WO2016056045A1 - Machine à travailler un substrat et procédé de montage - Google Patents

Machine à travailler un substrat et procédé de montage Download PDF

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Publication number
WO2016056045A1
WO2016056045A1 PCT/JP2014/076668 JP2014076668W WO2016056045A1 WO 2016056045 A1 WO2016056045 A1 WO 2016056045A1 JP 2014076668 W JP2014076668 W JP 2014076668W WO 2016056045 A1 WO2016056045 A1 WO 2016056045A1
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WO
WIPO (PCT)
Prior art keywords
lead
component
solder
electrical component
application
Prior art date
Application number
PCT/JP2014/076668
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English (en)
Japanese (ja)
Inventor
田中　克典
剛 濱根
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2014/076668 priority Critical patent/WO2016056045A1/fr
Priority to JP2016552720A priority patent/JP6521990B2/ja
Publication of WO2016056045A1 publication Critical patent/WO2016056045A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a substrate working machine for mounting an electrical component having a lead on a circuit substrate, and a mounting method for mounting the electrical component having a lead on a circuit substrate.
  • an electrical component having a lead (hereinafter sometimes referred to as a “lead component”) is mounted on a circuit substrate, the lead is inserted into a through hole formed in the circuit substrate, and the tip of the lead Molten solder is applied to the part.
  • the molten solder is applied to the lead, the lead component may float and the lead may come out of the through hole.
  • the molten solder is applied to the lead wire in a state where the lead component is pressed against the circuit base material by the pressing device.
  • the substrate working machine described in the above patent document it is possible to prevent the lead from coming out from the through hole when the molten solder is applied to the lead.
  • the lead component is mounted on the circuit substrate in various modes depending on the component type, there is also a lead component that is not suitable for soldering work in a state where the lead component is pressed against the circuit substrate.
  • This invention is made
  • a work machine for a board holds an electrical component having a lead and inserts the lead into a through hole formed in a circuit base material, and the through
  • a pressing device that holds the electrical component in a state in which the lead is inserted into the hole
  • a solder application device that applies molten solder to the lead that is inserted into the through hole, and the electrical component that is held by the holding device.
  • a control device having a work execution unit for selectively executing the operation.
  • a mounting method includes a holding device that holds an electrical component having a lead and that inserts the lead into a through-hole formed in a circuit substrate, and the through-hole.
  • a holding device that holds an electrical component having a lead and that inserts the lead into a through-hole formed in a circuit substrate, and the through-hole.
  • an on-board working machine comprising: a pressing device that holds the electrical component in a state where the lead is inserted; and a solder application device that applies molten solder to the lead inserted into the through hole.
  • a first application operation for applying molten solder to the lead by the solder application device, and the lead of the electrical component pressed by the pressing device Characterized in that it comprises a coating step of executing it and a second coating operation of applying the molten solder by applying apparatus selectively.
  • the first application operation of applying molten solder to the lead of the lead component held by the holding device, and the molten solder to the lead of the lead component pressed by the pressing device A second coating operation for coating is selectively performed. Accordingly, for example, the lead component is held by the holding device in a state where the main body portion of the lead component is floated from the circuit base material, and the lead component is soldered to the circuit board in a state where the main body portion and the circuit base material are separated from each other. It becomes possible to attach.
  • the lead component can be soldered to the circuit board in a state where the main body portion and the circuit base material are in contact with each other.
  • the lead component can be soldered to the circuit base material according to various aspects.
  • the “lead” in the present invention includes a lead wire, a lead pin, a connector pin, etc., and is also called a terminal or a terminal.
  • the “electric part having a lead” in the present invention includes package parts such as SIP (abbreviation for Single Inline package), DIP (abbreviation for Dual Inline Package), PGA (abbreviation for Pin Grid Array), and the like.
  • FIG. 1 shows a component mounting apparatus 10.
  • the component mounting apparatus 10 is an apparatus for executing a component mounting operation on the circuit substrate 12.
  • the component mounting apparatus 10 includes an apparatus main body 20, a base material conveyance holding device 22, a component supply device 24, a bulk component supply device 26, a component mounting device 28, a solder application device 30, and imaging devices 32 and 34.
  • the circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.
  • the apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40.
  • the substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
  • the conveyance device 50 is a device that conveys the circuit substrate 12
  • the clamp device 52 is a device that holds the circuit substrate 12.
  • the substrate conveyance holding device 22 conveys the circuit substrate 12 and holds the circuit substrate 12 fixedly at a predetermined position.
  • the conveyance direction of the circuit substrate 12 is referred to as an X direction
  • a horizontal direction perpendicular to the direction is referred to as a Y direction
  • a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting apparatus 10 is the X direction, and the front-rear direction is the Y direction.
  • the component supply device 24 is disposed at one end of the frame portion 40 in the front-rear direction.
  • the component supply device 24 includes a tray-type component supply device 60 and a feeder-type component supply device (see FIG. 6) 62.
  • the tray-type component supply device 60 is a device that supplies components placed on the tray.
  • the feeder-type component supply device is a device that supplies components by a tape feeder (not shown).
  • the bulk component supply device 26 is disposed at the other end of the frame portion 40 in the front-rear direction.
  • the separated component supply device 26 is a device that aligns a plurality of components scattered in a separated state and supplies the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.
  • the electrical component includes a component having a lead wire (hereinafter sometimes abbreviated as “lead component”), a component not having a lead wire, and the like.
  • the component mounting device 28 is disposed in the beam portion 42 and includes two work heads 64 and 66 and a work head moving device 68.
  • the work head moving device 68 includes an X direction moving device 70, a Y direction moving device 71, and a Z direction moving device 72. Then, the two work heads 64 and 66 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 70 and the Y-direction moving device 71. Further, as shown in FIG. 2, each of the work heads 64 and 66 is detachably attached to the sliders 73 and 74, and the Z-direction moving device 72 individually moves the sliders 73 and 74 in the vertical direction. That is, the work heads 64 and 66 are individually moved in the vertical direction by the Z-direction moving device 72.
  • a first component holder 76 is attached to the lower end surface of the work head 64. As shown in FIGS. 3 and 4, the first component holder 76 holds the lead wires of the electrical components. As shown in FIGS. 3 and 4, the main body portion 80, a pair of claw portions 82, an auxiliary plate 84, and an opening / closing device (FIG. 6). Reference) 86, a pusher 88, and an elevating device (see FIG. 6) 90 are included.
  • FIG. 3 is a side view of the first component holder 76
  • FIG. 4 is a front view of the first component holder 76.
  • the pair of claw portions 82 are held by the main body portion 80 so as to be swingable, and the distal end portions of the pair of claw portions 82 approach and separate from each other by the operation of the opening / closing device 86.
  • a recess (not shown) having a size corresponding to the wire diameter of the lead wire 98 of the lead component 96 to be held is formed inside the pair of claws 82.
  • the auxiliary plate 84 is located between the pair of claw portions 82, and enters between the two lead wires 98 of the lead component 96 as the pair of claw portions 82 approach.
  • Each of the two lead wires 98 of the lead component 96 is sandwiched from both side surfaces by the concave portion of the claw portion 82 and the auxiliary plate 84.
  • the lead component 96 is held by the pair of claws 82 in the two lead wires 98.
  • the pusher 88 is held by the main body portion 80 so as to be movable in the vertical direction, and moves up and down by the operation of the lifting device 90. When the pusher 88 is lowered, the pusher 88 contacts the main body portion 100 of the lead component 96 held by the pair of claw portions 82 and presses the lead component 96 downward.
  • a second component holder (see FIG. 5) 108 is attached to the lower end surface of the work head 66.
  • the second component holder 108 includes a main body portion 110, a pair of claw portions 112, an opening / closing device 114, a pusher 116, and a lifting device (see FIG. 6) 118.
  • the pair of claws 112 are disposed so as to extend downward from the lower surface of the main body 110 and slide so as to be able to approach and separate from each other.
  • the opening / closing device 114 slides the pair of claw portions 112 in a direction in which the pair of claw portions 112 approaches and separates.
  • the second component holder 108 holds the component to be held by holding the component to be held by the pair of claw portions 112 by the approach of the pair of claw portions 112.
  • the main body portion 100 of the lead component 96 is sandwiched by the pair of claw portions 112.
  • the second component holder 108 can also hold components that do not have lead wires.
  • the pusher 116 is held by the main body 110 so as to be movable in the vertical direction, and moves up and down by the operation of the lifting device 118. When the pusher 116 descends, the pusher 116 comes into contact with the main body of the lead component held by the pair of claws 112 and presses the lead component downward.
  • the solder application device 30 is disposed below the substrate conveyance holding device 22 and is located on the lower surface side of the circuit substrate 12 held by the clamp device 52 of the substrate conveyance holding device 22.
  • the solder application device 30 includes a solder jet device (see FIG. 7) 120 and a moving device (see FIG. 6) 122.
  • the solder jet device 120 includes a solder bath 126 and a jet nozzle 128. Molten solder is stored in the solder bath 126, and a jet nozzle 128 is provided in a standing state at the center of the solder bath 126. The molten solder stored in the solder bath 126 is jetted upward from the tip of the jet nozzle 128 by the operation of a pump (not shown).
  • the moving device 122 moves the solder jet device 120 to an arbitrary position below the base material conveyance holding device 22. Thereby, the solder jet device 120 can jet the molten solder toward an arbitrary position on the lower surface side of the circuit substrate 12.
  • the imaging device 32 is attached to the slider 73 while facing downward, and is moved together with the work head 64 in the X, Y, and Z directions. As a result, the imaging device 32 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the imaging device 34 is disposed between the base material conveyance holding device 22 and the component supply device 24 on the frame portion 40 so as to face upward. Thereby, the imaging device 34 images the components held by the first component holder 76 or the second component holder 108 of the work heads 64 and 66.
  • the component mounting apparatus 10 includes a control device 130 as shown in FIG.
  • the control device 130 is configured mainly by a computer, and is connected to the base material conveyance holding device 22, the component supply device 24, the loose component supply device 26, the component mounting device 28, and the solder coating device 30. Thereby, the control device 130 controls the operations of the substrate conveyance holding device 22, the component supply device 24, the bulk component supply device 26, the component mounting device 28, and the solder application device 30.
  • the control device 130 is connected to the imaging device 32 and the imaging device 34 via the image processing device 132. Thereby, the control apparatus 130 acquires the imaging data imaged by the imaging devices 32 and 34.
  • ⁇ Mounting work by the component mounting apparatus 10> With the configuration described above, in the component mounting apparatus 10, components are mounted on the circuit substrate 12. Specifically, the circuit base 12 is transported to the work position by the operation of the transport device 50, and the circuit base 12 is fixedly held by the operation of the clamp device 52 at that position. Further, the component supply device 24 or the bulk component supply device 26 supplies components at a predetermined supply position. Then, the work head 64 or the work head 66 is moved above the supply position by the operation of the work head moving device 68, and the parts are held by the first part holder 76 or the second part holder 108.
  • the lead component 96 having the two lead wires 98 is held by the first component holder 76.
  • components other than the lead component 96 having the two lead wires 98 can be held by the second component holder 108.
  • the work head 64 is operated by the X-direction moving device 70 and the Y-direction moving device 71 to operate the circuit substrate. 12 to a predetermined position.
  • the circuit substrate 12 is formed with a through hole 140 for inserting the lead wire 98 of the lead component 96.
  • the lead component 96 held by the first component holder 76 is imaged by the imaging device 34, and the through hole 140 of the circuit substrate 12 is imaged by the imaging device 32, and the holding posture of the lead component 96, etc.
  • the information regarding the position information of the through hole 140 and the like are calculated by the control device 130 based on the imaging data.
  • the working head 64 moves onto the circuit substrate 12 so that the through hole 140 of the circuit substrate 12 and the lead wire 98 coincide in the vertical direction. Then, the work head 64 is lowered by the operation of the Z-direction moving device 72, so that the lead wire 98 of the lead component 96 held by the first component holder 76 is inserted into the through hole 140 of the circuit substrate 12. To do. Since the first component holder 76 holds the lead wire 98, the lead wire 98 can be suitably inserted into the through hole 140.
  • the first component holder 76 moves the pair of claws 82 apart by the operation of the opening / closing device 86 and releases the holding of the lead component 96. Then, the pusher 88 is lowered by the operation of the lifting device 90. As a result, as shown in FIG. 7, the lead component 96 is pressed toward the circuit base material 12, whereby the lead wire 98 is inserted into the through hole 140 to the root, and the main body 100 is the surface of the circuit base material 12. To touch.
  • the solder jet device 120 moves below the through hole 140 of the circuit substrate 12 by the operation of the moving device 122. As a result, the solder jet device 120 is positioned below the lead wire 98 inserted into the through hole 140.
  • the solder jet device 120 jets molten solder from the jet nozzle 128 toward the lead wire 98 of the lead component 96 by the operation of the pump.
  • the lead component 96 is pressed against the circuit substrate 12 by the pusher 88 of the first component holder 76. That is, the lead component 96 is soldered by the solder jet device 120 while being pressed by the pusher 88. This prevents the lead component 96 from being lifted by the molten solder jet.
  • the molten solder jet is stopped.
  • the pressing of the lead component 96 by the pusher 88 is performed until the solder is solidified even after the jet of molten solder stops, and after the solder is solidified, the pressing of the lead component 96 by the pusher 88 is released. .
  • the lead wire 98 and the circuit substrate 12 are connected to form an electric circuit.
  • the lead component 96 is soldered while being pressed by the pusher 88.
  • a weight 150 is placed on the main body 100 of the lead component 96 as shown in FIG. That is, in the conventional component mounting apparatus, the lead component 96 is soldered in a state of being pressed by the weight 150, and the weight 150 prevents the lead component 96 from being lifted by a jet of molten solder.
  • the soldering operation using the weight 150 includes an operation of placing the weight 150 on the lead component 96 before the soldering operation, and an operation of collecting the weight 150 from the lead component 96 after the soldering operation. is required. Furthermore, solder may adhere to the weight 150. In such a case, the weight 150 needs to be cleaned. Thus, when soldering using the weight 150, it is necessary to perform work related to the weight 150, which is very inconvenient. On the other hand, since the component mounting apparatus 10 is soldered in a state of being pressed by the pusher 88, it is not necessary to use the weight 150, which is very convenient.
  • the lead component 96 is not attached to the circuit base 12 in a state where the main body 100 is in contact with the surface of the circuit base 12, and the main body 100 is separated from the surface of the circuit base 12. It may be attached to the circuit substrate 12 in a state. Specifically, when the lead wire 98 of the lead component 96 is inserted into the through hole 140, as shown in FIG. 9, the main body portion 100 of the lead component 96 is separated from the upper surface of the circuit substrate 12, The lead component 96 is held by the claw portion 82 of the first component holder 76. At this time, the pusher 88 is not lowered, and the lead component 96 is not pressed by the pusher 88. Thus, in a state where the lead component 96 is held by the claw portion 82 of the first component holder 76, the solder jet device 120 jets molten solder toward the lead wire 98.
  • the molten solder jet is stopped.
  • the lead component 96 is held by the claw portion 82 of the first component holder 76 even after the molten solder jet is stopped until the solder is solidified. After the solder is solidified, the lead component by the claw portion 82 is held. The holding of 96 is released. As a result, the lead component 96 is attached to the circuit substrate 12 with the main body 100 being separated from the surface of the circuit substrate 12.
  • a bent portion 152 is formed at the center of the lead wire 98, and the bent portion 152 allows the main body portion 100 of the lead component 96 to be on the surface of the circuit substrate 12. It is away from. In this state, the lead component 96 is soldered by the solder jet device 120. In order to separate the main body 100 from the surface of the circuit base 12, it is necessary to form a bent portion 152 in the lead wire 98, It is very uneconomical. However, in the component mounting apparatus 10, since the first component holder 76 is soldered to the circuit substrate 12 while being held by the first component holder 76, it is necessary to form the bent portion 152 in the lead wire 98. It is economical.
  • the components other than the lead component 96 having the two lead wires 98 are held by the second component holder 108 as described above.
  • a lead component 164 composed of one lead wire 160 and a main body portion 162 is sandwiched by a pair of claw portions 112 in the main body portion 162. , Held by the second component holder 108.
  • the lead component 164 is a component that is mounted on the circuit base material 12 with the main body portion 162 being separated from the surface of the circuit base material 12, the lead wire 160 of the lead component 164 is inserted into the through hole 140, and the main body The part 162 is held by the claw part 112 of the second component holder 108 in a state where the part 162 is separated from the surface of the circuit substrate 12.
  • the solder jet device 120 jets the molten solder toward the lead wire 160. Then, after the molten solder jet is performed for a predetermined time, the molten solder jet is stopped. The lead component 164 is held by the claw portion 112 of the second component holder 108 even after the molten solder jet is stopped until the solder is solidified. After the solder is solidified, the lead component by the claw portion 112 is held. The holding of 164 is released. As a result, the lead component 164 is attached to the circuit base 12 with the main body 162 being separated from the surface of the circuit base 12.
  • a jig 168 is placed on the surface of the circuit substrate 12 in order to stabilize the lead component 164 in a state where the main body 162 is separated from the surface of the circuit substrate 12. Is placed, and the main body 162 is placed on the jig 168.
  • the lead component 164 can be soldered.
  • the component mounting apparatus 10 is soldered while being held by the second component holder 108, it is not necessary to use the jig 168, which is very convenient.
  • the lead component 170 shown in FIG. 13 includes three or more lead wires (six lead wires in the figure) 172 and a main body portion 174, and is sandwiched between the pair of claw portions 112 in the main body portion 174. As a result, the second component holder 108 holds it.
  • the lead component 170 is a component that is mounted on the circuit substrate 12 with the main body 174 in contact with the surface of the circuit substrate 12. For this reason, after the lead wire 172 of the lead component 170 is inserted into the through hole 140, the pair of claws 112 are separated by the operation of the opening / closing device 114, and the holding of the lead component 170 is released. Then, the pusher 116 is lowered by the operation of the lifting device 118. As a result, as shown in FIG. 13, the lead component 170 is pressed toward the circuit substrate 12, whereby the lead wire 172 is inserted into the through hole 140 to the root, and the main body 174 is attached to the surface of the circuit substrate 12. To touch.
  • the solder jet device 120 jets the molten solder toward the lead wire 172 in a state where the lead component 170 is pressed against the circuit substrate 12 by the pusher 116. Then, after the molten solder jet is performed for a predetermined time, the molten solder jet is stopped. The pressing of the lead component 170 by the pusher 116 is performed until the solder is solidified even after the jet of molten solder stops, and after the solder is solidified, the pressing of the lead component 170 by the pusher 116 is released. As described above, also in the second component holder 108, the lead component 170 can be soldered to the circuit substrate 12 without using the weight 150 by pressing the lead component 170 with the pusher 116.
  • the soldering work of the lead parts in the state of being pressed by the pushers 88 and 116 and the soldering work of the lead parts in the state of being held by the claws 82 and 112 are arbitrarily performed. It is possible to change to Specifically, for example, in the above description, the lead component 170 is mounted on the circuit base 12 with the main body portion 174 in contact with the surface of the circuit base 12, but the operation of the component mounting device 28 and the like is performed. By changing the program to be controlled, the lead component 170 can be mounted on the circuit base 12 with the main body 174 spaced from the surface of the circuit base 12. As described above, by arbitrarily changing the soldering operation using the pushers 88 and 116 and the soldering operation using the claw portions 82 and 112, it is possible to easily cope with a change in the type of circuit board to be produced. It becomes possible.
  • the program for controlling the operation of the component mounting device 28 and the like it is possible to change the pressing time by the pushers 88 and 116 after the solder jet stops or the holding time by the claw portions 82 and 112. is there. Further, the amount of separation between the main body portion of the lead component and the surface of the circuit substrate 12 can be changed by changing a program for controlling the operation of the component mounting device 28 and the like.
  • the control apparatus 130 has the work execution part 180 and the work change part 182 as shown in FIG.
  • the work execution unit 180 includes a soldering operation using the pusher 88 of the first component holder 76, a soldering operation using the claw portion 82 of the first component holder 76, and a pusher 116 of the second component holder 108.
  • This is a functional unit for selectively executing a soldering operation using the nail and a soldering operation using the claw portion 112 of the second component holder 108.
  • the work changing unit 182 is a functional unit for changing a soldering work set in advance to a predetermined lead component to another soldering work.
  • the component mounting apparatus 10 is an example of a substrate working machine.
  • the circuit substrate 12 is an example of a circuit substrate.
  • the claw portion 82 is an example of a holding device.
  • the pusher 88 is an example of a pressing device.
  • the claw portion 112 is an example of a holding device.
  • the pusher 116 is an example of a pressing device.
  • the solder jet device 120 is an example of a solder application device.
  • the moving device 122 is an example of a moving device.
  • the control device 130 is an example of a control device.
  • the through hole 140 is an example of a through hole.
  • the lead component 96 is an example of an electrical component.
  • the lead wire 98 is an example of a lead.
  • the lead wire 160 is an example of a lead.
  • the lead component 164 is an example of an electrical component.
  • the lead component 170 is an example of an electrical component.
  • the lead wire 172 is an example of a lead.
  • the work execution unit 180 is an example of a work execution unit.
  • the work change unit 182 is an example of a work change unit.
  • this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, molten solder is jetted toward the lead wire during the soldering operation, but the molten solder may be applied to the lead wire. That is, for example, the lead wire may be immersed in the solder bath 126.
  • the lead component is inserted from above the circuit substrate 12 and the molten solder is applied from below the circuit substrate 12.
  • the lead component is inserted from below the circuit substrate 12, and the circuit Molten solder may be applied from above the substrate 12.
  • the molten solder may be dropped onto the circuit substrate 12.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne une machine à travailler un substrat, au moyen de laquelle un travail d'application de revêtement au cours duquel une soudure fondue est appliquée à un fil conducteur (160) d'un composant conducteur (164) maintenu par un outil de retenue (108) et un travail d'application de revêtement au cours duquel la soudure fondue est appliquée au fil conducteur du composant conducteur comprimé par un poussoir (116) sont exécutés de manière sélective. Du fait de cette configuration, le composant conducteur étant maintenu par l'outil de retenue correspondant dans un état dans lequel une section de corps principale (162) du composant conducteur est soulevée depuis une matière de base de circuit (12), par exemple, le composant conducteur peut être alors soudé à un substrat de circuit avec la section de corps principale et la matière de base de circuit dans un état séparé. De plus, le composant conducteur étant comprimé sur la matière de base de circuit par le poussoir, par exemple, le composant conducteur peut être alors soudé sur le substrat de circuit dans un état dans lequel la section de corps principale et la matière de base du circuit ont été mis en contact. Du fait de cette configuration, le composant conducteur peut être soudé sur la matière de base de circuit sous différentes formes.
PCT/JP2014/076668 2014-10-06 2014-10-06 Machine à travailler un substrat et procédé de montage WO2016056045A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2014/076668 WO2016056045A1 (fr) 2014-10-06 2014-10-06 Machine à travailler un substrat et procédé de montage
JP2016552720A JP6521990B2 (ja) 2014-10-06 2014-10-06 対基板作業機、および装着方法

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PCT/JP2014/076668 WO2016056045A1 (fr) 2014-10-06 2014-10-06 Machine à travailler un substrat et procédé de montage

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3522687A4 (fr) * 2016-09-30 2020-07-08 Fuji Corporation Machine destinée à effectuer un travail sur un substrat, et procédé d'insertion

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JPS5875888A (ja) * 1981-10-30 1983-05-07 株式会社東芝 電子部品自動插入装置
JPH01133800U (fr) * 1988-03-04 1989-09-12
JP2003273502A (ja) * 2002-03-18 2003-09-26 Toyota Motor Corp 電子部品リードピン接合方法および電子部品リードピン接合装置
WO2014045370A1 (fr) * 2012-09-20 2014-03-27 富士機械製造株式会社 Machine de travail pour cartes à circuits imprimés et procédé de montage

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Publication number Priority date Publication date Assignee Title
JP3417509B2 (ja) * 1995-09-04 2003-06-16 アンデス電気株式会社 電子部品の半田付け方法及び半田噴流装置

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Publication number Priority date Publication date Assignee Title
JPS5875888A (ja) * 1981-10-30 1983-05-07 株式会社東芝 電子部品自動插入装置
JPH01133800U (fr) * 1988-03-04 1989-09-12
JP2003273502A (ja) * 2002-03-18 2003-09-26 Toyota Motor Corp 電子部品リードピン接合方法および電子部品リードピン接合装置
WO2014045370A1 (fr) * 2012-09-20 2014-03-27 富士機械製造株式会社 Machine de travail pour cartes à circuits imprimés et procédé de montage

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