WO2014045370A1 - Machine de travail pour cartes à circuits imprimés et procédé de montage - Google Patents

Machine de travail pour cartes à circuits imprimés et procédé de montage Download PDF

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Publication number
WO2014045370A1
WO2014045370A1 PCT/JP2012/074056 JP2012074056W WO2014045370A1 WO 2014045370 A1 WO2014045370 A1 WO 2014045370A1 JP 2012074056 W JP2012074056 W JP 2012074056W WO 2014045370 A1 WO2014045370 A1 WO 2014045370A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
lead wire
circuit board
solder
work
Prior art date
Application number
PCT/JP2012/074056
Other languages
English (en)
Japanese (ja)
Inventor
範明 岩城
児玉　誠吾
公彦 安田
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2014536475A priority Critical patent/JP6062444B2/ja
Priority to PCT/JP2012/074056 priority patent/WO2014045370A1/fr
Publication of WO2014045370A1 publication Critical patent/WO2014045370A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Definitions

  • the present invention relates to a substrate working machine for mounting an electronic component having a lead wire on a circuit board, and a mounting method for mounting the electronic component having a lead wire on a circuit board.
  • the lead wire When an electronic component having a lead wire is mounted on a circuit board, the lead wire is inserted into a through hole formed in the circuit board, and molten solder is applied to the lead wire.
  • the lead wire of the electronic component held by the holding device is a through hole in the circuit board. Inserted into. Subsequently, the circuit board is unloaded from the mounting work machine and transferred into the solder coating work machine. And a molten solder is apply
  • mounting work and soldering work are performed by the mounting work machine and the solder application work machine.
  • the circuit board on which the mounting work is performed is transferred from the mounting work machine to the solder application work machine.
  • the electronic component mounted on the circuit board may be displaced during conveyance.
  • a relatively large arrangement space is required.
  • the productivity efficiency is lowered.
  • This invention is made
  • a substrate working machine holds an electronic component having a lead wire and inserts the lead wire into a through hole formed in a circuit board. And a solder application device that applies molten solder to the lead wires inserted into the through holes.
  • the substrate work machine further comprising a pressing device that presses the electronic component in a state where the lead wire is inserted into the through hole.
  • a solder application device applies molten solder to the lead wires of the electronic component pressed by the pressing device.
  • the holding device presses the electronic component in a state where the lead wire is inserted into the through hole.
  • the holding device presses the electronic component in a state where the lead wire is inserted into the through hole.
  • the solder application device is configured such that the lead wire is formed by the holding device. Apply the molten solder in accordance with the timing of insertion into the through hole.
  • a mounting method for mounting an electronic component having a lead wire on a circuit board wherein the holding device for holding the electronic component causes the through hole formed in the circuit board to pass through the through hole.
  • the on-board working machine according to claim 1, a holding device that performs mounting work of an electronic component having a lead wire on one working machine, and solder that performs soldering work on the electronic component mounted by the mounting work. And a coating device.
  • the mounting method in one work machine, the mounting operation of the electronic component having the lead wire and the soldering operation to the electronic component mounted by the mounting operation are performed.
  • the number of work implements can be reduced, the cost can be reduced, and the installation space for the work implements can be reduced.
  • it is not necessary to transfer the circuit board between the work machines it is possible to suppress the displacement of the electronic components due to the transfer and to shorten the work time.
  • the soldering operation is performed on the electronic component in a state of being pressed by the pressing device.
  • the mounting work and the soldering work are performed by a plurality of working machines.
  • an electronic component mounted on a circuit board may float when solder is applied by a jet of molten solder or the like.
  • the lead wire is bent after the lead wire of the electronic component is inserted into the through hole.
  • the soldering work is performed on the electronic component held by the holding device. That is, the holding device functions as a pressing device. As a result, it is not necessary to provide a pressing device on the substrate working machine, and the cost can be reduced.
  • the molten solder is applied in accordance with the timing at which the lead wire is inserted into the through hole of the circuit board. For this reason, when the lead wire enters the inside of the through hole, the molten solder enters the inside of the through hole. This makes it possible to fill the inside of the through hole, that is, the clearance between the inner peripheral surface of the through hole and the outer peripheral surface of the lead wire with molten solder, and to improve the solder joint state. It becomes possible.
  • FIG. 1 It is a figure which shows the electronic component mounting machine which is an Example of this invention. It is a figure which shows the mounting head and solder jet apparatus with which an electronic component mounting machine is provided. It is a block diagram which shows the control apparatus with which an electronic component mounting machine is provided. It is a figure which shows the mounting head and solder jet apparatus when molten solder is jetted according to the timing at which a lead wire is inserted into the through hole of the circuit board. It is a figure which shows a mounting head and a solder jet apparatus when molten solder is jetted toward the lead wire inserted in the through hole of the circuit board. It is a figure which shows a pressing apparatus and a solder jet apparatus when a soldering operation
  • FIG. 1 shows an electronic component mounting machine 10 according to an embodiment of the present invention.
  • the electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board.
  • the electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 22, a mounting head 24, a supply device 26, and a solder jet device 28. Yes.
  • the conveyance device 20 includes a pair of conveyor belts 30 extending in the X-axis direction and an electromagnetic motor (see FIG. 3) 32 that rotates the conveyor belt 30.
  • the circuit board 34 is supported by the pair of conveyor belts 30 and is conveyed in the X-axis direction by driving the electromagnetic motor 32.
  • the transfer device 20 includes a substrate holding device (see FIG. 3) 36.
  • the substrate holding device 36 fixedly holds the circuit board 34 supported by the conveyor belt 30 at a predetermined position (a position where the circuit board 34 in FIG. 1 is illustrated).
  • the moving device 22 includes an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52.
  • the X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction.
  • the X-axis slider 56 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 3) 58.
  • the Y-axis direction slide mechanism 52 has a Y-axis slider 60 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction.
  • the Y-axis slider 60 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 3) 62.
  • the mounting head 24 is attached to the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.
  • the mounting head 24 mounts electronic components on the circuit board.
  • a component holder 70 is attached to the lower end surface of the mounting head 24.
  • the component holder 70 has a pair of arms 72, and the pair of arms 72 approaches and separates by the operation of the positive / negative pressure supply device (see FIG. 3) 76.
  • the positive / negative pressure supply device 76 when the negative pressure is supplied by the positive / negative pressure supply device 76, the pair of arms 72 approaches, and when the positive pressure is supplied by the positive / negative pressure supply device 76, the pair of arms 72 separates. .
  • the component holder 70 grips the electronic component by the pair of arms 72 and detaches the gripped electronic component.
  • the mounting head 24 includes a lifting device (see FIG. 3) 78 that lifts and lowers the component holder 70. The mounting head 24 changes the vertical position of the electronic component to be gripped by the lifting device 78.
  • the supply device 26 is a feeder-type supply device, and has a plurality of tape feeders 80.
  • the tape feeder 80 accommodates the taped component in a wound state.
  • the taped component is obtained by taping the electronic component 82 shown in FIG. 2, specifically, the electronic component 82 having the lead wire 84.
  • the tape feeder 80 sends out the taped parts by a feeding device 86 (see FIG. 3).
  • the tape feeder 80 supplies the electronic component 82 at the supply position by feeding out the taped component.
  • a lead wire cutting mechanism (see FIG. 3) 88 is disposed at the supply position of the tape feeder 80, and when the electronic component 82 is gripped by the mounting head 24, the lead wire 84 of the electronic component 82 is The lead wire cutting mechanism 88 cuts it to a predetermined length.
  • the solder jet device 28 is disposed between the pair of conveyor belts 30 and is located on the lower surface side of the circuit board 34 held by the board holding device 36. As shown in FIG. 2, the solder jet device 28 has a generally cylindrical solder tank 90 and a jet nozzle 92. Molten solder is stored in the solder tank 90, and a jet nozzle 92 is disposed in the center of the solder tank 90 in a standing manner. The molten solder stored in the solder bath 90 is jetted upward from the tip of the jet nozzle 92 by the operation of a pump (see FIG. 3) 96. Further, the solder jet device 28 has a moving mechanism (see FIG.
  • solder jet device 28 can jet the molten solder toward an arbitrary position on the lower surface side of the circuit board 34.
  • the electronic component mounting machine 10 includes a control device 100 as shown in FIG.
  • the control device 100 includes a controller 102 and a plurality of drive circuits 104.
  • the plurality of drive circuits 104 are connected to the electromagnetic motors 32, 58, 62, the substrate holding device 36, the positive / negative pressure supply device 76, the lifting / lowering device 78, the feeding device 86, the lead wire cutting mechanism 88, the pump 96, and the moving mechanism 98.
  • the controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operations of the transport device 20 and the moving device 22 are controlled by the controller 102.
  • the electronic component 82 is mounted on the circuit board 34, and the mounted electronic component 82 is soldered to the circuit board 34.
  • the circuit board 34 is transported to the work position according to a command from the controller 102 of the control device 100, and the circuit board 34 is fixedly held at the position.
  • the supply device 26 supplies electronic components at the supply position of the tape feeder 80.
  • the controller 102 moves the mounting head 24 above the supply position and grips the electronic component 82 by the component holder 70.
  • the controller 102 moves the mounting head 24 to a predetermined position on the circuit board 34. Specifically, as shown in FIG. 2, a through hole 110 for inserting the lead wire 84 of the electronic component 82 is formed in the circuit board 34. The mounting head 24 is moved onto the circuit board 34 so that the through hole 110 and the lead wire 84 coincide with each other in the vertical direction. In addition, the controller 102 moves the solder jet device 28 below the through hole 110 of the circuit board 34. Thereby, as shown in FIG. 3, the component holder 70 that holds the electronic component 82 and the jet device 28 face each other with the through hole 110 of the circuit board 34 interposed therebetween.
  • the controller 102 moves the component holder 70 downward.
  • the leading end portion of the lead wire 84 of the electronic component 82 held by the component holder 70 is inserted into the through hole 110 of the circuit board 34.
  • the controller 102 operates the pump 96 of the solder jet device 28 in accordance with the timing at which the leading end portion of the lead wire 84 is inserted into the through hole 110.
  • the molten solder 112 jets toward the lead wire 84, the tip end portion of the lead wire 84 enters the through hole 110 from above, and the molten solder 112 enters from below.
  • the molten solder 112 is applied to the substrate surface opposite to the direction in which the lead wire 84 enters. Note that at the timing when the tip end portion of the lead wire 84 is inserted into the through hole 110, the operation of the pump 96 is controlled so that the molten solder that has flowed into the through hole 110 reaches the inside.
  • the controller 102 moves the component holder 70 further downward.
  • the lead wire 84 of the electronic component 82 held by the component holder 70 passes through the through hole 110 of the circuit board 34 and extends below the circuit board 34.
  • the pump 96 is in operation and the molten solder is jetted.
  • the electronic component 82 is soldered by the solder jet device 28 while being pressed by the component holder 70.
  • the operation of the pump 96 is controlled so that the molten solder that has flowed through reaches the lead wire 84 that extends below the circuit board 34.
  • the jet of molten solder is stopped, and the gripping of the electronic component 82 by the component holder 70 is released.
  • the electronic component 82 is mounted on the circuit board 34, and the mounted electronic component 82 is soldered to the circuit board 34. That is, the lead wire 84 inserted into the through hole 110 and the location where the lead wire 84 of the circuit board 34 is inserted are applied with molten solder, whereby the lead wire 84 and the circuit board 34 are connected, and the electric circuit Is formed.
  • the electronic component mounting machine 10 is provided with the mounting head 24 for performing the mounting operation and the solder jet device 28 for performing the soldering operation. Therefore, in one electronic component mounting machine 10, it is possible to mount the electronic component 82 on the circuit board 34 and solder the electronic component 82 to the circuit board 34.
  • the mounting work and the soldering work are performed by the mounting work machine provided with the mounting head 24 and the soldering work machine provided with the solder jet device 28.
  • the soldering operation is performed by the solder jet device 28 in the soldering machine, the electronic component 82 mounted on the circuit board 34 may be lifted by the jet of molten solder.
  • the electronic component mounting machine 10 it is possible to mount the electronic component 82 on the circuit board 34 and solder the electronic component 82 to the circuit board 34 in one working machine.
  • the number of work implements can be reduced, the cost can be reduced, and the installation space for the work implements can be reduced.
  • the working time can be shortened.
  • the molten solder jet is started in accordance with the timing when the lead wire 84 is inserted into the through hole 110. For this reason, the lead wire 84 enters the through hole 110 from above, and the molten solder enters from below. As a result, it is possible to fill the inside of the through hole 110, that is, the clearance between the inner peripheral surface of the through hole 110 and the outer peripheral surface of the lead wire 84 with the molten solder, and the soldering state is improved. It becomes possible to do.
  • the amount of molten solder ejected and the height ejected are controlled by controlling the operation of the pump 96. Specifically, as described above, the operation of the pump 96 is controlled so that the molten solder enters the through hole 110 at the initial stage of the ejection of the molten solder. Then, the operation of the pump 96 is controlled so that the amount of molten solder ejected, the height of ejection, and the like gradually decrease in accordance with the amount of protrusion of the lead wire 84 downward from the circuit board 34. Thereby, it is possible to suitably adjust the finish of the solder.
  • the controller 102 includes a lead wire insertion portion 120 and a solder jet portion 122 as shown in FIG.
  • the lead wire insertion portion 120 is a functional portion for inserting the lead wire 84 of the electronic component 82 into the through hole 110 of the circuit board 34.
  • the solder jet portion 122 is a functional portion for jetting molten solder toward the lead wire 84 inserted into the through hole 110.
  • the electronic component mounting machine 10 is an example of a substrate working machine.
  • the mounting head 24 is an example of a holding device and a pressing device.
  • the solder jet device 28 is an example of a solder application device.
  • the process processed by the lead wire insertion part 120 is an example of an insertion process.
  • the process processed by the solder jet part 122 is an example of an application
  • this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, molten solder is jetted toward the lead wire 84 during the soldering operation, but the molten solder may be applied to the lead wire 84. That is, the lead wire 84 may be immersed in the solder bath.
  • the electronic component 82 is inserted from above the circuit board 34 and molten solder is applied from below the circuit board 34.
  • the electronic component 82 is inserted from below the circuit board 34, and the circuit board Molten solder may be applied from above 34.
  • the molten solder may be dropped onto the circuit board.
  • the soldering operation is performed in a state where the electronic component 82 is suppressed by the mounting head 24, but the solder is performed in a state where the electronic component 82 is suppressed by a device different from the mounting head 24. It is possible to perform attachment work.
  • the electronic component mounting machine 10 may be provided with a pressing device 130 shown in FIG.
  • the pressing device 130 is disposed above the circuit board 34 and is movable in the vertical direction.
  • the pressing device 130 can move downward and simultaneously press a plurality of electronic components 82 mounted on the circuit board 34. That is, after mounting the plurality of electronic components 82 by the mounting head 24, the plurality of electronic components 82 are simultaneously pressed by the pressing device 130.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention porte sur une machine de travail pour des cartes à circuits imprimés qui comprend une tête de montage (24) pour maintenir un composant électronique (82) ayant des fils conducteurs (84) et pour insérer les fils conducteurs dans des trous traversants (110) formés dans une carte à circuits imprimés (34), et un dispositif de lançage de soudure (28) pour lancer une soudure en fusion (112) sur les fils conducteurs insérés dans les trous traversants. En d'autres termes, une machine de travail réalise un travail de montage pour un composant électronique ayant des fils conducteurs et réalise également un travail de soudage pour le composant électronique monté dans le travail de montage. En conséquence, le nombre de machines de travail peut être réduit, réduisant le coût et réduisant également l'espace nécessaire pour les machines de travail. De plus, il n'y a pas besoin de transférer la carte à circuits imprimés parmi les machines de travail, de telle sorte que le décalage positionnel du composant électronique provoqué par le transfert peut être empêché et le temps de travail peut également être réduit.
PCT/JP2012/074056 2012-09-20 2012-09-20 Machine de travail pour cartes à circuits imprimés et procédé de montage WO2014045370A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014536475A JP6062444B2 (ja) 2012-09-20 2012-09-20 対基板作業機、および装着方法
PCT/JP2012/074056 WO2014045370A1 (fr) 2012-09-20 2012-09-20 Machine de travail pour cartes à circuits imprimés et procédé de montage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074056 WO2014045370A1 (fr) 2012-09-20 2012-09-20 Machine de travail pour cartes à circuits imprimés et procédé de montage

Publications (1)

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WO2014045370A1 true WO2014045370A1 (fr) 2014-03-27

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PCT/JP2012/074056 WO2014045370A1 (fr) 2012-09-20 2012-09-20 Machine de travail pour cartes à circuits imprimés et procédé de montage

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WO (1) WO2014045370A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016056045A1 (fr) * 2014-10-06 2016-04-14 富士機械製造株式会社 Machine à travailler un substrat et procédé de montage
WO2016174715A1 (fr) * 2015-04-27 2016-11-03 富士機械製造株式会社 Machine de travail
JP2017168711A (ja) * 2016-03-17 2017-09-21 富士機械製造株式会社 対基板作業機、および装着方法
CN107251666A (zh) * 2015-02-25 2017-10-13 富士机械制造株式会社 钎焊装置
WO2018116397A1 (fr) * 2016-12-21 2018-06-28 株式会社Ｆｕｊｉ Machine de travail et procédé de brasage
CN108353536A (zh) * 2015-11-18 2018-07-31 株式会社富士 对基板作业机及插入方法
EP3522687A4 (fr) * 2016-09-30 2020-07-08 Fuji Corporation Machine destinée à effectuer un travail sur un substrat, et procédé d'insertion
CN111512713A (zh) * 2017-11-14 2020-08-07 株式会社富士 作业机、安装方法

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JPH10209622A (ja) * 1997-01-27 1998-08-07 Denso Corp 挿入型部品の実装方法

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016056045A1 (fr) * 2014-10-06 2016-04-14 富士機械製造株式会社 Machine à travailler un substrat et procédé de montage
JPWO2016056045A1 (ja) * 2014-10-06 2017-07-20 富士機械製造株式会社 対基板作業機、および装着方法
CN107251666A (zh) * 2015-02-25 2017-10-13 富士机械制造株式会社 钎焊装置
CN107251666B (zh) * 2015-02-25 2019-10-01 株式会社富士 钎焊装置
US10470350B2 (en) 2015-04-27 2019-11-05 Fuji Corporation Work machine
CN107535054A (zh) * 2015-04-27 2018-01-02 富士机械制造株式会社 作业机
JPWO2016174715A1 (ja) * 2015-04-27 2018-02-15 富士機械製造株式会社 作業機
CN107535054B (zh) * 2015-04-27 2019-10-08 株式会社富士 作业机
WO2016174715A1 (fr) * 2015-04-27 2016-11-03 富士機械製造株式会社 Machine de travail
CN108353536A (zh) * 2015-11-18 2018-07-31 株式会社富士 对基板作业机及插入方法
EP3379911A4 (fr) * 2015-11-18 2018-11-21 Fuji Corporation Machine de travail sur substrats et procédé d'insertion
CN108353536B (zh) * 2015-11-18 2020-06-30 株式会社富士 对基板作业机及插入方法
JP2017168711A (ja) * 2016-03-17 2017-09-21 富士機械製造株式会社 対基板作業機、および装着方法
EP3522687A4 (fr) * 2016-09-30 2020-07-08 Fuji Corporation Machine destinée à effectuer un travail sur un substrat, et procédé d'insertion
WO2018116397A1 (fr) * 2016-12-21 2018-06-28 株式会社Ｆｕｊｉ Machine de travail et procédé de brasage
CN111512713A (zh) * 2017-11-14 2020-08-07 株式会社富士 作业机、安装方法
CN111512713B (zh) * 2017-11-14 2021-06-04 株式会社富士 作业机、安装方法

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