WO2009001598A1 - 熱電モジュール及びその製造方法 - Google Patents

熱電モジュール及びその製造方法 Download PDF

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Publication number
WO2009001598A1
WO2009001598A1 PCT/JP2008/056328 JP2008056328W WO2009001598A1 WO 2009001598 A1 WO2009001598 A1 WO 2009001598A1 JP 2008056328 W JP2008056328 W JP 2008056328W WO 2009001598 A1 WO2009001598 A1 WO 2009001598A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric
thermoelectric module
terminals
manufacturing
electrode
Prior art date
Application number
PCT/JP2008/056328
Other languages
English (en)
French (fr)
Inventor
Kenichi Akabane
Original Assignee
Kyocera Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Priority to JP2009520383A priority Critical patent/JP4967018B2/ja
Publication of WO2009001598A1 publication Critical patent/WO2009001598A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　高い熱電特性を有すると同時に熱応力に対する優れた耐久性を有する熱電モジュールを提供する。 　その熱電モジュールは、それぞれ第１の端部と第２の端部とを有する複数の熱電素子と、隣り合う前記熱電素子の前記第１の端部間を接続する第１の電極と、隣り合う前記熱電素子の前記第２の端部間を接続する第２の電極と、を備え、前記熱電素子の前記第１の端部側の外周に、前記第２の端部から離れて設けられた第１の被覆層を有する。
PCT/JP2008/056328 2007-06-27 2008-03-31 熱電モジュール及びその製造方法 WO2009001598A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009520383A JP4967018B2 (ja) 2007-06-27 2008-03-31 熱電モジュール及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007169816 2007-06-27
JP2007-169816 2007-06-27

Publications (1)

Publication Number Publication Date
WO2009001598A1 true WO2009001598A1 (ja) 2008-12-31

Family

ID=40185421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056328 WO2009001598A1 (ja) 2007-06-27 2008-03-31 熱電モジュール及びその製造方法

Country Status (2)

Country Link
JP (1) JP4967018B2 (ja)
WO (1) WO2009001598A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2460182A1 (en) * 2009-07-27 2012-06-06 Corning Inc. A coating for thermoelectric materials and a device containing the same
WO2014010588A1 (ja) * 2012-07-10 2014-01-16 株式会社 東芝 熱電変換材料およびそれを用いた熱電変換モジュール並びに熱電変換材料の製造方法
JP2014123596A (ja) * 2012-12-20 2014-07-03 Kyocera Corp 熱電モジュール
CN104321890A (zh) * 2012-07-17 2015-01-28 株式会社东芝 热电转换材料及使用其的热电转换模块以及其制造方法
EP2869354A4 (en) * 2013-06-11 2015-10-21 Panasonic Ip Man Co Ltd THERMOELECTRIC CONVERSION MODULE
WO2022124674A1 (ko) * 2020-12-10 2022-06-16 엘지이노텍 주식회사 열전 소자

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023201062A1 (en) * 2022-04-15 2023-10-19 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113348U (ja) * 1989-02-23 1990-09-11
JPH11307824A (ja) * 1998-04-21 1999-11-05 Yamaha Corp 熱電モジュール
JP2001007411A (ja) * 1999-06-25 2001-01-12 Matsushita Electric Works Ltd 熱電素子モジュール
JP2003069090A (ja) * 2001-08-22 2003-03-07 Kyocera Corp 熱電材料の製造方法
JP2004193356A (ja) * 2002-12-11 2004-07-08 Kyocera Corp 熱電モジュール及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113348U (ja) * 1989-02-23 1990-09-11
JPH11307824A (ja) * 1998-04-21 1999-11-05 Yamaha Corp 熱電モジュール
JP2001007411A (ja) * 1999-06-25 2001-01-12 Matsushita Electric Works Ltd 熱電素子モジュール
JP2003069090A (ja) * 2001-08-22 2003-03-07 Kyocera Corp 熱電材料の製造方法
JP2004193356A (ja) * 2002-12-11 2004-07-08 Kyocera Corp 熱電モジュール及びその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2460182A1 (en) * 2009-07-27 2012-06-06 Corning Inc. A coating for thermoelectric materials and a device containing the same
EP2460182A4 (en) * 2009-07-27 2014-01-01 Corning Inc COATING OF THERMOELECTRIC MATERIALS AND DEVICE CONTAINING SAME
WO2014010588A1 (ja) * 2012-07-10 2014-01-16 株式会社 東芝 熱電変換材料およびそれを用いた熱電変換モジュール並びに熱電変換材料の製造方法
CN104321889A (zh) * 2012-07-10 2015-01-28 株式会社东芝 热电转换材料及使用其的热电转换模块以及其制造方法
US9837593B2 (en) 2012-07-10 2017-12-05 Kabushiki Kaisha Toshiba Thermoelectric conversion material, thermoelectric conversion module using the same, and manufacturing method of the same
CN104321890A (zh) * 2012-07-17 2015-01-28 株式会社东芝 热电转换材料及使用其的热电转换模块以及其制造方法
US9570667B2 (en) 2012-07-17 2017-02-14 Kabushiki Kaisha Toshiba Thermoelectric conversion material, thermoelectric conversion module using the same, and manufacturing method of the same
JP2014123596A (ja) * 2012-12-20 2014-07-03 Kyocera Corp 熱電モジュール
EP2869354A4 (en) * 2013-06-11 2015-10-21 Panasonic Ip Man Co Ltd THERMOELECTRIC CONVERSION MODULE
US9496476B2 (en) 2013-06-11 2016-11-15 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion module
WO2022124674A1 (ko) * 2020-12-10 2022-06-16 엘지이노텍 주식회사 열전 소자

Also Published As

Publication number Publication date
JP4967018B2 (ja) 2012-07-04
JPWO2009001598A1 (ja) 2010-08-26

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