WO2014092196A1 - Composition conductrice de chaleur à indice de réfraction élevé de transparence exceptionnelle, graisse conductrice de chaleur la comprenant, matière conductrice de chaleur durcie, composition conductrice de chaleur à ramollissement thermique et leurs applications - Google Patents

Composition conductrice de chaleur à indice de réfraction élevé de transparence exceptionnelle, graisse conductrice de chaleur la comprenant, matière conductrice de chaleur durcie, composition conductrice de chaleur à ramollissement thermique et leurs applications Download PDF

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Publication number
WO2014092196A1
WO2014092196A1 PCT/JP2013/083541 JP2013083541W WO2014092196A1 WO 2014092196 A1 WO2014092196 A1 WO 2014092196A1 JP 2013083541 W JP2013083541 W JP 2013083541W WO 2014092196 A1 WO2014092196 A1 WO 2014092196A1
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group
thermally conductive
heat
refractive index
conductive composition
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PCT/JP2013/083541
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English (en)
Japanese (ja)
Inventor
和彦 兒島
大川　直
通孝 須藤
晴彦 古川
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東レ・ダウコーニング株式会社
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Publication of WO2014092196A1 publication Critical patent/WO2014092196A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • heat radiating materials with excellent light transmittance and thermal conductivity must be relatively low refractive index materials, and when the heat radiating materials are applied to high-intensity type light emitting diodes, etc. It was not possible to avoid adverse effects on luminance and light emission efficiency, such as a decrease in light extraction efficiency.
  • Thermal conductivity filler is 20 to 1000 parts by mass, and the difference in refractive index between the matrix material composed of the organosilicon compound and the thermally conductive filler is 0.050 or less in absolute value. It is more suitably achieved by the sex composition.
  • the high refractive index organosilicon compound as component (A) is a specific organopolysiloxane or a specific polyorganometallosiloxane having a condensed polycyclic aromatic group such as a naphthyl group or a condensed polycyclic aromatic group-containing group.
  • the transparent heat conductive composition according to the present invention is cured by a hydrosilylation reaction
  • 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne and the like 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenyl
  • reaction inhibitors such as a cyclotetrasiloxane and a benzotriazole.
  • the heat conductive composition after mixing may be formed by extrusion molding, calendar molding, roll molding, press molding, or coating after dissolving in a solvent. it can.
  • the thickness of the sheet and film is not particularly limited, but is 0.02 to 2 mm, particularly 0.03 to 1 mm, and preferably 0.1 to 0.4 mm.
  • a release sheet or the like can be attached before use.
  • the refractive index (25 ° C.) of the matrix material of the resulting thermosoftening organopolysiloxane composition, the refractive index of the filler (25 ° C.), and the transmittance and thermal conductivity of the composition at 25 ° C. were measured. Further, since the obtained composition has fluidity on the surface at 60 to 80 ° C., in addition to excellent transparency and thermal conductivity, it has a property of flowing by heating.

Abstract

L'invention concerne une composition conductrice de chaleur contenant (A) 100 parties en masse d'un composé organosilicium ayant un indice de réfraction de 1,550 ou au-dessus à 25°C et (B) 10-2 000 parties en masse d'une charge conductrice de chaleur ; une graisse conductrice de chaleur comprenant la composition conductrice de chaleur ; une matière conductrice de chaleur durcie, de préférence un gel conducteur de chaleur ou un caoutchouc conducteur de chaleur, obtenu par durcissement de la composition conductrice de chaleur ; et une composition conductrice de chaleur à ramollissement thermique comprenant la composition conductrice de chaleur. L'invention concerne de plus une matière optique, un conducteur de chaleur en vue d'une utilisation dans un dispositif semi-conducteur, ou un dispositif semi-conducteur, qui comprend la composition conductrice de chaleur ou une forme durcie de celle-ci. La composition conductrice de chaleur ou la forme durcie de celle-ci a une transparence exceptionnelle et une conductivité de chaleur exceptionnelle et un indice de réfraction élevé, et peut être utilisée comme matière conductrice de chaleur dans diverses applications.
PCT/JP2013/083541 2012-12-11 2013-12-10 Composition conductrice de chaleur à indice de réfraction élevé de transparence exceptionnelle, graisse conductrice de chaleur la comprenant, matière conductrice de chaleur durcie, composition conductrice de chaleur à ramollissement thermique et leurs applications WO2014092196A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-270803 2012-12-11
JP2012270803 2012-12-11

Publications (1)

Publication Number Publication Date
WO2014092196A1 true WO2014092196A1 (fr) 2014-06-19

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Country Status (2)

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TW (1) TW201430064A (fr)
WO (1) WO2014092196A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016021714A1 (fr) * 2014-08-08 2016-02-11 日東電工株式会社 Feuille de scellement, son procédé de fabrication, dispositif à semiconducteur photoélectrique, et élément de semiconducteur photoélectrique scellé
JP2016035022A (ja) * 2014-08-04 2016-03-17 株式会社Kri 透明熱伝導性樹脂組成物
JP2017036391A (ja) * 2015-08-10 2017-02-16 Jsr株式会社 硬化性組成物、硬化物、ポリシロキサン、及び光半導体装置
JP2017048286A (ja) * 2015-08-31 2017-03-09 ポリマテック・ジャパン株式会社 熱伝導性シート
JP2017165943A (ja) * 2016-03-15 2017-09-21 東莞市天凱電子有限公司 硬化可能な有機ポリシロキサン組成物及びその応用
CN109140385A (zh) * 2018-10-15 2019-01-04 华域视觉科技(上海)有限公司 一种具有抗聚焦散热功能的车灯零件及其制备方法
JP2020057774A (ja) * 2018-09-28 2020-04-09 日亜化学工業株式会社 発光装置
US20210147739A1 (en) * 2018-05-31 2021-05-20 Sekisui Chemical Co., Ltd. Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member
CN116333498A (zh) * 2022-11-23 2023-06-27 四川天邑康和通信股份有限公司 一种高导热吸波垫片及其制备方法
CN116836392A (zh) * 2023-08-01 2023-10-03 深圳市晨日科技股份有限公司 一种有机硅增粘剂及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6754317B2 (ja) * 2017-04-27 2020-09-09 信越化学工業株式会社 付加硬化型シリコーン組成物、該組成物の製造方法、シリコーン硬化物、及び光学素子
CN112313795A (zh) * 2018-06-22 2021-02-02 积水保力马科技株式会社 热传导性片

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JP2012083548A (ja) * 2010-10-12 2012-04-26 Polymatech Co Ltd 光拡散熱伝導性組成物及び光拡散熱伝導性成形体
JP2012229317A (ja) * 2011-04-26 2012-11-22 Nitto Denko Corp 透明熱伝導性組成物
JP2012229316A (ja) * 2011-04-26 2012-11-22 Nitto Denko Corp 透明熱伝導性組成物
WO2013005858A1 (fr) * 2011-07-07 2013-01-10 東レ・ダウコーニング株式会社 Composition de silicium durcissable, produit durcissable réalisé à partir de cette composition et dispositif semi-conducteur optique

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JPH06345970A (ja) * 1993-06-07 1994-12-20 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物
JP2007051053A (ja) * 2005-07-21 2007-03-01 Sony Corp 金属酸化物ナノ粒子及びその製造方法、並びに、発光素子組立体及び光学材料
JP2007070603A (ja) * 2005-08-09 2007-03-22 Sony Corp ナノ粒子−樹脂複合材料及びその製造方法、並びに、発光素子組立体、発光素子組立体用の充填材料、及び、光学材料
JP2010248311A (ja) * 2009-04-13 2010-11-04 Polymatech Co Ltd 透明熱伝導性組成物及び透明熱伝導性成形体
JP2011144360A (ja) * 2009-12-15 2011-07-28 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置
JP2012082314A (ja) * 2010-10-12 2012-04-26 Polymatech Co Ltd 透明熱伝導性組成物及び透明熱伝導性成形体
JP2012083548A (ja) * 2010-10-12 2012-04-26 Polymatech Co Ltd 光拡散熱伝導性組成物及び光拡散熱伝導性成形体
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WO2013005858A1 (fr) * 2011-07-07 2013-01-10 東レ・ダウコーニング株式会社 Composition de silicium durcissable, produit durcissable réalisé à partir de cette composition et dispositif semi-conducteur optique

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016035022A (ja) * 2014-08-04 2016-03-17 株式会社Kri 透明熱伝導性樹脂組成物
JP2016037562A (ja) * 2014-08-08 2016-03-22 日東電工株式会社 封止シート、その製造方法、光半導体装置および封止光半導体素子
WO2016021714A1 (fr) * 2014-08-08 2016-02-11 日東電工株式会社 Feuille de scellement, son procédé de fabrication, dispositif à semiconducteur photoélectrique, et élément de semiconducteur photoélectrique scellé
JP2017036391A (ja) * 2015-08-10 2017-02-16 Jsr株式会社 硬化性組成物、硬化物、ポリシロキサン、及び光半導体装置
JP2017048286A (ja) * 2015-08-31 2017-03-09 ポリマテック・ジャパン株式会社 熱伝導性シート
JP2017165943A (ja) * 2016-03-15 2017-09-21 東莞市天凱電子有限公司 硬化可能な有機ポリシロキサン組成物及びその応用
US20210147739A1 (en) * 2018-05-31 2021-05-20 Sekisui Chemical Co., Ltd. Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member
JP7277766B2 (ja) 2018-09-28 2023-05-19 日亜化学工業株式会社 発光装置
JP2020057774A (ja) * 2018-09-28 2020-04-09 日亜化学工業株式会社 発光装置
CN109140385A (zh) * 2018-10-15 2019-01-04 华域视觉科技(上海)有限公司 一种具有抗聚焦散热功能的车灯零件及其制备方法
CN109140385B (zh) * 2018-10-15 2023-09-01 华域视觉科技(上海)有限公司 一种具有抗聚焦散热功能的车灯零件及其制备方法
CN116333498A (zh) * 2022-11-23 2023-06-27 四川天邑康和通信股份有限公司 一种高导热吸波垫片及其制备方法
CN116836392A (zh) * 2023-08-01 2023-10-03 深圳市晨日科技股份有限公司 一种有机硅增粘剂及其制备方法

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