WO2014207867A1 - Procédé de fabrication de dispositif collé - Google Patents

Procédé de fabrication de dispositif collé Download PDF

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Publication number
WO2014207867A1
WO2014207867A1 PCT/JP2013/067691 JP2013067691W WO2014207867A1 WO 2014207867 A1 WO2014207867 A1 WO 2014207867A1 JP 2013067691 W JP2013067691 W JP 2013067691W WO 2014207867 A1 WO2014207867 A1 WO 2014207867A1
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WO
WIPO (PCT)
Prior art keywords
substrate
adhesive
outer edge
semi
bonding
Prior art date
Application number
PCT/JP2013/067691
Other languages
English (en)
Japanese (ja)
Inventor
坂下　光邦
義和 大谷
Original Assignee
信越エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越エンジニアリング株式会社 filed Critical 信越エンジニアリング株式会社
Priority to CN201380077770.XA priority Critical patent/CN105359203B/zh
Priority to JP2014505427A priority patent/JP5512061B1/ja
Priority to KR1020157036781A priority patent/KR20160026908A/ko
Priority to PCT/JP2013/067691 priority patent/WO2014207867A1/fr
Priority to TW103122414A priority patent/TWI603848B/zh
Publication of WO2014207867A1 publication Critical patent/WO2014207867A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention may be a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel FPD, 3D (three-dimensional) display, electronic
  • FPD flat panel display
  • LCD liquid crystal display
  • OLED organic EL display
  • PDP plasma display
  • flexible display or a touch panel FPD, 3D (three-dimensional) display
  • electronic A method of manufacturing a bonding device such as a book, for bonding another substrate such as a cover glass, a cover film, or an FPD to a substrate such as a liquid crystal module (LCM) or a flexible printed wiring board (FPC).
  • a supply unit supplies an adhesive (ultraviolet curable resin) so as to spread over one side of one workpiece, and one of the adhesives spread over the whole side of the workpiece.
  • Part of the adhesive (outer edge of the adhesive supply area) or the entire adhesive on one side of the workpiece is irradiated with electromagnetic waves (ultraviolet rays) in the atmosphere before bonding.
  • An example in which the adhesive is spread over the entire surface of the workpiece by moving it with a scanning device an example in which the adhesive is spread over the entire part of the workpiece after it has been supplied, and an adhesive that is connected to many dispensers
  • Examples where the agent is applied in a number of lines examples where the supply unit applies the adhesive in a planar manner and uniformly applies in a short time, a device for applying with a roller, a device for applying with a squeegee, a device for applying spin, etc. Examples of applying various devices are shown.
  • the substrate constituting it is a rectangular thin plate like the work described in Patent Document 1, and an adhesive is filled between the two substrates,
  • the entire display area formed in a rectangular shape is filled with an adhesive.
  • the size of the display area with respect to the size of the substrate tends to expand, but the marginal portion of the outer edge of the substrate that is not filled with the adhesive tends to be as narrow as possible.
  • the adhesive will protrude outside the workpiece due to the bonding of the workpieces, and it will be necessary to wipe it off in the subsequent process There is. As a result, the productivity is lowered and the production cost is increased. Furthermore, depending on the type of bonding device, there is a demand for the film thickness (thickness dimension) of the adhesive to be about 0.1 to 0.5 mm. This size is several tens of times larger than the adhesive film thickness (about 1 to 10 ⁇ m) in general LCDs and LCMs, so the fluidity of the adhesive is increased and the entire display area is covered. It tends to be more difficult to fill with adhesive.
  • An object of the present invention is to cope with such a problem, and controls the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate so that the entire area in the display area is adhesive.
  • the purpose is to satisfy with.
  • the present invention provides a method for manufacturing a bonding device in which a first substrate and a second substrate facing each other are bonded together with a liquid adhesive filled therebetween and having a display region.
  • a bonding step of stacking the second substrate so that the adhesive is sandwiched between the opposing surfaces, and in the bonding step, the outer edge of the adhesive that is not semi-cured in the semi-curing step The specific part in the front Wherein it is disposed outside the outer edge of the adhesive, characterized in that to stretch toward the unfilled region of the adhesive.
  • the specific portion is removed at the outer edge of the adhesive.
  • the unsemi-cured specific part is a capillary phenomenon generated between the first substrate and the second substrate, natural flow or pressure flow, and the unfilled area outside the outer edge of the adhesive Extends to the entire display area.
  • the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate can be controlled to fill the entire display area with the adhesive.
  • the adhesive is sufficient for the blank area from the rectangular display area to the outer edge of the first substrate and the second substrate as compared with the conventional one in which the adhesive protrudes from the side of the rectangular filling area when the workpieces are bonded to each other. Even when there is no allowance, it is possible to prevent the adhesive from protruding outside the first substrate and the second substrate, and the adhesive has excellent formability and productivity. Furthermore, even when manufacturing a bonding device in which the film thickness (thickness dimension) of the adhesive is much thicker than the film thickness of the adhesive in general LCDs and LCMs, The adhesive can be filled without sticking out and can be easily handled.
  • the bonding device A As shown in FIGS. 1 to 6, the bonding device A according to the embodiment of the present invention sandwiches a pair of opposing first substrate 1 and second substrate 2 with a liquid adhesive 3 filled therebetween. As a result, the display area D having a predetermined shape is formed at the predetermined position.
  • the first substrate 1 and the second substrate 2 are flat panel displays (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a touch panel type FPD or 3D, for example.
  • FPD flat panel displays
  • LCD liquid crystal display
  • OLED organic EL display
  • PDP plasma display
  • flexible display or a touch panel type FPD or 3D
  • LCD liquid crystal module
  • FPC flexible printed wiring board
  • a cover film, a synthetic resin substrate, a cover glass, a barrier glass, or the like is used.
  • one of the first substrate 1 and the second substrate 2 is not limited to the one that is finally separated in the production stage, and a plurality of first substrates 1 and second substrates are produced in the production stage. It is also possible to use one before separation in which 2 are arranged side by side.
  • the first substrate 1 or the second substrate 2 may be configured by assembling a plurality of components such as LCM, and the outer periphery thereof may be supported by a frame-shaped protective frame.
  • the outer shapes of the first substrate 1 and the second substrate 2 are formed to have the same size, for example, a rectangle, and are bonded so that the outer edges overlap each other in the bonding step.
  • the adhesive 3 for example, a photo-curing adhesive having a photo-curing property, which is cured by absorbing light energy and is developed by polymerization, and the like are used. Further, instead of the photo-curing adhesive, it is also possible to use a thermosetting adhesive or a two-component mixed curing adhesive that is cured by polymerization by absorption of thermal energy. Further, when the adhesive 3 is supplied to either the first substrate 1 or the second substrate 2, the viscosity, specifically, the degree of polymerization (curing degree) is low and has fluidity. The adhesive 3 absorbs light energy, heat energy, and the like in a semi-curing step to be described later, and its fluidity decreases as the viscosity (degree of polymerization, degree of curing) increases.
  • the surface becomes a gelled state that does not harden and maintains adhesiveness, and this gelled state is called a semi-cured state.
  • the semi-cured adhesive 3 is further hard to be deformed by absorbing light energy, heat energy, and the like, and is in a fully cured state.
  • an ultraviolet curable adhesive made of, for example, an acrylic UV curable resin or a silicon UV curable resin is used, and the curing control has an oxygen inhibition property that the surface does not harden particularly in the air. It is preferable to use a material containing a material. In many cases, this type of curing control material has the property of being gasified in a vacuum atmosphere.
  • the supply method of the adhesive agent 3 in a supply process is, for example, a linear coating device such as a coater die having a slit-shaped discharge part, a linear coating device such as a quantitative discharge nozzle, or other means, and the first substrate 1 or the first substrate 1 Either one of the opposing surfaces of the two substrates 2 or both the first substrate 1 and the second substrate 2 are supplied in a shape substantially the same as the outer shape of the display region D.
  • a surface coating device or a linear coating device is used in the atmosphere, and the adhesive 3 is placed in the rectangular display area D on the opposing surface 1a of the first substrate 1. Is applied in a substantially rectangular shape smaller than the outer shape of the display area D.
  • the adhesive 3 is applied by printing or the like instead of the planar coating device or the linear coating device, or the second substrate 2 is opposed to the opposing surface 1a of the first substrate 1. It is also possible to apply the adhesive 3 to only the surface 2 a or both the facing surface 1 a of the first substrate 1 and the facing surface 2 a of the second substrate 2. Before supplying the adhesive 3, it is necessary to degas the air bubbles mixed in the adhesive 3 so that the air bubbles are not involved even during application. It is preferable to leave the adhesive 3 for a predetermined period of time after the supply of the adhesive 3 to naturally defoam the bubbles that are involved during application.
  • the “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process means that when the adhesive 3 is supplied in a rectangular shape to the opposing surface of the first substrate 1 or the second substrate 2, Examples include a corner portion 3a1 whose end is rounded into a spherical shape by the surface tension of the adhesive 3. Further, as another example of the specific part 3a ′, it may be a side portion 3a2 having a predetermined length continuous with the corner portion 3a1 or the entire circumference of the outer edge portion 3a including the corner portion 3a1 and the side portion 3a2.
  • the specific portion 3a ′ on the outer edge 3a of the adhesive 3 is covered with the mask 4 or the like, and the specific portion 3a ′ of the adhesive 3 that is not covered with the mask 4 or the like is excluded.
  • the exposed filling portion 3b is exposed and irradiated with light energy, heat energy, or the like, so that only the filling portion 3b in an exposed state absorbs light energy or heat energy, and the viscosity maintains adhesiveness. It is partially semi-cured so as to be higher than the viscosity of other parts.
  • a photo-curing adhesive is used as the adhesive 3
  • the corner portion 3a1 is used as the specific portion 3a 'in the outer edge 3a of the adhesive 3.
  • a light source 5 such as an ultraviolet lamp is disposed between the mask 4 and the light beam L such as ultraviolet rays from the light source 5. Is being irradiated.
  • the filling portion 3b excluding the corner portion 3a1 which becomes the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 gels by absorbing light energy, and the surface also gels, but the adhesiveness Is in a semi-cured state.
  • the filling portion 3b excluding the corner portion 3a1 and the like serving as the specific portion 3a ′ of the adhesive 3 becomes the semi-cured portion 3b ′ semi-cured in the semi-curing process.
  • the corner portion 3a1 or the like that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 becomes an uncured or uncured portion in an unsemi-cured state that is not semi-cured in the semi-curing process.
  • the adhesive 3 includes a curing control material having oxygen inhibition properties
  • the surface layer of the filling portion 3b from which the outer edge portion 3a is removed in the air is not completely solidified due to oxygen inhibition properties. Remains adhesive.
  • a transparent plate 4b having a light shielding portion 4a fixed at a predetermined position is used as the mask 4.
  • a mask 4 having a through-hole formed in a transparent portion excluding the light-shielding portion 4a may be used, or a heat source may be irradiated from a heat source instead of a light beam L such as ultraviolet rays. It is also possible to change the heat energy and the like into a gel and semi-cured or changed.
  • the state is left for a predetermined time, and the semi-cured portion 3b ′ that has become a semi-cured state (such as the corner portion 3a1 that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3).
  • the surface 3c in the filling part 3b) excluding the part 3 and the corner part 3a1 or the like (unsemi-hardened part or unsemi-hardened part) which becomes the specific part 3a 'of the outer edge 3a from which the semi-hardened part 3b' is removed It is preferable that the air bubbles are naturally smoothed and the bubbles entrained at the time of application are further defoamed.
  • the bonding method of the first substrate 1 and the second substrate 2 in the bonding process is as follows: between the facing surfaces 1a and 2a of the first substrate 1 and the second substrate 2, the specific portion 3a 'and the semi-cured portion of the outer edge portion 3a.
  • the specific part 3a 'of the unsemi-cured state in the outer edge 3a of the adhesive 3 is placed outside the outer edge 3a of the adhesive 3 by overlapping in the Z direction so that the entire adhesive 3 including 3b' is sandwiched. It extends toward the unfilled area D1 of the adhesive 3 to be arranged.
  • either one or both of the first substrate 1 and the second substrate 2 that are overlapped are entirely pressed in the Z direction, and each is vertically and horizontally obliquely intersected with the Z direction (hereinafter referred to as XY ⁇ direction). It is preferable that the facing surfaces 1a and 2a be close to each other in the Z direction so as to be spread.
  • the second substrate 2 is opposed to the first substrate 1 coated with the adhesive 3 in a vacuum or in the atmosphere.
  • the first substrate 1 and the second substrate 2 are superposed so as to be in contact with the surface 3c of the adhesive 3, and are pressed and bonded together so that the first substrate 1 and the second substrate 2 are parallel to each other with the adhesive 3 interposed therebetween.
  • an elevating drive unit (not shown) that moves either one or both of the first substrate 1 and the second substrate 2 toward each other is provided. This lifting drive is controlled by a controller (not shown) until the distance between the opposing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 is substantially the same as the coating height of the adhesive 3.
  • the substantially rectangular adhesive 3 supplied into the rectangular display region D by this overall pressurization has substantially arc-shaped corner portions 3a1 formed at the four corners of the outer edge 3a.
  • each of the substantially straight side portions 3a2 formed on the four sides of the outer edge portion 3a is expanded in the XY direction toward the side portion D3 of the display region D.
  • the first substrate 1 and the second substrate 2 are left in a state of being overlapped and bonded for a predetermined time. It is preferable to include a leveling step of naturally extending the specific portion 3a ′ in the outer edge portion 3a of the agent 3 along the opposing surfaces 1a and 2a. Accordingly, the corner portion 3a1 and the side portion 3a2 that become the specific portion 3a 'in the semi-cured state in the outer edge portion 3a of the adhesive 3 are the corner portion D2 and the side portion D3 that become the unfilled region D1 in the display region D. It naturally flows toward the screen, thereby expanding and extending all over the display area D.
  • the specific portion 3 a ′ is unfilled by partially pressing the portion P facing the specific portion 3 a ′ in the outer edge 3 a of the adhesive 3. It is also possible to approach each other so as to extend toward D1.
  • the portion P of the second substrate 2 facing the corner portion 3a1 of the outer edge portion 3a is locally pressed into a circular shape by a pressurizing device (not shown) to identify the unsemi-cured state.
  • the corner portion 3a1 that becomes the portion 3a ' is forcibly pushed toward the corner portion D2 of the display region D that becomes the unfilled region D1.
  • the corner portion 3a1 which becomes the specific portion 3a 'in the unsemi-cured state becomes the corner portion of the display region D which becomes the unfilled region D1
  • Each extension toward D2 can be promoted.
  • the vicinity of the portion P facing the corner portion 3a1 is locally pressurized with a shape different from the circular shape, or the portion facing the side portion 3a2 is locally pressed instead of the corner portion 3a1.
  • the place where the bonding process is performed or a place different from the execution place of the bonding process It is preferable to carry out main curing by irradiating the entire adhesive 3 including the specific part 3a ′ and the semi-cured part 3b ′ of the outer edge 3a by irradiating light L such as ultraviolet rays or heat rays.
  • irradiating light L such as ultraviolet rays or heat rays.
  • either or both of the first substrate 1 and the second substrate 2 in the supply step shown in FIG. After supplying the adhesive 3 so as to be arranged in the display area D, in the semi-curing process shown in FIGS. 1B and 2A, a specific part in the outer edge 3a of the supplied adhesive 3 The filling part 3b from which 3a 'is removed is partially semi-cured so that its viscosity is higher than the viscosity of other parts while maintaining the adhesiveness. Thereafter, in the bonding step shown in FIGS.
  • the first substrate 1 and the second substrate 1 are sandwiched between the adhesive 3 including the specific portion 3a ′ and the semi-cured portion 3b ′ of the outer edge 3a.
  • the substrate 2 is overlaid.
  • an unsemi-cured specific portion 3 a ′ in the outer edge 3 a of the adhesive 3 is caused by capillarity or natural phenomenon that occurs between the first substrate 1 and the second substrate 2. Due to the flow or pressure flow, it extends and extends toward the unfilled area D1 outside the outer edge 3a of the adhesive 3 and reaches all within the display area D.
  • the adhesive 3 protrudes outside the first substrate 1 and the second substrate 2 even when there is not enough margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2.
  • the manufacturing method of the bonding device A excellent in the shaping property of the adhesive 3 and excellent in productivity can be provided.
  • the first substrate 1 and the second substrate The adhesive 3 can be filled without sticking out of 2 and can be easily handled.
  • either one or both of the first substrate 1 and the second substrate 2 are fully pressurized, and any one of the facing surfaces 1a and 2a of the first substrate 1 and the second substrate 2 is pressed.
  • the adhesive 3 is brought into close contact with the surface 3c, the unevenness generated on the surface 3c of the adhesive 3 is smoothly deformed and brought into close contact. Accordingly, it is possible to further reduce the residual bubbles when the substrates 1 and 2 are bonded together. Therefore, the bubble-free quality can be improved, and the warpage between the substrates 1 and 2 can be corrected, thereby greatly improving the yield.
  • the bonding step when the opposing surfaces 1a and 2a are brought close to each other so that the specific portion 3a 'on the outer edge 3a of the adhesive 3 is pushed and spread along the opposing surfaces 1a and 2a, In the outer edge portion 3a of the adhesive 3, the specific portion 3a 'in an unsemi-cured state is formed in the unfilled region D1 outside the outer edge portion 3a of the adhesive 3 due to a capillary phenomenon generated between the first substrate 1 and the second substrate 2. It flows and expands and extends all over the display area D. Therefore, the entire display area D can be reliably filled with the adhesive 3. As a result, the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.
  • the first substrate 1 and the second substrate 2 are left in a state of being overlapped and left for a predetermined time, and the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 extends along the opposing surfaces 1a and 2a.
  • the specific part 3a ′ that is not semi-cured in the outer edge 3a of the adhesive 3 is naturally flowed toward the unfilled region D1 outside the outer edge 3a of the adhesive 3. As a result, it extends and extends all over the display area D.
  • the local vacuum or the like in the adhesive 3 disappears, the adhesive 3 becomes substantially stationary and stable, and the layer thickness of the adhesive 3 is the opposite surface of the first substrate 1 and the second substrate 2.
  • the entire display area D can be naturally filled with the adhesive 3, and the first substrate 1 and the second substrate 2 can be bonded in a completely bubble-free state with a uniform gap.
  • the production equipment is not complicated, the cost can be reduced, and the bubble-free performance can be improved.
  • the portion P facing the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 is partially applied to either one or both of the superposed first substrate 1 and second substrate 2.
  • the specific part 3a ' is not semi-cured at the outer edge 3a of the adhesive 3. It is forced to flow toward the unfilled region D1 outside the outer edge portion 3a and flows, thereby expanding and extending all over the display region D. Therefore, the entire display area D can be smoothly filled with the adhesive 3.
  • the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.
  • the adhesive 3 in the supplying process, is supplied in a substantially rectangular shape along the inner side of the boundary line of the rectangular display region D.
  • the adhesive 3 is used.
  • the filling portion 3b from which the corner portion 3a1 is removed as the specific portion 3a 'in the outer edge portion 3a of the outer peripheral portion 3a is semi-cured, and in the joining process, the corner portion 3a1 that becomes the specific portion 3a' It is extended toward the corner
  • the bonding device A of Example 1 is an electronic component such as an LCD or an LCM that does not have a sufficient margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2. Is shown.
  • the corner portion 3a1 that becomes the specific portion 3a ' is only a portion that is a quadrant formed at the four corners of the outer edge portion 3a of the adhesive 3 supplied in a substantially rectangular shape.
  • the light-shielding part 4a (4a1) of the mask 4 is rectangular and covers only the part that becomes a quadrant.
  • the light-shielding part 4a may be a triangle or the like. It is also possible to change the shape.
  • the corner portion 3a1 that becomes the specific portion 3a ' is a portion that is a quadrant of the four corners of the outer edge portion 3a of the substantially rectangular adhesive 3, and one of the arcs 3R.
  • This is a location including a rectangular side portion 3a3 that is continuously formed so as to be adjacent in the XY direction along a side 3L having a predetermined length continuous with one or both.
  • the rectangular light-shielding portion 4a2 larger than that shown in FIG. 4A is used to cover the quadrant and the L-shaped side part 3a3, but the quadrant. If the side part 3a3 along at least one side 3L can be covered, it is also possible to use a light shielding part 4a having another shape such as a triangle.
  • the corner portion 3a1 that becomes the specific portion 3a ' is a portion where the outer edge portion 3a of the substantially rectangular adhesive 3 is a quadrant of the four corners, and the arc 3R and the side 3L.
  • adjacent portions 3a4 continuously formed so as to be adjacent to each other in the XY direction from the boundary to the filling portion 3b.
  • the light shielding part 4a3 having a shape in which a rectangle and a trapezoid partially overlap is used to cover the quadrant and the adjacent portion 3a4.
  • the quadrant and the corner portion 3a1 and the adjacent portion 3a4 are covered. As long as it can be covered, it is also possible to use the light-shielding portion 4a having other shapes such as changing the rectangle into a triangle or changing the trapezoid into a circle.
  • the adhesive 3 supplied in a substantially rectangular shape by superimposing the first substrate 1 and the second substrate 2 is not semi-cured.
  • the corner portion 3a1 serving as the specific portion 3a ' is a corner that becomes the unfilled region D1 in the rectangular display region D due to capillary action, natural flow, or pressurized flow generated between the first substrate 1 and the second substrate 2.
  • Each extends and extends toward the portion D2, and reaches the corner portion D2 of the unfilled region D1. Therefore, the corner portion D ⁇ b> 2 of the display area D can be reliably filled with the adhesive 3.
  • the bonding device A has a sufficient margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCD or LCM, there is an advantage that the adhesive 3 can be prevented from protruding outside the first substrate 1 and the second substrate 2, the formability of the adhesive 3 is excellent, the yield is greatly improved, and the productivity can be further improved. .
  • the area of the specific part 3a ′ in an unsemi-cured state is increased by the side part 3a3 and bonded compared to the example shown in FIG. Since the extension flow rate of the agent 3 increases, the corner portion D2 of the display region D can be more reliably filled with the adhesive 3. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.
  • the area of the specific part 3a ′ in an unsemi-cured state is increased by the amount of the adjacent part 3a4 compared to the example shown in FIG.
  • the side 3L adjacent to the quadrant is temporarily cured as compared with the example shown in FIG. 4B, and thus the adhesive 3 protrudes from the side 3L to the unfilled region D1.
  • angular part D2 of the display area D can be more reliably filled with the adhesive agent 3.
  • FIG. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.
  • the adhesive 3 is supplied along the boundary line inside the rectangular display region D in the supply process, and the outer edge portion of the adhesive 3 is used in the semi-curing process.
  • the filling part 3b from which at least the side part 3a2 is removed as the specific part 3a 'in 3a is semi-cured, and in the bonding process, at least the side part 3a2 to be the specific part 3a' is separated from the unfilled area D4 outside the display area D.
  • the configuration in which the first substrate 1 and the second substrate 2 are extended toward the bonding space S between the outer edge portions 1b and 2b is different from the first embodiment shown in FIGS. This is the same as the first embodiment shown in FIG.
  • the bonding device A of Example 2 is a case of an electronic component having a relatively large margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM. Show.
  • the first substrate 1 has a frame-shaped protective frame 11, and a plurality of components are stacked in the Z direction and supported by the protective frame 11 so as to be integrally assembled. Yes.
  • the front-side video display component 12 and the back-side backlight unit 13 are assembled and fixed by a metal protective frame 11.
  • the mask 4 used in the semi-curing process uses a transparent plate 4d to which a frame-shaped light-shielding portion 4c smaller than the protective frame 11 is fixed, and has four side portions 3a2 on the outer edge portion 3a of the substantially rectangular adhesive 3;
  • the part which becomes a quadrant of the four corners is covered with a light-shielding part 4c, and is partially semi-cured so as to continue in a frame shape over the entire circumference of the outer edge part 3a. That is, the case where the “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process is the entire circumference of the outer edge 3a including all the quadrants and the side part 3a2. Show.
  • a protective frame 11 made of another material is used in place of the metal protective frame 11, or a through hole is opened in a transparent portion excluding the frame-shaped light shielding portion 4c. It is also possible to use semi-cured materials, to be semi-cured by irradiating heat rays or the like from a heat source instead of the light rays L such as ultraviolet rays, or to replace the first substrate 1 with one without the frame-shaped protective frame 11. is there.
  • the first substrate 1 and the second substrate 2 are superposed to each other in the non-cured state in the bonding space S supplied in a substantially rectangular shape.
  • Each of the first substrate 1 and the second substrate 2 extends and extends toward the bonding space S between the outer edge portions 1b and 2b of the second substrate 2 and reaches the bonding space S.
  • the space between the first substrate 1 and the second substrate 2 can be reliably filled with the adhesive 3 to the vicinity of the outer edge portions 1b and 2b.
  • the bonding device A has a relatively large margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM, the first substrate 1
  • the adhesive strength of the second substrate 2 can be improved.
  • the adhesive strength between the protective frame 11 of the first substrate 1 and the second substrate 2 can be increased.
  • the first substrate 1 is an electronic component in which a plurality of components are stacked in the Z direction and supported and fixed by the protective frame 11, the liquid is discharged from the gap between the protective frame 11 and the video display component 12 on the front side. If soaked, it would damage the internal electronic circuit and cause failure, so an adhesive that soaked through the gap could not be used.
  • a highly viscous adhesive 3 such as an ultraviolet curable adhesive, it is possible to prevent failure due to penetration into the interior from the gap between the protective frame 11 and the image display component 12 on the surface side.
  • the method for bonding the first substrate 1 and the second substrate 2 in the bonding process has not been described in detail.
  • the first fixed plate that holds the first substrate 1 detachably, Either one of the second surface plates for detachably holding the two substrates 2 or both the first surface plate and the second surface plate are provided with a buffer material, and the first surface plate and the second surface plate are parallel to each other. It is preferable to ensure the parallelism between the first substrate 1 and the second substrate 2 regardless of the degree.
  • all of the filling portion 3b from which the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 is removed is semi-cured.
  • the present invention is not limited to this. May be semi-cured in a state where a part of the center side of the filling portion 3b is partially removed.
  • a bonding device 1 1st board

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Abstract

La présente invention concerne un procédé de fabrication de dispositif collé dont l'objectif est de réguler l'extension de la périphérie externe d'un adhésif pris en sandwich entre un premier substrat et un second substrat et de remplir l'intégralité de l'intérieur d'une zone d'affichage d'adhésif. Après application d'un adhésif (3) sur un premier substrat (1), sur un second substrat (2) ou sur ces deux substrats, de manière à ce que l'adhésif (3) soit placé au sein d'une zone d'affichage (D), une partie remplie (3b) excluant une partie spécifique (3a') et située dans la périphérie (3a) de l'adhésif (3) est semi-durcie de manière à ce que sa viscosité soit supérieure à celle des autres parties tout en conservant son adhésivité. Ensuite, le premier substrat (1) et le second substrat (2) sont placés en chevauchement de manière à ce que l'adhésif (3) soit pris en sandwich entre les deux substrats, et l'action de capillarité, l'écoulement naturel, ou l'écoulement sous pression résultant entre le premier substrat (1) et le second substrat (2) entraîne l'extension d'une partie spécifique (3a') de la périphérie (3a) de l'adhésif (3), qui n'est pas semi-durcie, en direction d'une zone non remplie (F1) située plus vers l'extérieur que la périphérie (3a) de l'adhésif (3), et la répartition de ladite partie spécifique (3a') dans l'intégralité de l'intérieur de la zone d'affichage (D).
PCT/JP2013/067691 2013-06-27 2013-06-27 Procédé de fabrication de dispositif collé WO2014207867A1 (fr)

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CN201380077770.XA CN105359203B (zh) 2013-06-27 2013-06-27 贴合设备的制造方法
JP2014505427A JP5512061B1 (ja) 2013-06-27 2013-06-27 貼合デバイスの製造方法
KR1020157036781A KR20160026908A (ko) 2013-06-27 2013-06-27 접합 디바이스의 제조 방법
PCT/JP2013/067691 WO2014207867A1 (fr) 2013-06-27 2013-06-27 Procédé de fabrication de dispositif collé
TW103122414A TWI603848B (zh) 2013-06-27 2014-06-27 Bonding device manufacturing method

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CN106125352A (zh) * 2015-05-07 2016-11-16 信越工程株式会社 贴合设备的制造方法及贴合设备的制造装置
WO2020195251A1 (fr) * 2019-03-26 2020-10-01 日東電工株式会社 Procédé de production de film stratifié
CN114425504A (zh) * 2022-02-08 2022-05-03 亚世光电(集团)股份有限公司 一种全新loca减少贴合溢胶的工艺方法

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CN107554043A (zh) * 2017-09-22 2018-01-09 东莞华贝电子科技有限公司 Lcm贴合夹具、lcm的组装方法
CN111369904B (zh) * 2020-04-08 2022-05-31 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法、显示装置
CN114241916A (zh) * 2021-12-22 2022-03-25 云谷（固安）科技有限公司 曲面盖板与柔性屏的贴合方法

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CN106125352B (zh) * 2015-05-07 2019-04-19 信越工程株式会社 贴合设备的制造方法及贴合设备的制造装置
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JPWO2014207867A1 (ja) 2017-02-23
CN105359203A (zh) 2016-02-24
KR20160026908A (ko) 2016-03-09
CN105359203B (zh) 2018-09-04

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