CN101618628A - Method for manufacturing holographic mother board by using electroforming imposition - Google Patents
Method for manufacturing holographic mother board by using electroforming imposition Download PDFInfo
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- CN101618628A CN101618628A CN200910063601A CN200910063601A CN101618628A CN 101618628 A CN101618628 A CN 101618628A CN 200910063601 A CN200910063601 A CN 200910063601A CN 200910063601 A CN200910063601 A CN 200910063601A CN 101618628 A CN101618628 A CN 101618628A
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CN2009100636016A CN101618628B (en) | 2009-08-11 | 2009-08-11 | Method for manufacturing holographic mother board by using electroforming imposition |
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CN2009100636016A CN101618628B (en) | 2009-08-11 | 2009-08-11 | Method for manufacturing holographic mother board by using electroforming imposition |
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CN101618628A true CN101618628A (en) | 2010-01-06 |
CN101618628B CN101618628B (en) | 2011-05-18 |
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CN2009100636016A Expired - Fee Related CN101618628B (en) | 2009-08-11 | 2009-08-11 | Method for manufacturing holographic mother board by using electroforming imposition |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913287A (en) * | 2010-07-07 | 2010-12-15 | 湖北联合天诚防伪技术有限公司 | Method for platemaking holographic anti-counterfeiting label |
CN102009517A (en) * | 2010-09-20 | 2011-04-13 | 苏州苏大维格光电科技股份有限公司 | Method for making metal mother board |
CN102677106A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN102677107A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN103317825A (en) * | 2013-05-14 | 2013-09-25 | 武汉华工图像技术开发有限公司 | UV makeup method of holographic dedicated plate |
CN106739428A (en) * | 2016-12-07 | 2017-05-31 | 武汉华工图像技术开发有限公司 | The preparation method that a kind of holographic metal is molded mother matrix |
CN110756993A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
CN110871619A (en) * | 2018-08-29 | 2020-03-10 | 苏州苏大维格科技集团股份有限公司 | High-fidelity makeup method |
CN112323103A (en) * | 2020-11-04 | 2021-02-05 | 江苏兴广包装科技有限公司 | Hot-pressing type makeup method for holographic anti-counterfeiting plate |
CN112405703A (en) * | 2020-10-26 | 2021-02-26 | 东莞六淳智能科技股份有限公司 | Large-size gum die cutting process |
-
2009
- 2009-08-11 CN CN2009100636016A patent/CN101618628B/en not_active Expired - Fee Related
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913287A (en) * | 2010-07-07 | 2010-12-15 | 湖北联合天诚防伪技术有限公司 | Method for platemaking holographic anti-counterfeiting label |
CN102009517A (en) * | 2010-09-20 | 2011-04-13 | 苏州苏大维格光电科技股份有限公司 | Method for making metal mother board |
CN102677106A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN102677107A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN102677106B (en) * | 2012-06-05 | 2014-08-27 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN102677107B (en) * | 2012-06-05 | 2015-03-11 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
CN103317825A (en) * | 2013-05-14 | 2013-09-25 | 武汉华工图像技术开发有限公司 | UV makeup method of holographic dedicated plate |
CN103317825B (en) * | 2013-05-14 | 2015-03-04 | 武汉华工图像技术开发有限公司 | UV makeup method of holographic dedicated plate |
CN106739428A (en) * | 2016-12-07 | 2017-05-31 | 武汉华工图像技术开发有限公司 | The preparation method that a kind of holographic metal is molded mother matrix |
CN106739428B (en) * | 2016-12-07 | 2018-12-14 | 武汉华工图像技术开发有限公司 | A kind of production method of holography metal molding mother matrix |
CN110756993A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
CN110756993B (en) * | 2018-07-26 | 2021-06-29 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
CN110871619A (en) * | 2018-08-29 | 2020-03-10 | 苏州苏大维格科技集团股份有限公司 | High-fidelity makeup method |
CN112405703A (en) * | 2020-10-26 | 2021-02-26 | 东莞六淳智能科技股份有限公司 | Large-size gum die cutting process |
CN112323103A (en) * | 2020-11-04 | 2021-02-05 | 江苏兴广包装科技有限公司 | Hot-pressing type makeup method for holographic anti-counterfeiting plate |
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Publication number | Publication date |
---|---|
CN101618628B (en) | 2011-05-18 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20100106 Assignee: Yunnan Ji Ji Packing Technology Co.,Ltd. Assignor: HUBEI XINGLONG PACKAGING MATERIAL Co.,Ltd. Contract record no.: 2015420000156 Denomination of invention: Method for manufacturing holographic mother board by using electroforming imposition Granted publication date: 20110518 License type: Exclusive License Record date: 20150821 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20210811 |