JP6033878B2 - 部品内蔵基板の製造方法 - Google Patents
部品内蔵基板の製造方法 Download PDFInfo
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- JP6033878B2 JP6033878B2 JP2014537900A JP2014537900A JP6033878B2 JP 6033878 B2 JP6033878 B2 JP 6033878B2 JP 2014537900 A JP2014537900 A JP 2014537900A JP 2014537900 A JP2014537900 A JP 2014537900A JP 6033878 B2 JP6033878 B2 JP 6033878B2
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- mark
- component
- copper
- copper layer
- layer
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- 239000000758 substrate Substances 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 119
- 239000010410 layer Substances 0.000 claims description 119
- 229910052802 copper Inorganic materials 0.000 claims description 116
- 239000010949 copper Substances 0.000 claims description 116
- 230000002093 peripheral effect Effects 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 33
- 238000001514 detection method Methods 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 22
- 229910000831 Steel Inorganic materials 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 20
- 239000010959 steel Substances 0.000 description 20
- 239000013067 intermediate product Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 15
- 238000009713 electroplating Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Description
本発明においては、まず、出発素材上に銅製の柱状体からなる位置決め用のマークを形成する(マーク形成工程)。ここで、出発素材は、例えば、次のようにして準備される。
まず、図7に示すように、銅層4上における搭載予定領域Sに接着剤16が供給される。接着剤16は、少なくとも搭載予定領域Sの全体を覆っていればよく、接着剤16の位置決め精度は、比較的低くてもよい。ここで、接着剤16の位置決めを行う際、マーク12を基準にして搭載予定領域Sを特定し、特定された位置に接着剤16を塗布すると接着剤16の位置決め精度は向上するので好ましい。なお、基板内部品14の端子が存在する位置に対応する所定位置に接着剤16が適切に配設されるならば、接着剤16は、搭載予定領域Sの一部を覆う態様でも構わない。
まずは、図9に示すように、第1及び第2の絶縁基材22,24を用意する。これら絶縁基材22,24は、樹脂製である。ここで、絶縁基材22,24は、ガラス繊維に未硬化状態の熱硬化性樹脂を含浸させたシート状をなすいわゆるプリプレグである。この第1の絶縁基材22は、貫通孔30を有している。貫通孔30は、その開口部が基板内部品14を挿通可能な大きさに形成されているとともに、その高さ(絶縁基材22の厚さに相当)が基板内部品14の高さよりも高く設定されている。一方、第2の絶縁基材24は、図9に示すように、貫通孔が設けられていない平板状をなしている。
まずは、図12に示すように、両銅層4,28の表面にマスク層39,41を形成する。このマスク層39,41は、例えば、所定厚みのドライフィルムからなるエッチングレジストであり、所定位置に開口43が設けられている。開口43からは銅層4の第1面3が露出している。開口43は、マーク12,12が存在する部分及び基板内部品14の端子20,20が存在する部分(以下、端子存在部という)T,Tにそれぞれ設けられている。ここで、これら開口43は、例えば、絶縁基板34の端部を基準にして、マーク12,12が存在する部分及びを端子存在部T,Tを特定し、その特定した位置において、マーク12,12及び端子20,20よりも大きめに形成されている。この開口43は、マーク12や端子20よりも大きめに形成されるので、その位置を特定する際の精度は、比較的低くても構わない。
まず、露出したマーク12,12を光学系位置決め装置(図示せず)の光学系センサーで認識する。そして、マーク12,12の位置を基準として接着層18で隠れている基板内部品14の端子20の位置を特定する。その後、特定した端子位置の接着層18にレーザー、例えば、炭酸ガスレーザーを照射して接着層18を除去し、図14に示すように、端子20まで到達するレーザービアホール(以下、LVHという)46を形成する。これにより、基板内部品14の端子20が露出する。ここで、各ウィンドウW1、W2をマーク12,12及び端子20,20よりも大きめに形成しているので、第1ウィンドウW1では、マーク12,12の全体を認識することができ、第2ウィンドウW2では、銅層4により反射されることなく効率良く目標箇所にレーザーを照射することができる。
両銅層4,28の一部の除去は、通常のエッチング法が用いられる。これにより、図16に示すように、絶縁基板34の表面に所定の配線パターン50が形成される。
第2の実施形態は、第1の実施形態のマーク形成工程において、図18に示すような平面視形状が正方形のマーク90を形成する点のみで第1の実施形態と相違する。
第3の実施形態は、第1の実施形態のマーク形成工程において、図19に示すような平面視形状が円形のリング状のマーク100を形成する点のみで第1の実施形態と相違する。
なお、図19中、参照符号101は、マーク100の基端面を表し、参照符号103は、マーク100の基端面101の外周縁を表し、参照符号105は、マーク100の側面を表し、参照符号107は、この側面105の先端縁を表し、参照符号109は、外周曲面108の先端縁を表している。
第4の実施形態は、第1の実施形態のマーク形成工程において、図20に示すような平面視形状が正方形で中央が矩形に抜かれたリング状のマーク120を形成する点のみで第1の実施形態と相違する。
なお、図20中、参照符号121は、マーク120の基端面を表し、参照符号123は、マーク120の基端面121の外周縁を表し、参照符号125は、マーク120の側面を表し、参照符号127は、この側面125の先端縁を表し、参照符号129は、外周曲面128の先端縁を表している。
第5の実施形態は、第1の実施形態のマーク形成工程において、図21に示すような平面視形状が正方形で中央が円形に抜かれたリング状のマーク140を形成する点のみで第1の実施形態と相違する。
また、マークを形成する材料は銅に限定されず、他の材料、例えば、ニッケル等を用いることもできる。ここで、第3〜第5実施形態のように、マークを中抜きにした場合、マーク用のめっき材料の量を低減できるので、高価な材料を用いてマークを形成する際に有効である。
2 支持板
3 第1面
4 第1の銅層
5 第2面
6 銅張り鋼板
8 マスク層
12 マーク
14 電子部品(基板内部品)
16 接着剤
18 接着層
20 端子
25 外形稜線
34 絶縁基板
40 中間製品
46 レーザービアホール(LVH)
47 導通ビア
50 配線パターン
80 サーチ基準線
82 マーク基準線
84 下限領域
S 搭載予定領域
T 端子存在部
Claims (4)
- 表面に配線パターンを有する絶縁基板内に、前記配線パターンと電気的に接続された端子を有する電気又は電子的な部品が内蔵されている部品内蔵基板の製造方法であって、
支持板上に前記配線パターンとなるべき銅層を形成し、この銅層の前記支持板に接する第1面とは反対側の第2面上にめっき法により形成されるマークであって、前記第2面に接する基端面、前記基端面の外周縁から前記第2面に直交する方向へ延びる側面、前記側面の先端縁から先細りして円弧状に延びる外周曲面及び前記外周曲面の先端縁から延び、前記基端面に対向する頂面を有するマークを形成するマーク形成工程と、
撮像した検出対象の画像を映す撮像画面内に正方形のサーチ範囲が設定されており、前記サーチ範囲内において検出対象を検出する検出手段を用いて前記マークを検出した後、検出された前記マークを基準にして前記部品を位置決めし、絶縁性の接着層を介在させて前記銅層の第2面上に前記部品を搭載する部品搭載工程と、
前記部品を搭載した前記銅層の第2面上に、前記部品及び前記マークを埋設させる前記絶縁基板としての埋設層を形成する埋設層形成工程と、
前記銅層から前記支持板を剥離させた後、この剥離により露出した前記銅層の第1面側から前記銅層の一部を銅のエッチングに用いられる銅エッチング剤によりエッチング除去し、前記マークの基端面の全体とともに前記埋設層を部分的に露出させるウィンドウを形成するウィンドウ形成工程と、
前記ウィンドウから露出した前記マークを基準にして前記部品の端子の位置を特定し、前記端子まで到達するビアホールを形成した後、前記ビアホールに導電性材料を充填し、前記端子と前記銅層とを電気的に接続する導通ビアを形成する導通ビア形成工程と、
前記導通ビアを介して前記端子と電気的に接続された前記銅層を前記配線パターンに形成するパターン形成工程とを備えており、
前記マーク形成工程は、前記サーチ範囲の中心であるサーチ中心から前記サーチ範囲の縁辺まで延びる仮想線をサーチ基準線とし、前記マークの中心を前記サーチ中心と合致させた状態で、前記マークの中心から前記サーチ基準線と同じ方向で、且つ、前記マークにおける前記頂面と前記外周曲面との境界である外形稜線まで延びる仮想線をマーク基準線としたとき、前記マーク基準線の長さが前記サーチ基準線の30%以上の範囲となる位置に前記マークの外形稜線が存在する形状に前記マークを形成することを特徴とする部品内蔵基板の製造方法。 - 前記マークが平面視円形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 前記マークが平面視正方形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 前記マークが平面視リング形状に形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
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JP4812481B2 (ja) | 2006-03-22 | 2011-11-09 | 日東電工株式会社 | 配線回路基板 |
US8225503B2 (en) * | 2008-02-11 | 2012-07-24 | Ibiden Co., Ltd. | Method for manufacturing board with built-in electronic elements |
US8024858B2 (en) | 2008-02-14 | 2011-09-27 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
JP4874305B2 (ja) | 2008-07-22 | 2012-02-15 | 株式会社メイコー | 電気・電子部品内蔵回路基板とその製造方法 |
KR20110076979A (ko) | 2008-10-30 | 2011-07-06 | 에이티 앤 에스 오스트리아 테크놀로지 앤 시스템테크니크 악치엔게젤샤프트 | 인쇄회로기판에 전자부품을 통합하는 방법 |
JP5444473B2 (ja) * | 2010-10-01 | 2014-03-19 | 株式会社メイコー | 部品内蔵基板及び部品内蔵基板の製造方法 |
WO2012042667A1 (ja) | 2010-10-01 | 2012-04-05 | 株式会社メイコー | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
-
2012
- 2012-09-26 WO PCT/JP2012/074711 patent/WO2014049721A1/ja active Application Filing
- 2012-09-26 JP JP2014537900A patent/JP6033878B2/ja not_active Expired - Fee Related
- 2012-09-26 EP EP12885910.5A patent/EP2903399A4/en not_active Withdrawn
- 2012-09-26 US US14/429,741 patent/US9622352B2/en not_active Expired - Fee Related
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2013
- 2013-06-21 TW TW102122094A patent/TWI586238B/zh not_active IP Right Cessation
Also Published As
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JPWO2014049721A1 (ja) | 2016-08-22 |
EP2903399A4 (en) | 2016-07-27 |
US9622352B2 (en) | 2017-04-11 |
TWI586238B (zh) | 2017-06-01 |
TW201419967A (zh) | 2014-05-16 |
US20150237734A1 (en) | 2015-08-20 |
WO2014049721A1 (ja) | 2014-04-03 |
EP2903399A1 (en) | 2015-08-05 |
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