JP5444473B2 - 部品内蔵基板及び部品内蔵基板の製造方法 - Google Patents
部品内蔵基板及び部品内蔵基板の製造方法 Download PDFInfo
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- JP5444473B2 JP5444473B2 JP2012536128A JP2012536128A JP5444473B2 JP 5444473 B2 JP5444473 B2 JP 5444473B2 JP 2012536128 A JP2012536128 A JP 2012536128A JP 2012536128 A JP2012536128 A JP 2012536128A JP 5444473 B2 JP5444473 B2 JP 5444473B2
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- 239000000758 substrate Substances 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 20
- 239000004020 conductor Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
好ましくは、前記接続層は接着剤で形成されている。
好ましくは、前記ダミー内蔵部品は前記絶縁基材と同一材料(例えばエポキシ樹脂材料等)で形成されている。
好ましくは、前記絶縁基材、前記マーク、前記ダミー内蔵部品を貫通する基準孔を備えている。
また、接続層を接着剤で形成し、この接着剤を介して内蔵部品及びダミー内蔵部品を接続する際、部品電極を接着剤へ向けて搭載することで両部品の電極面高さを揃えることができ、さらに搭載精度は搭載機器等の精度に委ねられるので、両部品の相対的な位置精度をさらに高めることができる。また、ダミー内蔵部品と接着剤とをマークを介して間接的に接続することで、マークの厚みを適宜変更させ、内蔵部品及びダミー内蔵部品の高さを揃えることができる。
また、ダミー内蔵部品を絶縁基材と同一材料で形成すれば、マークを認識して当該マークを導体パターンの基準として用いた後、ダミー内蔵部品をそのまま絶縁基材としてその後の加工工程で用いることができるので、加工性が向上する。さらに、絶縁基材との熱膨張率が同一となるので、マークとダミー内蔵部品との間にずれが生じることを抑制できる。
また、基準孔を備えることで、この基準孔を基準として導体パターンを形成できるので、基準孔を視認しながら導体パターンを形成することもできるので、作業性が向上する。
2 導電層
3 マスク層
4 搭載位置
5 ダミー搭載位置
6 半田
7 ダミー内蔵部品
8 内蔵部品
9 接続端子
10 マーク
11 絶縁基材
12 コア基板
13 接着剤
14 貫通孔
15 積層体
16 絶縁層
17 基準孔
18 導体パターン
19 部品内蔵基板
20 導電めっき
21 端子
Claims (7)
- 樹脂製の絶縁基材と、
該絶縁基材に埋設された電気又は電子的な内蔵部品及びダミー内蔵部品と、
前記内蔵部品及びダミー内蔵部品と接続層を介して直接又は間接的に接続され、前記絶縁基材の少なくとも片面に形成された導体パターンと、
前記ダミー内蔵部品の表面に形成され、前記導体パターン形成の基準となるマークとを備えたことを特徴とする部品内蔵基板。 - 前記接続層は半田で形成されていることを特徴とする請求項1に記載の部品内蔵基板。
- 前記接続層は接着剤で形成され、該接着剤と前記ダミー内蔵部品とは前記マークを介して間接的に接続されていることを特徴とする請求項1に記載の部品内蔵基板。
- 前記マークはX線で検知することができる金属で形成されていることを特徴とする請求項1に記載の部品内蔵基板。
- 前記ダミー内蔵部品は前記絶縁基材と同一材料で形成されていることを特徴とする請求項1に記載の部品内蔵基板。
- 前記絶縁基材、前記マーク、及び前記ダミー内蔵部品を貫通する基準孔を備えたことを特徴とする請求項1に記載の部品内蔵基板。
- 支持板上に導体パターンとなるべき導電層を形成し、
前記支持板上及び前記導電層上に接続層を形成し、
前記導電層上の接続層を介して電気又は電子的な内蔵部品を接続し、
前記支持板上の接続層を介してマークが付されたダミー内蔵部品を接続し、
樹脂製の絶縁基材に前記内蔵部品及び前記ダミー内蔵部品を埋設し、
前記マークを基準として前記導電層の一部を除去し、前記導体パターンを形成することを特徴とする部品内蔵基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/067260 WO2012042668A1 (ja) | 2010-10-01 | 2010-10-01 | 部品内蔵基板及び部品内蔵基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012042668A1 JPWO2012042668A1 (ja) | 2014-02-03 |
JP5444473B2 true JP5444473B2 (ja) | 2014-03-19 |
Family
ID=45892172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012536128A Expired - Fee Related JP5444473B2 (ja) | 2010-10-01 | 2010-10-01 | 部品内蔵基板及び部品内蔵基板の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8921706B2 (ja) |
EP (1) | EP2624673B1 (ja) |
JP (1) | JP5444473B2 (ja) |
KR (1) | KR101713642B1 (ja) |
CN (1) | CN103155728B (ja) |
TW (1) | TWI510151B (ja) |
WO (1) | WO2012042668A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9622352B2 (en) * | 2012-09-26 | 2017-04-11 | Meiko Electronics Co., Ltd. | Manufacturing method for component incorporated substrate and component incorporated substrate |
WO2014054387A1 (ja) * | 2012-10-03 | 2014-04-10 | 株式会社村田製作所 | 部品内蔵基板およびその製造方法 |
JPWO2014115288A1 (ja) * | 2013-01-24 | 2017-01-26 | 株式会社メイコー | 部品内蔵基板の製造方法 |
CN104113983A (zh) * | 2013-04-17 | 2014-10-22 | 深南电路有限公司 | 一种埋入式电路板及其制作方法 |
CN104427794B (zh) * | 2013-09-10 | 2017-09-22 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
KR102194718B1 (ko) * | 2014-10-13 | 2020-12-23 | 삼성전기주식회사 | 임베디드 기판 및 임베디드 기판의 제조 방법 |
US20160234941A1 (en) * | 2015-02-10 | 2016-08-11 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, semiconductor package and method of manufacturing the same |
JP2016171149A (ja) * | 2015-03-11 | 2016-09-23 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP2019096818A (ja) * | 2017-11-27 | 2019-06-20 | 株式会社村田製作所 | 積層型コイル部品 |
CN109511215A (zh) * | 2018-11-27 | 2019-03-22 | 萨康电子(上海)有限公司 | Pcb通孔型光学点成形处理方法 |
JP7249907B2 (ja) * | 2019-08-08 | 2023-03-31 | 新光電気工業株式会社 | 配線基板の製造方法及び積層構造 |
Citations (5)
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JPH0353874U (ja) * | 1989-09-30 | 1991-05-24 | ||
JP2005159345A (ja) * | 2003-11-20 | 2005-06-16 | E I Du Pont De Nemours & Co | 基準のx線識別を用いて内層パネルおよび印刷回路板を製造する方法 |
JP2007027510A (ja) * | 2005-07-19 | 2007-02-01 | Fujikura Ltd | 実装基板及び電子部品の実装方法 |
JP2008300690A (ja) * | 2007-05-31 | 2008-12-11 | Icom Inc | 表面部品実装方法および表面部品実装用基板 |
JP2010087499A (ja) * | 2008-09-30 | 2010-04-15 | Ibiden Co Ltd | コンデンサ装置の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3924098C2 (de) | 1989-07-20 | 1998-05-20 | Hauni Werke Koerber & Co Kg | Behälterfördervorrichtung |
US5956564A (en) * | 1997-06-03 | 1999-09-21 | Ultratech Stepper, Inc. | Method of making a side alignment mark |
JP2005268669A (ja) * | 2004-03-19 | 2005-09-29 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JP4518114B2 (ja) * | 2007-07-25 | 2010-08-04 | Tdk株式会社 | 電子部品内蔵基板及びその製造方法 |
US8225503B2 (en) * | 2008-02-11 | 2012-07-24 | Ibiden Co., Ltd. | Method for manufacturing board with built-in electronic elements |
JPWO2009118950A1 (ja) * | 2008-03-27 | 2011-07-21 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JPWO2009147936A1 (ja) | 2008-06-02 | 2011-10-27 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP4874305B2 (ja) | 2008-07-22 | 2012-02-15 | 株式会社メイコー | 電気・電子部品内蔵回路基板とその製造方法 |
JP2010171413A (ja) * | 2008-12-26 | 2010-08-05 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板の製造方法 |
WO2013038468A1 (ja) * | 2011-09-12 | 2013-03-21 | 株式会社メイコー | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
-
2010
- 2010-10-01 JP JP2012536128A patent/JP5444473B2/ja not_active Expired - Fee Related
- 2010-10-01 KR KR1020137010930A patent/KR101713642B1/ko active IP Right Grant
- 2010-10-01 EP EP10857881.6A patent/EP2624673B1/en not_active Not-in-force
- 2010-10-01 WO PCT/JP2010/067260 patent/WO2012042668A1/ja active Application Filing
- 2010-10-01 CN CN201080069320.2A patent/CN103155728B/zh active Active
- 2010-10-01 US US13/823,700 patent/US8921706B2/en active Active
-
2011
- 2011-08-17 TW TW100129329A patent/TWI510151B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0353874U (ja) * | 1989-09-30 | 1991-05-24 | ||
JP2005159345A (ja) * | 2003-11-20 | 2005-06-16 | E I Du Pont De Nemours & Co | 基準のx線識別を用いて内層パネルおよび印刷回路板を製造する方法 |
JP2007027510A (ja) * | 2005-07-19 | 2007-02-01 | Fujikura Ltd | 実装基板及び電子部品の実装方法 |
JP2008300690A (ja) * | 2007-05-31 | 2008-12-11 | Icom Inc | 表面部品実装方法および表面部品実装用基板 |
JP2010087499A (ja) * | 2008-09-30 | 2010-04-15 | Ibiden Co Ltd | コンデンサ装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2624673B1 (en) | 2017-12-06 |
US20130176701A1 (en) | 2013-07-11 |
JPWO2012042668A1 (ja) | 2014-02-03 |
CN103155728B (zh) | 2016-01-20 |
TWI510151B (zh) | 2015-11-21 |
KR101713642B1 (ko) | 2017-03-08 |
KR20130129925A (ko) | 2013-11-29 |
EP2624673A1 (en) | 2013-08-07 |
CN103155728A (zh) | 2013-06-12 |
WO2012042668A1 (ja) | 2012-04-05 |
TW201216794A (en) | 2012-04-16 |
EP2624673A4 (en) | 2014-12-03 |
US8921706B2 (en) | 2014-12-30 |
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