WO2014024483A1 - 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 - Google Patents

物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 Download PDF

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Publication number
WO2014024483A1
WO2014024483A1 PCT/JP2013/004763 JP2013004763W WO2014024483A1 WO 2014024483 A1 WO2014024483 A1 WO 2014024483A1 JP 2013004763 W JP2013004763 W JP 2013004763W WO 2014024483 A1 WO2014024483 A1 WO 2014024483A1
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WIPO (PCT)
Prior art keywords
substrate
exchange
holding device
carrying
air guide
Prior art date
Application number
PCT/JP2013/004763
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English (en)
French (fr)
Japanese (ja)
Inventor
青木　保夫
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2014529315A priority Critical patent/JP6394965B2/ja
Priority to KR1020157005676A priority patent/KR102216809B1/ko
Priority to CN201380049087.5A priority patent/CN104662478B/zh
Publication of WO2014024483A1 publication Critical patent/WO2014024483A1/ja
Priority to HK15105480.9A priority patent/HK1205277A1/xx

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Definitions

  • the present invention relates to an object exchanging method, an object exchanging system, an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method, and more specifically, an exchanging method and system for an object held by an object holding apparatus, and the object exchanging method.
  • the present invention relates to an exposure apparatus including a system, a flat panel display using the exposure apparatus, and a device manufacturing method.
  • an exposure apparatus that transfers a pattern formed on a mask (or reticle) onto a glass substrate (or wafer) using an energy beam is used. ing.
  • the present invention provides an object exchange method for exchanging an object placed at a predetermined object exchange position with another object. Positioning the held object holding device at the object exchange position; suspending and supporting the first object on a support device provided at the object exchange position; and the first object suspended and supported by the support device. Is separated from the object holding device, and a second object is inserted between the first object suspended from the support device and the object holding device, and the second object is received by the object holding device. Passing the second object to the object holding device, and then moving the first object relative to the support device to move the first object out of the object replacement position.
  • exchange method That.
  • the second object is transferred to the object holding device in a state where the first object is suspended and supported by the support device, and then the first object is carried out from the object exchange position.
  • the replacement operation of the object on the object holding device can be performed quickly. It can be carried out.
  • the present invention provides an object exchange system for exchanging an object arranged at a predetermined object exchange position with another object, an object holding device capable of holding the object, and the object exchange position A support device capable of suspending and supporting the object; and the object holding device that holds the object is located at the object replacement position, and the object is suspended and supported by the support device.
  • An object that delivers the object from the object exchange position by delivering the object to the object holding device and moving the object relative to the support device after delivering the other object to the object holding device.
  • conversion device which is the object exchange system comprising a.
  • another object is delivered to the object holding device in a state where the object is suspended and supported by the support device, and then the object is carried out from the object exchange position.
  • the loading of another object into the object holding device is prioritized over the completion of the unloading operation of the object held by the object holding device, the replacement operation of the object on the object holding device can be performed quickly. Can do.
  • an object exchange system according to the second aspect of the present invention, and a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus using an energy beam. And an exposure apparatus.
  • a flat panel display comprising: exposing the object using the exposure apparatus according to the third aspect of the present invention; and developing the exposed object. It is a manufacturing method.
  • a device manufacturing method including exposing the object using the exposure apparatus according to the third aspect of the present invention, and developing the exposed object. is there.
  • FIG. 2 is a plan view of the liquid crystal exposure apparatus (partially omitted) in FIG. 1.
  • 3A is a front view of a substrate exchange apparatus included in the liquid crystal exposure apparatus of FIG. 2, and
  • FIG. 3B is a diagram showing a modification thereof.
  • 4A to 4C are views (Nos. 1 to 3) for explaining the operation of the substrate carry-in apparatus included in the liquid crystal exposure apparatus of FIG.
  • FIGS. 5A to 5C are views (No. 1 to No. 3) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the first embodiment.
  • FIGS. 6A to 6C are views (No. 4 to No.
  • FIGS. 7A to 7C are views (No. 7 to No. 9) for explaining the substrate exchange operation in the liquid crystal exposure apparatus according to the first embodiment.
  • FIGS. 8A and 8B are views (No. 10 and No. 11) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the first embodiment. It is a top view of the substrate stage device and substrate exchange device concerning a 2nd embodiment.
  • FIG. 10A is a side sectional view of the substrate stage apparatus according to the second embodiment, and FIG. 10B is a diagram showing a modification thereof.
  • FIGS. 11A to 11C are views (No. 1 to No. 3) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the second embodiment.
  • FIGS. 12A to 12C are views (No. 4 to No. 6) for explaining the substrate exchange operation in the liquid crystal exposure apparatus according to the second embodiment.
  • FIGS. 13A to 13C are views (No. 1 to No. 3) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the third embodiment.
  • FIG. 14A is a diagram (part 4) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the third embodiment, and
  • FIG. 14B is a diagram showing a modification thereof.
  • FIGS. 15A to 15C are views (No. 1 to No. 3) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the fourth embodiment.
  • FIGS. 16A to 16C are views (No. 4 to No. 6) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the fourth embodiment.
  • FIGS. 17A and 17B are views (No. 7 and No. 8) for explaining the substrate replacement operation in the liquid crystal exposure apparatus according to the fourth embodiment.
  • FIG. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to the first embodiment.
  • the liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object.
  • a projection exposure apparatus a so-called scanner.
  • the liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage apparatus 14 that holds a mask M, a projection optical system 16, and a substrate P on which a resist (sensitive agent) is coated on the surface (the surface facing the + Z side in FIG. 1). It has a substrate stage device 20 to be held, a substrate exchange device 30, a suspension support device 50, and a control system thereof.
  • the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction
  • the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis.
  • the illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331.
  • the illumination system 12 irradiates light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. ) Irradiate the mask M as IL.
  • a light source for example, a mercury lamp
  • the illumination light IL for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.
  • the mask stage device 14 holds the mask M by, for example, vacuum suction.
  • the mask stage device 14 is driven with a predetermined long stroke in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including a linear motor, for example.
  • Position information of the mask stage device 14 in the XY plane is obtained by a mask interferometer system including a laser interferometer (not shown).
  • the projection optical system 16 is disposed below the mask stage device 14.
  • the projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and is a double-sided telecentric equal magnification system.
  • a plurality of projection optical systems for forming a vertical image are provided.
  • the illumination light that has passed through the mask M causes the mask M in the illumination area to pass through the projection optical system 16.
  • a projection image (partial upright image) of the circuit pattern is formed in an irradiation region (exposure region) of illumination light conjugate to the illumination region on the substrate P. Then, the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction. Scanning exposure of one shot area is performed, and the pattern formed on the mask M is transferred to the shot area.
  • the substrate stage apparatus 20 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 26.
  • the XY coarse movement stage 22 is a device for driving the substrate holder 26 in a predetermined long stroke in the X-axis direction and the Y-axis direction.
  • Examples of the XY coarse movement stage 22 include an X coarse movement stage that is movable with a predetermined long stroke in the X-axis direction, as disclosed in, for example, US Patent Application Publication No. 2010/0018950, and a predetermined value in the Y-axis direction.
  • a so-called gantry type two-axis stage device (X and Y coarse movement stages are not shown) combined with a Y coarse movement stage movable with a long stroke can be used.
  • the fine movement stage 24 is disposed above the XY coarse movement stage 22 and is placed on the surface plate 18 via a weight cancellation device 28 as disclosed in, for example, US Patent Application Publication No. 2010/0018950. Yes.
  • the surface plate 18 is made of a plate-like member having a rectangular shape in plan view, and is installed on the floor 11 via a vibration isolator 19.
  • the substrate holder 26 is composed of a plate-like member having a rectangular shape in plan view (or a rectangular parallelepiped shape having a low height), and is integrally fixed to the upper surface of the fine movement stage 24.
  • the substrate holder 26 is guided by the XY coarse movement stage 22 to move with a predetermined long stroke in the X axis direction and / or the Y axis direction with respect to the projection optical system 16 (illumination light IL).
  • Position information in the XY plane of the substrate holder 26 (that is, the substrate P) is obtained by a substrate interferometer system including a laser interferometer (not shown).
  • the configuration of the XY coarse movement stage 22 is not particularly limited as long as at least the substrate P can be driven in the scanning direction with a predetermined long stroke.
  • a plurality of minute holes are formed on the upper surface (surface facing the + Z side) of the substrate holder 26.
  • a vacuum suction device and a pressurized gas supply device (each not shown) installed outside the substrate stage device 20 are selectably connected to the substrate holder 26.
  • the substrate holder 26 sucks and holds the substrate P placed on the upper surface by the vacuum suction force supplied from the vacuum suction device through the plurality of holes, and from the pressurized gas supply device.
  • the pressurized gas supplied through a plurality of holes (or other holes) allows the substrate P placed on the upper surface thereof to be levitated (non-contact supported).
  • the dimensions of the substrate holder 26 in the X-axis and Y-axis directions are set somewhat shorter than the dimensions of the substrate P in the X-axis and Y-axis directions, and the substrate P is placed on the substrate holder 26.
  • the end portion of the substrate P protrudes somewhat from the end portion of the substrate holder 26. This is to prevent the resist from adhering to the back surface of the substrate P and to prevent the resist from adhering to the substrate holder 26.
  • a pair of Y pressing pin devices 25y are arranged at predetermined intervals in the X-axis direction.
  • the Y pressing pin device 25y has a base 25a fixed to a substrate holder 26 (which may be the fine movement stage 24 or the XY coarse movement stage 22 (see FIG. 1 respectively)), and a predetermined (for example, Y axis direction) It has a pin 25b movable with a stroke of about 10 to 100 mm) and an actuator (not shown) for driving the pin 25b.
  • the tip of the pin 25b (the end on the + Z side) protrudes from the upper surface of the substrate holder 26 to the + Z side.
  • a pair of Y positioning pin devices 27y are arranged at predetermined intervals in the X-axis direction (vertically symmetrical with respect to the pair of Y pressing pin devices 25y with the substrate holder 26 interposed therebetween). ing.
  • the Y positioning pin device 27y has substantially the same configuration as the Y pressing pin device 25y except that the pin is fixed.
  • the pair of Y pressing pin devices 25y may be disposed on the + Y side of the substrate holder 26. In this case, the pair of Y positioning pin devices 27y are disposed on the ⁇ Y side of the substrate holder 26. Further, the Y pressing pin device 25y may be arranged on each of the ⁇ Y side and the + Y side of the substrate holder 26.
  • the X pressing pin device 25x includes a base 25a fixed to a substrate holder 26 (which may be the fine movement stage 24 or the XY coarse movement stage 22 (see FIG. 1 respectively)), and the Y axis direction with respect to the base 25a. It has a pin 25b movable with a predetermined stroke (for example, about 10 to 100 mm) and an actuator (not shown) for driving the pin 25b.
  • the pin 25b of the X pressing pin device 25x has a position where the tip end protrudes to the + Z side from the upper surface of the substrate holder 26, and a position where the tip end falls to the ⁇ Z side from the upper surface of the substrate holder 26. Can be driven in the vertical direction.
  • a pair of X positioning pin devices 27x are arranged at predetermined intervals in the Y-axis direction (symmetric to the paper plane with the substrate holder 26 sandwiched between the pair of X pressing pin devices 25x).
  • the X positioning pin device 27x has substantially the same configuration as the X pressing pin device 25x except that the pin is fixed.
  • the X pressing pin device 25x, the X positioning pin device 27x, the Y pressing pin device 25y, and the Y positioning pin device 27y are used during the pre-alignment operation of the substrate P with respect to the substrate holder 26.
  • the substrate exchange device 30 carries out the substrate P held by the substrate holder 26 from the substrate holder 26 and carries the substrate P into the empty substrate holder 26 (which does not hold the substrate P). As shown in FIG. 1, the substrate exchange device 30 is disposed in the + X side region of the substrate stage device 20 and is installed on the floor 11. The substrate stage device 20 and the substrate exchange device 30 are accommodated in a chamber (not shown) included in the liquid crystal exposure apparatus 10.
  • the substrate exchange device 30 includes a gantry 32, a base plate 34, a substrate driving device 36, and a plurality of air guide devices 38.
  • the gantry 32 is made of a table-like member having a low height installed on the floor 11.
  • the base plate 34 is composed of a plate-like member arranged in parallel to the XY plane.
  • the X linear guide 33a fixed to the upper surface of the gantry 32 and the lower surface of the base plate 34 It is mounted on the gantry 32 via a plurality of (for example, four) X linear guide devices 33 comprising a plurality of X sliders 33b fixed to the base plate.
  • the base plate 34 includes a plurality of (for example, two) X linear motors 31 including an X stator 31 a fixed to the upper surface of the gantry 32 and an X mover 31 b fixed to the lower surface of the base plate 34.
  • the drive system appropriately drives the gantry 32 with a predetermined stroke in the X-axis direction.
  • the substrate driving device 36 drives the substrate P to be loaded or unloaded during the replacement operation of the substrate P on the substrate holder 26.
  • the substrate driving device 36 includes an X driving unit 40, a support 42, and a suction pad 44.
  • the X drive unit 40 includes an X fixed unit 40a and an X movable unit 40b.
  • the X fixing portion 40a is made of a member extending in the X axis direction, and is fixed to the central portion in the Y axis direction on the upper surface of the base plate 34 (see FIGS. 2 and 3A).
  • the X movable part 40b is mounted on the upper surface of the X fixed part 40a.
  • the X movable part 40b is driven by a drive system including an X linear motor including a stator included in the X fixed part 40a and a mover included in the X movable part 40b. It is linearly driven along the fixed portion 40a in the X-axis direction, for example, with a stroke similar to the dimension of the substrate P in the X-axis direction.
  • the type of actuator for driving the base plate 34 and the X movable portion 40b is not particularly limited, and may be, for example, a feed screw device or a belt drive device.
  • the support column 42 is made of a member extending in the Z-axis direction, and a lower end portion thereof is integrally fixed to the X movable portion 40b.
  • the suction pad 44 is made of a member having an inverted L-shaped XZ section, and a portion parallel to the XY plane is formed in a plate shape having a rectangular shape in plan view.
  • the suction pad 44 is connected to a vacuum device (not shown), and the upper surface of a portion parallel to the XY plane functions as a substrate suction surface portion. In the suction pad 44, one surface parallel to the YZ plane is opposed to one surface (surface facing the -X side) in the vicinity of the upper end of the support column.
  • the suction pad 44 includes a Z linear guide 46a fixed to one surface ( ⁇ X side surface) of the support column 42 and a plurality of Z slide members 46b fixed to a portion (+ X side surface) parallel to the YZ plane of the suction pad 44. Is attached to the support column 42 so as to be movable in the Z-axis direction. Further, the suction pad 44 has an upper surface (substrate suction surface) that is higher than the upper surfaces of the substrate holder 26 and the plurality of air guide devices 38 by a Z actuator 48 (for example, an air cylinder) attached to the X movable portion 40b. It is driven in the Z-axis direction between a position protruding toward the + Z side and a position lower than the upper surfaces of the substrate holder 26 and the plurality of air guide devices 38.
  • a Z actuator 48 for example, an air cylinder
  • Each of the plurality of air guide devices 38 is composed of a rectangular parallelepiped member whose longitudinal direction is the X-axis direction, and is mounted on the intermediate base plate 37b via the support column 37a.
  • two intermediate base plates 37b are provided at predetermined intervals in the Y-axis direction so as not to hinder the movement of the column 42 of the substrate driving device 36.
  • each of the two intermediate base plates 37b is connected to the base plate 34 via a support column 37c. Accordingly, the plurality of air guide devices 38 move integrally with the base plate 34 in the X-axis direction.
  • FIG. 3A for example, two intermediate base plates 37b are provided at predetermined intervals in the Y-axis direction so as not to hinder the movement of the column 42 of the substrate driving device 36.
  • each of the two intermediate base plates 37b is connected to the base plate 34 via a support column 37c. Accordingly, the plurality of air guide devices 38 move integrally with the base plate 34 in the X-axis direction.
  • the plurality of air guide devices 38 are spaced apart from each other at a predetermined interval so that the lower surface of the substrate P can be supported substantially evenly.
  • a plurality of (for example, three) air guide device rows that are arranged at predetermined intervals in the X-axis direction have a plurality (for example, six rows) of air guide device rows that are arranged at predetermined intervals in the Y-axis direction.
  • the substrate P is supported from below by 18 air guide devices 38. Note that the number and arrangement of the air guide devices 38 and the shape of the substrate guide surface formed by the plurality of air guide devices 38 can be changed as appropriate according to the size of the substrate P, for example.
  • a plurality of minute holes are formed on the upper surface of each of the plurality of air guide devices 38.
  • a pressurized gas supply device (not shown) and a vacuum suction device (each not shown) are selectably connected to each of the plurality of air guide devices 38.
  • Each of the plurality of air guide devices 38 supports the substrate P placed on the upper surface thereof (non-contact support) by the pressurized gas supplied from the pressurized gas supply device through the plurality of holes.
  • the substrate P placed on the upper surface can be sucked and held by the vacuum suction force supplied from the vacuum suction device through the plurality of holes (or other holes). ing.
  • the substrate holder 26 performs a loading operation of the substrate P into the substrate holder 26 and a substrate unloading operation from the substrate holder 26 to be described later (hereinafter collectively referred to as a replacement operation of the substrate P). It is performed in a state where it is located at the substrate exchange position.
  • the substrate replacement position is set near the + X side end of the surface plate 18. In a state where the substrate holder 26 is located at the substrate exchange position (a state where the substrate holder 26 is disposed at a position indicated by a broken line in FIG. 1), as shown in FIG.
  • a plurality of air guide devices 38 are provided. And the substrate holder 26 are adjacent to each other in the X-axis direction, and a continuous guide surface is formed by the substrate guide surface formed by the plurality of air guide devices 38 and the upper surface of the substrate holder 26.
  • the Z position of the upper surface of the substrate holder 26 and the Z position of the upper surfaces of the plurality of air guide devices 38 are substantially the same (or the substrate holder 26).
  • the Z position of the substrate holder 26 is positioned so that the side is somewhat lower.
  • the position of the pin 25b of the X pressing pin device 25x is controlled so that the upper end portion is on the ⁇ Z side (does not protrude) from the upper surface of the substrate holder 26.
  • the substrate exchanging device 30 as shown in FIG.
  • pre-alignment in the Y-axis direction of the substrate P is similarly performed by pressing the ⁇ Y side end of the substrate P to the + Y side by the Y pressing pin device 25y.
  • the suction holding of the substrate P by the suction pad 44 is released, the suction pad 44 and the substrate P are separated, and the substrate P is moved by the inertial force. May be.
  • a notch into which the suction pad 44 can be partially inserted may be formed at the center in the Y-axis direction at the + X side end of the substrate holder 26. In this case, since the X position of the substrate P on the substrate holder 26 can be adjusted using the substrate driving device 36, the X pressing pin device 25x and the X positioning pin device 27x are not required.
  • the suspension support device 50 is used for carrying out the substrate P held by the substrate holder 26 from the substrate holder 26 together with the substrate replacement device 30.
  • the suspension support device 50 is arranged so as to be positioned above the substrate holder 26 in a state where the substrate stage device 20 is positioned at the substrate replacement position.
  • the suspension support device 50 has a plurality of non-contact chuck devices 52.
  • the non-contact chuck device 52 is also called a Bernoulli chuck or the like, and its configuration is disclosed in, for example, US Pat. No. 5,067,762. That is, a gas supply device (not shown) is connected to each of the plurality of non-contact chuck devices 52, and the plurality of non-contact chuck devices 52 are arranged with the lower surface of the suspension support device 50 and the upper surface of the substrate P facing each other with a predetermined clearance.
  • Each of the non-contact chuck devices 52 ejects pressurized gas (for example, air) at high speed onto the upper surface of the substrate P.
  • pressurized gas for example, air
  • non-contact chuck devices 52 are arranged at predetermined intervals in the X-axis direction and the Y-axis direction so that the suction force can be applied uniformly to the entire substrate P.
  • the number and arrangement of the non-contact chuck devices 52 are not limited to this, and can be appropriately changed according to the size of the substrate P, for example.
  • the plurality of non-contact chuck devices 52 include a plurality of bar-shaped members parallel to the X-axis arranged at predetermined intervals in the Y-axis direction, and a plurality of bar-shaped members parallel to the Y-axis arranged at predetermined intervals in the X-axis direction. Is attached in a suspended support state to a support member 54 formed in a net shape (see FIG. 1).
  • the support member 54 is driven with a predetermined stroke in the Z-axis direction (vertical direction) by a plurality of (for example, four in the first embodiment) Z actuators 56.
  • the Z actuator 56 includes a Z fixing portion 56a installed on the floor 11 (see FIG.
  • the surface formed by the lower surfaces of the plurality of non-contact chuck devices 52 will be referred to as a substrate holding surface of the suspension support device 50.
  • the substrate P is moved in the Z-axis direction integrally with the support member 54 by driving the support member 54 in the Z-axis direction while holding the substrate P in a non-contact manner. Accordingly, the suspension support device 50 can move the substrate P up and down above the substrate holder 26 located at the substrate replacement position.
  • the type of actuator that moves the support member 54 up and down can be changed as appropriate.
  • the support member 54 may be moved up and down by hanging the support member 54 with a rope or the like and winding up the rope.
  • the pin 58 on the side and the ⁇ Y side are not shown).
  • the plurality of pins 58 are arranged so as to surround the outer periphery of the substrate P in a state where the substrate P is suspended and supported using the plurality of non-contact chuck devices 52, and are arranged on the XY plane with respect to the suspension support device 50 of the substrate P. Inadvertent movement in parallel directions is restricted.
  • the number of pins 58 is not particularly limited as long as the inadvertent movement of the substrate P can be limited.
  • the pin 58 disposed in the vicinity of the + X side end portion of the support member 54 has a position where the lower end portion protrudes below the substrate holding surface and a position where the lower end portion does not protrude below the substrate holding surface ( And a position that does not hinder the movement of the substrate P in the + X direction relative to the suspension support device 50).
  • the plurality of pins 58 can be moved in the X-axis and / or Y-axis directions, and the end portions of the substrate P suspended and supported by the plurality of non-contact chuck devices 52 are pressed using the plurality of pins 58.
  • alignment (pre-alignment) of the substrate P in the XY plane may be performed.
  • an external transfer robot 99 (in FIG. 1 and FIG. 2) carries the substrate P into the liquid crystal exposure apparatus 10 from the outside of the liquid crystal exposure apparatus 10. Only the hand member 98 of the external transfer robot 99 is shown). As shown in FIG. 2, the hand member 98 includes a plurality of support portions 98a made of a plate-like member extending in parallel with the X axis, and a connection portion 98b that connects one ends of the plurality of support portions 98a to each other. It is also called a fork hand.
  • the external transfer robot 99 includes a drive device (for example, a robot arm) that can drive the hand member 98 with a predetermined stroke at least in the X-axis direction and the Z-axis (vertical) direction. .
  • the plurality of support portions 98a are arranged at substantially equal intervals in the Y-axis direction in order to suppress the bending of the substrate P.
  • substrate exchange apparatus 30 mentioned above has is determined in consideration of the space
  • the intervals in the Y-axis direction of the plurality of air guide devices 38 are relative to the plurality of support portions 98a of the hand member 98 in a state where the hand member 98 is positioned on the plurality of air guide devices 38. Are set so as not to overlap in the Y-axis direction. As a result, the air guide device 38 can be inserted between the adjacent support portions 98a via a predetermined clearance.
  • the mask M is loaded onto the mask stage apparatus 14 by a mask loader (not shown) under the control of the main controller (not shown).
  • the substrate exchange device 30 loads the substrate P onto the substrate holder 26.
  • alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially exposed in a step-and-scan manner. Operation is performed. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted.
  • the substrate P that has been subjected to the exposure process is unloaded from the substrate holder 26 by the substrate exchange device 30, and another substrate P to be exposed next is transported to the substrate holder 26.
  • the substrate P is exchanged, and the exposure operation and the like are continuously performed on the plurality of substrates P.
  • FIG. 5 (A) the substrate stage device 20 exposed substrate P 1 is placed on the substrate holder 26, and shows a state that has moved to the substrate exchange position from the exposure operation end position.
  • the substrate P 2 that will next exposure processing of the substrate P 1 is carried out it is placed.
  • a plurality of air guide devices 38 are ⁇ It is driven in the X direction (direction approaching the substrate stage device 20).
  • the plurality of non-contact chuck devices 52 are lowered in the suspension support device 50. Driven.
  • the substrate stage device 20 is in a state of being positioned in the substrate exchange position, as shown in FIG. 5 (B), as well as releasing the suction and holding of the substrate P 1 by the substrate holder 26, the lower surface of the substrate P 1 A pressurized gas is ejected from the upper surface of the substrate holder 26. Further, the suspension support apparatus 50, the gas is ejected at high speed from a plurality of non-contact chuck device 52, thereby, the arrow in the direction of gravity upward force (lift force) is applied to the substrate P 1 (FIG. 5 (B) Indicates the direction of force rather than gas flow), and the substrate P 1 is adsorbed and held by the suspension support device 50.
  • pressurized gas is ejected from the plurality of air guide devices 38 to the lower surface of the substrate P 2 , and the substrate P 2 floats on the plurality of air guide devices 38. Also, the suction pad 44 sucks and holds the lower surface of the substrate P 2.
  • the suspension support device 50 that holds the substrate P 1 by suction is driven upward, and the lower surface of the substrate P 1 and the upper surface of the substrate holder 26 are separated from each other.
  • the suction pad 44 is driven in the ⁇ X direction.
  • the substrate P 2 is the upper surface of the plurality of air guide device 38, and moves along a guide surface formed by the upper surface of the substrate holder 26.
  • the X pressing pin device 25x and the Y pressing pin device 25y are used on the substrate holder 26. After the pre-alignment is performed, the substrate P 2 is attracted and held by the substrate holder 26.
  • the exposed substrate P 1 is in a state of being held by suction on the suspension support device 50 and is waiting at the substrate replacement position.
  • the substrate stage device 20, as shown in FIG. 6 (B), for exposure operation for the substrate P 2 moves toward the substrate exchange position to a predetermined exposure operation start position.
  • the plurality of non-contact chuck devices 52 included in the suspension support device 50 are driven downward as shown in FIG.
  • Z position of the substrate P 1 the position where the suction pad 44 enables sucking and holding the lower surface of the substrate P 2, i.e., the substrate P 1 at the time of being carried into the substrate holder 26 (see FIG. 6 (A)) It is positioned so as to be substantially the same as the Z position.
  • the suction pad 44 of the lower surface adsorbed and held the substrate P 1 is driven in the + X direction, thereby the lower surface of the substrate P 1 is a plurality of non-contact chuck device 52, and a plurality It moves along the guide surface formed by the upper surface of the air guide device 38.
  • + X side of the pin 58 of the suspension support apparatus 50 is retracted so as not to contact the substrate P 1.
  • the substrate P is 2 substrate stage device 20 which holds a is illustrated for convenience, the substrate P 1 and the substrate P 3 in the substrate exchanging device 30 on to be described below the exposure operation exchange operation and the substrate P 2 and, performed in parallel, the actual position of the substrate stage device 20 is different.
  • the suction holding of the substrate P 1 by the suction pad 44 is released, and the suction pad 44 is driven downward. Further, ejection from the air guide device 38 of the pressurized gas against the lower surface of the substrate P 1 is stopped.
  • the plurality of air guide devices 38 are driven in the + X direction (a direction away from the substrate stage device 20). Note that the X positions of the plurality of air guide devices 38 may be fixed.
  • the hand member 98 of the external transfer robot 99 is located below the substrate P 1 . After being inserted into the space, it is driven up. At this time, as described above, the hand member 98 of the external transfer robot 99 and the plurality of air guide devices 38 do not contact each other. Thus, the substrate P 1 is supported by the hand member 98 from below, and the hand member 98 is driven in the + X direction in this state, whereby the substrate P 1 is carried out of the liquid crystal exposure apparatus 10 (see FIG. 1). Is done.
  • the suction pad 44 is driven downward to avoid contact between the suction pad 44 and the hand member 98. However, the suction pad 44 is moved in the ⁇ X direction to contact the hand member 98. Contact may be avoided.
  • the hand member 98 of the external transfer robot 99 (may be the same as the hand member 98 taken out of the substrate P 1, may be different)
  • the hand member 98 of the external transport robot 99 After the substrate P 3 to be subjected to the exposure process next to the substrate P 2 is transported above the plurality of air guide devices 38, as shown in FIG. 8B, the hand member 98 of the external transport robot 99. Are driven in the ⁇ Z direction and the ⁇ X direction, and the substrate P 3 is placed on the plurality of air guide devices 38.
  • the state returns to the state shown in FIG. 5A (however, the substrate P 1 is replaced with the substrate P 2 and the substrate P 2 is replaced with the substrate P 3 ).
  • the substrate P 3 after the substrate P 3 is passed over a plurality of air guide device 38, while floating on the plurality of air guide device 38, it may be performed alignment of the substrate P 3 (the alignment).
  • the alignment may be performed, for example, by pressing a plurality of positions at the end of the substrate P 3 while detecting the end (edge) position of the substrate P 3 with an edge sensor or a CCD (Charge Coupled Device) camera.
  • the exposure operation is continuously performed on the plurality of substrates P by repeatedly performing the operations shown in FIGS.
  • the loading operation of the substrate P 2 while the exposed substrate P 1 is waiting at the substrate replacement position was carried out, after the transfer to the substrate stage device 20 of the substrate P 2, so unloading the substrate P 1 from the standby position, for example after the unloading operation of the exposed substrate P 1 is completed, the substrate P 2 Compared to the case where the carry-in operation to the substrate stage apparatus 20 is started, the cycle time for substrate replacement can be shortened.
  • the exposed unloading operation of the liquid crystal exposure device 10 outside of the substrate P 1 and the placing of the plurality of air guide device 38 above the substrate P 3 since the time required for ⁇ work is be short (ready for the substrate P 3 is up to exposure operation is completed to the substrate P 2)
  • the overall throughput in performing successively exposed treated substrate P s by performing the loading operation the substrate P 2 (for example, three or more sheets), there is no effect.
  • the suspension support device 50 can move the plurality of non-contact chuck devices 52 up and down, the carry-in route and the carry-out route of the substrate P can be made the same, and the space for the liquid crystal exposure apparatus 10 can be saved. It becomes. Further, only one drive system (in the present embodiment, the substrate drive device 36) for driving the substrate P (substrates P 1 to P 3 ) may be used, and the drive system for loading and the drive system for unloading are independent. There is no need to provide it. Accordingly, the configuration of the liquid crystal exposure apparatus 10 is simplified and the cost can be reduced.
  • the plurality of non-contact chuck devices 52 eject gas to the upper surface (exposure surface) of the substrate P, but the substrate P held by the suspension support device 50 has already been exposed. Even if dust is contained in the pressurized gas, there is no risk of exposure failure. Further, since the positions of the plurality of non-contact chuck devices 52 in the XY plane are fixed, there is little possibility of dropping the substrate P.
  • a plurality of air guide devices 38 may be configured to move up and down like a substrate exchange device 30a shown in FIG. More specifically, in the substrate exchange device 30a, the plurality of air guide devices 38 are supported on the base plate 34a by a Z actuator 37d instead of the column 37c of the substrate exchange device 30 shown in FIG. ing.
  • the suspension support device 50 is driven downward (see FIG. 6C) in the first embodiment.
  • the plurality of air guide devices 38 may be driven up. At this time, the movable stroke of the suction pad 44 in the Z-axis direction may be set longer than that in the first embodiment so that the lower surface of the substrate P can be sucked and held.
  • the exposed substrate P can be carried out without changing the Z position of the suspension support device 50, the operation of the suspension support device 50 can be simplified. Further, since it is not necessary to drive the suspension support device 50 downward, the substrate carry-out operation can be started without waiting for the substrate stage device 20 to completely retract from the substrate replacement position (below the suspension support device 50). . Therefore, the time for the substrate exchange operation can be shortened.
  • the X fixing portion 40a for driving the suction pad 44 may be fixed on the gantry 32 as in the substrate exchange device 30a shown in FIG. 3B (the X fixing portion 40a itself is X). It does not have to move in the axial direction). In this case, the base plate 34a may be arranged on one side and the other side of the X fixing portion 40a, and the pair of base plates 34a may be driven synchronously.
  • Second Embodiment a second embodiment (and its modification) will be described with reference to FIGS. 9 to 12C.
  • elements having the same configurations as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment. Description is omitted.
  • the substrate stage apparatus 60 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 62, as shown in FIG.
  • the configurations of the XY coarse movement stage 22 and the fine movement stage 24 (including the weight cancellation device 28) are the same as those in the first embodiment.
  • the substrate holder 62 is made of a plate-like member having a rectangular shape in plan view, and is integrally fixed to the upper surface of the fine movement stage 24.
  • a plurality of X grooves 62a extending in the X axis direction are formed on the upper surface of the substrate holder 62 at predetermined intervals in the Y axis direction (for example, six in the second embodiment). .
  • An air guide device 64 is inserted into each of the plurality of X grooves 62a.
  • the air guide device 64 is made of a member extending in the X-axis direction, and the dimension in the longitudinal direction is set to be approximately the same as the dimension in the X-axis direction of the substrate P (slightly shorter in the second embodiment).
  • a plurality of small holes are formed on the upper surface of the air guide device 64.
  • the air guide device 64 is connected to a pressurized gas supply device (not shown) installed outside the substrate stage device 60 so that pressurized gas can be ejected from the plurality of minute holes. .
  • leg portions 66 extending in the Z-axis direction are fixed to the lower surface of the air guide device 64 and in the vicinity of both ends in the longitudinal direction of the air guide device 64.
  • a pair of through holes 62b penetrating the substrate holder 62 in the vertical direction is formed on the bottom surface defining the X groove 62a, and a leg portion 66 is inserted into each of the pair of through holes 62b.
  • the XY coarse movement stage 22 has a pair of Z actuators 68 corresponding to the pair of legs 66.
  • the air guide device 64 has a position where the upper surface protrudes upward from the upper surface of the substrate holder 62 and a position where the upper surface falls below the upper surface of the substrate holder 62 by the pair of Z actuators 68.
  • the Z position is appropriately controlled with respect to the position housed in the groove 62a.
  • the structure of the suspension support device 50a shown in FIG. 10A is such that the Z position of the support member 54 that supports the suspension of the plurality of non-contact chuck devices 52 is fixed (Z actuator 56 (see FIG. 1)). Except for this point, the second embodiment is the same as the first embodiment.
  • the air guide device 74 has a plurality of air guide devices 74 (for example, six in the second embodiment at a predetermined interval in the Y-axis direction).
  • the air guide device 74 is configured in the same manner (somewhat wide) as the air guide device 64 of the substrate holder 62. That is, the air guide device 74 is made of a member extending in the X-axis direction, and has a pair of legs 76 on the lower surface thereof as shown in FIG.
  • the air guide device 74 is driven with a predetermined stroke in the Z-axis direction by a pair of Z actuators 78 fixed to the base plate 34.
  • a plurality of minute holes are formed on the upper surface of the air guide device 74.
  • a pressurized gas supply device (not shown) is connected to the air guide device 74, and pressurized gas can be ejected from the plurality of minute holes.
  • the substrate P is supported from below by a plurality of air guide devices 64 included in the substrate stage device 60 and / or a plurality of air guide devices 74 included in the substrate exchange device 70. 64 and 74 support the substrate P in a floating manner (non-contact support) by ejecting a pressurized gas to the lower surface of the substrate P.
  • the configuration of the substrate driving device 36 shown in FIG. 9 is the same as that of the first embodiment, and a description thereof will be omitted.
  • FIG. 11 (A) the substrate stage device 60 which holds the exposed substrate P 1 is shown a state located in the substrate exchange position (below the suspension support device 50a).
  • a substrate P 2 is placed on the air guide device 74 of the substrate exchange device 70.
  • a substrate stage device is disposed at the substrate exchange position 60, as shown in FIG. 11 (B), increasing the air guide device 64 to the position suspended supporting device 50a is composed of a substrate P 1 can adsorb holding (suspension support) To drive.
  • Suspension Support device 50a is a substrate P 1 adsorbed and held, as in the first embodiment, to carry operation to the substrate stage device 60 of the substrate P 2 is completed, move the substrate P 1 of the substrate P 2 Evacuate from the route. Furthermore, the substrate exchanging device 70, the suction pad 44 sucks and holds the substrate P 2.
  • the air guide device 64 is driven downward.
  • the Z actuator 68 is controlled so that the Z position of the upper surface of the air guide device 64 is substantially the same (or somewhat lower) as the Z position of the upper surface of the air guide device 74 of the substrate exchange device 70.
  • the Z position of the air guide device 74 is set so that the upper surface of the air guide device 64 is positioned on the + Z side with respect to the upper surface of the substrate holder 62.
  • the suction pad 44 is driven in the ⁇ X direction.
  • the substrate P 2 is formed by the upper surfaces of the air guide device 64 of the air guide device 74, it moves rests over the air guide device 74 onto the air guide device 64.
  • the suction pad 44 is driven in the -Z direction, and the + X direction
  • the air guide device 64 is driven downward, and the substrate P ⁇ b > 2 is placed on the upper surface of the substrate holder 62.
  • the suction pad 44 + Z direction and is driven in the -X direction, attracts and holds the lower surface of the substrate P 1.
  • the air guide device 74 is driven up.
  • the upper surface of the air guide device 74, Z actuator 78 is controlled so somewhat the -Z side of the Z position of the lower surface of the substrate P 1 which is held in suspension support device 50a.
  • pressurized gas is ejected from the upper surface of the air guide device 74, and the suction pad 44 is driven in the + X direction.
  • the substrate P 1 moves along the guide surfaces defined by the plurality of non-contact chuck devices 52 and the plurality of air guide devices 74, and is placed on the plurality of air guide devices 74.
  • the substrate P 1 on a plurality of air guide device 74 the operation of exchanging with another substrate that will next exposure processing of the substrate P 2 is performed (not shown) This is performed using an external transfer robot 99 (not shown in FIG. 12C) (see FIGS. 7B to 8B).
  • the exposed substrate P 1 is retracted from the conveyance path of the substrate P 2, in preference to the unloading operation the substrate P 1 since the carrying-operation substrate P 2, it can be shortened replacement time of the substrate P.
  • a plurality of air guide device 74 is vertically movable, even without lowering driving a plurality of non-contact chuck device 52 can be unloaded directly the substrate P 1 from the retracted position. Accordingly, as shown in FIG. 12 (C), in a state in which position the substrate stage device 60 in the substrate exchange position, can be performed out of the substrate P 1 (be parallel to the prealignment operation for the substrate P 2 The time required for the replacement operation of the substrate P can be shortened. Further, since the plurality of air guide devices 64 included in the substrate stage device 60 can move up and down, the substrate P can be transferred from the substrate stage device 60 to the suspension support device 50a. Therefore, the Z position of the plurality of non-contact chuck devices 52 can be fixed, and the structure of the suspension support device 50a can be simplified.
  • the configuration of the liquid crystal exposure apparatus according to the second embodiment can be changed as appropriate.
  • the dimension in the X-axis direction is larger in the X groove 62a than in the air guide device 64 of the second embodiment (see FIG. 10A).
  • a plurality of short (for example, three in this modification) air guide devices 64a may be accommodated in the X-axis direction at predetermined intervals.
  • the plurality of air guide devices 64a are synchronously driven by a Z actuator 69 (for example, an air cylinder device) housed in a recess 62c formed on the bottom surface that defines the X groove 62a.
  • the air guide device 74 (see FIG. 9) of the substrate exchange device 70 may be configured in the same manner.
  • the configuration of the substrate stage device 60 is the same as that of the second embodiment, and the configuration of the suspension support device 50 is the same as that of the first embodiment.
  • the operation (control by the main controller) is different.
  • the substrate exchanging device 70a has a plurality of air guide devices 74 (hidden in the depth direction in FIG. 13A to FIG. 14B) as in the second embodiment shown in FIG. Although it has, it does not have an element equivalent to the board
  • FIG. 13A shows a state after the exposed substrate P 1 is delivered to the suspension support device 50.
  • a plurality of substrate stage devices 60 (hidden in the depth direction in FIG. 13A to FIG. 14B) of air guide devices 64 deliver the substrate P 1 to the suspension support device 50 and then are driven downward.
  • the Z position of the end portion of the air guide device 64 on the + X side is the end on the ⁇ X side.
  • the Z actuator 68 is controlled such that the guide surface formed by the plurality of air guide devices 64 is inclined with respect to the XY plane so as to be higher than the Z position of the portion.
  • the Z position of the + X side end is ⁇ X side.
  • the Z actuator 78 is controlled so as to be higher than the Z position at the end (on the substrate stage device 60 side), that is, so that the guide surface formed by the plurality of air guide devices 74 is inclined with respect to the XY plane.
  • Z actuator 68 and 78 respectively, to the extent guide surface formed by a plurality of air guide device 64 and the air guide device 74, do not hinder the movement of a single (no step (or the substrate P 2 The step is small))) is controlled to form a guide surface.
  • angles of the guide surfaces (inclined surfaces) formed by the plurality of air guide devices 64 and the air guide devices 74 are substantially the same, and the guides are formed by the plurality of air guide devices 64.
  • the Z position at the + X side end of the surface and the Z position at the ⁇ X side end of the guide surface formed by the plurality of air guide devices 74 are substantially the same (actually, the plurality of air guide devices 74
  • the guide surface formed by (1) is somewhat higher).
  • the substrate P 2 is supported by the plurality of air guide devices 64 and 74 in a non-contact (substantially negligible friction) state, and as shown in FIG. 13B, the substrate P 2 Moves from above the plurality of air guide devices 74 to the plurality of air guide devices 64 along a guide surface formed by the plurality of air guide devices 64 and 74 by its own weight. Thereafter, similarly to the first embodiment, after a pre-alignment operation using the X pressing pin device 25x (see FIG. 2) or the like is performed, as shown in FIG. device 74 is driven downward, thereby the substrate P 2 is attracted and held by the substrate holder 62.
  • the carry-out also exposed substrate P 1, it is performed by utilizing the weight of the substrate P 1. That is, in parallel with the pre-alignment operation of the substrate P 2, the suspension support apparatus 50, as a substrate holding surface which is formed by a plurality of non-contact chuck device 52 is inclined with respect to the XY plane, specifically, In the Z actuator 56 (FIG. 13C), the Z position of the + X side (substrate exchange device 70a side) end of the substrate holding surface is lower than the Z position of the ⁇ X side end. (Not shown, see FIG. 1 etc.) is controlled.
  • the plurality of air guide devices are configured such that the inclination angle of the guide surface formed by the plurality of air guide devices 74 is substantially the same as the inclination angle of the substrate holding surface of the suspension support device 50.
  • Each of 74 is driven.
  • the substrate P 1 moves along the substrate holding surface of the suspension support device 50 and / or the guide surface formed by the plurality of air guide devices 74 and is placed on the plurality of air guide devices 74.
  • the stopper device for stopping the substrate P 2 taken out from the suspension support apparatus 50 at a desired position on the plurality of air guide device 74 may be disposed on a substrate exchanging device 70.
  • the substrate exchange device 70a since the substrate exchange device 70a does not have an element for driving the substrate P, the configuration is simplified.
  • the configuration of the liquid crystal exposure apparatus according to the third embodiment can be changed as appropriate.
  • the + X side end of the substrate holding surface formed by the non-contact chuck devices 52 is more than the + X side end of the substrate holder 62.
  • the support member 54b may be configured to be long so that the protrusion protrudes toward the X side and the protruding portion overlaps with the vicinity of the end portion on the ⁇ X side of the air guide device 74 of the substrate exchange apparatus 70a in the vertical direction. This makes it possible to pass from a more smoothly suspension support device 50b of the substrate P 1 on the plurality of air guide device 74.
  • the exchange operation of the substrate P on the substrate stage apparatus 60 is performed by an external transfer robot 99 arranged outside the liquid crystal exposure apparatus.
  • the configuration of the substrate stage device 60 is the same as that of the second embodiment (however, the control is different), and the suspension support device 50b is the same as the first embodiment except that the movable stroke in the Z-axis direction is long. It is the same structure (however, control differs) as the suspension support apparatus 50 (refer FIG. 1 etc.) of embodiment.
  • substrate exchange apparatus 70 of the said 2nd Embodiment is not provided.
  • FIG. 15 (A) a substrate stage device 60 which holds the exposed substrate P 1 is shown a state in which located (position directly below the suspension support apparatus 50b) substrate exchange position.
  • the hand member 98 of the external transport robot 99 is waiting supporting the substrate P 2.
  • the standby position of the hand member 98 which supports the substrate P 2 a substrate stage device 60, and the suspension support apparatus to 50b may be an inner chamber (not shown) housed, an outer of the chamber Also good.
  • the substrate exchange operation on the substrate stage device 60 which will be described below, are performed through the opening formed in the chamber.
  • the hand member 98 of the external transfer robot 99 has a plurality of support portions 98a arranged at predetermined intervals in the Y-axis direction (in FIG. 15A to FIG. 17B, the paper surface).
  • the substrate stage device 60 has a plurality of air guide devices 64 (in FIG. 15 (A) to FIG. 17 (B) on the back side of the drawing) arranged at predetermined intervals in the Y-axis direction. Have overlapping).
  • the plurality of support portions 98a and the plurality of air guide devices 64 are arranged so that the positions in the Y-axis direction do not overlap each other with the hand member 98 positioned above the substrate holder 62 (the air guide device 64 is The interval in the Y-axis direction is set so that it can pass between adjacent support portions 98a). Accordingly, the configuration of the hand member 98 and / or the plurality of air guide devices 64 of the external transfer robot 99 according to the fourth embodiment is actually different from that of FIG. 2 or FIG. It shall be explained using.
  • the plurality of air guide devices 64 of the substrate stage device 60 positioned at the substrate replacement position are driven upward, thereby exposing the exposed substrate P 1. Is transferred to the suspension support device 50b.
  • a plurality of non-contact chuck device 52 which holds the substrate P 1 is driven upward, it is formed by the air guide device 64 substrate holding surface and a plurality of suspension support apparatus 50b A large space is formed between the guide surface.
  • the hand member 98 of the external transfer robot 99 supporting the substrate P 2 is inserted into the space.
  • the hand member 98 is driven downward (may be increased driving a plurality of air guide device 64), the substrate P 2 a plurality of air guide device 64 is supported from below, and the hand member 98 is driven in the + X direction, whereby the hand member 98 is retracted from below the suspension support device 50b.
  • the plurality of air guide devices 64 are driven downward, and the substrate P ⁇ b > 2 is placed on the substrate holder 62.
  • the hand member 98 of the external transfer robot 99 is driven in the + Z direction. While the transfer operation of the substrate P 2 from the hand member 98 of the external transfer robot 99 to the substrate holder 62 is being performed, the substrate P 1 is in the substrate replacement position as in the first to third embodiments. Waiting.
  • the substrate stage device 20 which holds the substrate P 2 is separated from the substrate exchange position, the hand member 98 of the external transport robot 99 is driven in the -X direction in parallel by, is disposed below the suspension support device 50b, by a plurality of non-contact chuck device 52 is driven downward in that state, the substrate P 1 is placed on the hand member 98 of the external transfer robot 99.
  • the hand member 98 which supports the substrate P 1 is driven in the + X direction after sucking and holding the substrate P 1, the substrate P 1 is an external device (For example, a coater / developer apparatus).
  • the plurality of non-contact chuck devices 52 are driven up.
  • the substrate stage device 60 has the same air guide device 64 as in the second embodiment, but the substrate P moves along the air guide device 64. Therefore, a device that does not have a guide function, such as a lift pin device, may be used.
  • the non-contact chuck device 52 applies an upward force in the gravity direction (+ Z direction) to the substrate P by causing a gas to pass between the upper surface of the substrate P at a high speed.
  • the present invention is not limited to this, and the gas on the upper surface side of the substrate P is sucked to apply a force in the + Z direction to the substrate P, and the gas is ejected to the substrate P to A so-called vacuum preload air bearing that maintains the clearance of the above may be used.
  • the pattern surface (upper surface) of the substrate P to be carried out is held from above by the non-contact chuck device 52, but the substrate P is separated from the substrate holders 26 and 62.
  • the structure of the suspension support device can be changed as appropriate.
  • a support member for example, a support member that contacts and supports the vicinity of the end of the substrate P (the region protruding outward from the end of the substrate holder 26) from the lower surface side.
  • the substrate P may be supported from above by using a plurality of L-shaped members such as the suction pad 44 (see FIG. 1) upside down (which may be used in combination with the non-contact chuck device 52).
  • the substrate driving device 36 that moves the substrate P when the substrate P is carried in and out is provided in the substrate exchange device 30, but is not limited to this, and the substrate stage device A device for driving the substrate P may be provided on the 20 side (or on each of the substrate exchange device 30 and the substrate stage device 20).
  • the exposed substrate P 1 a suspension support apparatus 50 (50a, 50b) in a state of being suspended with the substrate of the next substrate P 2
  • the procedure of the substrate exchange operation is not limited to this.
  • the next substrate P 2 is preliminarily placed on the plurality of air guide devices 38.
  • the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F 2 laser light (wavelength 157 nm).
  • a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium).
  • harmonics converted into ultraviolet light using a nonlinear optical crystal may be used.
  • a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.
  • the projection optical system 16 is a multi-lens projection optical system including a plurality of optical systems has been described, but the number of projection optical systems is not limited to this, and one or more projection optical systems may be used.
  • the projection optical system is not limited to a multi-lens projection optical system, and may be a projection optical system using an Offner type large mirror. Further, the projection optical system 16 may be an enlargement system or a reduction system.
  • the use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern onto the square glass plate.
  • the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel the semiconductor manufacture
  • the present invention can also be widely applied to an exposure apparatus for manufacturing an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip, and the like.
  • microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc.
  • the present invention can also be applied to an exposure apparatus that transfers a circuit pattern.
  • the object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank.
  • the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).
  • the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target.
  • the step of designing the function and performance of the device the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer)
  • the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .
  • the object exchange method and system of the present invention is suitable for exchanging an object on an object holding device.
  • the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display.
  • the device manufacturing method of the present invention is suitable for the production of micro devices.
  • SYMBOLS 10 Liquid crystal exposure apparatus, 20 ... Substrate stage apparatus, 26 ... Substrate holder, 30 ... Substrate exchange apparatus, 36 ... Substrate drive apparatus, 38 ... Air guide apparatus, 44 ... Suction pad, 50 ... Suspension support apparatus, 52 ... Non-contact Chuck device, P ... substrate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2013/004763 2012-08-08 2013-08-07 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 WO2014024483A1 (ja)

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JP2014529315A JP6394965B2 (ja) 2012-08-08 2013-08-07 物体交換方法、物体交換システム、露光方法、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR1020157005676A KR102216809B1 (ko) 2012-08-08 2013-08-07 물체 교환 방법, 물체 교환 시스템, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
CN201380049087.5A CN104662478B (zh) 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法
HK15105480.9A HK1205277A1 (en) 2012-08-08 2015-06-09 Object-swapping method, object-swapping system, exposure apparatus, method for manufacturing flat-panel display, and method for manufacturing device

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JP2012175778 2012-08-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180969A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法
JP2020166109A (ja) * 2019-03-29 2020-10-08 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102469192B1 (ko) * 2017-12-19 2022-11-21 엘지디스플레이 주식회사 디스플레이 장치의 제조 장치
KR102469193B1 (ko) * 2017-12-19 2022-11-21 엘지디스플레이 주식회사 디스플레이 장치의 제조 장치
WO2019188274A1 (ja) * 2018-03-30 2019-10-03 株式会社ニコン 保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び保持方法
CN110858059B (zh) * 2018-08-24 2021-06-04 上海微电子装备（集团）股份有限公司 一种垂向运动机构及光刻设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368065A (ja) * 2001-06-08 2002-12-20 Hiroshi Akashi 位置合わせ装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
JP2008300723A (ja) * 2007-06-01 2008-12-11 Nec Electronics Corp 処理装置
JP2011053586A (ja) * 2009-09-04 2011-03-17 Ushio Inc 露光装置
JP2012060134A (ja) * 2010-09-13 2012-03-22 Nikon Corp 移動体装置、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体交換方法
JP2012060118A (ja) * 2010-09-07 2012-03-22 Nikon Corp 移動体装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039999A1 (fr) 1998-02-09 1999-08-12 Nikon Corporation Appareil de support d'une plaque de base, appareil et procede de transport de cette plaque, appareil de remplacement de cette plaque et appareil d'exposition et procede de fabrication dudit appareil
JP4249869B2 (ja) * 1999-12-22 2009-04-08 株式会社オーク製作所 基板搬送装置
JP2009073646A (ja) * 2007-09-21 2009-04-09 Myotoku Ltd 浮上方法及び浮上ユニット
TWI661505B (zh) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method
CN201886733U (zh) * 2010-06-24 2011-06-29 华东师范大学 激光显示的多点综合测量装置
CN201811787U (zh) * 2010-07-01 2011-04-27 华东师范大学 激光显示的光色性能的手持式测量装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368065A (ja) * 2001-06-08 2002-12-20 Hiroshi Akashi 位置合わせ装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
JP2008300723A (ja) * 2007-06-01 2008-12-11 Nec Electronics Corp 処理装置
JP2011053586A (ja) * 2009-09-04 2011-03-17 Ushio Inc 露光装置
JP2012060118A (ja) * 2010-09-07 2012-03-22 Nikon Corp 移動体装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2012060134A (ja) * 2010-09-13 2012-03-22 Nikon Corp 移動体装置、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体交換方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180969A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法
CN110520798A (zh) * 2017-03-31 2019-11-29 株式会社尼康 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法
TWI765999B (zh) * 2017-03-31 2022-06-01 日商尼康股份有限公司 物體交換裝置、物體處裡裝置、平板顯示器的製造方法、元件製造方法、物體交換方法以及物體處理方法
JP2020166109A (ja) * 2019-03-29 2020-10-08 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7196734B2 (ja) 2019-03-29 2022-12-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法

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HK1205277A1 (en) 2015-12-11
KR20150041038A (ko) 2015-04-15
CN104662478A (zh) 2015-05-27
JP2019016801A (ja) 2019-01-31
JPWO2014024483A1 (ja) 2016-07-25
KR102216809B1 (ko) 2021-02-17
TWI739894B (zh) 2021-09-21
JP6394965B2 (ja) 2018-09-26
CN107436540A (zh) 2017-12-05
TW201407298A (zh) 2014-02-16
CN104662478B (zh) 2017-08-11
TWI600973B (zh) 2017-10-01

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