Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/302—Cu as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
  • B21B—ROLLING OF METAL
  • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
  • B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/3006—Ag as the principal constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C30/00—Alloys containing less than 50% by weight of each constituent
  • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C5/00—Alloys based on noble metals
  • C22C5/06—Alloys based on silver
  • C22C5/08—Alloys based on silver with copper as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper

Definitions

• metal parts for. As steel parts, copper and copper alloys, nickel and nickel alloys, brass alloys or metallized ceramics to solder using non-ferrous solder. Typical solders include silver, gold, nickel and copper solders. Silver solders are more expensive and generally melt at lower temperatures than copper alloys.
• Silver solder or brazing alloys with manganese and / or nickel with copper content are e.g. As described in JP 57-149022, JP 57-149093 or in US-A-2 303 272.
• brazing of steel or free steel alloys is usually carried out with the known braze alloys "Braze 580" and "Braze 655", based on silver with the participation of Cu and Mn or furthermore containing nickel (Braze 655). Accordingly, it would be desirable to provide a silver solder alloy having improved wettability.
• the object was to provide a new, essentially zinc-free (and therefore suitable for vacuum applications) solder alloy, which provide a high cold workability, good wetting of precious and structural steels and a working temperature of 750 ° C to 900 ° C.
• the object is achieved by a solder alloy containing 20% by weight to 44% by weight of silver, 5% by weight to 15% by weight of gallium and ad 100% by weight of copper, wherein the constituents can contain unavoidable impurities.
• solder alloys containing 41 wt .-% to 75 wt .-% copper, 20 wt .-% to 44 wt .-% silver and 5 wt .-% to 15 wt .-% gallium, wherein the
• Solder alloy according to item 1 wherein the content of zinc must not exceed 0.01 wt .-%.
• Solder alloys according to item 1 or 2 consisting of 41% by weight to 75% by weight of copper, 20% by weight to 44% by weight of silver, 5% by weight to 15% by weight of gallium and 0 to 15% by weight of further alloy constituents,
• Solder alloys according to one or more of the preceding items containing 20% by weight to 44% by weight of silver and 5% by weight to 15% by weight of gallium, 0.1% by weight to 15% by weight ( or 0.1% to 10% by weight) of other alloying elements selected from the group consisting of indium, tin, germanium, titanium, manganese, silicon, nickel and theirs
• Solder alloys according to item 5 wherein indium is present in combination with tin, titanium or manganese as a further element.
• Solder alloy according to one or more of the preceding points, consisting of 48% by weight to 67% by weight of copper, 20% by weight to 25% by weight of silver, 5 to 15% by weight of gallium, 0% by weight. % to 15% by weight of manganese, 0 wt .-% to 3 wt .-% indium, wherein the content of manganese is greater than 10 wt .-%, when the gallium content is less than 10 wt .-% and the amounts are complementary to 100 wt .-%.
• Solder alloy according to one or more of the items 1 to 8 consisting of 58 wt .-% to 65 wt .-% copper, 20 wt .-% to 25 wt .-% silver, 5 to 15 wt .-% gallium, 0 wt. -% to 15 wt .-% manganese, 0 wt .-% to 3 wt .-% indium, wherein the content of manganese is greater than 10 wt .-%, when the gallium content is less than 10 wt .-%, and the Amounts to 100 wt .-% complement.
• Solder alloy according to item 9 or 10 wherein the content of gallium is greater than 10 wt .-%, when the manganese content is less than 10 wt .-%.
• Solder alloy according to one or more of items 1 to 8 consisting of 41% by weight to 54% by weight of copper, 38% by weight to 42% by weight of silver, 8 to 12% by weight of gallium, 0% by weight. -% to 5 wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• Solder alloy according to one or more of the items 1 to 8 consisting of 41 wt .-% to 52 wt .-% copper, 38 wt .-% to 42 wt .-% silver, 5 to 9 wt .-% gallium, 7 wt. -% to 12 wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• Solder alloy according to one or more of the items 1 to 8 consisting of 50 wt .-% to 64 wt .-% copper, 28 wt .-% to 34 wt .-% silver, 8 to 12 wt .-% gallium, 0 wt. -% to 5 wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• Solder alloy according to one or more of items 1 to 8 consisting of 45% by weight to 62% by weight of copper, 28% by weight to 34% by weight of silver, 5 to 9% by weight of gallium, 7% by weight.
• Solder alloys according to one or more of the preceding points containing 0.5% by weight to 7% by weight or 0.2% by weight to 4% by weight or 0.5% by weight to 3% by weight. % Indium.
• Solder alloys according to one or more of the preceding points containing 0.3% by weight to 3% by weight or or 0.5% by weight to 1.5% by weight of tin.
• Solder alloys according to one or more of the preceding points containing 0.3% by weight to 3% by weight, or 0.3% by weight to 1.5% by weight or 0.4% by weight to 1 Wt% or 0.5 wt% to 0.75 wt%
• Germanium Solder alloys according to one or more of the preceding points, containing 0.1% by weight to 4% by weight or 0.5% by weight to 2% by weight of titanium. Solder alloys according to one or more of the preceding points, containing 0.5% by weight to 15% by weight or 0.5% by weight to 10% by weight of manganese. Solder alloys according to one or more of the preceding points, containing 0.1% by weight to 1% by weight of silicon.
• Solder alloys according to one or more of the preceding points containing 0.1 wt .-% to 5 wt .-% or 1 wt .-% to 4 wt .-% or 0.3 wt .-% to 2 wt .-% nickel , Solder alloy, in particular according to one of the preceding items, consisting of 5 to 15% by weight of gallium, the remaining
• Composition (ad 100 wt .-%) Ag, Cu in the ratio of 25: 61 to 44: 45 contains.
• Solder alloys according to one or more of the preceding items wherein the weight ratio of copper to silver Cu / Ag is 1 to 2.1. 25. Solder alloys according to one or more of the preceding items, wherein the weight ratio of copper to gallium Cu / Ga is 4.5 to 7.5.
• Household appliances such as white goods, soldering jewelry and their combinations.
• a molded article comprising a solder alloy according to one or more of the protruding points in contact with at least one substrate.
• a molded article according to item 28 wherein the substrate is selected from the group consisting of copper and copper alloys, nickel and nickel alloys, brass alloys, structural steel (eg, S235),
• Stainless steel grades eg 1.4301 / 1.4306 / 1.4401 / 1.4404 / 1.4571
• nickel-plated, copper-plated or gold-plated ceramics eg 1.4301 / 1.4306 / 1.4401 / 1.4404 / 1.4571
• Soldering alloys is reduced to an achievable reduction in cold rolling greater than about 60%, or greater than about 80% and up to about 96% or about 99% or about 99.9% cold, without a
• a method for soldering substrates wherein a solder alloy according to any of items 1 to 25 is used and the soldering temperature in a range with a lower limit of 0.3 * (TL-Ts) + Ts and an upper limit of TL + 50 Kelvin, wherein TL the liquidus temperature and Ts the
• Solidus temperature of the respective solder alloy is.
• the substrate is selected from the group consisting of copper and copper alloys, nickel and nickel alloys, iron or iron alloys, brass alloys, structural steel (eg S235), stainless steel grades (eg 1.4301 / 1.4306 / 1.4401 / 1.4404 / 1.4571)
• Shaped article obtainable according to any one of items 30 to 35. Use according to item 26 or 27, shaped article according to any one of items 28, 29 or 36 and method according to any one of items 34 to 35, wherein between the solder and at least one substrate
• Interdiffusion zone forms.
• the substrate is iron or iron alloys or stainless steel such as stainless steel 1.4404.
• the solder alloy contains 20% by weight to 44% by weight of silver, 5% by weight to 15% by weight of gallium and ad 100% by weight of copper, the constituents
• the solder alloys contain 41 wt% to 75 wt% or 45 to 60 wt% copper, 20 wt% to 44 wt% silver, or 25 to 44 wt% or 30 to 44 wt% Silver, and 5 wt% to 15 wt% or 6 wt% to 14 wt%
• the solder alloy may comprise from 20% to 44% by weight of silver, from 5% to 15% by weight gallium, from 0.1% to 15% by weight, or 0.1% Wt .-% to 10 wt .-% of further alloying elements selected from the group consisting of indium, tin, germanium, titanium, manganese, silicon, nickel and their combinations and ad 100 wt .-% copper, wherein the constituents to 100 % By weight and unavoidable
• the solder alloys contain 41 wt% to 75 wt% or 45 to 60 wt% copper, 20 wt% to 44 wt% silver, or 25 to 44 wt% or 30 to 44 wt% Silver, 5 wt% to 15 wt% or 6 wt% to 14 wt% gallium, and 0.1 wt% to 15 wt% or 0.1 wt%. % to 10% by weight of further alloying elements selected from the group consisting of indium, tin, germanium, titanium, manganese, silicon, nickel and their combinations, the constituents being added to 100% by weight and containing unavoidable impurities.
• solder alloy contains indium in combination with tin, titanium, manganese or combinations thereof.
• the solder alloy may further comprise 0.5 wt% to 7 wt% indium, 0.3 wt% to 3 wt% tin, 0.3 wt% to 3 wt% germanium, or 0 , 3% by weight to 1.5 Wt .-% germanium, 0.1 wt .-% to 4 wt .-% titanium, 0.5 wt .-% to 15 wt .-% or 0.5 wt .-% to 10 wt .-% manganese , 0.1 wt .-% to 1 wt .-% silicon, 0.1 wt .-% to 5 wt .-% or 1 wt .-% to 4 wt .-% nickel or their combinations in the appropriate amounts , where the ingredients can be 100% complementary and contain unavoidable impurities.
• the alloys may also contain a total of up to 0.15% by weight of tolerated, unavoidable impurities, e.g. Lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, antimony, selenium, tellurium, iron, zinc, silicon, phosphorus, sulfur, platinum, palladium, lead, gold, aluminum, tin, Germanium, carbon, cadmium, scandium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, yttrium,
• tolerated, unavoidable impurities e.g. Lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, antimony, selenium, tellurium, iron, zinc, silicon, phosphorus, sulfur, platinum, palladium, lead, gold, aluminum, tin, Germanium, carbon, c
• the content of carbon should not be greater than 0.005 wt .-%, the contents of cadmium, phosphorus, lead and zinc not greater than 0.01 wt .-% each.
• the total content of the amount of lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, antimony, selenium, tellurium, sulfur is more preferably 0.01% by weight or less.
• the alloy consists of 48% by weight to 67% by weight of copper, 20% by weight to 25% by weight of silver, 5% to 15% by weight of gallium, 0% by weight to 15% Wt .-% manganese, 0 wt .-% to 3 wt .-% indium, wherein the content of manganese is greater than 10 wt .-%, when the gallium content is less than 10 wt .-% and the amounts to 100 Add% by weight. Good results are also achievable if the content of gallium is greater than 10% by weight, if the manganese content is less than 10% by weight.
• the alloy consists of 58 wt% to 65 wt% copper, 20 wt% to 25 wt% silver, 5 to 15 wt% gallium, 0 wt% to 15 Wt .-% manganese, 0 wt .-% to 3 wt .-% indium, wherein the content of manganese is greater than 10 wt .-%, when the gallium content is less than 10 wt .-% and the amounts to 100 Add% by weight. Good results are also achievable if the content of gallium is greater than 10% by weight, if the manganese content is less than 10% by weight.
• Silver contents of 20 wt .-% to 25 wt .-% have the desired properties, provided that the contents of gallium or manganese are above 10 wt .-%. In this case, with an indium content of 1 to 3 wt .-% also good results can be achieved.
• the alloy consists of 41 wt% to 54 wt% copper, 38 wt% to 42 wt% silver, 8 to 12 wt% gallium, 0 wt% to 5 Wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• the alloy consists of 41 wt% to 52 wt% copper, 38 wt% to 42 wt% silver, 5 to 9 wt% gallium, 7 wt% to 12 Wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• the alloy consists of 50 wt% to 64 wt% copper, 28 wt% to 34 wt% silver, 8 to 12 wt% gallium, 0 wt% to 5 Wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• the alloy consists of 45% to 62% copper by weight, 28% to 34% silver by weight, 5 to 9% gallium by weight, 7% to 12% by weight Wt .-% manganese, 0 wt .-% to 4 wt .-% indium, wherein the amounts to 100 wt .-% complement.
• solder alloys include: (1) a solder alloy consisting of 40% by weight of silver, 50% by weight of copper, and 10% by weight of gallium; or (2) a brazing alloy consisting of 40 wt% silver, 46.5 wt% copper, 10 wt% gallium, 3 wt% indium, and 0.5 wt% tin; or (3) a brazing alloy consisting of 5 to 15 weight percent gallium, the remaining composition (ad 100 weight percent) being Ag, Cu in the proportional ratio of 25: 61 to 44: 45.
• the weight ratio of copper to Silver Cu / Ag is generally 1 to 2.1, and the weight ratio of copper to gallium Cu / Ga is generally 4.5 to 7.5.
• solder alloy may be obtained in any manner known in the art and cast into the desired shape using any manner known in the art.
• the solder alloy can be in strip form, wire form, bar form, plate form, foil form, raw form, powder form,
• Shot form, platelet shape or paste form The alloy can be produced, for example, by chill casting. To produce a more homogeneous microstructure, it is also possible to use continuous continuous casting or an alloy granulator or alloy atomization.
• alloy powder production may be followed by subsequent compaction such as continuous
• Powder extrusion also known as TEMCONEX®.
• CIP Cold Isostatic Pressing
• the solder alloy may be brazed at a temperature in a range of about 750 ° C to 900 ° C, or from about 780 ° C to about 830 ° C, for a time sufficient to place the braze alloy on a substrate to melt, which, for example, from a ferrous material, eg. As steel or stainless steel is formed.
• a ferrous material eg. As steel or stainless steel is formed.
• Structural steel e.g., S235
• stainless steel grades e.g., 1.4301 / 1.4306 / 1.4401 / 1.4404 / 1.4571.
• soldering may be performed using a furnace, locally using a blowtorch, using an induction heater, immersed in a solder or flux bath, by resistance heating,
• Soldering may include soldering in an inert gas atmosphere, e.g. B.
• solder alloy of the present invention melts in these
• Interdiffusion zone occurs during soldering and is advantageous and desirable as active interaction between solder and substrate.
• an interdiffusion zone generally does not occur during the brazing of stainless steels.
• the solder alloy of the present invention may, inter alia, be used to braze steel surfaces, particularly stainless steel surfaces.
• an iron-containing alloy substrate it is also possible to use copper or copper alloys, nickel or nickel alloys,
• Contact materials such as CuCr, AgSn02 and AgWC materials or nickel-plated / copper-plated / gold-plated ceramics are used.
• the present patent application therefore also relates to corresponding shaped articles.
• solder alloys are suitable, for example, for vacuum applications, such as sealing of or against vacuum, in
• Vacuum switch chambers Vacuum switch chambers, X-ray tubes or in cooler construction, but also for soldering contacts, in switches or the automotive industry. Also for soldering tools such as in the soldering of hard metals or brazing in the field of refrigeration or air conditioning, in plant and special machinery are the
• solder alloys lie in their good cold workability despite the high gallium concentration in the alloy. On the one hand, this property improves the mechanical stability of the solder joint. On the other hand, the solder alloy can thus be easier to be formed by rolling, forging, wire drawing or extrusion, especially during cold forming by rolling, forging or wire drawing, since up to an achievable reduction in cold rolling greater than about 60%, or greater than about 80%, and up to about 96%, or about 99%, or about 99.9% can be performed without a heat treatment such as a recovery or recrystallization anneal , Subsequently, after a cold forming of about 60% to about 99.9%, a
• Such a heat treatment may be carried out at temperatures of 400 ° C to 600 ° C, or from 400 ° C to 550 ° C.
• the duration of the heat treatment may generally be from 30 minutes to 300 minutes, or 60 minutes to 150 minutes, or 90 minutes to 140 minutes.
• the heat treatment may be carried out in vacuum or in an inert gas such as argon or nitrogen or in a reducing atmosphere such as forming gas (eg N2 / H2 95/5, N2 / H2 80/20, N2 / H2 50/50) or hydrogen.
• forming gas eg N2 / H2 95/5, N2 / H2 80/20, N2 / H2 50/50
• solder alloys described can also be used on surfaces that are not or not completely deoxidized, ie surfaces with incomplete oxide removal.
• the solder alloys described wet them well and can be soldered well.
• chromium-containing stainless steels which are a natural layer of chromium (III) oxide on the
• soldering can be performed well with the solder alloys in a certain temperature interval whose upper limit is defined by TL + 50 Kelvin and whose lower limit is 0.3 * (TL-Ts) + Ts, where TL is the liquidus temperature and Ts is the solidus temperature of the respective solder alloy is.
• An embodiment therefore also relates to a method for soldering
• Substrates preferably of steel, wherein the solder alloy is used and the soldering temperature is in a range with a lower limit of 0.3 * (TL-Ts) + Ts and an upper limit of TL + 50 Kelvin, where TL is the liquidus temperature and Ts is the solidus temperature the respective solder alloy is.
• the listed alloys were obtained by chill casting the corresponding alloying ingredients. The melting took place in one
• the size of the lugs was 500 g each of the solder alloy.
• the resulting alloys were further processed by rolling and oven-soldered at a temperature of 830 ° C for brazing stainless steel 1.4404 on a substrate of the same material (Edelstahll .4404) in vacuum. Wetting was assessed visually. The cold workability was reduced by reduction in rolling and solidus or liquidus temperatures
• DSC Differential calorimetry
• Composition CuAg40Gal0 was the achievable reduction in thickness during cold rolling without heat treatment 96%, the solidus temperature 724 ° C and the liquidus temperature 846 ° C.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Adornments (AREA)
• Conductive Materials (AREA)

Priority Applications (7)

Applications Claiming Priority (2)

Related Child Applications (2)

Publications (3)

Family

ID=47561446

Family Applications (1)

Country Status (8)

Families Citing this family (13)

Citations (3)

Family Cites Families (16)

• 2013
  • 2013-01-18 EP EP13151874.8A patent/EP2756914A1/de not_active Withdrawn
• 2014
  • 2014-01-17 PL PL14702765T patent/PL2945772T3/pl unknown
  • 2014-01-17 KR KR1020147010733A patent/KR102204246B1/ko active IP Right Grant
  • 2014-01-17 DE DE112014000475.8T patent/DE112014000475B4/de active Active
  • 2014-01-17 CN CN201480000173.1A patent/CN104411450B/zh active Active
  • 2014-01-17 JP JP2015553099A patent/JP6464096B2/ja active Active
  • 2014-01-17 WO PCT/EP2014/050937 patent/WO2014111538A2/de active Application Filing
  • 2014-01-17 EP EP14702765.0A patent/EP2945772B1/de active Active
  • 2014-01-17 US US14/345,646 patent/US20150306709A1/en not_active Abandoned
• 2019
  • 2019-10-03 US US16/592,504 patent/US20200030921A1/en not_active Abandoned

Patent Citations (3)

Also Published As

Similar Documents

Legal Events