JP7274050B2 - 高強度レーザポンピング光源に関する熱管理及び効率の改善 - Google Patents
高強度レーザポンピング光源に関する熱管理及び効率の改善 Download PDFInfo
- Publication number
- JP7274050B2 JP7274050B2 JP2022523545A JP2022523545A JP7274050B2 JP 7274050 B2 JP7274050 B2 JP 7274050B2 JP 2022523545 A JP2022523545 A JP 2022523545A JP 2022523545 A JP2022523545 A JP 2022523545A JP 7274050 B2 JP7274050 B2 JP 7274050B2
- Authority
- JP
- Japan
- Prior art keywords
- luminescent
- light
- reflective
- thermally conductive
- reflective elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 178
- 239000007787 solid Substances 0.000 claims description 45
- 238000004020 luminiscence type Methods 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 229910052709 silver Inorganic materials 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 239000004332 silver Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 10
- 229910052727 yttrium Inorganic materials 0.000 claims description 10
- 229910052733 gallium Inorganic materials 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052706 scandium Inorganic materials 0.000 claims description 8
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 7
- 229910052765 Lutetium Inorganic materials 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 229910052771 Terbium Inorganic materials 0.000 claims description 6
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- -1 and B comprises Inorganic materials 0.000 claims description 2
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 claims 1
- 239000010410 layer Substances 0.000 description 91
- 230000005855 radiation Effects 0.000 description 71
- 230000003287 optical effect Effects 0.000 description 45
- 230000003595 spectral effect Effects 0.000 description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 20
- 238000009826 distribution Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 15
- 238000002310 reflectometry Methods 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 13
- 239000002096 quantum dot Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 11
- 229910052684 Cerium Inorganic materials 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000001276 controlling effect Effects 0.000 description 7
- 239000002223 garnet Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000001513 hot isostatic pressing Methods 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 5
- 230000000875 corresponding effect Effects 0.000 description 5
- 229910052593 corundum Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910001845 yogo sapphire Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052747 lanthanoid Inorganic materials 0.000 description 3
- 150000002602 lanthanoids Chemical class 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- 229910007991 Si-N Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910006294 Si—N Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 229910008599 TiW Inorganic materials 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910003373 AgInS2 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910000635 Spelter Inorganic materials 0.000 description 1
- 241001455273 Tetrapoda Species 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- DFENVCUUBABVIU-UHFFFAOYSA-N [Ca].[Y] Chemical compound [Ca].[Y] DFENVCUUBABVIU-UHFFFAOYSA-N 0.000 description 1
- YNXRTZDUPOFFKZ-UHFFFAOYSA-N [In].[Ag]=S Chemical compound [In].[Ag]=S YNXRTZDUPOFFKZ-UHFFFAOYSA-N 0.000 description 1
- WCULPSIYAQDUJW-UHFFFAOYSA-N [Li].[Sr] Chemical compound [Li].[Sr] WCULPSIYAQDUJW-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000008272 agar Substances 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910001602 chrysoberyl Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- KWMNWMQPPKKDII-UHFFFAOYSA-N erbium ytterbium Chemical compound [Er].[Yb] KWMNWMQPPKKDII-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- VQMWBBYLQSCNPO-NJFSPNSNSA-N promethium-147 Chemical compound [147Pm] VQMWBBYLQSCNPO-NJFSPNSNSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/16—Laser light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Description
Claims (15)
- 固体ルミネッセンス本体を含むルミネッセンス要素であって、前記固体ルミネッセンス本体が、ルミネッセンス材料を含み、前記ルミネッセンス材料は、前記ルミネッセンス材料が励起可能である波長を有する光で励起されると、ルミネッセンス材料光を生成するように構成されており、前記固体ルミネッセンス本体が、ルミネッセンス本体面を有し、前記ルミネッセンス要素は、少なくとも1つのルミネッセンス本体面に関連付けられている、1つ以上の反射要素を更に含み、前記1つ以上の反射要素が、金属製であり、前記ルミネッセンス要素は、熱伝導性本体を更に含み、前記熱伝導性本体が、熱伝導性本体面を含み、前記熱伝導性本体が、少なくとも100W/m/Kの熱伝導を有し、前記固体ルミネッセンス本体が、前記1つ以上の反射要素を介して、前記熱伝導性本体面に関連付けられており、前記1つ以上の反射要素による、前記少なくとも1つのルミネッセンス本体面の表面被覆率が、5~40%の範囲から選択され、前記少なくとも1つのルミネッセンス本体面の、前記1つ以上の反射要素によって被覆されていない部分と、前記熱伝導性本体面との間に、空隙が存在する、ルミネッセンス要素。
- 前記1つ以上の反射要素のうちの1つからの任意の縁点において、前記1つ以上の反射要素のうちの前記1つが関連付けられている前記少なくとも1つのルミネッセンス本体面に平行な平面内で、第1の半径r1を有する円が、少なくとも、同じ反射要素の別の部分、又は別の反射要素の別の部分に接しており、10μm≦r≦500μmである、請求項1に記載のルミネッセンス要素。
- 複数のn個の反射要素を含み、n≧2であり、前記n個の反射要素が、最も近い隣接する反射要素の間に第2の最短距離d1を有し、前記表面被覆率が10~20%の範囲から選択され、20μm≦d1≦300μmである、請求項1又は2のいずれか一項に記載のルミネッセンス要素。
- n≧6であり、前記第2の最短距離d1が、50~200μmの範囲から選択される、請求項3に記載のルミネッセンス要素。
- 前記反射要素が、規則的配列で構成されていることと、n≧16であり、前記少なくとも1つのルミネッセンス本体面が、縁部及び幾何学的中心を有し、より前記幾何学的中心に近い前記反射要素が、より前記縁部に近い反射要素よりも、小さい最短距離d1を有することとのうちの、1つ以上が適用される、請求項3又は4のいずれか一項に記載のルミネッセンス要素。
- 前記1つ以上の反射要素が、銀及びアルミニウムのうちの1つ以上を含む、請求項1乃至5のいずれか一項に記載のルミネッセンス要素。
- 前記1つ以上の反射要素が、前記少なくとも1つのルミネッセンス本体面上の蒸着及び金属印刷のうちの1つ以上を含む方法によって得ることが可能である、請求項1乃至6のいずれか一項に記載のルミネッセンス要素。
- 前記固体ルミネッセンス本体が、セラミック本体を含み、前記ルミネッセンス材料が、A3B5O12:Ceを含み、Aが、Y、La、Gd、Tb及びLuのうちの1つ以上を含み、Bが、Al、Ga、In及びScのうちの1つ以上を含み、B-Oの最大10%が、Si-Nによって置換され得る、請求項1乃至7のいずれか一項に記載のルミネッセンス要素。
- 前記固体ルミネッセンス本体が、細長い光透過性本体を含み、前記固体ルミネッセンス本体が、前記ルミネッセンス材料光の少なくとも一部に対して光透過性である、請求項1乃至8のいずれか一項に記載のルミネッセンス要素。
- 前記1つ以上の反射要素と前記熱伝導性本体面との間に、中間要素を更に含む、請求項1乃至9のいずれか一項に記載のルミネッセンス要素。
- 前記固体ルミネッセンス本体と前記熱伝導性本体面との間の第3の距離d3が、10~100μmの範囲から選択される、請求項10に記載のルミネッセンス要素。
- 前記中間要素が、第1の中間層及び第2の中間層を含み、前記第1の中間層が、前記反射要素と物理的に接触しており、前記第1の中間層が、ニッケル、銅、金のうちの1つ以上を含み、前記第2の中間層が、前記第1の中間層と前記熱伝導性本体面との間に挟まれており、前記第2の中間層が、はんだを含み、前記熱伝導性本体が、反射層を含み、前記反射層が、前記熱伝導性本体面を画定している、請求項10又は11のいずれか一項に記載のルミネッセンス要素。
- 請求項1乃至12のいずれか一項に記載のルミネッセンス要素と、光源光を生成するように構成されている光源とを含み、前記ルミネッセンス材料が、前記光源と受光関係で構成されており、前記光源光の少なくとも一部を前記ルミネッセンス材料光に変換するように構成されている、光生成デバイス。
- 前記固体ルミネッセンス本体の前記ルミネッセンス本体面が、第1のルミネッセンス本体面及び第2のルミネッセンス本体面を含み、前記1つ以上の反射要素が、前記第1のルミネッセンス本体面に関連付けられており、前記光源が、前記第2のルミネッセンス本体面と放射的に結合されている、請求項13に記載の光生成デバイス。
- 前記光源が、レーザ光源を含み、前記光生成デバイスは、請求項10乃至12のいずれか一項に記載の熱伝導性本体を更に含む、請求項13又は14のいずれか一項に記載の光生成デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19204494.9 | 2019-10-22 | ||
EP19204494 | 2019-10-22 | ||
PCT/EP2020/079339 WO2021078677A1 (en) | 2019-10-22 | 2020-10-19 | Improved heat management and efficiency for high intensity laser pumped light source |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022551758A JP2022551758A (ja) | 2022-12-13 |
JP7274050B2 true JP7274050B2 (ja) | 2023-05-15 |
Family
ID=68296347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022523545A Active JP7274050B2 (ja) | 2019-10-22 | 2020-10-19 | 高強度レーザポンピング光源に関する熱管理及び効率の改善 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11828457B2 (ja) |
EP (1) | EP4048942B1 (ja) |
JP (1) | JP7274050B2 (ja) |
CN (1) | CN114761728A (ja) |
WO (1) | WO2021078677A1 (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016100090A (ja) | 2014-11-18 | 2016-05-30 | スタンレー電気株式会社 | 発光モジュール及びそれを用いた発光装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1815532B1 (en) | 2004-11-18 | 2008-06-18 | Philips Intellectual Property & Standards GmbH | Light emitting device with conversion structure |
US9816677B2 (en) | 2010-10-29 | 2017-11-14 | Sharp Kabushiki Kaisha | Light emitting device, vehicle headlamp, illumination device, and laser element |
JP2012119193A (ja) * | 2010-12-01 | 2012-06-21 | Sharp Corp | 発光装置、車両用前照灯、照明装置、及び車両 |
JP2012243624A (ja) * | 2011-05-20 | 2012-12-10 | Stanley Electric Co Ltd | 光源装置および照明装置 |
JP2014137973A (ja) | 2013-01-18 | 2014-07-28 | Stanley Electric Co Ltd | 光源装置 |
FR3022555B1 (fr) * | 2014-06-23 | 2017-12-22 | Saint-Gobain Cristaux Et Detecteurs | Materiau luminescent a couche photonique texturee |
ES2659344T3 (es) | 2014-09-11 | 2018-03-14 | Philips Lighting Holding B.V. | Módulo PC-LED con reproducción de blancos y eficiencia de conversión mejoradas |
WO2016185861A1 (ja) * | 2015-05-15 | 2016-11-24 | ソニー株式会社 | 光源装置および投射型表示装置 |
JP2017120864A (ja) | 2015-12-28 | 2017-07-06 | 株式会社タムラ製作所 | 発光装置 |
CN113237032B (zh) * | 2016-05-13 | 2024-01-05 | 新唐科技日本株式会社 | 光源装置以及照明装置 |
WO2017220411A1 (en) | 2016-06-22 | 2017-12-28 | Lumileds Holding B.V. | Light conversion package |
JP6918304B2 (ja) * | 2017-03-06 | 2021-08-11 | 国立大学法人京都大学 | 照明装置 |
KR101977261B1 (ko) | 2017-11-03 | 2019-05-13 | 엘지전자 주식회사 | 형광체 모듈 |
-
2020
- 2020-10-19 EP EP20789637.4A patent/EP4048942B1/en active Active
- 2020-10-19 CN CN202080073865.4A patent/CN114761728A/zh active Pending
- 2020-10-19 WO PCT/EP2020/079339 patent/WO2021078677A1/en unknown
- 2020-10-19 JP JP2022523545A patent/JP7274050B2/ja active Active
- 2020-10-19 US US17/769,914 patent/US11828457B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016100090A (ja) | 2014-11-18 | 2016-05-30 | スタンレー電気株式会社 | 発光モジュール及びそれを用いた発光装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021078677A1 (en) | 2021-04-29 |
US11828457B2 (en) | 2023-11-28 |
JP2022551758A (ja) | 2022-12-13 |
US20220390090A1 (en) | 2022-12-08 |
CN114761728A (zh) | 2022-07-15 |
EP4048942B1 (en) | 2023-07-26 |
EP4048942A1 (en) | 2022-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7142188B1 (ja) | 高いcriの高強度光源 | |
JP2022545426A (ja) | 高いcriを有する高強度光源 | |
JP7231795B1 (ja) | コンパクトなレーザベース光生成デバイス | |
JP7274050B2 (ja) | 高強度レーザポンピング光源に関する熱管理及び効率の改善 | |
US20230408802A1 (en) | Laser smd package with phosphor and light incoupler | |
US20230375157A1 (en) | Laser-phosphor light source with improved brightness and thermal management | |
JP7322306B1 (ja) | セラミック蛍光体アレイ | |
JP7322318B2 (ja) | レーザ蛍光体ベースの画素化光源 | |
US11892143B2 (en) | Compact laser beam combiner with micro-prism reflector | |
JP6866537B2 (ja) | 高ルーメン密度ランプの片面照明 | |
WO2022253725A1 (en) | Laser-based light engine with improved thermal management using tapered fiber | |
WO2023110396A1 (en) | High brightness light source | |
WO2023126202A1 (en) | High intensity bbl dimmable light source | |
JP2023529688A (ja) | 埋め込み型蛍光体セラミックタイル | |
WO2024028137A1 (en) | High-brightness laser-phosphor lighting with cct control |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220420 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20220420 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221028 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230125 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230410 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230428 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7274050 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |