WO2014098159A1 - ガラス基板表面の異物除去方法 - Google Patents
ガラス基板表面の異物除去方法 Download PDFInfo
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- WO2014098159A1 WO2014098159A1 PCT/JP2013/083984 JP2013083984W WO2014098159A1 WO 2014098159 A1 WO2014098159 A1 WO 2014098159A1 JP 2013083984 W JP2013083984 W JP 2013083984W WO 2014098159 A1 WO2014098159 A1 WO 2014098159A1
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- Prior art keywords
- glass substrate
- aqueous solution
- dross
- mass
- metal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/244—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass continuous
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
Definitions
- the present invention relates to a method for removing foreign matter on the surface of a glass substrate.
- the main manufacturing method for glass substrates is the float method. This is accomplished by continuously flowing molten glass on a bath surface filled with molten metal tin, called a molten metal bath, to form a glass ribbon, and advancing the glass ribbon while floating along the molten metal bath surface. This is an excellent method for mass production of highly flat glass substrates.
- a foreign substance called dross may be generated on the lower surface side of the glass ribbon in contact with the molten tin.
- Dross is a convex adhesion defect that is scattered like dots when the glass is visually observed under a fluorescent lamp.
- the generated dross is often an oxide of metal tin that is a metal component of a molten metal bath, that is, a tin oxide-based dross containing tin oxide (SnO 2 ) as a main component. .
- the glass substrate manufactured by the float method is a glass substrate for a flat panel display such as a liquid crystal display or a plasma display panel
- a tin oxide-based dross is present on the substrate surface.
- tin oxide-based dross found on the substrate surface is removed by polishing the glass substrate surface by 2 ⁇ m or more. From the viewpoint of improving productivity, it is desirable to reduce this polishing amount. For this reason, it is desirable that tin oxide-based dross existing on the surface of the glass substrate be removed to some extent before polishing.
- Patent Document 1 discloses that a float glass substrate is immersed in an inorganic acid aqueous solution containing divalent chromium ions. A method for dissolving and removing minute foreign substances existing on the surface is disclosed.
- Patent Document 2 the glass substrate is immersed in a hydrofluoric acid aqueous solution or an acidic aqueous solution containing divalent chromium ions to remove minute foreign substances existing on the substrate surface, and then the substrate surface is polished. A method is disclosed.
- the maximum diameter on the substrate surface is 10 ⁇ m. If the above dross exists, it can be visually confirmed, which is a drawback of the glass substrate. In this case, not only tin oxide-based dross, but also dross containing other metal oxide as a main component, for example, dross containing alumina (Al 2 O 3 ) or zirconia (ZrO 2 ) as a main component, Dross mainly composed of glass cullet is also a problem.
- the first form is a form in which grains having dimensions of the order of several hundreds of nanometers are gathered, and hereinafter referred to as “normal dross” in the present specification. This normal dross is considered to be generated when tin oxide particles adhering to the conveyance roller of the glass ribbon are transferred to the glass ribbon.
- production cause of dross other than the above-mentioned tin oxide type that is, dross mainly containing alumina (Al 2 O 3 ) or zirconia (ZrO 2 ), or dross mainly containing glass cullet is also the same. Conceivable.
- the second form is centered on granular tin oxide having a size of several ⁇ m, and a thin film of tin oxide of several tens of nm spread around the granular tin oxide. Called "Dress Remaining Dross". It is considered that this residual mold dross is tin oxide in the process in which the metallic tin adhering to the lower surface side of the glass ribbon is crushed by the conveying roller.
- the normal dross in which grains of the order of several hundreds of nanometers gather can be removed relatively easily by polishing the substrate surface without fear of breaking the wiring formed on the substrate surface.
- the residual mold dross the granular portion can be removed relatively easily by polishing, but the thin film-like portion existing around it is difficult to apply polishing pressure and is hard to wear away. As shown in FIG. 1, even if the polishing amount is increased, it is difficult to remove completely. Moreover, it is difficult to detect a thin film portion of several tens of nm in the remaining mold dross.
- an object of the present invention is to provide a method suitable for removing dross existing on the surface of a glass substrate manufactured by a float process, in particular, residual mold dross.
- Another object of the present invention is to provide a method suitable for removal of normal dross and dross other than the tin oxide system described later.
- the present invention provides an aqueous inorganic acid solution having a pH of 3 or less containing at least one ion selected from the group consisting of chlorine ion, iodine ion, bromine ion, fluorine ion, and sulfate ion, zinc, At least one metal selected from the group consisting of iron and aluminum was produced by a float process so that the supply amount per unit area of the inorganic acid and the metal was 1 g / m 2 or more, respectively. After supplying the glass substrate to the contact surface with the molten metal bath and etching the surface, mechanical polishing or chemical machinery is performed so that the polishing amount is 0.1 ⁇ m or more and 2 ⁇ m or less. There is provided a foreign substance removal method (1) (hereinafter sometimes referred to as the method (1) of the present invention) characterized by polishing.
- a foreign substance removal method (1) hereinafter sometimes referred to as the method (1) of the present invention
- the inorganic acid aqueous solution contains 0.1% by mass or more of hydrogen chloride (HCl). Further, in the method of the present invention (1), it is preferable that the aqueous solution of the inorganic acid contains at least 0.1 wt% sulfuric acid (H 2 SO 4). In the method (1) of the present invention, it is preferable that the inorganic acid aqueous solution contains 0.5 to 20% by mass of hydrogen fluoride (HF).
- HCl hydrogen chloride
- aqueous solution of the inorganic acid contains at least 0.1 wt% sulfuric acid (H 2 SO 4).
- the inorganic acid aqueous solution contains 0.5 to 20% by mass of hydrogen fluoride (HF).
- the present invention provides at least one selected from the group consisting of an inorganic acid aqueous solution having a pH of 3 or less, a hydrogen fluoride (HF) aqueous solution, zinc, iron and aluminum, selected from the group consisting of hydrochloric acid and sulfuric acid.
- a hydrogen fluoride (HF) aqueous solution having a pH of 3 or less
- HF hydrogen fluoride
- zinc, iron and aluminum selected from the group consisting of hydrochloric acid and sulfuric acid.
- a foreign substance removing method (2) on the surface of a glass substrate characterized in that the glass substrate manufactured by the float process is supplied to a contact surface with a molten metal bath and the surface is etched.
- the method (2) of the present invention it may be referred to as the method (2) of the present invention.
- the inorganic acid aqueous solution is a 0.1% by mass or more hydrogen chloride (HCI) aqueous solution.
- HCI hydrogen chloride
- the inorganic acid aqueous solution is preferably 0.1 mass% or more sulfuric acid (H 2 SO 4) aqueous solution.
- the hydrogen fluoride aqueous solution preferably contains 0.1 to 3% by mass of hydrogen fluoride.
- the hydrogen fluoride aqueous solution preferably contains 0.5 to 20% by mass of hydrogen fluoride.
- the metal is preferably supplied as a slurry dispersed in a solvent.
- the slurry preferably has a metal content of 1% by mass or more.
- at least one metal selected from the group consisting of zinc, iron and aluminum at least one selected from the group consisting of manganese, magnesium and nickel Metal may be supplied to the surface.
- the surface to be etched may be subjected to preliminary cleaning using a cleaning liquid of water or an alkaline aqueous solution having a pH of 10 or more.
- the glass substrate is preferably a glass substrate for a flat panel display.
- the glass substrate is preferably a glass substrate for a cover glass.
- the present invention also provides a glass substrate treated by the methods (1) and (2) of the present invention.
- tin oxide-based dross existing on the surface of a glass substrate manufactured by the float process can be removed very quickly.
- an inorganic acid aqueous solution containing at least one ion selected from the group consisting of chlorine ion, iodine ion, bromine ion, fluorine ion and sulfate ion, and zinc, iron and aluminum are used.
- the amount of waste liquid generated is small and toxic hexavalent compared to the method of immersing the glass substrate in the etching solution. Since there is no possibility of generating chromium, the burden of waste liquid treatment is eased. Further, in the method (1) of the present invention, the amount of polishing for making the surface of the glass substrate smooth without any residual mold dross can be as small as 0.1 ⁇ m or more and 2 ⁇ m or less. Will improve.
- normal dross and tin oxide other than tin oxide can be removed very quickly among tin oxide-based dross present on the surface of the glass substrate produced by the float process.
- an inorganic acid aqueous solution composed of hydrochloric acid and sulfuric acid, an aqueous hydrogen fluoride solution, and at least one metal selected from the group consisting of zinc, iron and aluminum are used on a glass substrate. Since it is supplied to the etching treatment surface, the amount of waste liquid generated is less than that in the method of immersing in the etching treatment liquid, and toxic hexavalent chromium is not generated, so the burden of waste liquid treatment is reduced.
- FIG. 1 is a graph showing the relationship between the polishing amount of the glass substrate and the disappearance rate of the dross existing on the surface of the glass substrate for each of the normal dross and the remaining mold dross.
- FIGS. 2A to 2C are schematic views showing the etching mechanism in the method (1) of the present invention.
- FIG. 3 is a graph showing the relationship between the polishing amount of the glass substrate and the disappearance rate of the residual mold dross existing on the glass substrate surface for Example 2, Comparative Example 2 and Comparative Example 3.
- FIG. 4 is a graph showing the relationship between the polishing amount of the glass substrate and the disappearance rate of normal dross existing on the tin contact surface of the glass substrate in Example 3 and Comparative Example 4.
- the method (1) of the present invention is a method for removing tin oxide-based dross existing on the surface of a glass substrate produced by the float process, in particular, residual mold dross.
- the method (1) of the present invention is suitable for application to a glass substrate for a flat panel display, where there is a risk of disconnection of wiring formed on the substrate surface when tin oxide-based dross exists on the substrate surface.
- an inorganic acid aqueous solution having a pH of 3 or less containing at least one ion selected from the group consisting of chlorine ion, iodine ion, bromine ion, fluorine ion, and sulfate ion, zinc, iron and aluminum And at least one metal selected from the group consisting of: a glass substrate produced by a float process so that the supply amount per unit area of the inorganic acid and the metal is 1 g / m 2 or more, respectively.
- FIG. 1 is a graph showing the relationship between the polishing amount of the glass substrate and the loss rate of dross for each of the normal dross and the remaining mold dross.
- the loss rate of dross is the number of samples in which dross is removed with respect to the total number by polishing a plurality of samples (size: 50 mm square, non-alkali glass) each having one dross attached at the same polishing amount.
- the removal of dross was confirmed while increasing the polishing amount. This also applies to Examples 2 to 3 and Comparative Examples 2 to 4 described later.
- the number of samples of the normal dross is 16, and the number of samples of the remaining mold dross is 37.
- the sample was polished using a foamed polyurethane polishing pad (D hardness: 30 degrees, JIS K6253, established in 2012) and cerium oxide as the abrasive. The load was 5 kPa).
- FIGS. 2A to 2C are schematic views showing the etching mechanism in the method (1) of the present invention.
- the upper surface is a contact surface with the molten metal bath during the production by the float process.
- the contact surface with the molten metal bath at the time of manufacture by the float process is also referred to as “tin contact surface of the glass substrate”.
- FIG. 2A there is a mold residue dross on the tin contact surface (upper surface) of the glass substrate.
- This type residual dross is centered on tin oxide grains having a size of several ⁇ m, and a SnO 2 diffusion region is formed on the glass substrate from the SnO 2 particles as a thin film having a thickness of several tens of nm.
- an aqueous solution of hydrogen chloride is used as an aqueous inorganic acid solution having a pH of 3 or less containing at least one ion selected from the group consisting of chlorine ions, iodine ions, bromine ions, fluorine ions, and sulfate ions, zinc, Zinc (Zn) was used as at least one metal selected from the group consisting of iron and aluminum.
- Zinc (Zn) supplied to the tin contact surface (upper surface) of the glass substrate reacts with hydrogen chloride to generate active hydrogen (H + ) (the following formula (1)).
- H + active hydrogen
- the active hydrogen (H + ) generated in this way acts on the residual mold dross existing on the tin contact surface (upper surface) of the glass substrate, as shown in FIG. 2B, and the surface of the SnO 2 grains and the SnO 2 2 Tin oxide (SnO 2 ) present in the diffusion region is reduced to metal tin (Sn) (the following formula (2)).
- FIG. 2B the portion reduced to metal tin (Sn) by the action of active hydrogen is shown in a dark gray tone.
- reaction site became metallic tin (Sn) by reduction with hydrogen chloride (HCl), as shown in FIG. 2 (C), four as tin chloride (SnCl 4), tin contact surfaces of the glass substrate ( Is removed from the upper surface (formula (3) below).
- the inorganic acid aqueous solution containing at least one ion selected from the group consisting of chlorine ion, iodine ion, bromine ion, fluorine ion, and sulfate ion is used in the above (1). This is because the presence of chlorine ions, iodine ions, bromine ions, fluorine ions, or sulfate ions is required for the progress of the reaction shown in (3).
- Examples of the inorganic acid aqueous solution containing the above ions include hydrogen fluoride, hydrogen bromide (HBr), hydrogen iodide (HI), perchloric acid (HClO 4 ), iodic acid (HIO 3 ) or sulfuric acid in addition to hydrogen chloride.
- An aqueous solution of (H 2 SO 4 ) can be used, and an aqueous solution containing a plurality of these acids can also be used.
- an aqueous solution of hydrogen chloride, sulfuric acid (H 2 SO 4 ) or hydrogen fluoride is preferable for reasons such as high etching action and availability, and an aqueous hydrogen chloride solution is more preferable.
- an inorganic acid aqueous solution having a pH of 3 or less is used as an etching treatment liquid. This is because the etching process does not proceed. More preferably, an inorganic acid aqueous solution having a pH of 2 or less is used, and an inorganic acid aqueous solution having a pH of 1 or less is more preferably used.
- an aqueous hydrogen chloride solution is used as the inorganic acid aqueous solution having a pH of 3 or less, an aqueous solution containing 0.1% by mass or more of hydrogen chloride is preferable for exhibiting an etching action, and an aqueous solution containing 1% by mass or more is preferable. It is more preferable that the aqueous solution contains 10% by mass or more.
- the hydrogen chloride content is preferably 35% by mass or less, and more preferably 30% by mass or less.
- an aqueous sulfuric acid (H 2 SO 4 ) solution is used as the inorganic acid aqueous solution having a pH of 3 or less
- an aqueous solution containing 0.1% by mass or more of sulfuric acid (H 2 SO 4 ) is preferable in order to exert an etching action.
- the aqueous solution containing 1% by mass or more is more preferable, and the aqueous solution containing 10% by mass or more is more preferable.
- the content of sulfuric acid (H 2 SO 4 ) is preferably 50% by mass or less and more preferably 40% by mass or less from the viewpoint of preventing corrosion of the apparatus and suppressing the formation of metal sulfide.
- an aqueous hydrogen fluoride solution When an aqueous hydrogen fluoride solution is used as the aqueous inorganic acid solution having a pH of 3 or less, an aqueous solution containing 0.5 to 20% by mass of hydrogen fluoride is preferable. If the aqueous solution contains 0.5% by mass or more of hydrogen fluoride, the etching effect of the residual mold dross will be sufficient. On the other hand, if the aqueous solution contains 20% by mass or less of hydrogen fluoride, there is no possibility of causing a concave defect called a pit on the tin contact surface of the glass substrate due to the etching action of the glass substrate by hydrogen fluoride.
- the content of hydrogen fluoride is more preferably 1 to 15% by mass. When the content of hydrogen fluoride is 1 to 15% by mass, the etching rate can be easily controlled and the life of the aqueous solution can be extended.
- iron (Fe) or aluminum (Al) can be used in addition to zinc (Zn). This is because the reaction of the above formula (1) proceeds in the presence of these metals. Two or more of these metals may be used in combination. Among these, zinc (Zn) is preferable because of its high etching action.
- zinc (Zn) is preferable because of its high etching action.
- in addition to at least one metal selected from the group consisting of zinc, iron and aluminum it is selected from the group consisting of manganese (Mn), magnesium (Mg) and nickel (Ni). At least one kind of metal may be used in combination. The combined use of these metals is expected to promote the reaction of the above formula (1).
- the tin contact surface of the glass substrate When the etching process is performed in an atmosphere in which oxygen is present, it is preferable to supply the tin contact surface of the glass substrate as a slurry in which a metal such as zinc (Zn) is dispersed in a solvent. Water or the like can be used as the solvent used for this purpose. In addition, a viscosity modifier such as polyethylene glycol may be added to this solvent.
- the metal content in the slurry is preferably 1% by mass or more, more preferably 5% by mass or more, in order to exert an etching action. More preferably, the content is at least mass%. If the metal content in the slurry is 10% by mass or more, it is preferable for increasing the etching rate. Particularly preferably, the content of the metal in the slurry is 15% by mass or more and 70% by mass or less.
- the inorganic acid aqueous solution having a pH of 3 or less is made of tin on the glass substrate so that the supply amount of inorganic acid per unit area (when the inorganic acid aqueous solution is a hydrogen chloride aqueous solution) is 1 g / m 2 or more. Supply to contact surface. When the supply amount of the inorganic acid per unit area is less than 1 g / m 2 , the etching action of the residual mold dross becomes insufficient.
- the amount of the inorganic acid supplied per unit area is preferably 5 g / m 2 or more, more preferably 10 g / m 2 or more, and further preferably 20 g / m 2 or more.
- the supply amount of the inorganic acid per unit area is 20 g / m 2 or more, it is preferable because the etching rate is increased. Particularly preferably, the supply amount of the inorganic acid per unit area is 25 g / m 2 or more and 200 g / m 2 or less.
- At least one metal selected from the group consisting of zinc, iron and aluminum is supplied to the tin contact surface of the glass substrate so that the supply amount per unit area is 1 g / m 2 or more.
- a metal such as zinc is supplied as a slurry dispersed in a solvent, the supply is performed so that the supply amount per unit area of each metal contained in the slurry is 1 g / m 2 or more.
- the supply amount of metal per unit area is less than 1 g / m 2 , the etching action of the residual mold dross becomes insufficient.
- the supply amount of metal per unit area is preferably 2 g / m 2 or more, more preferably 5 g / m 2 or more, further preferably 10 g / m 2 or more. Particularly preferably, the supply amount of the metal per unit area is 12 g / m 2 or more and 100 g / m 2 or less.
- the supply form of the aqueous inorganic acid solution having a pH of 3 or less is not particularly limited.
- the inorganic acid aqueous solution may be sprayed onto the tin contact surface of the glass substrate using a nozzle or the like, or the inorganic acid aqueous solution may be applied using a roll coater or the like.
- a metal such as zinc in a slurry dispersed in a solvent
- the slurry may be sprayed to the etched surface of the glass substrate using a nozzle or the like, or using a roll coater or the like. May be applied.
- a liquid circulation coating method called flow coating or curtain coating is also possible.
- the metal powder When a metal such as zinc is supplied as a metal powder, the metal powder may be sprayed using a nozzle or the like, and a method using a sieve or a method using static electricity can also be used.
- An inorganic acid aqueous solution having a pH of 3 or less and a metal such as zinc may be supplied to the entire tin contact surface of the glass substrate, or only to a portion of the tin contact surface of the glass substrate where the residual mold dross exists. Also good.
- the tin contact surface of the glass substrate is the upper surface, but the orientation of the glass substrate during the etching process is not limited to this, and the tin contact surface of the glass substrate is the lower surface.
- the etching process may be performed in the state. In this case, an inorganic acid aqueous solution having a pH of 3 or less and a metal such as zinc are supplied from below the glass substrate.
- the etching treatment time is preferably 0.1 seconds or more in order to exhibit the etching action of the residual mold dross, more preferably 1 second or more, and further preferably 10 seconds or more.
- an aqueous hydrogen fluoride solution is used as the inorganic acid aqueous solution, if the etching time is too long, the glass etching action by hydrogen fluoride may cause a concave defect called a pit on the tin contact surface of the glass substrate. .
- the etching processing time is preferably 300 seconds or shorter, and more preferably 60 seconds or shorter.
- the tin contact surface of the glass substrate is washed with water, an alkaline detergent, an acidic detergent, or a diluted acid.
- the tin contact surface of the glass substrate etched by the above procedure is mechanically or chemically mechanically polished so that the polishing amount is 0.1 ⁇ m or more and 2 ⁇ m or less.
- the polishing amount is 0.1 ⁇ m or more and 2 ⁇ m or less.
- the etching process described above is performed, and the etched surface (tin contact surface) is machined. Dross is usually removed by polishing or chemical mechanical polishing.
- Metal tin covered with tin oxide (SnO 2 ) on the back side with respect to the tin contact surface of the glass substrate that is, the surface on which the glass ribbon was not in contact with the molten metal bath during the float process.
- the method of the present invention is applied to the back surface side with respect to the tin contact surface of the glass substrate, that is, the above-described etching treatment is performed on the back surface side, and the etched surface is removed.
- mechanical polishing or chemical mechanical polishing it is possible to easily remove foreign substances mainly composed of metallic tin covered with tin oxide (SnO 2 ).
- polishing glass substrates For mechanical polishing and chemical mechanical polishing, the usual procedures used for polishing glass substrates can be applied.
- a polishing pad made of polyurethane foam and a polishing agent such as colloidal silica, alumina, zirconia are used, and a polishing machine such as a 4B single-side polishing machine, an Oscar type polishing machine, or a continuous type polishing machine is used.
- a polishing machine such as a 4B single-side polishing machine, an Oscar type polishing machine, or a continuous type polishing machine is used.
- a polishing pad made of polyurethane foam and a polishing agent containing cerium oxide are used, and predetermined using a polishing machine such as a 4B single-side polishing machine, an Oscar type polishing machine, or a continuous type polishing machine.
- the polishing load is used.
- the polishing load is preferably 20 to 200 g / cm 2 .
- the polishing rate is high, and it takes a short time to achieve a predetermined polishing amount.
- the polishing load is 200 g / cm 2 or less, even if a crack occurs at the edge of the glass substrate, the crack does not expand and the glass substrate is not damaged.
- the polishing load is more preferably 40 to 190 g / cm 2 , further preferably 60 to 180 g / cm 2 .
- the hardness of the polishing pad to be used is preferably D hardness 80 degrees or less, A hardness (JIS K6253, established in 2012) 10 degrees or more, D hardness 70 degrees or less, A hardness of 20 or more is more preferable.
- the hardness of the polishing pad to be used is D hardness 80 degrees or less, there is no possibility of scratching the tin contact surface of the glass substrate due to polishing.
- the polishing rate is high and a short time is required to achieve a predetermined polishing amount.
- the polishing may be performed in two or three stages, and polishing pads having different hardnesses within the above hardness range may be used in each polishing stage.
- the above-described etching treatment is performed on the tin contact surface of the glass substrate, and the etched surface (tin contact surface) is mechanically polished or chemically mechanically polished.
- the mold residue dross existing on the tin contact surface is removed. If dross in a form other than the mold remaining dross on the tin contact surface of the glass substrate, that is, if normal dross exists, these dross are also removed.
- the method (1) of the present invention can be widely applied to glass substrates produced by the float process, but is particularly preferably applied to glass substrates for flat panel displays in which the presence of residual mold dross is a problem.
- the method (2) of the present invention is a method for removing dross existing on the surface of a glass substrate produced by the float process, and both of normal dross and dross other than tin oxide are selected from tin oxide-based dross. Is to be removed.
- the reason why only the normal dross is removed from the tin oxide-based dross is as follows. In the case of highly viscous glass such as non-alkali glass used for glass substrates for flat panel displays, the temperature of the forming zone in the float process is high, so the metal tin adhering to the surface of the glass ribbon burns and the mold remains Dross is extremely likely to occur.
- the temperature of the forming zone in the float process is 100 ° C. or higher compared to high viscosity glass such as alkali-free glass. Since it is low, metallic tin adhering to the surface of the glass ribbon does not burn, and no mold residue dross is generated. For this reason, only normal dross can be targeted for removal.
- the method (2) of the present invention is suitable for application to a glass substrate that is not used for polishing the substrate surface during the production process.
- a glass substrate is a glass substrate for cover glass.
- the glass substrate for the cover glass is problematic because it can be visually confirmed when dross having a maximum diameter of 10 ⁇ m or more is present on the substrate surface, resulting in a defect of the glass substrate.
- the polishing process of the substrate surface is not usually performed in the manufacturing process, and the manufacturing cost This is undesirable because it leads to an increase in
- the method (2) of the present invention selected from the group consisting of hydrochloric acid and sulfuric acid, an inorganic acid aqueous solution having a pH of 3 or less, a hydrofluoric acid (HF) aqueous solution, zinc, iron and aluminum. Glass produced by a float process so that the supply amount per unit area of the inorganic acid aqueous solution, the hydrogen fluoride aqueous solution, and the metal is 1 g / m 2 or more.
- the substrate is supplied to the contact surface with the molten metal bath, and the surface is etched.
- the mechanism of the etching process in the method (2) of the present invention is as follows.
- the normal dross to be removed by the method (2) of the present invention is a form in which grains having dimensions of the order of several hundreds of nanometers are gathered on the tin contact surface of the glass substrate, that is, tin oxide It exists as particles.
- dross other than tin oxide that is, dross mainly composed of alumina (Al 2 O 3 ) or zirconia (ZrO 2 ), or dross mainly composed of glass cullet
- hydrogen fluoride for the glass substrate It is removed by the etching action. That is, dross containing alumina (Al 2 O 3 ) or zirconia (ZrO 2 ) as a main component is peeled off when the glass substrate is etched to reduce the contact area with the substrate.
- dross containing glass cullet as a main component is peeled by reducing the contact area with the substrate by etching the glass substrate.
- dross itself may disappear due to the etching action of hydrogen fluoride.
- the etching action of hydrogen fluoride in the method of the present invention is weaker than the method of immersing a glass substrate in a hydrogen fluoride aqueous solution as in the method disclosed in Patent Document 2, the etching action is weak on the substrate surface. There is no risk of causing a concave defect called a pit.
- An inorganic acid aqueous solution selected from the group consisting of hydrochloric acid (HCl) and sulfuric acid (H 2 SO 4 ) is used for the progress of the reactions shown in the above formulas (1) and (3) for chlorine ions, or This is because the presence of sulfate ions is required.
- HCl hydrochloric acid
- H 2 SO 4 sulfuric acid
- hydrogen chloride is preferred for reasons such as high etching action and availability.
- an inorganic acid aqueous solution having a pH of 3 or less is used as an etching treatment liquid because, when the pH of the etching treatment liquid is higher than 3, tin oxide (SnO 2 ), which is usually the main component of dross. Is passivated, and the etching process does not proceed. More preferably, an inorganic acid aqueous solution having a pH of 2 or less is used, and an inorganic acid aqueous solution having a pH of 1 or less is more preferably used.
- an aqueous hydrogen chloride solution is used as the inorganic acid aqueous solution having a pH of 3 or less, an aqueous solution containing 0.1% by mass or more of hydrogen chloride is preferable for exhibiting an etching action, and an aqueous solution containing 1% by mass or more is preferable. It is more preferable that the aqueous solution contains 10% by mass or more.
- the hydrogen chloride content is preferably 35% by mass or less, and more preferably 30% by mass or less.
- an aqueous sulfuric acid (H 2 SO 4 ) solution is used as the inorganic acid aqueous solution having a pH of 3 or less
- an aqueous solution containing 0.1% by mass or more of sulfuric acid (H 2 SO 4 ) is preferable in order to exert an etching action.
- the aqueous solution containing 1% by mass or more is more preferable, and the aqueous solution containing 10% by mass or more is more preferable.
- the content of sulfuric acid (H 2 SO 4 ) is preferably 50% by mass or less and more preferably 40% by mass or less from the viewpoint of preventing corrosion of the apparatus and suppressing the formation of metal sulfide.
- the hydrogen fluoride aqueous solution is used as the etching treatment liquid because the etching action on the glass is required as described above.
- an aqueous solution containing 0.1 to 3% by mass of hydrogen fluoride can be used as the hydrofluoric acid aqueous solution. If the aqueous solution contains 0.1% by mass or more of hydrogen fluoride, the etching action of hydrogen fluoride on the glass substrate is sufficient to remove dross other than tin oxide. On the other hand, if the aqueous solution contains 3% by mass or less of hydrogen fluoride, there is no possibility of causing a concave defect called a pit on the tin contact surface of the glass substrate due to the etching action of hydrogen fluoride on the glass substrate.
- the content of hydrogen fluoride is more preferably 0.2 to 2% by mass. When the content of hydrogen fluoride is 0.2 to 2% by mass, the etching rate can be easily controlled and the life of the aqueous solution can be extended.
- the hydrogen fluoride aqueous solution is an aqueous solution containing 0.5 to 20% by mass of hydrogen fluoride. Can be used. If it is aqueous solution containing 0.5 mass% or more of hydrogen fluoride, in addition to the etching effect
- the aqueous solution contains 20% by mass or less of hydrogen fluoride, there is no fear that a concave defect called a pit is remarkably generated on the tin contact surface of the glass substrate due to the etching action of hydrogen fluoride on the glass substrate.
- the content of hydrogen fluoride is more preferably 1 to 15% by mass.
- the etching rate can be easily controlled and the life of the aqueous solution can be extended.
- At least one metal selected from the group consisting of zinc, iron and aluminum is used. This is because the reaction of the above formula (1) proceeds in the presence of these metals. Two or more of these metals may be used in combination. Among these, zinc (Zn) is preferable because of its high etching action.
- At least one metal selected from the group consisting of zinc, iron and aluminum at least one metal selected from the group consisting of manganese (Mn), magnesium (Mg) and nickel (Ni) is used in combination. May be. The combined use of these metals is expected to promote the reaction of the above formula (1).
- At least one metal selected from the group consisting of zinc, iron and aluminum and may be used in combination with these metals, selected from the group consisting of manganese (Mn), magnesium (Mg) and nickel (Ni) It is also possible to supply at least one kind of metal as a metal powder to the tin contact surface of the glass substrate.
- the metal powder is supplied in an atmosphere containing oxygen, such as in an air atmosphere, there is a risk of explosion, so it is necessary to perform an etching process in an inert gas atmosphere such as nitrogen or argon.
- an inert gas atmosphere such as nitrogen or argon.
- the etching process is performed in an atmosphere in which oxygen is present, it is preferable to supply the tin contact surface of the glass substrate as a slurry in which a metal such as zinc (Zn) is dispersed in a solvent. Water or the like can be used as the solvent used for this purpose.
- a viscosity modifier such as polyethylene glycol may be added to this solvent.
- the metal content in the slurry is preferably 1% by mass or more, more preferably 5% by mass or more, in order to exert an etching action. More preferably, the content is at least mass%. If the metal content in the slurry is 10% by mass or more, it is preferable for increasing the etching rate. Particularly preferably, the content of the metal in the slurry is 15% by mass or more and 70% by mass or less.
- the inorganic acid aqueous solution (hydrogen chloride aqueous solution or sulfuric acid (H 2 SO 4 ) aqueous solution) having a pH of 3 or less is supplied with an inorganic acid aqueous solution per unit area (when the inorganic acid aqueous solution is a hydrogen chloride aqueous solution, When the inorganic acid aqueous solution is a sulfuric acid aqueous solution, it is supplied to the tin contact surface of the glass substrate so that the sulfuric acid aqueous solution supply amount)) is 1 g / m 2 or more.
- the etching action of normal dross which is tin oxide-based dross, becomes insufficient.
- the supply amount of the inorganic acid aqueous solution per unit area is preferably 5 g / m 2 or more, more preferably 10 g / m 2 or more, and further preferably 20 g / m 2 or more. If the supply amount of the inorganic acid aqueous solution per unit area is 20 g / m 2 or more, the etching rate is preferably increased. Particularly preferably, the supply amount of the inorganic acid aqueous solution per unit area is 25 g / m 2 or more and 200 g / m 2 or less.
- the aqueous hydrogen fluoride solution is supplied to the tin contact surface of the glass substrate so that the supply amount of the aqueous hydrogen fluoride solution per unit area is 0.05 g / m 2 or more. If the supply amount of the aqueous hydrogen fluoride solution per unit area is less than 0.05 g / m 2 , the etching action of hydrogen fluoride on the glass substrate becomes insufficient for removing dross other than tin oxide.
- the supply amount of the hydrogen fluoride aqueous solution per unit area is preferably 0.5 g / m 2 or more, more preferably 2 g / m 2 or more, more preferably 5 g / m 2 or more.
- the etching rate is preferably increased.
- the supply amount of the hydrogen fluoride aqueous solution per unit area is 7 g / m 2 or more and 50 g / m 2 or less.
- At least one metal selected from the group consisting of zinc, iron and aluminum is supplied to the tin contact surface of the glass substrate so that the supply amount per unit area is 1 g / m 2 or more.
- a metal such as zinc is supplied as a slurry dispersed in a solvent
- the metal is supplied so that the supply amount per unit area of the metal contained in the slurry is 1 g / m 2 or more.
- the amount of metal supplied per unit area is less than 1 g / m 2 , the etching action of normal dross, which is tin oxide-based dross, becomes insufficient.
- the supply amount of metal per unit area is preferably 2 g / m 2 or more, more preferably 5 g / m 2 or more, further preferably 10 g / m 2 or more. Particularly preferably, the supply amount of the metal per unit area is 12 g / m 2 or more and 100 g / m 2 or less.
- the inorganic acid aqueous solution having a pH of 3 or less, the hydrogen fluoride aqueous solution, and the supply form of the metal such as zinc are the same as described in the method (1) of the present invention.
- An inorganic acid aqueous solution having a pH of 3 or less, a hydrogen fluoride aqueous solution, and a metal such as zinc may be supplied to the entire tin contact surface of the glass substrate, or among the tin contact surfaces of the glass substrate, dross (tin oxide-based dross) , And dross other than tin oxide) may be supplied only to the site.
- the area of the portion dross is present is smaller than the normal 1 m 2, the area of the relevant site such supply amount in the case of scaled up to 1 m 2 is 1 g / m 2 or more, pH 3 or less of inorganic An acid aqueous solution and a metal such as zinc are supplied.
- the etching treatment time is preferably 0.1 seconds or more in order to exhibit the etching action of dross (tin oxide-based dross and tin oxide-based dross), and is preferably 1 second or longer. More preferably, it is more preferably 10 seconds or more. However, if the etching treatment time is too long, the aqueous solution supplied to the glass substrate may become dry and stains. For this reason, the etching processing time is preferably 300 seconds or shorter, and more preferably 60 seconds or shorter.
- the tin contact surface of the glass substrate is washed with water, an alkaline detergent, an acidic detergent, or a diluted acid.
- the method (2) of the present invention can be widely applied to glass substrates manufactured by the float process.
- tin oxide-based drosses there is usually a problem of the presence of dross and non-tin oxide-based dross. It is particularly preferable to apply it to a glass substrate for use. Due to its generation mechanism, dross other than tin oxide is produced on a substrate surface of a glass substrate manufactured by a manufacturing method other than the float method, for example, a downdraw method or a redraw method, specifically, a contact surface with the conveyance roller. May also exist. According to the method (2) of the present invention, dross existing on the surface of the glass substrate manufactured by the downdraw method or the redraw method can be removed.
- the methods (1) and (2) of the present invention can be appropriately selected depending on the glass constituting the glass substrate.
- the method (1) of the present invention is suitable for glass having a high viscosity and a high temperature in the forming region in the float process.
- Specific examples of such glass include so-called alkali-free aluminoborosilicate glass (hereinafter also referred to as alkali-free glass) that does not substantially contain an alkali metal component in the glass composition.
- alkali-free glass that an alkali metal component is not included substantially means that content of the alkali metal oxide in a glass composition is 1 mass% or less.
- the method (2) of the present invention is suitable for glass having a low viscosity and a low temperature in the forming region in the float process. Specific examples of such glass include aluminosilicate glass and soda lime glass.
- dross having a problem size can be removed according to the use of the glass substrate manufactured by the float process. Therefore, even if dross exists on the glass substrate, the dross may not be removed if the size does not cause a problem in use of the glass substrate.
- the methods (1) and (2) of the present invention it is preferable to perform preliminary cleaning using water or an alkaline aqueous solution having a pH of 10 or more on the surface to be etched, that is, the entire tin contact surface of the glass substrate.
- the surface of the glass substrate may have organic stains attached during storage or handling. Specific examples of such organic stains include oil stains attached to gloves used when handling glass substrates, fingerprints attached when touching glass substrates with bare hands, and protective paper used when storing glass substrates. There are attached oil stains.
- the etching solution inorganic acid aqueous solution, hydrogen fluoride aqueous solution, metal such as zinc
- the etching action is preferably exhibited. In the preliminary cleaning, it is preferable to perform brush cleaning using the above-described cleaning liquid.
- Example 1 Eighteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. A single mold residue dross was present on each tin contact surface of the glass substrate. A slurry in which an aqueous hydrogen chloride solution (pH 0.1, hydrogen chloride content 18 mass%) and zinc (Zn) are dispersed with respect to the tin contact surface of the glass substrate (solvent: water, zinc (Zn) content 30) (Mass%) was supplied and the etching process was performed for 1 minute.
- an aqueous hydrogen chloride solution pH 0.1, hydrogen chloride content 18 mass
- Zn zinc
- the supply amount of the aqueous hydrogen chloride solution (hydrochloric acid) per unit area was 22 g / m 2
- the supply amount of zinc (Zn) per unit area was 20 g / m 2
- a 4B single-side polishing machine Chemical mechanical polishing was performed at a predetermined polishing load (50 g / cm 2 ). After completion of the chemical mechanical polishing, all the mold residue dross existing on the surface of the glass substrate was removed.
- Comparative Example 1 Nineteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. A single mold residue dross was present on each tin contact surface of the glass substrate. Chemical mechanical polishing was performed in the same procedure as in Example 1 without subjecting the tin contact surface of the glass substrate to etching. Of the remaining mold dross, only 2 points were removed and the remaining 17 points could not be removed.
- Example 2 Comparative Example 2 and Comparative Example 3 Eighteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. A slurry in which an aqueous hydrogen chloride solution (pH 0.1, hydrogen chloride content 18% by mass) and zinc (Zn) are dispersed with respect to the tin contact surface of the glass substrate (solvent: water, zinc (Zn) content 30%) %) was supplied for etching for 1 minute.
- the supply amount of hydrochloric acid per unit area was 22 g / m 2
- the supply amount of zinc (Zn) per unit area was 20 g / m 2 .
- Example 2 using a polishing pad made of polyurethane foam (D hardness 30 degrees) and cerium oxide as an abrasive so that the average polished amount of the etched surface is 0.1 ⁇ m, a 4B single-side polishing machine Using this, chemical mechanical polishing was repeated with a predetermined polishing load (50 g / cm 2 ), and the relationship between the polishing amount of the glass substrate and the loss rate of dross was evaluated as Example 2.
- a predetermined polishing load 50 g / cm 2
- the chemical contact polishing was performed in the same procedure as in Example 2 without performing etching treatment on the tin contact surface of the glass substrate, and the relationship between the polishing amount of the glass substrate and the loss rate of dross was determined. What was evaluated was designated as Comparative Example 2. Twenty glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. Only an aqueous hydrogen chloride solution (pH 0.1, hydrogen chloride content 18% by mass) was supplied to the tin contact surface of the glass substrate and etched for 1 minute. Here, the supply amount of hydrochloric acid per unit area was 22 g / m 2 .
- FIG. 3 is a graph showing the relationship between the polishing amount of the glass substrate and the disappearance rate of the residual mold dross existing on the tin contact surface of the glass substrate for Example 2, Comparative Example 2 and Comparative Example 3.
- etching treatment HClaq / Zn
- etching treatment HClaq
- Example 3 when Comparative Example 2 in which the etching process was not performed, and Comparative Example 3 in which the etching process was performed by supplying only a hydrogen chloride aqueous solution having a pH of 3 or less, and Example 2 were compared,
- a slurry in which a hydrogen chloride aqueous solution having a pH of 3 or less and zinc (Zn) are dispersed is supplied to the tin contact surface of the glass substrate and etched, and then the etched surface is subjected to chemical mechanical polishing.
- the mold residue dross could be removed with a small amount of polishing.
- the polishing amount was 0.1 ⁇ m, the disappearance rate in Example 2 was 50%, whereas in Comparative Examples 2 and 3, the disappearance rate was 0%.
- Example 3 and Comparative Example 4 Twenty-two glass substrates (50 mm square, made of alkali-free glass) manufactured by the float process were prepared. One normal dross was present on each tin contact surface of the glass substrate. A slurry in which an aqueous hydrogen chloride solution (pH 0.1, hydrogen chloride content 18% by mass) and zinc (Zn) are dispersed with respect to the tin contact surface of the glass substrate (solvent: water, zinc (Zn) content 30%) %) was supplied for etching for 1 minute.
- the supply amount of hydrochloric acid per unit area was 22 g / m 2
- the supply amount of zinc (Zn) per unit area was 20 g / m 2 .
- a polishing pad made of polyurethane foam (D hardness of 30 degrees) and cerium oxide as a polishing agent were used so that the polishing amount of the etched surface became an average of 0.1 ⁇ m, and a 4B single-side polishing machine was used.
- chemical mechanical polishing was performed at a predetermined polishing load (50 g / cm 2 ), and the relationship between the polishing amount of the glass substrate and the loss rate of dross was evaluated as Example 3.
- Sixteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. One normal dross was present on each tin contact surface of the glass substrate.
- FIG. 4 is a graph showing the relationship between the polishing amount of the glass substrate and the disappearance rate of normal dross existing on the tin contact surface of the glass substrate in Example 3 and Comparative Example 4.
- the result of Example 3 with etching treatment is the result of Comparative Example 4 without etching treatment.
- Example 4 when Comparative Example 4 and Example 3 in which the etching treatment was not performed were compared, in Example 3, an aqueous hydrogen chloride solution having a pH of 3 or less and zinc were formed on the tin contact surface of the glass substrate. After supplying the slurry in which (Zn) was dispersed and performing the etching treatment, the etched surface was subjected to chemical mechanical polishing. However, the normal dross could be removed with a small amount of polishing.
- Example 4 Twenty glass substrates (5 cm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. A slurry (solvent :) in which a sulfuric acid (H 2 SO 4 ) aqueous solution (pH 0.4, sulfuric acid (H 2 SO 4 ) content 24 mass%) and zinc (Zn) are dispersed with respect to the tin contact surface of the glass substrate. Water and zinc (Zn) content 30% by mass) were supplied, and etching treatment was performed for 1 minute.
- the supply amount of sulfuric acid per unit area was 22 g / m 2
- the supply amount of zinc (Zn) per unit area was 20 g / m 2
- a 4B single-side polishing machine Chemical mechanical polishing was performed at a predetermined polishing load (50 g / cm 2 ). After the chemical mechanical polishing, all the remaining mold dross existing on the surface of the glass substrate was removed.
- Comparative Example 5 Twenty glass substrates (5 cm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. Etching in the same procedure as in Example 4 using nitric acid (HNO 3 ) (pH -0.2, nitric acid (HNO 3 ) content of 30% by mass) instead of sulfuric acid on the tin contact surface of the glass substrate. And chemical mechanical polishing was performed. Of the remaining mold dross, only 2 points were removed and the remaining 18 points could not be removed.
- HNO 3 nitric acid
- HNO 3 nitric acid
- Example 5 Nineteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. A slurry in which an aqueous hydrogen chloride solution (pH 0.1, hydrogen chloride content 18% by mass) and zinc (Zn) are dispersed with respect to the tin contact surface of the glass substrate (solvent: water, zinc (Zn) content 30%) %) was supplied for etching for 1 minute.
- the supply amount of hydrochloric acid per unit area was 5 g / m 2
- the supply amount of zinc (Zn) per unit area was 1 g / m 2 .
- Comparative Example 6 Nineteen glass substrates (50 mm square, made of non-alkali glass) manufactured by the float process were prepared. There was one point of mold residue dross on each tin contact surface of the glass substrate. Tin contact surface of the glass substrate to, 0.05 g / m 2 the amount of supply of hydrochloric acid per unit area, except that the supply amount of zinc (Zn) per unit area was 0.05 g / m 2 Example Etching and chemical mechanical polishing were performed in the same procedure as in No. 5. Of the remaining mold dross, only 2 points were removed and the remaining 17 points could not be removed.
- Example 6 92 glass substrates (50 mm square, made of aluminosilicate glass) manufactured by the float process were prepared. One point of normal dross or dross other than tin oxide was present on the tin contact surface of the glass substrate. With respect to the tin contact surface of the glass substrate, a mixed aqueous solution of hydrogen chloride and hydrofluoric acid (HF) (pH 0.5, hydrogen chloride content 9 mass%, hydrogen fluoride content 0.6 mass%), zinc A slurry in which (Zn) was dispersed (solvent: water, zinc (Zn) content 30 mass%) was supplied, and etching treatment was performed for 1 minute.
- HF hydrofluoric acid
- the supply amounts of hydrochloric acid and hydrogen fluoride aqueous solution per unit area are 11 g / m 2 and 0.7 g / m 2 , respectively, and the supply amount of zinc (Zn) per unit area is 20 g / m 2 .
- the visibility of the etched normal dross was evaluated by the same simple edge light inspection as described in Japanese Patent Laid-Open Nos. 2000-169177, 2000-169179, and 2000-169180. However, the pass rate before and after etching was changed from 15% to 82%.
- Comparative Example 7 31 glass substrates (50 mm square, made of aluminosilicate glass) manufactured by the float process were prepared. One point of normal dross or dross other than tin oxide was present on the tin contact surface of the glass substrate. Etching and simple edge light inspection were performed on the tin contact surface of the glass substrate in the same procedure as in Example 6 except that the aqueous hydrogen fluoride solution was not supplied. The pass rate before and after etching was 19% to 29%.
- Comparative Example 8 Thirty-five glass substrates (50 mm square, made of aluminosilicate glass) manufactured by the float process were prepared. One point of normal dross or dross other than tin oxide was present on the tin contact surface of the glass substrate. Etching and simple edge light inspection were performed on the tin contact surface of the glass substrate in the same procedure as in Example 6 except that hydrochloric acid was not supplied. The pass rate before and after etching was changed from 17% to 26%.
- Example 7 40 glass substrates (50 mm square, made of aluminosilicate glass) manufactured by the float process were prepared. One point of normal dross or dross other than tin oxide was present on the tin contact surface of the glass substrate. Tin contact surface of the glass substrate to the supply amount of hydrochloric acid and hydrogen fluoride aqueous solution per unit area were respectively 6 g / m 2 and 0.4 g / m 2, the supply amount of zinc (Zn) per unit area Etching and simple edge light inspection were performed in the same procedure as in Example 6 except that the amount was 5 g / m 2 . The pass rate before and after etching was changed from 13% to 65%.
- Comparative Example 9 Thirty glass substrates (50 mm square, made of aluminosilicate glass) manufactured by the float process were prepared. One point of normal dross or dross other than tin oxide was present on the tin contact surface of the glass substrate. To tin contact surface of the glass substrate, hydrochloric acid and the supply amount of the hydrogen fluoride aqueous solution per unit area, respectively and 0.6 g / m 2 and 0.04 g / m 2, the supply of zinc per unit area (Zn) Etching and simple edge light inspection were performed in the same procedure as in Example 6 except that the amount was 0.5 g / m 2 . The pass rate before and after etching was 17% and there was no change.
- the foreign matter removing method of the present invention has advantages such as a small amount of waste liquid generated, a reduced burden of waste liquid treatment, an improvement in productivity of a glass substrate, and a high flatness glass manufactured by a float process.
- the present invention can be widely applied to the removal of foreign substances on the surface of glass substrates for flat panel displays such as liquid crystal display panels and glass substrates for cover glasses of portable devices, which require substrates.
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Abstract
Description
ドロスは、蛍光灯下でガラスを目視観察する等した場合、点状に散見される凸状の付着欠点である。フロート法で製造されるガラスリボンの場合、発生するドロスは、溶融金属浴の金属成分である金属スズの酸化物、すなわち、酸化スズ(SnO2)を主成分とする酸化スズ系のドロスが多い。
生産性の向上の観点からは、この研磨量を少なくすることが望ましい。このため、研磨を実施する前に、ガラス基板表面に存在する酸化スズ系のドロスをある程度除去しておくことが望ましい。
また、特許文献2には、フッ化水素酸水溶液又は2価のクロムイオンを含む酸性水溶液に該ガラス基板を浸漬して、基板表面に存在する微小な異物を除去した後、該基板表面を研磨する方法が開示されている。
一方、ガラスに対してエッチング作用があるフッ化水素酸水溶液にガラス基板を浸漬すると、基板表面にピットと呼ばれる凹欠点を生じさせるおそれがある。このような凹欠点が生じた場合、基板表面の研磨量を増加させる必要がある。
なお、こちらの場合、酸化スズ系のドロスだけでなく、他の金属酸化物を主成分とするドロス、たとえば、アルミナ(Al2O3)やジルコニア(ZrO2)を主成分とするドロスや、ガラスカレットを主成分とするドロスも問題となる。
第1の形態は、寸法が数百nmオーダーの粒が集合した形態のものであり、以下、本明細書において、「通常ドロス」と呼ぶ。この通常ドロスは、ガラスリボンの搬送ローラに付着していた酸化スズの粒子が、ガラスリボンに転写されることによって発生すると考えられる。
なお、上記した酸化スズ系以外のドロス、すなわち、アルミナ(Al2O3)やジルコニア(ZrO2)を主成分とするドロスや、ガラスカレットを主成分とするドロスの発生原因も同様であると考えられる。
一方、型残りドロスの場合、粒状の部分は、研磨により比較的容易に除去できるが、その周囲に存在する薄膜状の部分は研磨の圧力がかかりにくく、また硬度も高く摩滅しにくいため、図1に示すように、研磨量を大きくしても完全に除去するのが困難である。
しかも、型残りドロスのうち、数十nmの薄膜状の部分は、検査により検出することが困難である。
また、本発明は、通常ドロス、及び後述する酸化スズ系以外のドロスの除去に好適な方法を提供することを目的とする。
また、本発明の方法(1)において、前記無機酸水溶液が硫酸(H2SO4)を0.1質量%以上含有することが好ましい。
また、本発明の方法(1)において、前記無機酸水溶液がフッ化水素(HF)を0.5~20質量%含有することが好ましい。
本発明の方法(2)において、前記無機酸水溶液が、0.1質量%以上の硫酸(H2SO4)水溶液であることが好ましい。
本発明の方法(2)において、前記フッ化水素水溶液が、フッ化水素を0.1~3質量%含有することが好ましい。
本発明の方法(2)において、前記フッ化水素水溶液が、フッ化水素を0.5~20質量%含有することが好ましい。
該スラリーは、前記金属の含有量が1質量%以上であることが好ましい。
本発明の方法(1)及び(2)において、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属に加えて、マンガン、マグネシウム及びニッケルからなる群から選択される少なくとも1種の金属を、前記面に供給してもよい。
特に、本発明の方法(1)では、塩素イオン、ヨウ素イオン、臭素イオン、フッ素イオン、及び硫酸イオンからなる群から選択される少なくとも1つのイオンを含む無機酸水溶液と、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属と、をガラス基板のエッチング面に供給するため、ガラス基板をエッチング処理液に浸漬させる方法に比べて廃液の発生量が少なく、かつ、有毒な六価クロムが発生するおそれがないため、廃液処理の負担が緩和される。
また、本発明の方法(1)では、ガラス基板表面を、型残りドロスのなく、平滑な状態にするための研磨量が、0.1μm以上2μm以下と少なくて済むため、ガラス基板の生産性が向上する。
本発明の方法(2)では、塩酸、および硫酸からなる無機酸水溶液と、フッ化水素水溶液と、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属と、を、ガラス基板のエッチング処理面に供給するため、エッチング処理液に浸漬させる方法に比べて廃液の発生量が少なく、かつ、有毒な六価クロムが発生するおそれがないため、廃液処理の負担が緩和される。
<本発明の方法(1)>
本発明の方法(1)は、フロート法で製造されたガラス基板表面に存在する酸化スズ系のドロス、特に、型残りドロスを除去する方法である。
本発明の方法(1)は、基板表面に酸化スズ系のドロスが存在すると、基板表面に形成される配線を断線させるおそれがある、フラットパネルディスプレイ用ガラス基板へ適用するのに好適である。
本発明の方法(1)では、塩素イオン、ヨウ素イオン、臭素イオン、フッ素イオン、及び硫酸イオンからなる群から選択される少なくとも1つのイオンを含むpH3以下の無機酸水溶液と、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属とを、それぞれ、該無機酸及び該金属の単位面積当たりの供給量が1g/m2以上となるように、フロート法で製造されたガラス基板の溶融金属浴との接触面に供給して、該面をエッチング処理した後、該エッチング処理された面を、研磨量が0.1μm以上2μm以下になるように機械研磨又は化学機械研磨する。
図1は、通常ドロス、及び型残りドロスのそれぞれについて、ガラス基板の研磨量と、ドロスの消失率と、の関係を示したグラフである。ここで、ドロスの消失率とは、同一の研磨量でドロスが各1点ずつ付着した複数のサンプル(寸法50mm角、無アルカリガラス)を研磨し、その合計数に対するドロスが除去されたサンプル数の割合であり、全てのサンプルについて、研磨量を増やしつつ、ドロス(通常ドロス、及び型残りドロス)の除去を確認した。この点については、後述する実施例2~3、及び比較例2~4の場合も同様である。なお、通常ドロスのサンプル数は16、型残りドロスのサンプル数は37である。
サンプルの研磨は、発泡ポリウレタン製の研磨パッド(D硬度:30度、JIS K6253、2012年制定)、酸化セリウムを研磨剤として使用し、4B片面研磨機(浜井産業社製:商品名4BT、研磨荷重 5kPa)により実施した。
以下、本明細書において、フロート法での製造時における溶融金属浴との接触面のことを、「ガラス基板のスズ接触面」ともいう。
図2(A)において、ガラス基板のスズ接触面(上面)には型残りドロスが存在している。この型残りドロスは、寸法が数μmの酸化スズ粒を中心とし、該SnO2粒子からガラス基板上に、SnO2拡散領域が、厚さ数十nmの薄膜状に形成されている。
Zn + 2HCl → ZnCl2 + 2H+↑ (1)
このようにして発生した活性水素(H+)が、図2(B)に示すように、ガラス基板のスズ接触面(上面)に存在する型残りドロスに作用し、SnO2粒の表面及びSnO2拡散領域に存在する酸化スズ(SnO2)を金属スズ(Sn)へと還元させる(下記式(2))。
SnO2 + 4H+ → Sn + 2H2O (2)
なお、図2(B)では、活性水素による作用で金属スズ(Sn)へと還元された部位を、濃いグレートーンで示した。
Sn + 4HCl → SnCl4 + 2H2↑ (3)
なお、エッチング処理の条件によっては、図2(B)に示す手順でSnO2粒が全て金属スズへと還元される。この場合、図2(C)に示す手順でガラス基板のスズ接触面(上面)から型残りドロスが全て除去される。
但し、型残りドロスが除去された部位には凹欠点が生じるため、エッチング処理の実施後には研磨の実施が必要となる。
上記のイオンを含む無機酸水溶液としては、塩化水素以外に、フッ化水素、臭化水素(HBr)、ヨウ化水素(HI)、過塩素酸(HClO4)、ヨウ素酸(HIO3)又は硫酸(H2SO4)の水溶液を用いることができ、これらの酸を複数含む水溶液も用いることができる。
これらの中でも、塩化水素、硫酸(H2SO4)又はフッ化水素の水溶液が、エッチング作用の高さ、入手しやすさ等の理由から好ましく、塩化水素水溶液がより好ましい。
但し、装置の腐食防止等の観点からは、塩化水素含有量は35質量%以下であることが好ましく、30質量%以下であることがより好ましい。
但し、装置の腐食防止及び金属硫化物の生成の抑制の観点からは、硫酸(H2SO4)含有量は50質量%以下であることが好ましく、40質量%以下であることがより好ましい。
フッ化水素を0.5質量%以上含有する水溶液であれば、型残りドロスのエッチング作用が十分になる。一方、フッ化水素を20質量%以下含有する水溶液であれば、フッ化水素によるガラス基板のエッチング作用により、ガラス基板のスズ接触面にピットを呼ばれる凹欠点を生じさせるおそれがない。
フッ化水素の含有量は、1~15質量%であることがより好ましい。フッ化水素の含有量が1~15質量%であれば、エッチングレートを制御しやすくなり、且つ、前記水溶液の寿命を長くできる。
これらの中でも、亜鉛(Zn)が、エッチング作用の高さから好ましい。
本発明の方法(1)では、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属に加えて、マンガン(Mn)、マグネシウム(Mg)及びニッケル(Ni)からなる群から選択される少なくとも1種の金属を併用してもよい。これらの金属の併用により、上記式(1)の反応が促進されることが期待される。
酸素が存在する雰囲気下でエッチング処理を実施する場合、亜鉛(Zn)等の金属を溶媒に分散させたスラリーとして、ガラス基板のスズ接触面に供給することが好ましい。この目的で使用する溶媒としては、水等を使用できる。また、この溶媒には、ポリエチレングリコール等の粘性調整剤を加えてもよい。
スラリーとして、亜鉛等の金属を供給する場合、スラリー中の金属の含有量が1質量%以上であることが、エッチング作用を発揮するうえで好ましく、5質量%以上含有することがより好ましく、10質量%以上含有することがさらに好ましい。スラリー中の金属の含有量が10質量%以上であれば、エッチングレートが高くなるうえで好ましい。
特に好ましくは、スラリー中の金属の含有量は、15質量%以上70質量%以下である。
単位面積当たりの無機酸の供給量は、5g/m2以上であることが好ましく、10g/m2以上であることがより好ましく、20g/m2以上であることがさらに好ましい。単位面積当たりの無機酸の供給量が20g/m2以上であれば、エッチングレートが高くなるうえで好ましい。特に好ましくは、単位面積当たりの無機酸の供給量は、25g/m2以上200g/m2以下である。
単位面積当たりの金属の供給量が1g/m2未満だと、型残りドロスのエッチング作用が不十分になる。
単位面積当たりの金属の供給量は、2g/m2以上であることが好ましく、5g/m2以上であることがより好ましく、10g/m2以上であることがさらに好ましい。特に好ましくは、単位面積当たりの金属の供給量は、12g/m2以上100g/m2以下である。
亜鉛等の金属を溶媒に分散させたスラリーとして供給する場合も同様であり、ガラス基板のエッチング面に対して、ノズル等を用いてスラリーを噴射してもよく、ロールコーター等を用いて、スラリーを塗布してもよい。また、フローコートやカーテンコート等と呼ばれる液循環塗布方式も可能である。
亜鉛等の金属を金属粉末として供給する場合、ノズル等を用いて金属粉末を噴射してもよく、ふるいを用いる方法や静電気を用いる方法も使用可能である。
pH3以下の無機酸水溶液、及び亜鉛等の金属は、ガラス基板のスズ接触面全体に供給してもよいし、ガラス基板のスズ接触面のうち、型残りドロスが存在する部位のみに供給してもよい。後者の場合、型残りドロスが存在する部位の面積は通常1m2より小さいため、該当する部位の面積を1m2までスケールアップした場合の供給量が1g/m2以上になるように、pH3以下の無機酸水溶液、及び亜鉛等の金属を供給する。
無機酸水溶液として、フッ化水素水溶液を使用する場合、エッチング処理時間が長すぎると、フッ化水素によるガラスのエッチング作用により、ガラス基板のスズ接触面にピットと呼ばれる凹欠点を生じさせるおそれがある。このため、エッチング処理時間は、300秒以下であることが好ましく、60秒以下であることがより好ましい。
図2(C)に示すように、ガラス基板のスズ接触面(上面)にSnO2粒が存在する場合、この研磨処理によって除去される。一方、エッチング処理によって、ガラス基板のスズ接触面に存在していた型残りドロスが全て除去された場合、型残りドロスが除去された部位に生じた凹欠点が、この研磨処理によって平坦化される。
なお、ガラス基板のスズ接触面に型残りドロス以外の形態のドロス、すなわち、通常ドロスが存在していた場合、上述したエッチング処理を実施し、該エッチング処理された面(スズ接触面)を機械研磨又は化学機械研磨することによって、通常ドロスは除去される。
一方、化学機械研磨の場合、発泡ポリウレタン製の研磨パッドと、酸化セリウムを含む研磨剤とを使用し、4B片面研磨機、オスカー式研磨機、又は連続式研磨機等の研磨機を用いて所定の研磨荷重で実施する。
機械研磨及び化学機械研磨のいずれの場合も、研磨荷重は20~200g/cm2であることが好ましい。
研磨荷重が20g/cm2以上であれば、研磨速度が速く、所定の研磨量を達成するのに短時間で済む。一方、研磨荷重が200g/cm2以下であれば、ガラス基板端部にクラックが発生した場合でも該クラックが伸張せず、ガラス基板が破損するおそれがない。
研磨荷重は、40~190g/cm2であることがより好ましく、60~180g/cm2であることがさらに好ましい。
機械研磨、化学機械研磨のいずれの場合も、使用する研磨パッドの硬度がD硬度80度以下、A硬度(JIS K6253、2012年制定)10度以上であることが好ましく、D硬度70度以下、A硬度20以上がより好ましい。使用する研磨パッドの硬度がD硬度80度以下であれば、研磨によってガラス基板のスズ接触面にキズが生じるおそれがない。一方、使用する研磨パッドの硬度がA硬度10度以上であれば、研磨速度が速く、所定の研磨量を達成するのに短時間で済む。さらに、研磨を2段、3段と多段化し、各研磨段階において、上記の硬度範囲内の硬度が異なる研磨パッドを使用してもよい。
本発明の方法(2)は、フロート法で製造されたガラス基板表面に存在するドロスを除去する方法であり、酸化スズ系のドロスのうち、通常ドロス、及び、酸化スズ系以外のドロスの両方を除去対象とする。
なお、酸化スズ系のドロスのうち、通常ドロスのみを除去対象とする理由は以下の通りである。
フラットパネルディスプレイ用のガラス基板に使用される無アルカリガラスのような粘性の高いガラスの場合、フロート法における成形域の温度が高いため、ガラスリボンの表面に付着した金属スズが燃焼し、型残りドロスが極めて発生し易い。
一方、カバーガラス等に用いられるアルミノシリケートガラスやソーダライムガラスのような粘性の低いガラスの場合、フロート法における成形域の温度が、無アルカリガラスのような粘性の高いガラスに比べると100℃以上低いため、ガラスリボンの表面に付着した金属スズが燃焼せず、型残りドロスが発生しない。このため、通常ドロスのみを除去対象とすることができる。
カバーガラス用のガラス基板は、基板表面に最大径が10μm以上のドロスが存在すると、目視により確認できるため、ガラス基板の欠点となるため問題となる。また、基板の表面性状、すなわち、平坦度や表面粗さに関する要求は、フラットパネルディスプレイ用のガラス基板に比べるとはるかに低いため、製造過程で基板表面の研磨処理は通常実施されず、製造コストの増加につながるため望ましくない。
酸化スズ系のドロスのうち、本発明の方法(2)で除去対象とする通常ドロスは、ガラス基板のスズ接触面に、寸法が数百nmオーダーの粒が集合した形態、すなわち、酸化スズの粒子として存在している。
ガラス基板のスズ接触面に対して、塩酸(HCl)、及び硫酸(H2SO4)からなる群から選択される、pH3以下の無機酸水溶液、ならびに、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属を供給すると、上記式(1)に示したのと同様の機構で、無機酸と金属とが反応して活性水素(H+)が発生する。
発生した活性水素(H+)は、ガラス基板のスズ接触面に存在する通常ドロスに作用し、上記式(2)に示したのと同様の機構で、酸化スズ(SnO2)粒子の表面を金属スズ(Sn)へと還元させる。
さらに、還元により金属(Sn)となった部位が無機酸と反応して、上記式(3)に示したのと同様の機構で、四塩化スズ(SnCl4)(又は硫酸スズ(SnSO4))として、ガラス基板のスズ接触面から除去される。
但し、本発明の方法におけるフッ化水素のエッチング作用は、特許文献2で開示の方法のような、フッ化水素水溶液にガラス基板を浸漬する方法に比べると、エッチング作用が弱いため、基板表面にピットと呼ばれる凹欠点を生じさせるおそれがない。
但し、装置の腐食防止等の観点からは、塩化水素含有量は35質量%以下であることが好ましく、30質量%以下であることがより好ましい。
但し、装置の腐食防止及び金属硫化物の生成の抑制の観点からは、硫酸(H2SO4)含有量は50質量%以下であることが好ましく、40質量%以下であることがより好ましい。
本発明の方法(2)において、フッ化水素水溶液をエッチング処理液として使用するのは、上述したようにガラスに対するエッチング作用が必要となるためである。
フッ化水素の含有量は、0.2~2質量%であることがより好ましい。フッ化水素の含有量が0.2~2質量%であれば、エッチングレートを制御しやすくなり、且つ、前記水溶液の寿命を長くできる。
一方、フッ化水素を20質量%以下含有する水溶液であれば、ガラス基板に対するフッ化水素のエッチング作用により、ガラス基板のスズ接触面にピットを呼ばれる凹欠点を顕著に生じさせるおそれがない。
フッ化水素の含有量は、1~15質量%であることがより好ましい。フッ化水素酸の含有量が1~15質量%であれば、エッチングレートを制御しやすくなり、且つ、前記水溶液の寿命を長くできる。
これらの中でも、亜鉛(Zn)が、エッチング作用の高さから好ましい。
亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属、及び、これらの金属と併用する場合がある、マンガン(Mn)、マグネシウム(Mg)及びニッケル(Ni)からなる群から選択される少なくとも1種の金属は、金属粉末として、ガラス基板のスズ接触面に供給することも可能である。但し、大気雰囲気下のような酸素が存在する雰囲気下で金属粉末を供給すると、爆発のおそれがあるため、窒素やアルゴン等の不活性ガス雰囲気下でエッチング処理を実施する必要がある。
酸素が存在する雰囲気下でエッチング処理を実施する場合、亜鉛(Zn)等の金属を溶媒に分散させたスラリーとして、ガラス基板のスズ接触面に供給することが好ましい。この目的で使用する溶媒としては、水等を使用できる。また、この溶媒には、ポリエチレングリコール等の粘性調整剤を加えてもよい。
スラリーとして、亜鉛等の金属を供給する場合、スラリー中の金属の含有量が1質量%以上であることが、エッチング作用を発揮するうえで好ましく、5質量%以上含有することがより好ましく、10質量%以上含有することがさらに好ましい。スラリー中の金属の含有量が10質量%以上であれば、エッチングレートが高くなるうえで好ましい。特に好ましくは、スラリー中の金属の含有量は、15質量%以上70質量%以下である。
単位面積当たりの無機酸水溶液の供給量は、5g/m2以上であることが好ましく、10g/m2以上であることがより好ましく、20g/m2以上であることがさらに好ましい。単位面積当たりの無機酸水溶液の供給量が20g/m2以上であれば、エッチングレートが高くなるうえで好ましい。特に好ましくは、単位面積当たりの無機酸水溶液の供給量は、25g/m2以上200g/m2以下である。
単位面積当たりのフッ化水素水溶液の供給量は、0.5g/m2以上であることが好ましく、2g/m2以上であることがより好ましく、5g/m2以上であることがさらに好ましい。単位面積当たりのフッ化水素水溶液の供給量が5g/m2以上であれば、エッチングレートが高くなるうえで好ましい。特に好ましくは、単位面積当たりのフッ化水素水溶液の供給量は、7g/m2以上50g/m2以下である。
単位面積当たりの金属の供給量が1g/m2未満だと、酸化スズ系のドロスである、通常ドロスのエッチング作用が不十分になる。
単位面積当たりの金属の供給量は、2g/m2以上であることが好ましく、5g/m2以上であることがより好ましく、10g/m2以上であることがさらに好ましい。特に好ましくは、単位面積当たりの金属の供給量は、12g/m2以上100g/m2以下である。
pH3以下の無機酸水溶液、フッ化水素水溶液、及び亜鉛等の金属は、ガラス基板のスズ接触面全体に供給してもよいし、ガラス基板のスズ接触面のうち、ドロス(酸化スズ系のドロス、及び、酸化スズ系以外のドロス)が存在する部位のみに供給してもよい。後者の場合、ドロスが存在する部位の面積は通常1m2より小さいため、該当する部位の面積を1m2までスケールアップした場合の供給量が1g/m2以上になるように、pH3以下の無機酸水溶液、及び亜鉛等の金属を供給する。
但し、エッチング処理時間が長すぎると、ガラス基板に供給された上記水溶液が乾燥してしみになる恐れがある。このため、エッチング処理時間は、300秒以下であることが好ましく、60秒以下であることがより好ましい。
その発生機構から、酸化スズ系以外のドロスは、フロート法以外の製造方法、たとえば、ダウンドロー法やリドロー法で製造されたガラス基板の基板表面、具体的には、搬送ローラとの接触面にも存在する場合がある。
本発明の方法(2)によれば、ダウンドロー法やリドロー法で製造されたガラス基板の基板表面に存在するドロスも除去できる。
本発明の方法(1)及び(2)は、ガラス基板を構成するガラスに応じて適宜選択できる。
本発明の方法(1)は、粘性が高く、フロート法における成形域の温度が高いガラスに好適である。このようなガラスの具体例としては、ガラス組成にアルカリ金属成分を実質的に含まない、いわゆる無アルカリのアルミノホウケイ酸ガラス(以下、無アルカリガラスともいう。)が例示される。
なお、アルカリ金属成分を実質的に含まないとは、ガラス組成中におけるアルカリ金属酸化物の含有量が1質量%以下であることをいう。
一方、本発明の方法(2)は、粘性が低く、フロート法における成形域の温度が低いガラスに好適である。このようなガラスの具体例としては、アルミノシリケートガラス、ソーダライムガラス等が例示される。
ガラス基板の表面には、保管時や取扱い時に有機物系の汚れが付着している場合がある。このような有機物系の汚れの具体例としては、ガラス基板の取扱い時に使用する手袋に付着した油汚れ、ガラス基板に素手で触った場合に付着した指紋、ガラス基板の保管時に使用する保護紙に付着した油汚れ等がある。
これら有機物系の汚れが基板表面に付着した状態で、エッチング処理を実施すると、エッチング処理液(無機酸水溶液、フッ化水素水溶液、亜鉛等の金属)をガラス基板のスズ接触面に噴霧した際に、該スズ接触面の濡れ性が低下して、エッチング作用が低下するおそれがある。予備洗浄により有機物系の汚れを予め除去することで、エッチング作用が好ましく発揮される。
予備洗浄では、上記の洗浄液を使用してブラシ洗浄を行うことが好ましい。
実施例1
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を18枚準備した。該ガラス基板のスズ接触面には、それぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素水溶液(pH0.1、塩化水素含有量18質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)の含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの塩化水素水溶液(塩酸)の供給量は22g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は20g/m2であった。
次に、エッチング処理された面を、研磨量が平均0.6μmになるように、発泡ポリウレタン製の研磨パッド(D硬度30度)と、研磨剤として酸化セリウムを使用し、4B片面研磨機を用いて所定の研磨荷重(50g/cm2)で化学機械研磨した。化学機械研磨の終了後、ガラス基板の表面に存在していた型残りドロスは全て除去されていた。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を19枚準備した。該ガラス基板のスズ接触面には、それぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、エッチング処理を施さすことなしに、実施例1と同様の手順で、化学機械研磨を実施した。型残りドロスのうち、2点のみが除去され、残りの17点は除去できなかった。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を18枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素水溶液(pH0.1、塩化水素含有量18質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの塩酸の供給量は22g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は20g/m2であった。
次に、該エッチング処理された面の研磨量が平均0.1μmになるように、発泡ポリウレタン製の研磨パッド(D硬度30度)と、研磨剤として酸化セリウムを使用し、4B片面研磨機を用いて所定の研磨荷重(50g/cm2)で化学機械研磨を繰り返し行い、ガラス基板の研磨量と、ドロスの消失率と、の関係を評価したものを実施例2とした。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を19枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、エッチング処理を施さすことなしに、実施例2と同様の手順で化学機械研磨を実施し、ガラス基板の研磨量と、ドロスの消失率と、の関係を評価したものを比較例2とした。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を20枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素水溶液(pH0.1、塩化水素含有量18質量%)のみを供給して、1分間エッチング処理した。ここで、単位面積当たりの塩酸の供給量は22g/m2であった。
次に、実施例2と同様の手順で化学機械研磨を実施し、ガラス基板の研磨量と、ドロスの消失率と、の関係を評価したものを比較例3とした。
図3は、実施例2、比較例2及び比較例3について、ガラス基板の研磨量と、該ガラス基板のスズ接触面に存在する型残りドロスの消失率との関係を示したグラフである。図3中、エッチング処理あり(HClaq/Zn)が実施例2の結果、エッチング処理なしが比較例2の結果、エッチング処理あり(HClaq)が比較例3の結果である。
図3から明らかなように、エッチング処理を実施しなかった比較例2、及びpH3以下の塩化水素水溶液のみを供給してエッチング処理を実施した比較例3と実施例2とを比較した場合、実施例2では、ガラス基板のスズ接触面に、pH3以下の塩化水素水溶液と、亜鉛(Zn)を分散させたスラリーを供給してエッチング処理した後、該エッチング処理された面を化学機械研磨したが、少ない研磨量で型残りドロスが除去できた。
なお、研磨量が0.1μmの場合は、実施例2では消失率が50%であったのに対して、比較例2及び3では消失率が0%であった。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を22枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素水溶液(pH0.1、塩化水素含有量18質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの塩酸の供給量は22g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は20g/m2であった。
次に、該エッチング処理された面の研磨量が平均0.1μmとなるように、発泡ポリウレタン製の研磨パッド(D硬度30度)と、研磨剤として酸化セリウムを使用し、4B片面研磨機を用いて所定の研磨荷重(50g/cm2)で化学機械研磨を行い、ガラス基板の研磨量と、ドロスの消失率と、の関係を評価したものを実施例3とした。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を16枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロスが存在していた。該ガラス基板のスズ接触面に対し、エッチング処理を施さすことなしに、実施例3と同様の手順で化学機械研磨を実施し、ガラス基板の研磨量と、ドロスの消失率と、の関係を評価したものを比較例3とした。
図4は、実施例3及び比較例4について、ガラス基板の研磨量と、該ガラス基板のスズ接触面に存在する通常ドロスの消失率との関係を示したグラフである。図4中、エッチング処理ありが実施例3の結果、エッチング処理なしが比較例4の結果である。
図4から明らかなように、エッチング処理を実施しなかった比較例4と実施例3とを比較した場合、実施例3では、ガラス基板のスズ接触面に、pH3以下の塩化水素水溶液と、亜鉛(Zn)を分散させたスラリーを供給してエッチング処理した後、該エッチング処理された面を化学機械研磨したが、少ない研磨量で通常ドロスも除去できた。
フロート法で製造されたガラス基板(5cm角、無アルカリガラス製)を20枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、硫酸(H2SO4)水溶液(pH0.4、硫酸(H2SO4)含有量24質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの硫酸の供給量22g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は20g/m2であった。
次に、エッチング処理された面を、研磨量が平均0.6μmになるように、発泡ポリウレタン製の研磨パッド(D硬度30度)と、研磨剤として酸化セリウムを使用し、4B片面研磨機を用いて所定の研磨荷重(50g/cm2)で化学機械研磨した。化学機械研磨の終了後では、ガラス基板の表面に存在していた型残りドロスは全て除去されていた。
フロート法で製造されたガラス基板(5cm角、無アルカリガラス製)を20枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、硫酸の代わりに硝酸(HNO3)(pH-0.2、硝酸(HNO3)含有量30質量%)を用いて、実施例4と同様の手順でエッチング及び化学機械研磨を実施した。型残りドロスのうち、2点のみが除去され、残りの18点は除去できなかった。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を19枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素水溶液(pH0.1、塩化水素含有量18質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの塩酸の供給量は5g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は1g/m2であった。
次に、エッチング処理された面を、研磨量が平均0.6μmになるように、発泡ポリウレタン製の研磨パッド(D硬度30度)と、研磨剤として酸化セリウムを使用し、4B片面研磨機を用いて所定の研磨荷重(50g/cm2)で化学機械研磨した。化学機械研磨の終了後では、ガラス基板の表面に存在していた型残りドロスのうち13点が除去され、6点が除去できなかった。
フロート法で製造されたガラス基板(50mm角、無アルカリガラス製)を19枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の型残りドロスが存在していた。該ガラス基板のスズ接触面に対し、単位面積当たりの塩酸の供給量を0.05g/m2、単位面積当たりの亜鉛(Zn)の供給量を0.05g/m2とした以外は実施例5と同様の手順で、エッチング及び化学機械研磨を実施した。型残りドロスのうち、2点のみが除去され、残りの17点は除去できなかった。
フロート法で製造されたガラス基板(50mm角、アルミノシリケートガラス製)を92枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロス又は酸化スズ系以外のドロスが存在していた。該ガラス基板のスズ接触面に対し、塩化水素とフッ化水素酸(HF)の混合水溶液(pH0.5、塩化水素含有量9質量%、フッ化水素含有量0.6質量%)と、亜鉛(Zn)を分散させたスラリー(溶媒:水、亜鉛(Zn)含有量30質量%)を供給して、1分間エッチング処理した。ここで、単位面積当たりの塩酸及びフッ化水素水溶液の供給量は、それぞれ11g/m2及び0.7g/m2であり、単位面積当たりの亜鉛(Zn)の供給量は20g/m2であった。エッチング処理された通常ドロスの視認性を、日本特開2000-169177号公報、日本特開2000-169179号公報、及び日本特開2000-169180号公報の記載と同様の簡易エッジライト検査により評価したところ、エッチング前後で合格率が15%から82%になった。
フロート法で製造されたガラス基板(50mm角、アルミノシリケートガラス製)を31枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロス又は酸化スズ系以外のドロスが存在していた。該ガラス基板のスズ接触面に対し、フッ化水素水溶液を供給しない以外は実施例6と同様の手順でエッチング及び簡易エッジライト検査を実施した。エッチング前後で合格率は19%から29%になった。
フロート法で製造されたガラス基板(50mm角、アルミノシリケートガラス製)を35枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロス又は酸化スズ系以外のドロスが存在していた。該ガラス基板のスズ接触面に対し、塩酸を供給しない以外は実施例6と同様の手順でエッチング及び簡易エッジライト検査を実施した。エッチング前後で合格率は17%から26%になった。
フロート法で製造されたガラス基板(50mm角、アルミノシリケートガラス製)を40枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロス又は酸化スズ系以外のドロスが存在していた。該ガラス基板のスズ接触面に対し、単位面積当たりの塩酸及びフッ化水素水溶液の供給量をそれぞれ6g/m2及び0.4g/m2とし、単位面積当たりの亜鉛(Zn)の供給量を5g/m2とした以外は実施例6と同様の手順でエッチング及び簡易エッジライト検査を実施した。エッチング前後で合格率は13%から65%になった。
フロート法で製造されたガラス基板(50mm角、アルミノシリケートガラス製)を30枚準備した。該ガラス基板のスズ接触面にはそれぞれ1点の通常ドロス又は酸化スズ系以外のドロスが存在していた。該ガラス基板のスズ接触面に対し、単位面積当たりの塩酸及びフッ化水素水溶液の供給量をそれぞれ0.6g/m2及び0.04g/m2とし、単位面積当たりの亜鉛(Zn)の供給量を0.5g/m2とした以外は実施例6と同様の手順でエッチング及び簡易エッジライト検査を実施した。エッチング前後で合格率は17%で変化が無かった。
Claims (16)
- 塩素イオン、ヨウ素イオン、臭素イオン、フッ素イオン、及び、硫酸イオンからなる群から選択される少なくとも1つのイオンを含むpH3以下の無機酸水溶液と、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属とを、それぞれ、前記無機酸水溶液及び前記金属の単位面積当たりの供給量が1g/m2以上となるように、フロート法で製造されたガラス基板の溶融金属浴との接触面に供給して、該面をエッチング処理した後、該エッチング処理された面を、研磨量が0.1μm以上2μm以下になるように、機械研磨又は化学機械研磨することを特徴とする、ガラス基板表面の異物除去方法。
- 前記無機酸水溶液が塩化水素を0.1質量%以上含有する、請求項1に記載のガラス基板表面の異物除去方法。
- 前記無機酸水溶液が硫酸を0.1質量%以上含有する、請求項1に記載のガラス基板表面の異物除去方法。
- 前記無機酸水溶液がフッ化水素を0.5~20質量%含有する、請求項1に記載のガラス基板表面の異物除去方法。
- 塩酸、及び、硫酸からなる群から選択される、pH3以下の無機酸水溶液と、フッ化水素(HF)水溶液と、亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属とを、それぞれ、前記無機酸水溶液、前記フッ化水素水溶液、及び、前記金属の単位面積当たりの供給量が1g/m2以上、0.05g/m2以上、及び、1g/m2以上となるように、フロート法で製造されたガラス基板の溶融金属浴との接触面に供給して、該面をエッチング処理することを特徴とする、ガラス基板表面の異物除去方法。
- 前記無機酸水溶液が、0.1質量%以上の塩化水素(HCl)水溶液である、請求項5に記載のガラス基板表面の異物除去方法。
- 前記無機酸水溶液が、0.1質量%以上の硫酸(H2SO4)水溶液である、請求項5に記載のガラス基板表面の異物除去方法。
- 前記フッ化水素(HF)水溶液が、フッ化水素を0.1~3質量%含有する、請求項5~7のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記フッ化水素(HF)水溶液が、フッ化水素を0.5~20質量%含有する、請求項5~7のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記金属は、溶媒中に分散されたスラリーとして供給される、請求項1~9のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記スラリーは、前記金属の含有量が1質量%以上である、請求項10に記載のガラス基板表面の異物除去方法。
- 亜鉛、鉄及びアルミニウムからなる群から選択される少なくとも1種の金属に加えて、マンガン、マグネシウム及びニッケルからなる群から選択される少なくとも1種の金属を前記面に供給する、請求項1~11のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記エッチング処理する面に対し、水、又は、pH10以上のアルカリ水溶液を洗浄液とする予備洗浄を行う、請求項1~12のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記ガラス基板は、フラットパネルディスプレイ用のガラス基板である、請求項1~4のいずれか一項に記載のガラス基板表面の異物除去方法。
- 前記ガラス基板は、カバーガラス用のガラス基板である、請求項5~9のいずれか一項に記載のガラス基板表面の異物除去方法。
- 請求項1~15のいずれか一項に記載のガラス基板表面の異物除去方法で処理されたガラス基板。
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| KR1020157010518A KR102218813B1 (ko) | 2012-12-19 | 2013-12-18 | 유리 기판 표면의 이물질 제거 방법 |
| CN201380066636.XA CN104870390B (zh) | 2012-12-19 | 2013-12-18 | 玻璃基板表面的异物去除方法 |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012276843 | 2012-12-19 | ||
| JP2012-276843 | 2012-12-19 | ||
| JP2013139813A JP2016028988A (ja) | 2012-12-19 | 2013-07-03 | ガラス基板表面の異物除去方法 |
| JP2013-139813 | 2013-07-03 |
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| WO2014098159A1 true WO2014098159A1 (ja) | 2014-06-26 |
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| PCT/JP2013/083984 Ceased WO2014098159A1 (ja) | 2012-12-19 | 2013-12-18 | ガラス基板表面の異物除去方法 |
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| JP (1) | JP2016028988A (ja) |
| KR (1) | KR102218813B1 (ja) |
| CN (1) | CN104870390B (ja) |
| TW (1) | TW201434766A (ja) |
| WO (1) | WO2014098159A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104926147A (zh) * | 2015-05-29 | 2015-09-23 | 中国科学院上海光学精密机械研究所 | 氟磷酸盐玻璃表面处理方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6836699B2 (ja) * | 2016-09-21 | 2021-03-03 | Agc株式会社 | ガラス板 |
| JP7275801B2 (ja) * | 2018-04-25 | 2023-05-18 | Agc株式会社 | ガラス基板 |
| CN110076681B (zh) * | 2018-09-12 | 2021-03-19 | 滁州盛诺电子科技有限公司 | 一种液晶显示屏研磨处理工艺 |
| CN110282878A (zh) * | 2019-05-31 | 2019-09-27 | 东莞市银泰玻璃有限公司 | 一种护眼型防窥玻璃的加工方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06227842A (ja) * | 1993-02-01 | 1994-08-16 | Nippon Sheet Glass Co Ltd | フロート板ガラス物品の表面スズ除去方法 |
| JP2009502721A (ja) * | 2005-08-02 | 2009-01-29 | ショット アクチエンゲゼルシャフト | 板ガラスを後処理する方法及び装置 |
| JP2009155179A (ja) * | 2007-12-27 | 2009-07-16 | Nippon Electric Glass Co Ltd | フラットパネルディスプレイ用ガラス基板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3489624A (en) * | 1965-03-31 | 1970-01-13 | Westinghouse Canada Ltd | Etching techniques for glass |
| JPH09295832A (ja) | 1996-04-26 | 1997-11-18 | Asahi Glass Co Ltd | ガラス基板表面の異物除去方法 |
| JPH09295833A (ja) * | 1996-04-26 | 1997-11-18 | Seimi Chem Co Ltd | フロートガラス基板の平坦化方法 |
-
2013
- 2013-07-03 JP JP2013139813A patent/JP2016028988A/ja active Pending
- 2013-12-18 TW TW102146934A patent/TW201434766A/zh unknown
- 2013-12-18 WO PCT/JP2013/083984 patent/WO2014098159A1/ja not_active Ceased
- 2013-12-18 CN CN201380066636.XA patent/CN104870390B/zh active Active
- 2013-12-18 KR KR1020157010518A patent/KR102218813B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06227842A (ja) * | 1993-02-01 | 1994-08-16 | Nippon Sheet Glass Co Ltd | フロート板ガラス物品の表面スズ除去方法 |
| JP2009502721A (ja) * | 2005-08-02 | 2009-01-29 | ショット アクチエンゲゼルシャフト | 板ガラスを後処理する方法及び装置 |
| JP2009155179A (ja) * | 2007-12-27 | 2009-07-16 | Nippon Electric Glass Co Ltd | フラットパネルディスプレイ用ガラス基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104926147A (zh) * | 2015-05-29 | 2015-09-23 | 中国科学院上海光学精密机械研究所 | 氟磷酸盐玻璃表面处理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016028988A (ja) | 2016-03-03 |
| KR102218813B1 (ko) | 2021-02-22 |
| CN104870390B (zh) | 2017-10-31 |
| CN104870390A (zh) | 2015-08-26 |
| TW201434766A (zh) | 2014-09-16 |
| KR20150099508A (ko) | 2015-08-31 |
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