CN104662478B - 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法 - Google Patents

物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法 Download PDF

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Publication number
CN104662478B
CN104662478B CN201380049087.5A CN201380049087A CN104662478B CN 104662478 B CN104662478 B CN 104662478B CN 201380049087 A CN201380049087 A CN 201380049087A CN 104662478 B CN104662478 B CN 104662478B
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substrate
action
holding apparatus
support
air guide
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CN201380049087.5A
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English (en)
Chinese (zh)
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CN104662478A (zh
Inventor
青木保夫
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Nikon Corp
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Nikon Corp
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Priority to CN201710587245.2A priority Critical patent/CN107436540B/zh
Publication of CN104662478A publication Critical patent/CN104662478A/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201380049087.5A 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法 Active CN104662478B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710587245.2A CN107436540B (zh) 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-175778 2012-08-08
JP2012175778 2012-08-08
PCT/JP2013/004763 WO2014024483A1 (ja) 2012-08-08 2013-08-07 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Related Child Applications (1)

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CN201710587245.2A Division CN107436540B (zh) 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法

Publications (2)

Publication Number Publication Date
CN104662478A CN104662478A (zh) 2015-05-27
CN104662478B true CN104662478B (zh) 2017-08-11

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CN201380049087.5A Active CN104662478B (zh) 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法
CN201710587245.2A Active CN107436540B (zh) 2012-08-08 2013-08-07 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法

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Country Status (6)

Country Link
JP (2) JP6394965B2 (ko)
KR (1) KR102216809B1 (ko)
CN (2) CN104662478B (ko)
HK (2) HK1245416A1 (ko)
TW (2) TWI600973B (ko)
WO (1) WO2014024483A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180969A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法
KR102469193B1 (ko) * 2017-12-19 2022-11-21 엘지디스플레이 주식회사 디스플레이 장치의 제조 장치
KR102469192B1 (ko) * 2017-12-19 2022-11-21 엘지디스플레이 주식회사 디스플레이 장치의 제조 장치
WO2019188274A1 (ja) * 2018-03-30 2019-10-03 株式会社ニコン 保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び保持方法
CN110858059B (zh) * 2018-08-24 2021-06-04 上海微电子装备(集团)股份有限公司 一种垂向运动机构及光刻设备
JP7196734B2 (ja) * 2019-03-29 2022-12-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201811787U (zh) * 2010-07-01 2011-04-27 华东师范大学 激光显示的光色性能的手持式测量装置
CN201886733U (zh) * 2010-06-24 2011-06-29 华东师范大学 激光显示的多点综合测量装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100638533B1 (ko) 1998-02-09 2006-10-26 가부시키가이샤 니콘 기판지지장치, 기판반송장치 및 그 방법, 기판교환방법,그리고 노광장치 및 그 제조방법
JP4249869B2 (ja) * 1999-12-22 2009-04-08 株式会社オーク製作所 基板搬送装置
JP2002368065A (ja) * 2001-06-08 2002-12-20 Hiroshi Akashi 位置合わせ装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
JP2008300723A (ja) * 2007-06-01 2008-12-11 Nec Electronics Corp 処理装置
JP2009073646A (ja) * 2007-09-21 2009-04-09 Myotoku Ltd 浮上方法及び浮上ユニット
JP5338576B2 (ja) * 2009-09-04 2013-11-13 ウシオ電機株式会社 露光装置
TWI777060B (zh) * 2010-02-17 2022-09-11 日商尼康股份有限公司 搬送裝置、曝光裝置以及元件製造方法
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201886733U (zh) * 2010-06-24 2011-06-29 华东师范大学 激光显示的多点综合测量装置
CN201811787U (zh) * 2010-07-01 2011-04-27 华东师范大学 激光显示的光色性能的手持式测量装置

Also Published As

Publication number Publication date
KR20150041038A (ko) 2015-04-15
WO2014024483A1 (ja) 2014-02-13
HK1245416A1 (zh) 2018-08-24
TWI739894B (zh) 2021-09-21
HK1205277A1 (en) 2015-12-11
CN104662478A (zh) 2015-05-27
CN107436540B (zh) 2020-05-26
TWI600973B (zh) 2017-10-01
JPWO2014024483A1 (ja) 2016-07-25
TW201407298A (zh) 2014-02-16
TW201800876A (zh) 2018-01-01
JP2019016801A (ja) 2019-01-31
JP6708233B2 (ja) 2020-06-10
CN107436540A (zh) 2017-12-05
KR102216809B1 (ko) 2021-02-17
JP6394965B2 (ja) 2018-09-26

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