CN110760896A - Crease-resistant electroforming process for working plate - Google Patents

Abstract

The invention discloses an anti-wrinkle electroforming process for a working plate, comprising the following steps: A. Flatly adhering a master plate to be electroformed on an at least partially transparent carrier through a photosensitive adhesive to obtain a substrate; B. then The substrate is cured, and a conductive tape is attached around the master to obtain a cured substrate; C. The cured substrate is subjected to electroforming treatment to obtain an electroforming layer, and the obtained electroforming layer is working version. The process disclosed by the invention can maintain a high flatness of the master plate layout to be electroformed, so that the electroforming working plate has no apparent defects such as orange peel and wrinkles.

Description

An anti-wrinkle electroforming process for a working plate

technical field

The invention relates to an anti-wrinkle electroforming process for a working plate, belonging to the field of holographic processing.

Background technique

Electroforming is a process of depositing metals, alloys or composite materials on the master to be electroformed by using the principle of metal ion cathode electrodeposition, and separating it from the master to produce products. During the electroforming process, the role of the power supply Then, the metal ions in the electroforming solution are reduced to metal on the master to be electroformed at the cathode, and deposited on the surface of the master to be electroformed. After the electroforming is completed, the electroforming layer is separated from the master to obtain a rough surface. For a working version with a similar degree value to that of the master, the working version produced by this method can accurately replicate the surface profile and fine lines of the master, and can obtain a working version with high dimensional accuracy and good surface finish.

However, in the prior art, when the masters to be electroformed are relatively thin, their masters are generally directly fixed on the substrate with double-sided tape. This operation is relatively random, and it is generally difficult to keep the layout flat. The working plate processed by the casting method is prone to layout defects such as orange peel and wrinkles.

The patent with the application number of CN201610666499.9 discloses a processing process for a laser working plate that can eliminate edge wrinkles, but each working plate needs to be electroformed first, and then partially processed back to the groove, the process is complicated, and the production cost of the working plate High, and can only eliminate edge wrinkles, can not improve the wrinkle problem in the pattern area.

The patent with the application number of CN200910063601.6 relates to a method for manufacturing holographic masters by electroforming imposition for large-sized unit holographic patterns, but it is only used for thicker masters, and in the case of thinner masters , the layout is prone to orange peel and wrinkles.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an anti-wrinkle electroforming process for a working plate, which can maintain a high flatness of the master plate to be electroformed, so that the working plate obtained by electroforming has no apparent defects such as orange peel and wrinkles.

In order to achieve the above object, the present invention provides the following technical solutions: an anti-wrinkle electroforming process of a working plate, comprising the following steps:

A. The master plate to be electroformed is evenly adhered to the at least partially transparent carrier through the photosensitive adhesive to obtain a substrate;

B. The substrate is then cured, and a conductive tape is attached around the master to obtain a cured substrate;

C. The solidified substrate is electroformed to obtain an electroformed layer, and the obtained electroformed layer is the working plate.

Further, the carrier is a transparent carrier. The transparent carrier is conducive to the photocuring of the photosensitive adhesive, so that the master is stably fixed on the carrier, and further ensures that the layout of the master remains flat.

Further, the carrier is a PC transparent carrier. The PC transparent carrier has high transparency, which is more conducive to the photocuring of the photosensitive adhesive, so that the master is more firmly fixed on the carrier, and further ensures that the layout of the master remains flat.

Further, the electric current of the electroforming treatment is 60-140A.

Further, the electroforming treatment time is 2-24h.

Further, the thickness of the electroformed layer is 50-500 μm.

Further, in the step C, after the solidified substrate is subjected to electroforming treatment, a substrate with an electroforming layer is obtained, and the electroforming layer is separated from the master on the substrate to obtain an electroforming layer. The layer is the working version.

Further, in the step A, the photosensitive adhesive around the master on the carrier is removed.

Further, the master to be electroformed is a nickel master, and the electroformed layer is a nickel electroformed layer.

The beneficial effects of the present invention are as follows: by adhering the master to be electroformed on the at least partially light-transmitting carrier flatly through the photosensitive adhesive, the bottom surface is made flat; On the carrier, the master plate to be electroformed is kept in high flatness, so that the working plate obtained by electroforming has no apparent defects such as orange peel and wrinkles. The software measures the average grain size, the grains are finer, and the surface flatness is high, and the surface of the obtained working plate has a flat micro-nano structure, which can produce good optical effects.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, and implement it according to the content of the description, the preferred embodiments of the present invention are described in detail below with the accompanying drawings.

Description of drawings

Fig. 1 is a schematic diagram of the structure of a substrate with an electroforming layer;

in:

1. Carrier, 2. Photosensitive adhesive, 3. Master, 4. Working.

Detailed ways

The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are intended to illustrate the present invention, but not to limit the scope of the present invention.

The embodiment of the present invention discloses an anti-wrinkle electroforming process for a working plate, comprising the following steps:

A. The master plate 3 to be electroformed is evenly adhered to the at least partially transparent carrier 1 through the photosensitive adhesive 2 to obtain a substrate;

B, then the substrate is cured, and a conductive tape is attached around the master 3 to obtain a cured substrate;

C. The solidified substrate is electroformed to obtain an electroformed layer, and the obtained electroformed layer is the working plate 4 .

By flatly adhering the master 3 to be electroformed on the at least partially light-transmitting carrier 1 through the photosensitive adhesive 2, the bottom surface is made flat; and then the photosensitive adhesive 2 is light-cured, so that the master 3 can be stably fixed on the carrier 1 , so that the layout of the master 3 to be electroformed maintains a high flatness.

In the above embodiment, the carrier 1 is a transparent carrier 1, which facilitates the photocuring of the photosensitive adhesive 2, so that the master 3 is stably fixed on the carrier 1, and further ensures that the layout of the master 3 remains flat.

In the above embodiment, the carrier 1 is a PC transparent carrier 1, which has high transparency, which is more conducive to the photocuring of the photosensitive adhesive 2, so that the master plate 3 is more firmly fixed on the carrier 1, and further ensures that the The layout of Master 3 remains flat.

In the above-mentioned embodiment, the electric current of the electroforming process is 60-140A.

In the above embodiment, the electroforming treatment time is 2-24h.

In the above embodiments, the thickness of the electroformed layer is 50-500 μm.

In the above embodiment, in the step C, after the solidified substrate is subjected to electroforming treatment, a substrate with an electroforming layer is obtained, and the electroforming layer is separated from the master on the substrate, The resulting electroformed layer is the working version 4.

In the above embodiment, in the step A, the photosensitive adhesive 2 around the master 3 on the carrier 1 is removed.

In the above embodiment, the master 3 to be electroformed is a nickel master 3, and the electroforming layer is a nickel electroforming layer.

In order to better illustrate the technical solutions of the present invention, several specific embodiments are described below.

Specific embodiment one

Apply UV glue on the transparent PC board carrier 1 of 1000mm*800mm, and flatly adhere the nickel master 3 to be electroformed on the PC board carrier 1 through the UV glue, erase the UV glue other than the nickel master 3, The substrate is obtained, and then the PC board carrier 1 is inverted, and the UV glue is photocured through the PC board carrier 1 by ultraviolet light to obtain a cured substrate, so that the nickel master 3 can be stably fixed on the PC board carrier 1, Keep the nickel master 3 layout high flatness. Then, a conductive tape is pasted around the nickel master 3, and the cured substrate is placed in an electroforming tank for electroforming treatment.

The electroforming solution in the electroforming tank is nickel sulfamate, the regulating current is 110A, and the voltage is 7V. When the electroforming treatment time reaches 4h, the electroforming treatment is completed, and a substrate with an electroforming layer is obtained.

The substrate with the electroforming layer was taken out, the electroforming layer was peeled off, and the electroforming layer was separated from the nickel master 3 on the substrate to obtain a nickel working plate 4 with a thickness of 120 μm and a complementary holographic pattern with the nickel master 3 .

Specific embodiment two

Reference can also be made to the first embodiment. The difference between the wrinkle-proof electroforming process of the working plate of the second embodiment and the first embodiment is that in the electroforming process, the regulated current is 60A and the voltage is 8V. The electroforming treatment time reaches 2h, the electroforming treatment is completed, and a substrate with an electroforming layer is obtained. Take out the substrate with the electroformed layer, peel off the electroformed layer, and separate the electroformed layer from the nickel master 3 on the substrate to obtain a nickel working plate 4 with a thickness of 50 μm and a complementary holographic pattern with the nickel master 3 .

Specific embodiment three

The first embodiment can also be referred to. The difference between the wrinkle-proof electroforming process of the working plate of the third embodiment and the first embodiment is only that in the electroforming process, the regulated current is 140A and the voltage is 7V. The electroforming treatment time reaches 24h, the electroforming treatment is completed, and a substrate with an electroforming layer is obtained. Take out the substrate with the electroformed layer, peel off the electroformed layer, and separate the electroformed layer from the nickel master 3 on the substrate to obtain a nickel working plate 4 with a thickness of 500 μm and a complementary holographic pattern with the nickel master 3 .

Specific embodiment four

The JSM-6460LV scanning electron microscope from Hitachi Electronics was used to observe the surface topography of the nickel working plates 4 obtained in different batches in Example 1 to Example 3 and the working plates of different batches in Comparative Example 1, and the Image Tool software was used to measure the surface topography. The average grain size, in Comparative Example 1, the master plate was fixed on the carrier with double-sided tape to make a working plate by electroforming, and the results are shown in Table 1 below.

Table 1

Test group number test batch average grain size Surface topography Example 1 The first batch 1.31μm smooth Example 1 second batch 1.42μm smooth Embodiment 2 The first batch 1.48μm smooth Embodiment 2 second batch 1.52μm smooth Embodiment 3 The first batch 1.53μm smooth Embodiment 3 second batch 1.51μm smooth Comparative Example 1 The first batch 2.02μm rough Comparative Example 1 second batch 2.21μm rough

As can be seen from the above Table 1, compared with the working plates obtained in Comparative Example 1, the average grain size of the working plates obtained in Examples 1 to 3 is smaller, the surface morphology is relatively flat, and the flatness of the working plates is higher, especially the Examples A working version has the highest flatness.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are more specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (9)

1. A crease-resist electroforming process of a working plate is characterized by comprising the following steps:

A. adhering a mother board to be electroformed to a carrier which is at least partially transparent to light through a photosensitive adhesive to obtain a substrate;

B. then curing the substrate, and attaching a conductive adhesive tape around the master mask to obtain a cured substrate;

C. and performing electroforming treatment on the cured substrate to obtain an electroforming layer, wherein the electroforming layer is the working plate.

2. The process of claim 1, wherein the carrier is a transparent carrier.

3. The process of claim 2, wherein the carrier is a PC transparent carrier.

4. A process for wrinkle-proofing and electroforming a working plate according to any of claims 1 to 3, wherein in step C, the electroforming is performed at a current of 60 to 140A.

5. A wrinkle-proofing electroforming process according to any of claims 1 to 3, wherein in said step C, the electroforming time is 2-24 hours.

6. A process for wrinkle-proofing and electroforming of a working plate according to any of claims 1 to 3, wherein the thickness of said electroformed layer is 50-500 μm.

7. The wrinkle-resistant electroforming process according to any one of claims 1 to 3, wherein in the step C, the solidified substrate is electroformed to obtain a substrate with an electroformed layer, the electroformed layer is separated from the master on the substrate, and the obtained electroformed layer is the working plate.

8. The wrinkle-resistant electroforming process according to any one of claims 1 to 3, wherein in said step A, the photosensitive glue on the periphery of the master on said carrier is removed.

9. The wrinkle-resistant electroforming process according to any one of claims 1 to 3, wherein the master to be electroformed is a nickel master, and the electroformed layer is a nickel electroformed layer.