CN201410774Y - Cathode carrier plate on electroforming plane of conductive upper interlayer-type laser nickel plate - Google Patents
Cathode carrier plate on electroforming plane of conductive upper interlayer-type laser nickel plate Download PDFInfo
- Publication number
- CN201410774Y CN201410774Y CN2009201522484U CN200920152248U CN201410774Y CN 201410774 Y CN201410774 Y CN 201410774Y CN 2009201522484 U CN2009201522484 U CN 2009201522484U CN 200920152248 U CN200920152248 U CN 200920152248U CN 201410774 Y CN201410774 Y CN 201410774Y
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- plate
- support plate
- electroforming
- type laser
- conductive
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Abstract
The utility model discloses a cathode carrier plate on an electroforming plane of a conductive upper interlayer-type laser nickel plate, which comprises a carrier plate that is made of non-conductor material; the carrier plate is provided with an opening trough which is internally provided with a metal cathode conductive plate that is matched with the opening trough; and a cathode conductive plateis connected with the carrier plate by a conductive hook. In the cathode carrier plate on the electroforming plane of the conductive upper interlayer-type laser nickel plate, as the conductive plateis arranged at the upper part of the carrier plate and the area is reduced, the whole planeness of the cathode plate is increased, the bonding effect of the laser nickel plate on the upper surface ofthe cathode carrier plate is smoother; and the quality of copying the laser nickel plate is improved, the damage on the master plate is reduced, the operation difficulty is reduced and the working efficiency is improved.
Description
Technical field
The utility model belongs to radium-shine plate-making field, is mainly laser nickel version electroforming kit.
Background technology
In the laser nickel version electroforming plane electrode support plate of prior art, general negative electrode conductive plate is designed to big X type or two parallel type.The negative electrode conductive plate of the laser nickel version electroforming plane electrode support plate of these structures is because area is bigger, and its combination rear surface flatness is lower, has both increased the difficulty of processing of support plate, influences electroforming copy effect again.
Summary of the invention
At the problem that prior art exists, the purpose of this utility model is to provide a kind of can effectively dwindle the minus plate area, has both guaranteed conducting effect, improves the flatness on the interlayer planar cathode support plate surface after making up again.
Technical solution adopted in the utility model is: put sandwich-type laser nickel version electroforming planar cathode support plate in a kind of conduction, it comprises the support plate of non-conductive material, on described support plate, be provided with open slot, be installed with the metallic cathode conductive plate suitable with open slot in described open slot, conductive hook links together negative electrode conductive plate and support plate.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the described conduction, described open slot is opened in the top of described support plate.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the described conduction, the degree of depth of described open slot is 1～2mm.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the described conduction, described negative electrode conductive plate sticks in the described open slot by glass cement, and fixes by bolt and support plate.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the described conduction, described support plate is poly (methyl methacrylate) plate or bakelite plate.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the described conduction, described negative electrode conductive plate is corrosion resistant plate or copper coin.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction of the present utility model, because the conductive plate position is in support plate top, and area reduces, so the minus plate integral smoothness improves, the effect that the laser nickel version sticks on above the negative electrode support plate is more smooth, not only improved the quality of copy laser nickel version but also reduced damage, and reduced operation easier and increase work efficiency mother matrix.
Description of drawings
Fig. 1 is a negative electrode conductive plate structure schematic diagram of the present utility model;
Fig. 2 is a carrying board structure schematic diagram of the present utility model;
Fig. 3 is the partial enlarged drawing of the A-A of Fig. 2 to cutaway view;
Fig. 4 is the schematic diagram of conductive hook of the present utility model.
The specific embodiment
Below by specific embodiment the present invention is described in further detail.
Shown in Fig. 1-4, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction of the present utility model, comprise that thickness is the nonmetal plate support plate 1 of 10～15mm, support plate 1 can be lucite or bakelite plate, open slot 2 of upper position processing at support plate 1, the degree of depth of open slot 2 is 1～2mm, in open slot 2, be provided with the stainless minus plate 3 that matches, minus plate 3 is by in the bonding embedding open slot 2 of glass cement, it is bonding firm and surperficial smooth to guarantee both during making, by stainless steel bolt 3 and pair of conductive hook 4 minus plate 3 and non-conductor support plate 1 is fixed together.
Put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction of the present utility model, because the conductive plate position is in support plate top, and area reduces, so the minus plate integral smoothness improves, the effect that the laser nickel version sticks on above the negative electrode support plate is more smooth, not only improved the quality of duplicating the laser nickel version but also reduced damage, and reduced operation easier and increase work efficiency mother matrix.
Claims (6)
1, puts sandwich-type laser nickel version electroforming planar cathode support plate in a kind of conduction, it comprises the support plate of non-conductive material, it is characterized in that: on described support plate, be provided with open slot, be installed with the metallic cathode conductive plate suitable with open slot in described open slot, conductive hook links together negative electrode conductive plate and support plate.
2, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction according to claim 1, it is characterized in that: described open slot is opened in the top of described support plate.
3, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction according to claim 1, it is characterized in that: the degree of depth of described open slot is 1～2mm.
4, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction according to claim 1, it is characterized in that: described negative electrode conductive plate sticks in the described open slot by glass cement, and fixes by bolt and support plate.
5, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction according to claim 1, it is characterized in that: described support plate is poly (methyl methacrylate) plate or bakelite plate.
6, put sandwich-type laser nickel version electroforming planar cathode support plate in the conduction according to claim 1, it is characterized in that: described metallic cathode conductive plate is corrosion resistant plate or copper coin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201522484U CN201410774Y (en) | 2009-04-29 | 2009-04-29 | Cathode carrier plate on electroforming plane of conductive upper interlayer-type laser nickel plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201522484U CN201410774Y (en) | 2009-04-29 | 2009-04-29 | Cathode carrier plate on electroforming plane of conductive upper interlayer-type laser nickel plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201410774Y true CN201410774Y (en) | 2010-02-24 |
Family
ID=41712666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201522484U Expired - Lifetime CN201410774Y (en) | 2009-04-29 | 2009-04-29 | Cathode carrier plate on electroforming plane of conductive upper interlayer-type laser nickel plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201410774Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400186A (en) * | 2010-09-17 | 2012-04-04 | 上海冰峰仪表塑料件厂 | Mold manufacturing technology making use of nickel electroforming machining |
| CN103334130A (en) * | 2013-07-22 | 2013-10-02 | 上海宝绿包装材料科技有限公司 | Hanger for electroforming laser nickel plate |
| CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
-
2009
- 2009-04-29 CN CN2009201522484U patent/CN201410774Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400186A (en) * | 2010-09-17 | 2012-04-04 | 上海冰峰仪表塑料件厂 | Mold manufacturing technology making use of nickel electroforming machining |
| CN103334130A (en) * | 2013-07-22 | 2013-10-02 | 上海宝绿包装材料科技有限公司 | Hanger for electroforming laser nickel plate |
| CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG ZHUANGLI COLOR PRINTING CO., LTD. Free format text: FORMER NAME: ZHUANGLI PRINTING CO., LTD., SHANTOU |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 515064, Shantou, Chaozhou City, Guangdong Province on the eastern side of Hulu City Patentee after: Guangdong Zhuangli Color Printing Co. Ltd. Address before: 515064, Shantou, Chaozhou City, Guangdong Province on the eastern side of Hulu City Patentee before: Zhuangli Printing Co., Ltd., Shantou |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100224 |
|
| CX01 | Expiry of patent term |