WO2014030255A1 - 最適化プログラム、および、対基板作業システム - Google Patents
最適化プログラム、および、対基板作業システム Download PDFInfo
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- WO2014030255A1 WO2014030255A1 PCT/JP2012/071465 JP2012071465W WO2014030255A1 WO 2014030255 A1 WO2014030255 A1 WO 2014030255A1 JP 2012071465 W JP2012071465 W JP 2012071465W WO 2014030255 A1 WO2014030255 A1 WO 2014030255A1
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- work
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- circuit board
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Definitions
- the present invention relates to an on-board work system in which work is sequentially performed on a circuit board to be transported, and an optimization program for optimizing a work procedure for each work machine in the system.
- the board-to-board work system usually includes a plurality of work machines arranged. And a circuit board is conveyed over what was arrange
- each work machine includes a pair of transfer devices, and a circuit board is transferred by the pair of transfer devices in order to improve productivity. That is, there is a system in which a circuit board is transported by two paths.
- the on-board working system described in the following patent document is an example of a system in which a circuit board is conveyed by two paths.
- the work time for two circuit boards for each work machine when working on a dual lane, the work time for two circuit boards for each work machine, more specifically, the work time for a circuit board transported on one path and the transport path on the other path.
- the method for optimizing the work time is different between the work in the single lane and the work in the dual lane.
- the present invention has been made in view of such a situation, and in a system capable of executing work in a single lane and work in a dual lane, by optimizing the work time in each work machine, Provided are an optimization program capable of reducing work time and a substrate work system.
- an optimization program has a pair of substrate transfer devices for transferring a circuit board through two paths, and includes a plurality of substrate transfer devices arranged in a row.
- An optimization program for optimizing a work procedure comprising: a work time for a circuit board transported on one of the two paths in each of the plurality of work machines; and a work time for a circuit board transported on the other First work setting means for setting a work procedure for each of the plurality of work machines so that a total work time is optimized, and for each of the plurality of work machines with respect to a circuit board conveyed on one of the two paths.
- work Second work setting means for setting a work procedure for each of the plurality of work machines so that the working time for each of the plurality of work machines is optimized with respect to the circuit board conveyed on the other side And a first work procedure that is a work procedure for each of the plurality of work machines set by the first work setting means based on a planned production number in the substrate work system, and the second work setting means. And a procedure selecting means for selecting any one of the second work procedures, which are work for each of the set work machines.
- an operation performed on one of the two paths is an operation on one of both sides of the circuit board, and the two The work performed on the other side of the path is a work on the other of both sides of the circuit board.
- the procedure selection means uses only one of the two routes of the planned production number.
- the number of circuit boards in which one work is used which is the number of circuit boards on which work is performed, and the number of circuit boards in which work is performed using both of the two paths of the planned production number
- One of the first work procedure and the second work procedure is selected based on the number of circuit boards in use.
- the procedure selecting means includes the number of circuit boards in use of the one path and the 2 Using the number of circuit boards at the time of route calculation, the total time required for the first work procedure of all the plurality of work machines and the total time required for the second work procedure of all of the plurality of work machines are calculated, When the total time required for the first work procedure is shorter than the total time required for the second work procedure, the first work procedure is selected, and the total time required for the second work procedure is the total required for the first work procedure When the time is shorter than the time, the second work procedure is selected.
- the substrate work system includes a pair of substrate transport devices for transporting the circuit board through two paths, a plurality of work machines arranged in a row, and the plurality of work machines.
- a control device that controls the operation of each work machine, and a circuit board on which the circuit board is conveyed by the two paths over the plurality of work machines arranged from the upstream side to the downstream side
- the control device performs a total work of a work time for the circuit board transported on one of the two paths in each of the plurality of work machines and a work time for the circuit board transported on the other
- a first work procedure based control unit that controls the operation of the plurality of work implements according to the set work procedure for each of the plurality of work implements, and transports one of the two routes so that time is optimized Vs circuit board
- the plurality of work machines set so that the work time for each of the plurality of work machines is optimized and the work time for each of the plurality of work machines with respect to the circuit board transported on the other side is optimized And
- the control device includes the first work procedure dependent control unit and the second work procedure dependent control unit. It has a control selection part which chooses which control part controls operation of a plurality of above-mentioned work machines.
- control selection unit performs the first work on the basis of the planned production number in the on-board work system. It is characterized in that it is selected by any one of the procedure dependent control unit and the second work procedure dependent control unit whether to control the operation of the plurality of work implements.
- the control selection unit uses only one of the two routes of the planned production number. When using one path, which is the number of circuit boards on which work is performed, and when using two paths, which is the number of circuit boards on which work is performed using both of the two paths of the planned production number Based on the number of circuit boards, it is selected which of the first work procedure dependence control unit and the second work procedure dependence control unit controls the operation of the plurality of work machines. And
- the first work setting means sets the first work procedure so that the work time in the dual lane is optimized
- the second work setting means sets the single work lane.
- the second work procedure is set so that the work time is optimized.
- the procedure selection means the first work procedure and the second work procedure are selected based on the planned production number of circuit boards. Specifically, for example, when the planned production number is S and the number of processes in the single lane is A, the number of processes in the dual lane is (SA). In this case, it is desirable that the smaller the planned production number S is, the higher the ratio of the single lane processing number A to the planned production number S is, and the second work procedure is selected.
- the ratio of the dual lane processing number (SA) to the planned production number S increases, and it is desirable to select the first work procedure. For this reason, for example, when the production schedule number S is small, the second work procedure is selected, and when the production schedule number S is large, the first work procedure is selected to optimize the work time of each work machine. This makes it possible to shorten the work time.
- SA dual lane processing number
- the first work procedure and the second work procedure are selected based on the single lane processing number A and the dual lane processing number (SA). This makes it possible to optimize the work time more effectively.
- the total time required for the first work procedure and the total time required for the second work procedure based on the single lane processing number A and the dual lane processing number (SA). And are calculated.
- SA dual lane processing number
- control according to the first work procedure and the control according to the second work procedure are selectively executed. As a result, it is possible to select an optimal work procedure according to the work, and to shorten the work time.
- the on-board work system according to claim 6 is provided with a control selection unit for selecting one of the control according to the first work procedure and the control according to the second work procedure. Yes. This makes it possible to select optimal control.
- the first work procedure and the second work procedure are selected based on the planned production number. As a result, it is possible to obtain the same effect as the optimization program according to the first aspect.
- the total time required for the first work procedure and the total work required for the second work procedure based on the single lane processing number A and the dual lane processing number (SA). Time is calculated.
- SA dual lane processing number
- FIG. 1 shows a substrate working system 10.
- a system 10 shown in FIG. 1 is a system for mounting electronic components on a circuit board.
- the on-board working system 10 includes four electronic component mounting apparatuses (hereinafter, may be abbreviated as “mounting apparatuses”) 12.
- the four mounting devices 12 are arranged in a row in an adjacent state.
- the direction in which the mounting devices 12 are arranged is referred to as the X-axis direction
- the horizontal direction perpendicular to the direction is referred to as the Y-axis direction.
- the four mounting devices 12 have substantially the same configuration. Therefore, one of the four mounting devices 12 will be described as a representative.
- the mounting device 12 has one system base 14 and two mounting machines 16 adjacent to the system base 14.
- Each mounting machine 16 mainly includes a mounting machine main body 20, a transport device 22, a mounting head 24, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 26, and a supply device 28.
- the mounting machine main body 20 includes a frame portion 30 and a beam portion 32 that is overlaid on the frame portion 30.
- the transport device 22 includes two conveyor devices 40 and 42.
- the two conveyor devices 40 and 42 are disposed in the frame portion 30 so as to be parallel to each other and extend in the X-axis direction.
- Each of the two conveyor devices 40 and 42 conveys a circuit board supported by the conveyor devices 40 and 42 in the X-axis direction by an electromagnetic motor (see FIG. 3) 46.
- the circuit board is fixedly held by a board holding device (see FIG. 3) 48 at a predetermined position.
- one of the two conveyor devices 40, 42 is the first conveyor device 40, and the other conveyor device is the second conveyor device 42. Sometimes called.
- the moving device 26 is an XY robot type moving device.
- the moving device 26 includes an electromagnetic motor (see FIG. 3) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 3) 54 that slides in the Y-axis direction.
- the mounting head 24 is attached to the slider 50, and the mounting head 24 is moved to an arbitrary position on the frame unit 30 by the operation of the two electromagnetic motors 52 and 54.
- the supply device 28 is a feeder-type supply device, and is disposed at the front end of the frame portion 30.
- the supply device 28 has a tape feeder 70.
- the tape feeder 70 accommodates the taped component in a wound state.
- the taped component is a taped electronic component.
- the tape feeder 70 sends out the taped parts by a delivery device (see FIG. 3) 76.
- the feeder type supply device 28 supplies the electronic component at the supply position by feeding the taped component.
- the mounting head 24 mounts electronic components on the circuit board.
- the mounting head 24 has a suction nozzle 78 provided on the lower end surface.
- the suction nozzle 78 communicates with a positive / negative pressure supply device (see FIG. 3) 80 via negative pressure air and positive pressure air passages.
- the suction nozzle 78 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure.
- the mounting head 24 has a nozzle lifting / lowering device (see FIG. 3) 82 that lifts and lowers the suction nozzle 78.
- the mounting head 24 changes the vertical position of the electronic component to be held by the nozzle lifting device 82.
- the substrate work system 10 includes a control device 90 as shown in FIG.
- the control device 90 includes a controller 92 and a plurality of drive circuits 96.
- the plurality of drive circuits 96 are connected to the electromagnetic motors 46, 52, 54, the substrate holding device 48, the delivery device 76, the positive / negative pressure supply device 80, and the nozzle lifting / lowering device 82.
- the controller 92 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 96. Thereby, the operation of the transport device 22 and the moving device 26 is controlled by the controller 92.
- the circuit board is placed in the first conveyor device 40 of the mounting machine 16 arranged at the most upstream of the eight mounting machines 16. It is sequentially carried in.
- each of the eight mounting machines 16 is arranged in order from the most upstream one, the first mounting machine 16a, the second mounting machine 16b, the third mounting machine 16c, and the fourth mounting machine 16d.
- a fifth mounting machine 16e, a sixth mounting machine 16f, a seventh mounting machine 16g, and an eighth mounting machine 16h is arranged in order from the most upstream one, the first mounting machine 16a, the second mounting machine 16b, the third mounting machine 16c, and the fourth mounting machine 16d.
- a plurality of circuit boards are sequentially conveyed from the first mounting machine 16a to the eighth mounting machine 16h, and mounting work is performed in each mounting machine 16 so that an electronic component is mounted on one surface of the circuit board.
- the And a circuit board is carried out from the 8th mounting machine 16h.
- the unloaded circuit board is reversed and loaded into the second conveyor device 42 of the first mounting machine 16a. For this reason, in each mounting machine 16 until a circuit board is carried in from the 1st conveyor apparatus 40 of the 8th mounting machine 16h after carrying in in the 1st conveyor apparatus 40 of the 1st mounting machine 16a, a circuit board A mounting operation is performed on one of the surfaces.
- the inverted circuit board is carried into the second conveyor device 42 of the first mounting machine 16a, in each mounting machine 16, mounting work on one surface of the circuit board and mounting work on the other surface And done.
- a predetermined number A of circuit boards out of the planned production number S is mounted in one route, in other words, mounted in a single lane.
- the mounting operation for the predetermined number A of circuit boards is completed, the mounting operation in two paths, in other words, the mounting operation in the dual lane is performed. That is, the mounting operation in the dual lane is performed on (SA) circuit boards.
- the circuit board of the planned production number S is carried into the first conveyor device 40 of the first mounting machine 16a, the circuit board is not carried into the first conveyor device 40. Then, when the number S of circuit boards to be produced is carried out from the first conveyor device 40 of the eighth mounting machine 16h, the mounting operation in the dual lane is completed, and only the second conveyor device 42 is mounted. That is, in the second conveyor device 42, the mounting operation in a single lane is performed on a predetermined number A of circuit boards.
- Each mounting machine 16 is provided with the two conveyor devices 40 and 42 as described above, and can perform mounting work in a dual lane. However, each mounting machine 16 is provided with only one mounting head 24, and when mounting on a dual lane, one mounting head 24 mounts electronic components on two circuit boards. There is a need to. Therefore, when the number of circuit boards processed in dual lanes (hereinafter sometimes referred to as “dual lane processing number”) (SA) is large, the working time for each mounting machine 16 is optimized. It is desirable. In other words, the working time for the circuit board transported to the first conveyor device 40 in each mounting machine 16 (hereinafter sometimes referred to as “first working time”) and the work for the circuit board transported to the second conveyor device 42. It is desirable that the total time with time (hereinafter also referred to as “second work time”) is leveled in each mounting machine 16.
- first working time the working time for the circuit board transported to the first conveyor device 40 in each mounting machine 16
- second work time the total time with time
- FIG. 4 shows the relationship between the first work time, the second work time, and the total time when the total time is leveled.
- FIG. 4A is a graph showing the first work time for each mounting machine 16.
- FIG. 4B is a graph showing the second work time for each mounting machine 16.
- FIG. 4C is a graph showing the total time for each mounting machine 16.
- the first work time and the second work time are different for each mounting machine 16, but the total time is leveled in each mounting machine 16. Thereby, it is possible to shorten the time required for the mounting work in the dual lane.
- the number A of circuit board processes in a single lane (hereinafter sometimes referred to as “the number of single lane processes”) A is large, the work time for each mounting machine 16 in each lane is optimized. It is desirable. That is, it is desirable that the first work time and the second work time are leveled in each mounting machine 16.
- FIG. 5 shows the relationship between the first work time, the second work time, and the total time when the first work time and the second work time are leveled.
- FIG. 5A is a graph showing the first work time for each mounting machine 16.
- FIG. 5B is a graph showing the second work time for each mounting machine 16.
- FIG. 5C is a graph showing the total time for each mounting machine 16.
- the first work time is standardized at t S1
- the second work time is standardized at t S2 .
- the standardized first work time t S1 is shorter than the maximum value t D1 of the first work time when the total time is leveled (see FIG. 4A).
- the standardized second work time t S2 is shorter than the maximum value t D2 (see FIG. 4B) of the second work time when the total time is leveled. That is, by leveling the first work time and the second work time, the time required for the mounting work in the single lane can be shortened.
- the total time for the first working time and the second working time was leveled has a t St.
- the total time when the total time is leveled is t Dt as shown in FIG. 4C and is shorter than t St. From this, it can be seen that the installation time in the dual lane can be shortened by leveling the total time.
- the work procedure of the mounting machine 16 set to level the total time (hereinafter sometimes referred to as “first work procedure”), the first work
- the work procedure of the mounting machine 16 set so as to equalize the time and the second work time (hereinafter may be referred to as “second work procedure”) is set.
- the work procedure of the mounting machine 16 is a set of the type, number, mounting location, and the like of electronic components mounted by each mounting machine 16, and each mounting machine 16 operates according to the work procedure.
- T 1 t D1 ⁇ A + t Dt ⁇ ( SA ) + t D2 ⁇ A
- [t D1 ⁇ A] is the total work time in the single lane in the first conveyor device 40.
- [T Dt ⁇ ( SA )] is the total work time in the dual lane.
- [T D2 ⁇ A] is the total work time in the single lane in the second conveyor device 42.
- T 2 t S1 ⁇ A + t St ⁇ ( SA ) + t S2 ⁇ A
- [t S1 ⁇ A] is the total work time in the single lane in the first conveyor device 40.
- [T St ⁇ ( SA )] is the total work time in the dual lane.
- [T S2 ⁇ A] is the total work time in the single lane in the second conveyor device 42.
- the total Total Work T 1 is the shorter than the total Total Work T 2, the operation of the mounting machine 16 is controlled in accordance with the first working procedure.
- total Total Work T 2 is shorter than the total Total Work T 1, the operation of the mounting machine 16 is controlled in accordance with the second working step.
- the operation of the mounting machine 16 can be controlled according to the processing procedure corresponding to the number of dual lane processes (SA) and the number of single lane processes A, and the working time can be shortened.
- SA dual lane processes
- the controller 92 of the control apparatus 90 has the 1st work procedure dependence control part 100, the 2nd work procedure dependence control part 102, and the control selection part 104, as shown in FIG.
- the first work procedure dependence control unit 100 is a functional unit that controls the operation of the mounting machine 16 according to the first work procedure.
- the 2nd work procedure dependence control part 102 is a function part which controls the action
- the control selection unit 104 is a functional unit that selects which of the first work procedure dependence control unit 100 and the second work procedure dependence control unit 102 is to control the operation of the mounting machine 16.
- the first work procedure and the second work procedure are set by the optimization program 110 stored in the controller 92 of the control device 90.
- the controller 92 stores various types of information such as the type, number, and mounting position of electronic components to be mounted on the circuit board.
- the type, number, mounting position, and the like of the electronic components to be mounted on each mounting machine 16 are set so that the total time is leveled. Is set.
- the type, number, mounting position, and the like of electronic components to be mounted on each mounting machine 16 are set so that the first work time and the second work time are leveled.
- the second work procedure is set.
- the selection of the first work procedure and the second work procedure is performed by the control selection unit 104.
- the optimization program 110 By executing the optimization program 110, the first work procedure and the second work procedure are selected. It is possible to make selections with procedures. Specifically, by executing the optimization program 110, the grand total working time T 1 and the total Total Work T 2 is calculated, the two grand total working time T 1, T 2 are compared. Then, if the total Total Work T 1 is less than the total Total Work T 2, the first working procedure is selected, if the total Total Work T 2 is shorter than the total Total Work T 1, the second work procedure Is selected. In other words, by executing the optimization program 110, it is possible to select an optimal work procedure and reduce the work time.
- the optimization program 110 includes a first work setting unit 112, a second work setting unit 114, and a procedure selection unit 116, as shown in FIG.
- the first work setting unit 112 causes the controller 92 to execute a process for setting the first work procedure.
- the second work setting unit 114 causes the controller 92 to execute processing for setting the second work procedure.
- the procedure selection means 116 causes the controller 92 to execute processing for selecting the first work procedure and the second work procedure.
- the board-to-board working system 10 is an example of the board-to-board working system.
- the mounting machine 16 is an example of a work machine.
- the conveyor devices 40 and 42 are an example of a substrate transfer device.
- the control device 90 is an example of a control device.
- the first work procedure dependency control unit 100, the second work procedure dependency control unit 102, and the control selection unit 104 of the control device 90 are examples of the first work procedure dependency control unit, the second work procedure dependency control unit, and the control selection unit. is there.
- the optimization program 110 is an example of an optimization program.
- the first work setting means 112, the second work setting means 114, and the procedure selection means 116 of the optimization program 110 are an example of a first work setting means, a second work setting means, and a procedure selection means.
- the planned production number S is an example of the planned production number.
- the single lane processing number A is an example of the number of circuit boards when one path is used.
- the number of dual lane processes (SA) is an example of the number of circuit boards when using two paths.
- the selection of the first work procedure and the second work procedure is performed based on the single lane processing number A and the dual lane processing number (SA).
- SA dual lane processing number
- the first work procedure and the second work procedure may be selected.
- the smaller the planned production number S the higher the ratio of the single lane processing number A to the planned production number S, and it is desirable that the second work procedure is selected.
- the ratio of the dual lane processing number (SA) to the planned production number S increases, and it is desirable to select the first work procedure. Therefore, for example, when the planned production number S is less than a predetermined number, the second work procedure may be selected, and when the planned production number S is greater than or equal to the predetermined number, the first work procedure may be selected.
- control selection unit 104 selects the first work procedure and the second work procedure.
- the worker selects the first work procedure and the second work procedure. It is possible. Specifically, for example, a selection button for selecting the first work procedure and the second work procedure is provided, and the selection of the first work procedure and the second work procedure can be performed by operating the selection button. Is possible.
- control according to one of the first work procedure and the second work procedure is performed during the production of the circuit board with the planned production number S, but the first work procedure is followed.
- the control according to the second work procedure may be switched according to the situation. Specifically, during production of a circuit board of the planned production number S, control according to the second work procedure is executed when mounting on a single lane, and control according to the first work procedure is performed when mounting on a dual lane. May be executed.
- the optimization program 110 is stored in the controller 92 of the control device 90, but may be stored in another control device. In other words, the optimization program 110 may be stored in a control device that is independent of the substrate work system 10.
- Counter work system 16 Mounting machine (work machine) 40: Conveyor device (substrate transport device) 42: Conveyor device (substrate transport device) 90: Control device 100: First work procedure based control unit 102: Second work Procedure-based control unit 104: Control selection unit 110: Optimization program 112: First work setting means 114: Second work setting means 116: Procedure selection means
Abstract
Description
図1に、対基板作業システム10を示す。図1に示すシステム10は、回路基板に電子部品を実装するためのシステムである。対基板作業システム10は、4台の電子部品装着装置(以下、「装着装置」と略す場合がある)12から構成されている。4台の装着装置12は、隣接した状態で1列に配設されている。なお、以下の説明では、装着装置12の並ぶ方向をX軸方向と称し、その方向に直角な水平の方向をY軸方向と称する。
上述した構成によって、対基板作業システム10では、回路基板が、8台の装着機16の内部を第1コンベア装置40によって搬送され、各装着機16によって、回路基板の一方の面に電子部品が装着される。そして、反転された回路基板が、8台の装着機16の内部を第2コンベア装置42によって搬送され、各装着機16によって、回路基板の他方の面に電子部品が装着される。これにより、対基板作業システム10では、両面に電子部品が装着された回路基板を生産することが可能となっている。
T1=tD1×A+tDt×(S-A)+tD2×A
ここで、〔tD1×A〕は、第1コンベア装置40におけるシングルレーンでの合計作業時間である。〔tDt×(S-A)〕は、デュアルレーンでの合計作業時間である。〔tD2×A〕は、第2コンベア装置42におけるシングルレーンでの合計作業時間である。
T2=tS1×A+tSt×(S-A)+tS2×A
ここで、〔tS1×A〕は、第1コンベア装置40におけるシングルレーンでの合計作業時間である。〔tSt×(S-A)〕は、デュアルレーンでの合計作業時間である。〔tS2×A〕は、第2コンベア装置42におけるシングルレーンでの合計作業時間である。
上記第1作業手順および第2作業手順は、制御装置90のコントローラ92内に記憶されている最適化プログラム110によって設定される。詳しくは、コントローラ92内には、回路基板に装着すべき電子部品の種類、数、装着位置等の各種情報が記憶されている。そして、最適化プログラム110の実行により、合計時間が平準化されるように、各装着機16の装着すべき電子部品の種類、数、装着位置等が設定されることで、第1作業手順が設定される。一方、最適化プログラム110の実行により、第1作業時間および第2作業時間が平準化されるように、各装着機16の装着すべき電子部品の種類、数、装着位置等が設定されることで、第2作業手順が設定される。
Claims (8)
- 回路基板を2つの経路で搬送するための1対の基板搬送装置を有し、1列に配列された複数の作業機を備え、前記複数の作業機の上流側に配置されたものから下流側に配置されたものにわたって回路基板が前記2つの経路で搬送される対基板作業システムにおける前記複数の作業機毎の作業手順を最適化させる最適化プログラムであって、
前記複数の作業機の各々での前記2つの経路の一方で搬送される回路基板に対する作業時間と他方で搬送される回路基板に対する作業時間との合計作業時間が最適化されるように、前記複数の作業機毎の作業手順を設定する第1作業設定手段と、
前記2つの経路の一方で搬送される回路基板に対する前記複数の作業機毎の作業時間が最適化されるとともに、他方で搬送される回路基板に対する前記複数の作業機毎の作業時間が最適化されるように、前記複数の作業機毎の作業手順を設定する第2作業設定手段と、
前記対基板作業システムでの生産予定数に基づいて、前記第1作業設定手段により設定された前記複数の作業機毎の作業手順である第1作業手順と、前記第2作業設定手段により設定された前記複数の作業機毎の作業である第2作業手順との何れかを選択する手順選択手段と
を含むことを特徴とする最適化プログラム。 - 前記2つの経路の一方で行われる作業は、回路基板の両面の一方に対する作業であり、
前記2つの経路の他方で行われる作業は、回路基板の両面の他方に対する作業であることを特徴とする請求項1に記載の最適化プログラム。 - 前記手順選択手段が、
前記生産予定数のうちの前記2つの経路の一方のみを使用して作業が行われる回路基板の数である1経路使用時回路基板数と、前記生産予定数のうちの前記2つの経路の両方を使用して作業が行われる回路基板の数である2経路使用時回路基板数とに基づいて、前記第1作業手順と前記第2作業手順との何れかを選択することを特徴とする請求項1または請求項2に記載の最適化プログラム。 - 前記手順選択手段は、
前記1経路使用時回路基板枚数と前記2経路使用時回路基板数とを用いて、前記複数の作業機全ての前記第1作業手順に要する合計時間と前記複数の作業機全ての前記第2作業手順に要する合計時間とを演算し、前記第1作業手順に要する合計時間が前記第2作業手順に要する合計時間より短い場合に、前記第1作業手順を選択し、前記第2作業手順に要する合計時間が前記第1作業手順に要する合計時間より短い場合に、前記第2作業手順を選択することを特徴とする請求項3に記載の最適化プログラム。 - 回路基板を2つの経路で搬送するための1対の基板搬送装置を有し、1列に配列された複数の作業機と、
それら複数の作業機の各々の作動を制御する制御装置と
を備え、前記複数の作業機の上流側に配置されたものから下流側に配置されたものにわたって回路基板が前記2つの経路で搬送される対基板作業システムであって、
前記制御装置が、
前記複数の作業機の各々での前記2つの経路の一方で搬送される回路基板に対する作業時間と他方で搬送される回路基板に対する作業時間との合計作業時間が最適化されるように、設定された前記複数の作業機毎の作業手順に従って、前記複数の作業機の作動を制御する第1作業手順依拠制御部と、
前記2つの経路の一方で搬送される回路基板に対する前記複数の作業機毎の作業時間が最適化されるとともに、他方で搬送される回路基板に対する前記複数の作業機毎の作業時間が最適化されるように、設定された前記複数の作業機毎の作業手順に従って、前記複数の作業機の作動を制御する第2作業手順依拠制御部と
を有することを特徴とする対基板作業システム。 - 前記制御装置が、
前記第1作業手順依拠制御部と前記第2作業手順依拠制御部とのいずれの制御部により、前記複数の作業機の作動を制御するかを選択する制御選択部を有することを特徴とする請求項5に記載の対基板作業システム。 - 前記制御選択部が、
当該対基板作業システムでの生産予定数に基づいて、前記第1作業手順依拠制御部と前記第2作業手順依拠制御部とのいずれの制御部により、前記複数の作業機の作動を制御するかを選択することを特徴とする請求項6に記載の対基板作業システム。 - 前記制御選択部が、
前記生産予定数のうちの前記2つの経路の一方のみを使用して作業が行われる回路基板の数である1経路使用時回路基板数と、前記生産予定数のうちの前記2つの経路の両方を使用して作業が行われる回路基板の数である2経路使用時回路基板数とに基づいて、前記第1作業手順依拠制御部と前記第2作業手順依拠制御部とのいずれの制御部により、前記複数の作業機の作動を制御するかを選択することを特徴とする請求項7に記載の対基板作業システム。
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