WO2014199541A1 - 熱電変換モジュール - Google Patents
熱電変換モジュール Download PDFInfo
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- WO2014199541A1 WO2014199541A1 PCT/JP2014/001513 JP2014001513W WO2014199541A1 WO 2014199541 A1 WO2014199541 A1 WO 2014199541A1 JP 2014001513 W JP2014001513 W JP 2014001513W WO 2014199541 A1 WO2014199541 A1 WO 2014199541A1
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- conversion module
- interlayer insulating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
Definitions
- thermoelectric conversion module This disclosure relates to a thermoelectric conversion module.
- thermoelectric conversion element included in the thermoelectric conversion module for example, there is a P-type or N-type thermoelectric conversion element configured by filling a P-type or N-type thermoelectric conversion portion inside a hollow cylindrical insulator (for example, , See Patent Document 1).
- a P-type or N-type thermoelectric conversion element configured by filling a P-type or N-type thermoelectric conversion portion inside a hollow cylindrical insulator (for example, , See Patent Document 1).
- the P-type and N-type thermoelectric conversion units are electrically connected in series with each other.
- thermoelectric conversion module when a temperature difference is provided on both surfaces of the thermoelectric conversion module, a heat flow is generated from one surface on the high temperature side to the other surface on the low temperature side of the temperature difference.
- the heat flow flows through the P-type and N-type thermoelectric conversion elements, electric power is generated due to a phenomenon (Seebeck effect) in which a voltage proportional to the temperature difference between both ends of the P-type and N-type thermoelectric conversion elements is generated.
- the periphery of the P-type and N-type thermoelectric converters is covered with an insulator. Therefore, an electrical short circuit between adjacent P-type and N-type thermoelectric conversion units can be prevented, and the pitch of the P-type and N-type thermoelectric conversion elements can be minimized and arranged at high density.
- thermoelectric conversion module when a temperature difference is provided, the heat flow generated by the temperature difference is also transmitted to the insulator disposed so as to cover the side surfaces of the P-type and N-type thermoelectric conversion units. . Therefore, there is a problem that the amount of heat flowing through the P-type and N-type thermoelectric conversion units decreases, and the thermoelectric conversion efficiency of the thermoelectric conversion module decreases.
- the ratio of the cross-sectional area of the P-type and N-type thermoelectric conversion parts to the cross-sectional area of the insulator in the short direction of the thermoelectric conversion element is 1: 1, and the heat conduction of the P-type and N-type thermoelectric conversion parts
- the rate is 1.4 W / mK and the thermal conductivity of the insulator is 0.6 W / mK
- the amount of heat flowing through the P-type and N-type thermoelectric converters is reduced by about 40%.
- the present disclosure solves the above-described problem, and suppresses the amount of heat flowing through the insulator, increases the amount of heat flowing through the P-type and N-type thermoelectric conversion units, and improves the thermoelectric conversion efficiency.
- the purpose is to provide modules.
- thermoelectric conversion module is a thermoelectric conversion module including P-type and N-type thermoelectric conversion elements disposed between two laminated substrates
- the P-type thermoelectric conversion element is A columnar P-type thermoelectric converter; An insulator provided on a side surface of the P-type thermoelectric converter; A diffusion prevention film provided on the top surface which is a surface different from the side surface of the P-type thermoelectric conversion unit;
- the N-type thermoelectric conversion element is A columnar N-type thermoelectric converter; An insulator provided on a side surface of the N-type thermoelectric converter; A diffusion preventing film provided on a top surface which is a surface different from the side surface of the N-type thermoelectric conversion unit;
- Each of the laminated substrates is A wiring layer that electrically connects the P-type and N-type thermoelectric conversion portions via the diffusion prevention film; A bonding material for bonding the diffusion prevention film and the wiring layer; With In the direction connecting the upper and lower top surfaces of the P-type or N-type
- thermoelectric conversion module can suppress the amount of heat flowing through the insulator, increase the flow rate flowing through the P-type and N-type thermoelectric conversion units, and improve the thermoelectric conversion efficiency.
- FIG. 3 is a diagram showing one manufacturing process of the thermoelectric conversion module according to the first embodiment.
- FIG. 3 is a diagram showing one manufacturing process of the thermoelectric conversion module according to the first embodiment.
- FIG. 3 is a longitudinal sectional view showing one manufacturing process (substrate preparation process) of the thermoelectric conversion module according to Embodiment 1.
- FIG. 3 is a longitudinal sectional view showing one manufacturing process (solder printing process) of the thermoelectric conversion module according to Embodiment 1.
- FIG. 3 is a longitudinal sectional view showing one manufacturing process (element mounting process) of the thermoelectric conversion module according to the first embodiment.
- FIG. 3 is a longitudinal sectional view showing one manufacturing process (board mounting process) of the thermoelectric conversion module according to the first embodiment.
- FIG. 3 is a longitudinal sectional view showing one manufacturing process (reflow process) of the thermoelectric conversion module according to Embodiment 1.
- FIG. 4 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module according to a second embodiment.
- FIG. 6 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module according to a third embodiment. The longitudinal cross-sectional view which expands and shows the vicinity of the upper side top surface of the thermoelectric conversion element of FIG. FIG.
- FIG. 6 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module according to a fourth embodiment.
- FIG. 6 is a plan view showing a planar structure of a thermoelectric conversion element according to a fifth embodiment.
- FIG. 15 is a longitudinal sectional view taken along line XV-XV in FIG. 14.
- FIG. 1 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module 100A according to the first embodiment.
- the thermoelectric conversion module 100 ⁇ / b> A is arranged between two upper and lower laminated substrates 90 arranged so as to face each other, and the two laminated substrates 90 sandwiching both end portions thereof.
- each of the upper and lower laminated substrates 90 includes a heat transfer body 106, an insulating plate 103, a conductor 101, an interlayer insulating film 104, a bonding material 102, and the like. Is provided.
- the heat transfer body 106 is provided on the outermost side of each multilayer substrate 90 in a direction connecting the upper and lower top surfaces of the P-type and N-type thermoelectric conversion elements 110 and 120 (hereinafter referred to as “longitudinal direction”). It is done.
- a ceramic substrate is used as the heat transfer body 106.
- a metal body containing any of Cu, Al, and Fe, graphite, or the like may be used as the heat transfer body 106.
- the insulating plate 103 is provided on each heat transfer body 106 in each laminated substrate 90.
- a polyimide film having a thickness of 10 ⁇ m or less can be used for the insulating plate 103.
- the flexibility of the thermoelectric conversion module 100A improves, and it is preferable in the viewpoint of the heat receiving from a curved surface.
- the heat transfer body 106 having high thermal conductivity may be provided outside the insulating plate 103 as in the first embodiment. It is more preferable to use the heat transfer body 106 having high thermal conductivity because the thermal diffusibility and rigidity in the surface direction are further increased.
- a conductor (wiring layer) 101 electrically connects P-type and N-type thermoelectric conversion elements 110 and 120 adjacent to a direction orthogonal to the longitudinal direction (hereinafter referred to as “short direction”) (this embodiment).
- short direction a direction orthogonal to the longitudinal direction
- the conductor 101 for example, an alloy containing two or more of Bi, Cu, Sb, and In can be used.
- the interlayer insulating film 104 is provided on each laminated substrate 90 between the conductor 101 and the cylinders 112 and 122 in the longitudinal direction via a gap 130 (not shown in FIG. 1) described later. Further, as will be described later, the interlayer insulating film 104 is provided for the purpose of increasing the thermal resistance of the heat path to the cylinders 112 and 122.
- the interlayer insulating film 104 is formed of, for example, an imide compound or an acrylic resin. In order to further increase the thermal resistance, it is effective to reduce the contact area between the cylinders 112 and 122 and the interlayer insulating film 104 by providing predetermined irregularities on the surface of the interlayer insulating film 104.
- the surface roughness provided on the surface of the interlayer insulating film 104 is preferably larger than the surface roughness of the tubes 112 and 122. This is to prevent heat from flowing from the interlayer insulating film 104 into the cylinders 112 and 122.
- the surface roughness of the interlayer insulating film 104 is preferably 0.1 mm or more, for example. Further, the inventors have found that the difference in surface roughness between the cylinders 112 and 122 and the interlayer insulating film 104 is 80 ⁇ m or more, which is effective in suppressing heat inflow.
- the surface roughness refers to the centerline average roughness Ra per 1 ⁇ m 2 .
- the bonding material 102 is provided in each opening 104 a (not shown in FIG. 1) formed in each interlayer insulating film 104 at a position corresponding to the diffusion preventing film 105, and is a P-type and N-type thermoelectric conversion element 110. 120 and each laminated substrate 90 are bonded together.
- the bonding material 102 is solder for guiding current from the P-type and N-type thermoelectric conversion units 111 and 121 to the conductor 101.
- the bonding material 102 may be a single metal or an alloy containing any of Sn, Pb, Ag, Bi, In, Sb, and Au.
- the P-type and N-type thermoelectric conversion elements 110 and 120 include columnar P-type and N-type thermoelectric conversion units 111 and 121. , Cylinders 112 and 122, and a diffusion prevention film 105, respectively.
- the P-type and N-type thermoelectric converters 111 and 121 are columnar members formed of a predetermined thermoelectric conversion material that generates an electromotive force when a temperature difference is generated between both ends thereof.
- Bi-Te (bismuth-tellurium) -based material having a high electromotive force in a temperature range from room temperature to 500 K is used as the P-type and N-type thermoelectric conversion units 111 and 121.
- the P-type and N-type thermoelectric converters 111 and 121 can be selected according to the temperature difference existing during use.
- the temperature difference is in the range from room temperature to 800K, use a Pb-Te (lead-tellurium) system, and if the temperature difference is in the range from room temperature to 1,000K, use a Si-Ge (silicon-germanium) system. Can do.
- Pb-Te lead-tellurium
- Si-Ge silicon-germanium
- the P-type and N-type thermoelectric conversion units 111 and 121 can be formed by adding an appropriate P-type or N-type dopant to the thermoelectric conversion material.
- Examples of the P-type dopant for obtaining the P-type thermoelectric conversion unit 111 include Sb.
- Examples of the N-type dopant for obtaining the N-type thermoelectric converter 121 include Se.
- the thermoelectric conversion material forms a mixed crystal. Therefore, these P-type or N-type dopants have a compositional expression such as “Bi 0.5 Sb 1.5 Te 3 ” or “Bi 2 Te 2.7 Se 0.3 ”. Added in an amount.
- the shape of the P-type and N-type thermoelectric conversion units 111 and 121 is preferably a polygonal column or a column from the viewpoint of aligning the element productivity and the crystal orientation of the thermoelectric conversion material in the axial direction of the cylinder. Furthermore, from the viewpoint of preventing cracking of the thermoelectric conversion portions 111 and 121 made of a brittle thermoelectric conversion material, a cylinder capable of suppressing stress concentration at the corner is more preferable.
- the length L in the longitudinal direction of the P-type and N-type thermoelectric converters 111 and 121 is, for example, 0.3 mm to 2 from the viewpoint of causing an appropriate temperature difference between both ends of the P-type and N-type thermoelectric converters 111 and 121. It is preferably within a range of 0.0 mm.
- the cross-sectional area in the short direction of the P-type and N-type thermoelectric conversion units 111 and 121 is preferably in the range of 0.1mm 2 ⁇ 4mm 2.
- the cylinders (insulators) 112 and 122 are provided so as to surround the side surfaces of the P-type and N-type thermoelectric conversion units 111 and 121.
- the cylinders 112 and 122 are members made of an insulating material having heat resistance and insulating properties and having cavities that open at both ends.
- the shapes of the cylinders 112 and 122 may be, for example, a cylinder, a polygonal cylinder, and a polygonal cylinder having an R at a corner.
- Examples of the material of the cylinders 112 and 122 include metal oxides such as silica and alumina, heat resistant glass, and quartz.
- the material of the cylinders 112 and 122 is preferably quartz from the viewpoint of heat resistance, and heat resistant glass is preferable in consideration of manufacturing cost. Further, the surface roughness of the cut surfaces of the cylinders 112 and 122 is, for example, 10 ⁇ m to 20 ⁇ m because they are cut with a wire saw, a dicer or the like when forming the P-type and N-type thermoelectric conversion elements 110 and 120 described later. It becomes a range.
- thermoelectric conversion module 100A When the cross-sectional area in the short direction of the cylinders 112 and 122 is smaller than the cross-sectional area in the short direction of the P-type and N-type thermoelectric converters 111 and 121, the P-type occupies the entire thermoelectric conversion module 100A. And the cross-sectional area ratio of the N-type thermoelectric converters 111 and 121 can be increased. Thereby, the thermoelectric conversion performance of the thermoelectric conversion module 100A is improved. On the other hand, when the cross-sectional area in the short direction of the cylinders 112 and 122 is too small compared to that of the P-type and N-type thermoelectric conversion units 111 and 121, the P-type and N-type thermoelectric conversion elements 110 and 120 Causes a decrease in mechanical strength.
- the cross-sectional area in the short direction of the tubes 112 and 122 is, for example, 0.2 times to 1.7 times the cross-sectional area in the short direction of the P-type and N-type thermoelectric converters 111 and 121. It is preferable to be within the range.
- the diffusion prevention film 105 is provided on the top surfaces of the P-type and N-type thermoelectric converters 111 and 121, respectively.
- the diffusion prevention film 105 is provided to prevent the components in the bonding material 102 from diffusing into the P-type and N-type thermoelectric conversion units 111 and 121.
- Ni is used as the diffusion prevention film 105.
- the diffusion prevention film 105 may be a single metal or alloy containing any of Ni, Mo, Ti, and W. Further, the diffusion preventing film 105 may use Ni or Mo.
- thermoelectric conversion module 100A further includes a gap (second gap) 140 that separates the P-type and N-type thermoelectric conversion elements 110 and 120 adjacent in the short direction.
- FIG. 2 is an enlarged vertical sectional view showing the vicinity of the upper top surface of the P-type thermoelectric conversion element 110 of FIG. 1, and an enlarged portion shown in FIG. 1 is enlarged.
- the configuration in the vicinity of the upper top surface of the P-type thermoelectric conversion element 110 will be described as an example with reference to FIG.
- the P-type thermoelectric conversion element 110 has a gap in which the cylinder 112 and the interlayer insulating film 104 are spaced apart from each other with a predetermined distance (substantially the film thickness TA of the diffusion prevention film 105) in the longitudinal direction. 130.
- the diffusion prevention film 105 is provided substantially only on the top surface of the P-type thermoelectric conversion unit 111 and does not cover the top surface of the cylinder 112. Therefore, a gap 130 corresponding to the film thickness TA of the diffusion prevention film 105 is formed between the cylinder 112 and the interlayer insulating film 104.
- the top surface of the diffusion preventing film 105 protrudes from the top surface on the upper side and the lower side of the tube 112 in the longitudinal direction.
- the P-type thermoelectric conversion element 110 has a gap 130 on the cylinder 112 in the longitudinal direction.
- the gap 130 is filled with air.
- the gap 130 is preferably filled (filled) with a gas such as, for example, decompressed (negative pressure) air. This is because the heat conductivity of the decompressed gas is low.
- predetermined gas such as argon gas whose heat conductivity is lower than general dry air, may be satisfy
- the gap 130 is, for example, a vacuum with a higher heat insulating effect.
- the gap 130 functions as a heat insulating material, and the heat received from the heat transfer body 106 on the high temperature side (heat receiving side) flows directly from the interlayer insulating film 104 to the cylinder 112. This can be suppressed. Therefore, the received heat can be efficiently guided to the P-type thermoelectric conversion unit 111.
- the outer diameter dimension d 1 of the diffusion prevention film 105 is smaller than the outer diameter dimension d 2 of the P-type thermoelectric conversion section 111 and the inner diameter dimension D 1 of the opening 104 a of the interlayer insulating film 104.
- Preferably satisfies a predetermined relationship (d1 ⁇ d2, D1 ⁇ d1) that is smaller than the outer diameter d1 of the diffusion prevention film 105.
- the cross-sectional area of the diffusion preventing film 105 in the short direction is larger than the cross-sectional area of the opening 104a, and the cross-sectional areas of the top surfaces of the P-type and N-type thermoelectric converters 111 and 121 in the short direction are diffusion.
- a gap 130 can be provided between the tube 112 and the interlayer insulating film 104 so as to be substantially separated by an interval corresponding to the film thickness TA of the diffusion prevention film 105.
- the inner diameter dimension D1 of the opening 104a is approximately equal to the outer diameter dimension d1 of the diffusion prevention film 105. More preferably, it is 90%.
- the inner diameter dimension D1 of the opening 104a is smaller than the diffusion prevention film 105 with respect to the positional deviation amount d1_xy in the xy direction of the outer diameter dimension d1 of the diffusion prevention film 105. It is preferable that the difference (d1 ⁇ d1 ⁇ d1_xy) be smaller than the difference in the positional deviation amount d1_xy from the outer diameter dimension d1.
- the outer diameter dimension d1 of the diffusion prevention film 105 is greater than the outer diameter dimension d2 of the P-type thermoelectric conversion section 111 with respect to the positional deviation amount d2_xy in the xy direction of the outer diameter dimension d2 of the P-type thermoelectric conversion section 111. It is more preferable that the difference is smaller than the difference in positional deviation amount d2_xy (d1 ⁇ d2-d2_xy).
- the film thickness TA of the diffusion preventing film 105 is preferably 5 ⁇ m or more from the viewpoint of suppressing the bonding material 102 from leaking from the opening 104 a and reaching the cylinder 112. On the other hand, if the film thickness TA is too large, the electrical resistance also increases. Therefore, the film thickness TA of the diffusion preventing film 105 is preferably 30 ⁇ m or less.
- the configuration of the upper top surface of the P-type thermoelectric conversion element 110 is described as an example with reference to FIG. However, similarly, in the configuration of the lower top surface of the P-type thermoelectric conversion element 110, the cylinder 112 and the interlayer insulating film 104 are spaced at a predetermined interval (substantially the film thickness TA of the diffusion prevention film 105) in the longitudinal direction. There is a gap 130 that is spaced apart. Further, in each of the configurations of the upper and lower top surfaces of the N-type thermoelectric conversion element 120, similarly, the cylinder 122 and the interlayer insulating film 104 have a predetermined distance in the longitudinal direction (substantially the film thickness TA of the diffusion prevention film 105). ) And a spaced gap 130.
- thermoelectric conversion module 100A Refer to Embodiment 1
- the heat transfer body 106 of the upper laminated substrate 90 is set to a high temperature
- the heat transfer body 106 of the lower stacked substrate 90 is set to a low temperature.
- the generated heat flow is sequentially from the heat transfer body 106 on the high temperature side like the flow path indicated by the arrow HA in FIG. 1, and the insulating plate 103, the conductor 101, the bonding material 102, the diffusion prevention film 105, and P It flows to the mold thermoelectric converter 111.
- the P-type thermoelectric converter 111 generates a voltage proportional to the temperature difference between both ends of the high-temperature end and the low-temperature end.
- the flow path indicated by the arrow HA refers to the insulating plate 103, the conductor 101, the bonding material 102, the diffusion prevention film 105, and the P-type thermoelectric conversion unit 111 (or N) sequentially from the heat transfer body 106 on the high temperature side.
- the generated heat flow flows through the flow path indicated by the arrow HA, so that the N-type thermoelectric conversion unit 121 has both ends at the high-temperature end and the low-temperature end.
- a voltage proportional to the temperature difference is generated.
- the polarity of the voltage generated in the N-type thermoelectric conversion element 120 is different from the polarity generated in the P-type thermoelectric conversion element 110. Therefore, in order to prevent the generated voltage from canceling, the P-type and N-type thermoelectric conversion elements 110 and 120 adjacent in the lateral direction are electrically connected in series with each other by the conductor 101. By electrically connecting in this way, a larger electromotive force can be generated in the entire thermoelectric conversion module 100A.
- the flow path of the heat flow caused by the temperature difference given to the thermoelectric conversion module 100A not only flows through the arrow HA that contributes to power generation but also flows through the P-type and N-type thermoelectric conversion units 111 and 121 and contributes to power generation.
- heat from the heat transfer member 106 on the high temperature side sequentially flows through the insulating plate 103, the conductor 101, the interlayer insulating film 104, the gap 130, and the cylinder 112 (or 122). The flow path until it flows to the heat transfer body 106 of the lower laminated substrate 90 on the side.
- the thermoelectric conversion module 100A has the gap 130 in which the cylinders 112 and 122 and the interlayer insulating film 104 are separated from each other in the longitudinal direction. Since the gap 130 is filled with air in the first embodiment, the thermal resistance of the gap 130 is larger by one digit or more than the thermal resistance of a solid substance such as an insulating material. Therefore, the gap 130 functions as a heat insulating material, and the amount of heat flowing in the flow path indicated by the arrow HB that does not contribute to power generation can be suppressed.
- thermoelectric conversion efficiency of the thermoelectric conversion module 100A can be improved.
- the outer diameter dimension d1 of the diffusion prevention film 105 is larger than the outer diameter dimension d2 of the P-type and N-type thermoelectric converters 111 and 121, the volume of the gap 130 decreases. As a result, part of the heat flow indicated by the arrow HA flows to the cylinders 112 and 122 via the diffusion prevention film 105, and the heat flow flowing to the P-type and N-type thermoelectric conversion units 111 and 121 is reduced.
- the outer diameter dimension d1 of the diffusion prevention film 105 is smaller than the inner diameter dimension D1 of the opening 104a, the bonding material 102 in the opening 104a has a portion in contact with the P-type and N-type thermoelectric conversion portions 111 and 121.
- the bonding material 102 is solder for guiding the current from the P-type and N-type thermoelectric converters 111 and 121 to the conductor 101, and the bonding material 102 has high thermal conductivity. Therefore, when the outer diameter dimension d1 of the diffusion preventing film 105 is smaller than the inner diameter dimension D1 of the opening 104a, the inflow of heat to the cylinders 112 and 122 through the bonding material 102 is increased.
- the outer diameter dimension d1 of the diffusion prevention film 105 is smaller than the outer diameter dimension d2 of the P-type thermoelectric converter 111, and the inner diameter dimension D1 of the opening 104a of the interlayer insulating film 104 is the outer diameter dimension of the diffusion prevention film 105. It is preferable to satisfy a predetermined relationship (d1 ⁇ d2, D1 ⁇ d1) smaller than d1.
- thermoelectric conversion module 100A 3. Manufacturing Method Next, a manufacturing method of the thermoelectric conversion module 100A according to the first embodiment will be described with reference to FIGS.
- the pipe 201 includes, for example, glass, particularly heat-resistant glass (a kind of borosilicate glass in which SiO 2 and B 2 O 3 are mixed, and has a thermal expansion coefficient of about 3 ⁇ 10 ⁇ 6 / K. Material) may be used.
- a pipe 201 having a total length of 150 mm and an inner diameter and an outer diameter of 0.8 mm and 2 mm can be used.
- the cylinder 203 is attached to one end of the pipe 201 via the silicon tube 202, and the other end is immersed in the molten thermoelectric conversion material 205 in the crucible 204.
- the molten thermoelectric conversion material 205 is a P-type thermoelectric conversion material (or N-type thermoelectric conversion material) melted by heating.
- the molten thermoelectric conversion material 205 is sucked into the pipe 201 by operating the cylinder 203. Then, the sucked molten thermoelectric conversion material 205 is cooled and solidified inside the pipe 201. Subsequently, along the short direction substantially perpendicular to the longitudinal direction of the pipe 201, for example, the wire saw or dicer 207 is controlled so as to have a desired length L in the longitudinal direction, and P-type thermoelectric conversion The part 111 and the pipe 201 are cut simultaneously. By separating the P-type thermoelectric conversion unit 111 from the pipe 201 by the cutting process as described above, the P-type thermoelectric conversion unit 111 and the cylinder 112 are formed simultaneously.
- a diffusion prevention film 105 made of Ni or the like is selectively formed on each of the upper and lower top surfaces of the formed P-type thermoelectric conversion unit 111 using, for example, barrel plating. Form.
- the outer diameter dimension d1 of the diffusion prevention film 105 formed is smaller than the outer diameter dimension d2 of the P-type thermoelectric converter 111, and the inner diameter dimension D1 of the opening 104a of the interlayer insulating film 104 described later is
- the formation conditions are controlled so as to satisfy the predetermined relationship (d1 ⁇ d2, D1 ⁇ d1) that is smaller than the outer diameter dimension d1 of the diffusion prevention film 105.
- it is preferable to control the formation conditions so that the film thickness TA of the diffusion prevention film 105 to be formed is 5 ⁇ m or more and 30 ⁇ m or less.
- a plurality of P-type thermoelectric conversion elements 110 are formed by the above manufacturing process.
- the manufacturing process of the N-type thermoelectric conversion element 120 is substantially the same as the manufacturing process of the P-type thermoelectric conversion element 110 except that the molten thermoelectric conversion material to be melted in the crucible 204 is an N-type thermoelectric conversion material. The same. Therefore, detailed description of the manufacturing process of the N-type thermoelectric conversion element 120 is omitted.
- thermoelectric conversion elements 110 and 120 a mounting process of the P-type and N-type thermoelectric conversion elements 110 and 120 on the multilayer substrate 90 will be described with reference to FIGS. 5 to 9.
- a lower laminated substrate 90 is prepared on the transport tray 220.
- the lower laminated substrate 90 includes an insulating plate 103, a conductor 101, and an interlayer insulating film 104 that are sequentially laminated on the heat transfer body 106.
- a part of the conductor 101 is separated in the lateral direction so that the P-type and N-type thermoelectric conversion elements 110 and 120 to be mounted in a later process are electrically connected in series.
- an opening 104a having an inner diameter dimension D1 is formed in the interlayer insulating film 104 by using, for example, an etching process or the like.
- solder printing step shown in FIG. 6 an optimized amount of solder is printed in each opening 104 a of the interlayer insulating film 104 by, for example, screen printing to form the bonding material 102.
- the upper laminated substrate 90 is also formed in the same manner by performing the same steps shown in FIGS.
- the P-type and N-type thermoelectric conversion elements 110 and 120 are mounted on each bonding material 102 of the lower laminated substrate 90 using, for example, a chip mounter.
- the mounted P-type and N-type thermoelectric conversion elements 110 and 120 are electrically connected to each other in series by the conductor 101.
- a predetermined reflow process is performed, and heating and cooling are performed, for example, in a reflow furnace having a predetermined temperature profile so that each bonding material 102 is melted and solidified in each opening 104 a of the interlayer insulating film 104.
- the same process shown in FIGS. 5 and 6 is performed to prepare an upper laminated substrate 90 formed in the same manner.
- the upper laminated substrate 90 is arranged so that the respective bonding materials 102 of the prepared upper laminated substrate 90 are respectively disposed on the respective diffusion prevention films 105 on the upper side of the P-type and N-type thermoelectric conversion elements 110 and 120.
- each bonding material 102 is melted and solidified in each opening 104 a of the interlayer insulating film 104 in a state where the upper laminated substrate 90 is loaded. Heating and cooling are performed in a reflow furnace having a temperature profile. Then, each bonding material 102 is melted and solidified in each opening 104a to manufacture the thermoelectric conversion module 100A according to the first embodiment. As described above, in the first embodiment, the reflow process is performed on each of the upper and lower laminated substrates 90 to form the bonding material 102 in each predetermined opening 104a. Therefore, it becomes possible to manufacture the thermoelectric conversion module 100A within a range of allowable positional deviation.
- the thermoelectric conversion module 100A has the gap 130 in which the tubes 112 and 122 and the interlayer insulating film 104 are separated from each other in the longitudinal direction. Since the gap 130 is filled with air in the first embodiment, the thermal resistance of the gap 130 is larger by one digit or more than a solid substance such as an insulating material. Therefore, the gap 130 functions as a heat insulating material, and the amount of heat flowing through the flow path indicated by the arrow HB that does not contribute to power generation shown in FIG. 1 can be suppressed. The amount of heat flowing through the flow path indicated by arrow HA that contributes to power generation shown in FIG. 1 can be increased by the amount of heat that flows through the flow path indicated by arrow HB. Therefore, the thermoelectric conversion efficiency of the thermoelectric conversion module 100A can be improved.
- the ratio of the cross-sectional area in the short direction of the P-type and N-type thermoelectric converters 111 and 121 to the cross-sectional area in the short direction of the tubes 112 and 122 is 1: 1, and the P-type and N-type thermoelectric conversions
- the thermal conductivity of the parts 111 and 121 is 1.4 W / mK and the thermal conductivity of the cylinders 112 and 122 is 0.6 W / mK
- the amount of heat flowing through the P-type and N-type thermoelectric conversion parts 111 and 121 is about 40%. Decrease degree.
- most of the amount of heat flowing through the cylinders 112 and 122 can be suppressed by having the gap 130.
- thermoelectric conversion efficiency of the thermoelectric conversion module 100A can be improved.
- thermoelectric conversion module 100A has a gap 140 in which the P-type or N-type thermoelectric conversion elements 110 and 120 adjacent to each other in the short direction are separated. Therefore, by increasing the thermal resistance between the P-type or N-type thermoelectric conversion elements 110 and 120 adjacent in the short direction, the amount of heat flowing through the P-type and N-type thermoelectric conversion units 111 and 121 is further increased, and the thermoelectric The thermoelectric conversion efficiency of the conversion module 100A can be improved.
- FIG. 10 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module 100B according to the second embodiment.
- thermoelectric conversion module 100B according to the second embodiment is characterized by including the lower and upper laminated substrates 90B.
- the multilayer substrate 90B is different from the multilayer substrate 90 according to the first embodiment in that it does not include the heat transfer body 106 and the insulating plate 103.
- the laminated substrate 90B of the thermoelectric conversion module 100B includes the conductor 101 and the interlayer insulating film 104, but does not include the heat transfer body 106 and the insulating plate 103.
- the heat transfer body 106 and the insulating plate 103 are not provided, the heat flow from the heat source does not pass through the heat transfer body 106 and the insulating plate 103, and the conductor 101 and the interlayer It flows to the P-type and N-type thermoelectric converters 111 and 121 only through the insulating film 104. Therefore, there is no heat loss caused by passing through the heat transfer body 106 and the insulating plate 103, and the heat flow efficiently flows, so that the thermoelectric conversion efficiency of the thermoelectric conversion module 100B can be improved.
- thermoelectric conversion module 100B according to Embodiment 2 in which the heat loss from the heat source to the top surfaces of the P-type and N-type thermoelectric conversion units 111 and 121 is small is the viewpoint of thermoelectric conversion efficiency. Is more effective.
- FIG. 11 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module 100C according to the third embodiment.
- FIG. 12 is an enlarged vertical sectional view showing the vicinity of the upper top surface of the P-type thermoelectric conversion element 110 of FIG. 11, in which the portion surrounded by FIG. 11 is enlarged.
- thermoelectric conversion module 100C is characterized in that the laminated substrate 90C further includes a conductive ring 107 as compared with the thermoelectric conversion module 100A according to the first embodiment.
- the conductive ring 107 is provided between the interlayer insulating film 104 and the diffusion prevention film 105 in the longitudinal direction so as to surround the side surface of the bonding material 102 in a ring shape.
- the inner diameter dimension of the conductive ring 107 is made larger than the inner diameter dimension D1 of the opening 104a.
- the outer diameter D2 of the conductive ring 107 is made smaller than the outer diameter d1 of the diffusion prevention film 105 (D2 ⁇ d1).
- the gap 130B can be provided larger by the film thickness of the conductive ring 107. Therefore, in the thermoelectric conversion module 100C according to the third embodiment, the tube 112 and the interlayer insulating film 104 in the longitudinal direction are substantially separated by an interval corresponding to the film thickness TB between the diffusion prevention film 105 and the conductive ring 107. Gap 130B.
- the outer diameter D2 of the conductive ring 107 is made smaller than the outer diameter d1 of the diffusion prevention film 105 in order to further suppress the inflow of heat into the tubes 112 and 122 (D2 ⁇ d1).
- the inner diameter of the conductive ring 107 is made larger than the inner diameter D1 of the opening 104a.
- the conductive ring 107 is preferably composed of a conductor having a low electrical resistance in order to efficiently extract the current generated in the P-type and N-type thermoelectric converters 111 and 121.
- the film thickness of the conductive ring 107 is, for example, 30 ⁇ m.
- the laminated substrate 90 shown in FIG. 5 is prepared, a resist film is applied on the laminated substrate 90, and a ring-shaped opening surrounding the opening 104a is formed in the applied resist film. . Subsequently, a conductor is embedded in the formed opening using a predetermined method to form a ring-shaped conductive ring 107. Subsequently, the applied resist film is peeled off from the laminated substrate 90.
- Other configurations, operations, and manufacturing methods are substantially the same as those in the first embodiment, and thus detailed descriptions thereof are omitted.
- thermoelectric conversion module 100C is a conductive layer provided between the interlayer insulating film 104 and the diffusion prevention film 105 in the longitudinal direction so as to surround the side surface of the bonding material 102 in a ring shape.
- a ring 107 is further provided. Therefore, the thermoelectric conversion module 100 ⁇ / b> C has a gap 130 ⁇ / b> B that is substantially spaced apart by a film thickness TB between the diffusion prevention film 105 and the conductive ring 107 between the cylinder 112 and the interlayer insulating film 104 in the longitudinal direction.
- thermoelectric conversion performance of the thermoelectric conversion module 100C can be further improved.
- thermoelectric conversion modules 100A and 100C according to the first and third embodiments including the laminated substrate 90 is provided from the viewpoint of preventing a short circuit and electrolytic corrosion. It is valid. Furthermore, in the case where it is desired to separate the cylinder 112 and the interlayer insulating film 104 in the longitudinal direction in a larger and more reliable manner, the configuration of the thermoelectric conversion module 100C having the gap 130B according to the third embodiment is more effective.
- FIG. 13 is a longitudinal sectional view showing a sectional structure of a thermoelectric conversion module 100D according to the fourth embodiment.
- thermoelectric conversion module 100D according to the fourth embodiment further includes a hole 108 provided in the interlayer insulating film 104 of the multilayer substrate 90D, as compared with the thermoelectric conversion module 100B according to the second embodiment. It is characterized by providing.
- the hole 108 is a ring-shaped hole provided through the interlayer insulating film 104 so as to surround the periphery of the opening 104a.
- the contact area between the cylinders 112 and 122 and the interlayer insulating film 104 is reduced, and the thermal resistance of the heat path flowing from the interlayer insulating film 104 to the cylinders 112 and 122 can be further increased.
- the total area of the cross-sectional area of the hole 108 in the short direction is preferably 50% or less of the cross-sectional area of the interlayer insulating film 104 in the short direction from the viewpoint of the strength of the thermoelectric conversion module 100D. This is because if the total area of the holes 108 exceeds 50%, the effect of thermal deformation generated in each member cannot be absorbed by the interlayer insulating film 104, and the reliability as the thermoelectric conversion module may be reduced.
- an etching process or the like is performed so as to surround the opening 104a, for example, until it penetrates the interlayer insulating film 104 in a ring shape.
- the hole 108 shown in FIG. 13 can be formed.
- Other configurations, operations, and manufacturing methods are substantially the same as those in the second embodiment, and thus detailed descriptions thereof are omitted.
- the thermoelectric conversion module 100D includes the ring-shaped hole 108 that penetrates the interlayer insulating film 104 so as to surround the opening 104a.
- the thermal resistance is increased, and the thermal resistance of the heat path flowing from the interlayer insulating film 104 to the cylinders 112 and 122 can be further increased.
- the applied heat is less likely to be transmitted in the plane of the interlayer insulating film 104 provided with the holes 108, and the heat concentrates on the flow path passing through the bonding material 102. As a result, more heat flows through the P-type and N-type thermoelectric converters 111 and 121.
- thermoelectric conversion efficiency of the thermoelectric conversion module 100D can be further improved.
- FIG. 14 is a plan view showing a planar structure of P-type thermoelectric conversion element 110B according to the fifth embodiment.
- FIG. 15 is a longitudinal sectional view taken along line XV-XV in FIG.
- the P-type thermoelectric conversion element 110 ⁇ / b> B according to the fifth embodiment is higher than the P-type thermoelectric conversion element 110 according to the first embodiment, and It is characterized by having a gap 130C on each side surface on the lower side.
- the gap 130 ⁇ / b> C is provided by projecting the upper and lower top surfaces of the P-type thermoelectric converter 111 in a convex shape in the longitudinal direction from the upper and lower top surfaces of the cylinder 112.
- the diffusion prevention film 105 according to the fifth embodiment is formed on each top surface of the P-type thermoelectric conversion unit 111 protruding from the top surfaces on the upper side and the lower side of the cylinder 112.
- the cross section is provided so as to have a U shape.
- illustration is abbreviate
- FIG. 1 is a diagrammatic representation of the N type thermoelectric conversion element which concerns on Embodiment 5.
- the multilayer substrate according to Embodiment 5 does not use the interlayer insulating film 104. Therefore, in the thermoelectric conversion module according to Embodiment 5, the P-type and N-type thermoelectric conversion elements 110B and 120B are similarly mounted on the laminated substrate 90 that does not have the interlayer insulating film 104, for example, in the longitudinal direction. Further, a gap 130 ⁇ / b> C that separates the cylinders (insulators) 112 and 122 from the conductor (wiring layer) 101 is provided.
- the P-type thermoelectric conversion unit 111 is formed by using a manufacturing process similar to the manufacturing process described in FIGS. Subsequently, when the P-type thermoelectric conversion unit 111 is separated from the pipe 201, as shown in FIG. 15, only the top surfaces of the upper side and the lower side of the cylinder 112 are respectively cut to the center side by the thickness TC in the longitudinal direction. The top surfaces of the upper side and the lower side of the P-type thermoelectric converter 111 are protruded by separating them.
- a diffusion prevention film 105 made of Ni or the like is selectively formed on each of the upper and lower top surfaces of the protruding P-type thermoelectric conversion unit 111 using, for example, a plating method, and the P-type thermoelectric conversion is performed.
- Element 110B is formed.
- the manufacturing process of the N-type thermoelectric conversion element is the same as the manufacturing process of the P-type thermoelectric conversion element 110B.
- the formed P-type and N-type thermoelectric conversion elements are similarly mounted on the lower and lower laminated substrates 90 that do not have the interlayer insulating film 104, for example, so that the thermoelectric conversion module according to the fifth embodiment is mounted. Manufacturing.
- Other configurations, operations, and manufacturing methods are substantially the same as those in the first embodiment, and thus detailed descriptions thereof are omitted.
- the P-type and N-type thermoelectric conversion elements included in the thermoelectric conversion module according to Embodiment 5 have the gap 130C on each of the upper and lower side surfaces of the P-type and N-type thermoelectric conversion units 111 and 121. Have. Therefore, the heat flow of heat flowing through the cylinders 112 and 122 can be further suppressed, and the thermoelectric conversion efficiency can be increased by further increasing the heat flow of heat flowing through the P-type and N-type thermoelectric conversion units 111 and 121.
- the thermal conductivity of the P-type thermoelectric conversion unit 111 is 1.27 W ⁇ m ⁇ 1 ⁇ K ⁇ 1
- the thermal conductivity of the N-type thermoelectric conversion unit 121 is 1.35 W.
- ⁇ m is -1 ⁇ K -1
- heat conductivity may be used Corning Pyrex 1.1W ⁇ m -1 ⁇ K -1 (R) as the cylinder 112, 122.
- the transverse area in the short direction is 0.5 mm 2 (a cylinder with a diameter of 0.8 mm).
- the cross-sectional area of the tube 112 in the short direction is 0.28 mm 2 (cylinder with an outer diameter of 0.5 mm), and the cross-sectional area of the tube 122 in the short direction is 0.7 mm 2 (cylinder with an outer diameter of 0.62 mm). ).
- the top surface of the opening 104a, the diffusion prevention film 105, the P-type and N-type thermoelectric converters 111 and 122 is circular
- the outer diameter or inner diameter is used.
- these shapes may be other than circular.
- the opening 104a is the smallest, and then the diffusion preventing film 105 and the top surfaces of the P-type and N-type thermoelectric converters 111 and 122 are the largest. .
- the gap 130 can be similarly formed, and the inflow of heat into the cylinders 112 and 122 can be suppressed.
- ring-shaped hole 108 penetrating the interlayer insulating film 104 has been described with reference to FIG.
- the present invention is not limited to this.
- a ring-shaped hole that penetrates the insulating plate 103 and the interlayer insulating film 104 may be provided so as to surround the opening 104a.
- thermoelectric conversion modules capable of converting heat into electricity.
- thermoelectric conversion module 110 110B ... P-type thermoelectric conversion element 111 ... P-type thermoelectric conversion part 112, 122 ... Tube 120 ... N-type thermoelectric conversion element 121 ... N-type thermoelectric converter 101 ... conductor 102 ... bonding material 103 ... insulating plate 104 ... interlayer insulating film 105 ... diffusion prevention film 106 ... heat transfer body 107 ... conductive ring 130, 130B, 130C, 140 ... gap 201 ... pipe 202 ... Silicon tube 203 ... Cylinder 204 ... Crucible 205 ... Mold thermoelectric conversion material
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Abstract
Description
前記P型熱電変換素子は、
柱状のP型熱電変換部と、
前記P型熱電変換部の側面に設けられた絶縁体と、
前記P型熱電変換部の前記側面と異なる面である頂面上に設けられる拡散防止膜と、
を備え、
前記N型熱電変換素子は、
柱状のN型熱電変換部と、
前記N型熱電変換部の側面に設けられた絶縁体と、
前記N型熱電変換部の前記側面と異なる面である頂面上に設けられる拡散防止膜と、
を備え、
前記各積層基板は、
前記拡散防止膜を介して前記P型及びN型熱電変換部を電気的に接続する配線層と、
前記拡散防止膜と前記配線層とを接合する接合材と、
を備え、
前記P型又はN型熱電変換部の上側及び下側の頂面を結ぶ方向において、前記拡散防止膜の頂面は、前記絶縁体の上側及び下側の各頂面から突出し、前記方向において、前記絶縁体上に間隙を有する。
1.構成について
1-1.熱電変換モジュールの全体構成について
まず、図1を用い、実施の形態1に係る熱電変換モジュールの全体構成について説明する。図1は、実施の形態1に係る熱電変換モジュール100Aの断面構造を示す縦断面図である。図1に示すように、熱電変換モジュール100Aは、互いに対向するように配置される上側及び下側の2つの積層基板90と、上記2つの積層基板90の間にその両端部を挟んで配置される複数のP型及びN型熱電変換素子110、120と、を備える。
図1に示すように、上側及び下側の各積層基板90は、伝熱体106と、絶縁板103と、導電体101と、層間絶縁膜104と、接合材102とを備える。
次いで、P型及びN型熱電変換素子110、120は、図1に示すように、柱状のP型及びN型熱電変換部111、121と、筒112、122と、拡散防止膜105と、をそれぞれ備える。
次に、P型及びN型熱電変換素子110、120の頂面の近傍の構成について説明する。図2は、図1のP型熱電変換素子110の上側頂面の近傍を拡大して示す縦断面図であって、図1において囲って示す部分を拡大している。ここでは、図2を用い、P型熱電変換素子110の上側頂面の近傍の構成を例に挙げて説明する。
次に、図1を用い、実施の形態1に係る熱電変換モジュール100Aの発電動作について説明する。
次に、図3乃至図9を用い、実施の形態1に係る熱電変換モジュール100Aの製造方法について説明する。
図3及び図4を用い、P型及びN型熱電変換素子110、120の製造工程について説明する。ここでは、P型熱電変換部111と、筒112と、拡散防止膜105とを備えるP型熱電変換素子110の製造工程を一例に挙げて説明する。
次に、図5乃至図9を用い、P型及びN型熱電変換素子110、120の積層基板90への実装工程について説明する。
以上説明したように、実施の形態1に係る熱電変換モジュール100Aは、長手方向において筒112、122と層間絶縁膜104との間が離間する間隙130を有する。この間隙130には、本実施の形態1では、空気が満たされることから、間隙130の熱抵抗は、例えば絶縁材料等の固体物質に比較して、1桁以上大きい。そのため、間隙130が断熱材として働き、図1に示した発電に寄与しない矢印HBの流路に流れる熱量を抑制することできる。そして、この矢印HBの流路に流れる熱量を抑制する分、同図1に示す発電に寄与する矢印HAの流路に流れる熱量を増大させることができる。そのため、熱電変換モジュール100Aの熱電変換効率を向上させることができる。
次に、図10を用い、実施の形態2に係る熱電変換モジュールについて説明する。図10は、実施の形態2に係る熱電変換モジュール100Bの断面構造を示す縦断面図である。
次に、図11及び図12を用い、実施の形態3に係る熱電変換モジュールについて説明する。図11は、実施の形態3に係る熱電変換モジュール100Cの断面構造を示す縦断面図である。図12は、図11のP型熱電変換素子110の上側頂面の近傍を拡大して示す縦断面図であって、図11において囲って示す部分を拡大している。
次に、図13を用い、実施の形態4に係る熱電変換モジュールについて説明する。図13は、実施の形態4に係る熱電変換モジュール100Dの断面構造を示す縦断面図である。
次に、図14及び図15を用い、実施の形態5に係る熱電変換素子及びモジュールについて説明する。図14は、実施の形態5に係るP型熱電変換素子110Bの平面構造を示す平面図である。図15は、図14のXV-XV線に沿った縦断面図である。
100A、100B、100C、100D…熱電変換モジュール
110、110B…P型熱電変換素子
111…P型熱電変換部
112、122…筒
120…N型熱電変換素子
121…N型熱電変換部
101…導電体
102…接合材
103…絶縁板
104…層間絶縁膜
105…拡散防止膜
106…伝熱体
107…導電リング
130、130B、130C、140…間隙
201…パイプ
202…シリコンチューブ
203…シリンダー
204…るつぼ
205…溶融熱電変換材料
Claims (14)
- 2つの積層基板の間に配置されるP型熱電変換素子及びN型熱電変換素子を具備する熱電変換モジュールであって、
前記P型熱電変換素子は、
柱状のP型熱電変換部と、
前記P型熱電変換部の側面に設けられた絶縁体と、
前記P型熱電変換部の前記側面と異なる面である頂面上に設けられる拡散防止膜と、
を備え、
前記N型熱電変換素子は、
柱状のN型熱電変換部と、
前記N型熱電変換部の側面に設けられた絶縁体と、
前記N型熱電変換部の前記側面と異なる面である頂面上に設けられる拡散防止膜と、
を備え、
前記各積層基板は、
前記拡散防止膜を介して前記P型熱電変換部及びN型熱電変換部を電気的に接続する配線層と、
前記拡散防止膜と前記配線層とを接合する接合材と、
を備え、
前記P型又はN型熱電変換部の上側及び下側の頂面を結ぶ方向において、前記拡散防止膜の頂面は、前記絶縁体の上側及び下側の各頂面から突出し、
前記方向において、前記絶縁体上に間隙を有する、熱電変換モジュール。 - 前記各積層基板は、前記方向における前記拡散防止膜と前記配線層との間に設けられる層間絶縁膜を更に備え、
前記層間絶縁膜は、前記拡散防止膜上に位置する開口部を有する、
請求項1に記載の熱電変換モジュール。 - 前記方向と直交する第2方向における前記拡散防止膜の断面積は、前記第2方向における前記開口部の断面積よりも大きく、
前記第2方向における前記P型及びN型熱電変換部の前記頂面の断面積は、前記第2方向における前記拡散防止膜の断面積よりも大きい請求項2に記載の熱電変換モジュール。 - 前記各積層基板は、前記接合材の側面を囲う導電リングを更に備える請求項2又は3に記載の熱電変換モジュール。
- 前記各積層基板は、前記開口部の周囲を囲うように、前記層間絶縁膜を貫通して設けられるリング状の孔を更に備える請求項2乃至4のいずれか一項に記載の熱電変換モジュール。
- 前記方向と直交する第2方向における前記孔の断面積の総面積は、前記第2方向における前記層間絶縁膜の断面積の50%以下である請求項5に記載の熱電変換モジュール。
- 前記層間絶縁膜の表面粗さは、前記絶縁体の表面粗さよりも荒い請求項2乃至6のいずれかに記載の熱電変換モジュール。
- 前記層間絶縁膜の表面粗さと前記絶縁体の表面粗さとの差は、80μm以上である請求項7に記載の熱電変換モジュール。
- 前記P型及びN型熱電変換部は、Bi-Te系材料を含み、
前記絶縁体は、耐熱ガラスまたは石英を含み、
前記層間絶縁膜は、イミド化合物またはアクリル樹脂を含む請求項2乃至8のいずれかに記載の熱電変換モジュール。 - 前記方向と直交する第2方向における前記拡散防止膜、前記P型及びN型熱電変換部、及び前記開口部の断面の形状は、円形であって、
前記方向と直交する第2方向において、前記拡散防止膜の外径寸法が、前記P型又はN型熱電変換部の外径寸法よりも小さく、かつ、前記開口部の内径寸法が、前記拡散防止膜の外径寸法よりも小さい請求項2乃至9のいずれかに記載の熱電変換モジュール。 - 前記P型及びN型熱電変換部の上側及び下側の各頂面は、前記方向において、前記絶縁体の上側及び下側の各頂面から突出し、
前記P型及びN型熱電変換素子は、前記方向において、前記P型及びN型熱電変換部の上側及び下側の各側面に間隙を有する、請求項1乃至10のいずれかに記載の熱電変換モジュール。 - 前記方向と直交する第2方向において隣接する前記P型及びN型熱電変換素子の間を離間する第2間隙を更に有する請求項1乃至11のいずれかに記載の熱電変換モジュール。
- 前記間隙には、減圧された気体が充填される請求項1乃至12のいずれかに記載の熱電変換モジュール。
- 前記間隙には、アルゴンが充填される請求項1乃至13のいずれかに記載の熱電変換モジュール。
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WO (1) | WO2014199541A1 (ja) |
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Cited By (16)
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US10141492B2 (en) * | 2015-05-14 | 2018-11-27 | Nimbus Materials Inc. | Energy harvesting for wearable technology through a thin flexible thermoelectric device |
JP2017092295A (ja) * | 2015-11-12 | 2017-05-25 | 日東電工株式会社 | 半導体装置の製造方法 |
JPWO2017159594A1 (ja) * | 2016-03-15 | 2019-01-24 | パナソニックIpマネジメント株式会社 | 熱電変換素子および熱電変換モジュール |
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US11424397B2 (en) | 2017-03-16 | 2022-08-23 | Lintec Corporation | Electrode material for thermoelectric conversion modules and thermoelectric conversion module using same |
JPWO2018168837A1 (ja) * | 2017-03-16 | 2020-01-16 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
WO2018168837A1 (ja) * | 2017-03-16 | 2018-09-20 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
JP7486949B2 (ja) | 2017-03-16 | 2024-05-20 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
JP2020510987A (ja) * | 2017-06-15 | 2020-04-09 | エルジー・ケム・リミテッド | 熱電モジュール |
US11349055B2 (en) | 2017-06-15 | 2022-05-31 | Lg Chem, Ltd. | Thermoelectric module |
WO2019146991A1 (ko) * | 2018-01-23 | 2019-08-01 | 엘지이노텍 주식회사 | 열전 모듈 |
JP2021512488A (ja) * | 2018-01-23 | 2021-05-13 | エルジー イノテック カンパニー リミテッド | 熱電モジュール |
EP3745480A4 (en) * | 2018-01-23 | 2021-11-10 | LG Innotek Co., Ltd. | THERMOELECTRIC MODULE |
US11730056B2 (en) | 2018-01-23 | 2023-08-15 | Lg Innotek Co., Ltd. | Thermoelectric module |
JP7407718B2 (ja) | 2018-01-23 | 2024-01-04 | エルジー イノテック カンパニー リミテッド | 熱電モジュール |
WO2022124674A1 (ko) * | 2020-12-10 | 2022-06-16 | 엘지이노텍 주식회사 | 열전 소자 |
Also Published As
Publication number | Publication date |
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JPWO2014199541A1 (ja) | 2017-02-23 |
EP2869354A1 (en) | 2015-05-06 |
EP2869354A4 (en) | 2015-10-21 |
CN104508846A (zh) | 2015-04-08 |
JP5696261B1 (ja) | 2015-04-08 |
US9496476B2 (en) | 2016-11-15 |
EP2869354B1 (en) | 2017-03-01 |
US20150179912A1 (en) | 2015-06-25 |
CN104508846B (zh) | 2016-02-10 |
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