WO2014065051A1 - Dispositif de source de lumière fluorescente - Google Patents

Dispositif de source de lumière fluorescente Download PDF

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Publication number
WO2014065051A1
WO2014065051A1 PCT/JP2013/075471 JP2013075471W WO2014065051A1 WO 2014065051 A1 WO2014065051 A1 WO 2014065051A1 JP 2013075471 W JP2013075471 W JP 2013075471W WO 2014065051 A1 WO2014065051 A1 WO 2014065051A1
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WO
WIPO (PCT)
Prior art keywords
conversion member
wavelength conversion
light source
source device
fluorescent light
Prior art date
Application number
PCT/JP2013/075471
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English (en)
Japanese (ja)
Inventor
井上　正樹
政治 北村
蕪木　清幸
Original Assignee
ウシオ電機株式会社
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Priority to JP2014543196A priority Critical patent/JP6164221B2/ja
Publication of WO2014065051A1 publication Critical patent/WO2014065051A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2013—Plural light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2066—Reflectors in illumination beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating

Definitions

  • the present invention relates to a fluorescent light source device, and more particularly, to a fluorescent light source device suitable as a light source for a projector, which includes a wavelength conversion member made of a phosphor excited by excitation light such as laser light.
  • a fluorescent light source device including a laser light source and a wavelength conversion member made of a phosphor excited by laser light from the laser light source
  • a green light source of a projector device As shown in FIG. 8, as a green light source of a projector device, a laser light source 51 that emits laser light oscillating in a blue region, a fluorescent wheel 52, and the fluorescent wheel 52 are rotated. A fluorescent light source device including a wheel motor 53 is used. The fluorescent wheel 52 is formed by forming a wavelength conversion member made of a phosphor excited by the laser light on a base material that transmits the laser light from the laser light source 51.
  • FIG. 1 a green light source of a projector device
  • a laser light source 51 that emits laser light oscillating in a blue region
  • a fluorescent wheel 52 As a green light source of a projector device, a laser light source 51 that emits laser light oscillating in a blue region, a fluorescent wheel 52, and the fluorescent wheel 52 are rotated.
  • 61 is a collimating lens
  • 62 is a red light source composed of a red light emitting diode.
  • Reference numerals 63A, 63B, 63C, 64A, 64B, and 64C denote condensing lenses.
  • Reference numeral 65 denotes a dichroic lens that transmits light from a green light source and reflects light from a red light source.
  • Reference numeral 66 denotes an incident lens for a light guide device.
  • Reference numeral 67 denotes a reflection mirror, and reference numeral 68 denotes a light guide device.
  • the wavelength conversion member is air-cooled by the rotation of the fluorescent wheel 52.
  • the configuration of the drive system of the fluorescent wheel 52 including the wheel motor 53 is complicated, and a long service life cannot be obtained for the wheel motor 53 due to deterioration of the constituent members.
  • the wavelength conversion member cannot be sufficiently cooled only by rotating the fluorescent wheel 52.
  • Patent Document 2 a fluorescent light source device having a configuration without a rotation mechanism has been proposed (for example, see Patent Document 2).
  • a wavelength conversion member 71 made of a phosphor excited by laser light from a laser light source and a material having a thermal expansion coefficient different from that of the wavelength conversion member are used.
  • a fluorescent light source device including a fluorescent light emitter having a substrate 72 and a thermal expansion absorption layer 73 made of barium sulfate formed between the wavelength conversion member 71 and the substrate 72 is disclosed.
  • the substrate 72 is made of an aluminum nitride sintered body having high thermal conductivity, and the surface (the lower surface in FIG.
  • the substrate 72 facing the laminated surface of the thermal expansion absorption layer 73 is made of metal.
  • a heat dissipation plate 74 made of eutectic is joined. Further, a heat radiating fin 75 is fixed to the surface (the lower surface in FIG. 9) of the heat radiating plate 74 that faces the bonding surface with the substrate 72.
  • the barium sulfate layer using glass as a binder has low thermal conductivity. Therefore, the heat generated by the laser beam irradiation on the wavelength conversion member 71 can be efficiently transferred to the heat dissipation plate 74 and the heat dissipation fin 75 via the substrate 72 and the substrate 72 to be radiated to the outside. Can not. Thereby, there exists a problem that the wavelength conversion member 71 will become high temperature. Thus, when the wavelength conversion member 71 becomes high temperature, the phosphor constituting the wavelength conversion member 71 cannot be sufficiently excited by the laser light. In addition, the phosphor itself rises in temperature, causing a decrease in light flux due to temperature quenching, and various adverse effects such as a failure to obtain a sufficient fluorescent light flux occur.
  • the present invention has been made based on the circumstances as described above, and an object of the present invention is to provide a fluorescent light source device that can suppress the temperature rise of the wavelength conversion member due to irradiation of excitation light and can obtain high luminous efficiency. It is to provide.
  • the fluorescent light source device of the present invention is a fluorescent light source device including a wavelength conversion member made of a phosphor excited by excitation light, The wavelength conversion member is bonded to a thermally conductive substrate via a bonding member;
  • the wavelength conversion member has a thermal conductivity of 4.0 W / mK or more,
  • the thermally conductive substrate is made of a material whose difference in thermal expansion coefficient from the wavelength conversion member is within ⁇ 40% of the thermal expansion coefficient of the wavelength conversion member,
  • the bonding member has a higher thermal conductivity than the wavelength conversion member.
  • the phosphor constituting the wavelength conversion member is preferably made of a single crystal material or a polycrystalline material having a porosity of 0.5% or less.
  • the thermally conductive substrate is made of a composite material of at least graphite and aluminum.
  • the thermally conductive substrate is provided with a heat radiation fin.
  • the wavelength conversion member has a specific thermal conductivity
  • the bonding member has a higher thermal conductivity than the wavelength conversion member.
  • the heat generated in the member can be efficiently transmitted to the heat conductive substrate through the bonding member.
  • the heat conductive substrate is made of a material having a thermal expansion coefficient substantially equal to that of the wavelength conversion member, the heat cycle in which the heat of the wavelength conversion member is transferred to the heat conductive substrate through the bonding member is highly reliable. Is obtained. As a result, it is possible to prevent the thermal conversion substrate and the wavelength conversion member from peeling off and the wavelength conversion member from being cracked due to the thermal expansion of the wavelength conversion member and the thermal conductive substrate. .
  • the fluorescent light source device of the present invention heat generated in the wavelength conversion member can be efficiently transmitted to the heat conductive substrate through the bonding member and radiated to the outside.
  • the temperature rise of the wavelength conversion member can be suppressed and high luminous efficiency can be obtained.
  • the wavelength conversion member since the phosphor constituting the wavelength conversion member is made of a single crystal material or a polycrystalline material having a porosity of 0.5% or less, the wavelength conversion member has a desired thermal conductivity. It can be of high thermal conductivity. Moreover, since the wavelength conversion member has no pores or almost no pores, the backscattering of the excitation light to be irradiated is almost eliminated and excitation is performed efficiently.
  • the thermal conductive substrate is made of a composite material of at least graphite and aluminum, so that the thermal conductive substrate has a high thermal conductivity and a desired thermal expansion coefficient. Can do.
  • the composite material of graphite and aluminum has a specific gravity smaller than that of metal, it is possible to reduce the weight of the fluorescent light-emitting body in which the wavelength conversion member and the heat conductive substrate are bonded via the bonding member. .
  • the heat conductive substrate is provided with heat radiating fins, a higher heat radiating effect is obtained by the heat conductive substrate due to the heat radiating effect of the heat radiating fins. Further, since it is not necessary to use a fin fixing joint member for fixing the heat radiation fin to the heat conductive substrate, it is not necessary to transfer heat to the heat radiation fin via the fin fixing joint member. Therefore, the temperature rise of the wavelength conversion member due to the irradiation of excitation light is further suppressed, so that the light emission efficiency can be further increased. In addition, when the thermally conductive substrate is made of a composite material of at least graphite and aluminum, since the composite material has a low specific gravity, the weight of the thermally conductive substrate associated with the provision of heat radiation fins is suppressed. can do.
  • FIG. 2 is an explanatory perspective view illustrating an outline of a first embodiment of a configuration of a fluorescent light emitter in which a wavelength conversion member and a heat conductive substrate are bonded via a bonding member in the fluorescent light source device of FIG. 1.
  • It is sectional drawing for description which shows the cross section of the fluorescent substance of FIG.
  • It is explanatory drawing which shows the outline of an example of a structure of the light source unit in the strong excitation light source device used as a laser light source of the fluorescence light source device of FIG.
  • FIG. 1 is an explanatory view showing an outline of an example of the configuration of the fluorescent light source device of the present invention
  • FIG. 2 is a diagram illustrating a wavelength conversion member and a thermally conductive substrate in the fluorescent light source device of FIG.
  • FIG. 3 is an explanatory perspective view showing an outline of the first embodiment of the configuration of the bonded fluorescent light emitter
  • FIG. 3 is an explanatory cross sectional view showing a cross section of the fluorescent light emitter of FIG.
  • the fluorescent light source device 10 includes a laser light source 30 as an excitation light source and a fluorescent light emitter 20 having a wavelength conversion member 21 made of a fluorescent material excited by the laser light from the laser light source 30.
  • the collimating lens 12 and the laser light that has been made substantially parallel by the collimating lens 12 are transmitted through the optical path from the light emitting port 30 ⁇ / b> A of the laser light source 30 to the fluorescent light emitter 20.
  • the dichroic mirror 11 and the condensing lenses 13 and 14 for condensing the transmitted laser light are arranged in this order.
  • the dichroic mirror 11 is arranged in a posture inclined at an angle of, for example, 45 ° with respect to the optical axis of the collimating lens 12.
  • the fluorescent light emitter 20 has a structure in which a rectangular plate-shaped wavelength conversion member 21 is bonded to a rectangular plate-shaped thermally conductive substrate 26 via a bonding member. belongs to. Between the heat conductive substrate 26 and the wavelength conversion member 21, a rectangular flat plate-shaped bonding member layer 29 made of a bonding member is formed.
  • the fluorescent light emitter 20 is disposed such that the surface of the wavelength conversion member 21 (the upper surface in FIG. 3) faces the light exit 30A of the laser light source 30, and the irradiated light is irradiated with excitation light by the surface.
  • the surface is configured.
  • the wavelength conversion member 21 is made of a phosphor having a thermal conductivity of 4.0 W / mK or more.
  • the thermal conductivity of the wavelength conversion member 21 is less than 4.0 W / mK, the heat generated by the irradiation of the excitation light in the wavelength conversion member cannot be efficiently transferred to the thermal conductive substrate 26, and the wavelength The conversion member becomes high temperature, and sufficient exchange for fluorescence (hereinafter referred to as “fluorescence conversion efficiency”) cannot be obtained.
  • the phosphor constituting the wavelength conversion member 21 is preferably made of a single crystal material or a polycrystalline material having a porosity of 0.5% or less.
  • a phosphor made of a single crystal material or a polycrystalline material having a porosity of 0.5% or less as the wavelength conversion member 21, the wavelength conversion member 21 has a high thermal conductivity having a desired thermal conductivity. be able to. The reason is that the single crystal material has no pores, and the polycrystalline material has few pores, so that the thermal conductivity is not greatly reduced due to the presence of air with low thermal conductivity in the pores. Because.
  • the wavelength conversion member 21 made of a single crystal material or a polycrystalline material has no pores or few pores, and there is almost no backscattering of the excitation light to be irradiated. So that the phosphor is efficiently excited.
  • a polycrystalline material having a porosity of more than 0.5% is used as the wavelength conversion member, a desired thermal conductivity cannot be obtained, as is apparent from an experimental example described later, that is, the thermal conductivity. Is less than 4.0 W / mK.
  • a Czochralski method of growing a crystal (single crystal) by bringing a seed crystal into contact with a raw material that has been melted in a crucible and pulling it while rotating in a vertical direction are used.
  • various materials and seed crystals can be used.
  • a raw material (a base material, a baking aid and an activator if necessary) is pulverized by using a pulverizer such as a ball mill to reduce the particle size to submicron or less.
  • a pulverizer such as a ball mill to reduce the particle size to submicron or less.
  • the obtained fired body is subjected to hot isostatic pressing.
  • various materials can be used as long as they can be sintered.
  • the single crystal material and polycrystalline material constituting the wavelength conversion member 21 are preferably those in which a rare earth compound is doped (activated) as an activator.
  • a rare earth compound examples include cerium (Ce), praseodymium (Pr), and samarium (Sm).
  • the doping amount of the rare earth compound is appropriately determined according to, for example, the type of the rare earth compound to be doped, and is, for example, about 0.5 mol%.
  • the phosphor constituting the wavelength conversion member 21 include a crystal material (YAG: Ce) in which cerium is doped into yttrium aluminum garnet (Y 3 Al 5 O 12 ), yttrium aluminum garnet (Y 3 Al 5 O 12 ) crystal material doped with praseodymium (YAG: Pr), yttrium aluminum garnet (Y 3 Al 5 O 12 ) samarium doped crystal material (YAG: Sm), and lutetium Examples thereof include a crystal material (LuAG: Ce) in which cerium is doped in aluminum garnet (Lu 3 Al 5 O 12 ).
  • the thickness of the wavelength conversion member 21 is preferably 30 to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
  • the thickness of the wavelength conversion member 21 is too small, the excitation light is transmitted, so that the wavelength conversion member 21 cannot sufficiently absorb the excitation light, and the conversion amount of fluorescence may be reduced. is there.
  • the thickness of the wavelength conversion member 21 is excessive, heat generated by the excitation light being irradiated by the thermal resistance of the wavelength conversion member 21 may accumulate in the wavelength conversion member 21 and become high temperature. is there.
  • the wavelength conversion member 21 has silicon dioxide (SiO 2) on the entire back surface (the lower surface in FIG. 3) from the viewpoint of bonding properties with the bonding member and the configuration of the fluorescent light source device 10. 2 )
  • a metal film in which the reflective film layer 22, the protective film layers 23 and 24, and the solder wet film layer 25 are laminated is formed through a film (not shown).
  • the reflective film layer 22 is made of, for example, silver (Ag)
  • the protective film layer 23 is made of, for example, titanium (Ti)
  • the protective film layer 24 is made of, for example, platinum (Pt).
  • the layer 25 is made of, for example, gold (Au).
  • the reflective film layer 22, the protective film layers 23 and 24, and the solder wetting film layer 25 constituting the metal film can be formed by, for example, sputtering.
  • the thickness of the silicon dioxide film is as thin as 10 nm, so the thermal resistance is ignored.
  • the metal film constituting each layer of the metal film is as thin as about several hundred nm and has a good thermal conductivity, heat transfer from the wavelength conversion member 21 to the heat conductive substrate 26 is possible. There will be no harmful effects. In the example of this figure, the thickness of the silicon dioxide film is 10 nm.
  • each layer constituting the metal film is 110 nm for the reflective film layer 22, 100 nm for the protective film layer 23, 200 nm for the protective film layer 24, and 500 nm for the solder wetting film layer 25.
  • the surface of the wavelength conversion member 21 functions as an irradiated surface and also functions as a light emitting surface.
  • the thermally conductive substrate 26 has a high thermal conductivity, and a material whose difference in thermal expansion coefficient from the wavelength conversion member 21 is within ⁇ 40% of the thermal expansion coefficient of the wavelength conversion member 21 (hereinafter referred to as “substrate”). "Material")).
  • the difference in thermal expansion coefficient from the wavelength conversion member 21 is preferably within ⁇ 20% of the thermal expansion coefficient of the wavelength conversion member 21, and within ⁇ 15% of the thermal expansion coefficient of the wavelength conversion member 21. More preferably. That is, the coefficient of thermal expansion of the substrate material is required to be 0.6 C to 1.4 C [/ K], preferably 0 to 0.1 C, where C is the coefficient of thermal expansion of the wavelength conversion member 21.
  • the thermal expansion coefficient of the material constituting the thermally conductive substrate 26 is too small and excessive, that is, when the difference between the thermal expansion coefficient of the material constituting the thermally conductive substrate 26 and the wavelength conversion member 21 is excessive. Due to thermal expansion, the thermally conductive substrate and the wavelength conversion member 21 may be peeled off or cracks may be generated in the wavelength conversion member 21.
  • the thermal expansion coefficient of the wavelength conversion member 21 is 8.0 ⁇ 10 ⁇ 6 / K when YAG or LuAG is used as the phosphor constituting the wavelength conversion member 21.
  • the substrate material include a composite material of graphite and aluminum (hereinafter also referred to as “graphite composite material”).
  • graphite composite material a composite material of graphite and aluminum
  • the thermal expansion coefficient of the graphite composite material is 7 ⁇ 10 ⁇ 6 to 8 ⁇ 10 ⁇ 6 / K
  • the thermal conductivity is 168 to 425 W / mK.
  • the graphite composite material is obtained by a molten metal forging method. Specifically, the graphite composite material is formed by immersing a graphite block in molten aluminum metal and forcing the molten aluminum metal into pores existing in the graphite block by applying high pressure to the molten aluminum metal. It can be produced by impregnating and then cooling. According to such a manufacturing method, the obtained specific graphite composite material can be made into a cast product having a dense shape and a small number of voids.
  • the substrate material for example, a composite material of silicon carbide and aluminum obtained by a melt forging method, a copper tungsten alloy, molybdenum, a diamond copper composite, an aluminum diamond composite, and the like can be used in addition to the graphite composite.
  • the thermal expansion coefficient of the composite material of silicon carbide and aluminum is 6 ⁇ 10 ⁇ 6 to 7 ⁇ 10 ⁇ 6 / K, and the thermal conductivity is 276 W / mK.
  • the thermal expansion coefficient of the copper tungsten alloy is 6.4 ⁇ 10 ⁇ 6 / K, and the thermal conductivity is 167 W / mK.
  • Molybdenum has a thermal expansion coefficient of 4.8 ⁇ 10 ⁇ 6 / K and a thermal conductivity of 138 W / mK.
  • the thermal expansion coefficient of the diamond copper composite is 6 ⁇ 10 ⁇ 6 / K, and the thermal conductivity is 550 W / mK.
  • the thermal expansion coefficient of the aluminum diamond composite is 7.5 ⁇ 10 ⁇ 6 / K, and the thermal conductivity is 500 W / mK.
  • the heat conductive substrate 26 has a protective film layer 27 and a solder wetting film layer on the surface (upper surface in FIG. 3) of the base material 26A made of a substrate material, from the viewpoint of bonding properties with the bonding member. It is preferable that a metal film in which 28 is laminated in this order is formed.
  • the protective film layer 27 is made of, for example, a nickel-phosphorous plating film (Ni-P film) formed by an electroless plating method
  • the solder wet film layer 28 is made of gold (for example, formed by a plating method). Au) film.
  • the metal constituting each layer of the metal film has a good heat conductivity. There is no adverse effect on heat transfer from the conversion member 21.
  • the entire outer surface (front surface, back surface and side surface) of the base material 26A made of the substrate material is covered with a metal film made of the protective film layer 27 and the solder wet film layer 28. It will be.
  • the thickness of each layer constituting the metal film is 2 ⁇ m for the protective film layer 27 and 0.1 ⁇ m for the solder wetting film layer 28.
  • the thickness of the base material 26A in the heat conductive substrate 26 is appropriately determined according to the thermal conductivity of the substrate material constituting the base material 26A from the viewpoint of exhaust heat. Specifically, when the substrate material is a graphite composite material, the thickness of the base material 26A is preferably 1.0 to 2.0 ⁇ m. Moreover, it is preferable that the area of the surface (upper surface in FIG. 3) in the heat conductive board
  • substrate 26 is larger than the area of the back surface in the wavelength conversion member 21 from viewpoints, such as exhaust heat property.
  • the bonding member has a higher thermal conductivity than the wavelength conversion member 21.
  • the thermal conductivity of the bonding member is equal to or lower than the thermal conductivity of the wavelength conversion member 21, the heat generated by the excitation light irradiation in the wavelength conversion member 21 can be efficiently transmitted to the thermal conductive substrate 26. Therefore, the wavelength conversion member 21 becomes high temperature, and sufficient fluorescence exchange efficiency cannot be obtained.
  • flux-free solder As the joining member, flux-free solder is used.
  • the thermal conductivity of the flux-free solder is 40 to 55 W / mK.
  • the wavelength conversion member 21 and the heat conductive substrate 26 are bonded by the bonding member using, for example, a reflow furnace, a flux-free solder sheet as a bonding member, and a wavelength on which a silicon dioxide film and a metal film are formed as necessary. It can be performed by a reflow method in which it is sandwiched between the conversion member 21 and the heat conductive substrate 26 and heated in an atmosphere of formic acid gas or hydrogen gas.
  • the reflow is performed by removing the surface oxide film of the flux-free solder sheet using the reducing power of formic acid or hydrogen, no voids are generated in the formed joining member layer 29, Good thermal conductivity is obtained.
  • the thickness of the joining member (flux-free solder sheet) used for joining the wavelength conversion member 21 and the heat conductive substrate 26 by the reflow method is, for example, 50 ⁇ m.
  • the formed bonding member layer 29 has a surface from the viewpoints of bondability between the wavelength conversion member 21 and the heat conductive substrate 26, exhaust heat by the bonding member layer 29, heat transfer to the heat conductive substrate 26, and the like. It is preferable that the area of the upper surface in FIG. 3 is larger than the area of the back surface of the wavelength conversion member 21 and the area of the back surface (lower surface in FIG. 3) is smaller than the area of the surface of the heat conductive substrate 26.
  • a plurality of strong excitation light source devices (5 in this example) are used.
  • 14 laser light emitting elements 32 are arranged in two rows, and each of the seven laser light emitting elements 32 constituting each row is opposed to the light emitting surface. Are arranged to be.
  • a collimating lens 33 is disposed in front of the light emitting surface of each of the 14 laser light emitting elements 32, and the laser light that has been made substantially parallel by each of the plurality of collimating lenses 33 is the same.
  • a folding mirror 34 is provided to bend so as to proceed in the direction. Further, a condensing lens 35 for condensing the light reflected by each of the plurality of folding mirrors 34 and a light guide member 36 for allowing the laser light condensed by the condensing lens 35 to enter one end are provided.
  • the light guide member 36 for example, a quartz fiber having a diameter of 1.5 mm is used. And the quartz fiber which comprises the light guide member 36 of the five laser light source units 31 is bundled, and by this, the laser light source 30 which consists of a strong excitation light source device by the other end of five bundled quartz fibers. A light exit 30A is configured.
  • the laser light emitted from the 14 laser light emitting elements 32 in each of the five laser light source units 31 constituting the laser light source 30 is substantially parallel by the collimating lens 33. After being converted to light, it is reflected toward the condenser lens 35 by the folding mirror 34. Then, the reflected light of the folding mirror 34 is collected by the condenser lens 35 and enters one end of the light guide member 36. In this way, the laser light incident on each of the light guide members 36 constituting the five light source units 31 is a light emission port formed by the other ends of these five light guide members 36 (quartz fibers). 30A is emitted as excitation light. As shown in FIG.
  • the laser light emitted from the light emission port 30 ⁇ / b> A of the laser light source 30 is converted into substantially parallel light by the collimating lens 12, condensed by the condenser lenses 13 and 14, and fluorescent light emission.
  • the surface (irradiated surface) of the wavelength conversion member 21 constituting the body 20 it is converted into fluorescence.
  • the fluorescence emitted by irradiating the wavelength conversion member 21 with the laser light is emitted from the fluorescent light source device 10 and used as, for example, the light source light of the projector device.
  • the excitation light of high energy density will be irradiated with respect to the wavelength conversion member 21.
  • the energy for exciting the phosphor constituting the wavelength conversion member 21 is about 100 W (excitation density is about 20 W / mm 2 ).
  • excitation density is about 20 W / mm 2 .
  • the fluorescent light source device 10 includes a fluorescent wheel.
  • the phosphor constituting the wavelength conversion member 21 is excited with light having an excitation density four times that of the fluorescent light source device.
  • the fluorescence conversion efficiency in the wavelength conversion member 21 is 50%, so about half of the excitation light energy becomes heat.
  • the fluorescence conversion efficiency in the wavelength conversion member 21 decreases as the temperature of the wavelength conversion member 21 increases, and this temperature quenching causes a decrease in luminous flux.
  • FIG. 5 shows the relationship between the temperature of the phosphor constituting the wavelength conversion member 21 (wavelength conversion member temperature) and the relative value of the amount of fluorescent light flux.
  • the wavelength conversion member 21 has a specific thermal conductivity of 4.0 W / mK or more, and the bonding member has a higher thermal conductivity than the wavelength conversion member 21.
  • the heat generated in the wavelength conversion member 21 by being irradiated with the excitation light is efficiently transmitted to the heat conductive substrate 26 through the bonding member.
  • the heat conductive substrate 26 is made of a substrate material having a thermal expansion coefficient substantially equal to that of the wavelength conversion member 21, the heat of the wavelength conversion member 21 is transmitted to the heat conductive substrate 26 through the bonding member. High reliability in thermal cycle.
  • the temperature of the wavelength conversion member 21 irradiated with the excitation light is set to a temperature at which the luminous flux decrease due to temperature quenching of the phosphor constituting the wavelength conversion member 21 is within 10%, specifically 200 ° C. or less. Since it can be preferably set to 150 ° C. or less, high luminous efficiency can be obtained. Further, in the fluorescent light source device 10, the wavelength conversion member 21 and the heat conductive substrate 26 are thermally expanded to cause separation between the heat conductive substrate 26 and the wavelength conversion member 21, and the wavelength conversion member. No adverse effects such as the occurrence of cracks in 21 occur.
  • a wavelength conversion member having a thermal conductivity of 4.0 W / mK or more is bonded to a thermally conductive substrate made of a substrate material via a bonding member having a higher thermal conductivity than the wavelength conversion member.
  • the heat conductive substrate may be provided with a heat radiating fin (see FIG. 7), or a metal film is provided only on the surface of a base material made of a substrate material. (See FIGS. 6 and 7).
  • the thermally conductive substrate is provided with heat radiating fins
  • a higher heat radiating effect is obtained by the heat conductive substrate due to the heat radiating effect of the heat radiating fins.
  • heat-fining bonding member such as grease to fix the heat-dissipating fin to the heat-conductive substrate
  • heat is transferred to the heat-dissipating fin via the heat-conductive bonding member. There is no need to do. Therefore, the temperature rise of the wavelength conversion member due to the irradiation of excitation light can be further suppressed, and the luminous efficiency can be further increased.
  • the thermally conductive substrate is made of at least a graphite composite material
  • the graphite composite material has a smaller specific gravity than a metal such as copper, which is generally used as a constituent material of the heat radiation fin.
  • the specific gravity of the graphite composite material is about 1/4 of that of copper.
  • the metal film may be formed in the wavelength conversion member in the whole outer surface other than the surface (surface to be irradiated) (refer FIG. 7).
  • a metal film including a reflective film layer is formed on the side surface of the wavelength conversion member, the fluorescence obtained in the wavelength conversion member can be prevented from being emitted from the side surface. It can be used more efficiently.
  • FIGS. 6 and 7 there is a fluorescent light source device including a fluorescent light emitter as shown in FIGS.
  • the temperature increase of the wavelength conversion member due to the irradiation of the excitation light can be suppressed, and the high luminous efficiency. Can be obtained.
  • the fluorescent light-emitting body 41 of FIG. 6 has a configuration having a thermally conductive substrate 42 in which a metal film is provided only on the surface (upper surface in FIG. 6) of a base material 26A made of a substrate material.
  • the metal film has the same configuration as the metal film provided on the heat conductive substrate 26 of the fluorescent light source device 10 according to FIGS. 1 to 3, for example.
  • the fluorescent light source device having the fluorescent light emitter 41 of FIG. 6 uses a thermally conductive substrate 42 in which a metal film is provided only on the surface of the base material 26A made of a substrate material.
  • the fluorescent light source device 10 according to FIGS. 1 to 3 has the same configuration.
  • the heat conductive substrate 45 has a configuration in which the heat conductive substrate 45 includes the heat radiation fins 46 on the back surface side (the lower surface side in FIG. 7).
  • the heat conductive substrate 45 is a substrate in which a metal film is provided only on the surface (upper surface in FIG. 7) of a base material 45A made of a substrate material.
  • the metal film has the same configuration as the metal film provided on the heat conductive substrate 26 of the fluorescent light source device 10 according to FIGS. 1 to 3, for example. Further, a metal film is formed on the entire outer surface (back surface and side surface) other than the surface (irradiated surface) of the wavelength conversion member 21.
  • the metal film has the same configuration as the metal film formed on the wavelength conversion member 21 of the fluorescent light source device 10 according to FIGS. 1 to 3, for example.
  • the fluorescent light emitter 44 uses the heat conductive substrate 45 having the heat dissipating fins 46 on the back surface side, and the surface of the wavelength conversion member 21 ( Except that a metal film is formed on the entire surface of the outer surface other than the surface to be irradiated), it has the same configuration as that of the fluorescent light source device according to FIG.
  • the structure of the whole fluorescence light source device is not limited to what is shown in FIG. 1, A various structure is employable.
  • the light of one laser light source for example, a laser diode
  • a condensing lens is disposed in front of the wavelength conversion member
  • the form which irradiates a wavelength conversion member with condensed light may be sufficient.
  • the excitation light is not limited to the light from the laser light source, and may be one that condenses the light of the LED as long as it can excite the wavelength conversion member, and further, from a lamp in which mercury, xenon, or the like is enclosed. May be light.
  • the wavelength of the excitation light is a main radiation wavelength region emitted from the lamp or the like.
  • the present invention is not limited to this.
  • a light emitter (also referred to as “7”) was manufactured.
  • the heat conductive substrate has a rectangular flat plate shape of 25 mm long, 25 mm wide and 1.6 mm thick.
  • a composite material coefficient of thermal expansion: 7.0 ⁇ 10 ⁇ 6 / K
  • a flux-free solder sheet thermal conductivity 55 W / mK having a length of 3.5 mm, a width of 2.2 mm, and a thickness of 50 ⁇ m was used as the joining member.
  • the produced experimental fluorescent light emitter (1) to experimental fluorescent light emitter (7) are used as fluorescent light emitters in the fluorescent light source device having the configuration shown in FIG.
  • Each of the bodies (7) was irradiated with excitation light having an energy for exciting the phosphor of about 100 W (excitation density of about 20 W / mm 2 ) from a laser light source under an environmental condition of a temperature of 25 ° C. Then, the temperature (surface temperature) of the heat conductive substrate is measured by a thermocouple, and the temperature of the wavelength conversion member is calculated based on the obtained measurement value and the thermal resistance of the wavelength conversion member constituting each fluorescent light emitter. did. The results are shown in Table 1 together with the thermal conductivity of the wavelength conversion member.
  • a strong excitation light source device having the structure of FIG. 4 was used as the laser light source.
  • a laser light emitting element 32 that emits laser light having a wavelength of 445 nm at an output of 1.6 W is used, and a light guide member 36 that is made of a quartz fiber having a diameter of 1.5 mm. Using.

Abstract

L'objet de la présente invention est de produire un dispositif de source de lumière fluorescente par lequel des accroissements de température d'un organe de conversion de longueur d'onde causés par l'exposition à une lumière d'excitation sont réduits et un haut rendement d'émission de lumière est obtenu. Le dispositif de source de lumière fluorescente, lequel comprend un organe de conversion de longueur d'onde comprenant une substance fluorescente qui est excitée par une lumière d'excitation, est caractérisé en ce que : ledit organe de conversion de longueur d'onde est joint à un substrat thermoconducteur par un organe de jonction intercalé entre eux ; la conductance thermique de l'organe de conversion de longueur d'onde est d'au moins 4,0 W/mK ; le substrat thermoconducteur comprend un matériau ayant un coefficient d'expansion thermique compris dans une plage de ±40 % de celui de l'organe de conversion de longueur d'onde ; et l'organe de jonction a une conductance thermique supérieure à celle de l'organe de conversion de longueur d'onde.
PCT/JP2013/075471 2012-10-26 2013-09-20 Dispositif de source de lumière fluorescente WO2014065051A1 (fr)

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JP2017045528A (ja) * 2015-08-24 2017-03-02 ウシオ電機株式会社 光源装置及び蛍光板アッセンブリ
JP2018107064A (ja) * 2016-12-28 2018-07-05 ウシオ電機株式会社 蛍光光源装置およびその製造方法
JP2018159742A (ja) * 2017-03-22 2018-10-11 セイコーエプソン株式会社 波長変換素子、光源装置及びプロジェクター
CN108692204A (zh) * 2016-08-08 2018-10-23 优志旺电机株式会社 荧光光源装置
WO2019159441A1 (fr) 2018-02-14 2019-08-22 日本特殊陶業株式会社 Dispositif de conversion de longueur d'onde optique
JP2019525389A (ja) * 2016-06-22 2019-09-05 ルミレッズ ホールディング ベーフェー 光変換パッケージ
JP2020134823A (ja) * 2019-02-22 2020-08-31 日本特殊陶業株式会社 光波長変換部品
JP2020201379A (ja) * 2019-06-10 2020-12-17 セイコーエプソン株式会社 波長変換素子、光源装置およびプロジェクター
JPWO2021010272A1 (fr) * 2019-07-16 2021-01-21
WO2021208668A1 (fr) * 2020-04-15 2021-10-21 青岛海信激光显示股份有限公司 Dispositif de source de lumière, procédé de commande de dispositif de source de lumière et projecteur
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WO2016152297A1 (fr) * 2015-03-20 2016-09-29 ウシオ電機株式会社 Dispositif de source de lumière fluorescente
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WO2016158089A1 (fr) * 2015-03-31 2016-10-06 ウシオ電機株式会社 Dispositif de source lumineuse fluorescente
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