WO2019207730A1 - Dispositif de montage de composant et procédé d'inspection - Google Patents

Dispositif de montage de composant et procédé d'inspection Download PDF

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Publication number
WO2019207730A1
WO2019207730A1 PCT/JP2018/017057 JP2018017057W WO2019207730A1 WO 2019207730 A1 WO2019207730 A1 WO 2019207730A1 JP 2018017057 W JP2018017057 W JP 2018017057W WO 2019207730 A1 WO2019207730 A1 WO 2019207730A1
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WO
WIPO (PCT)
Prior art keywords
inspection
control unit
detailed
sub
value
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PCT/JP2018/017057
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English (en)
Japanese (ja)
Inventor
和志 高間
Original Assignee
ヤマハ発動機株式会社
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Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2018/017057 priority Critical patent/WO2019207730A1/fr
Priority to JP2020515405A priority patent/JP6884924B2/ja
Publication of WO2019207730A1 publication Critical patent/WO2019207730A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a component mounting apparatus and an inspection method, and more particularly, to a component mounting apparatus and an inspection method including a main control unit and a sub control unit provided separately from the main control unit.
  • a component mounting apparatus including a main control unit and a sub control unit provided separately from the main control unit is known.
  • a component mounting apparatus is disclosed in, for example, Japanese Patent No. 6174487.
  • Japanese Patent No. 6174487 discloses a pick-and-place tool including a camera, a position measurement controller, an image writing controller, and an image writer.
  • position data of a die (component) on a workpiece (substrate) is acquired by image processing by a position measurement controller.
  • pattern image data to be written on the workpiece is generated by the image writing controller based on the position data acquired by the position measurement controller.
  • a pattern is written on the workpiece by the image writer based on the pattern image data generated by the image writing controller.
  • the image writing controller is used as a main controller, and the processing performed in the image writing controller is performed by a sub controller having a lower processing capacity than the main controller. It is thought that it is shared by a certain position measurement controller.
  • the present invention has been made in order to solve the above-described problems, and one object of the present invention is to provide a component mounting apparatus capable of both suppressing an increase in processing time and suppressing a decrease in inspection accuracy. And providing an inspection method.
  • a component mounting apparatus includes a head unit including a head for mounting a component on a board, a main control unit that performs main operation control of the component mounting apparatus including the head unit, and a main control unit.
  • a sub-control unit provided separately, and the sub-control unit is configured to perform a simple inspection based on an acquisition value for simple inspection acquired based on an inspection object including at least a component mounted on a substrate, In the simple inspection, when the acquired value for the simple inspection is within a predetermined range with respect to the threshold value, either the main control unit or the sub control unit is configured to perform a detailed inspection that is more detailed than the simple inspection.
  • the sub-control unit is simplified based on the acquired value for simple inspection acquired based on the inspection object including at least the component mounted on the substrate. It is configured to perform an inspection. Further, in the simple inspection, when the acquisition value for the simple inspection is within a predetermined range with respect to the threshold value, either the main control unit or the sub control unit is configured to perform a detailed inspection more detailed than the simple inspection. Yes. As a result, the inspection object is mainly determined by the simple inspection with a smaller processing load than the detailed inspection in the inspection object inspection, and the inspection object is determined not only by the simple inspection but also by the detailed inspection when necessary.
  • the sub-control unit performs simple inspection without performing the detailed inspection.
  • the inspection result of the inspection is determined to be correct. If configured in this way, if the acquired value for simple inspection is outside the predetermined range of the threshold, it is considered that the inspection result of the simple inspection and the inspection result of the detailed inspection are likely to match. Since the inspection of the inspection object is completed, the inspection object can be efficiently inspected.
  • the detailed inspection is performed by inspecting the inspection object using the same inspection items as the inspection items in the simple inspection, and the acquisition method for the acquisition value for the simple inspection in the simple inspection; Are configured to perform inspection based on the acquired value for detailed inspection acquired by different acquisition methods. If configured in this way, the inspection items are the same as those of the simple inspection, but the inspection is performed based on the acquisition value for detailed inspection different from the acquisition value for the simple inspection. Since the same inspection item can be inspected, the inspection accuracy of the inspection object can be further improved.
  • it further includes an imaging unit that images the inspection object, and the sub-control unit performs a simple inspection using the acquired value for simple inspection acquired based on the image of the inspection object captured by the imaging unit.
  • the main control unit and the sub control unit is configured to perform the detailed inspection using the acquired value for detailed inspection acquired based on the image by a method different from the acquired value for simple inspection. . If comprised in this way, since the waste of a test
  • the main control unit has a simple inspection acquisition value within a predetermined range with respect to the threshold value in the simple inspection by the sub control unit. In this case, a detailed inspection is performed. If comprised in this way, since it can suppress the increase in the processing time of a detailed test
  • the sub control unit performs the simple inspection when the acquired value for the simple inspection is within a predetermined range with respect to the threshold value. It is configured to perform a detailed inspection. If comprised in this way, the processing load concerning a main control part can be reduced rather than the case where a main process performs a detailed process.
  • the sub control unit performs the detailed inspection based on the processing load of the process being executed being larger than a predetermined value.
  • the main control unit performs detailed inspection based on the fact that the processing load of the process being executed is equal to or less than a predetermined value.
  • the main control unit or the sub control unit performs the detailed inspection
  • the detailed inspection is performed.
  • the threshold value of the simple test is corrected based on the test result and the acquired value for simple test compared with the threshold value in the simple test. If comprised in this way, the test result of a simple test
  • An inspection method is an inspection method in a substrate working apparatus including a main control unit and a sub control unit provided separately from the main control unit. Performs simple inspection based on the acquired value for simple inspection acquired based on the inspection object including the component mounted by the work on the board or printed solder, and the acquired value for simple inspection is predetermined with respect to the threshold value in the simple inspection. Based on being within the range, either the main control unit or the sub-control unit performs a detailed inspection that is more detailed than the simple inspection.
  • the sub-control unit acquires the component mounted by the operation on the substrate of the substrate working apparatus or the inspection object including the printed solder. Perform simple inspection based on the acquired value for simple inspection. Further, in the simple inspection, when the acquired value for the simple inspection is within a predetermined range with respect to the threshold value, a detailed inspection that is more detailed than the simple inspection is performed by either the main control unit or the sub control unit. As a result, the inspection object is mainly determined by the simple inspection with a smaller processing load than the detailed inspection in the inspection object inspection, and the inspection object is determined not only by the simple inspection but also by the detailed inspection when necessary. Therefore, in the inspection of the inspection object, it is possible to obtain an inspection method capable of achieving both suppression of an increase in processing time and suppression of a decrease in inspection accuracy.
  • FIG. 1st Embodiment It is a top view showing the whole component mounting device composition by a 1st embodiment.
  • the component mounting apparatus by 1st Embodiment it is the side view which showed the state which images the mounting head which mounts components on a board
  • the component mounting apparatus according to the first embodiment it is a block diagram showing a control configuration of each of a main control unit and a sub control unit. It is a schematic diagram explaining the simple test
  • the component mounting apparatus by 1st Embodiment it is the schematic diagram which showed the case classification of whether detailed processing is performed in a main control part. It is a flowchart of the test target object inspection process of the component mounting apparatus according to the first embodiment. It is a flowchart of the test target object inspection process of the component mounting apparatus according to the second embodiment. It is a flowchart of the test target object inspection process of the component mounting apparatus according to the third embodiment. It is a flowchart of the test target object inspection process of the component mounting apparatus according to the fourth embodiment.
  • the component mounting apparatus 1 is a component mounting apparatus 1 that transports a substrate P in the X direction by a pair of conveyors 3 and mounts a component E on the substrate P at a mounting work position M.
  • the conveyance direction of the pair of conveyors 3 on which the substrates P are placed and the opposite direction are defined as the X direction
  • the direction perpendicular to the X direction in the horizontal direction is defined as the Y direction
  • a direction orthogonal to the X direction and the Y direction is defined as a Z direction (vertical direction).
  • the component mounting apparatus 1 is an example of the “board working apparatus” in the claims.
  • the component mounting apparatus 1 includes a base 2, a pair of conveyors 3, a component supply unit 4, a head unit 5, a support unit 6, a pair of rail units 7, a component recognition imaging unit 8, and an imaging unit 9. And a main control unit 10 and a sub-control unit 11.
  • the imaging unit 9 is an example of an “imaging unit” in the claims.
  • the pair of conveyors 3 are installed on the base 2 and configured to transport the substrate P in the X direction. Further, the pair of conveyors 3 is configured to hold the substrate P being transported in a state of being stopped at the mounting work position M. Further, the pair of conveyors 3 is configured so that the interval in the Y direction can be adjusted according to the size of the substrate P.
  • the component supply unit 4 is disposed outside the pair of conveyors 3 (Y1 side and Y2 side).
  • the component supply unit 4 is provided with a plurality of tape feeders 4a.
  • the tape feeder 4a holds a reel (not shown) around which a tape holding a plurality of parts E at a predetermined interval is wound.
  • the tape feeder 4a is configured to supply the component E from the tip of the tape feeder 4a by sending a tape that holds the component E by rotating the reel.
  • the component E includes electronic components such as an IC, a transistor, a capacitor, and a resistor.
  • the head unit 5 is disposed above the pair of conveyors 3 and the component supply unit 4, and includes a plurality (five) of mounting heads 5a with nozzles 5b (see FIG. 2) attached to the lower end, and a board recognition camera. 5c.
  • the mounting head 5a is an example of the “head” in the claims.
  • the mounting head 5a is configured to be movable in the Z direction (vertical direction), and sucks the component E supplied from the tape feeder 4a by the negative pressure generated at the tip of the nozzle 5b by a pressure source (not shown).
  • the component E is mounted at a mounting position on the substrate P.
  • the substrate recognition camera 5c is configured to image the fiducial mark F of the substrate P in order to recognize the position of the substrate P. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component E on the board P.
  • the support unit 6 includes a motor 61.
  • the support unit 6 is configured to move the head unit 5 in the X direction by driving a motor 61. Both ends of the support portion 6 are supported by a pair of rail portions 7.
  • the pair of rail portions 7 are fixed on the base 2.
  • the rail portion 7 on the X1 side includes a motor 71.
  • the rail portion 7 is configured to move the support portion 6 in the Y direction by driving a motor 71.
  • the head unit 5 is movable in the X direction
  • the support unit 6 is movable in the Y direction, whereby the head unit 5 is movable in the XY direction.
  • the component recognition imaging unit 8 is fixed on the upper surface of the base 2.
  • the component recognition imaging unit 8 is disposed outside the pair of conveyors 3 (Y1 side and Y2 side).
  • the component recognition imaging unit 8 images the component E sucked by the nozzle 5b of the mounting head 5a from the Z2 side (lower side) in order to recognize the suction state (suction posture) of the component E prior to the mounting of the component E. Is configured to do.
  • the main controller 10 can acquire the suction state of the component E sucked by the nozzle 5b of the mounting head 5a.
  • the imaging unit 9 is provided in the head unit 5. As shown in FIG. 2, the imaging unit 9 is configured to be able to image the mounting position of the substrate P from a plurality of directions. Specifically, the imaging unit 9 includes a first camera 9a, a second camera 9b, and an illumination 9c. The second camera 9b is arranged offset to the Z1 side (upper side) than the first camera 9a. In the imaging unit 9, the first camera 9a and the second camera 9b can image the mounting position of the component E by the mounting head 5a from a plurality of directions (angles) with respect to the Z direction (vertical direction), respectively. It is. That is, the imaging unit 9 is configured to capture the periphery of the mounting position of the component E from a plurality of directions and capture the first image by the first camera 9a and the second image by the second camera 9b.
  • the illumination 9c is configured to emit light during imaging by the first camera 9a and the second camera 9b.
  • the illumination 9c is provided around the first camera 9a and the second camera 9b.
  • the illumination 9c has a light source such as an LED (light emitting diode).
  • the main control unit 10 (see FIG. 1) is configured to perform main operation control of the component mounting apparatus 1 according to a predetermined program.
  • the main control unit 10 includes a communication unit 21, a motor control unit 22, a storage unit 23, an image processing unit 24, and a CPU (Central Processing Unit) 25, as shown in FIG. It is out.
  • a communication unit 21 a communication unit 21, a motor control unit 22, a storage unit 23, an image processing unit 24, and a CPU (Central Processing Unit) 25, as shown in FIG. It is out.
  • the communication unit 21 is configured to transmit / receive information to / from a communication unit 31 described later of the sub-control unit 11 disposed in the head unit 5.
  • the motor control unit 22 is configured to control the driving of the motor 61 of the support unit 6 and the motor 71 of the rail unit 7 by being controlled by the CPU 25.
  • the storage unit 23 acquires the detailed inspection acquisition value 23a acquired based on the inspection object Ta, which is the component E mounted on the substrate P, and the detailed inspection program that determines pass / fail based on the detailed inspection acquisition value 23a. 23b.
  • the detailed inspection acquisition value 23a and the detailed inspection program 23b will be described later in detail.
  • the image processing unit 24 is configured to process image information transmitted from the communication unit 31 of the sub-control unit 11 to be described later, and cause the CPU 25 of the main control unit 10 to acquire the detailed inspection acquisition value 23a.
  • the sub control unit 11 is configured to assist the main control unit 10. Specifically, as shown in FIG. 3, the sub control unit 11 includes a communication unit 31, a storage unit 32, an image processing unit 33, and a CPU 34.
  • the communication unit 31 is configured to transmit and receive information to and from the communication unit 21 of the main control unit 10 disposed on the base 2.
  • the storage unit 32 includes a simple inspection acquisition value 32a acquired based on the inspection object Ta, which is the component E mounted on the substrate P, and a simple inspection program that determines pass / fail based on the simple inspection acquisition value 32a. 32b.
  • the acquired value 32a for simple inspection and the simple inspection program 32b will be described later in detail.
  • the image processing unit 33 processes the image information of the first image and the image information of the second image captured by the first camera 9a and the second camera 9b, respectively, and the CPU 34 of the sub-control unit 11 acquires the simplified inspection acquisition value. 32a is acquired.
  • the image processing unit 33 processes the image information of the first image and the image information of the second image captured by each of the first camera 9a and the second camera 9b, and the communication unit 31 is processed by the CPU 34 of the sub-control unit 11. It is comprised so that it may transmit to the main control part 10 via.
  • the component mounting apparatus 1 selectively combines a simple inspection performed on the basis of the simple inspection program 32b by the sub-control unit 11 and a detailed inspection performed on the basis of the detailed inspection program 23b by the main control unit 10.
  • the inspection object inspection for determining pass / fail is performed.
  • the simple inspection is an inspection in which the reliability of the inspection result is lower than that of the detailed inspection, but the processing load during execution is smaller than that of the detailed inspection.
  • the detailed inspection is an inspection in which the reliability of the inspection result is higher than that of the detailed inspection, but the processing load during execution is larger than that of the simple inspection.
  • the inspection object inspection is an example of the “inspection method” in the claims.
  • the inspection object inspection a simple inspection is performed and then a detailed inspection is performed if necessary.
  • the detailed inspection is an inspection performed in order to improve the accuracy of the inspection result for the inspection item by inspecting the inspection item in the simple inspection over the processing time than the simple inspection.
  • the inspection object inspection is, for example, an inspection of the presence or absence of the component E on the substrate P when the component E is mounted on the substrate P by the mounting head 5a. That is, in the inspection object inspection, each of the simple inspection and the detailed inspection is configured to inspect the presence or absence of the component E on the substrate P after mounting the component E based on the image of the component E imaged by the imaging unit 9. Has been.
  • the sub-control unit 11 is configured to acquire the acquisition value 32a for simple inspection based on the part E by the simple inspection program 32b, and to perform simple inspection based on the acquisition value 32a for simple inspection. Specifically, the sub-control unit 11 is configured to perform the simple inspection by acquiring the acquisition value 32a for simple inspection based on the image of the part E imaged by the imaging unit 9.
  • the imaging unit 9 captures the first image and the second image by the first camera 9a and the second camera 9b, respectively, before and after mounting.
  • the sub-control unit 11 compares the image P1 before mounting the component E at the mounting position imaged by either the first camera 9a or the second camera 9b of the imaging unit 9 with the image P2 after mounting, and the mounting state Is configured to determine. Specifically, as shown in FIG. 4, the sub control unit 11 acquires a difference image P3 between an image P1 before mounting the component E at the mounting position and an image P2 after mounting the component E at the mounting position. It is configured as follows. At this time, the sub-control unit 11 includes a mounting position of the target component E, and does not include another component E adjacent to the target component E and a board feature (for example, pattern, silk, electrode, solder, etc.). The determination area J is set. The sub-control unit 11 is configured to acquire a difference image P3 between the image P1 before mounting and the image P2 after mounting in the mounting determination region J.
  • the sub-control unit 11 determines whether or not the component E has been normally mounted based on the acquired difference image P3. Specifically, the sub control unit 11 has an area of a change amount equal to or greater than a predetermined value among all the pixel values in the mounting determination region J based on the change amounts of the plurality of pixel values on the difference image P3. By determining whether or not the threshold T1 or more is included, it is configured to determine whether or not the component E has been successfully mounted.
  • the acquired value 32a for simple inspection is an area of a changed portion of a predetermined value or more among all the pixel values on the difference image P3.
  • the threshold value T1 is an example of the “threshold value” in the claims.
  • the sub-control unit 11 performs the simple inspection based on the area that has changed by a predetermined value or more among the pixel values acquired from the difference image P3 with respect to the inspection item of presence / absence of the component E on the substrate P. It is configured.
  • the main control unit 10 is configured to acquire the detailed inspection acquisition value 23a based on the part E by the detailed inspection program 23b and to perform the detailed inspection based on the detailed inspection acquisition value 23a. Specifically, the main control unit 10 is configured to perform the detailed inspection by acquiring the detailed inspection acquisition value 23a based on the image of the component E imaged by the imaging unit 9.
  • the main control unit 10 includes the first camera 9a and the second camera 9a of the imaging unit 9 between the mounting head 5a mounting the component E at the mounting position and the completion of the rise from the mounting position.
  • a first image and a second image obtained by imaging the mounting determination area J by each of the cameras 9b are acquired from the sub-control unit 11 at substantially the same time.
  • the main control unit 10 uses the height measurement method based on stereo matching based on the first image and the second image, so that the height position information (the height position of the upper surface of the substrate P) in the mounting determination region J is obtained. , The height position of the upper surface of the component E, etc.).
  • the main control unit 10 determines whether the height position information in the mounting determination area J includes an area greater than or equal to a predetermined height. By doing so, it is configured to determine whether or not the component E is mounted at the mounting position.
  • the detailed inspection acquisition value 23a is an area of a predetermined height or more in the height position information in the mounting determination region J.
  • the main control unit 10 acquires (generates) a three-dimensional image of the mounting determination area J based on the height position information in the mounting determination area J and is acquired. It is determined whether or not the component E has been successfully mounted at the mounting position by determining whether or not a portion having a predetermined height or more (shown by hatching in FIG. 5) is included in the three-dimensional image. It is configured.
  • the main control unit 10 performs a detailed inspection based on the height position information in the mounting determination area J acquired from the first image and the second image for the inspection item of the presence or absence of the component E on the board P. Configured to do.
  • the main control unit 10 is configured to perform a detailed inspection when the acquired value 32 a for simple inspection satisfies a predetermined condition in the simple inspection.
  • the main control unit 10 is configured to perform a detailed inspection when the acquired value 32a for simple inspection is within a predetermined range R including the threshold value T1 in the simple inspection.
  • the sub-control unit 11 performs the inspection for the simple inspection without performing the detailed inspection. It is configured to determine that the result is correct.
  • the predetermined range R indicates a range from a lower limit value that is smaller than the threshold value T1 to an upper limit value that is greater than the threshold value T1.
  • the sub-control unit 11 determines that the inspection item “presence / absence of the part E on the board P” is larger than the threshold T1.
  • the test result is judged to be good.
  • a condition for performing the detailed inspection is set on the premise of the determination by the sub-control unit 11. That is, in the component mounting apparatus 1, the detailed inspection is performed when the simple inspection acquired value 32 a is in the condition 1, with the condition 1 in which the inconsistency of the quality determination of the inspection in the simple inspection and the detailed inspection is unlikely to occur. Absent.
  • the detailed inspection is performed when the condition 2 is set as the condition 2 where the inconsistency in the quality determination of the inspection in each of the simple inspection and the detailed inspection is likely to occur, and when the acquired value 32 a for the simple inspection is in the condition 2. .
  • the sub-control unit 11 When the area of the amount of change equal to or greater than a predetermined value among all the pixel values in the mounting determination area J is less than the threshold value T1 with respect to the inspection item of presence / absence of the component E on the board P, the sub-control unit 11 The test result is determined to be defective.
  • a condition for performing the detailed inspection is set on the premise of the determination by the sub-control unit 11. That is, in the component mounting apparatus 1, the detailed inspection is performed when the condition 3 is set as the condition 3 in which the inconsistency between the inspection quality determinations in the simple inspection and the detailed inspection is likely to occur, and when the acquired value 32 a for the simple inspection is in the condition 3. .
  • the detailed inspection is performed when the condition 4 is set as the condition 4 in which the inconsistency in the quality determination of the inspection in the simple inspection and the detailed inspection is unlikely to occur, and when the acquired value 32 a for the simple inspection is in the condition 4. Absent.
  • the component mounting apparatus 1 when the acquired value 32a for simple inspection satisfies the conditions 2 and 3, and the reliability of the determination by the sub-control unit 11 is considered to be low, the detailed inspection is performed. That is, the component mounting apparatus 1 has a predetermined range in which the area of the change amount equal to or larger than a predetermined value among all the pixel values in the mounting determination region J with respect to the inspection item of presence / absence of the component E on the board P includes the threshold T1. If it is determined by the sub-control unit 11 to be within R, the main control unit 10 performs a detailed inspection.
  • the component mounting apparatus 1 determines whether or not an area greater than or equal to a predetermined height is included in the inspection item “presence / absence of the component E on the board P” based on the height position information of the mounting determination region J.
  • the main control unit 10 determines whether or not.
  • the detailed inspection is not performed when the acquisition value 32a for simple inspection satisfies the conditions 1 and 4 and it is considered that the reliability of the determination by the sub-control unit 11 is high.
  • the component mounting apparatus 1 has a predetermined range in which a portion having a change amount greater than or equal to a predetermined value among all the pixel values in the mounting determination region J includes the threshold value T1 with respect to the inspection item of presence / absence of the component E on the board P. If it is determined by the sub-control unit 11 to be outside R, the main control unit 10 is configured not to perform detailed inspection.
  • the inspection object inspection process will be described with reference to FIG.
  • the sub-control unit 11 performs a simple inspection, and when the acquired value 32a for simple inspection used in the simple inspection is within the predetermined range R, the main control unit 10 performs detailed processing to perform the simple inspection.
  • the process is terminated as it is.
  • step S ⁇ b> 1 in the component mounting apparatus 1, a simple inspection is performed by the sub-control unit 11. That is, referring to the above-described example of the simple inspection (FIG. 4), the sub-control unit 11 determines whether or not the area of the amount of change greater than or equal to the predetermined value among all the pixel values on the difference image P3 is greater than or equal to the threshold T1. Is judged. In step S2, in the component mounting apparatus 1, the simple inspection by the sub-control unit 11 is finished.
  • step S3 the sub-control unit 11 determines whether or not the simple test acquisition value 32a is within a predetermined range R with respect to the threshold value T1. That is, referring to an example of the simple inspection described above, the sub-control unit 11 determines whether or not the area of the amount of change greater than or equal to a predetermined value among all the pixel values on the difference image P3 is within a predetermined range R including the threshold T1. To be judged. In the component mounting apparatus 1, when the acquired value 32a for simple inspection is within the predetermined range R, the process proceeds to step S4.
  • step S7 when the acquired value 32a for simple inspection is outside the predetermined range R, the process proceeds to step S7, and the main control unit 10 determines whether the inspection result of the simple inspection is good. In this case, in the component mounting apparatus 1, if the inspection result of the simple inspection is good, the inspection object inspection processing is terminated as it is, and if the inspection result of the simple inspection is defective, the process proceeds to step S8 and the return processing is performed.
  • step S ⁇ b> 4 in the component mounting apparatus 1, the main body that performs the inspection object inspection process is switched from the sub control unit 11 to the main control unit 10 by the sub control unit 11.
  • step S ⁇ b> 5 in the component mounting apparatus 1, a detailed inspection is started by the main control unit 10. That is, referring to the above-described example of the detailed inspection (FIG. 5), the main control unit 10 determines whether or not an area having a predetermined height or more is greater than or equal to a threshold based on the height position information of the mounting determination region J. Based on the above, the presence / absence of the component E on the substrate P is determined.
  • the main control unit 10 determines that the inspection result of the detailed inspection is a correct inspection result.
  • step S6 in the component mounting apparatus 1, the detailed inspection by the main control unit 10 is completed.
  • step S ⁇ b> 7 in the component mounting apparatus 1, the main control unit 10 determines whether the result of the detailed inspection is good.
  • the process proceeds to step S8.
  • the inspection object inspection process is finished as it is.
  • step S8 after the return process for the inspection item of the detailed inspection is performed by the user, the inspection object inspection process is ended.
  • the sub-control unit 11 is configured to perform a simple inspection based on the acquisition value 32a for simple inspection acquired based on the inspection target Ta that is the part E.
  • the main control unit 10 is configured to perform a detailed inspection that is more detailed than the simple inspection when the acquired value 32a for the simple inspection is within a predetermined range R including the threshold value T1.
  • the inspection object Ta is mainly determined by the simple inspection having a processing load smaller than that of the detailed inspection.
  • the inspection object Ta is not only the simple inspection but also the detailed inspection. Since the determination is performed, in the inspection of the inspection object Ta, it is possible to achieve both suppression of an increase in processing time and suppression of a decrease in inspection accuracy.
  • the reliability of the inspection determination of the inspection target Ta can be ensured, it is possible to suppress the error stop process that is not necessary due to the erroneous determination of the inspection of the inspection target Ta.
  • the ratio of performing the detailed inspection after performing the simple inspection is about 5%, the majority is the simple inspection. Therefore, the effect of suppressing an increase in processing time is great.
  • the sub-control unit 11 does not perform the detailed inspection when the acquired value 32a for the simple inspection is outside the predetermined range R including the threshold value T1 in the simple inspection.
  • the simple test result is judged to be correct.
  • the acquired value 32a for simple inspection is outside the predetermined range R including the threshold value T1
  • it is considered that the inspection result of the simple inspection and the inspection result of the detailed inspection easily match. Since the inspection of the inspection object Ta is completed, the inspection object inspection process can be performed efficiently.
  • the inspection target Ta is inspected using the same inspection items as the inspection items in the simple inspection, and the acquisition value 32a for the simple inspection in the simple inspection is acquired. It is comprised so that it may test
  • the sub-control unit 11 is simplified by the simple inspection acquisition value 32a acquired based on the image of the inspection target Ta that is the part E imaged by the imaging unit 9. It is configured to perform an inspection. Further, the main control unit 10 is configured to perform a detailed inspection using the detailed inspection acquisition value 23a acquired based on the image by a method different from the simple inspection acquisition value 32a. Thus, by diverting the image captured in the simple inspection in the detailed inspection, it is possible to suppress the waste of the inspection, so that the inspection can be performed efficiently.
  • the main control unit 10 performs the detailed inspection when the acquisition value 32a for simple inspection is within the predetermined range R including the threshold T1 in the simple inspection by the sub-control unit 11. Configured to do. Thereby, since an increase in the processing time of the detailed inspection can be suppressed by performing the detailed inspection in the main control unit 10, an increase in the time required for the inspection of the inspection object Ta can be further suppressed.
  • the sub control unit 211 Inspection object inspection, in the component mounting apparatus 201 according to the second embodiment, as illustrated in FIGS. 3 and 8, when the acquired value 32a for simple inspection is within a predetermined range R including the threshold value T1 in the simple inspection, the sub control unit 211 It is configured to perform a detailed inspection. Further, in the component mounting apparatus 201, when the acquired value 32a for simple inspection is outside the predetermined range R including the threshold value T1 in the simple inspection, the sub-control unit 211 performs the inspection for the simple inspection without performing the detailed inspection. It is configured to determine that the result is correct.
  • the component mounting apparatus 201 As described above, in the component mounting apparatus 201, a simple inspection is performed by the sub-control unit 211 in a normal case, and a detailed inspection is performed by the sub-control unit 211 when necessary.
  • the remaining configuration of the second embodiment is the same as that of the first embodiment.
  • the sub-control unit 211 performs a simple inspection, and when the acquisition value 32a for simple inspection used in the simple inspection is within the predetermined range R, the sub-control unit 211 further performs a detailed process to simplify the inspection object inspection process. When the acquired value for inspection 32a is outside the predetermined range R, the process is terminated as it is.
  • steps S1 to S3 are the same as the inspection object inspection processing of the first embodiment, and thus description thereof is omitted.
  • step S21 in the component mounting apparatus 201, the sub-control unit 211 starts a detailed inspection.
  • step S22 in the component mounting apparatus 201, the detailed inspection by the sub control unit 211 ends.
  • step S23 in the component mounting apparatus 201, the sub-control unit 211 determines whether the result of the detailed inspection is good.
  • the sub-control unit 11 determines that the inspection result of the detailed inspection is a correct inspection result.
  • the process proceeds to step S24.
  • step S24 after the return processing for the inspection item of the detailed inspection is performed by the user, the inspection object inspection processing is ended.
  • the sub-control unit 211 is configured to perform a detailed inspection when the acquired value 32a for the simple inspection is within the predetermined range R including the threshold value T1 in the simple inspection. . Thereby, the processing load concerning the main control part 10 can be reduced rather than the case where the main control part 10 performs a detailed process.
  • the remaining effects of the second embodiment are similar to those of the first embodiment.
  • the sub-control unit 311 Based on the inspection result of the inspection and the acquired value 32a for simple inspection compared with the threshold value T1 in the simple inspection, the threshold value T1 of the simple inspection is corrected. That is, when the inspection result of the simple inspection is good and the inspection result of the detailed inspection is bad, the sub-control unit 311 can correctly determine that the inspection result for the simple inspection acquisition value 32a in the simple inspection is defective. As described above, the threshold value T1 is updated based on the acquisition value 32a for simple inspection.
  • the sub-control unit 311 can correctly determine that the inspection result for the acquired value 32a for simple inspection is good in the simple inspection. As described above, the threshold value T1 is updated based on the acquisition value 32a for simple inspection.
  • the sub-control unit 311 corrects the threshold value T1 for the simple inspection so that the inspection result for the simple inspection and the inspection result for the detailed inspection match.
  • Other configurations of the third embodiment are the same as those of the first embodiment.
  • the inspection object inspection process is a process for correcting the simple inspection when the inspection result of the simple inspection is different from the inspection result of the detailed inspection.
  • steps S1 to S8 are the same processing as the inspection object inspection processing of the first embodiment, and thus description thereof is omitted.
  • step S31 in the component mounting apparatus 301, the main control unit 310 determines whether the inspection result of the simple inspection is different from the inspection result of the detailed inspection.
  • the process proceeds to step S32.
  • the inspection result of the simple inspection is the same as the inspection result of the detailed inspection, or when only the simple inspection is performed, the inspection object inspection processing is ended as it is.
  • step S32 after the sub-control unit 311 corrects the threshold value T1 of the simple inspection based on the inspection result of the detailed inspection and the current acquisition value 32a for the simple inspection, the inspection object inspection process is ended.
  • the sub-control unit 311 when the inspection result of the simple inspection is different from the inspection result of the detailed inspection, the sub-control unit 311 performs the inspection result of the detailed inspection and the simple inspection. Based on the acquired value 32a for simple inspection compared with the threshold T1, the threshold T1 for simple inspection is modified. Thereby, since the inspection result of a simple inspection and the inspection result of a detailed inspection can be matched, the precision of a simple inspection can be improved.
  • the remaining effects of the third embodiment are similar to those of the first embodiment.
  • the component mounting apparatus 401 performs a detailed inspection by the sub-control unit 411 based on the fact that the processing load being executed in the main control unit 410 is larger than a predetermined value.
  • the main control unit 410 performs detailed inspection based on the fact that the processing load being executed in the main control unit 410 is below a predetermined position. That is, in the component mounting apparatus 401, after the simple inspection is performed in the sub-control unit 411, the main control unit 410 or the sub-control unit 411 is inspected in the state of the mounting operation when necessary. Detailed processing is performed in either of the above.
  • the main control unit 410 when the mounting operation is performed in the component mounting apparatus 401 and the processing load of the main control unit 410 is high, the sub-control performs detailed processing, and the mounting operation is not performed in the component mounting apparatus 401 and the main control unit When the processing load of 410 is low (waiting for board loading, waiting for board loading, etc.), the main control unit 410 is configured to perform detailed processing.
  • the main control unit 410 or the sub control unit 411 selectively performs the detailed inspection.
  • the other structure of 4th Embodiment is the same as that of 1st and 2nd Embodiment.
  • the inspection object inspection process will be described below with reference to FIG.
  • the sub-control unit 411 performs a detailed inspection when the processing load is large according to the processing load status of the main control unit 410, and the processing load is small.
  • the main control unit 410 performs a detailed inspection.
  • steps S1 to S3 are the same as the inspection object inspection processing of the first embodiment, and thus the description thereof is omitted.
  • step S41 in the component mounting apparatus 401, the main control unit 410 determines whether or not the processing load on the main control unit 410 is greater than a predetermined value. In the component mounting apparatus 401, when the processing load of the main control unit 410 is larger than a predetermined value, the process proceeds to step S21. In the component mounting apparatus 401, when the processing load of the main control unit 410 is equal to or less than a predetermined value, the process proceeds to step S4. Steps S4 to S8 are the same processing as the inspection object inspection processing of the first embodiment, and steps S21 to S24 are the same processing as the inspection object inspection processing of the second embodiment, and thus description thereof is omitted. .
  • the component mounting apparatus 401 performs a detailed inspection by the sub-control unit 411 based on the processing load of the process being executed being larger than a predetermined value, and performs the process being executed.
  • the main control unit 410 is configured to perform a detailed inspection based on the processing load being equal to or less than a predetermined value. Thereby, it is possible to suppress an excessive processing load on the main control unit 410 compared to the case where the detailed processing is always performed by the main control unit 410, and the inspection target Ta is compared to the case where the detailed processing is always performed by the sub control unit 411. Since the time required for the inspection can be shortened, the detailed processing can be processed efficiently.
  • the remaining effects of the fourth embodiment are similar to those of the first and second embodiments.
  • the example in which the pair of conveyors 3 is configured to hold the substrate P being transported while being stopped at the mounting work position M has been described. It is not limited to this.
  • a plurality of pairs of conveyors may be arranged, and a plurality of mounting work positions may be provided.
  • the main control unit according to the fourth embodiment determines whether or not the mounting operation is performed in at least one of the plurality of mounting work positions in the component mounting apparatus. Whether a detailed inspection is to be performed is selected by one of the control units.
  • the sub-control unit 11 uses the pixel value acquired from the difference image P 3 for the inspection item of presence / absence of the component E on the board P.
  • the sub-control unit may be configured to perform a simple inspection based on the amount of change in the distance between the sensor and the substrate measured by the distance sensor with respect to the inspection item of the presence / absence of components on the substrate. .
  • the sub-control unit may be configured to perform a simple inspection based on the height position information of the narrowed range on the board obtained by the stereo camera for the inspection item of presence / absence of components on the board. Good.
  • the sub-control unit may be configured to perform a simple inspection based on component shape data for an inspection item of correctness / incorrectness determination of the component mounted on the board.
  • the main control unit 10 (310, 410) or the sub control unit 11 (211, 311) performs the first operation on the inspection item of the presence / absence of the component E on the board P.
  • the main control unit or the sub-control unit is based on details such as the polarity of the electrode of the component as well as the data of the shape of the component with respect to the inspection item of whether the component mounted on the board is correct or incorrect. It may be configured to perform an inspection.
  • the main control unit or the sub control unit may be configured to perform a detailed inspection based on component recognition by a neural network with respect to an inspection item of correctness / incorrectness determination of components mounted on the board.
  • the inspection object inspection process is performed in the component mounting apparatus 1 (201, 301, 401) is shown, but the present invention is not limited to this.
  • the inspection object inspection process may be used for solder inspection in a printing apparatus.
  • the sub controller 11 (211, 311, 411) is arranged in the head unit 5.
  • the present invention is not limited to this.
  • the sub control unit may be arranged in the vicinity of the component recognition imaging unit.
  • the predetermined range R indicates a range from a lower limit value that is smaller than the threshold value T1 to an upper limit value that is greater than the threshold value T1 is shown, but the present invention is not limited to this.
  • the predetermined range may be a range from a lower limit value smaller than the threshold value to the threshold value, or may be a range from the threshold value to an upper limit value larger than the threshold value.
  • the processing operations of the main control unit 10 (310, 410) and the sub control unit 11 (211, 311, 411) are processed in order along the processing flow for convenience of explanation.
  • the description has been given using the flow-driven flowchart to be performed the present invention is not limited to this.
  • the processing operations of the main control unit and the sub control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Ce dispositif de montage de composant (1) est conçu de telle sorte que lorsqu'une valeur acquise d'inspection simplifiée (32a) se situe dans une plage prédéterminée (R) par rapport à une valeur de seuil (T1) dans une inspection simplifiée (32b), soit une unité de commande principale (10) soit une unité de commande auxiliaire (11) effectue une inspection détaillée (23b) qui est plus détaillée que l'inspection simplifiée.
PCT/JP2018/017057 2018-04-26 2018-04-26 Dispositif de montage de composant et procédé d'inspection WO2019207730A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/017057 WO2019207730A1 (fr) 2018-04-26 2018-04-26 Dispositif de montage de composant et procédé d'inspection
JP2020515405A JP6884924B2 (ja) 2018-04-26 2018-04-26 部品実装装置および検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/017057 WO2019207730A1 (fr) 2018-04-26 2018-04-26 Dispositif de montage de composant et procédé d'inspection

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04203916A (ja) * 1990-11-29 1992-07-24 Matsushita Electric Ind Co Ltd 外観検査方法
JP2010258013A (ja) * 2009-04-21 2010-11-11 Hitachi High-Technologies Corp 基板検査装置及び方法
WO2014024275A1 (fr) * 2012-08-08 2014-02-13 富士機械製造株式会社 Système de travail pour un substrat
WO2017064774A1 (fr) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 Système de travail de substrat et dispositif de montage de composants

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04203916A (ja) * 1990-11-29 1992-07-24 Matsushita Electric Ind Co Ltd 外観検査方法
JP2010258013A (ja) * 2009-04-21 2010-11-11 Hitachi High-Technologies Corp 基板検査装置及び方法
WO2014024275A1 (fr) * 2012-08-08 2014-02-13 富士機械製造株式会社 Système de travail pour un substrat
WO2017064774A1 (fr) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 Système de travail de substrat et dispositif de montage de composants

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