JPWO2014013572A1 - 検査ヘッド、作業装置および電子部品実装ライン - Google Patents
検査ヘッド、作業装置および電子部品実装ライン Download PDFInfo
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- JPWO2014013572A1 JPWO2014013572A1 JP2014525605A JP2014525605A JPWO2014013572A1 JP WO2014013572 A1 JPWO2014013572 A1 JP WO2014013572A1 JP 2014525605 A JP2014525605 A JP 2014525605A JP 2014525605 A JP2014525605 A JP 2014525605A JP WO2014013572 A1 JPWO2014013572 A1 JP WO2014013572A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
図1に示す電子部品実装ライン2は、主にスクリーン印刷機4と、複数の作業装置6,8,10と、リフロー炉12と、メインコントローラ14を備えている。スクリーン印刷機4は、基板にクリーム状はんだをスクリーン印刷する。作業装置6,8,10は、基板への電子部品の実装や、基板の表面状態の検査を行う。リフロー炉12は、基板を加熱してクリーム状はんだを溶融させる。メインコントローラ14は、スクリーン印刷機4と、作業装置6,8,10と、リフロー炉12を含む電子部品実装ライン2の各装置の動作を制御する。
Claims (5)
- 基板に対して作業を行うための作業装置に作業ヘッドとして取り付け可能な基板の表面状態を検査する検査ヘッドであって、
基板を撮影して画像データを取得するカメラと、
検査処理プログラムと検査基準データを記憶可能な記憶媒体と、
検査処理プログラムに従って、カメラから取得される画像データと検査基準データに基づいて検査処理を実行する制御部とを搭載した検査ヘッド。 - 前記制御部が、前記作業装置の外部のコンピュータと通信可能であって、検査結果を示す検査結果データを前記作業装置の外部のコンピュータへ出力する請求項1の検査ヘッド。
- 基板に撮影用の光を照射する撮影用照明をさらに搭載した請求項1の検査ヘッド。
- 請求項1から3の何れか一項の検査ヘッドが作業ヘッドとして取り付けられた作業装置。
- 基板に電子部品を実装する実装ヘッドが作業ヘッドとして取り付けられた作業装置の下流側に、請求項4の作業装置が配置された電子部品実装ライン。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/068231 WO2014013572A1 (ja) | 2012-07-18 | 2012-07-18 | 検査ヘッド、作業装置および電子部品実装ライン |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014013572A1 true JPWO2014013572A1 (ja) | 2016-06-30 |
JP6023196B2 JP6023196B2 (ja) | 2016-11-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014525605A Active JP6023196B2 (ja) | 2012-07-18 | 2012-07-18 | 検査ヘッド、作業装置および電子部品実装ライン |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6023196B2 (ja) |
CN (1) | CN104472031B (ja) |
WO (1) | WO2014013572A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6913165B2 (ja) * | 2017-06-01 | 2021-08-04 | ヤマハ発動機株式会社 | 検査結果報知方法、検査結果報知装置および部品実装システム |
WO2019180861A1 (ja) * | 2018-03-22 | 2019-09-26 | 株式会社Fuji | 構成装置良否判定サーバ、検査システム、検査システム用の端末装置、および検査装置 |
JP7149456B2 (ja) * | 2018-05-30 | 2022-10-07 | パナソニックIpマネジメント株式会社 | 部品実装装置 |
JP7074865B2 (ja) * | 2018-08-28 | 2022-05-24 | 株式会社Fuji | 制御プログラムのチェック装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004006510A (ja) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | 部品実装基板生産装置及び方法 |
JP2009130134A (ja) * | 2007-11-22 | 2009-06-11 | Panasonic Corp | 基板の検査方法及び基板の検査装置 |
JP2011119429A (ja) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | 部品実装システム |
JP2011243884A (ja) * | 2010-05-20 | 2011-12-01 | Fuji Mach Mfg Co Ltd | 部品実装システム |
JP2012089552A (ja) * | 2010-10-15 | 2012-05-10 | Fuji Mach Mfg Co Ltd | 部品実装システムおよび部品実装システムにおける部品検査方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6375503A (ja) * | 1986-09-19 | 1988-04-05 | Toshiba Corp | リ−ド付部品位置決め装置 |
KR100881908B1 (ko) * | 2001-08-08 | 2009-02-04 | 파나소닉 주식회사 | 전자부품 실장장치 및 전자부품 실장방법 |
JP3903910B2 (ja) * | 2002-11-21 | 2007-04-11 | 松下電器産業株式会社 | 画像読取装置および画像読取方法 |
JP2006214820A (ja) * | 2005-02-02 | 2006-08-17 | Yamaha Motor Co Ltd | 基板検査装置および基板検査方法 |
JP4986760B2 (ja) * | 2007-08-01 | 2012-07-25 | Juki株式会社 | 表面実装装置 |
JP4998485B2 (ja) * | 2009-01-23 | 2012-08-15 | パナソニック株式会社 | 部品実装ライン及び部品実装方法 |
JP2011082243A (ja) * | 2009-10-05 | 2011-04-21 | Panasonic Corp | 部品実装装置および部品実装装置における実装状態検査方法 |
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2012
- 2012-07-18 JP JP2014525605A patent/JP6023196B2/ja active Active
- 2012-07-18 CN CN201280074753.6A patent/CN104472031B/zh active Active
- 2012-07-18 WO PCT/JP2012/068231 patent/WO2014013572A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004006510A (ja) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | 部品実装基板生産装置及び方法 |
JP2009130134A (ja) * | 2007-11-22 | 2009-06-11 | Panasonic Corp | 基板の検査方法及び基板の検査装置 |
JP2011119429A (ja) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | 部品実装システム |
JP2011243884A (ja) * | 2010-05-20 | 2011-12-01 | Fuji Mach Mfg Co Ltd | 部品実装システム |
JP2012089552A (ja) * | 2010-10-15 | 2012-05-10 | Fuji Mach Mfg Co Ltd | 部品実装システムおよび部品実装システムにおける部品検査方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6023196B2 (ja) | 2016-11-09 |
WO2014013572A1 (ja) | 2014-01-23 |
CN104472031A (zh) | 2015-03-25 |
CN104472031B (zh) | 2017-08-15 |
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