CN101992583A - Method for preparing seamless wide-width holographic embossing master plate - Google Patents
Method for preparing seamless wide-width holographic embossing master plate Download PDFInfo
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- CN101992583A CN101992583A CN2009101094804A CN200910109480A CN101992583A CN 101992583 A CN101992583 A CN 101992583A CN 2009101094804 A CN2009101094804 A CN 2009101094804A CN 200910109480 A CN200910109480 A CN 200910109480A CN 101992583 A CN101992583 A CN 101992583A
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Abstract
The invention discloses a method for preparing a seamless wide-width holographic embossing master plate, which comprises the following steps of: a. coating a coating material on a base material to form a coating material layer, wherein the coating material has the viscosity of 1000-3000mPa.s at the temperature of 25 DEG C; b. combining small blocks of holographic makeup with holographic lines on the surface to form a required holographic pattern; embossing the holographic pattern by using the combined small blocks of makeup on the coating material layer, and then standing still for 0.5-2h to obtain a coating pattern layer; curing the coating pattern layer to obtain a holographic pattern layer; metalizing the surface of the holographic pattern layer to form a metal layer so as to obtain the seamless wide-width holographic embossing master plate finally. The seamless wide-width holographic embossing master plate prepared by the method has no seams left after conventional makeup pressing, and the size of the seamless wide-width holographic embossing master plate prepared by the method is not restrained. The method has simple process and is beneficial to mass industrialized production.
Description
[technical field]
The present invention relates to a kind of preparation method of contour forging mother matrix, particularly a kind of preparation method of seamless wide cut contour forging mother matrix.
[background technology]
Therefore peculiar characteristics such as holographic technique has that three-dimensional stereo effect is good, the bright-colored gorgeous and dynamic panorama of color have caused extensive concern since coming out.Along with the develop rapidly of holographic technique, moulding holographic technology also arises at the historic moment, and it is that a kind of light harvesting, electric mechanical, surface chemistry, industrial art and embossment printing etc. are multidisciplinary in the comprehensive modern high technology of one.But the embossed holographic product has function uniqueness, cheap automation production in enormous quantities, application advantage very widely, is mainly used in false proof and the packing aspect.
One of most important operation of moulding holographic technology is to make the contour forging template, in the embossed holographic product high volume production process, requires the contour forging template to have bigger size, i.e. wide cut contour forging template.The preparation method of prior art wide cut contour forging template is by the layout machine hologram on the undersized contour forging template to be imprinted directly on the plastic sheet, to carry out electroforming after the plastic sheet metallization again, obtain wide cut contour forging mother matrix, after casting, obtain wide cut contour forging template.
But, in the prior art, the version seam that stays in the time of can having layout on the wide cut contour forging mother matrix by layout mechanism work, and this edition seam can be by being observed visually.Adopt to exist version seam and picture and text discontinuous on the contour forging product of this wide cut contour forging mother matrix preparation accordingly, had a strong impact on the quality of product.
[summary of the invention]
In order to overcome the defective that has the version seam on the wide cut contour forging mother matrix for preparing in the prior art, the invention discloses a kind of preparation method of seamless wide cut contour forging mother matrix, seamless on the wide cut contour forging mother matrix by this preparation method's preparation.
The preparation method of seamless wide cut contour forging mother matrix disclosed by the invention comprises:
A, on base material, apply coating, form dope layer; Wherein, the viscosity of described coating is 1000-3000mPas in the time of 25 ℃;
B, the surface is had the fritter layout combination of holographic lines, form required holographic pattern; Adopt the fritter layout after making up on dope layer, to impress described holographic pattern, leave standstill 0.5-2h then, obtain coating figure lamina;
C, described coating figure lamina is solidified, obtain the hologram lamina;
D, the holographic pattern laminar surface is metallized, form metal level, obtain seamless wide cut contour forging mother matrix.
On the seamless wide cut contour forging mother matrix by method disclosed by the invention preparation, do not have the version seam that stays after the conventional layout compacting, and the size of the seamless wide cut contour forging mother matrix by this method preparation is unrestricted.Simultaneously, this method technology is simple, helps heavy industrialization and uses.
[specific embodiment]
In order to make technical problem to be solved by this invention, technical scheme and beneficial effect clearer, below the present invention is further elaborated.
The preparation method of seamless wide cut contour forging mother matrix disclosed by the invention comprises:
A, on base material, apply coating, form dope layer; Wherein, the viscosity of described coating is 1000-3000mPas in the time of 25 ℃;
B, the surface is had the fritter layout combination of holographic lines, form required holographic pattern; Adopt the fritter layout after making up on dope layer, to impress described holographic pattern, leave standstill 0.5-2h then, obtain coating figure lamina;
C, described coating figure lamina is solidified, obtain the hologram lamina;
D, the holographic pattern laminar surface is metallized, form metal level, obtain seamless wide cut contour forging mother matrix.
Among the above-mentioned preparation method, the base material of selecting for use is this area various base materials commonly used, as can be in polymethyl methacrylate (PMMA), Merlon (PC), the polyester (PET) a kind of.The not too big restriction of the thickness of base material can be 0.2-2.0mm.Above-mentioned base material all can be commercially available, and the thickness of producing as GE company is the Merlon (PC) of 0.3mm.
The above-mentioned method that applies coating on base material is a method known in those skilled in the art, as adopting spin coating or roller coat etc.When adopting spin coating, the spin coating condition is: rotary speed is 500-1000rpm, and the coating time is 5-20s.Also can adopt line rod spreader directly to apply.Obtain the thick dope layer of 0.5-2um.The inventor finds, can guarantee to form the precision of hologram pattern at the dope layer that forms on the base material in above-mentioned scope, and helps the elimination of version seam.The thickness of above-mentioned coating layer can be controlled by being controlled at the amount that applies coating on the base material unit are.
According to the present invention, the coating that is adopted in the above-mentioned coating procedure can be the UV photocureable coating.The not too big requirement of above-mentioned UV photocureable coating can be adopted this area various UV photocureable coating commonly used, and only need make the viscosity of this UV photocureable coating is 1000-3000mPas in the time of 25 ℃, is 2000-2500mPas under the preferable case.The viscosity of above-mentioned coating is the dope viscosity in the time of 25 ℃.
Above-mentioned on dope layer the method for layout hologram line be this area method commonly used, as adopting the layout machine surface is had the fritter layout combination of holographic pattern, form the holographic pattern of finishing.The size of above-mentioned fritter layout does not require, as selecting the fritter layout of 4 * 4cm for use.The base material that then surface is had dope layer places the layout machine, makes the holographic pattern face of dope layer in layout.In the described fritter layout anabolic process, control layout precision is 0-0.2mm, and being preferably control layout precision is 0-0.1mm.The method of hologram line is on dope layer: regulating layout machine pressure is 0.1-1Mpa, is to be embossed to 1-10s under 50-80 ℃ in temperature.Being preferably and regulating layout machine pressure is 0.4-0.6Mpa, is to be embossed to 3-6s under 60-70 ℃ in temperature.By promptly having formed holographic pattern behind the above-mentioned layout machine impression at coating surface.In the present invention, above-mentioned layout precision may be defined as after the fritter layout combination, the width in the slit between two adjacent fritter layouts.
Then, leave standstill 0.5-2h, be preferably 1-1.5h.This leaves standstill processing and can directly carry out at normal temperatures.
Obtain coating figure lamina after leaving standstill.Then coating figure lamina is solidified.The method that coating figure lamina is solidified is that commonly used various in this area are cured the method for processing to coating, and as can carrying out in the F300 ultra-violet curing lamp system that FUSION company produces, condition of cure is: adopt the high-pressure sodium lamp of 2KW to solidify 5-30s.During curing, the fritter layout in the layout machine can still be in and the coating state of contact, also can break away from coating.Above-mentioned coating figure lamina promptly forms the hologram lamina after solidifying.
According to the present invention, obtain also comprising behind the above-mentioned hologram lamina holographic pattern laminar surface is carried out metalized.The method of this metalized is this area various method for metallising commonly used, at holographic pattern laminar surface spray silver, obtains seamless wide cut contour forging mother matrix precursor as earlier, and electroforming then forms metal level, obtains seamless wide cut contour forging mother matrix.
Because the hologram lamina is to obtain by paint solidification, the holographic pattern laminar surface is non-conductive.In order to make holographic pattern laminar surface conduction,, handle so need earlier the holographic pattern laminar surface to be sprayed silver usually so that carry out electroforming.The purpose that described spray silver is handled is for the holographic pattern laminar surface can be conducted electricity.The silver-colored processing of described spray can adopt this area method commonly used to carry out.
After the holographic pattern laminar surface sprays silver, makes its surface conductance, can carry out electroforming.The method of described electroforming can comprise puts into electroforming solution as negative electrode with the seamless wide cut contour forging mother matrix precursor after the processing of spray silver, and the metal of need electroforming is put into electroforming solution as anode, connects power supply.After the electroforming, can obtain seamless wide cut contour forging mother matrix.
Described electroforming solution can be the various electroforming solution that this area is commonly used, can be the aqueous solution of the water soluble salt that contains electroforming metal, and the water soluble salt of electroforming metal can be selected from one or more in slaine hydrochlorate, metal sulfate and the metal organic acid salt.The water soluble salt of described electroforming metal is preferably one or more in nickel chloride, nickelous sulfate, organic acid nickel salt, copper chloride, copper sulphate, organic acid mantoquita, iron chloride, ferric sulfate, organic acid molysite, chromium chloride, chromium sulfate, organic acid chromic salts, stannic chloride, STANNOUS SULPHATE CRYSTALLINE, organic acid tin salt, zinc chloride, zinc sulfate, organic acid zinc salt, sulfurous acid gold, potassium auricyanide, silver cyanide and the silver potassium cyanide.Described acylate is preferably sulfamate.
Can also contain other auxiliary agent in the described electroforming solution, for example acid and/or wetting agent.Acid can be selected from one or more in boric acid, sulfamic acid, sulfuric acid and the hydrochloric acid.Wetting agent can be existing various nickel plating wetting agents, as wetting agent WT (lucky and prosperous chemical company produces) or lauryl sodium sulfate.Described acid is preferably boric acid; Other sour consumption makes the pH value of electroforming solution reach required interior the getting final product of scope.
According to the present invention, electroforming solution is the aqueous solution that contains boric acid, nickel chloride and nickel sulfamic acid, and wherein, the content of boric acid is the 10-50 grams per liter, and the content of nickel chloride is the 1-10 grams per liter, and the content of nickel sulfamic acid is the 300-600 grams per liter; The metal of described electroforming is a nickel.And, can also contain lauryl sodium sulfate and saccharin sodium in the above-mentioned electroforming solution.
The condition of described electroforming is: current density is 0.5-5A/dm
2, the electroforming time is 120-600 minute.Be preferably: current density is 2-4A/dm
2, the electroforming time is 180-300 minute.Under the preferable case, the condition of electroforming comprises that also the electroforming temperature is 30-70 ℃, is preferably 40-60 ℃.Obtain the metal level that thickness is 50-200um, above-mentioned metal layer thickness can be controlled by control electroforming time and current strength.
Usually, when being equipped with mother matrix by layout mechanism, the version seam between each fritter layout is extremely difficult to be eliminated.By a large amount of experiments, the inventor finds, when preparing seamless wide cut contour forging mother matrix by method disclosed by the invention, though still can exist version to stitch when adopting the layout machine on coating, impress,, the present inventor is by the viscosity of control coating, and behind the hologram line, leave standstill 0.5-2h, by the self-leveling energy of coating, the version seam part levelling that layout impression is produced is eliminated, and impresses in the holographic pattern of coating surface and can not change.Thereby make on the seamless wide cut contour forging mother matrix after the metallization seamless, seamless on the seamless wide cut holographic film by this seamless wide cut contour forging mother matrix preparation.Improved product quality.When preparing seamless wide cut contour forging mother matrix by this method, its size is unrestricted, can increase the size of seamless wide cut holographic film greatly.
According to the present invention, the thickness of described hologram lamina is 0.5-2um.The thickness of above-mentioned hologram lamina can be controlled by the thickness that control is coated in substrate surface coating.Though, can be after forming dope layer on the base material through impression, this step is less to the thickness effect of dope layer, in the present invention, can ignore, and thinks that directly the thickness of dope layer is the thickness of the hologram lamina of formation.The thickness of dope layer can be controlled by the amount that applies coating on the control unit are, and this control method is for well known to a person skilled in the art.
The inventor finds, the thickness of the hologram lamina that forms behind the paint solidification is in above-mentioned scope the time, and is very favourable to the levelling of the lines that keeps holographic pattern and version seam.
The invention also discloses a kind of seamless wide cut contour forging mother matrix, this is seamless, and wide cut contour forging mother matrix obtains by method for preparing, comprises base material, is positioned at the hologram lamina of substrate surface and is positioned at the metal level of holographic pattern laminar surface.
Under the preferable case, this is seamless, and wide cut contour forging reticle dimension is 400mm * 400mm-1500mm * 1500mm.Than various seamless wide cut contour forging mother matrixs of the prior art or seamless wide cut holographic film, the seamless wide cut contour forging mother matrix of method disclosed by the invention preparation or be not subjected to the restriction of size by the seamless wide cut holographic film of this seamless wide cut contour forging mother matrix preparation, can accomplish 400mm * 400mm-1500mm * 1500mm, even bigger, broken through the bottleneck of seamless wide cut contour forging mother matrix of the prior art or seamless wide cut holographic film.
According to the present invention, the base material that is adopted can adopt this area various base materials commonly used, as can be in polymethyl methacrylate (PMMA), Merlon (PC), the polyester (PET) a kind of.Above-mentioned base material all can be commercially available, and the thickness of producing as GE company is the Merlon (PC) of 0.3mm.Above-mentioned metal level contains nickel.
Equally, prepare large-sized seamless wide cut contour forging mother matrix by method disclosed by the invention after, can adopt this seamless wide cut contour forging mother matrix to prepare the large scale seamless holographic films.The preparation method can be the whole bag of tricks commonly used in the prior art, impresses on the plastic basis material surface as adopting this seamless wide cut contour forging mother matrix, perhaps applies coating at substrate surface, impresses at coating surface then, coating is cured again; Also can apply coating, then coating is cured, impress at coating surface again and get final product at substrate surface.
The method of impression is included on the surface of the material of on the moulding press holographic pattern on the seamless wide cut contour forging mother matrix being transferred to holographic pattern to be formed, forms seamless wide cut holographic film.The temperature of described mold pressing can be 40-200 ℃, is preferably 100-160 ℃, and the pressure of mold pressing can be 50-400MPa, is preferably 200-300MPa, the speed of mold pressing can for 10-100 rice/minute, be preferably 20-50 rice/minute.
Prepare seamless wide cut contour forging mother matrix by method disclosed by the invention, can overcome prior art and can not realize large scale and seamless bottleneck, realize that the contour forging mother matrix has very large size, the surface is seamless simultaneously.
The present invention is further illustrated below by embodiment.
Embodiment 1
Present embodiment is used to illustrate the preparation method of seamless wide cut contour forging mother matrix disclosed by the invention.
Get the polyester film base material (the PC film that GE produces, thickness is 0.3mm) of 1200mm * 1200mm, adopt line rod spreader to apply UV photocureable coating (25 ℃ time viscosity be 1200mPas) on its surface, form the thick dope layer of 0.8um.
The base material that the surface is had dope layer places the layout machine, and the size of fritter layout is 3 * 7cm, and the layout precision is 0.2mm, adjusting pressure is 0.8Mpa, and temperature is 75 ℃, and the impression time is 8s, at coating surface layout hologram line, leave standstill 1.6h then at normal temperatures, obtain coating figure lamina.
The PET base material that the surface is had coating figure lamina places ultra-violet curing lamp system (the F300 ultra-violet curing lamp system that FUSION company produces), and adopting energy is the high-pressure sodium lamp curing 20s of 2KW.Obtain the hologram lamina.
The hologram lamina is sprayed silver handle, obtain seamless wide cut contour forging mother matrix precursor, then seamless wide cut contour forging mother matrix precursor is put into electroforming solution as negative electrode, the metal of need electroforming is put into electroforming solution as anode, connect power supply, carry out electroforming.
Electroforming solution contains the amino semi-annular jade pendant acid nickel of promising 500g/L, the nickel chloride of 8g/L, the boric acid of 40g/L, the lauryl sodium sulfate of 0.1g/L and the saccharin sodium of 0.2g/L.Regulating the electroforming current density is 4.5A/dm
2,, obtain the thick nickel metal layer of 160um 65 ℃ of following electroforming 400 minutes.
Obtain seamless wide cut contour forging mother matrix S1, wherein base material thickness is 0.3mm, and the holographic pattern layer thickness is 0.8um, and metal layer thickness is 160um.The perusal mother matrix is seamless, and holographic lines is clear.
Embodiment 2
Present embodiment is used to illustrate the preparation method of seamless wide cut contour forging mother matrix disclosed by the invention.
Get polyester film base material (the PET film that Foshan dupont Hongji Membrane Co., Ltd produces of 1500mm * 1500mm, thickness is 1mm), adopt line rod spreader to apply UV photocureable coating (25 ℃ time viscosity be 2700mPas) on its surface, form the thick dope layer of 1.2um.
The PET base material that the surface is had dope layer places the layout machine, the size of fritter layout is 3 * 7cm, the layout precision is 0.1mm, adjusting pressure is 0.2Mpa, temperature is 55 ℃, and the impression time is 3s, at coating surface layout hologram line, leave standstill 0.8h then at normal temperatures, obtain coating figure lamina.
The PET base material that the surface is had coating figure lamina places ultra-violet curing lamp system (the F300 ultra-violet curing lamp system that FUSION company produces), adopts the high-pressure sodium lamp of 2KW to solidify 10s.Obtain the hologram lamina.
The hologram lamina is sprayed silver handle, obtain seamless wide cut contour forging mother matrix precursor, then seamless wide cut contour forging mother matrix precursor is put into electroforming solution as negative electrode, the metal of need electroforming is put into electroforming solution as anode, connect power supply, carry out electroforming.
Electroforming solution contains the amino semi-annular jade pendant acid nickel of promising 350g/L, the nickel chloride of 4g/L, the boric acid of 20g/L, the lauryl sodium sulfate of 0.1g/L and the saccharin sodium of 0.2g/L.Regulating the electroforming current density is 3A/dm
2,, obtain the thick nickel metal layer of 80um 35 ℃ of following electroforming 150 minutes.
Obtain seamless wide cut contour forging mother matrix S2, wherein base material thickness is 1mm, and the holographic pattern layer thickness is 1.2um, and metal layer thickness is 80um.The perusal mother matrix is seamless, and holographic lines is clear.
Embodiment 3
Present embodiment is used to illustrate the preparation method of seamless wide cut contour forging mother matrix disclosed by the invention.
Get Merlon film base material (the PC film that Foshan dupont Hongji Membrane Co., Ltd produces of 800mm * 800mm, thickness is 0.5mm), adopt line rod spreader to apply UV photocureable coating (25 ℃ time viscosity be 2400mPas) on its surface, form the thick dope layer of 1.5um.
The PET base material that the surface is had dope layer places the layout machine, the size of fritter layout is 3 * 7cm, the layout precision is 0.8mm, adjusting pressure is 0.5Mpa, temperature is 62 ℃, and the impression time is 5s, at coating surface layout hologram line, leave standstill 1.2h then at normal temperatures, obtain coating figure lamina.
The PET base material that the surface is had coating figure lamina places ultra-violet curing lamp system (the F300 ultra-violet curing lamp system that FUSION company produces), adopts the high-pressure sodium lamp of 2KW to solidify 15s.Obtain the hologram lamina.
The hologram lamina is sprayed silver handle, obtain seamless wide cut contour forging mother matrix precursor, then seamless wide cut contour forging mother matrix precursor is put into electroforming solution as negative electrode, the metal of need electroforming is put into electroforming solution as anode, connect power supply, carry out electroforming.
Electroforming solution contains the amino semi-annular jade pendant acid nickel of promising 400g/L, the nickel chloride of 6g/L, the boric acid of 30g/L, the lauryl sodium sulfate of 0.1g/L and the saccharin sodium of 0.2g/L.Regulating the electroforming current density is 3A/dm
2,, obtain the thick nickel metal layer of 120um 50 ℃ of following electroforming 200 minutes.
Obtain seamless wide cut contour forging mother matrix S3, wherein base material thickness is 0.5mm, and the holographic pattern layer thickness is 1.5um, and metal layer thickness is 120um.The perusal mother matrix is seamless, and holographic lines is clear.
Embodiment 4
Present embodiment is used to illustrate the preparation method of seamless wide cut contour forging mother matrix disclosed by the invention.
Get polymethyl methacrylate film base material (the PMMA film that Aomei Optical Co., Ltd produces of 1000mm * 1000mm, thickness is 1mm), adopt line rod spreader to apply UV photocureable coating (25 ℃ time viscosity be 2100mPas) on its surface, form the thick dope layer of 1.2um.
The PET base material that the surface is had dope layer places the layout machine, the size of fritter layout is 3 * 7cm, the layout precision is 0.6mm, adjusting pressure is 0.5Mpa, temperature is 65 ℃, and the impression time is 5s, at coating surface layout hologram line, leave standstill 1.2h then at normal temperatures, obtain coating figure lamina.
The PET base material that the surface is had coating figure lamina places ultra-violet curing lamp system (the F300 ultra-violet curing lamp system that FUSION company produces), and adopting energy is the high-pressure sodium lamp curing 25s of 2KW.Obtain the hologram lamina.
The hologram lamina is sprayed silver handle, obtain seamless wide cut contour forging mother matrix precursor, then seamless wide cut contour forging mother matrix precursor is put into electroforming solution as negative electrode, the metal of need electroforming is put into electroforming solution as anode, connect power supply, carry out electroforming.
Electroforming solution contains the amino semi-annular jade pendant acid nickel of promising 450g/L, the nickel chloride of 5g/L, the boric acid of 35g/L, the lauryl sodium sulfate of 0.1g/L and the saccharin sodium of 0.2g/L.Regulating the electroforming current density is 3A/dm
2,, obtain the thick nickel metal layer of 140um 50 ℃ of following electroforming 210 minutes.
Obtain seamless wide cut contour forging mother matrix S4, wherein base material thickness is 1mm, and the holographic pattern layer thickness is 1.2um, and metal layer thickness is 140um.The perusal mother matrix is seamless, and holographic lines is clear.
Comparative Examples 1
This Comparative Examples is used for the preparation method of comparative illustration seamless wide cut contour forging mother matrix disclosed by the invention.
The preparation method of seamless wide cut contour forging mother matrix is identical with embodiment 3, and different is: the Merlon film base material is of a size of 400mm * 400mm; And, behind coating surface layout hologram line,, directly solidify without leaving standstill processing.
Obtain wide cut contour forging mother matrix D1, find to exist on the mother matrix significantly version seam by perusal.
Comparative Examples 2
This Comparative Examples is used for the preparation method of comparative illustration seamless wide cut contour forging mother matrix disclosed by the invention.
The preparation method of seamless wide cut contour forging mother matrix is identical with embodiment 3, and different is: the viscosity of the UV photocureable coating that is adopted in the time of 25 ℃ is 800mPas.
Obtain wide cut contour forging mother matrix D2, by seamless on the perusal discovery mother matrix, but hologram pattern is fuzzyyer.
Prepare seamless wide cut contour forging mother matrix by method disclosed by the invention, can overcome prior art and can not realize large scale and seamless bottleneck, realize that the contour forging mother matrix has very large size, the surface is seamless simultaneously.
Claims (10)
1. the preparation method of a seamless wide cut contour forging mother matrix comprises:
A, on base material, apply coating, form dope layer; Wherein, the viscosity of described coating in the time of 25 ℃ is 1000-3000mPas;
B, the surface is had the fritter layout combination of holographic lines, form required holographic pattern; Adopt the fritter layout after making up on dope layer, to impress described holographic pattern, leave standstill 0.5-2h then, obtain coating figure lamina;
C, described coating figure lamina is solidified, obtain the hologram lamina;
D, the holographic pattern laminar surface is metallized, form metal level, obtain seamless wide cut contour forging mother matrix.
2. preparation method according to claim 1 is characterized in that: described base material is a kind of in polymethyl methacrylate, Merlon, the polyester, and its thickness is 0.2-2.0mm.
3. preparation method according to claim 1 is characterized in that: described coating is the UV photocureable coating; The curing of described UV photocureable coating is: adopt the high-pressure sodium lamp of 2KW to solidify 5-30s.
4. preparation method according to claim 1 is characterized in that: the thickness of described dope layer is 0.5-2um.
5. preparation method according to claim 1 is characterized in that: in the described fritter layout anabolic process, the layout precision is 0-0.2mm.
6. preparation method according to claim 1 is characterized in that: described on dope layer the method for hologram line be: 50-80 ℃ temperature, the pressure of 0.1-1Mpa is impression 1-10s down.
7. preparation method according to claim 1 is characterized in that: the holographic pattern laminar surface is carried out metallized method be included in holographic pattern laminar surface spray silver, obtain seamless wide cut contour forging mother matrix precursor, electroforming then forms metal level.
8. preparation method according to claim 7 is characterized in that: described electrocasting method is: in electroforming solution, spraying seamless wide cut contour forging mother matrix precursor behind the silver as negative electrode,, connect power supply and carry out electroforming as anode with the metal of need electroforming; The condition of electroforming is: current density is 0.5-5A/dm
2, the electroforming time is 120-600 minute.
9. preparation method according to claim 8, it is characterized in that: described electroforming solution is the aqueous solution that contains boric acid, nickel chloride and nickel sulfamic acid, and wherein, the content of boric acid is the 10-50 grams per liter, the content of nickel chloride is the 1-10 grams per liter, and the content of nickel sulfamic acid is the 300-600 grams per liter.
10. preparation method according to claim 8 is characterized in that: the metal that described electroforming is used is a nickel, and the metal layer thickness of formation is 50-200um.
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