WO2014003019A1 - Feuille de cuivre enroulée, son procédé de fabrication, et plaque stratifiée - Google Patents

Feuille de cuivre enroulée, son procédé de fabrication, et plaque stratifiée Download PDF

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Publication number
WO2014003019A1
WO2014003019A1 PCT/JP2013/067413 JP2013067413W WO2014003019A1 WO 2014003019 A1 WO2014003019 A1 WO 2014003019A1 JP 2013067413 W JP2013067413 W JP 2013067413W WO 2014003019 A1 WO2014003019 A1 WO 2014003019A1
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WO
WIPO (PCT)
Prior art keywords
copper foil
rolling
rolled copper
less
final
Prior art date
Application number
PCT/JP2013/067413
Other languages
English (en)
Japanese (ja)
Inventor
嘉一郎 中室
拓摩 吉川
Original Assignee
Jx日鉱日石金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Priority to KR1020157002391A priority Critical patent/KR101669774B1/ko
Priority to CN201380001896.9A priority patent/CN103636296B/zh
Publication of WO2014003019A1 publication Critical patent/WO2014003019A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Definitions

  • the present invention relates to a rolled copper foil and a method for producing the same, and a laminated board, and in particular, a rolled copper foil suitable for a field where transparency of the remaining resin after etching the copper foil is required, and a method for producing the same. , Relating to laminates.
  • FPC flexible printed wiring boards
  • the signal current propagates near the surface of the wiring. Therefore, if the surface of the copper foil used as the FPC wiring member is rough, the signal loss increases. Therefore, the smoothness of the surface is required for the high-frequency copper foil.
  • the marker position is confirmed by a CCD camera through a resin layer (for example, polyimide) serving as the base of the FPC, and the bonding position is adjusted.
  • the resin layer of FPC is obtained by removing the copper layer by etching after bonding the copper foil and the resin layer. Therefore, the resin layer surface is a replica to which the unevenness of the copper foil surface is transferred. That is, if the surface of the copper foil is rough, the surface of the resin layer is also rough, and light is irregularly reflected, so that the transparency is lowered. For this reason, in order to improve the light transmittance of a resin layer, it is necessary to make the adhesive surface with the resin layer of copper foil smooth. In general, the adhesive surface of the copper foil with the resin layer is subjected to roughening plating in order to increase the adhesive strength. Since the plating particles for the roughening treatment are larger than the surface roughness of the copper foil, the plating conditions have been mainly improved so far as means for smoothing the copper foil surface.
  • Patent Document 1 discloses an adhesion layer that is formed of chromium and zinc ions or oxides on the surface of a copper foil and is processed using an aqueous solution containing at least 0.5% of silane. The copper foil is shown.
  • the adhesion strength of the demonstration sample disclosed in Patent Document 1 is lower than that of a rough copper foil as a comparative sample.
  • the adhesion strength with the resin layer is lowered, and thus there is a limit to smoothing by improving the rough plating. For this reason, it is difficult to achieve both ensuring of the adhesion strength between the resin layer and the copper foil and improving the visibility of the resin layer.
  • the present invention is a rolled copper having a smooth surface even when subjected to the same roughening plating as before, excellent adhesion to the resin, and excellent transparency of the resin after the copper foil is removed by etching. It is an object to provide a foil, a manufacturing method thereof, and a laminated board.
  • the inventors smoothed the surface of the rolled copper foil as a base material for rough plating by a predetermined means, and by using the rolled copper foil whose gloss level was controlled within a predetermined range, It has been found that the transparency of the resin after removing the copper foil by etching is improved even when a roughening treatment for obtaining good adhesion with the resin is performed.
  • a 180 ° adhesive bending with the polyimide film surface inside is performed on a sample of a single-sided copper clad laminate having a width of 3 mm or more and 5 mm or less laminated, the number of times of bending until the copper foil breaks is 3 times. It is the rolled copper foil which is the above.
  • the oil film equivalent in the final rolling pass of the final cold rolling process is 17000 or less, the oil film equivalent in the rolling pass immediately before the final rolling pass is 15000 or less, and the oil film equivalent in the rolling pass immediately before is further reduced.
  • the present invention is a laminated plate configured by laminating the rolled copper foil of the present invention and a resin substrate.
  • a rolled copper foil a method for producing the same, and a laminated plate that are excellently bonded to a resin and excellent in transparency of the resin after the copper foil is removed by etching.
  • Example 3 is a SEM image of the copper foil surface of Example 2.
  • 6 is a SEM image of a copper foil surface of Comparative Example 2.
  • the rolled copper foil used in the present invention is useful for a rolled copper foil that is used by bonding a resin substrate to produce a laminate and partially removing the copper foil by etching.
  • the surface of the copper foil that adheres to the resin substrate that is, the roughened surface, has a fist-like electric surface on the surface of the copper foil after degreasing in order to improve the peel strength of the copper foil after lamination.
  • a roughening process is carried out to wear. This roughening treatment can be performed by copper-cobalt-nickel alloy plating, copper-nickel-phosphorus alloy plating, or the like.
  • the rolled copper foil according to the present invention includes a copper alloy foil containing one or more elements such as Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, and V.
  • a copper alloy containing 10 to 2000 ppm of the above element or a copper alloy containing 10 to 500 ppm is included.
  • the conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more.
  • the thickness of the copper foil is not particularly limited, but is preferably 5 to 50 ⁇ m, more preferably 5 to 35 ⁇ m.
  • the rolled copper foil of the present invention has a 60-degree glossiness G in the rolling parallel direction of more than 500. For this reason, the smoothness of the copper foil surface becomes good, and the transparency of the resin after removing the copper foil by etching becomes good even if a roughening treatment for obtaining good adhesion with the resin is performed.
  • the 60-degree glossiness G in the rolling parallel direction is 500 or less, when the roughening treatment is performed to obtain good adhesion to the resin, the transparency of the resin after removing the copper foil by etching is good. It becomes difficult to obtain.
  • the 60-degree glossiness G in the rolling parallel direction is preferably 520 or more, and more preferably 550 or more.
  • the 60 degree glossiness G in the rolling parallel direction is 600 or more. Although there is no upper limit on the 60-degree glossiness G in terms of the characteristics of the copper foil, the 60-degree glossiness G in the rolling parallel direction can be 900 or less in consideration of manufacturability and the like.
  • the rolled copper foil of the present invention performs 180 ° adhesion bending with a polyimide film surface on the inside of a sample of a single-sided copper clad laminate having a width of 3 mm or more and 5 mm or less obtained by laminating a copper foil and a polyimide film having a film thickness of 25 ⁇ m.
  • the number of times of bending until the copper foil breaks is preferably 3 times or more, and more preferably 5 times or more. If the flexibility is good so as to satisfy such conditions, it can be suitably used as an LCD module FPC.
  • a raw material is first melt
  • the oil film equivalent in the final rolling pass of the final cold rolling step is 17000 or less
  • the oil film equivalent in the rolling pass immediately before the final rolling pass is 15000 or less
  • the oil film equivalent is defined by the following equation.
  • Oil film equivalent ⁇ (rolling oil viscosity [cSt]) ⁇ (sheet feeding speed [mpm] + roll peripheral speed [mpm]) ⁇ / ⁇ (roll biting angle [rad]) ⁇ (yield stress of material [kg / mm 2 ]) ⁇
  • the rolling oil viscosity [cSt] is a kinematic viscosity at 40 ° C.
  • a known method such as using a low-viscosity rolling oil or slowing the sheet passing speed may be used. By controlling the oil film equivalent, deformation of the material surface is constrained by the roll, and an increase in surface roughness accompanying a change in thickness due to rolling can be suppressed.
  • the gloss level after the final pass can be controlled within a desired range. If the gloss level is low immediately before the final pass, even if the material surface is smoothed in the final pass, deep irregularities formed up to the previous pass remain, and the desired surface shape cannot be obtained.
  • the surface of the rolling roll is preferably smooth.
  • the average roughness Ra when the rolling roll used with the manufacturing method of the rolled copper foil of this invention is measured in the direction parallel to the rotating shaft of a roll is 0.1 micrometer or less.
  • the laminated copper foil can be manufactured by bonding the rolled copper foil of the present invention to the resin substrate from the roughened surface side.
  • the resin substrate is not particularly limited as long as it has characteristics applicable to a printed wiring board and the like.
  • a polyester film such as polyethylene terephthalate (PET), a polyimide film, a liquid crystal polymer (LCP) film, etc. are used. I can do it.
  • the method of laminating can be applied to a substrate such as a polyimide film via an adhesive, or laminated and bonded to a rolled copper foil under high temperature and high pressure without using an adhesive, or a polyimide precursor is applied and dried.
  • a substrate such as a polyimide film via an adhesive
  • laminated and bonded to a rolled copper foil under high temperature and high pressure without using an adhesive or a polyimide precursor is applied and dried.
  • -A laminated board can be manufactured by performing hardening etc.
  • each rolled copper foil was prepared as follows. First, after producing a copper ingot having the composition shown in Table 1 and performing hot rolling, cold rolling and annealing in an annealing furnace set to a temperature of 300 to 800 ° C. are repeated at least once, and then cold rolling is performed. Thus, a rolled plate having a thickness of 1 to 2 mm was obtained. This rolled sheet was annealed and recrystallized in an annealing furnace set to a temperature of 300 to 800 ° C., and finally cold-rolled to the thickness shown in Table 1.
  • the conditions for the roughening treatment were set as follows. The conditions for the roughening treatment were generally used for FPC applications as those that would give practically sufficient peel strength.
  • -Plating bath composition Cu 15 g / L, Co 8.5 g / L, Ni 8.6 g / L -Treatment solution pH: 2.5 ⁇ Processing temperature: 38 °C ⁇ Current density: 20 A / dm 2 ⁇ Plating time: 2.0 seconds
  • haze value (%) is a value calculated by (diffuse transmittance) / (total light transmittance) ⁇ 100.
  • One surface of each sample copper foil was plated under the following conditions as a roughening treatment.
  • ⁇ Peel strength (adhesive strength);
  • the normal peel strength is measured with a tensile tester Autograph 100, and the normal peel strength is 0.7 N / mm or more that can be used for laminated substrate applications (judgment “ ⁇ ”). Those with less than 0.7 N / mm could not be used (judgment “x”).
  • FIG. 2 shows an SEM image of the copper foil surface of Comparative Example 2.
  • the 60-degree glossiness G in the rolling parallel direction was greater than 500, and the adhesion to the resin, the visibility of the resin, and the bendability were good.
  • the 60-degree glossiness G in the rolling parallel direction was 500 or less, and the visibility of the resin was poor. Some also had poor bendability.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Rolling (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne : une feuille de cuivre enroulée qui adhère de manière favorable à une résine, et qui est telle que la transparence de la résine est supérieure après retrait de la feuille de cuivre par gravure ; un procédé de fabrication de la feuille de cuivre enroulée ; et une plaque stratifiée. Dans la feuille de cuivre enroulée, dont la brillance (G) à 60° dans la direction parallèle à l'enroulement est supérieure à 500 et inférieure à 900, lorsqu'un enroulement serré à 180° est réalisé avec la surface de film de polyimide sur l'intérieur d'un échantillon d'une plaque stratifiée à revêtement de cuivre sur un seul côté ayant une largeur de 3 à 5 mm inclus et résultant de la stratification d'une feuille de cuivre et d'un film de polyimide ayant une épaisseur de 25 µm, le nombre de répétitions de torsion jusqu'à ce que la feuille de cuivre se brise étant au moins trois.
PCT/JP2013/067413 2012-06-29 2013-06-25 Feuille de cuivre enroulée, son procédé de fabrication, et plaque stratifiée WO2014003019A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020157002391A KR101669774B1 (ko) 2012-06-29 2013-06-25 압연 구리박 및 그 제조 방법, 그리고 적층판
CN201380001896.9A CN103636296B (zh) 2012-06-29 2013-06-25 轧制铜箔及其制造方法、以及层叠板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012147449A JP5261595B1 (ja) 2012-06-29 2012-06-29 圧延銅箔及びその製造方法、並びに、積層板
JP2012-147449 2012-06-29

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WO2014003019A1 true WO2014003019A1 (fr) 2014-01-03

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PCT/JP2013/067413 WO2014003019A1 (fr) 2012-06-29 2013-06-25 Feuille de cuivre enroulée, son procédé de fabrication, et plaque stratifiée

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JP (1) JP5261595B1 (fr)
KR (1) KR101669774B1 (fr)
CN (1) CN103636296B (fr)
TW (1) TWI600537B (fr)
WO (1) WO2014003019A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6612168B2 (ja) * 2016-03-30 2019-11-27 Ｊｘ金属株式会社 銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器
JP6611751B2 (ja) * 2017-03-31 2019-11-27 Ｊｘ金属株式会社 リチウムイオン電池集電体用圧延銅箔及びリチウムイオン電池
JP6856688B2 (ja) * 2019-03-26 2021-04-07 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
CN110392485B (zh) * 2019-06-18 2022-04-12 淮安维嘉益集成科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法

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JP2006281249A (ja) * 2005-03-31 2006-10-19 Nikko Kinzoku Kk 銅張積層基板用高光沢圧延銅箔及びその製造方法
JP2006326684A (ja) * 2005-04-28 2006-12-07 Nikko Kinzoku Kk 銅張積層基板用高光沢圧延銅箔
JP2010227971A (ja) * 2009-03-27 2010-10-14 Nippon Mining & Metals Co Ltd 圧延銅箔
JP2011136357A (ja) * 2009-12-28 2011-07-14 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板
WO2012043462A1 (fr) * 2010-09-28 2012-04-05 Jx日鉱日石金属株式会社 Feuille de cuivre roulée

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Publication number Priority date Publication date Assignee Title
US7749611B2 (en) 2002-12-05 2010-07-06 Gbc Metals, L.L.C. Peel strength enhancement of copper laminates
JP4240506B2 (ja) * 2006-09-05 2009-03-18 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの製造方法
US20080174016A1 (en) * 2006-12-28 2008-07-24 Mitsui Mining & Smelting Co., Ltd. Flexible Printed Wiring Board and Semiconductor Device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006281249A (ja) * 2005-03-31 2006-10-19 Nikko Kinzoku Kk 銅張積層基板用高光沢圧延銅箔及びその製造方法
JP2006326684A (ja) * 2005-04-28 2006-12-07 Nikko Kinzoku Kk 銅張積層基板用高光沢圧延銅箔
JP2010227971A (ja) * 2009-03-27 2010-10-14 Nippon Mining & Metals Co Ltd 圧延銅箔
JP2011136357A (ja) * 2009-12-28 2011-07-14 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板
WO2012043462A1 (fr) * 2010-09-28 2012-04-05 Jx日鉱日石金属株式会社 Feuille de cuivre roulée

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CN103636296B (zh) 2017-06-06
KR20150029726A (ko) 2015-03-18
KR101669774B1 (ko) 2016-10-27
JP2014011341A (ja) 2014-01-20
TWI600537B (zh) 2017-10-01
CN103636296A (zh) 2014-03-12
JP5261595B1 (ja) 2013-08-14
TW201404585A (zh) 2014-02-01

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