JP2016171149A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP2016171149A JP2016171149A JP2015048889A JP2015048889A JP2016171149A JP 2016171149 A JP2016171149 A JP 2016171149A JP 2015048889 A JP2015048889 A JP 2015048889A JP 2015048889 A JP2015048889 A JP 2015048889A JP 2016171149 A JP2016171149 A JP 2016171149A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000013078 crystal Substances 0.000 claims abstract description 9
- 239000007791 liquid phase Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 20
- 229910010271 silicon carbide Inorganic materials 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1602—Diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
Abstract
【解決手段】実施形態の半導体装置は、常圧で液相がない材料の単結晶の基板と、上記基板に設けられ、非晶質の上記材料の領域、又は、ストイキオメトリから外れた上記材料の領域を有する識別マークと、を備える。
【選択図】図1
Description
本実施形態の半導体装置は、常圧で液相がない材料の単結晶の基板と、基板に設けられ、非晶質の上記材料の領域、又は、ストイキオメトリから外れた上記材料の領域を有する識別マークと、を備える。
本実施形態の半導体装置は、基板の側面に識別マークが設けられること以外は、第1の実施形態と同様である。したがって、第1の実施形態と重複する内容については、記述を省略する。
SiC基板の表面に、レーザ光を照射し、SiC基板を非晶質化、又は、SiC基板の組成を変調して識別マークを形成した。レーザ光として、YAGレーザの第4高調波(FHG)のパルスレーザを用いた。YAGレーザのFHGの波長は266nmである。
SiC基板の表面に、レーザ光を照射し、アブレーションによりSiC基板表面に凹凸を設けて識別マークを形成した。実施例よりも、1パルスあたりのエネルギーを高く設定した。1パルスあたりのエネルギー以外の条件は、実施例と同様である。
14 識別マーク
14a 領域
100 SBD(半導体装置)
200 SBD(半導体装置)
Claims (8)
- 常圧で液相がない材料の単結晶の基板と、
前記基板に設けられ、非晶質の前記材料の領域、又は、ストイキオメトリから外れた前記材料の領域を有する識別マークと、
を備える半導体装置。 - 前記材料がSiCである請求項1記載の半導体装置。
- 前記識別マークの表面の最大高さ(Rz)が100nm以下である請求項1又は請求項2記載の半導体装置。
- 前記基板が更に素子領域を備え、前記基板が表面、裏面及び側面を有し、前記識別マークが前記表面の前記素子領域以外の領域に設けられる請求項1乃至請求項3いずれか一項記載の半導体装置。
- 前記基板が表面、裏面及び側面を備え、前記側面に前記識別マークが設けられる請求項1乃至請求項3いずれか一項記載の半導体装置。
- 常圧で液相がない材料の単結晶の基板に前記材料のバンドギャップよりもエネルギーが大きいレーザー光を照射して、前記基板を非晶質化、又は、前記基板の組成を変調することにより識別マークを形成する半導体装置の製造方法。
- 前記材料がSiCである請求項6記載の半導体装置の製造方法。
- 前記識別マークの表面の最大高さ(Rz)が100nm以下である請求項6又は請求項7記載の半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048889A JP2016171149A (ja) | 2015-03-11 | 2015-03-11 | 半導体装置およびその製造方法 |
US14/840,850 US9799608B2 (en) | 2015-03-11 | 2015-08-31 | Semiconductor device and method for manufacturing the same |
TW104129061A TWI604592B (zh) | 2015-03-11 | 2015-09-02 | Semiconductor device and its manufacturing method |
CN201510556151.XA CN105977182A (zh) | 2015-03-11 | 2015-09-02 | 半导体装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048889A JP2016171149A (ja) | 2015-03-11 | 2015-03-11 | 半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016171149A true JP2016171149A (ja) | 2016-09-23 |
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Family Applications (1)
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JP2015048889A Pending JP2016171149A (ja) | 2015-03-11 | 2015-03-11 | 半導体装置およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9799608B2 (ja) |
JP (1) | JP2016171149A (ja) |
CN (1) | CN105977182A (ja) |
TW (1) | TWI604592B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190048402A (ko) * | 2017-10-31 | 2019-05-09 | 엘지디스플레이 주식회사 | 표시장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6946153B2 (ja) * | 2017-11-16 | 2021-10-06 | 株式会社ディスコ | ウエーハの生成方法およびウエーハ生成装置 |
US11562928B2 (en) * | 2019-01-25 | 2023-01-24 | Omnivision Technologies, Inc. | Laser marked code pattern for representing tracing number of chip |
KR20210079614A (ko) * | 2019-12-20 | 2021-06-30 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
CN114121898B (zh) * | 2022-01-28 | 2022-07-08 | 甬矽电子(宁波)股份有限公司 | 晶圆级芯片封装结构、封装方法和电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001250754A (ja) * | 2000-03-07 | 2001-09-14 | Komatsu Ltd | 半導体ウェハとその結晶軸方位の特定方法 |
JP2006043717A (ja) * | 2004-08-02 | 2006-02-16 | Sumitomo Heavy Ind Ltd | マーキング方法、単結晶炭化ケイ素製部材の製造方法、及び単結晶炭化ケイ素製部材 |
JP2006203063A (ja) * | 2005-01-21 | 2006-08-03 | Toshiba Corp | 半導体基板及び半導体基板の製造方法 |
JP2013093493A (ja) * | 2011-10-27 | 2013-05-16 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
JP2014031306A (ja) * | 2012-07-10 | 2014-02-20 | Hitachi Metals Ltd | 高融点材料単結晶基板への識別マークの形成方法、及び高融点材料単結晶基板 |
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JP2000114129A (ja) | 1998-10-09 | 2000-04-21 | Toshiba Corp | 半導体装置及びその製造方法 |
TW454238B (en) | 1999-11-25 | 2001-09-11 | Komatsu Mfg Co Ltd | Form of microscopic dot mark using laser beam and marking method thereof |
JP4071476B2 (ja) * | 2001-03-21 | 2008-04-02 | 株式会社東芝 | 半導体ウェーハ及び半導体ウェーハの製造方法 |
US6812477B2 (en) | 2002-12-04 | 2004-11-02 | Texas Instruments Incorporated | Integrated circuit identification |
TWI349973B (en) | 2007-10-31 | 2011-10-01 | Chipmos Technologies Inc | Method of fabricating alignment mark for cdim package structure |
JP5078725B2 (ja) | 2008-04-22 | 2012-11-21 | ラピスセミコンダクタ株式会社 | 半導体装置 |
JP5522914B2 (ja) | 2008-09-11 | 2014-06-18 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
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JP2010283070A (ja) | 2009-06-03 | 2010-12-16 | Fujikura Ltd | 半導体装置の製造方法 |
JP2012028664A (ja) | 2010-07-27 | 2012-02-09 | Renesas Electronics Corp | 半導体装置の製造方法 |
KR101713642B1 (ko) * | 2010-10-01 | 2017-03-08 | 메이코 일렉트로닉스 컴파니 리미티드 | 부품 내장 기판 및 부품 내장 기판의 제조 방법 |
WO2016100560A1 (en) * | 2014-12-16 | 2016-06-23 | Deca Technologies Inc. | Method of marking a semiconductor package |
-
2015
- 2015-03-11 JP JP2015048889A patent/JP2016171149A/ja active Pending
- 2015-08-31 US US14/840,850 patent/US9799608B2/en not_active Expired - Fee Related
- 2015-09-02 TW TW104129061A patent/TWI604592B/zh not_active IP Right Cessation
- 2015-09-02 CN CN201510556151.XA patent/CN105977182A/zh active Pending
Patent Citations (5)
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JP2001250754A (ja) * | 2000-03-07 | 2001-09-14 | Komatsu Ltd | 半導体ウェハとその結晶軸方位の特定方法 |
JP2006043717A (ja) * | 2004-08-02 | 2006-02-16 | Sumitomo Heavy Ind Ltd | マーキング方法、単結晶炭化ケイ素製部材の製造方法、及び単結晶炭化ケイ素製部材 |
JP2006203063A (ja) * | 2005-01-21 | 2006-08-03 | Toshiba Corp | 半導体基板及び半導体基板の製造方法 |
JP2013093493A (ja) * | 2011-10-27 | 2013-05-16 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
JP2014031306A (ja) * | 2012-07-10 | 2014-02-20 | Hitachi Metals Ltd | 高融点材料単結晶基板への識別マークの形成方法、及び高融点材料単結晶基板 |
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KR20190048402A (ko) * | 2017-10-31 | 2019-05-09 | 엘지디스플레이 주식회사 | 표시장치 |
KR102111045B1 (ko) * | 2017-10-31 | 2020-05-14 | 엘지디스플레이 주식회사 | 표시장치 |
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Also Published As
Publication number | Publication date |
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TWI604592B (zh) | 2017-11-01 |
US20160268212A1 (en) | 2016-09-15 |
CN105977182A (zh) | 2016-09-28 |
TW201633490A (zh) | 2016-09-16 |
US9799608B2 (en) | 2017-10-24 |
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