CN101618628B - Method for manufacturing holographic mother board by using electroforming imposition - Google Patents

Method for manufacturing holographic mother board by using electroforming imposition Download PDF

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Publication number
CN101618628B
CN101618628B CN2009100636016A CN200910063601A CN101618628B CN 101618628 B CN101618628 B CN 101618628B CN 2009100636016 A CN2009100636016 A CN 2009100636016A CN 200910063601 A CN200910063601 A CN 200910063601A CN 101618628 B CN101618628 B CN 101618628B
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China
Prior art keywords
nickel plate
unit
unit hologram
hologram
electroforming
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Expired - Fee Related
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CN2009100636016A
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Chinese (zh)
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CN101618628A (en
Inventor
吴婷婷
汤炼
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HUBEI XINGLONG PACKAGING MATERIAL CO Ltd
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HUBEI XINGLONG PACKAGING MATERIAL CO Ltd
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Abstract

The invention relates to a method for manufacturing a holographic mother board by using an electroforming imposition, which is used for big-size unit holographs. The method comprises the following steps: firstly, fixing a plurality of nickel boards of unit holographs on a flat plastic bottom board by using double-faced adhesive tapes, and then, eliminating spliced joints between every two nickel boards of the unit holographs to manufacture a big-size holographic mother board. The invention has the advantages that the method can be used for splicing a large holographic mother board containing unit holographs in different unit sizes, the splicing speed is quick, the splicing precision is high, and the subsequent electroforming process can level up and eliminate the joints, thus the nickel boards can be combined together to form an ideal large holographic mother board.

Description

A kind of method of making holographic mother with the electroforming layout
Technical field
The invention belongs to the holographic technique field, particularly a kind of method that is used for the large-size units hologram with electroforming layout manufacturing holographic mother.
Background technology
Be used at present the technology of layout both at home and abroad, can be divided into two big classes basically:
The one, the mechanical layout machine of small size unit hologram, it utilizes the principle of blanching seal, the mode that undersized unit hologram is shifted by thermoprint, and be spliced into the master hologram of a big size.Because the restriction of its principle and process aspect can only be spliced undersized hologram at present, unit size is many within 10 centimetres of X10 cm range, can't splice large-sized unit hologram.
The 2nd, silica gel layout method, this method are to splice large-sized unit hologram in principle.It is that the unit hologram that needs splice is duplicated with silica gel, a plurality of figures that duplicate is cut and artificial splicing, and figure recycle silicon glue or the epoxy glue that is stitched together duplicated.But because silica gel is softer, restively cuts and splice precision, and, the layout cycle also very long (, generally wanting 24 hours) because the silica gel of every module unit hologram duplicates, complex process, the human factor influence is bigger.
Therefore, for large-sized unit hologram, also there are not a kind of comparatively desirable keyline layout method and machinery to splice holographic mother at present with large-size units hologram.
Summary of the invention
The purpose of this invention is to provide a kind of can layout large-size units hologram, again can control easily cut and splice precision make the method for holographic mother with the electroforming layout, to overcome the deficiencies in the prior art.
To achieve these goals, the method applied in the present invention is:
First step: the unit hologram quantity required according to layout makes the nickel plate of the unit hologram of requirement with electrocasting;
Second step: the nickel plate of the unit hologram of whole required splicings is accurately cut into the desired identical shaped and size of layout;
Third step: on the one side of smooth plastic bottom board, stick double faced adhesive tape;
The 4th step: the nickel plate of the unit hologram that will cut, by desired arrangement, be stitched together in the one side that double faced adhesive tape is arranged one by one, forming a matrix of being formed by the unit hologram, and reach size that holographic mother requires;
The 5th step: the vacant part around the unit hologram that is stitched together, stick the fringing nickel plate with the nickel plate stack pile of unit hologram, to form a frame;
The 6th step: will be add all good big versions of splicing of upper side frame by the matrix of a plurality of unit hologram, carry out repeated multiple times electroforming processing, with the seam of progressively filling and leading up and eliminate splicing with increase the bond strength of seam and eliminate the thickness difference of former each concatenation unit, finishing spliced nickel plate is exactly required holographic mother.
The thickness of nickel plate is at the 50-60 micron in the above-mentioned first step, the nickel plate thickness of slab error of each unit hologram is controlled at ± 5 microns within.
Cutting with precision optical machinery of the nickel plate of unit hologram sheared or the method for cross cutting in above-mentioned second step.
After sticking double faced adhesive tape on the one side of smooth plastic bottom board, intersect side at two of double faced adhesive tape and respectively stick a separate paper, in the above-mentioned third step with benchmark as the nickel plate of pasting the unit hologram.
The nickel plate of said units hologram be shaped as square or rectangular.
The invention has the beneficial effects as follows:
1, owing to is not subjected to the restriction of concatenation unit hologram size, the sliceable big master hologram that contains various unit sizes.Particularly be suitable for the splicing of large-size units hologram.
2, owing to adopting the method for on double faced adhesive tape, pasting to splice, so splicing speed is fast;
3, since concatenation unit cut precision can accomplish very high, therefore, the splicing precision also can accomplish very high.Seam be filled and led up and be eliminated to follow-up electroforming process can, is combined into an integral body, becomes a desirable big mother matrix.
Description of drawings
Fig. 1 is a schematic diagram of the present invention.
Fig. 2 is the A portion side-looking enlarged drawing of Fig. 1.
Fig. 3 is the schematic diagram behind the embodiment of the invention third step.
Fig. 4 is the schematic diagram after the embodiment of the invention the 5th step.
Among the figure: the nickel plate of 1-unit hologram, 2-plastic plate, 3-double faced adhesive tape, 4-fringing nickel plate, 5-separate paper.
The specific embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
Method of the present invention is to fix the nickel plate (Fig. 1) of a plurality of unit hologram on smooth plastic bottom board earlier with double faced adhesive tape, eliminates the seam of splicing between the nickel plate of unit hologram with the method for electroforming then, and makes large-sized holographic mother.
Embodiment: the large scale holographic mother of making soft cigarette capsule hologram
Mission requirements: requiring effective mold pressing area of the good holographic mother of splicing is 775X619.8mm, unit hologram (being little cigarette case) is of a size of 155X103.3mm, totally 30 unit holograms, form the matrix of a 5X6 unit hologram, the holographic mother that adds behind the upper side frame is of a size of 1000X800mm, the purpose of frame (fringing nickel plate) is the requirement for subsequent technique, as the requirement of electroforming or mold pressing.
Manufacture method is:
1, the hologram (being the unit hologram) with little cigarette case duplicates 30 with the method for electroforming, promptly duplicate 30 blocks of nickel plates with little cigarette case hologram, the nickel plate thickness can be selected about 55 microns, but the thickness difference between each nickel plate should be controlled at ± 5 microns within (thickness and thickness error can be realized by control electroforming parameter);
2, with the nickel plate of 30 little cigarette case holograms, with the accurate digital control shearing machine mode of cross cutting (or with) with every rectangle that all is cut into 155X103.3mm, require the relative error between the size of each piece minimum, as ± 0.001mm (this is to accomplish with numerical control shearing machine or cross cutting);
3, get the poly (methyl methacrylate) plate of a smooth 1000X800mm, on whole of its one side, stick double faced adhesive tape, sticking a separate paper along the 1000mm direction from 90.1 millimeters places of panel edges, also stick a separate paper at 112.5 millimeters places of 800mm direction isolated edge again, the inner edge of two separate papers will be mutually the right angle.The inward flange of these two separate papers, the location benchmark (Fig. 3) when pasting exactly;
4, at the angle of cut place of two separate papers, stick the nickel plate of the unit hologram of first 155X103.3mm, in the time of subsides, the direction of the long limit 155mm of the nickel plate of this element hologram is parallel with the 1000mm direction of poly (methyl methacrylate) plate.Stick 5 so that same orientation is parallel; Then paste next line 5, paste 6 row altogether.Just formed the unit hologram matrix of a 5X6.Matrix is of a size of (5X155) X (103.3X60)=755X619.8mm.During stickup, require the edge between each piece to be close together, the slit is as far as possible little, but can not be overlapping;
5, the separate paper that will locate usefulness tears off, and around the unit hologram matrix, respectively sticking two width is 90.1mm and 112.5mm again, the fringing nickel plate that thickness is identical with unit hologram nickel plate thickness, and (Fig. 4) finished in the work of then pasting.
6, will paste the version of finishing, and place electrotyping bath, and carry out the repeated multiple times electroforming and duplicate, the slit of pasting will progressively be filled and led up and be disappeared, and the nickel plate has just formed a smooth smooth holographic mother.
The content that is not described in detail in this specification belongs to this area professional and technical personnel's known prior art.

Claims (1)

1. make the method for holographic mother with the electroforming layout for one kind, the method that is adopted is:
First step: the unit hologram quantity required according to layout, the thickness of unit hologram that makes requirement with electrocasting at the 50-60 micron, be shaped as the nickel plate of square or rectangular, the nickel plate thickness of slab error of each unit hologram is controlled at ± 5 microns within;
Second step: the nickel plate of the unit hologram of whole required splicings is sheared with precision optical machinery or the method for cross cutting accurately cuts into the desired identical shaped and size of layout;
Third step: on the one side of smooth plastic bottom board, stick double faced adhesive tape, concrete grammar is: after sticking double faced adhesive tape on the one side of smooth plastic bottom board, intersect side at two of double faced adhesive tape and respectively stick a separate paper, with benchmark as the nickel plate of pasting the unit hologram;
The 4th step: the nickel plate of the unit hologram that will cut, by desired arrangement, be stitched together in the one side that double faced adhesive tape is arranged one by one, forming a matrix of being formed by the nickel plate of unit hologram, and reach size that holographic mother requires;
The 5th step: the vacant part around the unit hologram that is stitched together, stick the fringing nickel plate with the nickel plate stack pile of unit hologram, to form a frame;
The 6th step: will be add all good big versions of splicing of upper side frame by the matrix of a plurality of unit hologram, carry out repeated multiple times electroforming processing, with the seam of progressively filling and leading up and eliminate splicing with increase the bond strength of seam and eliminate the thickness difference of former each concatenation unit, finishing spliced nickel plate is exactly required holographic mother.
CN2009100636016A 2009-08-11 2009-08-11 Method for manufacturing holographic mother board by using electroforming imposition Expired - Fee Related CN101618628B (en)

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CN101618628A CN101618628A (en) 2010-01-06
CN101618628B true CN101618628B (en) 2011-05-18

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101913287A (en) * 2010-07-07 2010-12-15 湖北联合天诚防伪技术有限公司 Method for platemaking holographic anti-counterfeiting label
CN102009517B (en) * 2010-09-20 2013-04-03 苏州苏大维格光电科技股份有限公司 Method for making metal mother board
CN102677107B (en) * 2012-06-05 2015-03-11 湖北联合天诚防伪技术股份有限公司 Electrotype splicing method
CN102677106B (en) * 2012-06-05 2014-08-27 湖北联合天诚防伪技术股份有限公司 Electrotype splicing method
CN103317825B (en) * 2013-05-14 2015-03-04 武汉华工图像技术开发有限公司 UV makeup method of holographic dedicated plate
CN106739428B (en) * 2016-12-07 2018-12-14 武汉华工图像技术开发有限公司 A kind of production method of holography metal molding mother matrix
CN110756993B (en) * 2018-07-26 2021-06-29 苏州苏大维格科技集团股份有限公司 Laser spot welding makeup method
CN110760896A (en) * 2018-07-26 2020-02-07 苏州苏大维格科技集团股份有限公司 Crease-resistant electroforming process for working plate
CN110871619A (en) * 2018-08-29 2020-03-10 苏州苏大维格科技集团股份有限公司 High-fidelity makeup method
CN112405703B (en) * 2020-10-26 2022-05-20 东莞六淳智能科技股份有限公司 Large-size gum die cutting process
CN112323103A (en) * 2020-11-04 2021-02-05 江苏兴广包装科技有限公司 Hot-pressing type makeup method for holographic anti-counterfeiting plate

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Application publication date: 20100106

Assignee: Yunnan Ji Ji Packing Technology Co.,Ltd.

Assignor: HUBEI XINGLONG PACKAGING MATERIAL Co.,Ltd.

Contract record no.: 2015420000156

Denomination of invention: Method for manufacturing holographic mother board by using electroforming imposition

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