WO2014010491A1 - 燃料電池用セパレータ及び燃料電池用セパレータの製造方法 - Google Patents
燃料電池用セパレータ及び燃料電池用セパレータの製造方法 Download PDFInfo
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- WO2014010491A1 WO2014010491A1 PCT/JP2013/068294 JP2013068294W WO2014010491A1 WO 2014010491 A1 WO2014010491 A1 WO 2014010491A1 JP 2013068294 W JP2013068294 W JP 2013068294W WO 2014010491 A1 WO2014010491 A1 WO 2014010491A1
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- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0247—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the form
- H01M8/0254—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the form corrugated or undulated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
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- H—ELECTRICITY
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- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0267—Collectors; Separators, e.g. bipolar separators; Interconnectors having heating or cooling means, e.g. heaters or coolant flow channels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a fuel cell separator and a method of manufacturing the fuel cell separator.
- a solid polymer fuel cell comprises an electrolyte membrane formed of an ion exchange membrane, a membrane electrode assembly (MEA: Membrane-Electrode Assembly) having a pair of electrodes sandwiching the electrolyte membrane, and a pair of separators sandwiching the MEA. ing. Gas flow paths are formed between each of the pair of separators and the MEA.
- a fuel gas for example, hydrogen gas
- an oxidizing gas for example, air
- a metal separator has been proposed as the separator.
- Metal separators are required to have high conductivity, high gas tightness to fuel gas, and high corrosion resistance to the redox reaction of fuel gas and oxidizing gas. Examples of the material of such a metallic separator include stainless steel (SUS) and titanium.
- Patent Document 1 and Patent Document 2 are known.
- a resin conductive layer 106 in which a resin 102 and a conductive filler 104 made of metal carbide are mixed is provided on the surface of a metal substrate 100.
- the content per volume of the conductive filler 104 is configured to decrease continuously from the metal substrate 100 (base material interface) to the surface of the separator (hereinafter referred to as 1 conventional separator)).
- the surface of the resin conductive layer 106 contains a conductive filler 110 made of a carbon-based material, and the surface of the resin conductive layer 106
- a metal separator provided with a low electrical resistance layer 108 having a lower volume resistivity hereinafter referred to as a second conventional separator. According to the configuration shown in FIG. 21 (b), an advantage is obtained that the contact resistance with the GDL (gas diffusion layer) can be greatly reduced.
- Patent Document 2 As shown in FIG. 23, the first resin layer 120 formed on the surface of the metal substrate 100 and the second resin layer 130 disposed on the surface of the first resin layer 120 are provided.
- a metal separator has been proposed (hereinafter referred to as the third conventional separator).
- the first resin layer 120 and the second resin layer 130 contain a conductive filler 118.
- the volume resistivity of the second resin layer 130 is set smaller than the volume resistivity of the first resin layer 120.
- FIG. 22 shows the relationship between the position in the film thickness direction of the conductive layer or resin layer of the conventional example and the ratio of the conductive filler (conductive particles).
- the solid line shows the example shown in FIG. 21 (a)
- the dotted line shows the example shown in FIG. 21 (b)
- the dashed-dotted line shows the example shown in FIG.
- Patent Document 3 proposes a method of manufacturing a fuel cell separator (referred to as a first conventional method).
- a first resin sheet 200 containing a conductive substance 202 and a second resin sheet 210 containing a conductive substance 202 are shown in FIG. 24 (b).
- the metal substrate 100 is overlapped and bonded together, and is integrally connected to the metal substrate 100 by heat pressing.
- the content of the conductive substance 202 in the second resin sheet 210 is larger than the content of the conductive substance 202 in the first resin sheet 200.
- heat treatment is performed above the melting point of the resin to perform surface treatment of the separator.
- a mixed solution in which a conductive substance 140 and a resin are mixed is applied to a metal substrate 100.
- a mixed solution of the conductive substance 140 and the resin is similarly applied and cured on the surface of the layer, and the resin layers 154, 156, and 158 are sequentially formed. It is being formed (referred to as the second conventional method).
- Patent Document 4 discloses that a mixed solution of a conductive ceramic and a resin (binder resin) is applied to a metal substrate as a method for producing a fuel cell separator, and the applied solution is dried and baked in an oven after application.
- the first conventional separator has a high contact resistance because the number of conductive paths between the GDL (gas diffusion layer) provided on the surface of the MEA and the separator surface is small.
- the second conventional separator has a low electrical resistance layer on the surface, so that the contact resistance to the GDL can be reduced compared to the first conventional separator.
- the contact resistance to the GDL can be reduced compared to the first conventional separator.
- there are few conductive paths on the surface of the first resin conductive layer there is a problem that interface resistance between the resin conductive layer and the low electric resistance layer is high.
- the interface resistance between the first resin layer and the second resin layer is high, and the volume resistivity of the first resin layer is high, so the contact resistance is high.
- the separators in the case of connecting the separators to constitute the fuel cell, or in the case of connecting the separator to the GDL through the porous body, there is a problem that their contact resistance becomes high.
- the manufacturing method of the first conventional method after the conductive resin sheet is manufactured, the cost is high because the resin sheet is attached to the metal substrate. Moreover, in the separator which has a complicated groove shape on the surface, it is difficult to affix a resin sheet, and this manufacturing method can not be adopted.
- the first object of the present invention is to significantly reduce the contact resistance to GDL and the contact resistance to other separators, and as a result, the internal resistance of the fuel cell can be reduced, and the cell voltage drop can be suppressed.
- An object of the present invention is to provide a fuel cell separator capable of achieving size reduction and high output of the cell.
- the second object of the present invention is that the fuel cell separator can be manufactured, and the metal particles are not limited to flat plates, and conductive particles are well covered even in complicated groove shapes, and the layer thickness It is an object of the present invention to provide a method of manufacturing a fuel cell separator that can reduce variations, can form a resin conductive layer thinner, and can be manufactured inexpensively.
- a metal substrate and a resin conductive layer on the surface (one side or both sides) of the metal substrate, and the resin conductive layer is a resin
- a fuel cell separator comprising: and a conductive substance dispersed in the resin. In the fuel cell separator, the ratio of the conductive substance to the resin is continuously increased from the metal substrate toward the surface of the fuel cell separator.
- the resin conductive layer constitutes a main resin conductive layer
- the fuel cell separator comprises a sub resin conductive layer between the main resin conductive layer and the metal substrate, and the sub resin
- the conductive layer includes a sublayer resin and a sublayer conductive material dispersed in the sublayer resin, and the subresin conductive layer prevents metal ions from eluting from the metal substrate.
- the surface of the metal substrate is not in contact with the gas diffusion layer or the other separator and defines a water channel, and a contact portion in contact with the gas diffusion layer or the other separator of the fuel cell.
- the main resin conductive layer and the sub resin conductive layer are formed on the contact portion and the non-contact portion, and the main resin conductive layer has hydrophilicity at the non-contact portion.
- the first step of adhering the prepared resin and the first conductive substance to the surface of the metal substrate to form an uncured resin conductive layer, and the uncured resin conductivity A second step of attaching a second conductive material to the surface of the layer, and a third step of curing the uncured resin conductive layer, and adding a metal substrate having the surface covered at the time of curing.
- a method of manufacturing a fuel cell separator including the third step of causing the resin to be introduced between the second conductive substance and curing the resin by pressure.
- the second conductive material may be attached to part or all of the contact site and the non-contact site of the uncured resin conductive layer. In this case, during the fourth and fifth steps, the second conductive substance attached to the non-contact area is removed.
- the second step includes mixing the second conductive substance in a solvent and depositing the mixture on the uncured resin conductive layer formed in the first step, The resin is poorly soluble in the solvent used in the second step.
- the prepared second layer resin and second layer conductive substance are attached to the surface of the uncured first resin conductive layer to form an uncured second resin conductive layer.
- the ratio of the second conductive material to the second layer resin is greater than the ratio of the first layer conductive material to the first layer resin, and the uncured first resin conductive material
- a method of manufacturing a fuel cell separator is provided, which includes the third step of curing the layer and the second resin conductive layer.
- Two steps, a third step of attaching a second conductive material to the surface of the uncured main resin conductive layer, and a fourth step of curing the uncured main resin conductive layer, the surface being And a fourth step of curing the main layer resin after the main layer resin is introduced between the second conductive substances by pressurizing the metal substrate covered with A method of manufacture is provided.
- the method includes mixing the second conductive substance in a solvent and depositing the mixture on the uncured auxiliary resin conductive layer formed in the first step, wherein the main layer resin is And have poor solubility in the solvent.
- the step of curing the auxiliary resin conductive layer, the second step of attaching the main layer resin to the surface of the auxiliary resin conductive layer to form an uncured resin layer, and the step of curing the uncured resin layer In the third step of adhering a conductive material to the surface, and pressing the metal substrate covered with the surface, the main layer resin of the uncured resin layer is made to enter between the conductive materials and cured.
- the gist of the present invention is a method of manufacturing a fuel cell separator including a fourth step of forming a main resin conductive layer.
- the third step includes the steps of mixing the conductive substance in a solvent and depositing the mixture on the uncured auxiliary resin conductive layer formed in the first step,
- the main layer resin is poorly soluble in the solvent.
- one surface of the metal substrate can not be in contact with the gas diffusion layer or the other separator, and a water channel which is in contact with the gas diffusion layer or the other separator of the fuel cell.
- the sublayer resin and the sublayer conductive material are attached to the contact site and the noncontact site of the metal substrate, and the uncured sublayer is formed.
- the uncured auxiliary resin conductive layer formed on the contact portion and the non-contact portion is cured, and in the second step, the contact portion and the non-contact
- the prepared main layer resin and the first conductive substance are attached to the surface of the sub-resin conductive layer of the portion to form an uncured main resin conductive layer, and in the third step, the second step Uncured main formed by The second conductive substance is attached to a portion covering the contact portion in the fat conduction, and in the fourth step, the metal substrate covered with the surface is pressed to thereby form the portion in the portion covering the contact portion.
- the contact resistance to the GDL and the contact resistance to the separator can be reduced.
- the internal resistance of the fuel cell can be reduced, and the cell voltage drop can be suppressed, and the fuel cell can be miniaturized. High output can be achieved.
- the secondary resin conductive layer covers the surface of the metal substrate, the metal ions can be prevented from flowing out from the metal substrate, and the metal elution from the metal substrate can be greatly reduced while securing the contact resistance. it can.
- a metal substrate of poor corrosion resistance can be used, and the cost can be reduced.
- the resin enters the gap between the conductive materials covering the entire surface of the resin conductive layer and is cured by pressure.
- the resin in the vicinity of the metal substrate moves between the conductive substances covering the entire surface of the main resin conductive layer. May cause defects on the surface of the metal substrate. The formation of this defect may cause elution of metal ions from the metal substrate to deteriorate the corrosion resistance. According to the second aspect, such a thing can be prevented.
- the main resin conductive layer has hydrophilicity at the non-contact portion, the water droplets staying at this portion can be efficiently discharged to the outside.
- the non-contact area other than the contact area in contact with the gas diffusion layer or the other separator is covered by the resin layer, the corrosion resistance of the metal substrate can be improved.
- the metal substrate is not limited to a flat plate, even if the surface of the metal substrate has a complicated groove shape, the coverage of the conductive particles is good, and the variation in layer thickness can be reduced.
- the resin conductive layer can be made thin and can be manufactured inexpensively.
- the resin of the resin conductive layer since the resin of the resin conductive layer has low solubility in the solvent for dispersing the second conductive substance, the resin of the resin conductive layer moves to the upper surface of the second conductive substance. Being prevented. Therefore, the increase in the contact resistance can be suppressed, and the output performance of the fuel cell can be improved.
- the sixth aspect it is possible to easily manufacture a fuel cell separator in which the ratio of the conductive substance to the resin continuously increases from the metal substrate side toward the surface.
- the surface of the metal substrate is hardened in advance even if the main layer resin forming the main resin conductive layer moves so as to enter between the second conductive materials when pressurized. Because the secondary resin conductive layer is covered, it is possible to suppress defects in which the surface of the metal substrate is exposed. This prevents the metal ions from eluting from the metal substrate. Furthermore, since the surface of the auxiliary resin conductive layer is covered with the main resin conductive layer, the corrosion resistance of the separator can be improved.
- the main layer resin since the main layer resin has low solubility in the solvent for dispersing the second conductive material, the main layer resin is moved to the upper surface of the second conductive material. It can control and can control increase of contact resistance. As a result, the output performance of the fuel cell can be improved.
- the surface of the metal substrate is pre-cured Since the resin conductive layer is covered, defects in which the surface of the metal substrate is exposed can be suppressed. This prevents the metal ions from eluting from the metal substrate. Furthermore, since the surface of the auxiliary resin conductive layer is covered with the main resin conductive layer, the corrosion resistance of the separator can be improved.
- the main layer resin since the main layer resin has low solubility in the solvent for dispersing the conductive substance, the movement of the main layer resin to the upper surface of the conductive substance can be suppressed. For this reason, the increase in the contact resistance can be suppressed, and the output performance of the fuel cell can be improved.
- the portion of the main resin conductive layer covering the non-contacting part has hydrophilicity, a separator capable of efficiently discharging the water droplets staying in the groove to the outside can be obtained.
- a separator can be obtained in which the drainage property of the groove is enhanced to improve the gas diffusivity of the gas diffusion layer of the fuel cell.
- the non-contact portion is coated with a resin, a separator is obtained in which the corrosion resistance of the metal substrate is improved.
- a separator capable of reducing the contact resistance to the gas diffusion layer (GDL) can be obtained.
- Explanatory drawing which shows the ratio of the electroconductive substance (electroconductive particle) of a main resin conductive layer and a subresin conductive layer.
- A)-(f) is explanatory drawing of the manufacturing method of the separator for fuel cells of 3rd Embodiment.
- A)-(f) is explanatory drawing of the manufacturing method of the separator for fuel cells of 4th Embodiment.
- A)-(c) is explanatory drawing of the manufacturing method of the separator for fuel cells of 5th Embodiment.
- (A), (b) is explanatory drawing of the manufacturing method of the separator for fuel cells of 5th Embodiment.
- (A), (b) is explanatory drawing of the manufacturing method of the separator for fuel cells of 5th Embodiment.
- (A) is a schematic sectional view of Comparative Example 1
- (b) is a schematic sectional view of Comparative Example 2
- (c) is a schematic sectional view of Comparative Example 3.
- Explanatory drawing of the measuring method of contact resistance is sectional drawing of metal separators of a prior art example. Explanatory drawing which shows the ratio of the conductive filler of the conventional conductive layer or resin layer. Sectional drawing of the metal separator of a prior art example.
- (A), (b), (c) is explanatory drawing of the manufacturing method of the conventional metal separator. Sectional drawing of the metal-made separator manufactured by the manufacturing method of the other prior art example.
- the fuel cell 10 has a stack structure in which a plurality of single cells 12 are stacked.
- the unit cell 12 is a solid polymer electrolyte membrane (hereinafter simply referred to as “electrolyte membrane”) sandwiched between the anode assembly 13, the cathode assembly 14, the anode assembly 13 and the cathode assembly 14. And “15”.
- the electrolyte membrane 15 and the anode 16 A of the anode assembly 13 sandwiching the electrolyte membrane 15 and the cathode 16 B of the cathode assembly 14 constitute a membrane electrode assembly (MEA: Membrane-Electrode Assembly) 18.
- MEA Membrane-Electrode Assembly
- the anode 16A acts as a fuel electrode
- the cathode 16B acts as an oxygen electrode.
- the anode assembly 13 includes the anode 16A, and an anode gas flow path 17 formed between the anode 16A and the separator 20A and through which a fuel gas (hydrogen gas) flows.
- the separator 20 ⁇ / b> A includes a plurality of convex portions 22 for electrically contacting the anode 16 ⁇ / b> A.
- Each protrusion 22 has a top surface 22b and contacts the anode 16A at the top surface 22b.
- a groove 22a is formed between the adjacent convex portions 22, and an anode gas flow path 17 through which a fuel gas can pass is defined between the groove 22a and the anode 16A.
- the cathode assembly 14 has the cathode 16B, and a cathode gas flow path 19 formed between the cathode 16B and the separator 20B and through which an oxidant gas (air) flows.
- the separator 20B includes a plurality of projections 24 for electrically contacting the cathode 16B.
- Each protrusion 24 has a top surface 24 b and contacts the cathode 16 B at the top surface 24 b.
- a groove 24a is formed between adjacent convex portions 24, and a cathode gas flow path 19 through which an oxidant gas (air) can pass is defined between the groove 24a and the cathode 16B.
- the back side of the groove 22a of the separator 20A constitutes a convex portion 23 which protrudes in the opposite direction to the convex portion 22 and has a top surface.
- the back side of the groove 24a of the separator 20B constitutes a protrusion 25 which protrudes in the opposite direction to the protrusion 24 and has a top surface.
- Separators 20A and 20B are in electrical contact with each other on the top surface of protrusion 23 and the top surface of protrusion 25. Further, grooves are formed between the convex portions 23 and between the convex portions 25 respectively.
- the electrolyte membrane 15 is made of a solid polymer material having good proton conductivity in the wet state.
- Each of the anode 16A and the cathode 16B is composed of an electrode catalyst layer 11a and a gas diffusion layer (GDL) 11b.
- the electrode catalyst layer 11 a contacts the electrolyte membrane 15.
- the electrode catalyst layer 11 a is formed of, for example, conductive carbon black supporting platinum fine particles.
- the gas diffusion layer 11b is stacked on the electrode catalyst layer 11a.
- the gas diffusion layer 11 b is made of, for example, carbon paper, carbon cloth made of carbon fiber, or carbon felt.
- a space formed between the convex portion 22 of the separator 20A and the convex portion 24 of the separator 20B constitutes a cooling flow passage 40 through which a cooling medium such as water flows. That is, the cooling flow passage 40 is defined by the grooves between the projections 23 and the grooves between the projections 25.
- the separators 20A and 20B are formed in a flat plate shape.
- a cooling water plate 26 is sandwiched between the separators 20A and 20B.
- the cooling water plate 26 has a plurality of protrusions 27 that alternately protrude in the vertical direction, and the protrusions 27 are in contact with the separators 20A and 20B, respectively.
- a porous body 29 made of a metal material or a conductive material is disposed between the separator 20A and the gas diffusion layer 11b of the anode 16A and between the separator 20B and the gas diffusion layer 11b of the cathode 16B.
- the porous body 29 electrically connects the separator 20A and the gas diffusion layer 11b of the anode 16A, and electrically contacts the separator 20B and the gas diffusion layer 11b of the cathode 16B.
- the metal substrate 30 used in the separator 20 is made of a conductive metal material, such as stainless steel, steel, copper, titanium, aluminum, or nickel.
- the thickness of the metal substrate 30 is preferably 0.03 mm to 1 mm.
- the separator 20 is illustrated as a flat plate in FIG. 1 for convenience of explanation, the separator 20 applied in the case of the first configuration example of the fuel cell has a convex portion 22 as shown in FIG. It is formed to have 25.
- the ratio of the thickness of the metal substrate 30 and the resin conductive layer 32 shown in FIG. 1 is different from the actual ratio for convenience of explanation.
- a resin conductive layer 32 made of a compounded resin 33 and a conductive material 34 Is formed on at least one surface of the metal substrate 30 (the stack structure and the end portion of the metal substrate 30 may be on one side).
- the resin 33 used for the resin conductive layer 32 is made of an insulating resin of any of a thermosetting resin, a reaction curing resin, and a thermoplastic resin.
- thermosetting resin a phenol resin, an amino resin, unsaturated polyester resin, an epoxy resin, a polyurethane, a diallyl phthalate, a silicone resin, an alkyd resin can be mentioned, for example.
- reaction curable resins include reaction curable elastomers such as urethane resins, polyacrylates, photocurable resins typified by ultraviolet curable resins, silicone rubber, and isobutylene.
- thermoplastic resins include general purpose plastics, general purpose engineering plastics, super engineering plastics, fluoroplastics, ultra-high molecular weight polyethylene, thermoplastic elastomers, polymethylpentene, biodegradable plastics, polyacrylonitrile, and fiber based plastics. it can.
- Examples of the general-purpose plastic include polyethylene, polystyrene, AS resin, ABS resin, polypropylene, vinyl chloride resin, polyvinyl chloride, polyvinyl alcohol, polyethylene vinyl alcohol, methacrylic resin, and polyethylene terephthalate.
- examples of general-purpose engineering plastics include polyamide, polycarbonate, polyacetal, modified polyphenylene ether, and polybutylene terephthalate.
- examples of super engineering plastics include polyphenylene sulfide, polyacrylate, polysulfone, polyether sulfone, polyether ether ketone, polyether imide, polyamide imide, liquid crystal polymer, polyimide, and poly phthalamide.
- the conductive substance 34 is made of conductive ceramics, a carbon-based material, or a metal material.
- the conductive ceramics include alumina-titanium-carbide based ceramics, conductive zirconia based ceramics, silicon carbide based ceramics and the like.
- the conductive substance 34 may be a powdered carbon-based material, and examples thereof include graphite (artificial graphite and natural graphite), carbon black, and expanded graphite.
- the conductive substance 34 may be a fibrous carbon-based material, and examples thereof include carbon nanotubes, carbon nanofibers, and carbon fibers.
- the carbon nanotubes and carbon nanofibers preferably have a diameter of 0.001 to 0.5 ⁇ m, preferably 0.003 to 0.2 ⁇ m, and have a length of 1 to 100 ⁇ m, preferably 1 to 30 ⁇ m. It is preferable from the point of view.
- the conductive material 34 may be a powdery or fibrous metal carbide, such as tungsten carbide, silicon carbide, tantalum carbide, titanium carbide, niobium carbide, molybdenum carbide, vanadium carbide, chromium carbide and hafnium carbide. Can.
- the conductive substance 34 may be a powdery or fibrous metal oxide, and examples thereof include titanium oxide, zinc oxide, ruthenium oxide, indium oxide and tin oxide.
- the conductive material 34 may be powdery or fibrous metal nitride, and, for example, tantalum nitride, titanium nitride, molybdenum nitride, chromium nitride, aluminum nitride, zirconium nitride, gallium nitride, niobium nitride, vanadium nitride And boron nitride.
- the conductive material 34 may be a powdered metal, and may include, for example, copper, aluminum, zinc, titanium, nickel, tin, silver, tantalum and niobium powders. Also, the conductive material 34 may be a fibrous metal, and examples thereof include iron fibers, copper fibers and stainless steel fibers.
- the characteristic feature of the first embodiment is that the ratio of the conductive substance 34 to the resin is continuously increased from the metal substrate 30 (metal substrate interface) toward the surface as shown in FIG. is there.
- the ratio of the conductive substance 34 to the resin 33 on the surface of the resin conductive layer 32 is about 100%, and the ratio of the conductive substance 34 to the resin 33 on the interface of the metal substrate is about 5%.
- the proportion of the conductive substance 34 on the surface of the resin conductive layer 32 is not necessarily 100%, but a number close to 100% is preferable.
- the ratio of the conductive substance 34 at the interface of the metal substrate is 5% in the first embodiment, but is not limited to 5%, and preferably at least several% or more. Further, in FIG.
- a line indicating the ratio of the conductive substance 34 from the metal substrate interface to the surface is a straight line, it is not limited to a straight line, and a curved line curved downward or a curved line curved upward It may be a letter. The point is that the proportion of the conductive substance 34 may be increased continuously, ie, monotonically, from the metal substrate interface to the surface.
- many carbon-based conductive substances 34 are disposed in the vicinity of the surface of the separator.
- the thickness of the resin conductive layer 32 is 1 to 350 ⁇ m, preferably 2 to 100 ⁇ m.
- the upper limit of the weight average particle size is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and most preferably 10 ⁇ m or less.
- the lower limit of the weight-average particle diameter of the powdery conductive substance is 0.01 ⁇ m or more, preferably 0.05 ⁇ m or more, and most preferably 0.1 ⁇ m or more.
- the above-described carbon nanotubes and carbon nanofibers are used, or a fiber whose upper limit of diameter is 50 ⁇ m or less, preferably 20 ⁇ m or less and whose lower limit of diameter is nano level is used.
- the lower limit of the diameter of such fibers is 1 ⁇ m or more, more preferably 5 ⁇ m or more.
- the fiber length is 1 to 10000 ⁇ m, preferably 5 to 1000 ⁇ m.
- the various conductive substances described above may be used alone or in combination.
- a carbon-based conductive substance alone or in combination with another conductive substance 34.
- the mixing ratio can be set as desired.
- the resin 33 and the first conductive material 34A are mixed in a solvent capable of dispersing or dissolving the resin 33 and the first conductive material 34A, and a mixture of the first conductive material 34A and the resin 33, ie, Adjust the formulation (paint).
- the first conductive substance 34A the above-described conductive ceramics, carbon-based material, or metal material can be used alone or in combination of two or more. When used in combination, the mixing ratio can be set as desired.
- the ratio of the first conductive substance 34A to the solvent may be an appropriate proportion that does not impair the formation of the layer to be performed later, but the ratio of the second conductive substance 34B attached to the surface of the resin conductive layer 32 is Make it smaller. Moreover, it is preferable that the density of the first conductive substance 34A is not extremely higher than the density of the solvent. If the density of the first conductive material 34A is extremely high, this is not preferable because of the formation of the resin conductive layer 32 to be performed later. After depositing the mixture on the metal substrate 30, the conductive substance 34A precipitates in the mixture.
- the solution viscosity may be adjusted to delay the sedimentation of the conductive substance 34A by adjusting the amount and type of the solvent.
- the preparation liquid (paint) prepared as described above is attached to the surface (one side or both sides) of the metal substrate 30 shown in FIG. 5 (a).
- FIG. 5B shows a state in which only one surface of the metal substrate 30 is attached.
- the method of attaching the resin and the first conductive material to the metal substrate 30 is not limited, but includes spray coating, dipping, and electrodeposition.
- the conductive substance 34 present in the resin conductive layer 32 after the application of the preparation liquid is indicated by the reference numeral 34A.
- the second conductive material 34B is prepared in an appropriate ratio in a solvent in which the second conductive material 34B can be dispersed.
- the solvent here is preferably a solvent which does not dissolve the resin 33 in the resin conductive layer 32.
- the second conductive substance 34B the above-mentioned conductive substance can be used, and it is preferable to use a carbon-based conductive substance alone or in combination with another conductive substance.
- the preparation liquid (paint) prepared by dispersing the second conductive substance 34B in the dispersion solvent and preparing without the resin is shown in FIG. 5 (c) of the uncured resin conductive layer 32. Adhere to the surface. By the adhesion, the whole or substantially the entire surface of the resin conductive layer 32 is covered with the second conductive substance 34B. Examples of the method of adhering the second conductive substance to the resin conductive layer 32 include, but are not limited to, spray coating, dipping, and electrodeposition.
- distributes the 2nd electroconductive substance 34B without resin is a solvent which is hard to melt
- dispersion solvent for dispersing the second conductive substance 34B without resin examples of the dispersion solvent for dispersing the second conductive substance 34B without resin are given below, but the invention is not limited thereto.
- dissolve such polar resin is used, for example.
- solvents include, for example, benzene, ethylbenzene, cumene, normal hexane, cyclohexane, ethyl acetate, propyl acetate, diethyl ether, tetrahydrofuran, dioxane, ethylene glycol diethyl ether, carbon tetrachloride and chloroform.
- the surface of the resin conductive layer 32 is covered with the second conductive material 34B.
- the ratio of the second conductive substance 34 B to the resin on the surface of the resin conductive layer 32 is higher than the ratio of the first conductive substance 34 A to the resin in the resin conductive layer 32.
- thermosetting resin When a thermosetting resin is used as the resin of the resin conductive layer 32, thereafter, the metal substrate 30 whose surface is covered with the second conductive material 34B is heated and pressurized to form the second conductive material 34B. While being pushed into the uncured resin conductive layer 32, the resin is cured. The heating temperature at this time is a temperature for curing the thermosetting resin.
- a method of pressurizing while heating there are a method by hot press, a method of pressurizing by a belt press while heating by a heating means, and a method of pressurizing by a roll press while heating by a heating means.
- the second conductive substance 34 B is pushed into the uncured resin conductive layer 32 by pressing before curing.
- the method of pressing may be a cold press, a belt press, or a roll press.
- the resin when the resin is a curable resin, when the uncured resin conductive layer 32 is pressed while being heated by a hot press, the powder or fibrous second conductive substance 34B (for example, a carbon-based conductive material) After the resin 33 has entered the gap between the substances, it hardens.
- the powder or fibrous second conductive substance 34B for example, a carbon-based conductive material
- the resin is a reaction curable resin or a thermoplastic resin
- the resin is cured by a conventional method.
- the second conductive substance 34B is pressed into the uncured resin conductive layer 32 under pressure, and a powdery or fibrous second conductive substance 34B (for example, After the resin 33 intrudes into the gap between the carbon-based conductive substances), it hardens.
- the ratio of the second conductive substance 34B to the resin in the vicinity of the surface of the separator 20 is dispersed in the resin conductive layer 32.
- the ratio of the first conductive substance 34A to the resin is greater than
- the resin When the resin is a thermosetting resin, it is pressed by a hot press or the like, or when the resin is a thermoplastic resin or a reaction curable resin, it is pressed by a cold press or the like.
- the first conductive substance 34A in the resin conductive layer 32 is also restrained by the curing of the resin in a state of further moving toward the interface of the metal substrate.
- the ratio of the conductive substance 34 (34A, 34B) is continuously increased from the interface of the metal substrate to the surface of the separator.
- the resin conductive layer 32 there are a portion where the proportion of the first conductive substance 34A in the thickness direction is small, and a part formed by the resin entering between the second conductive substance 34B. It is finally configured. After this, the second conductive substance 34B which is not restrained by the resin is washed by, for example, high pressure washing or ultrasonic washing. This cleaning step may be omitted if all of the attached second conductive substance 34B is restrained by the resin.
- the resin conductive layer 32 may be formed similarly on both sides.
- the ratio of the conductive substance 34 (34A, 34B) to the resin increases continuously from the metal substrate 30 toward the surface of the separator.
- the prepared resin and the first conductive substance 34A are attached to the surface (one side or both sides) of the metal substrate 30, and the uncured resin conductive layer is formed.
- the resin 33 is applied to the gap between the second conductive material 34B attached without the resin by pressing the metal substrate whose surface is covered at the time of curing.
- the third step of infiltrating and curing is performed infiltrating and curing.
- the manufacturing method of the first embodiment even when the metal substrate is not limited to a flat plate and the surface of the metal substrate has a complicated groove, the coverage of the conductive particles is good, and the layer Variations in thickness can be reduced, the resin conductive layer can be made thinner, and manufacturing can be performed inexpensively. That is, in the manufacturing method of the first embodiment, the resin conductive layer 32 is formed even in a separator having a complicated shape having the convex portions 22 to 25 as used in the first configuration example of the fuel cell 10. It is easy. In addition, since the application of the preparation liquid (paint) is required twice, the variation of the layer is small, and the layer can be thinned. In addition, unlike the first conventional method as disclosed in Patent Document 3, since it is not necessary to attach a conductive resin sheet to a metal substrate, cost can be suppressed.
- the dispersion solvent in which the second conductive substance 34B is dispersed without the resin is a solvent in which the resin mixed with the first conductive substance 34A is difficult to dissolve.
- the solvent for dispersing the second conductive substance 34 B is difficult to dissolve the resin of the resin conductive layer 32, the resin moves so as to exceed the upper surface of the second conductive substance. Can be prevented, and an increase in contact resistance can be suppressed. As a result, the output performance of the fuel cell can be improved.
- the solvent of the preparation liquid dissolves the resin of the resin conductive layer 32 easily, the melted resin of the resin conductive layer 32 may move so as to exceed the upper surface of the second conductive substance 34B. .
- this resin since this resin has an insulating property, there is a possibility that the contact resistance may be increased by the resin remaining after evaporation of the dispersion solvent.
- the ratio of the conductive substance to the resin on the surface of the resin conductive layer 32 can be increased.
- the metal substrate 30 of the separator 20 of the second embodiment is formed in the same manner as in the first embodiment.
- the separator 20 is illustrated as a flat plate in FIG. 6 for convenience of explanation, the separator 20 applied in the case of the first configuration example of the fuel cell is formed to have the convex portions 22 to 25. Ru.
- the ratio of the thickness of the metal substrate 30 and the resin conductive layers 32A and 32B shown in FIG. 6 is different from the actual ratio for the convenience of description.
- the prepared first layer resin 35A and the first layer conductivity are applied to at least one surface of the metal substrate 30 (the metal substrate 30 at the end in the stack structure may be on one side).
- the first resin conductive layer 32A made of the organic substance 36A is formed.
- FIG. 6 (d) for convenience of explanation, those in which the resin conductive layers 32A and 32B are formed on one side of the metal substrate 30 are shown.
- the first layer resin 35A used for the first resin conductive layer 32A is made of an insulating resin, which is any one of the thermosetting resin, the reaction curable resin, and the thermoplastic resin described in the first embodiment. Further, the first layer conductive substance 36A is made of the conductive ceramic, the carbon-based material, or the metal material described in the first embodiment.
- a second resin conductive layer 32B composed of the prepared second layer resin 35B and the second layer conductive material 36B is formed.
- the second layer resin 35B used for the second resin conductive layer 32B is made of an insulating resin of any of the thermosetting resin, the reaction curing resin, and the thermoplastic resin described in the first embodiment.
- the type of the second layer resin of the second resin conductive layer 32B is preferably the same as that of the first layer resin of the first resin conductive layer 32A.
- the first layer resin of the first resin conductive layer 32A is a thermosetting resin
- the second layer resin of the second resin conductive layer 32B is also the same thermosetting resin
- the first resin of the first resin conductive layer 32A is
- the layer resin is a thermoplastic resin
- the second layer conductive substance 36 B is made of the conductive ceramic, the carbon-based material, or the metal material described in the first embodiment.
- the ratio of the first layer conductive substance 36A to the first layer resin 35A in the first resin conductive layer 32A is the second layer resin 35B of the second layer conductive substance 36B in the second resin conductive layer 32B. Greater than the percentage of That is, by increasing the ratio of the conductive substance to the resin in the second resin conductive layer 32B than in the first resin conductive layer 32A, the conductive substance is directed from the metal substrate 30 (the interface of the metal substrate) to the separator surface. Are configured to increase continuously.
- the ratio of the second layer conductive substance 36B is 80 to 90%, and near the interface of the metal substrate (first resin conductive layer 32A)
- the ratio of the first layer conductive substance 36A is about 5%. This ratio is not necessarily 80 to 90% on the surface, but is larger than the ratio of the first layer conductive substance 36A in the first resin conductive layer 32A.
- the ratio of the first layer conductive substance 36A in the vicinity of the interface of the metal substrate (the first resin conductive layer 32A) is 5% in the second embodiment, but is not limited to 5%. However, several% or more is preferable.
- the ratio of the conductive substance to the resin is continuous. That is, the distribution of the second layer conductive substance 36B which settles in the uncured second resin conductive layer 32B is on the surface (the interface with the second resin conductive layer 32B) of the uncured first resin conductive layer 32A. Adjustment of solution viscosity for forming the first resin conductive layer 32A and the second resin conductive layer 32B is performed by a test or the like so as to be the same as or similar to the distribution of the first layer conductive substance 36A. There is.
- the first layer resin 35A of the first resin conductive layer 32A and the second layer resin 35B of the second resin conductive layer 32B may be different, but are preferably of the same type. That is, it is preferable that each of the first resin conductive layer 32A and the second resin conductive layer 32B be a thermosetting resin or a thermoplastic resin.
- the thickness of the first and second resin conductive layers 32A and 32B is 1 to 350 ⁇ m, preferably 6 to 200 ⁇ m.
- first and second conductive materials 36A and 36B included in the first and second resin conductive layers 32A and 32B of the second embodiment the various conductive materials described in the first embodiment are used alone. It may be used in combination of two or more.
- the first layer conductive material 36A is mixed with the first layer resin 35A and the first layer conductive material 36A in a solvent capable of dispersing or dissolving the first layer resin 35A and the first layer conductive material 36A.
- a preparation liquid that is, a preparation liquid (paint) is performed.
- the first-layer conductive substance 36A the above-described conductive ceramics, carbon-based materials, or metal materials are used alone or in combination of two or more. When used in combination, the mixing ratio is set as desired.
- the ratio of the first layer conductive material 36A to the solvent may be an appropriate ratio that does not impair the formation of the layer to be performed later, but is smaller than the ratio of the second layer conductive material 36B. Moreover, it is preferable that the density of the first layer conductive substance 36A is not extremely higher than the density of the solvent. If the density of the first layer conductive material 36A is extremely high, the first layer is formed in the mixture after the mixture is attached to the metal substrate 30, which is not desirable, for the formation of the first resin conductive layer 32A to be performed later. The conductive substance 36A precipitates.
- the solution viscosity may be adjusted so as to delay the sedimentation of the first layer conductive substance 36A by adjusting the amount and type of the solvent.
- the preparation liquid (paint) prepared as described above is attached to the surface (one side or both sides) of the metal substrate 30 shown in FIG. 6A to form an uncured first resin conductive layer 32A.
- FIG. 6B shows a state in which only one surface of the metal substrate 30 is attached.
- the method of attaching the resin and the conductive substance to the metal substrate 30 is not limited, and examples thereof include spray coating, dipping, and electrodeposition.
- the second layer resin 35B and the second layer conductive material 36B are mixed in a solvent capable of dispersing or dissolving the second layer resin 35B and the second layer conductive material 36B, and the second layer conductivity is obtained.
- Preparation of the mixture of the substance 36B and the second layer resin 35B, that is, the preparation liquid (paint) is performed. This adjustment may be made in advance prior to forming the first resin conductive layer 32A for non-hardening.
- the second-layer conductive substance 36 B the above-described conductive ceramics, carbon-based materials, or metal materials are used alone or in combination of two or more.
- the mixing ratio is set as desired.
- the ratio of the second layer conductive substance 36B to the solvent and the second layer resin 35B is made larger than the ratio of the first layer conductive substance 36A contained in the first resin conductive layer 32A. Further, it is preferable that the density of the second layer conductive substance 36B is not extremely higher than the density of the solvent.
- the ratio of the second layer conductive material 36B to the second layer resin 35B is configured to continuously increase from the metal substrate interface to the surface.
- the preparation (coating material) of the second layer resin 35B and the second layer conductive substance 36B prepared as described above is adhered to the surface of the uncured resin conductive layer 32A shown in FIG. 6 (b).
- the method for attaching the second layer resin 35B and the second layer conductive substance 36B to the surface of the first resin conductive layer 32A is not limited, and examples thereof include spray coating, dipping, and electrodeposition.
- the second resin conductive layer 32B is cured by curing the resin by applying heat and pressure with a hot press or applying pressure with a belt press while heating with a heating means (heater).
- the second resin conductive layer 32 ⁇ / b> B is formed by curing by pressing with a roll press while heating with a heating unit (heater).
- the resin 35B is a thermoplastic resin or a reaction curing resin
- the resin 35B is cured by pressing with a cold press, a belt press, or a roll press without heating, as shown in FIG.
- the cured second resin conductive layer 32B is formed.
- the ratio of the first resin conductive layer 32A to the first layer resin 35A is directed toward the surface by the first layer conductive substance 36A settling out during curing. Increase continuously.
- the ratio of the second resin conductive layer 32B to the second layer resin 35B is on the surface by the second layer conductive substance 36B settling out during curing. Increase continuously towards the Thus, the surface of the first resin conductive layer 32A is arranged to be covered with the resin conductive layer 32B in which the ratio of the conductive substance to the resin is higher than that of the first resin conductive layer 32A.
- the ratio of the conductive substance to the resin is continuously increased from the metal substrate interface toward the surface.
- the second embodiment has the following features.
- the ratio of the second layer conductive substance 36B to the second layer resin 35B in the second resin conductive layer 32B is the first resin conductivity in the vicinity of the interface of the metal substrate 30 It is larger than the ratio of the first layer conductive substance 36A to the first layer resin 35A in the layer 32A, and continuously increases from the interface of the metal substrate to the surface of the separator.
- the contact resistance to the GDL or other separators can be reduced, and as a result, the internal resistance of the fuel cell can be reduced, the cell voltage can be increased, and the fuel cell can be miniaturized and its output can be increased. it can.
- the first layer resin 35A and the first layer conductivity prepared for the surface (one side or both sides) of the metal substrate 30 in the first step A substance 36A is deposited to form an uncured first resin conductive layer.
- the prepared second layer resin 35B and the second layer conductive substance 36B are deposited on the uncured first resin conductive layer 32A formed in the first step, and thus uncured.
- a second resin conductive layer is formed.
- the ratio of the second layer conductive substance 36B to the second layer resin 35B is larger than the ratio of the first layer conductive substance 36A to the first layer resin 35A.
- the uncured first and second resin conductive layers formed in the first and second steps are cured in the third step.
- a separator 20 according to a third embodiment and a method of manufacturing the separator will be described with reference to FIGS.
- the separator 20 of 3rd Embodiment the structure different from the separator 20 of 1st Embodiment is demonstrated, about the structure same as 1st Embodiment, or equivalent, the same code
- the separator 20 of the third embodiment is different from the first embodiment in that the auxiliary resin conductive layer 42 is provided between the metal substrate 30 and the resin conductive layer 32.
- the resin conductive layer 32 is referred to as a main resin conductive layer 32 in the third embodiment.
- the sub resin conductive layer 42 includes a sub layer resin 45 and a sub layer conductive substance 44 dispersed in the sub layer resin 45.
- the sublayer resin 45 of the subresin conductive layer 42 may be the same resin as the resin 33 of the main resin conductive layer 32 (in the third embodiment, referred to as the main layer resin 33), or may be a different resin.
- the sublayer resin 45 used in the subresin conductive layer 42 is selected from the resins described in the first embodiment.
- the sublayer conductive substance 44 distributed in the subresin conductive layer 42 a single type may be selected and used from various conductive substances described in the first embodiment, or a plurality of types may be selected and used in combination. May be
- the sub resin conductive layer 42 may have a thickness corresponding to the size of the sub layer conductive material 44. That is, when the powdery sublayer conductive substance 44 is used, the subresin conductive layer 42 may have a thickness corresponding to the weight average particle diameter of the sublayer conductive substance 44. When the fibrous sublayer conductive substance 44 is used, the subresin conductive layer 42 may have a thickness substantially corresponding to the fiber diameter of the sublayer conductive substance 44. Alternatively, when the sublayer conductive substance 44 forms an aggregate, the sub resin conductive layer 42 has a thickness substantially corresponding to the size of the aggregate.
- the ratio of the conductive substance (sub-layer conductive substance 44) to the resin (sub-layer resin 45) is constant as shown in FIG. .
- the ratio of the conductive substance to the resin increases continuously from the interface of the sub resin conductive layer 42 toward the surface.
- the ratio of the conductive material on the surface of the main resin conductive layer 32 is 100%, and the ratio of the conductive material on the interface of the metal substrate is about 5%.
- the proportion of the conductive material on the surface of the main resin conductive layer 32 is not necessarily 100%, but a number close to 100% is preferable.
- the ratio of the conductive material at the metal substrate interface is 5% in the third embodiment, but is not limited to 5%, and is preferably at least several% at the minimum. Further, in FIG.
- a line indicating the ratio of the conductive substance from the vicinity of the interface of the metal substrate to the surface of the separator is a straight line, but it is not limited to a straight line, and a curved or curved upward curve. It may be in the form of a curved curve. The point is that the proportion of the conductive substance should be monotonously increased continuously from the vicinity of the interface of the metal substrate to the surface of the separator.
- the sublayer resin 45 and the sublayer conductive material 44 are mixed in a solvent capable of dispersing or dissolving the sublayer resin 45 and the sublayer conductive material 44 to form the sublayer conductive material 44 and the sublayer resin.
- a solvent capable of dispersing or dissolving the sublayer resin 45 and the sublayer conductive material 44 to form the sublayer conductive material 44 and the sublayer resin.
- Preparation of 45 mixtures ie, the first preparation (paint).
- the conductive substance 44 the above-described conductive ceramics, a carbon-based material, or a metal material may be used alone or in combination of two or more.
- the mixing ratio can be set as desired.
- the ratio of the conductive substance 44 to the solvent may be any ratio that does not impair the formation of the layer to be performed later.
- the preparation liquid (paint) prepared as described above is attached to the surface (one side or both sides) of the metal substrate 30 shown in FIG. 9 (a).
- FIG. 9B shows a state in which only one surface of the metal substrate 30 is attached.
- the method of attaching the resin and the conductive substance to the metal substrate 30 is not limited, and examples thereof include spray coating, dipping, and electrodeposition.
- the layer deposited at this time has a thickness corresponding to the size of the sublayer conductive material 44 as described above. That is, when the powdery sublayer conductive substance 44 is used, a layer having a thickness corresponding to the weight average particle diameter of the sublayer conductive substance 44 is formed. When the fibrous sublayer conductive substance 44 is used, a layer having a thickness corresponding to the fiber diameter of the sublayer conductive substance 44 is formed. Alternatively, when the conductive substance 44 forms an aggregate, a layer having a thickness corresponding to the size of the aggregate is formed.
- FIG.9 (b) is explanatory drawing of a 1st process.
- the belt press is performed while heating and pressing with a hot press or heating with a heating means (heater).
- a heating means herein, the sublayer resin 45 is cured to form the subresin conductive layer 42.
- the sublayer resin 45 is cured to form the subresin conductive layer 42 by pressurizing the sublayer resin 45 by heating with a heating means (heater) and pressing with a roll press.
- the sublayer resin 45 is cured by heating with a heating means (heater) to form the subresin conductive layer 42.
- the sublayer resin 45 is cured by heating with a cold press, a belt press, or a roll press without heating.
- the secondary resin conductive layer 42 is formed.
- the main layer resin 33 and the first conductive substance 34 are mixed in a solvent capable of dispersing or dissolving the main layer resin 33 and the first conductive substance 34A, and the first conductive substance 34A and the main layer are mixed.
- the mixture of the resin 33 that is, the second preparation liquid (paint) is adjusted.
- the conductive substance 34 the above-described conductive ceramics, carbon-based material, or metal material may be used alone or in combination of two or more.
- the mixing ratio can be set as desired.
- the ratio of the first conductive substance 34A and the main layer resin 33 may be an appropriate proportion that does not impair the formation of a layer to be performed later, and for example, 0 to 50% by weight of the conductive substance is used.
- the upper limit value of the first conductive substance 34A is not limited to 50% by weight, and may be set according to the degree of being pushed into the main resin conductive layer 32 of the second conductive substance 34B.
- the density of the first conductive substance 34A is not extremely higher than the density of the solvent. If the density of the first conductive material 34A is extremely high, this is not preferable because of the formation of the main resin conductive layer 32 to be performed later. After deposition of the mixture, the conductive substance 34A precipitates in the mixture. When the density of the first conductive material 34A is extremely large, the sedimentation thereof is fast, and the ratio of the first conductive material 34A is not configured to continuously increase from the metal substrate interface toward the surface of the separator. In addition, the solution viscosity may be adjusted so as to delay the sedimentation of the first conductive substance 34A by adjusting the amount and type of the solvent.
- the type of the main layer resin 33 is preferably the same as that of the sub layer resin 45 of the sub resin conductive layer 42.
- the same thermoplastic resin is preferably used for the sublayer resin 45 of the subresin conductive layer 42.
- the second prepared liquid (paint) adjusted as described above is attached to the surface of the auxiliary resin conductive layer 42 as shown in FIG. 9 (d).
- FIG. 9D for convenience of description, the case where the auxiliary resin conductive layer 42 is formed on one side of the metal substrate 30 is described.
- the deposition method is, but not limited to, the deposition method similar to the first embodiment.
- FIG. 9D is an explanatory view of the second step.
- the second conductive material 34B is prepared in an appropriate ratio in a solvent in which the second conductive material 34B can be dispersed.
- the solvent here is preferably a solvent which does not dissolve the main layer resin 33 in the main resin conductive layer 32.
- the second conductive substance 34B here may be the conductive substance described in the first embodiment, but a carbon-based conductive substance is used alone or in combination with other conductive substances. Is preferred.
- the preparation liquid (paint) prepared by dispersing the second conductive substance 34B in a solvent and using no resin as described above is the uncured main resin conductive layer 32. It adheres to the surface, and the whole or almost the whole of the surface of the main resin conductive layer 32 is covered with the second conductive material 34B. Although it adheres by the adhesion method similar to 1st Embodiment, it is not limited. It is preferable that the dispersion solvent which disperse
- FIG.9 (e) is explanatory drawing of a 3rd process.
- thermosetting resin as the main layer resin 33 to the metal substrate 30 whose surface is covered with the second conductive substance 34B
- heating is performed by hot pressing.
- the main resin conductive layer 32 is cured by applying pressure and pressing with a belt press while heating with a heating means (heater).
- the main resin conductive layer 32 is cured by pressurizing with a roll press while heating with a heating means (heater).
- the heating temperature at this time is a temperature for curing the main layer resin 33.
- the main resin conductive layer 32 is cured by applying pressure by cold press, belt press, or roll press without heating.
- FIG. 9F is an explanatory view of the fourth step.
- the main resin conductive layer 32 is made of a powdery or fibrous conductive material 34B (for example, a carbon-based conductive material).
- the main layer resin 33 intrudes into the gap between the two and is hardened.
- the surface of the main resin conductive layer 32 is covered with the second conductive substance 34B. Even if the main layer resin 33 intrudes between the second conductive substance 34B, the ratio of the second conductive substance 34B to the resin in the vicinity of the surface is the first conductivity dispersed and present in the main resin conductive layer 32. The ratio of substance 34A to resin is higher.
- the first conductive substance 34A in the main resin conductive layer 32 is also restrained in a state of being moved further toward the interface of the metal substrate by curing of the main layer resin 33 by pressure.
- the ratio of the conductive substance 34 continuously increases from the interface of the auxiliary resin conductive layer 42 toward the surface of the separator.
- the main resin conductive layer 32 has a portion where the proportion of the first conductive material 34A in the thickness direction is small, and a portion formed by the main layer resin penetrating into the second conductive material 34B. And are finally configured. Thereafter, the second conductive substance 34B which is not constrained by the main layer resin 33 is cleaned by, for example, high-pressure cleaning or ultrasonic cleaning. This cleaning step may be omitted if all of the attached second conductive substance 34B is restrained by the resin.
- the separator 20 configured as described above has the following function in addition to the same function as the first embodiment.
- the uncured resin in the main resin conductive layer 32 is the second conductive material. It penetrates the gap between 34B and cures. At this time, the resin in contact with the surface of the metal substrate 30 may move toward the surface of the separator to cause a defect.
- the resin 33 of the main resin conductive layer 32 is pressed by the pressing means, the sublayer resin of the sub resin conductive layer 42 has already been cured. Resin in contact does not move. As a result, the occurrence of a defect near the surface of the metal substrate 30 can be prevented by the auxiliary resin conductive layer 42, and the corrosion resistance of the separator can be improved.
- the separator according to the third embodiment prevents metal ion elution of the metal substrate 30 between the main resin conductive layer 32 and the metal substrate 30, and the conductive substance 44 is dispersed in the resin 45.
- the auxiliary resin conductive layer 42 is formed in a cured state.
- the surface of the metal substrate 30 is covered in a state where the auxiliary resin conductive layer 42 is cured.
- the separator of the third embodiment can significantly reduce metal elution from the metal substrate while securing the contact resistance. Therefore, the life of the fuel cell can be improved.
- a metal substrate of poor corrosion resistance can be used, and the cost can be reduced.
- the prepared sublayer resin 45 and the sublayer conductive substance 44 are attached to one side or both sides of the metal substrate 30, and the uncured sub resin conductive layer is formed. And a step of curing the auxiliary resin conductive layer formed in the first step. Furthermore, the manufacturing method adheres the prepared main layer resin 33 and the first conductive substance 34A to the surface of the auxiliary resin conductive layer 42 to form an uncured main resin conductive layer 32. And a third step of adhering the second conductive substance 34B to the main resin conductive layer 32 formed in the second step without the resin.
- the manufacturing method causes the uncured main layer resin 33 to enter the gap between the second conductive substance 34B attached without the resin by pressing the metal substrate whose surface is covered. And a fourth step of curing.
- the main layer resin 33 forming the main resin conductive layer 32 is pressurized, it is directed to, for example, between the second conductive substance 34 B (conductive substance). Even if it moves, since the surface of the metal substrate 30 is covered with the auxiliary resin conductive layer 42 hardened in advance, it is possible to prevent a defect in which the surface of the metal substrate 30 is exposed. Therefore, in the separator, elution of metal ions from the metal substrate 30 is suppressed. Furthermore, since the surface of the auxiliary resin conductive layer 42 is covered with the main resin conductive layer 32, the corrosion resistance of the separator can be improved.
- the dispersion solvent for dispersing the second conductive substance 34B without resin is included in the main resin conductive layer 32 as compared with the solvent of the second preparation liquid.
- the main layer resin 33 is difficult to dissolve.
- the resin 33 of the main resin conductive layer 32 exceeds the upper surface of the second conductive substance 34B.
- the movement of the separator can be prevented, and the increase in the contact resistance of the separator can be suppressed.
- the output performance of the fuel cell can be improved.
- the solvent in which the second conductive substance 34B is dispersed dissolves the main layer resin 33 of the main resin conductive layer 32 easily (for example, the same solvent as the solvent of the second preparation liquid), the main The melted main layer resin 33 of the resin conductive layer 32 may move to exceed the top surface of the second conductive material 34B. Since the main layer resin 33 has an insulating property, the contact resistance may be increased by the resin 33 remaining on the upper surface of the second conductive material 34 B after the dispersion solvent is evaporated.
- the ratio of the conductive material of the main resin conductive layer 32 in particular, the ratio of the conductive material on the surface can be increased.
- a separator 20 and a method of manufacturing the separator will be described with reference to FIG.
- a configuration different from the separator 20 of the third embodiment will be described, and the same or corresponding components as or to those of the third embodiment are denoted by the same reference numerals and description thereof will be omitted.
- the separator 20 of the fourth embodiment differs from the separator 20 of the third embodiment in that the first conductive material 34A in the main resin conductive layer 32 is omitted.
- the other configuration is the same as that of the third embodiment.
- the characteristic is that in the main resin conductive layer 32, the second conductive substance 34B is disposed so as to increase continuously from the interface of the sub resin conductive layer 42 toward the surface of the separator. It is Further, as in the third embodiment, the thickness of the sub resin conductive layer 42 corresponds to the weight average particle diameter of the sub layer conductive substance 44 when the powder sub layer conductive substance 44 is used, When the fibrous sublayer conductive substance 44 is used, it corresponds to the fiber diameter of the sublayer conductive substance 44. Alternatively, when the sublayer conductive substance 44 forms an aggregate, the sub-resin conductive layer 42 has a thickness substantially corresponding to the size of the aggregate. Therefore, in the secondary resin conductive layer 42, the ratio of the conductive substance to the resin is constant.
- the ratio of the second conductive substance 34B to the main layer resin 33 is continuously increased from the interface of the sub resin conductive layer 42 toward the surface of the separator 20.
- the ratio of the conductive substance 34B is 100% on the surface of the main resin conductive layer 32, and the ratio of the sublayer conductive substance 44 is about 5% in the vicinity of the interface of the metal substrate. This proportion is not necessarily 100% on the surface, but a number close to 100% is preferable.
- the ratio of the sublayer conductive substance 44 in the fourth embodiment is 5% in the vicinity of the interface of the metal substrate, but is not limited to 5%, and is preferably at least several% at the minimum.
- the ratio from the interface to the surface of the metal substrate changes in a straight line, a curved line curved downward, or a curved line curved upward.
- the point is that the proportion of the conductive substance should be monotonously increased continuously from the metal substrate interface to the surface.
- FIGS. 10 (a) to 10 (f) a method of manufacturing the separator 20 of the fourth embodiment will be described with reference to FIGS. 10 (a) to 10 (f).
- the steps or steps of FIGS. 10 (a) to 10 (c) are the same as the manufacturing method described in FIGS. 9 (a) to 9 (c) of the third embodiment, and therefore the description thereof is omitted. That is, the steps until the secondary resin conductive layer 42 is formed on the metal substrate 30 are the same as in the third embodiment.
- the main layer resin 33 and the first conductive substance 34A are attached to the surface of the auxiliary resin conductive layer 42 to form the uncured main resin conductive layer 32.
- the main layer resin 33 is attached to the surface of the auxiliary resin conductive layer 42 to form the resin layer 32C.
- the main layer resin 33 is added to a solvent capable of dispersing or dissolving the main layer resin 33 to adjust the preparation liquid (paint).
- this preparation corresponds to the second preparation.
- the proportions of the main layer resin 33 and the solvent may be any suitable proportion that does not impair the formation of a layer to be performed later.
- the preparation liquid (paint) prepared as described above is adhered to the surface of the auxiliary resin conductive layer 42 as shown in FIG. 10 (d).
- FIG. 10D for convenience of description, the case where the sub resin conductive layer 42 is formed on one surface of the metal substrate 30 is described.
- the adhesion method is similar to that of the first embodiment, and is not limited.
- the layer formed by adhesion becomes an uncured resin layer 32C.
- the step of attaching the conductive substance 34B to the resin layer 32C without attaching the resin is the step of attaching the second conductive substance 34B of the third embodiment to the main resin conductive layer 32 (FIG. 9 (e))
- the description is omitted because it is the same as the reference.
- the entire or substantially the entire surface of the resin layer 32C is covered with the conductive material 34B (third step).
- the adhesion method here is the same as that of the first embodiment, and is not limited.
- distributes the electroconductive substance 34B which does not accompany resin is a solvent which is hard to melt
- the main layer resin 33 preferably has low solubility in the dispersion solvent in which the conductive substance 34B is dispersed.
- thermosetting resin used as the main layer resin 33, similarly to the fourth step of the third embodiment, for the metal substrate 30 whose surface is covered with the conductive substance 34B.
- the resin layer 32C is cured by heating and pressing with a hot press or the like.
- the conductive substance 34B is pressed into the resin layer 32C, and the cured main resin conductive layer 32 is formed.
- the resin conductive layer 32 is cured by a normal method by applying pressure by cold press or the like without heating.
- the metal substrate 30 whose surface is covered is pressurized by the above-mentioned hot press or the like or cold press or the like, the gaps between the powder or fibrous conductive material 34B (for example, the carbon conductive material 34B)
- the layer resin 33 enters and cures.
- the conductive substance 34B in which the hardened main resin conductive layer 32 is formed and the surface is covered with the conductive substance 34B is dispersed in the resin layer 32C to form the main resin conductive layer 32.
- the ratio of the conductive substance 34 B continuously increases due to sedimentation and pressurization from the interface of the auxiliary resin conductive layer 42 toward the surface of the separator.
- the main resin conductive layer 32 a portion formed by the main layer resin intruding between the conductive substances 34B is finally formed.
- the conductive substance 34B which is not restrained by the main layer resin is washed by, for example, high pressure washing or ultrasonic washing. This washing step may be omitted if all the attached conductive substance 34B is restrained by the resin.
- the auxiliary resin conductive layer 42 is formed and hardened in advance. Therefore, even if the main layer resin 33 of the main resin conductive layer 32 is not cured, the sublayer resin of the sub resin conductive layer 42 does not move even if it is pressurized by the pressing means. As a result, the secondary resin conductive layer 42 prevents the occurrence of defects in the film, which makes it possible to improve the corrosion resistance.
- the separator of the fourth embodiment includes the auxiliary resin conductive layer 42 between the main resin conductive layer 32 and the metal substrate 30.
- the sub resin conductive layer 42 prevents the metal ions from being eluted from the metal substrate 30 and includes the sub layer conductive substance 44 dispersed in the sub layer resin 45.
- the separator 20 according to the fourth embodiment exhibits the same effect as (1) of the third embodiment.
- the prepared sublayer resin 45 and the sublayer conductive substance 44 are attached to the surface (one side or both sides) of the metal substrate 30 and uncured
- the method includes a first step of forming the auxiliary resin conductive layer 42 and a step of curing the auxiliary resin conductive layer 42 formed in the first step.
- the main layer resin 33 is attached to the surface of the auxiliary resin conductive layer 42 to form an uncured resin layer 32C, and the resin layer 32C formed in the second step. And depositing a conductive material 34 B (second conductive material) without resin.
- the manufacturing method by pressing the metal substrate 30 whose surface is covered, the conductive substance 34B (second conductive substance) attached without resin is pushed into the resin layer 32C, and The fourth step of curing the layer resin 33 to form the main resin conductive layer 32 is included.
- the same effect as (2) of the third embodiment can be obtained.
- the dispersion solvent for dispersing the conductive substance 34B without the resin is different from the solvent of the second preparation liquid containing the main layer resin in the main layer resin 33. It is a difficult solvent to dissolve. As a result, according to the fourth embodiment, the same effect as (3) of the third embodiment can be obtained.
- the separator 20 of the fifth embodiment is used as the separators 20A and 20B described in FIG. 3 as in the third embodiment.
- separator 20 of the fifth embodiment the configuration different from that of the third embodiment described in FIG. 7 will be described, and the same or corresponding components as or to those of the third embodiment are denoted by the same reference numerals and the description thereof will be omitted. .
- the separators 20A and 20B have the same configuration, for convenience of explanation, the configuration of the separator 20A will be described, and the description of the separator 20B will be omitted.
- the separator of the third embodiment includes a sub resin conductive layer 42 and a main resin conductive layer 32 laminated on the entire surface (one side or both sides) of the metal substrate 30.
- the main resin conductive layer 32 includes the main layer resin 33, the first conductive substance 34A and the second conductive substance 34B, and the sub resin conductive layer 42 includes the sublayer resin 45 and the sublayer A conductive substance 44 is included.
- the separator 20A of the fifth embodiment also has a sub resin conductive layer 42 and a main resin conductive layer that are laminated on the entire surface (one side or both sides) of the metal substrate 30, as shown in FIG. 13 (b). That is, the sub resin conductive layer 42 and the main resin conductive layer 32 are provided on the top surface 22 b of the convex portion 22 of the metal substrate 30 and the surface on which the groove 22 a is formed.
- the auxiliary resin conductive layer 42 and the main resin conductive layer 32 are provided only on one side of the metal substrate 30 for convenience of explanation.
- the sublayer conductive substance 44 and the first conductive substance 34A are dispersed in the sub resin conductive layer 42 and the main resin conductive layer 32, respectively.
- the top surface 22 b of the convex portion 22 is a contact portion in contact with the gas diffusion layer 11 b.
- the surface forming the groove 22a is a non-contact portion.
- the separator 20A of the fifth embodiment differs from the third embodiment in the second conductive material 34B in the main resin conductive layer 32 and in the surface of the main resin conductive layer 32 in the top surface region of the convex portion 22. Are dispersed and fixed, but the second conductive substance 34B is not present on the surface on which the groove 22a is formed.
- the main layer resin 33 is different from that of the third embodiment in that the region portion covering the surface forming the groove 22a has hydrophilicity.
- the main layer resin 33 itself may be made of a hydrophilic resin.
- the main layer resin 33 preferably also has water resistance.
- the surface of the area portion may be subjected to a hydrophilization treatment.
- the hydrophilization treatment include plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. Since the resin 33 has hydrophilicity, water droplets staying in the groove 22a can be efficiently discharged to the outside.
- FIG. 11 (b) is a view showing a first step.
- FIG. 12A shows a second step similar to the second step shown in FIG. 9D of the third embodiment, and the description will be omitted because it is the same as the third embodiment.
- the main resin conductive layer 32 in which the first conductive substance 34A is dispersed in the main layer resin 33 is laminated on the sub resin conductive layer 42.
- the main resin conductive layer 32 is illustrated thinner than the sub resin conductive layer 42 for convenience of explanation, but the third embodiment Similar to the main resin conductive layer 32 of the above, it is formed thicker than the sub resin conductive layer 42.
- a second conductive substance 34B (for example, carbon black) similar to that of the third embodiment is applied by an application unit 50 such as a roll coater. It is applied on the uncured main layer resin 33 on the top surface of the convex portion 22. Alternatively, the second conductive substance 34B is applied onto the uncured main layer resin 33 by an application means such as a spray.
- FIG. 13A is an explanatory view of the fourth step.
- a thermosetting resin is used as the resin 33 for the metal substrate 30 whose surface is covered as shown in FIG. 13 (a)
- heating and pressing with a hot press, or heating means (heater) The main resin conductive layer 32 is cured by applying pressure by means of a belt press while heating.
- the main resin conductive layer 32 is cured by pressurizing with a roll press while heating with a heating means (heater).
- the heating temperature at this time is a temperature for curing the resin.
- the resin 33 is a thermoplastic resin or a reaction curable resin
- the main resin conductive layer 32 is cured by applying pressure by cold press, belt press or roll press without heating.
- the second conductive substance 34B is pressed into the main resin conductive layer 32 at the contact site, and the main layer resin 33 enters and cures in the gap between the second conductive substances 34B.
- FIG. 13B is an explanatory view of the fifth step.
- the portion of the main resin conductive layer 32 covering the surface on which the groove 22a is formed is subjected to a hydrophilization treatment to hydrophilize the surface.
- a hydrophilization treatment is performed by irradiation system treatment such as plasma treatment, corona discharge treatment, or ultraviolet irradiation treatment
- the resin 33 covering the top surface 22b is not hydrophilized because it is covered with the conductive substance 34B. . Therefore, the main resin conductive layer 32 covering the surface on which the groove 22a is formed can be selectively hydrophilized.
- the second conductive material 34B not bound to the resin may be washed by high-pressure washing or ultrasonic washing. This cleaning step may be omitted if all of the attached second conductive substance 34B is restrained by the resin.
- the second conductive substance 34B is applied to other than the top surface of the convex portion 22 by an application means such as a spray, for example, the second electric conduction not restrained by the resin by the cleaning method as described above. It is necessary to remove the sex substance 34B.
- separator 20A Although the above-mentioned explanation was explained by the manufacturing method of separator 20A, it can manufacture similarly about separator 20B.
- the portion of the main resin conductive layer 32 that covers the area of the surface on which the groove 22a is formed has hydrophilicity. Therefore, in the fuel cell using this separator, the water droplets remaining in the groove 22a can be efficiently discharged to the outside. As a result, the drainage of the groove is enhanced, and the gas diffusion of the gas diffusion layer 11b of the fuel cell is improved.
- the corrosion resistance of the metal substrate 30 is improved.
- the second conductive substance 34B is present on the surface of the main resin conductive layer 32 covering the convex portions 22 and 24 of the metal substrate 30, the contact resistance with the gas diffusion layer 11b can be reduced.
- the fuel cell separator according to the fifth embodiment has the top surfaces 22b and 24b of the projections 22 and 24 in contact with the gas diffusion layer 11b of the fuel cell or other separators on one side of the metal substrate 30 ( Contact site).
- the separator has a surface (non-contact portion) that forms grooves 22a, 24a that can not contact with the gas diffusion layer 11b or the other separator to define a water channel.
- the separator has a sub resin conductive layer 42 and a main resin conductive layer 32.
- the main resin conductive layer 32 includes a main layer resin 33 and a first conductive substance 34 A dispersed in the main layer resin 33.
- a second conductive material 34B is provided on the surface of the main resin conductive layer 32 on the top surfaces 22b and 24b (contact parts) of the protrusions 22 and 24. Further, the portion of the main layer resin 33 of the main resin conductive layer 32 covering the surface (non-contact portion) forming the grooves 22a and 24a has hydrophilicity.
- the portion of the main layer resin 33 of the resin conductive layer 32 covering the area of the surface on which the groove is formed has hydrophilicity. Therefore, in a fuel cell using this separator, Water droplets that stagnate can be discharged to the outside efficiently. As a result, the drainage of the groove is enhanced, the gas diffusivity of the gas diffusion layer 11b of the fuel cell is improved, and the cell performance is improved.
- the corrosion resistance of the metal substrate is improved.
- the second conductive substance 34B is present on the surface of the main resin conductive layer 32 covering the convex portion of the metal substrate, the contact resistance with the gas diffusion layer 11b can be reduced.
- the top surface 22b (contacting portion) of the projections 22 and 24 in contact with the gas diffusion layer 11b of the fuel cell or other separators on one surface of the metal substrate 30; It has a surface (non-contact portion) which forms grooves 22a, 24a which can not be in contact with diffusion layer 11b or other separators and which defines a water channel.
- the sublayer resin 45 and the sublayer conductive substance 44 are attached to the top surface 22b (contact portion) of the convex portions 22 and 24 and the surface (noncontact portion) forming the grooves 22a and 24a , Forming an uncured auxiliary resin conductive layer.
- the sub resin conductive layer 42 formed in the contact area and the non-contact area in the first step is cured.
- the main layer resin compounded with respect to the surface of the sub-resin conductive layer 42 on the top surface 22 b (contact portion) of the convex portions 22 and 24 and the surface (non-contact portion) forming the grooves 22 a and 24 a 33 and the first conductive material 34A are deposited to form an uncured main resin conductive layer 32.
- the second conductive substance 34B is attached to the portion of the main resin conductive layer 32 covering the top surfaces 22b (contact parts) of the convex portions 22 and 24 without resin.
- the second conductive material 34B may be attached to the portion of the main resin conductive layer 32 other than the top surface. However, in this case, it is necessary to remove the second conductive material 34B after the fourth step.
- the second conductive substance 34B attached without resin is pushed into the main resin conductive layer 32 by pressurizing the metal substrate 30 whose surface is covered, and the main resin conductive layer Cure 32.
- a portion for making the main resin conductive layer 32 covering the surface (non-contact portion) on which the grooves 22a and 24a are formed is subjected to a hydrophilization treatment.
- the non-contact portion is coated with the hydrophilic resin, in the fuel cell using this separator, the water droplets staying in the groove can be efficiently discharged to the outside. As a result, the gas diffusivity of the gas diffusion layer 11b of the fuel cell is improved. In addition, since the non-contact portion is coated with a hydrophilic resin, the corrosion resistance of the metal substrate is improved. Furthermore, since the second conductive substance 34B is present on the surface of the main resin conductive layer 32 covering the convex portion of the metal substrate, the contact resistance with the gas diffusion layer 11b can be reduced.
- Example 1 Example 1 regarding the first embodiment will be described.
- a resin conductive layer 70% by weight of MEK (methyl ethyl ketone) as a solvent and 30% by weight of the following solids were mixed to prepare a prepared solution.
- the solid content is 50% by weight of a phenolic resin (manufactured by Gunei Chemical Co., Ltd., Resitop PGA 4528), and 50% by weight of TiN (titanium nitride (manufactured by Nippon Shin Metals: weight average particle diameter of 1.2 to And 1.8 ⁇ m).
- This preparation was applied to both sides of a flat plate-like metal substrate made of SUS 447 J1 by spray coating to form a layer having a layer thickness of 4 ⁇ m.
- normal hexane which is a solvent here, is a dispersion solvent for dispersing expanded graphite, and is a solvent in which a phenol resin is less likely to dissolve as compared to MEK (methyl ethyl ketone).
- a layer of expanded graphite was applied and formed, and left for 30 minutes to evaporate normal hexane. Then, before curing of the first layer, heating and pressing were performed for 3 minutes by a hot press under conditions of a temperature of 150 ° C. and a face thickness load of 2 MPa, and the resin of the first layer was applied without resin. After being entrapped between conductive materials, the whole was cured to form a resin conductive layer.
- the surface of the separator was washed with a high pressure washer to remove the exfoliated graphite which was not restrained by the resin, the layer thickness of the exfoliated graphite was 7 ⁇ m, and the total layer thickness of the resin conductive layer was 11 ⁇ m.
- Example 2 Example 2 regarding the third embodiment will be described.
- the secondary resin conductive layer 70 wt% of MEK (methyl ethyl ketone) as a solvent and 30 wt% of the following solid contents were mixed to prepare a prepared solution.
- the solid content is 90% by weight of a phenolic resin (manufactured by Gunei Chemical Co., Ltd., Resitop PGA 4528) and 10% by weight of TiN (titanium nitride (manufactured by Nippon Shin Metals: weight average particle diameter of 1.2 to And 1.8 ⁇ m).
- the preparation liquid here corresponds to a first preparation liquid
- the phenol resin corresponds to a sublayer resin
- the conductive substance corresponds to a sublayer conductive substance.
- This prepared liquid was applied by spray to both surfaces of a flat plate-like metal substrate made of SUS 447 J1 to form a sub-resin conductive layer having a thickness of 3 ⁇ m.
- baking was performed by heating at a temperature of 150 ° C. for 10 minutes to cure the auxiliary resin conductive layer.
- the main resin conductive layer 70 wt% of MEK (methyl ethyl ketone) as a solvent and 30 wt% of the following solid contents were mixed to prepare a prepared solution.
- the solid content is 50% by weight of a phenolic resin (manufactured by Gunei Chemical Co., Ltd., Resitop PGA 4528), and 50% by weight of TiN (titanium nitride (manufactured by Nippon Shin Metals: weight average particle diameter of 1.2 to 1.8 ⁇ m)).
- the preparation liquid here corresponds to a second preparation liquid
- the phenol resin corresponds to a main layer resin
- the conductive substance corresponds to a first conductive substance.
- This preparation was applied to the surface of the sub-resin conductive layer by spraying to form a layer having a thickness of 2 ⁇ m and containing a resin and a conductive substance.
- the normal hexane which is a solvent here is a dispersion solvent which disperses the expanded graphite as the second conductive substance, and compared with the solvent (MEK (methyl ethyl ketone) of the second preparation liquid), a phenol resin which is a main layer resin Is a solvent that does not dissolve easily.
- MEK methyl ethyl ketone
- the surface of the separator was washed with a high pressure washer to remove the expanded graphite which was not restrained by the resin, the layer thickness of the expanded graphite was 6 ⁇ m, and the total layer thickness of the resin conductive layer was 11 ⁇ m.
- a resin conductive layer In order to form a resin conductive layer, 40% by weight of MEK (methyl ethyl ketone) as a solvent and 60% by weight of a commercially available carbon paint (manufactured by Nippon Graphite Industry, Ebriome 101P) were mixed to prepare a preparation.
- the commercially available carbon paint (Ebriome 101P, manufactured by Nippon Graphite Industry Co., Ltd.) is a paint made of graphite and a phenol resin.
- This prepared liquid was applied by spray on one side of a flat plate-like metal substrate 30 made of SUS447J1 as shown in FIG. Thereafter, the solvent was dried and evaporated, and baked by heating for 30 minutes at a temperature of 150 ° C. to form a conductive layer 62 with a layer thickness of 5 ⁇ m.
- a conductive substance 64 made of carbon is dispersed and disposed in the conductive layer 62.
- Comparative example 2 As a resin conductive material, 90% by weight of a commercially available carbon paint (manufactured by Nippon Graphite Industries, Inc., Ebriome 101P) and 10% by weight of TiN (titanium nitride (manufactured by Nippon Shin Metals: weight average particle diameter is 1.2 to 1.). Mixed with 8 ⁇ m)). The mixture was adjusted to 60% by weight and mixed in 40% by weight of MEK (methyl ethyl ketone) as a solvent to prepare a paint formulation.
- MEK methyl ethyl ketone
- This preparation liquid was spray-coated on one surface of a flat metal substrate 30 made of SUS447J1 as shown in FIG. 16 (b) to form a coating film. Thereafter, the solvent is evaporated by drying, and baking is carried out by heating at a temperature of 150 ° C. for 30 minutes to form a resin conductive layer 72 having a layer thickness of 5 ⁇ m.
- a conductive substance 74 made of carbon and a conductive substance 76 made of TiN are dispersed in the resin conductive layer 72.
- This preparation was applied to both sides of a flat metal substrate made of SUS 447 J1 by spray coating to form a layer having a layer thickness of 5 ⁇ m.
- MEK methyl ethyl ketone
- MEK methyl ethyl ketone
- FIG. 16C shows a state in which a conductive substance 84 composed of carbon and a conductive substance 86 composed of TiN are dispersed in the resin conductive layer 82 in Comparative Example 3. . Also, it is illustrated that the phenolic resin layer 88 is formed over the surface on which the conductive substance 86 is laminated.
- both sides of a test piece 304 are sandwiched by carbon cloth 306, and a predetermined current (4 MPa) is applied by a contact resistance measurement jig 301, 302 while applying a predetermined load (1 MPa).
- the voltage at the time of applying (1A) was measured to determine the contact resistance.
- the evaluation area of the test piece 304 in the contact resistance test is 10 cm 2 .
- the carbon cloth 306 is the same material as the gas diffusion layer 11 b provided on the anode 16 A and the cathode 16 B described in FIGS. 3 and 4.
- the measured values of the contact resistance to the gas diffusion layer 11b described below are measured by the contact resistance test in a state where one test piece 304 is sandwiched between a pair of carbon cloths 306 as shown in FIG. .
- the contact resistance to the separator, Comparative Example 1, 90m ⁇ ⁇ cm 2, 21.4m ⁇ ⁇ cm 2 in Comparative Example 2 was 44m ⁇ ⁇ cm 2 in Comparative Example 3.
- the contact resistance to the separator in Example 1 was 3.6 m ⁇ ⁇ cm 2
- the contact resistance to the separator in Example 2 was 4.0 m ⁇ ⁇ cm 2 .
- FIG. 18 is a graph showing the measurement results of the contact resistance to GDL and the contact resistance to the separator in Example 1 in which normal hexane is used as the dispersion solvent of expanded graphite and in Comparative Example 3 in which MEK (methyl ethyl ketone) is used. is there.
- Examples 1 and 2 showed smaller resistance values in both the contact resistance to the gas diffusion layer (GDL) and the contact resistance to the separator, as compared with Comparative Examples 1 to 3.
- the load (surface pressure) is 0.1 to 1.0 MPa by the contact resistance measuring jig 301, 302.
- the contact resistance was measured at intervals of 0.1. The measurement results are shown in FIG.
- the loads by the contact resistance measurement jigs 301 and 302 are changed every 0.1 to 0.2 to 1.0 MPa.
- the contact resistance to the separator was measured.
- the measurement of the contact resistance to the separator is to measure the contact resistance of the coating films (resin conductive layers) provided on the respective separators. The measurement results are shown in FIG.
- test pieces of Examples 1 and 2 were immersed in a solution adjusted to a temperature of 80 ° C. with an aqueous solution of sulfuric acid (300 ml, ph 3), and in this state, the potential of 0.9 V vs SHE was kept constant. I kept it. The test time was 100 hours.
- Metal ion elution confirmation test The amount of metal ions in the aqueous sulfuric acid solution was measured using a Digital Pack Test Multi Device (measurement method: absorptiometry (LED: 470, 525, 615 nm)) manufactured by Kyoritsu Chemical-Chemical Laboratory Co., Ltd.
- the elution amount of Fe was 1.5 mg / l for the test piece of Example 1, and less than the detection limit (0.05 mg / l) for the test piece of Example 2.
- the elution amount of Cr was below the detection limit (0.05 mg / l) also about any of the test piece of Example 1 and Example 2.
- FIG. 1 the detection limit (0.05 mg / l) also about any of the test piece of Example 1 and Example 2.
- Reference Signs List 20 separator, 30 metal substrate 32 resin conductive layer (main resin conductive layer) 32A, 32B resin conductive layer 33 resin (main layer resin) 34 34A, 34B conductive substance 35A 35B: resin, 36A, 36B: conductive material, 42: auxiliary resin conductive layer, 44: auxiliary layer conductive material, 45: auxiliary layer resin.
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Abstract
Description
燃料電池10は、複数の単セル12が積層されたスタック構造を有する。図3に示すように、単セル12は、アノード組立体13と、カソード組立体14と、アノード組立体13及びカソード組立体14の間に挟まれる固体高分子電解質膜(以下、単に「電解質膜」という)15とを有する。
次に、燃料電池の第2構成例を、図4を参照して説明する。第1構成例と同一構成または相当する構成については同一符号を付し、第1構成例とは異なる構成について説明する。図4に示すように、第2構成例では、セパレータ20A,20Bは平板状に形成されている。両セパレータ20A,20Bの間には、冷却水板26が挟み込まれている。冷却水板26は、上下に交互に突出する複数の突部27を有し、突部27において、セパレータ20A,20Bにそれぞれ接触している。セパレータ20Aと冷却水板26との間、及びセパレータ20Bと冷却水板26との間に形成された空間は、水等の冷却媒体が流れる冷却流路40を構成している。また、セパレータ20Aとアノード16Aのガス拡散層11bとの間、及びセパレータ20Bとカソード16Bのガス拡散層11bとの間には、金属材料或いは導電性材料製の多孔体29が配置されている。多孔体29は、セパレータ20Aとアノード16Aのガス拡散層11bとを電気的に接続しセパレータ20Bとカソード16Bのガス拡散層11bとをそれぞれ電気的に接触している。
次に、上記のように燃料電池に使用される前記セパレータ20A及びセパレータ20Bについて図1、及び図2を参照して説明する。
次に、上記のように構成されたセパレータ20の製造方法を、図5(a)~(d)を参照して説明する。
上記のように構成されたセパレータ20を、図3で示す第1構成例及び図4で示す第2構成例の燃料電池10に使用する場合、GDL(ガス拡散層)11bとの接触面の導電性パスが十分に確保できる。また、樹脂導電層32内の導電性物質の割合を、金属基板の界面からセパレータ20の表面に向けて連続的に増加するように構成しているため、第1導電性物質34Aが存在する部位と、第2導電性物質34Bが主に存在する部位との界面抵抗の上昇がなく、かつ、固有抵抗も低減できる。このため、他の部材(GDL、セパレータ)との接触抵抗は大幅に低減する。また、セパレータ20の表面の導電性パスが十分に確保できるため、燃料電池10において、同様の樹脂導電層を備えた他のセパレータに接続した場合の抵抗も低減する。
次に、第2実施形態のセパレータを、図6を参照して説明する。
次に第2実施形態のセパレータ20の製造方法を、図6を参照して説明する。
次に、第3実施形態のセパレータ20及び該セパレータの製造方法を図7~9を参照して説明する。第3実施形態のセパレータ20については、第1実施形態のセパレータ20と異なる構成について説明し、第1実施形態と同一または相当する構成については同じ符号を付してその説明を省略する。
次に、第3実施形態のセパレータ20の製造方法を図9(a)~(f)を参照して説明する。
上記のように構成されたセパレータ20は、第1実施形態と同様の作用の他に下記の作用がある。
次に、第4実施形態を、セパレータ20及びセパレータの製造方法を図10を参照して説明する。第4実施形態では、第3実施形態のセパレータ20と異なる構成について説明し、第3実施形態と同一または相当する構成については同じ符号を付してその説明を省略する。
次に、第4実施形態のセパレータ20の製造方法を図10(a)~(f)を参照して説明する。図10(a)~(c)までの工程又は段階は、第3実施形態の図9(a)~(c)で説明した製造方法と同じであるため説明を省略する。すなわち、金属基板30に副樹脂導電層42を形成するまでは、第3実施形態と同じである。
第4実施形態においても、副樹脂導電層42が、形成されて、予め硬化される。そのため、主樹脂導電層32の主層樹脂33が硬化していない状態で、プレス手段により加圧されても、副樹脂導電層42の副層樹脂が移動することがない。この結果、副樹脂導電層42により被膜の欠陥が発生することが防止され、耐食性を向上させることが可能となる。
次に、第5実施形態を図11~図13を参照して説明する。
次に、第5実施形態のセパレータ20の製造方法の一例を図11~図12を参照して説明する。
第5実施形態では、溝22aを形成する面の領域を被覆する主樹脂導電層32の部分が親水性を有する。そのため、このセパレータを使用した燃料電池では、溝22aに滞留する水滴を効率良く外部に排出できる。この結果、溝の排水性を高めて、燃料電池のガス拡散層11bのガス拡散性が向上する。
第1実施形態に関する実施例1について説明する。
第3実施形態に関する実施例2について説明する。
樹脂導電層の形成のために、溶媒として40重量%のMEK(メチルエチルケトン)と、60重量%の市販カーボン塗料(日本黒鉛工業製、エブリオーム101P)とを混合して調合液を調整した。市販カーボン塗料(日本黒鉛工業製、エブリオーム101P)は、黒鉛及びフェノール樹脂からなる塗料である。この調合液を、図16(a)に示すようにSUS447J1からなる平板状の金属基板30の片面に対してスプレーにより塗布して塗膜を形成した。この後、溶媒を乾燥蒸発させ、温度150℃で30分間加熱してベークし、層厚5μmの導電層62を形成した。図16(a)において、導電層62の中にカーボンからなる導電性物質64が分散して配置されている。
樹脂導電性物質として、90重量%の市販のカーボン塗料(日本黒鉛工業製、エブリオーム101P)と、10重量%のTiN(窒化チタン(日本新金属製:重量平均粒径が1.2~1.8μm))とを混合した。この混合物を60重量%とし、溶媒として40重量%のMEK(メチルエチルケトン)に混合して、塗料の調合液を調整した。
樹脂導電層の形成のために、90重量%の市販のカーボン塗料(日本黒鉛工業製、エブリオーム101P)と、10重量%のTiN(窒化チタン(日本新金属製:重量平均粒径が1.2~1.8μm))とを混合した。前記混合物を60重量%とし、溶媒として40重量%のMEK(メチルエチルケトン)に混合して、調合液を調整した。
実施例1、2及び比較例1~3のセパレータについて下記の方法による測定を行なった。
実施例1、2について、日本工業規格の金属材料の電気化学的高温腐食試験法(JIS Z2294)に準じた定電位腐食試験を行った。
前記硫酸水溶液中の金属イオン量を(株)共立理化学研究所製のデジタルパックテストマルチ装置(測定方法:吸光光度法(LED:470,525,615nm))を用いて測定した。
Claims (11)
- 金属基板と、該金属基板の表面上の樹脂導電層とを有し、該樹脂導電層は、樹脂と、該樹脂内に分散された導電性物質とを含む燃料電池用セパレータにおいて、
前記導電性物質の前記樹脂に対する割合が前記金属基板から、前記燃料電池用セパレータの表面に向けて連続的に増加することを特徴とする燃料電池用セパレータ。 - 前記樹脂導電層は主樹脂導電層を構成し、
前記燃料電池用セパレータは前記主樹脂導電層と前記金属基板との間に副樹脂導電層を備え、該副樹脂導電層は、副層樹脂と、該副層樹脂内に分散された副層導電性物質とを含み、前記副樹脂導電層は前記金属基板から金属イオンが溶出することを防止することを特徴とする請求項1に記載の燃料電池用セパレータ。 - 金属基板の表面は、燃料電池のガス拡散層または他のセパレータに接触する接触部位と、前記ガス拡散層または前記他のセパレータに対して接触不能であるとともに水路を画定する非接触部位とを有し、
前記主樹脂導電層および前記副樹脂導電層は、前記接触部位および前記非接触部位に形成され、
前記非接触部位において、前記主樹脂導電層が親水性を有する請求項2に記載の燃料電池用セパレータ。 - 金属基板の表面に対して、調合された樹脂および第1導電性物質を付着させて未硬化の樹脂導電層を形成する第1工程と、
前記未硬化の樹脂導電層の表面に対して、第2導電性物質を付着させる第2工程と、
前記未硬化の樹脂導電層を硬化させる第3工程であって、硬化時に、表面を覆われた金属基板を加圧することにより、前記樹脂を前記第2導電性物質の間に入り込ませて硬化させる前記第3工程とを含む燃料電池用セパレータの製造方法。 - 前記第2工程は、前記第2導電性物質を溶媒に混合し、その混合物を前記第1工程で形成された未硬化の樹脂導電層上に付着させる工程を含み、前記樹脂は、前記溶媒に対し難溶性を有することを特徴とする請求項4に記載の燃料電池用セパレータの製造方法。
- 金属基板の表面に対して、調合された第1層樹脂および第1層導電性物質を付着させて、未硬化の第1樹脂導電層を形成する第1工程と、
前記未硬化の第1樹脂導電層の表面に対して、調合された第2層樹脂および第2層導電性物質を付着させて、未硬化の第2樹脂導電層を形成する第2工程であって、前記第2層導電性物質の前記第2層樹脂に対する割合は、前記第1層導電性物質の前記第1層樹脂に対する割合よりも多い前記第2工程と、
前記未硬化の第1樹脂導電層および第2樹脂導電層を硬化させる第3工程とを含む燃料電池用セパレータの製造方法。 - 金属基板の表面に対して、調合された副層樹脂および副層導電性物質を付着させて、未硬化の副樹脂導電層を形成する第1工程と、
前記未硬化の副樹脂導電層を硬化させる工程と、
前記副樹脂導電層の表面に対して、調合された主層樹脂および第1導電性物質を付着させて、未硬化の主樹脂導電層を形成する第2工程と、
前記未硬化の主樹脂導電層の表面に対して、第2導電性物質を付着させる第3工程と、
前記未硬化の主樹脂導電層を硬化させる第4工程であって、表面を覆われた金属基板を加圧することにより、前記主層樹脂を前記第2導電性物質の間に入り込ませた後、前記主層樹脂を硬化させる前記第4工程とを含む燃料電池用セパレータの製造方法。 - 前記第3工程は、前記第2導電性物質を溶媒に混合し、その混合物を前記第1工程で形成された未硬化の副樹脂導電層上に付着させる工程を含み、前記主層樹脂は、前記溶媒に対し難溶性を有することを特徴とする請求項7に記載の燃料電池用セパレータの製造方法。
- 金属基板の表面に対して、調合された副層樹脂および副層導電性物質を付着させて、未硬化の副樹脂導電層を形成する第1工程と、
前記未硬化の副樹脂導電層を硬化させる工程と、
前記副樹脂導電層の表面に対して、主層樹脂を付着させて、未硬化の樹脂層を形成する第2工程と、
前記未硬化の樹脂層の表面に対して、導電性物質を付着させる第3工程と、
表面を覆われた金属基板を加圧することにより、前記未硬化の樹脂層の主層樹脂を前記導電性物質の間に入り込ませて硬化させ、主樹脂導電層を形成する第4工程とを含む燃料電池用セパレータの製造方法。 - 前記第3工程は、前記導電性物質を溶媒に混合し、その混合物を前記第1工程で形成された未硬化の副樹脂導電層上に付着させる工程を含み、前記主層樹脂は、前記溶媒に対し難溶性を有することを特徴とする請求項9に記載の燃料電池用セパレータの製造方法。
- 前記金属基板の表面は、燃料電池のガス拡散層または他のセパレータに接触する接触部位と、前記ガス拡散層または前記他のセパレータに対して接触不能であって、水路を画定する非接触部位とを有し、
前記第1工程では、前記金属基板の接触部位及び非接触部位に対して前記副層樹脂および前記副層導電性物質を付着させ、
前記未硬化の副樹脂導電層を硬化させる工程では、前記第1工程において、前記接触部位及び非接触部位に形成された前記未硬化の副樹脂導電層を硬化させ、
前記第2工程では、前記接触部位及び非接触部位の副樹脂導電層の表面に対して、調合された主層樹脂および第1導電性物質を付着させて、未硬化の主樹脂導電層を形成し、
前記第3工程では、前記第2工程で形成された未硬化の主樹脂導電層のうち前記接触部位を覆う部分に対して第2導電性物質を付着させ、
前記第4工程では、前記表面を覆われた金属基板を加圧することにより、前記接触部位を覆う部分における前記主層樹脂を前記第2導電性物質の間に入り込ませた後、前記主層樹脂を硬化させ、
前記第4工程の後に、前記主樹脂導電層のうち前記非接触部位を覆う部分に対して親水化処理を行う第5工程をさらに含む請求項7に記載の燃料電池用セパレータの製造方法。
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US9515324B2 (en) | 2016-12-06 |
JP5930036B2 (ja) | 2016-06-08 |
US20150140204A1 (en) | 2015-05-21 |
EP2884570A1 (en) | 2015-06-17 |
JPWO2014010491A1 (ja) | 2016-06-23 |
EP2884570B1 (en) | 2017-06-14 |
EP2884570A4 (en) | 2016-05-18 |
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