JP2003045098A - Optical disk sticking device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for piling up two substrates between which an adhesive is interposed at a high speed, absorbing the disorder of the parallelism of both substrates and surely preventing the generating of air bubbles without being affected by the fluctuation of the liquid surface height of the adhesive, an optical disk sticking device in a simple structure capable of being manufactured at a low cost, and the method. SOLUTION: The optical disk sticking device is constituted of a substrate table 5 for fixing and mounting a lower substrate 1 for which a horizontal direction and a vertical direction are positioned, a transfer arm 11 having a vertically movable mechanism, a suction pad 10 loaded on the transfer arm 11 for vacuum-sucking an upper substrate 4 by a vacuum device not shown in the figure, an electrode 7 applying voltage to the upper substrate 4, conductive rubber 8 annularly formed at the substrate contact part of the electrode 7, an electrode vertically moving mechanism 9 having a structure capable of vertically moving the electrode 7 and a power source 6 applying the voltage between the electrode 7 and the substrate table 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk laminating apparatus, and more particularly, to an optical disk laminating apparatus which reduces bubbles by changing the laminating speed according to the distance while applying an electric field between the substrates to be bonded. And how to do that.

[0002]

2. Description of the Related Art In recent years, personal computers (PCs)
And with the development of the Internet, CD-R (Compact Disc-Recordable), CD-RW (Co
mpactDisc-ReWritable) or DVD (Digital Ver
satile Disc) is often used. In particular, a DVD is a bonded optical disk, and the basic method for manufacturing this recording medium is to bond an upper substrate to a base substrate with an adhesive. At this time, in an optical disk laminating apparatus using a liquid adhesive, it is important not to have voids (air bubbles) in the adhesive layer after bonding, and therefore various methods have been conventionally used. Although it has been considered, in each method, a void having a diameter of 0.1 mm or more, a minute void having a diameter of 0.05 mm to 0.1 mm or less, or a mixture of these voids is formed between the disk substrates. Will end up. JP-A-2000-29
Japanese Patent No. 0602 discloses a technique for significantly suppressing the formation of voids between bonded objects when the plate-shaped objects are bonded together. According to this, in a method and an apparatus for laminating two plate-shaped objects with an adhesive and curing the adhesive, the two plate-shaped objects are superposed with an adhesive. Up to this, an electric field is formed in the space between the two plate-like objects.

[0003]

In the prior art, it was necessary to make the substrate superposition speed extremely slow in order to prevent bubbles from being generated. Certainly, if the superposing speed at the moment when the upper substrate and the adhesive come into contact with each other is set to 0.1 mm / s or less, the bubble generation rate becomes extremely low. However, the incidence is 0
It didn't mean%. Further, if the angle formed by the two substrates is a little different from the setting, or if the liquid level of the adhesive varies a little, the generation rate of bubbles rises. Furthermore, a speed of 0.1 mm / s or less is not suitable for practical use because it has poor productivity. Therefore, it is desired to develop a method for eliminating bubbles without extremely slowing the superposing speed. Japanese Unexamined Patent Publication No. 2000-290602 is similar to the present invention in that an electric field is applied at the time of superposition, but it is poor in specificity and has a problem that the applied voltage is direct current.
There is a problem that the equipment becomes large in scale because it requires 0 kHz or more. In view of the above-mentioned problems, the present invention superimposes two substrates with an adhesive interposed therebetween at a high speed (2 mm / s or more), absorbs the deviation in parallelism between the two substrates, and increases the liquid level of the adhesive. It is an object of the present invention to provide a method in which bubbles are not reliably generated without being affected by the variation in the optical disc, an optical disk bonding apparatus that can be manufactured at a low cost with a simple structure, and a method therefor.

[0004]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides an optical disk laminating apparatus in which a plurality of optical disk substrates are superposed with an adhesive and the adhesive is cured. A substrate table on which one of the plurality of optical disc substrates is fixedly mounted, a transfer arm having a vertically movable mechanism, and the other substrate of the plurality of optical disc substrates mounted on the transfer arm to be sucked A suction pad and an electrode section for applying an electric field to the other substrate, and bonding the plurality of optical disk substrates while applying a DC or AC voltage between the substrate table and the electrode section. . Bonded optical disks such as DVDs are bonded by a dedicated bonding device that operates vertically. Generally, the lower substrate is placed on a substrate table having a high degree of parallelism, and an adhesive is applied in a ring shape on the substrate by a nozzle. The opposite upper substrate is vacuum-sucked by a suction pad attached to a vertically moving transfer arm. Then, in order to apply a voltage between the upper substrate and the lower substrate, the substrate table of the lower substrate is connected to the ground, and a predetermined DC or AC voltage is applied to the upper substrate. At that time, in order to apply a voltage to the upper substrate, it is preferable to form a structure in which the electrode portion contacts the upper substrate during adsorption. According to the invention, since the bonding is performed while applying a voltage to the bonding device having a parallelism and a vertical positional relationship, it is possible to eliminate bubbles, and further, it is possible to simplify and miniaturize the mechanism of the stacking process. . Further, the invention of claim 2 is an effective means of the present invention, wherein the DC or AC voltage is any voltage of 2.5 KV or more and 5 KV or less. As for the voltage applied to the upper and lower substrates, the wider the type of power supply and the wider voltage range, the easier it is to use as a device, and the cost of the device itself can be reduced. In that sense, either direct current or alternating current can be used, and the voltage range is as wide as 2.5 KV to 5 KV.
According to such a technical means, the power source can be used in either direct current or alternating current, and the voltage range is wide as 2.5 KV to 5 KV, so that a commercially available power source can be used, and it can be realized in a small size and at low cost.

Further, in the invention of claim 3, the frequency of the AC voltage is a commercial frequency (50 Hz or 60 Hz), which is an effective means of the present invention. In the case of an AC power supply, its frequency becomes a problem. For example, in the case of a frequency of several tens KHz, it has to be specially prepared as a power source. If the commercial frequency (50Hz or 6
If 0 Hz) is usable, only the voltage needs to be controlled. According to such a technical means, since the used frequency is the commercial frequency, commercially available parts can be used, and it is possible to realize the device at a small size and at low cost. In the invention of claim 4, the contact portion of the electrode portion with the other substrate is made of conductive rubber or a cushion material, which is also an effective means of the present invention. When bonding the upper and lower substrates, a certain pressure is applied to the substrates. At that time, the substrate should not be damaged by stress. Therefore, the electrode material of the portion contacting the substrate is preferably an elastic material. According to this technical means, since the contact portion between the electrode portion and the substrate is made of conductive rubber or cushion material, the same potential can be applied to the entire surface without damaging the substrate. Further, the invention of claim 5 is also an effective means of the present invention in which the surface resistance value of the conductive rubber or cushion material is 10 ⁵ Ω or more and 10 ¹¹ Ω or less. The voltage applied between the upper and lower substrates is a high voltage. An electric field is generated between the adhesive and the substrate by the voltage, and the liquid surface of the adhesive is attracted to the substrate side by the electric field force. At that time, the current flowing there is weak. In that sense, the surface resistance value of the conductive rubber or cushion material does not need to be so low. According to this technical means, since the surface resistance value is 10 ⁵ Ω or more and 10 ¹¹ Ω or less, the capacity of the power source can be small, the power source can be made small and low cost, and the safety is enhanced. Further, the invention of claim 6 is an effective means of the present invention, wherein the supporting mechanism for the electrode portion is provided with a mechanism for allowing the electrode portion to move up and down. As described above, when the upper and lower substrates are bonded together, a certain constant pressure is applied to the substrates. It is necessary to absorb the stress generated at that time by some method. One method is rubber or cushion material. However, in order to form the pressing pressure against the substrate, it is preferable that the electrode portion can be moved up and down by some method. According to such a technical means, since the electrode supporting mechanism is provided with a mechanism for freely moving the electrode up and down, the pressing force with respect to the substrate can always be made constant. Therefore, it is possible to prevent contact failure due to insufficient pressing of the electrodes and deformation of the substrate due to excessive pressing of the electrodes.

In the invention of claim 7, it is also an effective means of the present invention to form an insulator other than the electrode portion mounted on the transfer arm. 2.5 on the top and bottom boards
A high voltage of KV to 5 KV is applied. Therefore, the worker must be protected from this voltage. The substrate table is safe because it is connected to the ground, but a high voltage is applied to the electrode portion mounted on the transfer arm. Therefore, it is necessary to insulate the electrodes other than the electrodes when the transfer arm descends. According to such a technical means, since the holding member of the upper substrate is made of an insulator, the charged area is only the electrode portion and the upper substrate, and the transfer arm itself is at the ground potential, which is safe. In the invention of claim 8, the viscosity of the adhesive is 200 to 1000 P (Poise), which is an effective means of the present invention. If the viscosity of the adhesive applied to the lower substrate is too low, it will flow from the surface of the substrate and a constant height of the adhesive surface cannot be maintained. If it is too hard, it cannot be attracted to the upper substrate when an electric field is applied. Therefore, it is important to select an appropriate viscosity. According to such a technical means, since the viscosity of the adhesive is 200 to 1000 P, it is possible to use a commercially available ultraviolet curable adhesive. In addition, since the viscosity range is wide, it is possible to widen the allowable value of the viscosity change with respect to the environmental temperature change. In the invention of claim 9, the application amount of the adhesive is 0.5 to 3 g, which is an effective means of the present invention.
The amount of adhesive applied to the substrate must always be controlled to a constant amount. Basically, the less the better,
It needs to be managed within a certain range. According to such a technical means, since the coating amount of the adhesive is widely compatible with 0.5 to 3 g, it is possible to widen the allowable value of the coating amount change with respect to the environmental temperature change. According to a tenth aspect of the present invention, the superposition of the plurality of optical disc substrates is started, and the distance between the liquid surface of the adhesive and the substrate surface of any one of the plurality of optical disc substrates becomes a predetermined distance. It is also an effective means of the present invention that the first superimposing speed until the above is different from the second superimposing speed after the predetermined distance. The distance between the liquid surface of the adhesive and the upper substrate surface is 2 mm
Until, there is no correlation between the superposition speed (first superposition speed) and the generation of bubbles. But 2
If the velocity exceeds a certain value between the superposition speed (second superposition velocity) and the generation of bubbles, the generation of bubbles will increase. Therefore, changing the speed depending on the distance is effective in suppressing the generation of bubbles. According to such a technical means, the superposing speed of the adhesive and the upper substrate can be made as high as 5 mm / s, and the takt time can be shortened.

According to the invention of claim 11, the predetermined distance is 2 mm or less and the second superposing speed is 5 mm.
It is also an effective means of the present invention to set it to be / s or less. As described above, there is a correlation between the superposition speed and the generation of bubbles. The distance between the liquid surface of the adhesive and the substrate is 2 mm, and the applied voltage is 3
In the case of KV, air bubbles increase when the superposition speed becomes 5 mm / s or more. According to such technical means, the distance is 2 m.
When it is m or less, the superposing speed is 5 mm / s or less, so that the generation of bubbles can be minimized. Further, the invention of claim 12 is an effective means of the present invention, wherein the predetermined distance is 2 mm or less and the superposition of the plurality of optical disk substrates is stopped for 0.1 second or more. The superposing speed may be high up to a distance of 2 mm between the liquid surface of the adhesive and the substrate surface. However, when the distance is 2 mm or less, the correlation with bubbles appears, so it is also effective to slow down or stop the speed. According to such technical means,
The superposition speed of the adhesive and the upper substrate can be increased to 5 mm / s or higher. Therefore, it is possible to further shorten the takt time. In the invention of claim 13, the predetermined distance is 2 mm or less, and after the superposition of the plurality of optical disk substrates is stopped for 0.1 seconds or more, the other substrate is naturally dropped. Is an effective means. Since the adhesive is brought into contact with the upper substrate without bubbles during the standby, bubbles are not generated even after the substrate is naturally dropped from that position thereafter. According to such a technical means, the substrate can be naturally dropped and the next preparation can be performed during that period, so that the tact time can be further shortened.

In the fourteenth aspect of the present invention, it is also an effective means of the present invention that the conductive rubber or cushion material is formed at a position facing the application position of the adhesive. The reason for applying the electric field is to generate an electrostatic force between the adhesive and the substrate to attract the adhesive. Therefore, it is meaningless to apply an electric field to a position where there is no adhesive. According to such a technical means, since the electrodes are formed only at the positions facing the application position of the adhesive, the electric field works effectively, the effect can be exhibited with a small amount of electric power, and the power source can be downsized. According to a fifteenth aspect of the present invention, in a method of laminating a plurality of optical disc substrates via an adhesive and curing the adhesive, the laminating between the plurality of optical disc substrates is started, and the adhesive is A speed at which the first superposition speed until the distance between the liquid surface and the substrate surface of any one of the plurality of optical disk substrates reaches a predetermined distance and a second superposition speed after the predetermined distance are different. Is characterized in that. Further, in the invention of claim 16, the predetermined distance is 2 mm or less and the second superposing speed is 5 m.
Setting it to m / s or less is also an effective means of the present invention. According to a seventeenth aspect of the present invention, the predetermined distance is 2 mm or less, and the superposition between the plurality of optical disc substrates is 0.1.
Stopping for more than a second is also an effective means of the present invention. Further, in the invention of claim 18, the predetermined distance is 2 mm or less, and the overlap between the plurality of optical disk substrates is 0.1.
It is also an effective means of the present invention to let the substrate on the upper side fall naturally after being stopped for more than a second.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the embodiments shown in the drawings. However, the constituent elements, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely explanatory examples, not the gist of limiting the scope of the present invention thereto, unless specifically stated. .. Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram for explaining the adhesive application state of a general stick-on type optical disc such as a DVD. While the lower substrate 1 of the bonded optical disk is rotated by a rotation mechanism (not shown), the adhesive 3 is discharged from the adhesive discharge nozzle 2 to form an annular adhesive on the lower substrate 1. Although a method using one discharge nozzle is described in the drawing, a plurality of discharge nozzles may be used. This step may be performed in advance as a step different from the bonding step described below, or may be performed simultaneously with the bonding step.
FIG. 2 is a sectional view of the optical disk laminating apparatus according to the embodiment of the present invention. In this configuration, the substrate table 5 on which the lower substrate 1 is fixedly mounted is aligned in the horizontal direction and the vertical direction.
And a transfer arm 11 having a vertically movable mechanism,
A suction pad 10 mounted on the transfer arm 11 for vacuum-sucking the upper substrate 4 by a vacuum device (not shown), an electrode 7 for applying a voltage to the upper substrate 4, and an annular shape at the substrate contact portion of the electrode 7. The formed conductive rubber 8 and the electrode up-and-down mechanism 9 having a structure capable of moving the electrode 7 up and down,
It is composed of a power source 6 for applying a voltage between the electrode 7 and the substrate table 5, and an adhesive 3 is applied on the lower substrate 5 as shown in FIG. In addition, the cable 6 from the power supply 6
The electrodes 7 and the substrate table 5 are connected by a and 6b. Further, the lower substrate 1 is placed with a center hole (not shown) aligned with the central axis 12 of the substrate table 5.

Next, the operation of the optical disk laminating apparatus of the present invention will be described. FIG. 3 shows the transfer arm 1 of FIG.
1 is a diagram in which 1 descends and the adhesive 3 forms liquid surfaces 3a and 3b toward the upper substrate 4 by an electric field. FIG. Since the same components are designated by the same reference numerals, duplicate description will be omitted. A description will be given with reference to FIG. One of the power sources 6 is connected to the substrate table 5 holding and loading the lower substrate 1 by the cable 6b. If the power supply is DC, connect it to the ground side, and if it is AC, ground it. The other side of the power supply 6 is connected to the electrode 7 which is in contact with the upper substrate 4 forming a pair,
Connect by a. For DC, connect to the positive side. Next, as shown in FIG. 1, the lower substrate 1 is coated with the adhesive 3 in an annular shape and placed on the substrate table 5. next,
In order to adsorb the upper substrate, a vacuum vacuum (not shown) is operated to adsorb the upper substrate. In that state, the electrode up-and-down mechanism 9 is adjusted up and down so that the conductive rubber 8 formed on the electrode 7 is brought into close contact with the upper substrate 4.
This adjustment may be performed in advance. Next, the power supply 6 is turned on and a voltage is applied. At that time, a voltage of 2.5 to 5 KV is applied (details will be described later). In this state, the transfer arm 11 is lowered. Then, when the distance between the upper substrate 4 and the adhesive 3 becomes 2 mm or less, the descending speed, that is, the overlapping speed is set to 5 mm / s or less. Or 0.1
Hold for more than a second. At this time, the adhesive 3 is attracted by the electric field of the upper substrate 4 and starts to rise at a plurality of places like 3a and 3b. This situation is shown in FIG. In this way, point contact occurs at a plurality of locations, and eventually the circuit completes one round to complete the ring. At this time, since the adhesive 3 is in ideal point contact or line contact, bubbles generated during surface contact do not occur. After that, the transfer arm 11 holding the upper substrate 4 descends to a predetermined position, but the impact given to the adhesive 3 at that time is small and the adhesive 3 gently spreads so that no bubbles are entrained. . Then, the vacuum is stopped, the vacuum in the suction pad 10 is released, and the upper substrate is freed. Then, the transfer arm 11 is raised to end the series of operations.

FIG. 4 is a diagram showing the relationship between the applied voltage and the bubbles according to the present invention. The vertical axis represents the bubble evaluation value, and the horizontal axis represents the applied voltage. The bubble evaluation value is 1: equivalent to the case where no voltage is applied, 2: bubble size is reduced, 3: many fine bubbles and some large bubbles remain, 4: fine bubbles slightly remain, and 5: no bubbles. Further, as parameters, data was collected when the distance between the upper substrate and the adhesive was 2 mm and when the distance was 1 mm. The applied voltage is an alternating voltage, and the superposition speed is 2.2 mm / s. From this data, when the distance is 2 mm, the applied voltage rises almost linearly from 0 to 2.5 KV and saturates at 2.5 KV. Further, when the distance is 1 mm, there is no change up to 2 KV, and it rapidly rises from 2 KV, once saturates at 3 KV, drops sharply from about 3.5 KV, and there is no change after 4 KV. From this data, it can be said that if a voltage of 2.5 KV or more is applied at a superposing speed of 2.2 mm / s from a distance of 2 mm,
Adhesion with almost no air bubbles is possible. Also, the distance is 1mm
When it is set to 3, the highest bubble evaluation value is 3, which is not possible as a use condition. In other words, the overlay speed is 2mm
If the voltage is not applied at / s or more, many large bubbles are generated, so the applied voltage is 0 as shown in FIG.
When an experiment was conducted to gradually increase from V, 1.5K
A change in which the bubbles become smaller appears around V, 2.5 to 5
It was confirmed that bubbles did not occur in KV. FIG. 5 is a diagram showing the relationship between the superposition speed and the bubble evaluation value. The vertical axis represents the bubble evaluation value, and the horizontal axis represents the superposition speed. Figure 4
Is data with a constant superposition speed of 2.2 mm / s. The distance is 2 mm and the superposition speed is 2.2 mm.
It is known that the bubble evaluation value becomes 5 when a voltage of 2.5 KV or more is applied at / s. Therefore, this data was collected to see how the bubbles change when the superposition speed is changed. From this data, the superposition speed is constant up to 5 mm / s, and if it exceeds 5 mm / s, the rank is lowered. From this data,
If the superposition speed is up to 5 mm / s, the bubbles will not change, so the distance is 2 mm in order to shorten the takt time.
Therefore, even if the superposing speed is 5 mm / s, the bubble evaluation value is 5 as in FIG.

From the above experimental results, when the distance between the adhesive and the upper substrate becomes 2 mm, the superposing speed is 5 mm.
/ S or less, make the speed as fast as possible, and apply voltage from 2.5 KV to
If it is made as low as possible within the range of 5 KV, the bubble evaluation value will be 5.
I found out. The drawings used in the above description are described for a bonded optical disk such as a DVD as an embodiment. These have an information board with many fine pits arranged in a spiral or concentric pattern on only one side, both sides are information boards, read-only, rewritable, different format, thin board Although there are various types such as a plurality of layers having a large capacity and the like, the present invention is not limited to the types and combinations thereof, and thus the description thereof will be omitted.
Further, in the embodiment, the adhesive is applied to the lower substrate, but the same effect can be obtained even when the substrate is turned upside down. Similarly, the same effect can be obtained irrespective of the polarity of the voltage applied to both substrates and whether the charge is positive or negative.

[0013]

As described above, according to the present invention, since the bonding is performed while applying a voltage to the bonding device having the parallelism and the vertical positional relationship, it is possible to eliminate bubbles. The mechanism of the superposition process can be simple and downsized. According to claim 2, the power source can be used in either direct current or alternating current, and the voltage range is 2.5 KV-5.
Since it is as wide as KV, you can use a commercially available power supply,
Small size and low cost can be realized. According to the third aspect, since the used frequency is the commercial frequency, commercially available parts can be used, and the size and cost can be reduced. According to the present invention, since the contact portion between the electrode portion and the substrate is made of conductive rubber or cushion material, the same potential can be applied to the entire surface without damaging the substrate. According to claim 5, the surface resistance value is
Since it is 10 ⁵ Ω or more and 10 ¹¹ Ω or less, the capacity of the power supply can be small, the power supply can be made small in size and low in cost, and safety can be enhanced. According to the sixth aspect, since the electrode supporting mechanism is provided with a mechanism for freely moving the electrode up and down, the pressing force with respect to the substrate can always be made constant. Therefore, it is possible to prevent contact failure due to insufficient pressing of the electrodes and deformation of the substrate due to excessive pressing of the electrodes. Claim 7
Since the holding member of the upper substrate is an insulator, the charged area is only the electrode portion and the upper substrate, and the transfer arm itself is at the ground potential, which is safe. According to the eighth aspect, since the viscosity of the adhesive is 200 to 1000 P, it is possible to use an ultraviolet curable adhesive which is generally commercially available. In addition, since the viscosity range is wide, it is possible to widen the allowable value of the viscosity change with respect to the environmental temperature change. According to the ninth aspect, the application amount of the adhesive is broadly supported to 0.5 to 3 g, so that the allowable value of the application amount change with respect to the environmental temperature change can be widened.

According to the tenth and fifteenth aspects, the superposing speed of the adhesive and the upper substrate can be made as high as 5 mm / s, and the takt time can be shortened. According to the eleventh and sixteenth aspects, when the distance is 2 mm or less, the superposing speed is 5 mm / s or less, so that the generation of bubbles can be minimized. According to the twelfth and seventeenth aspects, the superposing speed of the adhesive and the upper substrate can be increased to 5 mm / s or more. Therefore, it is possible to further shorten the takt time. According to the thirteenth and eighteenth aspects, since the substrate can be naturally dropped and the next preparation can be performed in the meantime,
It is possible to further shorten the tact time. According to the fourteenth aspect, since the electrode is formed only at the position facing the application position of the adhesive, the electric field works effectively, the effect can be produced with a small amount of electric power, and the power source can be downsized.

[Brief description of drawings]

FIG. 1 is a schematic diagram for explaining the adhesive application state of a general bonded optical disc such as a DVD according to the present invention.

FIG. 2 is a cross-sectional view in which a transfer arm of the optical disc bonding apparatus according to the embodiment of the present invention is raised.

FIG. 3 is a cross-sectional view in which the transfer arm of the optical disc bonding apparatus according to the embodiment of the present invention is lowered.

FIG. 4 is a diagram showing a relationship between an applied voltage and bubbles according to the present invention.

FIG. 5 is a diagram showing a relationship between an overlay speed and a bubble evaluation value according to the present invention.

[Explanation of symbols]

1 lower substrate, 3 adhesive, 4 upper substrate, 5 substrate table, 6 power supply, 7 electrodes, 8 conductive rubber, 9 electrode up-and-down mechanism, 10 suction pad, 11 transfer arm, 12
Central axis

Claims (18)

[Claims] 1. An optical disk bonding apparatus for stacking a plurality of optical disk substrates via an adhesive and curing the adhesive, and a substrate table on which one of the optical disk substrates is fixedly mounted. A transfer arm having a vertically movable mechanism, an adsorption pad mounted on the transfer arm for adsorbing the other optical disk substrate of the plurality of optical disk substrates, and an electrode section for applying an electric field to the other optical disk substrate. And a plurality of optical disk substrates are bonded together while applying a DC or AC voltage between the substrate table and the electrode portion. 2. The DC or AC voltage is 2.5K
The optical disk laminating apparatus according to claim 1, wherein the voltage is any voltage between V and 5 KV. 3. The optical disk laminating apparatus according to claim 2, wherein the frequency of the AC voltage is a commercial frequency. 4. The optical disk laminating apparatus according to claim 1, wherein a contact portion of the electrode portion with the other optical disk substrate is made of conductive rubber or cushion material. 5. The conductive rubber or cushion material
Surface resistance value is 10 ⁵Ω or more 10¹¹Ω or less
An optical disk bonding apparatus according to claim 4, characterized in that
Place 6. The optical disk laminating apparatus according to claim 1, wherein a supporting mechanism for the electrode portion is provided with a mechanism for moving the electrode portion up and down. 7. The structure other than the electrode part mounted on the transfer arm is made of an insulator.
-6. The optical disk laminating apparatus described in 6. 8. The viscosity of the adhesive is 200 to 1000 P.
(Poise) is set, The optical disk bonding apparatus of Claims 1-7 characterized by the above-mentioned. 9. The optical disk laminating apparatus according to claim 1, wherein the amount of the adhesive applied is 0.5 to 3 g. 10. A method for starting a superposition between the plurality of optical disc substrates until a distance between a liquid surface of the adhesive and a substrate surface of one of the plurality of optical disc substrates reaches a predetermined distance. 10. The optical disk laminating apparatus according to claim 1, wherein the superposing speed of 1 is different from the second superposing speed after the predetermined distance. 11. The optical disk laminating apparatus according to claim 10, wherein when the predetermined distance is 2 mm or less, the second superposing speed is 5 mm / s or less. 12. The optical disk laminating apparatus according to claim 1, wherein when the predetermined distance is 2 mm or less, the superposition of the plurality of optical disk substrates is stopped for 0.1 seconds or more. 13. The predetermined distance is 2 mm or less, and after the superposition of the plurality of optical disk substrates is stopped for 0.1 seconds or more, the other substrate is allowed to fall naturally. (9) The optical disk laminating apparatus described in (9). 14. The optical disk laminating apparatus according to claim 4, wherein the conductive rubber or cushion material is formed at a position facing a position where the adhesive is applied. 15. A method of laminating a plurality of optical disc substrates via an adhesive and curing the adhesive, in the optical disc laminating method, wherein the laminating between the plurality of optical disc substrates is started, and the liquid surface of the adhesive is It is preferable that the first superposition speed until the distance to the substrate surface of any one of the plurality of optical disk substrates reaches a predetermined distance and the second superposition speed after the predetermined distance are different. Characteristic optical disk laminating method. 16. The optical disk laminating method according to claim 15, wherein when the predetermined distance is 2 mm or less, the second superimposing speed is 5 mm / s or less. 17. The optical disk laminating method according to claim 15, wherein when the predetermined distance is 2 mm or less, the superposition between the plurality of optical disk substrates is stopped for 0.1 second or more. 18. The predetermined distance is 2 mm or less, and after the superposition of the plurality of optical disk substrates is stopped for 0.1 seconds or more, the other substrate is naturally dropped. Item 17. A method for laminating optical disks according to item 17.