WO2014032315A1 - 一种玻璃基板切割装置和方法 - Google Patents

一种玻璃基板切割装置和方法 Download PDF

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Publication number
WO2014032315A1
WO2014032315A1 PCT/CN2012/080957 CN2012080957W WO2014032315A1 WO 2014032315 A1 WO2014032315 A1 WO 2014032315A1 CN 2012080957 W CN2012080957 W CN 2012080957W WO 2014032315 A1 WO2014032315 A1 WO 2014032315A1
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WIPO (PCT)
Prior art keywords
cutting
glass substrate
waterjet
water
water knife
Prior art date
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PCT/CN2012/080957
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English (en)
French (fr)
Inventor
齐明虎
吴俊豪
林昆贤
汪永强
李贤德
郭振华
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/641,100 priority Critical patent/US20140060274A1/en
Publication of WO2014032315A1 publication Critical patent/WO2014032315A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00—Combinations of several similar cutting apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0591—Cutting by direct application of fluent pressure to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction

Definitions

  • the present invention relates to the field of manufacturing liquid crystal panels, and in particular to a liquid crystal display device, a backlight module thereof, and a backplane frame.
  • the process of the liquid crystal panel can be divided into a front Array process, a middle CELL process, and a rear LCM (liquid crystal module) process.
  • the middle CELL process is mainly the glass of the previous stage Array as a substrate, which is combined with the color filter, and the liquid crystal is poured on the glass substrate, and then cut into the required size.
  • a high-permeability glass cutter wheel is usually used to cut the glass substrate, but during the cutting process, since the contact surface of the cutter wheel and the glass substrate is very sharp, and the cutter wheel runs at a high speed, the cutter wheel wears a large amount and needs frequent Replacement, which increases production costs while reducing production efficiency.
  • the technical problem to be solved by the embodiments of the present invention is to provide a glass substrate cutting device and method, which can improve the efficiency of cutting a glass substrate and reduce the cost.
  • a glass substrate cutting device which comprises: a cutting assembly, a high-pressure water source and a first control unit.
  • the cutting assembly includes a first water knife and a second water knife for providing a high pressure water jet; the high pressure water source is for supplying high pressure water to the first water knife and the second water knife; the first control unit is for controlling the first water knife and The movement of the second waterjet.
  • the glass substrate cutting device further comprises a second control unit for controlling the flow rate and pressure of the high pressure water jet.
  • the second control unit is a valve.
  • the high pressure water jet contains an abrasive.
  • the first control unit controls the first water knife and the second water knife to be respectively disposed at two ends of the cutting line of the glass substrate; the first water knife and the second water knife move toward each other, and the glass substrate is synchronously cut along the cutting line;
  • the water knife is cut to the preset stop point, the cutting is stopped first, and the cutting is continued by the second water knife until the cutting point is cut to complete the cutting along the cutting line.
  • the first water knife and the second water knife are located on both sides of the glass substrate, and the preset stopping point is adjacent to the midpoint of the cutting line and is closer to the first water knife setting.
  • the first control unit includes a charge coupled component positioning device to position the first waterjet and the second waterjet such that the first waterjet and the second waterjet are aligned with the cutting line.
  • the glass substrate is fixedly placed horizontally.
  • another technical solution adopted by the embodiment of the present invention is to provide a method for cutting a glass substrate.
  • the first control unit controls the first water knife and the second water knife to be respectively disposed at two ends of the cutting line of the glass substrate; the first water knife and the second water knife move toward each other, and the glass substrate is synchronously cut along the cutting line;
  • the water knife is cut to the preset stop point, the cutting is stopped first, and the cutting is continued by the second water knife until the cutting point is cut to complete the cutting along the cutting line.
  • first water knife and the second water knife are located on both sides of the glass substrate.
  • the first water knife and the second water knife are located on the same side of the glass substrate, wherein, when the first water knife is cut to a preset stopping point, after the cutting is stopped first, the first water knife is moved backward to avoid The second water jet creates interference.
  • the preset stopping point is adjacent to the midpoint of the cutting line and is closer to the first water knife setting.
  • the first control unit includes a charge coupled component positioning device to position the first waterjet and the second waterjet such that the first waterjet and the second waterjet are aligned with the cutting line.
  • the glass substrate is fixedly placed horizontally.
  • the first water knife and the second water knife are respectively disposed at two ends of the cutting line of the glass substrate by the first control unit, and the first water knife and the second water knife synchronously cut the glass substrate along the opposite movement of the cutting line.
  • the first water knife stops cutting at the preset stopping point, and the cutting is completed by the second water knife, and the first water knife and the second water knife have no contact with the glass substrate, and no abrasion occurs, which can improve the efficiency of cutting the glass substrate and reduce the efficiency. cost.
  • FIG. 1 is a schematic structural view of an embodiment of a glass substrate cutting device of the present invention
  • FIG. 2 is a schematic perspective view showing the glass substrate of the glass substrate cutting device shown in FIG. 1;
  • FIG. 3 is a front elevational view showing the glass substrate cutting device of FIG. 2 cutting a glass substrate
  • FIG. 4 is a schematic structural view of the glass substrate cutting device shown in FIG. 2 cutting a glass substrate to a predetermined stopping point;
  • Figure 5 is a flow chart of an embodiment of a method of cutting a glass substrate of the present invention.
  • FIG. 1 is a schematic structural view of an embodiment of a glass substrate cutting device of the present invention
  • FIG. 2 is a schematic perspective view showing a glass substrate cutting device of FIG.
  • FIG. 2 also shows a glass substrate 100.
  • the glass substrate cutting device includes a cutting assembly 20, a high pressure water source 30, and a first control unit 40.
  • the cutting assembly 20 includes a first water knife 202 and a second water knife 203.
  • the first water knife 202 and the second water knife 203 each include a nozzle 201.
  • the nozzle 201 can be made of cemented carbide, sapphire, ruby or the like. Very small, up to 0.05 mm.
  • the high-pressure water source 30 is used to supply the first water knife 202 and the second water knife 203 with high-pressure water.
  • the high-pressure water source 30 is an ultra-high pressure water pump.
  • the high-pressure water source 30 can also It is another device capable of generating high-pressure water, which is not limited by the present invention.
  • the high pressure water produced by the high pressure water source 30 is very fast, and the pressure of the water jet can reach 1700 MPa when passing through the nozzle 201, so that the glass substrate can be cut. It is worth noting that in the present embodiment, the water jet is also added.
  • the high pressure water source 30 further includes a water delivery conduit 301 for conveying the high pressure water produced by the high pressure water source 30 to the first water knife 202 and the second water knife 203.
  • the first control unit 40 is for controlling the movement of the first water knife 202 and the second water knife 203.
  • the first control unit 40 controls the speed, direction, and stop, motion, and the like of the first water knife 202 and the second water knife 203 to enable the first water knife 202 and the second water knife 203 to cut the glass accurately and efficiently.
  • a substrate wherein the first control unit 40 further includes a driving unit and a CCD (Charge-coupled Device, charge coupled device positioning device (not shown), in this embodiment, the driving unit is a motor, of course, other devices that can drive the movement of the first water knife 202 and the second water knife 203, the present invention This is not limited.
  • CCD Charge-coupled Device, charge coupled device positioning device
  • the glass substrate cutting device of the present invention may further include a second control unit 50 for controlling the flow rate and pressure of the high pressure water jet to accommodate different pressures and flows of the cut glass substrate of different thicknesses and materials.
  • the second control unit 50 is preferably a valve, which may be a manually adjustable structure or an automatically adjustable structure.
  • the glass substrate cutting device of the embodiment cuts the glass substrate by the high-pressure water jet generated by the first water jet and the second water jet, and the first water jet and the second water jet do not directly contact the glass substrate to generate wear, and the glass substrate is cut.
  • the device can be used for a long time, thereby reducing costs.
  • FIG. 5 is a flow chart of an embodiment of a method of cutting a glass substrate according to the present invention.
  • Step S101 The first control unit 40 controls the first water knife 202 and the second water knife 203 to be respectively disposed at two ends of the cutting line of the glass substrate 100;
  • FIG. 3 is a front view of the glass substrate cutting device shown in FIG.
  • the glass substrate 100 is placed in a horizontally fixed position.
  • the glass substrate 100 can be placed in other fixed states without affecting the cutting, which is not limited in the present invention.
  • the first water knife 202 and the second water knife 203 may be located on both sides or the same side of the glass substrate, and the first water knife 202 and the second water knife 203 are positioned by the CCD, so that the first water knife 202 and the second water knife 203 is aligned with the cutting line.
  • Step S102 the first waterjet 202 and the second waterjet 203 move toward each other, and cut the glass substrate 100 synchronously along the cutting line;
  • Step S103 When the first water knife 202 is cut to the preset stop point T, the cutting is stopped first, and the cutting is continued by the second water knife 203 until the cutting point T is cut to complete all the cutting along the cutting line.
  • FIG. 4 is a schematic structural view of the glass substrate cutting device shown in FIG. 2 cutting the glass substrate to a preset stopping point.
  • the preset stop point T is adjacent to the midpoint of the cutting line and is closer to the first water knife 202.
  • the specific position of the preset stop point T can be set according to actual conditions, which is not limited by the present invention.
  • first water knife 202 and the second water knife 203 are the same, and for the sake of clarity, they are named as the first water knife 202 and the second water knife 203, but actually In use, the positional relationship of the first waterjet 202 and the second waterjet 203 can be interchanged without affecting the implementation of the present invention.
  • the first water knife and the second water knife are respectively disposed at two ends of the cutting line of the glass substrate by the first control unit, and the first water knife and the second water knife synchronously cut the glass substrate along the opposite movement of the cutting line.
  • the first water jet stops cutting at the preset stop point, and the cutting is completed by the second water jet, which can improve the efficiency of cutting the glass substrate.

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

一种玻璃基板切割装置和方法
【技术领域】
本发明涉及液晶面板制造技术领域，具体是涉及一种液晶显示装置及其背光模组和背板框架。
【背景技术】
液晶面板的制程可分为前段Array(阵列)制程、中段CELL(基板)制程以及后段LCM(液晶模组)制程。其中，中段CELL制程主要是以前段Array的玻璃为基板，让其与彩色滤光片结合，并在玻璃基板上灌注液晶，而后切割成所需要的尺寸。
现有技术中，通常采用高渗透玻璃刀轮来切割玻璃基板，但在切割过程中，由于刀轮与玻璃基板的接触面非常锋利，且刀轮高速运转，导致刀轮磨损较大而需经常更换，这样增加了生产成本，同时降低了生产效率。
【发明内容】
本发明实施例主要解决的技术问题是提供一种玻璃基板切割装置和方法，能够提高切割玻璃基板的效率，降低成本。
为解决上述技术问题，本发明实施例采用的一个技术方案是：提供一种玻璃基板切割装置，其包括：切割组件、高压水源以及第一控制单元。切割组件包括用于提供高压水射流的第一水刀和第二水刀；高压水源用于向第一水刀和第二水刀提供高压水；第一控制单元用于控制第一水刀和第二水刀的运动。
其中，玻璃基板切割装置还包括第二控制单元，用于控制高压水射流的流量及压力。
其中，第二控制单元为阀门。
其中，高压水射流中含有研磨剂。
为解决上述技术问题，本发明实施例采用的另一个技术方案是：提供一种玻璃基板的切割方法。其包括：第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两端；第一水刀和第二水刀相向运动，沿切割线同步切割玻璃基板；第一水刀切割至预设的停止点时，先行停止切割，由第二水刀继续切割，直到切割至停止点为止，以沿切割线完成全部切割。其中，第一水刀和第二水刀位于玻璃基板的两侧，预设的停止点临近切割线的中点且更靠近第一水刀设置。
其中，第一控制单元包括电荷耦合元件定位装置，以对第一水刀和第二水刀进行定位，使得第一水刀和第二水刀与切割线对齐。
其中，玻璃基板水平固定放置。
为解决上述技术问题，本发明实施例采用的又一个技术方案是：提供一种玻璃基板的切割方法。其包括：第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两端；第一水刀和第二水刀相向运动，沿切割线同步切割玻璃基板；第一水刀切割至预设的停止点时，先行停止切割，由第二水刀继续切割，直到切割至停止点为止，以沿切割线完成全部切割。
其中，第一水刀和第二水刀位于玻璃基板的两侧。
其中，第一水刀和第二水刀位于玻璃基板的同侧，其中，在第一水刀切割至预设的停止点时，先行停止切割之后，第一水刀做后退运动，以避免与第二水刀产生干涉。
其中，预设的停止点临近切割线的中点且更靠近第一水刀设置。
其中，第一控制单元包括电荷耦合元件定位装置，以对第一水刀和第二水刀进行定位，使得第一水刀和第二水刀与切割线对齐。
其中，玻璃基板水平固定放置。
本发明实施例通过第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两端，第一水刀和第二水刀沿切割线相向运动同步切割玻璃基板，第一水刀在预设停止点停止切割，由第二水刀完成切割，并且第一水刀和第二水刀与玻璃基板无接触，不会产生磨损，能够提高切割玻璃基板的效率，降低成本。
【附图说明】
图1是本发明的玻璃基板切割装置实施例的结构示意图；
图2是图1所示的玻璃基板切割装置切割玻璃基板的立体结构示意图；
图3是图2所示的玻璃基板切割装置切割玻璃基板的主视示意图；
图4是图2所示的玻璃基板切割装置切割玻璃基板至预设的停止点时的结构示意图；
图5是本发明一种切割玻璃基板的方法实施例的流程图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细描述。
请结合参阅图1和图2，图1是本发明的玻璃基板切割装置实施例的结构示意图；图2是图1所示的玻璃基板切割装置切割玻璃基板的立体结构示意图。为清楚显示，图2还示出了玻璃基板100。该玻璃基板切割装置包括切割组件20、高压水源30以及第一控制单元40。
切割组件20包括第一水刀202和第二水刀203，第一水刀202和第二水刀203均包含喷嘴201，喷嘴201可采用硬质合金、蓝宝石、红宝石等材料做成，喷口直径非常小，可达0.05毫米。
高压水源30用于向第一水刀202和第二水刀203提供高压水，在本实施例中，高压水源30为超高压水泵，当然，在其他备选实施例中，高压水源30也可以是其他能产生高压水的装置，本发明对此不作限定。高压水源30产生的高压水的速度非常快，在通过喷嘴201时水射流的压力可达到1700兆帕，以至于能够切割玻璃基板，值得注意的是，在本实施例中，水射流中还添加了研磨剂，如石榴沙、金刚石沙等，利用研磨剂的高硬度及切削作用，可以更有效率地切割玻璃基板。高压水源30进一步还包括输水管道301，用于传输高压水源30产生的高压水至第一水刀202和第二水刀203。
第一控制单元40用于控制第一水刀202和第二水刀203的运动。第一控制单元40对第一水刀202和第二水刀203的速度、方向以及停止、运动等状态进行控制，以使得第一水刀202和第二水刀203能够精确且高效地切割玻璃基板，其中，第一控制单元40还包括驱动单元和CCD（Charge-coupled Device，电荷耦合元件定位装置）（图未示），在本实施例中，驱动单元为马达，当然，也可以是其他可驱动第一水刀202和第二水刀203运动的装置，本发明对此不作限定。
本发明的玻璃基板切割装置可进一步包括第二控制单元50，第二控制单元50用于控制高压水射流的流量及压力，以适应不同厚度、不同材质的切割玻璃基板需要不同的压力和流量。在本实施例中，第二控制单元50优选为阀门，该阀门可以是手动可调结构或自动可调结构。
本实施例的玻璃基板切割装置通过第一水刀和第二水刀产生的高压水射流对玻璃基板进行切割，第一水刀和第二水刀不直接与玻璃基板接触产生磨损，玻璃基板切割装置能够长久使用，从而能够降低成本。
请参阅图5，图5是本发明一种切割玻璃基板的方法实施例的流程图。
步骤S101：第一控制单元40控制第一水刀202和第二水刀203分别置于玻璃基板100的切割线的两端；
请结合参阅图3，图3是图2所示的玻璃基板切割装置的主视示意图。其中，在本实施例中，玻璃基板100为水平固定放置，当然，在不影响切割的情况下，玻璃基板100也可以置于其他固定状态，本发明对此不作限定。第一水刀202和第二水刀203可位于玻璃基板的两侧或同侧，由CCD对第一水刀202和第二水刀203进行定位，使得第一水刀202和第二水刀203与切割线对齐。
步骤S102：第一水刀202和第二水刀203相向运动，沿切割线同步切割玻璃基板100；
步骤S103：第一水刀202切割至预设的停止点T时，先行停止切割，由第二水刀203继续切割，直到切割至停止点T为止，以沿切割线完成全部切割。
请结合参阅图4，图4是图2所示的玻璃基板切割装置切割玻璃基板至预设的停止点时的结构示意图。其中，预设的停止点T临近切割线的中点且更靠近第一水刀202设置，预设的停止点T的具体位置可根据实际情况进行设置，本发明对此不作限定。当第一水刀202切割至预设的停止点T时，先行停止切割，并且第一水刀202做后退运动，以避免产生干涉，由第二水刀203完成全部切割。值得注意的是，在本实施例中，第一水刀202和第二水刀203的结构是相同的，为了清楚表达，将其命名为第一水刀202和第二水刀203，但实际应用中，第一水刀202和第二水刀203位置关系可以互换，且不影响本发明的实施。
本发明实施例通过第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两端，第一水刀和第二水刀沿切割线相向运动同步切割玻璃基板，第一水刀在预设停止点停止切割，由第二水刀完成切割，能够提高切割玻璃基板的效率。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种玻璃基板切割装置，其中，包括：
    切割组件，所述切割组件包括用于提供高压水射流的第一水刀和第二水刀；
    高压水源，用于向所述第一水刀和所述第二水刀提供高压水；
    第一控制单元，用于控制所述第一水刀和所述第二水刀的运动。
  2. 根据权利要求1所述的玻璃基板切割装置，其中，所述玻璃基板切割装置还包括第二控制单元，用于控制所述高压水射流的流量及压力。
  3. 根据权利要求2所述的玻璃基板切割装置，其中，所述第二控制单元为阀门。
  4. 根据权利要求1所述的玻璃基板切割装置，其中，所述高压水射流中含有研磨剂。
  5. 一种玻璃基板的切割方法，其中，包括：
    第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两
    端；
    所述第一水刀和所述第二水刀相向运动，沿所述切割线同步切割所述玻璃基板；
    所述第一水刀切割至预设的停止点时，先行停止切割，由所述第二水刀继续切割，直到切割至所述停止点为止，以沿所述切割线完成全部切割；
    其中，所述第一水刀和所述第二水刀位于所述玻璃基板的两侧，所述预设的停止点临近所述切割线的中点且更靠近所述第一水刀设置。
  6. 根据权利要求５所述的切割方法，其中，所述第一控制单元包括电荷耦合元件定位装置，以对所述第一水刀和所述第二水刀进行定位，使得所述第一水刀和所述第二水刀与所述切割线对齐。
  7. 根据权利要求５所述的切割方法，其中，所述玻璃基板水平固定放置。
  8. 一种玻璃基板的切割方法，其中，包括：
    第一控制单元控制第一水刀和第二水刀分别置于玻璃基板的切割线的两端；
    所述第一水刀和所述第二水刀相向运动，沿所述切割线同步切割所述玻璃基板；
    所述第一水刀切割至预设的停止点时，先行停止切割，由所述第二水刀继续切割，直到切割至所述停止点为止，以沿所述切割线完成全部切割。
  9. 根据权利要求8所述的方法，其中，所述第一水刀和所述第二水刀位于所述玻璃基板的两侧。
  10. 根据权利要求8所述的方法，其中，所述第一水刀和所述第二水刀位于所述玻璃基板的同侧，其中，在所述第一水刀切割至预设的停止点时，先行停止切割之后，所述第一水刀做后退运动，以避免与第二水刀产生干涉。
  11. 根据权利要求8所述的方法，其中，所述预设的停止点临近所述切割线的中点且更靠近所述第一水刀设置。
  12. 根据权利要求8所述的方法，其中，所述第一控制单元包括电荷耦合元件定位装置，以对所述第一水刀和所述第二水刀进行定位，使得所述第一水刀和所述第二水刀与所述切割线对齐。
  13. 根据权利要求8所述的方法，其中，所述玻璃基板水平固定放置。
PCT/CN2012/080957 2012-08-31 2012-09-04 一种玻璃基板切割装置和方法 Ceased WO2014032315A1 (zh)

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