WO2017212566A1 - Système de montage de composants - Google Patents

Système de montage de composants Download PDF

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Publication number
WO2017212566A1
WO2017212566A1 PCT/JP2016/067041 JP2016067041W WO2017212566A1 WO 2017212566 A1 WO2017212566 A1 WO 2017212566A1 JP 2016067041 W JP2016067041 W JP 2016067041W WO 2017212566 A1 WO2017212566 A1 WO 2017212566A1
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WIPO (PCT)
Prior art keywords
component
image
image processing
processing
content
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PCT/JP2016/067041
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English (en)
Japanese (ja)
Inventor
秀一郎 鬼頭
杉山　健二
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2016/067041 priority Critical patent/WO2017212566A1/fr
Priority to CN201680086241.XA priority patent/CN109196971B/zh
Priority to JP2018522219A priority patent/JP6807386B2/ja
Publication of WO2017212566A1 publication Critical patent/WO2017212566A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Definitions

  • the present invention relates to a component mounting system that mounts a component collected by a sampling nozzle on a substrate, and more particularly to a component mounting system that can determine the quality of the position of the component using an image.
  • a component mounting apparatus or the like constituting a board production line is configured to collect a component by a sampling nozzle and mount the component at a predetermined position on the substrate.
  • the component mounting machine described in Patent Document 1 includes a substrate transfer device, a component supply device, a component transfer device including a component mounting head, and an imaging monitoring device.
  • the components supplied by the component supply device can be mounted on the conveyed substrate by the component mounting head.
  • an imaging monitoring apparatus images the state in which the suction nozzle in the component mounting head picked up the component with the imaging unit, acquires image data, and determines the component suction state in the suction nozzle and the quality of the component. is doing.
  • the imaging monitoring apparatus according to Patent Literature 1 performs predetermined image processing on the image data, thereby improving the determination accuracy regarding the component suction state and the component quality in the suction nozzle.
  • the components mounted on the board satisfy the requirements as a board if the parts have the same specifications (for example, the same resistance value, capacitance, basic shape, etc.). For this reason, during the board production operation, the parts may be changed to parts of different parts vendors although they have the same specifications.
  • the specifications are the same, the specifications such as resistance values and the basic shape are common before and after the change of the parts.
  • details such as the body color and lead width of the parts are the same before and after the change of the parts. It is assumed that they are different.
  • the difference in detail before and after the change of the component affects the result of the image processing, and there is a possibility that the determination accuracy regarding the component suction state and the quality of the component in the suction nozzle may be lowered. Furthermore, this decrease in the determination accuracy also leads to a decrease in the mounting accuracy of components on the substrate, so it is considered that the productivity of the substrate is greatly affected.
  • the present invention has been made in view of the above problems, and relates to a component mounting system capable of determining the quality of the position of a component using an image when mounting the component sampled by a sampling nozzle on a substrate,
  • An object of the present invention is to provide a component mounting system capable of maintaining determination accuracy by performing appropriate image processing even when a component is changed.
  • a component mounting system that supplies a component to be mounted at a predetermined position on a substrate, and a sampling that collects the component supplied by the component supply unit A nozzle, an imaging unit that captures an image of a part collected by the sampling nozzle, and acquires image data; image data captured by the imaging unit; and details of image processing performed on the image data
  • a storage unit that stores processing content data; an image processing execution unit that performs image processing on the image data based on the processing content data; and image data that has undergone image processing by the image processing execution unit.
  • a determination unit that determines the position of the component and the quality of the component, and the component supply unit is configured to follow the predetermined first component and then have the same specifications as the first component.
  • a second part having different details is supplied, and the storage unit is applied to image data obtained by imaging the first part, and shows a first image processing content for enabling determination by the determination unit.
  • Processing content data is stored, and is applied in common to the image data obtained by imaging the first component and the image data obtained by imaging the second component, and the content of the image processing for enabling the determination by the determination unit
  • Common processing content data indicating the processing content adjustment unit for adjusting the content of the image processing in the first processing content data, image data obtained by imaging the first component by the image processing execution unit, and the second
  • a presentation unit for presenting that the content of the image processing on the image data obtained by imaging the component is changed to the content of the image processing based on the common processing content data.
  • the processing content adjustment unit converts the common processing content data into the first processing content data. In order to adjust and generate the content of the image processing in the image processing, it is possible to perform appropriate image processing in common with the image data obtained by imaging the first component and the image data obtained by imaging the second component.
  • the presentation unit is presented to change the content of the image processing for the image data obtained by imaging the first component and the image data obtained by imaging the second component to the content of the image processing based on the common processing content data. Therefore, it is possible to prevent parts from being mounted in an unintended situation.
  • FIG. 1 is a perspective view of an electronic component mounting apparatus 10 according to the present embodiment.
  • the electronic component mounting apparatus 10 is an apparatus for mounting electronic components on a circuit board.
  • the electronic component mounting apparatus 10 has one system base 14 and two mounting machines 16 arranged side by side on the system base 14.
  • the direction in which the mounting machines 16 are arranged is referred to as the X-axis direction
  • the horizontal direction perpendicular to the direction is referred to as the Y-axis direction.
  • Each mounting machine 16 mainly includes a mounting machine body 20, a transport device 22, a mounting head moving device 24 (hereinafter may be abbreviated as “moving device 24”), a mounting head 26, a supply device 28, a parts camera 90, and the like. It has.
  • the mounting machine main body 20 includes a frame portion 32 and a beam portion 34 that is overlaid on the frame portion 32.
  • the conveying device 22 includes two conveyor devices (a conveyor device 40 and a conveyor device 42).
  • the conveyor device 40 and the conveyor device 42 are arranged in the frame portion 32 so as to be parallel to each other and extend in the X-axis direction.
  • the conveyor device 40 and the conveyor device 42 convey the circuit boards supported by the electromagnetic motor 46 (see FIG. 2) in the X-axis direction. Further, the circuit board is fixedly held at a predetermined position by the board holding device 48 (see FIG. 2).
  • the moving device 24 is an XY robot type moving device, and includes an electromagnetic motor 52 (see FIG. 2) that slides the slider 50 in the X-axis direction and an electromagnetic motor 54 (see FIG. 2) that slides in the Y-axis direction. ing.
  • a mounting head 26 is attached to the slider 50, and the mounting head 26 moves to an arbitrary position on the frame portion 32 by the operation of the electromagnetic motor 52 and the electromagnetic motor 54.
  • the mounting head 26 mounts electronic components on the circuit board.
  • the mounting head 26 has a suction nozzle 62 provided on the lower end surface.
  • the suction nozzle 62 communicates with a positive / negative pressure supply device 66 (see FIG. 2) via a negative pressure air passage and a positive pressure air passage.
  • the suction nozzle 62 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure.
  • the mounting head 26 has a nozzle lifting device 65 (see FIG. 2) that lifts and lowers the suction nozzle 62.
  • the mounting head 26 changes the vertical position of the electronic component to be held by the nozzle lifting device 65.
  • the supply device 28 is a feeder-type supply device, and is disposed at one end of the frame portion 32 in the Y-axis direction.
  • the supply device 28 has a tape feeder 81.
  • the tape feeder 81 accommodates a taped component formed by taping an electronic component in a wound state. Then, the tape feeder 81 sends out the taped parts by the delivery device 82 (see FIG. 2). Thereby, the feeder type supply device 28 supplies the electronic component at the supply position by feeding the taped component.
  • the tape feeder 81 can be attached to and detached from the frame portion 32, and can be used for replacement of electronic components, and electronic components can be added by splicing the taped components. .
  • the mounting machine 16 includes a parts camera 90 and a mark camera 91 (see FIG. 2).
  • the parts camera 90 is disposed between the transport device 22 and the supply device 28 on the frame portion 32 so as to face upward.
  • the parts camera 90 can take an image of the component sucked and held by the suction nozzle 62 of the mounting head 26.
  • the mark camera 91 is attached to the slider 50 so as to face downward, and is moved together with the mounting head 26 in the X, Y, and Z directions. Thereby, the mark camera 91 can capture an arbitrary position on the frame unit 32.
  • the mounting machine 16 includes a control device 100.
  • the control device 100 includes a controller 102, and the controller 102 includes a CPU, a ROM, a RAM, and the like, and mainly includes a computer.
  • the controller 102 is connected to a plurality of drive circuits 106, and the plurality of drive circuits 106 include an electromagnetic motor 46, an electromagnetic motor 52, an electromagnetic motor 54, a substrate holding device 48, a nozzle lifting / lowering device 65, and a positive / negative pressure supply device 66. , Connected to the sending device 82. Thereby, the operations of the transport device 22 and the moving device 24 are controlled by the controller 102.
  • the controller 102 is connected to the image processing device 110, the storage device 115, and the display 120.
  • the image processing apparatus 110 performs image processing on image data obtained by the parts camera 90 and the mark camera 91, and the controller 102 acquires various types of information from the image data.
  • the display 120 is a display device that can display various types of information. Based on a control signal from the controller 102, the display 120 displays various types of information regarding the component mounting system 1 such as the operating status of the component mounting system 1 and the occurrence of an error. indicate.
  • the storage device 115 is a storage device constituted by an HDD or the like, and the contents of image processing for image data obtained by the parts camera 90 and the mark camera 91 in a predetermined situation and images taken by the parts camera 90.
  • Various pieces of information necessary for executing the mounting work are stored, such as processing content data (see FIG. 3) indicating the above. Therefore, the controller 102 can acquire information necessary for the mounting work from the storage device 115.
  • the controller 102 can acquire information (for example, processing content data) necessary for image processing in the image processing apparatus 110 from the storage device 115 and input the information to the image processing apparatus 110.
  • the mounting machine 16 can perform an electronic component mounting operation with the mounting head 26 on the circuit board held by the transfer device 22. Specifically, when the controller 102 executes a component mounting processing program (see FIG. 4), which will be described later, the electronic component sampling operation, the determination regarding the collected component, and the mounting operation of the electronic component on the circuit board are performed. Implemented in the system 1.
  • the circuit board In response to a command from the controller 102, the circuit board is transported to the working position, and is fixedly held by the board holding device 48 at that position. Further, the tape feeder 81 sends out a taped component and supplies an electronic component at a supply position in accordance with a command from the controller 102. Then, the mounting head 26 moves above the electronic component supply position in accordance with a command from the controller 102, and holds the electronic component by suction with the suction nozzle 62.
  • the mounting head 26 moves to a predetermined position above the parts camera 90 in accordance with a command from the controller 102.
  • the parts camera 90 images the electronic component sucked and held by the mounting head 26 according to a command from the controller 102.
  • the captured image data is stored in the storage device 115 according to a command from the controller 102.
  • the image processing apparatus 110 performs image processing on the image data based on the processing content data (see FIG. 3) in accordance with an instruction from the controller 102.
  • the controller 102 determines the attitude and position of the electronic component held by the mounting head 26 and the quality of the electronic component based on the image data subjected to image processing by the image processing apparatus 110.
  • the mounting head 26 moves from above the parts camera 90 to above the circuit board held by the board holding device 48 in response to a command from the controller 102, and an electronic component with a good determination result is transferred to the predetermined circuit board. Attach to the position. Note that the mounting head 26 discards an electronic component having a defective determination result according to a command from the controller 102.
  • the storage device 115 is connected to the controller 102 of the control device 100 and stores various data. Specifically, the storage device 115 stores image data obtained by imaging the electronic component held by the mounting head 26 by the parts camera 90 and processing content data indicating the content of image processing performed by the image processing device 110. ing.
  • the image data is image data obtained by imaging the electronic component held by the mounting head 26 with the parts camera 90, and is captured within the component switching period.
  • the component switching period means a period before and after a component mounted on the circuit board is switched from a predetermined first component to a second component having the same type and the same specifications as the first component.
  • the image data stored in the storage device 115 includes both image data obtained by imaging the first component and image data obtained by imaging the second component.
  • the processing content data indicates the content of image processing performed on the image data obtained by imaging the electronic component, the reference for determining the position and quality of the component with respect to the mounting head 26, and the like.
  • Connector, chip, IC Are associated with each type of component.
  • the processing content data includes component shape data, algorithm pattern data, tolerance value data, rough positioning template (seek line) data, and the like for each type of component.
  • the part shape data is data indicating the outer shape of the part, and is used as a reference when determining the position and quality of the part with respect to the mounting head 26.
  • the algorithm pattern data defines the combination and order of image processing algorithms that are performed as preprocessing for determining the position and quality of a component with respect to the mounting head 26. Since the optimum combination and order of image processing algorithms differ depending on the color tone and contrast of the components in the image data, a plurality of algorithm patterns are defined for one component type.
  • the tolerance value data defines the tolerance for determining the position and quality of the component with respect to the mounting head 26 using the component shape data.
  • the first component is an electronic component having a predetermined specification supplied from the vendor (A)
  • the second component is an electronic component supplied from the vendor (B) and having the same specification as the first component. It is.
  • the second component has different appearance details (for example, body color, lead length, pitch, etc.).
  • the storage device 115 stores first processing content data as processing content data for image data obtained by imaging the first component by the parts camera 90 (hereinafter referred to as first component image data).
  • the first processing content data Includes a pattern of an appropriate image processing algorithm for the first part image data.
  • step (hereinafter simply referred to as “S”) 1 the controller 102 transports and positions the circuit board by the transport device 22, confirms the position of the circuit board, and confirms the reading of the board ID.
  • step (S2 to S11) the production loop (S2 to S11) is started.
  • the controller 102 performs control related to the collection of parts by the mounting head 26. Specifically, the controller 102 outputs a control signal to the tape feeder 81 of the supply device 28 to send out the taped component and supply the electronic component at the supply position. Further, the controller 102 outputs a control signal to the moving device 24 and the mounting head 26, thereby moving the mounting head 26 above the electronic component supply position and sucking and holding the electronic component by the suction nozzle 62.
  • the controller 102 performs control related to the imaging of the electronic component held by the mounting head 26. Specifically, the controller 102 outputs a control signal to the moving device 24 and the mounting head 26, thereby moving the mounting head 26 holding the electronic component above the parts camera 90. Then, the controller 102 controls the part camera 90 via the image processing apparatus 110 to image the electronic component held by the mounting head 26.
  • the controller 102 determines whether or not the current electronic component mounting operation is within the component switching period.
  • the component switching period means a period before and after the component mounted on the circuit board is switched from the predetermined first component to the second component, and specifically, the lot related to the first component. The period from when the remaining number of first parts in a predetermined number (for example, 5) to when the lot is switched to the lot related to the second part and a predetermined number (for example, 5) of second parts is supplied It is.
  • the controller 102 can determine whether or not the current electronic component mounting operation is within the component switching period based on these pieces of information. If it is within the component switching period (S4: YES), the controller 102 shifts the process to S5. On the other hand, when it is not within the component switching period (S4: NO), the controller 102 shifts the process to S6.
  • the controller 102 executes image storage processing and stores the first component image data and the second component image data captured within the component switching period in the storage device 115.
  • the first part image data and the second part image data captured by the part camera 90 are saved before and after the timing when there is a change in the part lot or part vendor, so that a large amount of image data is not handled.
  • Image data having a large change related to the appearance of the component can be stored with a small storage capacity.
  • the controller 102 acquires processing content data relating to the electronic component from the storage device 115 and outputs a control command to the image processing device 110.
  • the image processing apparatus 110 performs image processing on the image data based on the processing content data.
  • the first component image data is subjected to image processing using an algorithm pattern related to the first processing content data.
  • the image processing apparatus 110 corrects, for example, the amount of deviation between the suction nozzle 62 and the center of the component, checks whether the component is rotated or tilted with respect to the suction nozzle 62, and checks the outer shape of the sucked component. Thereby, when the component suction state of the suction nozzle 62 is abnormal or when the component shape itself is abnormal, it is determined as an image processing error.
  • the controller 102 determines the electronic components held by the mounting head 26 based on information such as the total number of electronic components constituting the lot and the number of electronic components used for the mounting operation in the electronic component mounting apparatus 10. It is determined whether or not the first part has been switched to the second part. If it has been switched to the second part (S7: YES), the controller 102 proceeds to S8. On the other hand, if the first component is not switched to the second component (S7: NO), the controller 102 shifts the process to S11.
  • the controller 102 determines whether or not the result of performing the image processing based on the first processing content data on the second component image data is an image processing error based on the result of the image processing in S6. Judging. When it is an image processing error (S8: YES), the controller 102 shifts the process to S9. On the other hand, if it is not an image processing error (S8: NO), the controller 102 can obtain an appropriate determination result even if image processing based on the first processing content data is performed on the second component image. To migrate.
  • the controller 102 cannot obtain an appropriate determination result even if image processing based on the first processing content data is performed on the second component image. Therefore, the image processing content adjustment program (see FIG. 5) is used. Execute. The controller 102 adjusts the first processing content data in accordance with the image processing content adjustment program, thereby enabling processing content data that can perform appropriate image processing on at least the second component image (that is, common processing content data or Any one of the second processing content data) is generated.
  • the controller 102 is the connector (white).
  • algorithm pattern (A) the algorithm pattern in the first process content data
  • the controller 102 is the connector (white).
  • automatic adjustment is performed such as “algorithm pattern (B)”, “algorithm pattern (C)”.
  • the controller 102 executes image processing on the first component image data according to the processing content data automatically adjusted in S21. Since the content of the image processing at this time is automatically adjusted in S21, it is different from the processing content related to the first processing content data.
  • the controller 102 determines whether or not the result of applying the image processing based on the automatically adjusted processing content data to the first component image data is an image processing error. to decide. If it is an image processing error (S23: YES), the controller 102 shifts the process to S24. On the other hand, if it is not an image processing error (S23: NO), the controller 102 proceeds to S26.
  • the controller 102 determines whether or not there are other adjustment items that are not targets of the automatic adjustment in S22 among the items constituting the processing content data. When there is another adjustment item (S24: YES), the controller 102 returns the process to S22 to perform the automatic adjustment related to S22 for the other adjustment item. On the other hand, when there is no other adjustment item (S24: NO), the controller 102 transfers a process to S25.
  • the controller 102 proposes a multi-vendor function via the display 120 or the like based on the processing results in S21 to S24.
  • the multi-vendor function is the second processing content indicating the content of the image processing dedicated to the second component which is the same type and the same spec but different from the first processing content data for the first component image. This means a setting for generating data and performing image processing based on the second processing content data for the second component image.
  • the processing content data is automatically adjusted so that an image processing error of the second component image does not occur for each item constituting the processing content data, but the image based on the same processing content data is used.
  • an image processing error occurs.
  • processing content data specialized for the second component image that is, second processing content data
  • the controller 102 asks “whether or not the second component is set to execute image processing based on second processing content data different from the first processing content data”. The message is displayed on the display 120. Thereafter, the controller 102 ends the image processing content adjustment program, and shifts the processing to S10 of the component mounting processing program (see FIG. 4).
  • the controller 102 proposes to perform image processing of processing contents common to the first part and the second part via the display 120 or the like based on the processing results of S21 to S24. Since the first part and the second part are parts of the same type and the same specification, but only different parts vendors, there may be cases where it is possible to set processing contents common to both parts. If the common processing content data indicating the processing content common to both can be set, it is possible to respond promptly even when the component vendor switching related to the first component and the second component occurs thereafter. This is useful from the viewpoint of determination accuracy of one component and second component and circuit board productivity.
  • the processing content data is automatically adjusted so that an image processing error of the second component image does not occur for each item constituting the processing content data, and image processing based on the same processing content data is performed. Is in a state in which no image processing error occurs even if it is applied to the first component image (S23: NO).
  • processing content data that can be used for both the first component image and the second component image (that is, common processing content data) is generated. ing.
  • the controller 102 determines whether or not to set to execute image processing based on the common processing content data obtained by adjusting the first processing content data for the first component and the second component. Is displayed on the display 120. Thereafter, the controller 102 ends the image processing content adjustment program, and shifts the processing to S10 of the component mounting processing program (see FIG. 4).
  • the controller 102 determines whether or not to approve the processing content proposed in S25 or S26.
  • the determination process of S10 is determined by whether or not an approval operation has been performed on the devices constituting the component mounting system 1.
  • the controller 102 shifts the process to S11.
  • the controller 102 waits for the process while the component mounting operation by the mounting head 26 is stopped.
  • the controller 102 outputs a control signal to the moving device 24 and the mounting head 26 via the drive circuit 106 in order to mount the electronic component held by the mounting head 26 at the mounting position on the circuit board. Specifically, the controller 102 outputs a control signal based on the mounting position data stored in the RAM to the moving device 24, thereby moving the mounting head 26 above the mounting position on the circuit board. Thereafter, the controller 102 outputs a control signal to the mounting head 26 moved to the mounting position, thereby lowering the electronic component and mounting the electronic component at the mounting position on the circuit board.
  • the controller 102 repeats the production loop when all the parts are not mounted.
  • the controller 102 ends the component mounting processing program at the same time as ending the production loop.
  • the component mounting system 1 includes the electronic component mounting device 10, the image processing device 110, the storage device 115, and the display 120.
  • each mounting machine 16 includes a transport device 22, a moving device 24, a mounting head 26, a supply device 28, and a parts camera 90.
  • the mounting machine 16 holds the electronic component supplied by the supply device 28 by the mounting head 26 and images the held electronic component by the parts camera 90. Thereafter, the mounting machine 16 mounts the electronic component on the circuit board transported to a predetermined position by the transport device 22 by holding and moving the electronic component by the mounting head 26.
  • the component mounting system 1 performs image processing on the image data of the electronic component imaged by the parts camera 90 according to the processing content data by the image processing device 110, and the position of the electronic component relative to the mounting head 26.
  • the quality of the electronic component can be determined (S6).
  • the controller 102 Adjusting the processing content of the image processing in the first processing content data corresponding to the first component to generate common processing content data indicating the processing content of the image processing that can correspond to both the first component and the second component.
  • S9 In the subsequent production, it is displayed on the display 120 and proposed to perform image processing related to the common processing content data for the first part and the second part (S26).
  • the component mounting system 1 can perform accurate determination regarding the position of the component and the quality of the component for both the first component and the second component. Can be performed. Since the display 120 proposes to perform image processing based on the common processing content data, the component mounting system 1 can prevent a component mounting operation from being performed in an unintended situation. Thus, it is possible to prevent defective production of circuit boards.
  • the controller 102 may adjust the content of the image processing in the first processing content data to generate common processing content data that can be applied in common to the first component and the second component. If not possible (S24: NO), the second processing content data applicable only to the image data of the second part is generated by automatically adjusting the processing content in the first processing content data (S21 to S24). .
  • the image processing related to the first processing content data is applied to the image related to the first component, and the image related to the second component is applied to the first. 2.
  • a multi-vendor function that applies image processing related to the processing content data is proposed via the display 120 (S25).
  • the component mounting system 1 since it is possible to perform appropriate image processing on the second component, it is possible to maintain high determination accuracy regarding the position of the component and the quality of the component for the second component. And the said component mounting system 1 can suppress the fall of productivity of a circuit board by maintaining the determination precision regarding the position of components, and the quality of components high.
  • the controller 102 stores the image data captured by the parts camera 90 in the storage device 115 within the component switching period (S5), and the first image captured within the component switching period.
  • the processing content of the first processing content data is adjusted using the component image data and the second component image data (S9). Since the first component image data and the second component image data captured during the component switching period are image data having a large change related to the appearance of the component, the component mounting system 1 does not handle a large amount of image data.
  • the processing content related to the first processing content data can be adjusted efficiently.
  • the controller 102 performs processing until the adjustment result (that is, the proposal message) is approved. (S10: NO), and the mounting operation of the second component is stopped. For this reason, according to the component mounting system 1, it is possible to make the user check whether the adjustment result of the image processing content adjustment (S10) is appropriate. Can reflect the intentions.
  • the component mounting system 1 and the electronic component mounting device 10 are examples of the component mounting system in the present invention
  • the supply device 28 and the tape feeder 81 are examples of the component supply unit in the present invention.
  • the mounting head 26 and the suction nozzle 62 are examples of a sampling nozzle in the present invention
  • the parts camera 90 is an example of an imaging unit in the present invention.
  • the storage device 115 is an example of a storage unit in the present invention
  • the image processing device 110 is an example of an image processing execution unit in the present invention.
  • the control device 100 and the controller 102 are examples of a determination unit, a processing content adjustment unit, and a mounting control unit in the present invention
  • the display 120 is an example of a presentation unit in the present invention.
  • the component mounting system 1 includes the electronic component mounting device 10, the control device 100, the image processing device 110, the storage device 115, and the display 120. It is not limited to the embodiment.
  • the component mounting system 1 is realized as the electronic component mounting device 10 by incorporating the control device 100, the image processing device 110, the storage device 115, and the display 120 in one electronic component mounting device 10. It is also possible.
  • the image processing device 110, the storage device 115, and the display 120 are partly built in the electronic component mounting device 10 and the rest are connected to the electronic component mounting device 10 via a network.
  • the system 1 may be realized.
  • the component mounting system 1 is configured to include the electronic component mounting device 10, the image processing device 110, and the storage device 115, but is not limited to this mode. .
  • the component mounting system 1 may be configured such that a plurality of electronic component mounting devices 10 are connected to the image processing device 110, the storage device 115, and the display 120.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un système de montage de composants (1) qui comprend un dispositif d'insertion (10) de composants électroniques, un dispositif de commande (100), un dispositif de traitement d'images (110), un dispositif d'enregistrement (115), et un affichage (120). Le dispositif d'insertion (10) de composants électroniques comprend un dispositif de transport (22), un dispositif de déplacement (24), une tête d'insertion (26), un dispositif d'acheminement (28), et une caméra de parties (90). Pendant une période de changement de composants pendant laquelle un composant électronique passe d'un premier composant à un deuxième composant, la tête d'insertion (26) maintient le composant électronique acheminé, et la caméra de parties (90) capture une image du composant électronique maintenu. Le dispositif de traitement d'images (110) effectue un traitement d'images sur les données d'images provenant de l'image capturée du composant électronique pour évaluer la position du composant électronique et la qualité du composant électronique (S6). Le contrôleur (102) règle les contenus de traitement du traitement d'images effectué sur les premières données de contenu de traitement correspondant au premier composant pour générer des données communes de contenu de traitement (S9), et propose d'effectuer le traitement d'images en fonction des données communes de contenu de traitement (S26) dans une production ultérieure.
PCT/JP2016/067041 2016-06-08 2016-06-08 Système de montage de composants WO2017212566A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019134039A (ja) * 2018-01-30 2019-08-08 ヤマハ発動機株式会社 部品実装装置および部品検査方法
CN111656878A (zh) * 2018-03-22 2020-09-11 株式会社富士 构成装置良好与否判定服务器、检查系统、检查系统用的终端装置及检查装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095033A (ja) * 1995-06-19 1997-01-10 Nagoya Denki Kogyo Kk 印刷配線板の実装部品検査装置
JP2000307298A (ja) * 1999-04-22 2000-11-02 Sony Corp 部品装着方法
JP2005109198A (ja) * 2003-09-30 2005-04-21 Yamagata Casio Co Ltd 部品搭載装置
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245483A (ja) * 2005-03-07 2006-09-14 Yamagata Casio Co Ltd 部品搭載方法及びそれを用いた部品搭載装置
JP5819697B2 (ja) * 2011-09-29 2015-11-24 ヤマハ発動機株式会社 部品ライブラリデータの作成方法
JP6363606B2 (ja) * 2013-08-26 2018-07-25 株式会社Ｆｕｊｉ 部品実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095033A (ja) * 1995-06-19 1997-01-10 Nagoya Denki Kogyo Kk 印刷配線板の実装部品検査装置
JP2000307298A (ja) * 1999-04-22 2000-11-02 Sony Corp 部品装着方法
JP2005109198A (ja) * 2003-09-30 2005-04-21 Yamagata Casio Co Ltd 部品搭載装置
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019134039A (ja) * 2018-01-30 2019-08-08 ヤマハ発動機株式会社 部品実装装置および部品検査方法
CN111656878A (zh) * 2018-03-22 2020-09-11 株式会社富士 构成装置良好与否判定服务器、检查系统、检查系统用的终端装置及检查装置

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CN109196971B (zh) 2020-10-20
CN109196971A (zh) 2019-01-11
JPWO2017212566A1 (ja) 2019-04-04
JP6807386B2 (ja) 2021-01-06

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