WO2014013572A1 - Tête d'inspection, appareil de travail et chaîne de montage de composant électronique - Google Patents

Tête d'inspection, appareil de travail et chaîne de montage de composant électronique Download PDF

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Publication number
WO2014013572A1
WO2014013572A1 PCT/JP2012/068231 JP2012068231W WO2014013572A1 WO 2014013572 A1 WO2014013572 A1 WO 2014013572A1 JP 2012068231 W JP2012068231 W JP 2012068231W WO 2014013572 A1 WO2014013572 A1 WO 2014013572A1
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WO
WIPO (PCT)
Prior art keywords
inspection
head
work
substrate
working
Prior art date
Application number
PCT/JP2012/068231
Other languages
English (en)
Japanese (ja)
Inventor
光孝 稲垣
博史 大池
和美 星川
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2014525605A priority Critical patent/JP6023196B2/ja
Priority to PCT/JP2012/068231 priority patent/WO2014013572A1/fr
Priority to CN201280074753.6A priority patent/CN104472031B/zh
Publication of WO2014013572A1 publication Critical patent/WO2014013572A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • This specification relates to an inspection head, a working device, and an electronic component mounting line.
  • Japanese Patent Application Laid-Open No. 2011-243484 describes a technique that allows one working device incorporated in an electronic component mounting line to operate as a surface mounter or as an inspection machine.
  • the work device can be operated as a surface mounter by attaching a mounting head as a work head of the work device and further attaching a feeder device to the work device.
  • the work head attached to the work device is replaced from the mounting head to the inspection head, and the feeder device attached to the work device is replaced with an inspection computer, thereby operating the work device as an inspection machine.
  • the electronic component mounting line can be easily recombined.
  • This specification discloses an inspection head for inspecting the surface state of a substrate that can be attached as a work head to a working device for working on the substrate.
  • the inspection head captures image data and inspection reference data acquired from the camera in accordance with a camera that shoots a substrate and acquires image data, a storage medium that can store an inspection processing program and inspection reference data, and an inspection processing program. And a control unit that executes an inspection process based on the control unit.
  • the work apparatus By attaching the inspection head as described above to the work apparatus as a work head, the work apparatus can be operated as an inspection machine without separately attaching an inspection computer. Therefore, when the work device is rearranged from the surface mounter to the inspection machine, the work of replacing the feeder device with the inspection computer is not required. Furthermore, when the work device is rearranged from the inspection machine to the surface mounter, the work of removing the inspection computer is not required.
  • the inspection head as described above, the recombination work from the surface mounting machine to the inspection machine and the recombination work from the inspection machine to the surface mounting machine can be performed with less effort.
  • the inspection head may be configured such that the control unit can communicate with a computer external to the work device and output inspection result data indicating the inspection result to a computer external to the work device. .
  • the above-described inspection head can be configured to further include photographing illumination for irradiating the substrate with photographing light.
  • This specification also discloses a working device in which the inspection head is attached as a working head. Furthermore, the present specification also discloses an electronic component mounting line in which the above-described working device is arranged on the downstream side of a working device in which a mounting head for mounting an electronic component on a substrate is attached as a working head.
  • the electronic component mounting line 2 shown in FIG. 1 mainly includes a screen printing machine 4, a plurality of work devices 6, 8, 10, a reflow furnace 12, and a main controller 14.
  • the screen printer 4 screen-prints cream solder on the substrate.
  • the work devices 6, 8, and 10 perform mounting of electronic components on the substrate and inspection of the surface state of the substrate.
  • the reflow furnace 12 heats the substrate to melt the cream solder.
  • the main controller 14 controls the operation of each device of the electronic component mounting line 2 including the screen printing machine 4, the work devices 6, 8, 10 and the reflow furnace 12.
  • Work devices 6, 8, and 10 are modularized, and can be operated as a surface mounter or an inspection machine by changing the type of work head.
  • the working devices 6 and 8 operate as a surface mounter that mounts electronic components on a substrate
  • the working device 10 operates as an inspection machine that inspects the surface state of the substrate.
  • the working device 6 that is a surface mounting machine includes a mounting head 30, a holder 20, a holder driving device 22, a feeder device 24, a substrate transfer device 26, and a module controller 28.
  • the substrate transfer device 26 carries in the substrate from the upstream production device (screen printer 4 in the case of the work device 6) and holds the substrate at the work position, and then the downstream production device (of the work device 6). In this case, the substrate is carried out to the working device 8).
  • the feeder device 24 supplies electronic components to be mounted on the board.
  • the feeder device 24 is detachable from the working device 6.
  • a working head such as a mounting head 30 or an inspection head 32 described later can be attached to the holder 20. In the present embodiment, since the working device 6 operates as a surface mounter, a mounting head 30 is attached to the holder 20.
  • the mounting head 30 includes a nozzle 34, a nozzle driving device 36, an attachment / detachment switching device 38, and a head controller 40.
  • the nozzle 34 sucks an electronic component by generating a negative pressure at its tip, and releases the suction of the electronic component by generating a positive pressure at its tip.
  • the nozzle driving device 36 adjusts the relative position and posture of the nozzle 34 with respect to the holder 20.
  • the attachment / detachment switching device 38 switches between attachment / detachment of electronic components to / from the nozzle 34 by switching between a state in which the negative pressure path communicates with the tip of the nozzle 34 and a state in which the positive pressure path communicates with the tip of the nozzle 34.
  • the head controller 40 controls the operation of the nozzle driving device 36 and the attachment / detachment switching device 38.
  • the holder driving device 22 reciprocates the holder 20 between the feeder device 24 and the substrate transfer device 26.
  • the mounting head 30 is moved above the feeder device 24, the electronic component at the component supply position is attracted to the tip of the nozzle 34, and then the mounting head 30 is moved above the substrate transport device 26 to be at the component mounting position.
  • the electronic component can be mounted on the substrate.
  • the module controller 28 controls the operation of the mounting head 30, the holder driving device 22, the feeder device 24, and the substrate transport device 26.
  • the module controller 28 can communicate with the head controller 40 via a communication line such as a serial bus, a wired LAN, or a wireless LAN.
  • the head controller 40 can communicate with the main controller 14 via a communication line such as a wired LAN or a wireless LAN.
  • the module controller 28 reads a production job from the main controller 14 and controls the operation of the work device 6 according to the read production job. Further, the module controller 28 transmits the work status and the like in the work device 6 to the main controller 14.
  • the working device 10 that is an inspection machine includes an inspection head 32, a holder 20, a holder driving device 22, a substrate transfer device 26, and a module controller 28.
  • the configurations of the holder 20, the holder driving device 22, the substrate transfer device 26, and the module controller 28 are the same as those of the work device 6.
  • an inspection head 32 is attached to the holder 20 as a work head.
  • the inspection head 32 includes a camera 42, a photographing illumination 44, and a head controller 46 (corresponding to a control unit).
  • the camera 42 images the substrate held at the work position by the substrate transfer device 26 and outputs image data to the head controller 46.
  • the photographing illumination 44 irradiates the substrate held at the work position by the substrate transport device 26 with photographing light.
  • the head controller 46 controls the operation of the camera 42 and the photographing illumination 44.
  • the head controller 46 includes a CPU, ROM, RAM, flash memory, and the like. An inspection processing program and inspection reference data are stored in advance in the ROM, RAM, flash memory, and the like (corresponding to a storage medium) of the head controller 46.
  • the head controller 46 can communicate with the module controller 28 via a communication line such as a serial bus, a wired LAN, or a wireless LAN.
  • the head controller 46 can communicate with the main controller 14 (corresponding to a computer outside the work apparatus 10) via a communication line such as a wired LAN or a wireless LAN.
  • the module controller 28 reads a production job from the main controller 14 and controls the operation of the work apparatus 10 according to the read production job.
  • the head controller 46 controls the camera 42 and the photographing illumination 44 to acquire image data, and performs substrate inspection processing based on the acquired image data and inspection reference data.
  • image data acquired by the camera 42 is compared with inspection reference data indicating an image of a non-defective substrate, and whether or not the solder printed on the substrate is shifted or missing, the substrate It is possible to determine whether there is a shortage of electronic components mounted on the device, the presence / absence of a position / angle shift, the presence / absence of foreign matter, and the like.
  • the head controller 46 transmits inspection result data indicating the inspection result to the main controller 14.
  • the head controller 46 may be configured to transmit the inspection result data for each substrate each time. Alternatively, the head controller 46 may aggregate the inspection results for a plurality of substrates and transmit the totaled inspection result data. You may comprise.
  • the head controller 46 stores an inspection processing program and inspection reference data, performs inspection processing based on image data and inspection reference data obtained from the camera 42, and outputs inspection result data. Transmit to the main controller 14. Therefore, it is not necessary to transmit / receive large-capacity image data between the inspection head 32 and the main controller 14 or between the inspection head 32 and the module controller 28. For this reason, the load on the communication line between the inspection head 32 and the main controller 14 or between the inspection head 32 and the module controller 28 can be reduced. Further, it is possible to reduce the load of communication processing in the main controller 14 and the module controller 28 and to stabilize the operation of these controllers.
  • the inspection processing program and inspection reference data stored in the head controller 46 can be rewritten from the main controller 14.
  • the head controller 46 may read the production job from the main controller 14, and the head controller 46 may be configured to control the operation of each part of the production apparatus 10 via the module controller 28.
  • the working device 8 can be operated as an inspection machine.
  • the feeder device 24 attached when the working device 8 is operated as a surface mounter does not affect the operation as an inspection machine, and therefore may be left attached to the working device 8 or removed. Good. Or you may utilize as a stand of the feeder apparatus 24, or an adjustment stand.
  • the working device 8 can be rearranged from the surface mounter to the inspection machine by a simple replacement work.
  • the inspection head 32 attached to the holder 20 is replaced with the mounting head 30.
  • a feeder device 24 for supplying electronic components to be mounted on the substrate is newly attached to the work device 10.
  • the working device 10 can be rearranged from the inspection machine to the surface mounting machine by a simple replacement work.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un appareil permettant de diminuer la charge de travail nécessaire pour mettre en œuvre une opération de reconfiguration à partir d'un appareil de montage sur une surface d'un appareil de travail vers un appareil d'inspection à partir de celui-ci, et une opération permettant d'effectuer une reconfiguration de l'appareil d'inspection de celui-ci vers l'appareil de montage sur une surface de celui-ci. La description de la présente demande divulgue une tête d'inspection destinée à inspecter l'état de surface d'un et pouvant être fixée en tant que tête de travail à un appareil de travail pour effectuer un travail sur le substrat. Cette tête d'inspection comprend les éléments suivants : une caméra destinée à imager le substrat et à obtenir des données d'image ; un support d'enregistrement permettant d'enregistrer un programme de traitement d'inspection et des données de référence d'inspection ; et une unité de commande destinée à exécuter le traitement d'inspection sur la base des données d'image obtenues de la caméra et des données de référence d'inspection, et conformément au programme de traitement d'inspection.
PCT/JP2012/068231 2012-07-18 2012-07-18 Tête d'inspection, appareil de travail et chaîne de montage de composant électronique WO2014013572A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014525605A JP6023196B2 (ja) 2012-07-18 2012-07-18 検査ヘッド、作業装置および電子部品実装ライン
PCT/JP2012/068231 WO2014013572A1 (fr) 2012-07-18 2012-07-18 Tête d'inspection, appareil de travail et chaîne de montage de composant électronique
CN201280074753.6A CN104472031B (zh) 2012-07-18 2012-07-18 检查头、作业装置及电子元件安装生产线

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/068231 WO2014013572A1 (fr) 2012-07-18 2012-07-18 Tête d'inspection, appareil de travail et chaîne de montage de composant électronique

Publications (1)

Publication Number Publication Date
WO2014013572A1 true WO2014013572A1 (fr) 2014-01-23

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PCT/JP2012/068231 WO2014013572A1 (fr) 2012-07-18 2012-07-18 Tête d'inspection, appareil de travail et chaîne de montage de composant électronique

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JP (1) JP6023196B2 (fr)
CN (1) CN104472031B (fr)
WO (1) WO2014013572A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111656878A (zh) * 2018-03-22 2020-09-11 株式会社富士 构成装置良好与否判定服务器、检查系统、检查系统用的终端装置及检查装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6913165B2 (ja) * 2017-06-01 2021-08-04 ヤマハ発動機株式会社 検査結果報知方法、検査結果報知装置および部品実装システム
JP7149456B2 (ja) * 2018-05-30 2022-10-07 パナソニックＩｐマネジメント株式会社 部品実装装置
CN112602385B (zh) * 2018-08-28 2022-08-30 株式会社富士 控制程序的检查装置

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JP2004006510A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 部品実装基板生産装置及び方法
JP2009130134A (ja) * 2007-11-22 2009-06-11 Panasonic Corp 基板の検査方法及び基板の検査装置
JP2011119429A (ja) * 2009-12-03 2011-06-16 Panasonic Corp 部品実装システム

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JP3903910B2 (ja) * 2002-11-21 2007-04-11 松下電器産業株式会社 画像読取装置および画像読取方法
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JP4986760B2 (ja) * 2007-08-01 2012-07-25 Ｊｕｋｉ株式会社 表面実装装置
JP4998485B2 (ja) * 2009-01-23 2012-08-15 パナソニック株式会社 部品実装ライン及び部品実装方法
JP2011082243A (ja) * 2009-10-05 2011-04-21 Panasonic Corp 部品実装装置および部品実装装置における実装状態検査方法
JP5773474B2 (ja) * 2010-05-20 2015-09-02 富士機械製造株式会社 部品実装システム
JP5787504B2 (ja) * 2010-10-15 2015-09-30 富士機械製造株式会社 部品実装システムおよび部品実装システムにおける部品検査方法

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Publication number Priority date Publication date Assignee Title
JP2004006510A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 部品実装基板生産装置及び方法
JP2009130134A (ja) * 2007-11-22 2009-06-11 Panasonic Corp 基板の検査方法及び基板の検査装置
JP2011119429A (ja) * 2009-12-03 2011-06-16 Panasonic Corp 部品実装システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111656878A (zh) * 2018-03-22 2020-09-11 株式会社富士 构成装置良好与否判定服务器、检查系统、检查系统用的终端装置及检查装置

Also Published As

Publication number Publication date
JPWO2014013572A1 (ja) 2016-06-30
CN104472031A (zh) 2015-03-25
CN104472031B (zh) 2017-08-15
JP6023196B2 (ja) 2016-11-09

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