JP5261595B1 - 圧延銅箔及びその製造方法、並びに、積層板 - Google Patents

圧延銅箔及びその製造方法、並びに、積層板 Download PDF

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Publication number
JP5261595B1
JP5261595B1 JP2012147449A JP2012147449A JP5261595B1 JP 5261595 B1 JP5261595 B1 JP 5261595B1 JP 2012147449 A JP2012147449 A JP 2012147449A JP 2012147449 A JP2012147449 A JP 2012147449A JP 5261595 B1 JP5261595 B1 JP 5261595B1
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JP
Japan
Prior art keywords
copper foil
rolling
rolled copper
final
less
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Active
Application number
JP2012147449A
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English (en)
Japanese (ja)
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JP2014011341A (ja
Inventor
嘉一郎 中室
拓摩 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2012147449A priority Critical patent/JP5261595B1/ja
Priority to TW102121868A priority patent/TWI600537B/zh
Priority to KR1020157002391A priority patent/KR101669774B1/ko
Priority to CN201380001896.9A priority patent/CN103636296B/zh
Priority to PCT/JP2013/067413 priority patent/WO2014003019A1/fr
Application granted granted Critical
Publication of JP5261595B1 publication Critical patent/JP5261595B1/ja
Publication of JP2014011341A publication Critical patent/JP2014011341A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Metal Rolling (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2012147449A 2012-06-29 2012-06-29 圧延銅箔及びその製造方法、並びに、積層板 Active JP5261595B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012147449A JP5261595B1 (ja) 2012-06-29 2012-06-29 圧延銅箔及びその製造方法、並びに、積層板
TW102121868A TWI600537B (zh) 2012-06-29 2013-06-20 Rolled copper foil and its manufacturing method, and laminated board
KR1020157002391A KR101669774B1 (ko) 2012-06-29 2013-06-25 압연 구리박 및 그 제조 방법, 그리고 적층판
CN201380001896.9A CN103636296B (zh) 2012-06-29 2013-06-25 轧制铜箔及其制造方法、以及层叠板
PCT/JP2013/067413 WO2014003019A1 (fr) 2012-06-29 2013-06-25 Feuille de cuivre enroulée, son procédé de fabrication, et plaque stratifiée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012147449A JP5261595B1 (ja) 2012-06-29 2012-06-29 圧延銅箔及びその製造方法、並びに、積層板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013048183A Division JP2014011451A (ja) 2013-03-11 2013-03-11 圧延銅箔及びその製造方法、並びに、積層板

Publications (2)

Publication Number Publication Date
JP5261595B1 true JP5261595B1 (ja) 2013-08-14
JP2014011341A JP2014011341A (ja) 2014-01-20

Family

ID=49053007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012147449A Active JP5261595B1 (ja) 2012-06-29 2012-06-29 圧延銅箔及びその製造方法、並びに、積層板

Country Status (5)

Country Link
JP (1) JP5261595B1 (fr)
KR (1) KR101669774B1 (fr)
CN (1) CN103636296B (fr)
TW (1) TWI600537B (fr)
WO (1) WO2014003019A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6612168B2 (ja) * 2016-03-30 2019-11-27 Ｊｘ金属株式会社 銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器
JP6611751B2 (ja) * 2017-03-31 2019-11-27 Ｊｘ金属株式会社 リチウムイオン電池集電体用圧延銅箔及びリチウムイオン電池
JP6856688B2 (ja) * 2019-03-26 2021-04-07 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
CN110392485B (zh) * 2019-06-18 2022-04-12 淮安维嘉益集成科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066416A (ja) * 2006-09-05 2008-03-21 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ及びその製造方法
WO2011081044A1 (fr) * 2009-12-28 2011-07-07 Jx日鉱日石金属株式会社 Feuille de cuivre, et stratifié revêtu de cuivre mettant en œuvre celle-ci
WO2012043462A1 (fr) * 2010-09-28 2012-04-05 Jx日鉱日石金属株式会社 Feuille de cuivre roulée

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749611B2 (en) 2002-12-05 2010-07-06 Gbc Metals, L.L.C. Peel strength enhancement of copper laminates
JP4401998B2 (ja) * 2005-03-31 2010-01-20 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔及びその製造方法
JP4522972B2 (ja) * 2005-04-28 2010-08-11 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔
US20080174016A1 (en) * 2006-12-28 2008-07-24 Mitsui Mining & Smelting Co., Ltd. Flexible Printed Wiring Board and Semiconductor Device
JP4972115B2 (ja) * 2009-03-27 2012-07-11 Ｊｘ日鉱日石金属株式会社 圧延銅箔

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066416A (ja) * 2006-09-05 2008-03-21 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ及びその製造方法
WO2011081044A1 (fr) * 2009-12-28 2011-07-07 Jx日鉱日石金属株式会社 Feuille de cuivre, et stratifié revêtu de cuivre mettant en œuvre celle-ci
JP2011136357A (ja) * 2009-12-28 2011-07-14 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板
WO2012043462A1 (fr) * 2010-09-28 2012-04-05 Jx日鉱日石金属株式会社 Feuille de cuivre roulée

Also Published As

Publication number Publication date
KR20150029726A (ko) 2015-03-18
CN103636296A (zh) 2014-03-12
WO2014003019A1 (fr) 2014-01-03
CN103636296B (zh) 2017-06-06
TW201404585A (zh) 2014-02-01
KR101669774B1 (ko) 2016-10-27
TWI600537B (zh) 2017-10-01
JP2014011341A (ja) 2014-01-20

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