WO2023148957A1 - Machine de travail de substrat et procédé de montage de composant - Google Patents

Machine de travail de substrat et procédé de montage de composant Download PDF

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Publication number
WO2023148957A1
WO2023148957A1 PCT/JP2022/004635 JP2022004635W WO2023148957A1 WO 2023148957 A1 WO2023148957 A1 WO 2023148957A1 JP 2022004635 W JP2022004635 W JP 2022004635W WO 2023148957 A1 WO2023148957 A1 WO 2023148957A1
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WO
WIPO (PCT)
Prior art keywords
component
attached
holder
held
board
Prior art date
Application number
PCT/JP2022/004635
Other languages
English (en)
Japanese (ja)
Inventor
晴章 前田
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/004635 priority Critical patent/WO2023148957A1/fr
Priority to CN202280086713.7A priority patent/CN118402328A/zh
Priority to JP2023578330A priority patent/JPWO2023148957A1/ja
Publication of WO2023148957A1 publication Critical patent/WO2023148957A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a board-to-board work machine or the like that mounts a component held by a component holder on a board on which pre-attached components are mounted.
  • the following patent document describes a technique for mounting a component held by a component holder on a board on which a pre-attached component is mounted.
  • An object is to appropriately mount a component held by a component holder on a board on which a pre-attached component is mounted.
  • the present specification provides a component holder that holds a component, a holder moving device that vertically moves the component holder, and an imaging device that captures an image of a pre-attached component mounted on a board.
  • image data obtained by imaging the pre-attached component by the imaging device when the component held by the component holder is mounted on the board on which the pre-attached component is mounted by operating the holder moving device; and a determination device for determining whether or not at least one of the component holder and the component held by the component holder interferes with the preceding component.
  • the present specification provides an imaging step of imaging a pre-attached component that is a component mounted on a substrate, and a component holder holding a new component by a holder moving device.
  • the imaging step determines the component holder and the a determination step of determining whether or not at least one of the new component held by the component holder interferes with the pre-attached component; and a mounting step in which the component holder mounts the new component on the board on which the pre-attached component is mounted when it is determined that the new component does not interfere with the pre-attached component.
  • Disclosed is a component mounting method for mounting a new component on an existing board.
  • the component held by a component holder when an image of a pre-attached component is captured by an imaging device, and a component held by a component holder is attached to a board on which the pre-attached component is attached, the component is captured based on the image data of the pre-attached component. It is determined whether or not at least one of the holder and the component held by the component holder interferes with the pre-attached component. As a result, the component held by the component holder can be appropriately mounted on the board on which the pre-attached component is mounted.
  • FIG. 10 is a diagram showing the lead component when mounted on a circuit board; It is a figure which shows the retrofitted component which interferes with a preliminarily attached component at the time of mounting
  • FIG. 10 is a diagram showing a suction nozzle that interferes with a pre-attached component when attaching the post-attached component; FIG.
  • FIG. 10 is a diagram showing a chuck that interferes with a pre-attached component when attaching the post-attached component. It is a figure which shows the tolerance
  • FIG. 10 is a diagram showing a plurality of pre-attached parts captured by a single image capturing by the mark camera;
  • the component mounter 10 is a device for mounting components on the circuit board 12 .
  • the component mounting machine 10 includes an apparatus main body 20, a substrate conveying/holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a bulk component supplying device 30, a component supplying device 32, and a control device (see FIG. 3) 36.
  • the circuit board 12 includes a circuit board, a three-dimensional structure base material, and the like, and the circuit board includes a printed wiring board, a printed circuit board, and the like.
  • the device main body 20 is composed of a frame 40 and a beam 42 suspended on the frame 40 .
  • the substrate conveying/holding device 22 is arranged in the center of the frame 40 in the front-rear direction, and has a conveying device 50 and a clamping device 52 .
  • the transport device 50 is a device that transports the circuit board 12
  • the clamp device 52 is a device that holds the circuit board 12 .
  • the substrate conveying/holding device 22 conveys the circuit substrate 12 and also holds the circuit substrate 12 fixedly at a predetermined position.
  • the direction in which the circuit board 12 is conveyed is called the X direction
  • the horizontal direction perpendicular to that direction is called the Y direction
  • the vertical direction is called the Z direction. That is, the width direction of the mounter 10 is the X direction, and the front-rear direction is the Y direction.
  • the component mounting device 24 is arranged on the beam 42 and has two working heads 60 , 62 and a working head moving device 64 .
  • Each working head 60, 62 has a part holder (see FIG. 2) 66 by which a part is held.
  • the working head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72, as shown in FIG. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70 .
  • the working heads 60, 62 are detachably attached to sliders 74, 76, and the Z-direction moving device 72 moves the sliders 74, 76 individually in the vertical direction. That is, the working heads 60 and 62 are individually moved vertically by the Z-direction moving device 72 .
  • the mark camera 26 is attached to the slider 74 while facing downward, and is moved together with the working head 60 in the X, Y and Z directions. Thereby, the mark camera 26 images an arbitrary position on the frame 40 .
  • the parts camera 28 is arranged facing upward between the substrate conveying/holding device 22 and the parts supplying device 32 on the frame 40. As shown in FIG. Thereby, the parts camera 28 images the parts held by the part holders 66 of the working heads 60 and 62 .
  • the bulk part supply device 30 is arranged at one end of the frame 40 in the front-rear direction.
  • the discrete component supply device 30 is a device that aligns a plurality of scattered components and supplies aligned components. In other words, it is a device that aligns a plurality of parts in arbitrary postures in a predetermined posture and supplies the components in the predetermined posture.
  • the component supply device 32 is arranged at the other end of the frame 40 in the front-rear direction.
  • the component supply device 32 has a tray type component supply device 86 and a feeder type component supply device 88 .
  • the tray-type component supply device 86 is a device that supplies components placed on a tray (not shown).
  • the feeder-type component supply device 88 is a device that supplies components using a tape feeder 90 .
  • the control device 36 includes a controller 100, a plurality of drive circuits 102, an image processing device 104, and a control circuit 106, as shown in FIG.
  • a plurality of drive circuits 102 are connected to the conveying device 50, the clamping device 52, the working heads 60 and 62, the working head moving device 64, the tray-type component supply device 86, the feeder-type component supply device 88, and the bulk component supply device 30.
  • the controller 100 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 102 . Accordingly, the controller 100 controls the operations of the substrate conveying/holding device 22, the component mounting device 24, and the like.
  • the controller 100 is also connected to the image processing device 104 .
  • the image processing device 104 processes image data obtained by the mark camera 26 and the parts camera 28, and the controller 100 obtains various information from the image data. Further, controller 100 is connected to display device 108 via control circuit 106 . An arbitrary image is thereby displayed on the display device 108 by the controller 100 .
  • a production program 110 is stored in the controller 100 , and the controller 100 controls the operations of the substrate conveying/holding device 22 , the component mounting device 24 , and the like according to the production program 110 , so that the components on the circuit substrate 12 are mounted on the circuit board 12 . to carry out the installation work.
  • Various components can be mounted on the circuit board 12 by the component mounter 10. A case where the lead component (see FIG. 4) 120 is mounted on the circuit board 12 will be described below.
  • the substrate conveying/holding device 22 conveys the circuit substrate 12 to the working position, and the clamping device 52 holds the circuit substrate 12 fixedly at that position. to hold.
  • the mark camera 26 moves above the circuit board 12 and takes an image of the circuit board 12 according to the command of the controller 100 according to the production program 110 .
  • the controller 100 acquires information about the positions of the pair of through holes (see FIG. 4) 122 formed in the circuit board 12 .
  • the bulk parts supply device 30 or the parts supply device 32 supplies the lead parts 120 at a predetermined supply position.
  • the lead component 120 includes a generally block-shaped component body 126 and two leads 128 extending from the bottom surface of the component body 126, as shown in FIG.
  • One of the working heads 60 and 62 is moved above the component supply position by a command from the controller 100 according to the production program 110 , and the component holder 66 holds the lead component 120 .
  • a suction nozzle 66 a is employed as the component holder 66 , and the suction nozzle 66 a sucks and holds the component body 126 of the lead component 120 .
  • the work heads 60 and 62 are moved above the parts camera 28 by commands from the controller 100 according to the production program 110, and the parts camera 28 images the lead parts 120 held by the suction nozzle 66a. This provides information about the tip positions of the pair of leads 128 .
  • the work heads 60 and 62 are moved above the circuit board 12 by commands from the controller 100 in accordance with the production program 110, and positional deviation of the held components by the suction nozzles 112 is corrected by the circuit board. 12, and the tip position of the lead 128 of the lead component 120 held by the suction nozzle 66a.
  • the working heads 60 and 62 are moved so that the positions of the pair of through holes 122 and the tip positions of the pair of leads 128 are aligned in the vertical direction by a command from the controller 100 according to the production program 110,
  • the working heads 60, 62 are lowered vertically.
  • the tips of the pair of leads 128 of the lead component 120 are inserted into the pair of through holes 122 of the circuit board 12, as shown in FIG.
  • the lead component 120 is mounted on the circuit board 12 by inserting the lead 128 of the lead component 120 into the through hole 122 of the circuit board 12 .
  • the lead component 120 attached to the circuit board 12 may tilt or fall due to deformation of the lead 128 or the like, as shown in FIG.
  • the lead component 120 is mounted on the circuit board 12 in a state protruding from the intended mounting position.
  • the lead component 120 mounted on the circuit board 12 tilts and protrudes from the planned mounting position of the component 150a, so that the component 150a interferes with the protruding lead component 120.
  • FIG. 5 the lead component 120 mounted on the circuit board 12 tilts and protrudes from the planned mounting position of the component 150a, so that the component 150a interferes with the protruding lead component 120.
  • the component holder 66 that holds the component 150 projects from the side surface of the component 150 in a horizontal area although the vertical direction is different, the component 150 is not the component 150 held by the component holder 66. There is a risk that the component holder 66 that holds the component will interfere with the lead component 120 .
  • the suction nozzle 66a that holds the component 150b protrudes from the side surface of the component 150b in a horizontal area. Therefore, when the component 150b held by the suction nozzle 66a is mounted next to the lead component 120 after the lead component 120 is mounted on the circuit board 12, the component 150b held by the suction nozzle 66a is not a lead component.
  • the suction nozzle 66a holding the component 150b may interfere with the lead component 120.
  • FIG. 8 when the component 150c is held by the chuck 66b instead of the suction nozzle 66a, a pair of opposing side surfaces of the component 150c are held by a pair of gripping claws 156 of the chuck 66b. Therefore, the chuck 66b holding the component 150c protrudes from the side surface of the component 150c in a horizontal area. Therefore, when the component 150c held by the chuck 66b is mounted next to the lead component 120 after the lead component 120 is mounted on the circuit board 12, the component 150c held by the chuck 66b does not interfere with the lead component.
  • the chuck 66b holding the component 150c may interfere with the lead component 120.
  • FIG. 8 the gripping claws 156 of the chuck 66 b interfere with the lead component 120 in FIG. 8 , the chuck body 158 of the chuck 66 b may interfere with the lead component 120 .
  • the component 150 held by the component holder 66 is mounted next to the lead component 120 after the lead component 120 is mounted on the circuit board 12, the component 150 held by the component holder 66 is , and at least one of the component holder 66 that holds the component 150 may interfere with the lead component. That is, when the component 150 held by the component holder 66 is mounted next to the lead component 120 after the lead component 120 is mounted on the circuit board 12, the component holder 66 descends to remove the component 150 from the circuit board. At least one of the component 150 and the component holder 66 may interfere with the already mounted lead component until it is mounted on the material 12 .
  • any one of the lead component 120, the component 150, and the component holder 66 may be damaged. Further, not only the lead component 120 but also a component having no lead may be mounted at a position shifted from the planned mounting position of the circuit board. That is, when the component 150 held by the component holder 66 is to be mounted next to a component having no lead already mounted at a position shifted from the intended mounting position, the component held by the component holder 66 At least one of 150 and component holder 66 that holds component 150 may interfere with an already mounted component.
  • post-attached parts the components held by the component holder 66 (hereinafter referred to as “post-attached parts”) are placed next to the components previously mounted on the circuit board 12 (hereinafter referred to as “pre-attached parts").
  • pre-attached parts there is a risk that at least one of the post-attached component and the component holder that holds the post-attached component will interfere with the pre-attached component. In such a case, any one of the pre-attached part, the post-attached part, and the part holder may be damaged.
  • the mounter 10 when a post-mounted component is mounted next to a pre-mounted component, the component holder is mounted based on image data obtained by imaging the pre-mounted component with the mark camera 26. It is determined whether or not at least one of the post-attachment component and the component holder 66 interferes with the pre-attachment component when the post-attachment component held by 66 is mounted. Specifically, first, the allowable range of the position where the pre-attached component is attached is based on the planned attachment position of the pre-attached component and the expected attachment position of the post-attached component scheduled to be attached next to the pre-attached component. set. For example, referring to FIG.
  • FIG. 9 which is a perspective view of a circuit board on which a plurality of components are to be mounted, a planned mounting position 160 of a pre-attached component and a plurality of post-attached components to be mounted next to the pre-attached component are shown.
  • the allowable range 168 of the position where the pre-attached component is to be mounted is set based on the expected component mounting position 162 .
  • Preliminary component mounting positions 160 and retrofitted component mounting positions 162 are programmed in the production program 110, and based on the production program 110, the preliminarily mounted component mounting positions 160 and the retrofittable components are mounted.
  • a planned position 162 is displayed on the display device 108 .
  • the retrofitted component to be mounted at the mounting position 162a is mounted on the circuit board while being held by the suction nozzle 66a.
  • the suction nozzle 66a holding the retrofitted component protrudes from the side surface of the retrofitted component in the horizontal area.
  • the permissible range 168 of the mounting position of the pre-attached component includes the planned mounting position 160 of the pre-attached component, the planned mounting position 162a of the post-attached component, and the horizontal area of the suction nozzle protruding from the side surface of the post-attached component. It is set at a position a predetermined distance away from the planned mounting position 162a of the retrofitted component.
  • the allowable range 168 of the mounting position of the pre-attached component includes the planned mounting position 160 of the pre-attached component, the planned mounting position 162b of the post-attached component, and the horizontal dimension of the suction nozzle protruding from the side surface of the post-attached component. Considering this, it is set at a position a predetermined distance away from the planned mounting position 162b of the retrofitted component.
  • the suction nozzle 66a holding the retrofitted component is positioned in the horizontal area. Do not protrude from the side of the part. For this reason, the allowable range 168 of the mounting position of the pre-attached component is set to a position separated by a predetermined clearance from the planned mounting position 162c of the post-attached component without considering the horizontal dimension of the suction nozzle.
  • the retrofitted component scheduled to be mounted at the scheduled mounting position 162d is held by the chuck 66b and mounted on the circuit board, the retrofitted component is clamped by the pair of gripping claws 156 of the chuck 66b.
  • the chuck 66b that holds the retrofit projects from the side of the retrofit in a horizontal area.
  • the allowable range 168 of the mounting position of the pre-attached component is set at a predetermined distance away from the planned mounting position 162d of the post-attached component in consideration of the horizontal dimension of the chuck 66b.
  • the retrofitted component scheduled to be mounted at the scheduled mounting position 162e is also held by the chuck 66b and mounted on the circuit board.
  • the allowable range 168 of the mounting position of the pre-attached component is set at a predetermined distance from the planned mounting position 162e of the post-attached component, taking into account the horizontal dimension of the chuck 66b.
  • the allowable range 168 of mounting position of the pre-attached component is not set for all the components scheduled to be mounted on the circuit board 12, but for any of all the components scheduled to be mounted on the circuit board 12.
  • Arbitrary parts among all the parts to be mounted on the circuit board 12 include, for example, lead parts, parts other than lead parts, parts with a high height dimension, parts with a small bottom area, and the like. are exemplified.
  • the permissible range 168 of the mounting position of the tipped component may be manually set by the operator or automatically set by the controller 100 . That is, for example, the operator may set the allowable range 168 by operating the display device 108 in consideration of the dimensions of the suction nozzle 66a and the like. Alternatively, the controller 100 may calculate and automatically set the allowable range 168 based on the dimensions of the suction nozzle 66a and the like.
  • the permissible range 168 of the mounting position of the pre-attached part is set, the permissible range 168 corresponding to the pre-attached part is programmed in the production program 110 .
  • the mark camera 26 captures an image of the pre-attached component that has already been attached in the vicinity of the planned position where the post-attached component is to be attached before the post-attached component is attached. As shown in FIG.
  • the mark camera 26 captures an image of a plurality of pre-attached components 170 in the vicinity of the predetermined attachment position where the post-attached component is to be attached. In other words, the mark camera 26 captures images of a plurality of tipped components 170 in one shot.
  • the dotted line 172 indicates the planned mounting position of the retrofitted part, and the dotted line 172 is not shown in the image taken by the mark camera 26, but it is not shown in the image taken by the mark camera 26 once. Dotted lines 172 are shown in FIG. 10 to indicate that a plurality of pre-attached components 170 are imaged by the above-mentioned method, and the intended mounting positions of the post-attached components are also imaged.
  • the controller 100 analyzes the captured imaging data and calculates the mounting position of the pre-attached component. Then, the controller 100 determines whether or not the mounting position of the pre-attached component falls within the allowable range 168 . At this time, when it is determined that the mounting position of the pre-attached component is within the area of the allowable range 168, the controller 100, when mounting the post-attached component on the circuit board, separates the post-attached component and the post-attached component. It is determined that at least one of the component holder 66 that holds the .
  • the controller 100 moves the retrofitted component and the component holder before the component holder 66 that holds the retrofitted component descends toward the upper surface of the circuit board and mounts the retrofitted component on the circuit board 12 . 66 does not interfere with the pre-attached part. Then, when the controller 100 determines that at least one of the retrofitted component and the component holder 66 does not interfere with the pre-attached component, the post-attached component is mounted.
  • the controller 100 determines that at least one of the post-attached part and the part holder 66 interferes with the pre-attached part when the attached part is attached. That is, the controller 100 controls at least one of the retrofitted component and the component holder 66 until the retrofitted component is mounted on the circuit board 12 after the component holder 66 that holds the retrofitted component is lowered. is determined to interfere with the pre-attached part.
  • the controller 100 does not perform the mounting operation of the post-attached component. Then, the controller 100 displays an error screen on the display device 108 to the effect that the installation work of the retrofit component was not executed.
  • the postmounted component and the postmounted component can be It is possible to appropriately prevent at least one of the component holder 66 from interfering with the pre-attached component.
  • the mark camera 26 captures images of a plurality of pre-attached components in one shot. In other words, the mark camera 26 collectively images a plurality of pre-attached parts. As a result, it is possible to reduce the number of times of imaging the pre-attached component and shorten the time required for imaging the pre-attached component.
  • a plurality of post-attached parts to be attached around the one pre-attached part are based on the imaging data of the one pre-attached part. It is determined whether or not there is interference between each of the retrofitted parts and the component holders that hold the respective retrofitted parts. In other words, based on one piece of imaging data, it is determined whether or not there is interference when mounting a plurality of retrofitted components. This also makes it possible to reduce the number of times the pre-attached component is imaged and shorten the time required to image the pre-attached component.
  • the component mounter 10 is an example of a work machine for board.
  • the mark camera 26 is an example of an imaging device.
  • the component holder 66 is an example of a component holder.
  • the Z-direction moving device 72 is an example of a holder moving device.
  • Controller 100 is an example of a determination device.
  • the lead component 120 is an example of a pre-attached component.
  • Part 150 is an example of a new part.
  • a plurality of pre-attached components are captured by the mark camera 26 once, but one pre-attached component may be captured by the mark camera 26 once.
  • the pre-attached component imaged by the mark camera 26 may be imaged in its entirety, or may be imaged in part.
  • it is preferable that the imaged pre-attached component is imaged together with the planned mounting position where the post-attached component is attached, but the pre-attached component imaged together with the pre-attached component is also imaged at the planned attachment position of the area.
  • the mark camera in the above embodiment may be an imaging device with a wider field of view regardless of the type of camera.
  • the presence or absence of interference during attachment of a plurality of post-attached parts is determined based on the imaging data of one pre-attached part, but based on the imaging data of one pre-attached part, It may be determined whether or not there is interference when mounting one retrofitted component.
  • At least one of the retrofitted component and the component holder 66 is moved while the component holder 66 is lowered toward the circuit board and the retrofitted component is mounted on the circuit board 12 . interference with the pre-attached component. You can judge.
  • the post-mounted component is mounted next to the pre-mounted component by the component mounter 10.
  • the post-mounted component may be mounted next to the pre-mounted component by the component mounter 10.
  • At least one of the post-attached component and the component holder 66 is pre-attached before the component holder 66 is lowered in the vertical direction and the post-attached component is mounted on the circuit board 12 .
  • the component holder 66 is lowered obliquely downward until the component is attached to the circuit board 12 . may interfere with the pre-attached component.
  • Component mounter working machine for board
  • 26 Mark camera (imaging device)
  • 66 Component holder
  • 72 Z-direction moving device (holding device moving device)
  • Controller Controller
  • 120 Lead component (preliminary Parts) 150: Parts (new parts)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne une machine de travail de substrat comprenant : un support de composant qui supporte un composant ; un dispositif de déplacement de support qui déplace le support de composant dans les directions du haut et du bas ; un dispositif d'imagerie qui prend des images d'un composant précédemment monté sur le substrat ; et un dispositif de détermination qui, lorsque le dispositif de déplacement de support est activé pour monter le composant supporté par le support de composant sur le substrat sur lequel le composant précédemment monté est monté, détermine si le support de composant et/ou le composant supporté par le support de composant interféreront avec le composant précédemment monté, sur la base des données d'imagerie obtenues par les images du composant précédemment monté prises par le dispositif d'imagerie.
PCT/JP2022/004635 2022-02-07 2022-02-07 Machine de travail de substrat et procédé de montage de composant WO2023148957A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/004635 WO2023148957A1 (fr) 2022-02-07 2022-02-07 Machine de travail de substrat et procédé de montage de composant
CN202280086713.7A CN118402328A (zh) 2022-02-07 2022-02-07 对基板作业机及元件安装方法
JP2023578330A JPWO2023148957A1 (fr) 2022-02-07 2022-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/004635 WO2023148957A1 (fr) 2022-02-07 2022-02-07 Machine de travail de substrat et procédé de montage de composant

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WO2023148957A1 true WO2023148957A1 (fr) 2023-08-10

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CN (1) CN118402328A (fr)
WO (1) WO2023148957A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176299A (ja) * 2000-09-26 2002-06-21 Matsushita Electric Ind Co Ltd 部品実装装置、部品実装方法、および記録媒体
JP2003243898A (ja) * 2002-02-13 2003-08-29 Yamaha Motor Co Ltd 実装機、実装方法
JP2016058605A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176299A (ja) * 2000-09-26 2002-06-21 Matsushita Electric Ind Co Ltd 部品実装装置、部品実装方法、および記録媒体
JP2003243898A (ja) * 2002-02-13 2003-08-29 Yamaha Motor Co Ltd 実装機、実装方法
JP2016058605A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法

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JPWO2023148957A1 (fr) 2023-08-10

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