WO2014049721A1 - 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板 - Google Patents
部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板 Download PDFInfo
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- WO2014049721A1 WO2014049721A1 PCT/JP2012/074711 JP2012074711W WO2014049721A1 WO 2014049721 A1 WO2014049721 A1 WO 2014049721A1 JP 2012074711 W JP2012074711 W JP 2012074711W WO 2014049721 A1 WO2014049721 A1 WO 2014049721A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 121
- 229910052802 copper Inorganic materials 0.000 claims abstract description 118
- 239000010949 copper Substances 0.000 claims abstract description 118
- 239000010410 layer Substances 0.000 claims description 119
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 5
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- 239000011889 copper foil Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- 230000000873 masking effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- H01L2224/9212—Sequential connecting processes
- H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
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- H05K2203/03—Metal processing
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- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
Definitions
- the present invention relates to a method of manufacturing a component-embedded substrate in which electrical or electronic components are embedded in the substrate, and a component-embedded substrate manufactured using this method.
- component-embedded boards having a structure in which electronic parts are embedded in an insulating substrate that is an insulating layer (see, for example, Patent Document 1).
- a component-embedded substrate has a wiring pattern formed on the surface of the insulating substrate, and other various electronic components can be surface-mounted at a predetermined position of the wiring pattern and used as a module substrate. It can also be used as a core substrate when manufacturing a component built-in multilayer circuit board by the build-up method.
- a connection portion for electrically connecting the wiring pattern on the surface of the insulating substrate and the terminals of the electronic components in the insulating substrate it is necessary to provide a connection portion for electrically connecting the wiring pattern on the surface of the insulating substrate and the terminals of the electronic components in the insulating substrate.
- a conventional method for manufacturing a component-embedded substrate first, a copper layer to be a wiring pattern is formed on a support plate, and a connecting portion is formed by a solder paste at a predetermined position on the copper layer. And an electronic component is arrange
- the connection portion and the electronic component are embedded with an insulating material to be an insulating substrate, and an intermediate product incorporating the electronic component is obtained. Thereafter, the support plate is peeled off from the intermediate product, and the exposed copper layer is formed into a wiring pattern having a predetermined shape, whereby a component built-in substrate is obtained.
- the component-embedded substrate is subjected to reflow soldering when other various electronic components are surface-mounted on the surface, so that it is exposed to a temperature higher than the melting temperature of the solder each time. For this reason, there exists a possibility that the reliability of the connection part between a wiring pattern and the terminal part of an electronic component may fall.
- the material for forming the connection portion has a higher melting point than solder. It is conceivable to use copper which is not easily affected by heat during reflow soldering.
- the connection portion using copper is provided with a connection hole from the wiring pattern on the substrate surface to the terminal of the electronic component in the substrate after the electronic component is embedded in the insulating substrate, and a plating method is applied to the connection hole. Used to fill with copper.
- the connection hole since the connection hole must be accurately formed toward the terminal of the electronic component in the insulating substrate, it is necessary to improve the positioning accuracy of the electronic component and the specific accuracy of the terminal position in the manufacturing process. .
- an aspect of a method for manufacturing the component-embedded substrate in which the accuracy is improved will be described below.
- a support plate is prepared, and a copper layer is formed on the support plate. And the mark which consists of a copper columnar body is formed on this copper layer by the plating method.
- the electronic component is positioned at a predetermined position on the copper layer based on the position of the detected mark, and fixed with an insulating adhesive.
- the fixed electronic component and the mark are covered with an insulating material, and an insulating layer is formed as an insulating substrate in which the electronic component is embedded.
- the support plate is peeled off to expose the copper layer. In the exposed copper layer, the mark is exposed by etching away the portion where the mark exists.
- the terminal position of an electronic component is pinpointed on the basis of the exposed mark, and the connection hole which reaches
- the present invention has been made on the basis of the above circumstances, and the object of the present invention is to improve the mark detection accuracy, and thus can accurately position and position the component.
- An object of the present invention is to provide a method for manufacturing a built-in substrate and a component-embedded substrate manufactured using this method.
- a component in which an electrical or electronic component having a terminal electrically connected to the wiring pattern is incorporated in an insulating substrate having a wiring pattern on the surface.
- a mark to be formed a base end surface in contact with the second surface, a side surface extending in a direction perpendicular to the second surface from an outer peripheral edge of the base end surface, and an outer periphery extending in an arc from the front end edge of the side surface
- a square search range is set in a mark forming step for forming a mark having a top surface that extends from the leading edge of the curved surface and the outer peripheral curved surface and faces the base end surface, and an imaging screen that displays the captured image to be detected And the above After detecting the mark using a detection means for detecting a detection target within the hiding range, the component is positioned with reference to the detected mark, and an insulating adhesive layer is interposed to detect the mark on the copper layer.
- a window forming step of forming a window that partially exposes the buried layer together with the entire base end face of the mark; and a terminal of the component based on the mark exposed from the window A conductive via forming step of identifying a position and forming a via hole reaching the terminal, filling the via hole with a conductive material, and forming a conductive via that electrically connects the terminal and the copper layer; A pattern forming step of forming, in the wiring pattern, the copper layer electrically connected to the terminal through the conductive via, and the mark forming step starts from a search center that is a center of the search range.
- a virtual line extending to the edge of the search range is used as a search reference line, and the center of the mark coincides with the search center in the same direction as the search reference line from the center of the mark, and the mark in the mark
- the length of the mark reference line is 30% or more of the search reference line.
- the mark is formed in a circular shape in plan view.
- the mark is formed in a square shape in plan view.
- the mark is formed in a ring shape in plan view.
- a base end face that is manufactured using the above-described method for manufacturing a component-embedded substrate and is in contact with the second surface of the copper layer, and from the outer peripheral edge of the base end surface in a direction orthogonal to the second surface.
- Built-in component comprising: an extending side surface; an outer peripheral curved surface tapering from a leading edge of the side surface and extending in an arc shape; and a mark having a top surface extending from the leading edge of the outer peripheral curved surface and facing the base end surface A substrate is provided.
- a virtual line extending from the search center, which is the center of the search range of the detection means, to the edge of the search range is used as a search reference line
- the center of the mark is the search center.
- the component-embedded substrate of the present invention is obtained by the manufacturing method described above, the mark detection accuracy is high, and the terminals and wiring patterns of the built-in component are positioned with high accuracy, resulting in poor electrical connection. Is extremely rare and excellent in quality.
- FIG. 12 is a cross-sectional view schematically showing a state in which a mask layer is formed on the copper layer of the intermediate product in FIG. 11.
- FIG. 13 is a cross-sectional view schematically illustrating a state where a window is formed in the intermediate product of FIG. 12.
- FIG. 14 is a cross-sectional view schematically showing a state where a laser via hole is formed in the intermediate product of FIG. 13.
- FIG. 15 is a cross-sectional view schematically showing a state in which the intermediate product in FIG. 14 is plated. It is sectional drawing which shows the state which formed the wiring pattern in the intermediate product of FIG. 1 is a cross-sectional view schematically showing a component built-in substrate according to an embodiment of the present invention.
- a positioning mark made of a copper columnar body is formed on a starting material (mark forming step).
- the starting material is prepared as follows, for example.
- a support plate 2 is prepared.
- the support plate 2 is a thin plate made of, for example, stainless steel.
- a first copper layer 4 made of a thin film is formed on the support plate 2.
- the first copper layer 4 is made of, for example, a copper plating film obtained by electrolytic plating.
- the copper-clad steel plate 6 obtained in this way is used as a starting material.
- a surface in contact with the support plate 2 is a first surface 3, and a surface opposite to the first surface 3 is a second surface 5.
- the first copper layer 4 is made of, for example, a copper foil and is attached to the surface of a thin aluminum plate.
- a mask layer 8 is formed on the first copper layer 4 of the prepared copper-clad steel plate 6.
- the mask layer 8 is, for example, a plating resist made of a dry film having a predetermined thickness, and an opening 10 is provided at a predetermined position.
- the opening 10 is a through hole having a circular shape in plan view, and the copper layer 4 is exposed at the bottom.
- copper electroplating on the copper-clad steel plate 6 having such a mask layer 8
- copper is preferentially deposited on the exposed portion, and the columnar copper along the shape inside the opening 10.
- a positioning mark 12 made of a post is formed. After that, by removing the dry film 8, a positioning mark 12 made of a copper post appears at a predetermined position on the second surface 5 of the first copper layer 4 (see FIG. 4).
- the mark 12 has a flat cylindrical shape. Specifically, the mark 12 has a base end surface 13 in contact with the second surface 5 of the copper layer 4 and a direction perpendicular to the second surface 5 of the copper layer 4 from the outer peripheral edge 11 of the base end surface 13 (upward direction in FIG. 5). ), The outer peripheral curved surface 19 that tapers from the distal end edge 17 of the side surface 15 and extends in an arc shape, and the top surface 23 that extends from the distal end edge 21 of the outer peripheral curved surface 19 and faces the proximal end surface 13. ing.
- the base end surface 13 is flat following the second surface 5 of the copper layer 4, and the outer shape thereof is a circle along the internal shape of the opening 10.
- the side surface 15 is a peripheral surface that follows the inner peripheral surface of the opening 10.
- the outer peripheral curved surface 19 is located between the side surface 15 and the top surface 23 of the mark 12 and becomes an arc shape during the plating growth process.
- the top surface 23 is positioned at a position facing the base end surface 13 and is a substantially flat surface.
- the front end edge 21 of the outer peripheral curved surface 19 is a boundary with the top surface 23, and this boundary is referred to as an outer ridge line 25 (see FIG. 5A).
- the width (diameter) of the mark 12 is L1
- the width (diameter) of the top surface 23 is M1
- P1 and P2 have the same value, but a slight difference may occur.
- the left side width in FIG. 5 is P1
- the right side width is P2.
- the outer peripheral curved surface 19 is exaggerated for the sake of explanation.
- the size of the mark 12 is determined as follows in relation to the size of the search range of the optical system sensor as the detection means used in the subsequent component mounting process.
- the optical sensor images a detection target and sets a square search range in an imaging screen that displays the image.
- the mark 12 is placed in the search range, and in this state, the detection light is irradiated in the search range. Then, the mark 12 is detected by receiving the reflected light reflected by the detection light reflected by the top surface 23 of the mark 12 and returned.
- a square search range 72 is set at a predetermined position in the imaging screen 70 of the optical system sensor. In the search range 72, the mark 12 is stored so that the search center 74, which is the center thereof, and the mark center 76 of the mark 12 coincide.
- a search reference line 80 extending from the search center 74 to the edge 78 of the search range 72 is assumed, and a mark reference extending from the mark center 76 in the same direction as the search reference line 80 to the outer edge 25 of the mark 12.
- Line 82 is virtual.
- the size of the mark 12 is set so that the relationship that the length of the mark reference line 82 is 30% or more of the entire length of the search reference line 80 is satisfied. Specifically, it is as follows. First, when the search reference line 80 is moved around the search center 74 around the search center 74, a virtual square 84 in FIG. Here, this virtual square 84 is hereinafter referred to as a lower limit region 84.
- the mark reference line 82 when the mark reference line 82 is moved around the mark center 76 with the mark center 76 as the center, the locus of the tip of the mark reference line 82 becomes the outer edge line 25. Therefore, the mark 12 is formed in such a shape that the outer ridge line 25 is positioned outside the lower limit region 84. Thereby, the mark 12 having a size satisfying the above-described relationship can be obtained.
- the mark 12 is usually detected by receiving detection light reflected from the mark 12. Specifically, it is as follows. First, the detection light is irradiated to the top surface 23 of the mark 12, the outer peripheral curved surface 19, and the portion off the mark 12. Here, since the detection light hitting the top surface 23 returns directly to the light receiving sensor, the level of received light intensity is high. On the other hand, since the detection light hitting the outer peripheral curved surface 19 is scattered, the amount of light returning directly to the light receiving sensor is less than that of the top surface 23. Then, the reflected light does not return from the part off the mark 12, and the light receiving intensity level of the light receiving sensor becomes extremely low. The external ridge line 25 is read from the difference in the light receiving intensity level of the light receiving sensor, and the shape of the mark 12 is detected.
- the inventor of the present application increases the radius of curvature of the outer peripheral curved surface 19, increases the widths P 1 and P 2 of the outer peripheral curved surface 19, and sets the mark 12 to the lower limit. It has been found that when the area is larger than the region 84, the radius of curvature of the outer peripheral curved surface 19 becomes smaller and the widths P1 and P2 of the outer peripheral curved surface 19 become narrower. If the widths P1 and P2 of the outer peripheral curved surface 19 are wide, the reading error of the outer ridge line 25 becomes large, which affects the detection of the mark 12.
- the length of the mark reference line 82 is specified to be 30% or more of the length of the search reference line 80 in order to make the mark 12 larger than the lower limit region 84 based on the above knowledge.
- the mark 12 becomes relatively large and the radius of curvature of the outer peripheral curved surface 19 becomes small. Therefore, the reading error of the outer edge line 25 can be reduced. Further, when the measurement error level of the measuring instrument is the same, the larger the mark size, the lower the influence of the error on the accuracy when specifying the outer shape of the mark, and as a result, the mark detection accuracy is considered to be higher. .
- an optical system sensor in which the length of one side of the search range 78 is 5 mm is used. Moreover, the specific dimension of each part in this embodiment is shown below.
- L1 was 2.540 mm
- M1 was 2.476 mm
- P1 was 0.035 mm
- P2 was 0.029 mm.
- the formation method of the mark 12 which consists of a copper plating layer is not restricted to an electrolytic plating method, An electroless plating method can also be employ
- the installation position of the mark 12 can be arbitrarily selected. However, the optical position of an optical system positioning device (not shown) for positioning an electronic component (hereinafter referred to as a component in the substrate) 14 to be built in the insulating substrate 14 is used. It is preferable to provide it at a position where the system sensor can easily recognize it.
- two marks 12 are formed so as to sandwich the planned mounting area S on which the in-board component 14 is to be mounted.
- a conventionally known roughening treatment is performed on the second surface 5 of the first copper layer 4 by using a sulfuric acid-hydrogen peroxide-based copper etchant among copper etchants used for copper etching. It is preferable.
- a masking tape is applied to the mark 12, and the masking tape is removed after the roughening treatment.
- the mark 12 is not corroded and a glossy surface can be maintained.
- the contrast between the glossy mark and the roughened first copper layer 4 around the mark becomes clear, which contributes to a reduction in detection error of the optical sensor.
- the first copper layer 4 becomes a rough surface, an anchor effect is exhibited between the insulating substrate and the first copper layer 4 in the embedded layer forming step, which is a subsequent step, and adhesion can be improved. .
- the in-board component 14 is mounted on the copper-clad steel plate 6 via the adhesive 16 (component mounting step).
- the adhesive 16 is supplied to the mounting area S on the copper layer 4.
- the adhesive 16 only needs to cover at least the entire mounting area S, and the positioning accuracy of the adhesive 16 may be relatively low.
- the adhesive 16 may cover a part of the planned mounting area S as long as the adhesive 16 is appropriately disposed at a predetermined position corresponding to the position where the terminal of the in-board component 14 is present.
- the above-described adhesive 16 is cured to become an adhesive layer 18 having a predetermined thickness.
- the obtained adhesive layer 18 fixes the in-board component 14 at a predetermined position and has a predetermined insulating property.
- the adhesive 16 is not particularly limited as long as it exhibits a predetermined adhesive strength and a predetermined insulating property after curing, but for example, a thermosetting epoxy resin or a polyimide resin with a filler added thereto. Used.
- this filler fine powders, such as a silica (silicon dioxide) and glass fiber, are used, for example.
- the form of the adhesive 16 supplied to the planned mounting region S is not particularly limited, and may take a form in which the liquid adhesive 16 is applied with a predetermined thickness, or the predetermined thickness.
- the sheet-like adhesive 16 may be placed.
- a liquid adhesive in which fine silica powder is added to a thermosetting epoxy resin is used.
- the adhesive 16 is applied to the mounting region S on the second surface 5 of the first copper layer 4, and the in-board component 14 is mounted thereon.
- the in-board component 14 is positioned in the planned mounting area S with reference to the mark 12.
- the adhesive 16 is cured by being heated using a thermosetting furnace or the like to become the adhesive layer 18.
- the in-board component 14 is fixed at a predetermined position.
- the in-board component 14 is a rectangular parallelepiped package component in which an IC chip or the like (not shown) is covered with a resin, and a plurality of terminals 20 are provided below the package component. Is provided.
- An adhesive layer 18 is interposed between the in-board component 14 and the terminal 20 and the second surface 5 of the copper layer 4.
- first and second insulating base materials 22 and 24 are prepared. These insulating base materials 22 and 24 are made of resin.
- the insulating base materials 22 and 24 are so-called prepregs having a sheet shape in which glass fibers are impregnated with an uncured thermosetting resin.
- the first insulating base material 22 has a through hole 30.
- the through hole 30 is formed so that the opening thereof can be inserted through the in-substrate component 14, and the height (corresponding to the thickness of the insulating base material 22) is higher than the height of the in-substrate component 14. Is set.
- the second insulating substrate 24 has a flat plate shape without a through hole.
- a first insulating base material 22 is laminated on the first copper layer 4, a second insulating base material 24 is stacked on the upper side of the first insulating base material 22, and this second insulating base material is further stacked.
- a copper foil to be the second copper layer 28 is stacked on the upper side of 24 to form a laminate.
- the first insulating base material 22 is arranged so that the in-board component 14 is positioned in the through hole 30. Then, what is called a hot press which pressurizes and heats the whole said laminated body is performed.
- the uncured thermosetting resin of the prepreg is pressurized and filled in the gaps such as the through holes 30 and then cured by the heat of the hot press.
- An insulating substrate (buried layer) 34 composed of the base materials 22 and 24 is formed.
- a pressure molded body 37 in which the in-substrate component 14 is embedded in the insulating substrate 34 is obtained.
- the through hole 30 is provided in the insulating base material 22 in advance, it is possible to avoid the pressure applied to the in-board component 14 during hot pressing. For this reason, even the large in-board component 14 can be embedded in the insulating substrate without being damaged.
- the intermediate product 40 includes an insulating substrate 34 including the in-substrate component 14 therein, a first copper layer 4 formed on one surface (lower surface) 36 of the insulating substrate 34, and the other surface (upper surface) 38.
- the second copper layer 28 is formed.
- the 1st copper layer 4 is exposed by peeling of the support plate 2.
- a predetermined portion of the first copper layer 4 is removed from the obtained intermediate product 40 to form a window (window forming step).
- mask layers 39 and 41 are formed on the surfaces of both copper layers 4 and 28.
- the mask layers 39 and 41 are, for example, an etching resist made of a dry film having a predetermined thickness, and an opening 43 is provided at a predetermined position.
- the first surface 3 of the copper layer 4 is exposed from the opening 43.
- the openings 43 are provided in portions where the marks 12 and 12 are present and portions (hereinafter referred to as terminal existence portions) T and T where the terminals 20 and 20 of the in-board component 14 are present.
- the openings 43 specify, for example, the portions where the marks 12 and 12 are present and the terminal existing portions T and T with reference to the end portion of the insulating substrate 34, and the marks 12 and 12 at the specified positions. 12 and terminals 20 and 20 are formed to be larger. Since the opening 43 is formed to be larger than the mark 12 and the terminal 20, the accuracy in specifying the position may be relatively low.
- the exposed first copper layer 4 is removed from the intermediate product 40 by a normal etching method using a copper etchant made of a cupric chloride aqueous solution. Thereafter, the mask layers 39 and 41 are removed. As a result, as shown in FIG. 13, the first window W1 that partially exposes the insulating substrate 34 together with the marks 12 and 12 and the second window W2 that exposes the portion of the adhesive layer 18 including the terminal existence portion T are formed.
- the windows W1 and W2 are formed larger than the marks 12 and 12 and the terminals 20 and 20, following the opening 43.
- a via hole is formed in the adhesive layer 18 of the terminal existing portion T (via hole forming step).
- the exposed marks 12 and 12 are recognized by an optical system sensor of an optical system positioning device (not shown).
- the position of the terminal 20 of the in-board component 14 hidden by the adhesive layer 18 is specified with reference to the positions of the marks 12 and 12.
- the adhesive layer 18 at the specified terminal position is irradiated with a laser, for example, a carbon dioxide laser, to remove the adhesive layer 18, and as shown in FIG. 14, a laser via hole (hereinafter referred to as LVH) 46 reaching the terminal 20.
- LVH laser via hole
- the first window W1 can recognize the entirety of the marks 12 and 12, and the second window In W2, the laser beam can be efficiently applied to the target portion without being reflected by the copper layer 4.
- the present invention is characterized in that the marks 12 and 12 used for positioning the in-board component 14 are used again for forming the LVH 46.
- the present invention uses a mark common to the positioning of the in-board component 14 and the positioning of the LVH 46, so that extremely high positioning accuracy can be exhibited, and the terminal 20 hidden in the adhesive layer 18 can be accurately detected.
- the LVH 46 can be formed at various positions.
- a plating treatment is performed to deposit copper on the surface of the intermediate product 40, and the LVH 46 is filled with copper.
- a conductive via for electrically connecting the terminal 20 of the in-board component 14 and the first copper layer 4 is formed (conductive via forming step).
- electroless plating of copper is performed in the LVH 46, and the inner wall surface of the LVH 46 and the surface of the terminal 20 of the in-board component 14 are covered with copper. Thereafter, a copper electrolytic plating process is performed, and as shown in FIG. 15, a copper plating layer 48 covering the entire first copper layer 4 and the entire second copper layer 28 including the inside of the LVH 46 is grown. As a result, the inside of the LVH 46 is filled with copper to form a conductive via 47, which is integrated with the first copper layer 4, and the terminal 20 of the in-board component 14 and the first copper layer 4 are electrically connected. Connected.
- a part of the first copper layer 4 and the second copper layer 28 on the surface of the insulating substrate 34 is removed, and a predetermined wiring pattern 50 is formed (pattern forming step).
- a normal etching method is used to remove a part of both copper layers 4 and 28. Thereby, as shown in FIG. 16, a predetermined wiring pattern 50 is formed on the surface of the insulating substrate 34.
- solder resist is applied to the surface of the insulating substrate 34 where solder adhesion is to be avoided. Thereby, a solder resist layer 60 is formed on the surface of the insulating substrate 34.
- an opening 62 is provided in the solder resist layer 60 without applying a solder resist to the portion of the mark 12.
- the portion of the copper plating layer 48 corresponding to the portion of the mark 12 is exposed and becomes a component mounting land 61.
- the component-embedded substrate 1 in which the in-substrate component 14 having the terminal 20 electrically connected to the wiring pattern 50 is built in the insulating substrate 34 having the predetermined wiring pattern 50 on the surface. can get.
- the component-embedded substrate 1 obtained in this way can be used as a module substrate by mounting other electronic components on the surface.
- a multilayer circuit board can be formed using the component built-in board 1 as a core board using a build-up method that is normally performed.
- the second window is formed together with the first window in the window forming step.
- the present invention is not limited to this mode, and may be a mode in which only the first window is formed.
- the position of the terminal 20 of the component 14 is specified with reference to the mark 12 exposed from the first window.
- the adhesive layer 18 including the copper layer 4 is removed and the via hole is formed. Form.
- the second embodiment is different from the first embodiment only in that a mark 90 having a square shape in plan view as shown in FIG. 18 is formed in the mark forming step of the first embodiment.
- a mask layer 8 is formed on the first copper layer 4 of the prepared copper-clad steel plate 6.
- the mask layer 8 is provided with an opening 92 made of a through hole having a square shape in plan view at a predetermined position.
- copper electroplating is applied to the copper-clad steel plate 6 having the mask layer 8 to form a copper plating layer in the opening 92.
- FIG. 18A a mark 90 having a square shape in plan view is obtained.
- the outer edge 94 of the mark 90 has a square shape and is located outside the lower limit region 84.
- each part in this embodiment is as follows.
- the width L1 of the mark 90 was 1.541 mm
- the width M1 of the top surface 96 was 1.462 mm
- the width of the outer peripheral curved surface 98 was 0.042 mm for P1 and 0.037 mm for P2.
- reference numeral 91 represents the base end face of the mark 90
- reference numeral 93 represents the outer peripheral edge of the base end face 91 of the mark 90
- reference numeral 95 represents the side face of the mark 90.
- Reference numeral 97 represents the leading edge of the side surface 95
- reference numeral 99 represents the leading edge of the outer peripheral curved surface 98.
- the third embodiment differs from the first embodiment only in that, in the mark forming step of the first embodiment, a ring-shaped mark 100 having a circular shape in plan view as shown in FIG. 19 is formed.
- a mask layer 8 is formed on the first copper layer 4 of the prepared copper-clad steel plate 6.
- the mask layer 8 is provided with an opening 102 formed of a ring-shaped through hole having a circular shape in plan view at a predetermined position.
- copper electroplating is applied to the copper-clad steel plate 6 having the mask layer 8 to form a copper plating layer in the opening 102.
- FIG. 19A a ring-shaped mark 100 having a circular shape in plan view is obtained.
- the outer edge 104 of the mark 100 has a circular shape and is located outside the lower limit region 84.
- the mark 100 has a circular central through hole 110 at the center, and an inner peripheral curved surface 111 and an inner ridge line 112 are formed at the upper edge of the central through hole 110.
- an optical sensor in which the length of one side of the search range 78 is 5 mm is used.
- the specific dimension of each part in this embodiment is as follows.
- the width (diameter) L1 of the mark 100 is 2.508 mm
- the width (diameter) M1 of the top surface 106 is 2.431 mm
- the width (diameter) N1 of the central through hole 110 is 1.300 mm
- Q1 is 1.401 mm
- the width of the outer peripheral curved surface 108 is 0.042 mm for P1, 0.035 mm for P2
- the width of the inner peripheral curved surface 111 is 0.046 mm for P3 and 0.055 mm for P4.
- reference numeral 101 represents the base end face of the mark 100
- reference numeral 103 represents the outer peripheral edge of the base end face 101 of the mark 100
- reference numeral 105 represents the side face of the mark 100.
- Reference numeral 107 represents a leading edge of the side surface 105
- reference numeral 109 represents a leading edge of the outer peripheral curved surface 108.
- the fourth embodiment is the first only in that a ring-shaped mark 120 having a square shape in plan view as shown in FIG. It is different from the embodiment.
- a mask layer 8 is formed on the first copper layer 4 of the prepared copper-clad steel plate 6.
- the mask layer 8 is provided with an opening 122 formed of a through hole having a ring shape with a square shape in plan view at a predetermined position.
- copper electroplating is performed on the copper-clad steel plate 6 having the mask layer 8 to form a copper plating layer in the opening 122.
- FIG. 20 (a) a ring-shaped mark 120 having a square shape in plan view and a rectangular center is obtained.
- the outer ridge line 124 of the mark 120 has a square shape and is located outside the lower limit region 84.
- the mark 120 has a square central through hole 130 at the center, and an inner peripheral curved surface 131 and an inner ridge line 132 are formed at the upper edge of the central through hole 130.
- an optical sensor in which the length of one side of the search range 78 is 5 mm is used.
- the specific dimension of each part in this embodiment is as follows.
- the width L1 of the mark 120 is 2.559 mm
- the width M1 of the top surface 126 is 2.472 mm
- the width N1 of the central through hole 130 is 0.500 mm
- the width Q1 of the inner ridgeline 132 is 0.577 mm
- the width of the outer peripheral curved surface 128 P1 was 0.048 mm
- P2 was 0.039 mm
- the inner curved surface 131 had a width of P36 of 0.036 mm and P4 of 0.041 mm.
- reference numeral 121 represents the base end face of the mark 120
- reference numeral 123 represents the outer peripheral edge of the base end face 121 of the mark 120
- reference numeral 125 represents the side face of the mark 120
- reference numeral 127 represents the leading edge of the side surface 125
- reference numeral 129 represents the leading edge of the outer peripheral curved surface 128.
- the fifth embodiment is the first only in that a ring-shaped mark 140 having a square shape in plan view as shown in FIG. It is different from the embodiment.
- a mask layer 8 is formed on the first copper layer 4 of the prepared copper-clad steel plate 6.
- the mask layer 8 is provided with openings 142 at predetermined positions.
- the opening 142 is formed of a through-hole having a ring shape as a whole, in which a part of the cylindrical mask layer 8 is positioned at the center of the through-hole having a square shape in plan view.
- copper electroplating is applied to the copper-clad steel plate 6 having the mask layer 8 to form a copper plating layer in the opening 142.
- FIG. 21A a ring-shaped mark 140 having a square shape in plan view and a circular shape at the center is obtained.
- the outer edge 144 of the mark 140 has a square shape and is located outside the lower limit region 84.
- the mark 140 has a circular central through hole 150 at the center, and an inner peripheral curved surface 151 and an inner ridge line 152 are formed at the upper edge of the central through hole 150.
- each part in this embodiment is as follows.
- the width L1 of the mark 140 is 2.577 m
- the width M1 of the top surface 146 is 2.475 mm
- the width N1 of the central through hole 150 is 0.300 mm
- the width Q1 of the inner diameter ridgeline 152 is 0.408 mm
- the width of the outer curved surface 148 P1 was 0.057 mm
- P2 was 0.045 mm
- the inner curved surface 151 had a width of 0.048 mm for P3 and 0.060 mm for P4.
- reference numeral 141 represents the base end face of the mark 140
- reference numeral 143 represents the outer peripheral edge of the base end face 141 of the mark 140
- reference numeral 145 represents the side face of the mark 140
- reference numeral Reference numeral 147 represents the leading edge of the side surface 145
- reference numeral 149 represents the leading edge of the outer peripheral curved surface 148.
- the outer ridge lines 25, 94, 104, 124, and 144 are all positioned outside the lower limit region 84.
- the shape to make As a result, the relationship that the length of the mark reference line 82 is 30% or more of the entire length of the search reference line 80 is satisfied, so that the reading error of the outer ridge line can be reduced and the mark detection accuracy can be improved.
- the components built in the insulating substrate are not limited to package components, and can be various other electronic components such as chip components.
- the material for forming the mark is not limited to copper, and other materials such as nickel can be used.
- the amount of the plating material for the mark can be reduced, which is effective when the mark is formed using an expensive material.
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Abstract
Description
本発明においては、まず、出発素材上に銅製の柱状体からなる位置決め用のマークを形成する(マーク形成工程)。ここで、出発素材は、例えば、次のようにして準備される。
まず、図7に示すように、銅層4上における搭載予定領域Sに接着剤16が供給される。接着剤16は、少なくとも搭載予定領域Sの全体を覆っていればよく、接着剤16の位置決め精度は、比較的低くてもよい。ここで、接着剤16の位置決めを行う際、マーク12を基準にして搭載予定領域Sを特定し、特定された位置に接着剤16を塗布すると接着剤16の位置決め精度は向上するので好ましい。なお、基板内部品14の端子が存在する位置に対応する所定位置に接着剤16が適切に配設されるならば、接着剤16は、搭載予定領域Sの一部を覆う態様でも構わない。
まずは、図9に示すように、第1及び第2の絶縁基材22,24を用意する。これら絶縁基材22,24は、樹脂製である。ここで、絶縁基材22,24は、ガラス繊維に未硬化状態の熱硬化性樹脂を含浸させたシート状をなすいわゆるプリプレグである。この第1の絶縁基材22は、貫通孔30を有している。貫通孔30は、その開口部が基板内部品14を挿通可能な大きさに形成されているとともに、その高さ(絶縁基材22の厚さに相当)が基板内部品14の高さよりも高く設定されている。一方、第2の絶縁基材24は、図9に示すように、貫通孔が設けられていない平板状をなしている。
まずは、図12に示すように、両銅層4,28の表面にマスク層39,41を形成する。このマスク層39,41は、例えば、所定厚みのドライフィルムからなるエッチングレジストであり、所定位置に開口43が設けられている。開口43からは銅層4の第1面3が露出している。開口43は、マーク12,12が存在する部分及び基板内部品14の端子20,20が存在する部分(以下、端子存在部という)T,Tにそれぞれ設けられている。ここで、これら開口43は、例えば、絶縁基板34の端部を基準にして、マーク12,12が存在する部分及びを端子存在部T,Tを特定し、その特定した位置において、マーク12,12及び端子20,20よりも大きめに形成されている。この開口43は、マーク12や端子20よりも大きめに形成されるので、その位置を特定する際の精度は、比較的低くても構わない。
まず、露出したマーク12,12を光学系位置決め装置(図示せず)の光学系センサーで認識する。そして、マーク12,12の位置を基準として接着層18で隠れている基板内部品14の端子20の位置を特定する。その後、特定した端子位置の接着層18にレーザー、例えば、炭酸ガスレーザーを照射して接着層18を除去し、図14に示すように、端子20まで到達するレーザービアホール(以下、LVHという)46を形成する。これにより、基板内部品14の端子20が露出する。ここで、各ウィンドウW1、W2をマーク12,12及び端子20,20よりも大きめに形成しているので、第1ウィンドウW1では、マーク12,12の全体を認識することができ、第2ウィンドウW2では、銅層4により反射されることなく効率良く目標箇所にレーザーを照射することができる。
両銅層4,28の一部の除去は、通常のエッチング法が用いられる。これにより、図16に示すように、絶縁基板34の表面に所定の配線パターン50が形成される。
第2の実施形態は、第1の実施形態のマーク形成工程において、図18に示すような平面視形状が正方形のマーク90を形成する点のみで第1の実施形態と相違する。
第3の実施形態は、第1の実施形態のマーク形成工程において、図19に示すような平面視形状が円形のリング状のマーク100を形成する点のみで第1の実施形態と相違する。
なお、図19中、参照符号101は、マーク100の基端面を表し、参照符号103は、マーク100の基端面101の外周縁を表し、参照符号105は、マーク100の側面を表し、参照符号107は、この側面105の先端縁を表し、参照符号109は、外周曲面108の先端縁を表している。
第4の実施形態は、第1の実施形態のマーク形成工程において、図20に示すような平面視形状が正方形で中央が矩形に抜かれたリング状のマーク120を形成する点のみで第1の実施形態と相違する。
なお、図20中、参照符号121は、マーク120の基端面を表し、参照符号123は、マーク120の基端面121の外周縁を表し、参照符号125は、マーク120の側面を表し、参照符号127は、この側面125の先端縁を表し、参照符号129は、外周曲面128の先端縁を表している。
第5の実施形態は、第1の実施形態のマーク形成工程において、図21に示すような平面視形状が正方形で中央が円形に抜かれたリング状のマーク140を形成する点のみで第1の実施形態と相違する。
また、マークを形成する材料は銅に限定されず、他の材料、例えば、ニッケル等を用いることもできる。ここで、第3~第5実施形態のように、マークを中抜きにした場合、マーク用のめっき材料の量を低減できるので、高価な材料を用いてマークを形成する際に有効である。
2 支持板
3 第1面
4 第1の銅層
5 第2面
6 銅張り鋼板
8 マスク層
12 マーク
14 電子部品(基板内部品)
16 接着剤
18 接着層
20 端子
25 外形稜線
34 絶縁基板
40 中間製品
46 レーザービアホール(LVH)
47 導通ビア
50 配線パターン
80 サーチ基準線
82 マーク基準線
84 下限領域
S 搭載予定領域
T 端子存在部
Claims (5)
- 表面に配線パターンを有する絶縁基板内に、前記配線パターンと電気的に接続された端子を有する電気又は電子的な部品が内蔵されている部品内蔵基板の製造方法であって、
支持板上に前記配線パターンとなるべき銅層を形成し、この銅層の前記支持板に接する第1面とは反対側の第2面上にめっき法により形成されるマークであって、前記第2面に接する基端面、前記基端面の外周縁から前記第2面に直交する方向へ延びる側面、前記側面の先端縁から先細りして円弧状に延びる外周曲面及び前記外周曲面の先端縁から延び、前記基端面に対向する頂面を有するマークを形成するマーク形成工程と、
撮像した検出対象の画像を映す撮像画面内に正方形のサーチ範囲が設定されており、前記サーチ範囲内において検出対象を検出する検出手段を用いて前記マークを検出した後、検出された前記マークを基準にして前記部品を位置決めし、絶縁性の接着層を介在させて前記銅層の第2面上に前記部品を搭載する部品搭載工程と、
前記部品を搭載した前記銅層の第2面上に、前記部品及び前記マークを埋設させる前記絶縁基板としての埋設層を形成する埋設層形成工程と、
前記銅層から前記支持板を剥離させた後、この剥離により露出した前記銅層の第1面側から前記銅層の一部を銅のエッチングに用いられる銅エッチング剤によりエッチング除去し、前記マークの基端面の全体とともに前記埋設層を部分的に露出させるウィンドウを形成するウィンドウ形成工程と、
前記ウィンドウから露出した前記マークを基準にして前記部品の端子の位置を特定し、前記端子まで到達するビアホールを形成した後、前記ビアホールに導電性材料を充填し、前記端子と前記銅層とを電気的に接続する導通ビアを形成する導通ビア形成工程と、
前記導通ビアを介して前記端子と電気的に接続された前記銅層を前記配線パターンに形成するパターン形成工程とを備えており、
前記マーク形成工程は、前記サーチ範囲の中心であるサーチ中心から前記サーチ範囲の縁辺まで延びる仮想線をサーチ基準線とし、前記マークの中心を前記サーチ中心と合致させた状態で、前記マークの中心から前記サーチ基準線と同じ方向で、且つ、前記マークにおける前記頂面と前記外周曲面との境界である外形稜線まで延びる仮想線をマーク基準線としたとき、前記マーク基準線の長さが前記サーチ基準線の30%以上の範囲となる位置に前記マークの外形稜線が存在する形状に前記マークを形成することを特徴とする部品内蔵基板の製造方法。 - 前記マークが平面視円形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 前記マークが平面視正方形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 前記マークが平面視リング形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 請求項1~4の何れかに記載の製造方法を用いて製造され、前記銅層の第2面に接する基端面、前記基端面の外周縁から前記第2面に直交する方向へ延びる側面、前記側面の先端縁から先細りして円弧状に延びる外周曲面及び前記外周曲面の先端縁から延び、前記基端面に対向する頂面を有するマークを備えていることを特徴とする部品内蔵基板。
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US14/429,741 US9622352B2 (en) | 2012-09-26 | 2012-09-26 | Manufacturing method for component incorporated substrate and component incorporated substrate |
PCT/JP2012/074711 WO2014049721A1 (ja) | 2012-09-26 | 2012-09-26 | 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板 |
JP2014537900A JP6033878B2 (ja) | 2012-09-26 | 2012-09-26 | 部品内蔵基板の製造方法 |
EP12885910.5A EP2903399A4 (en) | 2012-09-26 | 2012-09-26 | METHOD FOR MANUFACTURING INTEGRATED COMPONENT SUBSTRATE AND INTEGRATED COMPONENT SUBSTRATE MADE USING THE SAME |
TW102122094A TWI586238B (zh) | 2012-09-26 | 2013-06-21 | A method of manufacturing a part-embedded substrate, and a part-embedded substrate manufactured by using the method |
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TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
CN113366935B (zh) * | 2019-02-19 | 2022-10-14 | 株式会社富士 | 基准标记确定装置、基准标记确定方法 |
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- 2012-09-26 WO PCT/JP2012/074711 patent/WO2014049721A1/ja active Application Filing
- 2012-09-26 JP JP2014537900A patent/JP6033878B2/ja not_active Expired - Fee Related
- 2012-09-26 EP EP12885910.5A patent/EP2903399A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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JPWO2014049721A1 (ja) | 2016-08-22 |
EP2903399A1 (en) | 2015-08-05 |
TWI586238B (zh) | 2017-06-01 |
EP2903399A4 (en) | 2016-07-27 |
JP6033878B2 (ja) | 2016-11-30 |
US9622352B2 (en) | 2017-04-11 |
TW201419967A (zh) | 2014-05-16 |
US20150237734A1 (en) | 2015-08-20 |
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