

It is difficult to make the entire surfaces of the optical disk substrates A and B sufficiently parallel to each other when the optical disk substrates are bonded together, and the adhesive liquid film Ta is used in the multi-point method of the above embodiment.
Since it is extremely difficult to make the heights of all liquids equal to each other, microscopically observing the contact time of the liquid film Ta of the adhesive agent, the contact points of the liquid film Ta are actually different. When applying DC voltage,
The liquid film that comes into contact first gets wet by the effect of voltage application,
The liquid film after the second point is not as wet as the first point. This is because the electric charge charged in the capacitance between the upper and lower disks starts to flow through the resistance R of the adhesive from the moment when the first liquid film comes into contact, and the voltage between the upper and lower optical disk substrates decreases.
This is because the effect of voltage application is somewhat diminished. Therefore,
In this example, an AC voltage was applied.

When an AC voltage is applied, as shown in FIG. 7, the electrode portion 16 of the pedestal 15 and the reflection film of the optical disc substrate A (
The insulating material (not shown) and the optical disk substrate A form a first capacitance, and exhibit an impedance Z1 in terms of AC. The gap between the reflective film of the optical disk substrate A and the reflective film (not shown) of the optical disk substrate B forms a second capacitance, and exhibits an AC impedance Z2. Also,
The reflective film of the optical disk substrate B, the supporting means 19 and the insulating material of the optical disk substrate B sandwiched between them form the third capacitance, and exhibit an impedance Z3 in terms of alternating current. It is considered that the gap between the reflective film of the optical disk substrate A and the reflective film of the optical disk substrate B is indicated by the switch S, and the resistance of the adhesive is indicated by R 2, which are connected in parallel with the impedance Z3.

The magnitudes of these impedances Z1 to Z3 all become smaller according to the frequency f of the applied voltage (for example, Z1 = 1 / 2πfC3, Z3 = 1 / 2πfC1).
However, Z1 and Z3 are absolute values. ), The impedances Z1 to Z3 can be reduced by applying an AC voltage of an appropriate frequency between the optical disk substrates A and B, and the impedances Z1 to Z3 can be equal to or less than the resistance R of the adhesive. If the frequency f is set as follows, the voltage v2 between the reflection film of the optical disk substrate A and the reflection film of the optical disk substrate B will be
Is almost unaffected by resistance R.

That is, when an AC voltage is applied between the optical disk substrates, by appropriately setting the frequency f, even if the liquid film Ta of the adhesive contacts the optical disk substrate B, Voltage between the reflective films of optical disk substrate B
v2 hardly decreases. Therefore, this means that the effect of voltage application is maintained even if the timings at which the plurality of liquid films Ta of the adhesive contact each other are deviated.

Considering the conditions such as the thickness of the optical disk substrates A and B, the dielectric constant, and the resistivity of the adhesive, the effect of voltage application is large when the frequency f of the applied AC voltage is 4 kHz or more. Considering the audible frequency range, the frequency of the AC output voltage of the AC power supply 18 is preferably 20 kHz or higher. In the case of an AC voltage, the average value affects the effect of voltage application, so it is necessary to perform voltage grounding at the average value. Further, the waveform of the AC voltage is not limited to the sine wave, and may be a positive / negative alternating waveform such as a rectangular wave, a triangular wave, or an AC voltage waveform having a voltage pause period.

According to this embodiment, the top portion of the liquid film Ta is tapered by the AC electric field, and the adhesive comes into contact with the tip of the liquid film Ta, so that the generation of minute voids that are easily formed at the time of bonding is sufficiently suppressed, Further, as the liquid film Ta rapidly spreads in the circumferential direction, the liquid film Ta spreads radially outward between the optical disk substrates A and B whose surfaces are positively and negatively charged.
In this process, air is not entrained, and therefore, a large void having a diameter larger than that of a minute void does not occur in the adhesive layer uniformly thinly spread between the optical disk substrates A and B by the spin processing. When the voltage to be applied is an AC voltage, the average value affects the effect of voltage application, so it is necessary to perform voltage grounding at the average value. Further, the waveform of the AC voltage is not limited to the sine wave, and may be a positive / negative alternating waveform such as a rectangular wave, a triangular wave, or an AC voltage waveform having a voltage pause period.

The present invention can be applied to the other combinations described in FIGS. 1 and (0021) in exactly the same manner.
Since the same effect can be obtained, the description is omitted. The present invention can be applied not only to the case where the optical disk substrate is flat, but also to an optical disk substrate such as a curved body such as a lens, which can be bonded in the same manner as described above, and the same effect can be obtained. In the embodiment shown in FIG. 2, a single adhesive supply nozzle has been described. However, two adhesive supply nozzles are arranged at 180 ° offsets, and the optical disk substrate is bonded at the same time while rotating about 1/2 turn. The agent may be supplied. Also, without rotating the optical disk substrate,
The adhesive supply nozzle may be rotated at a constant speed. Furthermore, the applied voltage may have a similar effect even if it is a DC voltage. Although the switch 4 is used in FIGS. 2 and 3, this is for explaining ON / OFF of the AC voltage, and in an actual device, it is replaced by the switching element of the primary side circuit of the AC power supply. .

[0036]

As described above, according to the present invention, the electric field is applied when the liquid adhesive is supplied onto the optical disk substrate or when the liquid adhesive is bonded to the optical disk substrate. Therefore, the adhesive is very preferable in the optical disk substrate. It is possible to significantly suppress the formation of voids between the optical disk substrates which are brought into contact with the liquid and bonded to each other.

[Brief description of drawings]

FIG. 1 is a diagram for explaining an embodiment of an optical disk substrate bonding method according to the present invention.

FIG. 2 is a diagram illustrating an embodiment of an optical disk substrate bonding method and device according to the present invention.

FIG. 3 is a diagram illustrating an embodiment of an optical disk substrate bonding method and device according to the present invention.

FIG. 4 is a diagram illustrating an embodiment of an optical disk substrate bonding method and device according to the present invention.

FIG. 5 is a diagram illustrating an embodiment of laminating optical disk substrates according to the present invention.

FIG. 6 is a diagram illustrating an embodiment of laminating optical disk substrates according to the present invention.

FIG. 7 is a diagram showing an equivalent circuit for laminating optical disk substrates according to the present invention.

FIG. 8 is a diagram for explaining a conventional bonding method for optical disk substrates.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Adhesive supply nozzle 2 ... AC power supply 3 ... Electrode means 4 ... Switch 5 ... Base part 6 ... Outer peripheral annular wall part 7 ... Liquid supply path 8 ... Center pin 9 ... Supporting base 10 ... Supporting means 11 ... Electrode part 12 ... Positioning part 15 ... Receiving base 16 ... Electrode part 17 ... Power supply line 18 ... AC power supply 19 ... Supporting means 20 ... Chucking means 21 ... Elevating shafts A, B ... Optical disk substrates Ta, Tb ...
・ Liquid film of adhesive

Continuation of the front page (56) Reference JP-A-7-228847 (JP, A) JP-A-8-36791 (JP, A) JP-A-4-277581 (JP, A) JP-A-61-201081 (JP , A) JP 11-39734 (JP, A) JP 8-293132 (JP, A) JP 64-14752 (JP, A) JP 5-20714 (JP, A) JP 9-265673 (JP, A) JP 2001-67738 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G11B 7/26

Claims (5)

(57) [Claims] 1. A method for laminating two optical disk substrates with an adhesive between them and curing the adhesive, wherein an adhesive supply nozzle for supplying the adhesive to the optical disk substrate and the optical disk substrate are provided. supplying the adhesive to the optical disc substrate in the state where an electric field, thereafter to overlay the two optical disk substrates, bonded by the rotation of the optical disc substrate, characterized in that the spinning process if during
How to make. Wherein Oite to claim 1, wherein the electric field method for bonding optical disc substrates, characterized in that an AC electric field or a DC electric field. 3. An optical disk substrate bonding apparatus for laminating two optical disk substrates via an adhesive agent and curing the adhesive agent to bond the optical disk substrates to each other, wherein an adhesive agent is supplied to the optical disk substrate. Nozzles, electrode means arranged in contact with or in the vicinity of the surface of the optical disk substrate opposite to the side where the adhesive supply nozzle is present, and an AC electric field or between the electrode means and the adhesive supply nozzle. An AC power supply or a DC power supply for forming a DC electric field,
An optical disk substrate bonding apparatus comprising: 4. The adhesive supply nozzle according to claim 3 , wherein the adhesive supply nozzle is composed of a single piece or two pieces arranged at a position shifted by about 180 degrees, and is directed downward so as to be substantially perpendicular to the optical disk substrate. An optical disk substrate bonding apparatus, wherein an annular adhesive liquid film is formed on the optical disk substrate that is in a relatively rotating state. 5. The adhesive supply nozzle according to claim 3 , wherein the adhesive supply nozzle comprises a plurality of nozzle portions arranged on a virtual circle at substantially constant intervals, and is substantially perpendicular to the optical disc substrate on the lower surface side of the optical disc substrate. And a liquid film of an adhesive agent is applied in a dot shape to the lower surface of the optical disk substrate so that the bonding apparatus for the optical disk substrate.