WO2014207822A1 - Carte à câblage imprimé - Google Patents

Carte à câblage imprimé Download PDF

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Publication number
WO2014207822A1
WO2014207822A1 PCT/JP2013/067373 JP2013067373W WO2014207822A1 WO 2014207822 A1 WO2014207822 A1 WO 2014207822A1 JP 2013067373 W JP2013067373 W JP 2013067373W WO 2014207822 A1 WO2014207822 A1 WO 2014207822A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
wiring board
printed wiring
insulating base
insulating
Prior art date
Application number
PCT/JP2013/067373
Other languages
English (en)
Japanese (ja)
Inventor
光昭 戸田
和男 志々目
英里 馬場
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2013/067373 priority Critical patent/WO2014207822A1/fr
Publication of WO2014207822A1 publication Critical patent/WO2014207822A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits

Definitions

  • the present invention relates to a foldable printed wiring board having a laminated structure composed of a plurality of metal layers and insulating layers.
  • a flexible substrate with flexibility In order to realize a structure (Flex to Install structure) that can be folded and incorporated in various electric / electronic devices, a flexible substrate with flexibility, a relatively hard rigid substrate without flexibility, and Various substrates such as a bonded substrate obtained by bonding a flexible substrate or a rigid flex substrate obtained by integrating the flexible substrate and the rigid substrate without forming a bonded portion have been used.
  • a substrate used for limited bending applications, a substrate is known in which a rigid substrate is subjected to spot facing with a cutting tool such as an end mill and the opening formed by the spot facing is bent at a bending point. ing.
  • a cutting tool such as an end mill
  • the opening formed by the spot facing is bent at a bending point.
  • a prepreg which is a base material in a state in which one glass cloth is impregnated in a thermosetting resin such as an epoxy resin and then heat-dried and semi-cured.
  • Patent Document 1 discloses a printed circuit board using such a foldable structure.
  • a specific material may have a specific thickness for the minimum thickness portion of the printed wiring board, which is a portion subjected to spot facing processing. It is requested.
  • the prepreg in the UL (Underwriters Laboratories Inc) standard that guarantees the safety of electrical products in the United States, when the above-mentioned prepreg is used for the minimum thickness portion of a printed wiring board, the prepreg alone is about 200 ⁇ m. The thickness is required.
  • the bent portion is constituted by only one prepreg having a thickness of about 200 ⁇ m, it becomes difficult to form a plurality of wiring layers in the bent portion.
  • a signal layer and a ground layer made of a conductive material such as copper foil are provided on a printed wiring board as a plurality of wiring layers, a configuration in which two prepregs having a thickness of 100 ⁇ m are simply arranged in a bent portion. Then, the bending characteristic of the printed wiring board was deteriorated.
  • the present invention has been made in view of such problems, and an object of the present invention is to provide a printed wiring board having a plurality of wiring layers and capable of improving bending characteristics.
  • a printed wiring board of the present invention includes a first insulating base material made of resin alone, an insulator with a copper foil made of a copper foil formed on the surface of the first insulating base material, And a plurality of second insulating base materials made of glass cloth and resin covered by the glass cloth are alternately laminated on the first insulating base material, and the contact surface with the insulator with copper foil A laminate in which an opening is formed from the surface on the opposite side toward the inside, and one sheet is provided in a region between the bottom surface of the opening and the copper foil on the insulating resin body with the copper foil.
  • the glass cloth and the resin constituting the plurality of second insulating bases only exist, and the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with copper foil is 170 ⁇ m or more and 230 ⁇ m It is characterized by the following.
  • the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with the first copper foil is preferably 200 ⁇ m.
  • the thickness of the first insulating base material is preferably 40 ⁇ m or more and 60 ⁇ m or less.
  • the printed wiring board according to the present invention on the bottom surface side of the printed wiring board, copper foils are formed on the front and back surfaces of the first insulating base material not including the glass cloth. Therefore, in the printed wiring board, only two types of copper foil and resin having different elastic moduli exist between the two copper foils arranged on the bottom surface side of the printed wiring board. Compared with the case of using a prepreg including a glass cloth between two copper foils, it is possible to reduce stress strain caused by the difference in elastic modulus of various materials between the two copper foils.
  • the resin layer present in the bent portion includes a resin layer made of the first insulating base material and a second insulating layer.
  • the base material and the resin layer which consists of a part of 2nd insulating base material exist. That is, since only the resin layer including one glass cloth, the resin layer not including the glass cloth, and the two copper foils are present in the bent part, the bent part has 2 Compared with a structure in which one or more glass cloths are present, it is possible to reduce stress strain at the bent portion of the printed wiring board.
  • the copper foil is peeled from the first insulating base material by reducing the stress strain caused by the difference in elastic modulus of various materials between the two copper foils. Can be prevented.
  • the printed wiring board according to the present invention includes a plurality of wiring layers and can easily improve the bending characteristics.
  • FIG. 3 is a partially enlarged view of a cross section taken along line III-III in FIG. It is a front view which shows the use condition of the printed wiring board which concerns on the Example of this invention.
  • FIG. 1 is a plan view of the printed wiring board 1 according to the present embodiment.
  • FIG. 2 is a front view of the printed wiring board 1 according to this embodiment.
  • the printed wiring board 1 is a flat board having a rectangular planar shape. Further, in the printed wiring board 1, the opening 2 is formed in the central portion of the printed wiring board 1 so as to be parallel to the short side in the plan view of FIG. 1. As can be seen from FIGS. 1 and 2, the opening 2 extends from one of the long sides toward the other in the plan view of FIG. 1 and is formed on the first surface 1 a side of the printed wiring board 1. It does not reach the second surface 1b of the wiring board 1.
  • the printed wiring board 1 has relatively hard characteristics as a whole, but the opening 2 is formed at the center of the board, so that the opening 2 is bent (the center of bending). And can be bent easily.
  • the usage state of the printed wiring board 1 will be described later.
  • the first surface 1 a of the printed wiring board 1 has a plurality of wiring patterns, various types of electricity such as resistors, capacitors, and semiconductor elements. -Terminals for mounting electronic parts are formed.
  • the planar shape of the printed wiring board 1 is not limited to a rectangular shape, and can be appropriately changed according to the opening shape of the electric / electronic device in which the printed wiring board 1 is built.
  • FIG. 3 is a partially enlarged view of a cross section taken along line III-III in FIG.
  • the printed wiring board 1 includes a first insulating base 3 and a copper foil 4 formed on the first surface (front surface) 3 a of the first insulating base 3.
  • 1 insulator 5 with copper foil laminate 17 in which copper foils 6 to 11 and second insulating substrates 12 to 16 are alternately laminated, and first insulating substrate 18 and first insulating substrate 18
  • the first copper foil insulator 5 is obtained by coating an electrolytic copper foil that is the copper foil 4 with a resin such as an epoxy resin. Not included. That is, the 1st insulating base material 3 is comprised only from an epoxy resin, and the insulator 5 with a 1st copper foil is also generally called RCC (Resin
  • the copper foil 4 is formed on the entire surface of the first surface 3a of the first insulating base 3 and functions as a ground layer (ground potential layer).
  • the layer thickness of the copper foil 4 is about 30 to 40 ⁇ m, and the layer thickness of the first insulating substrate 3 is about 40 ⁇ m to 60 ⁇ m.
  • a better impedance matching is achieved by setting the layer thickness of the first insulating base material 3 to about 50 ⁇ m.
  • the first insulating base material 3 does not necessarily need to be composed of only a resin. If the base material does not include a glass cloth or the like, other insulating materials that improve the insulation and other characteristics are resin. It may be dispersed and held within.
  • the second copper foil insulator 20 has the same configuration as the first copper foil insulator 5 and is the RCC described above. That is, the insulator 20 with the second copper foil is obtained by coating the copper foil 19 as an electrolytic copper foil with a resin (for example, epoxy resin), and the inside thereof includes a substrate such as a glass cloth. Not. As a difference between the insulator 20 with the second copper foil and the insulator 5 with the first copper foil, a desired wiring pattern is formed on the copper foil 19 constituting the insulator 20 with the second copper foil. In particular, the copper foil 19 is not formed in the opening 2 and its periphery.
  • a resin for example, epoxy resin
  • the printed wiring board 1 is not necessarily provided with the insulator 20 with the second copper foil.
  • the insulator with the second copper foil is used depending on the use of the printed wiring board 1 and required dimensions. 20 may not be laminated. That is, the printed wiring board 1 may have a structure in which only the stacked body 17 is stacked on the first insulator 5 with copper foil.
  • the laminated body 17 includes a copper foil 6, a second insulating base 12, a copper foil 7, a second insulating base 13, a copper foil 8, and a second insulating base on the second surface 3b of the first insulating base 3.
  • Each component is laminated in the order of the material 14, the copper foil 9, the second insulating base material 15, the copper foil 10, the second insulating base material 16, and the copper foil 11.
  • the second insulating base materials 12 to 16 are so-called one prepreg in which a glass cloth 21 is coated with a resin 22 (for example, epoxy resin).
  • the copper foil 6 is formed on the entire surface of the second surface 3b of the first insulating base 3, and functions as a wiring for an electrical signal (that is, a signal layer) supplied from the outside of the printed wiring board 1.
  • the copper foils 7 to 11 function as internal wiring of the printed wiring board 1 and are subjected to desired patterning.
  • the copper foil 4 as a ground layer or the copper foil as a signal layer is formed by a conductive via (not shown). 6 is electrically connected.
  • the copper foils 7 to 11 are not formed in the formation region of the opening 2 and the periphery thereof, and a desired opening (wiring pattern) is formed.
  • the resin 22 constituting the adjacent second insulating base materials 12 to 16 is subjected to heating and pressurization by a vacuum press for fixing each layer. It flows and hardens, filling each of the openings.
  • the number of laminated second insulating base materials and copper foils in the laminate 17 is not limited to that shown in FIG. 4, and is appropriately determined according to the use of the printed wiring board 1 and the required dimensions. Can be changed. Further, the copper foil 6 may function as a ground layer instead of a signal layer. In such a case, the copper foil 4 constituting the first insulator 5 with copper foil functions as a signal layer.
  • the layer thickness of the second insulating substrate 12 is about 150 ⁇ m
  • the layer thickness of the second insulating substrates 13 to 16 is about 70 to 200 ⁇ m.
  • the layer thickness of the copper foils 6 to 11 is about 18 to 35 ⁇ m.
  • an anchor of about 1 ⁇ m is formed on the first surface 6 a that contacts the first insulating substrate 3, and about 5 ⁇ m is formed on the second surface 6 b that contacts the second insulating substrate 12.
  • An anchor is formed. That is, in the copper foil 6, the roughness of the first surface 6 a that contacts the first insulating substrate 3 is smaller than the roughness of the second surface 6 b that contacts the second insulating substrate 12.
  • the opening 2 formed in the central portion of the printed wiring board 1 passes through the insulator 20 with the second copper foil and reaches the second insulating substrate 13 of the laminate 17.
  • the opening 2 includes the first insulating base 18, the resins 22 of the second insulating bases 14 to 16, the glass cloths 21 of the second insulating bases 13 to 16, and the second insulating base. It is formed by removing a part of the resin of the material 13 and reaches the resin 22 located on the copper foil 7 and the second insulating base 12 side rather than the glass cloth 21 of the second insulating base 13. Yes.
  • the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is 170 ⁇ m or more and 230 ⁇ m or less.
  • the copper foil 6 is formed from the bottom surface 2 a of the opening 2.
  • the distance is preferably about 200 ⁇ m.
  • the reason why the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is about 200 ⁇ m is that the minimum laminated thickness (first insulation) of the printed wiring board 1 in the UL standard that guarantees the safety of electrical products in the United States. This is because the resin layer of only the epoxy resin such as the base material and the copper foil is defined as 200 ⁇ m.
  • the layer thickness of the second insulating base material 12 that is a prepreg is about 150 ⁇ m, and the second insulating base material 13 in a portion where the opening 2 is not formed (that is, a region immediately below the opening 2).
  • the layer thickness of the resin 22 filling the opening of the copper foil 7 is about 18 ⁇ m, which is the layer thickness of the copper foil 7.
  • the second insulating base materials 12 to 16 which are prepregs and the copper foils 7 to 10 which have been subjected to desired patterning are sequentially laminated and laminated. These members are fixed by heating and pressurizing these members with a vacuum press. Thereafter, the copper foil 6 is affixed on the surface of the second insulating substrate 12, and the patterned copper foil 11 is affixed on the surface of the second insulating substrate 16. Thereby, formation of the laminated body 17 is completed. When forming the laminate 17, formation and patterning of conductive vias for the copper foils 6 to 11 are appropriately performed.
  • the laminated body 17 is sandwiched between the insulator 5 with the first copper foil and the insulator 20 with the second copper foil, and is heated and pressurized by a vacuum press, whereby the first insulating base of the insulator 5 with the first copper foil.
  • the material 3 and the copper foil 6 are fixed, the first insulating substrate 18 of the insulator 20 with the second copper foil and the copper foil 11 are fixed, and the laminated structure of the printed wiring board 1 is completed.
  • spot facing is performed from the surface on which the copper foil 19 of the insulator 20 with the second copper foil is formed, and the opening 2 is formed.
  • the place where the spot facing is performed is a central portion of the printed wiring board 1 where the copper foil 19 is not formed (exposed portion of the first insulating base material 18).
  • the said spot facing process penetrates the glass cloth 21 of the 2nd insulating base material 13, removes a part of resin 22 of the 2nd insulating base material 13, and is completed.
  • the amount of spot facing is adjusted so that the distance from the bottom surface 2a of the opening 2 to the surface of the copper foil 6 is about 200 ⁇ m.
  • the printed wiring board 1 on the second surface 1 b side of the printed wiring board 1, the front and back surfaces (first surface) of the first insulating base material 3 that does not include the glass cloth 21.
  • a copper foil 4 as a ground layer and a copper foil 6 as a signal layer are formed on 3a and the second surface 3b). Therefore, in the printed wiring board 1, only the copper foil and the resin, which are two kinds of materials having different elastic moduli, exist between the copper foils 4 and 6, and the glass cloth is interposed between the copper foils 4 and 6. Compared with the case where the prepreg containing 21 is used, the stress distortion resulting from the difference in the elastic modulus of the various materials between the copper foils 4 and 6 can be reduced.
  • the resin layer existing in the bent portion in FIG. 4 the resin layer made of the first insulating base material 3, the second insulating base material 12, 2
  • a resin layer made of a part of the insulating base material 13 That is, only the resin layer containing one glass cloth 21 (that is, one prepreg), the resin layer not containing glass cloth, and the copper foils 4 and 6 exist in the bent portion in FIG. Therefore, compared with a structure in which two or more glass cloths 21 exist in the bent part (that is, a structure in which two or more prepregs exist), the stress strain in the bent part of the printed wiring board 1 is reduced. Can be reduced.
  • the second insulating base material 13 is laminated via the copper foil 6 on the first insulating base material 3 made of only the resin not including the glass cloth 21. Therefore, a structure in which only one prepreg exists in the bent portion of the printed wiring board 1 while the ground layer and the signal layer are formed on the outer layer (that is, the second surface 1b side) of the printed wiring board 1 in a bent state. Has been realized.
  • the roughness of the first surface 6 a that contacts the first insulating base 3 is the second surface 6 b that contacts the second insulating base 12. It is smaller than the roughness. From such a structure, the adhesion between the first insulating base 3 and the copper foil 6 not including the glass cloth 21 is weak, and the copper foil 6 may be peeled off from the first insulating base 3. Since the base material 3 does not include the glass cloth 21, the stress strain caused by the difference in elastic modulus of various materials in the first insulating base material 3 can be reduced, and the peeling of the copper foil 6 can be reduced.
  • the printed wiring board 1 according to the present embodiment has the above-described structure, and thus includes a plurality of wiring layers and can easily improve the bending characteristics.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne une carte à câblage imprimé comprenant : un isolant (5) à feuille de cuivre, comprenant un premier substrat isolant (3) constitué de résine, et de feuille de cuivre (4) formée sur la surface du premier substrat isolant ; et un stratifié (17) dans lequel une pluralité de feuilles de cuivre (6 à 11) et une pluralité de seconds substrats isolants (12 à 16) comprenant du tissu de verre (21) et de la résine (22) recouverte par le tissu de verre, sont empilés alternativement sur le premier substrat isolant, et une partie d'ouverture (2) est formée vers l'intérieur à partir de la surface du côté opposé à la surface de contact avec l'isolant à feuille de cuivre. Dans la région entre la bas de la partie d'ouverture et la feuille de cuivre sur le corps de résine isolant avec feuille de cuivre, il n'existe qu'une seule feuille de tissu de verre et de résine constituant une pluralité des seconds substrats isolants, et la distance entre le bas de la partie d'ouverture et la surface de la feuille de cuivre sur le corps de résine isolant avec feuille de cuivre est supérieure ou égale à 170 μm et inférieure ou égale à 230 μm.
PCT/JP2013/067373 2013-06-25 2013-06-25 Carte à câblage imprimé WO2014207822A1 (fr)

Priority Applications (1)

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PCT/JP2013/067373 WO2014207822A1 (fr) 2013-06-25 2013-06-25 Carte à câblage imprimé

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PCT/JP2013/067373 WO2014207822A1 (fr) 2013-06-25 2013-06-25 Carte à câblage imprimé

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WO2014207822A1 true WO2014207822A1 (fr) 2014-12-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104602444A (zh) * 2015-01-29 2015-05-06 高德(苏州)电子有限公司 一种汽车用多层叠构线路板及其制作方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04213888A (ja) * 1990-02-05 1992-08-04 Carl Freudenberg:Fa 硬・軟質プリント基板の製造方法
JPH08125342A (ja) * 1994-10-21 1996-05-17 Nec Corp フレキシブル多層配線基板とその製造方法
JPH1126945A (ja) * 1997-07-07 1999-01-29 Toagosei Co Ltd 多層プリント配線板の製造方法
JP2003031950A (ja) * 2001-07-12 2003-01-31 Sony Corp 多層配線基板及びその製造方法
JP2007096131A (ja) * 2005-09-29 2007-04-12 Toshiba Corp プリント配線板
JP2010518649A (ja) * 2007-02-16 2010-05-27 アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフト フレキ−リジッドプリント回路基板を製造する方法、およびフレキ−リジッドプリント回路基板
JP2012516039A (ja) * 2009-01-27 2012-07-12 デイー・シー・シー−デイベロツプメント・サーキツツ・エンド・コンポーネンツ・ゲー・エム・ベー・ハー 多層プリント回路基板を製造する方法、接着防止材料、多層プリント回路基板、およびそのような方法の使用
JP2013098536A (ja) * 2011-10-31 2013-05-20 Tripod Technology Corp 折り曲げ式プリント回路基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04213888A (ja) * 1990-02-05 1992-08-04 Carl Freudenberg:Fa 硬・軟質プリント基板の製造方法
JPH08125342A (ja) * 1994-10-21 1996-05-17 Nec Corp フレキシブル多層配線基板とその製造方法
JPH1126945A (ja) * 1997-07-07 1999-01-29 Toagosei Co Ltd 多層プリント配線板の製造方法
JP2003031950A (ja) * 2001-07-12 2003-01-31 Sony Corp 多層配線基板及びその製造方法
JP2007096131A (ja) * 2005-09-29 2007-04-12 Toshiba Corp プリント配線板
JP2010518649A (ja) * 2007-02-16 2010-05-27 アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフト フレキ−リジッドプリント回路基板を製造する方法、およびフレキ−リジッドプリント回路基板
JP2012516039A (ja) * 2009-01-27 2012-07-12 デイー・シー・シー−デイベロツプメント・サーキツツ・エンド・コンポーネンツ・ゲー・エム・ベー・ハー 多層プリント回路基板を製造する方法、接着防止材料、多層プリント回路基板、およびそのような方法の使用
JP2013098536A (ja) * 2011-10-31 2013-05-20 Tripod Technology Corp 折り曲げ式プリント回路基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104602444A (zh) * 2015-01-29 2015-05-06 高德(苏州)电子有限公司 一种汽车用多层叠构线路板及其制作方法

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